CN115651602A - High-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition and preparation method and application thereof - Google Patents
High-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition and preparation method and application thereof Download PDFInfo
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- CN115651602A CN115651602A CN202211375695.2A CN202211375695A CN115651602A CN 115651602 A CN115651602 A CN 115651602A CN 202211375695 A CN202211375695 A CN 202211375695A CN 115651602 A CN115651602 A CN 115651602A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 132
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 132
- 239000010703 silicon Substances 0.000 title claims abstract description 132
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 119
- 239000000203 mixture Substances 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 27
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 27
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 21
- 239000001257 hydrogen Substances 0.000 claims abstract description 21
- 229920001971 elastomer Polymers 0.000 claims abstract description 20
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000003112 inhibitor Substances 0.000 claims abstract description 7
- 238000012545 processing Methods 0.000 claims abstract description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 41
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 34
- -1 polysiloxane Polymers 0.000 claims description 20
- 238000003756 stirring Methods 0.000 claims description 19
- 239000003054 catalyst Substances 0.000 claims description 18
- 229910052697 platinum Inorganic materials 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 14
- 229920002313 fluoropolymer Polymers 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 229920002050 silicone resin Polymers 0.000 claims description 10
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000008096 xylene Substances 0.000 claims description 7
- 229920002799 BoPET Polymers 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 238000004873 anchoring Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 5
- 239000004327 boric acid Substances 0.000 claims description 5
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims description 5
- 230000003301 hydrolyzing effect Effects 0.000 claims description 5
- 238000006068 polycondensation reaction Methods 0.000 claims description 5
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 5
- 150000004754 hydrosilicons Chemical class 0.000 claims description 4
- JQZGUQIEPRIDMR-UHFFFAOYSA-N 3-methylbut-1-yn-1-ol Chemical compound CC(C)C#CO JQZGUQIEPRIDMR-UHFFFAOYSA-N 0.000 claims description 3
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 claims description 2
- INASARODRJUTTN-UHFFFAOYSA-N 3-methyldodec-1-yn-3-ol Chemical compound CCCCCCCCCC(C)(O)C#C INASARODRJUTTN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004971 Cross linker Substances 0.000 claims description 2
- 239000002313 adhesive film Substances 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000003759 ester based solvent Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 2
- 239000005453 ketone based solvent Substances 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- 238000011056 performance test Methods 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920006037 cross link polymer Polymers 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- 229910015395 B-O-Si Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910015403 B—O—Si Inorganic materials 0.000 description 1
- 229920002209 Crumb rubber Polymers 0.000 description 1
- 101710172072 Kexin Proteins 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000003578 releasing effect Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition, a preparation method and application thereof, wherein the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition comprises the following components: 10-50 parts of vinyl raw rubber, 5-20 parts of boron-doped organic silicon resin, 20-60 parts of methyl MQ resin, 40-80 parts of solvent, 0.5-1.5 parts of silicon-hydrogen cross-linking agent and 0.04-0.2 part of inhibitor. The organic silicon pressure-sensitive adhesive has excellent comprehensive performance, excellent initial adhesion, stripping force, air exhaust and adhesion, high temperature resistance up to 260 ℃, no pollution to components after tearing, and wide application in the production, processing and transportation processes of electronic devices.
Description
Technical Field
The invention relates to the technical field of organic silicon pressure-sensitive materials, in particular to a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition, a preparation method and application thereof.
Background
Silicone pressure-sensitive adhesives are silicon-containing adhesives that not only have the pressure-sensitive properties necessary for pressure-sensitive adhesives, but also have a number of specific properties, such as: (1) good adhesion to low surface energy materials; 2) The adhesive has outstanding high and low temperature resistance, can be used for a long time at the temperature of between 50 ℃ below zero and 200 ℃, and still keeps the bonding strength and the flexibility at high temperature and low temperature; (3) The material has good chemical inertness, and has outstanding moisture resistance and electrical property; (4) good chemical resistance and solvent resistance; and (5) the dielectric property is good.
At present, pressure sensitive adhesive systems suitable for being used under high-temperature severe conditions are mainly peroxide-initiated organic silicon pressure sensitive adhesives, for example, shielding adhesive tapes are required to be used in gold plating, hot air leveling and wave soldering processes in the manufacturing process of a PCB (printed circuit board), and the adhesive tapes are required to be well adhered to the PCB under a high-temperature environment and not allowed to have adhesive residues when being stripped. However, the production process of the organic silicon pressure-sensitive adhesive of the peroxide system needs high-temperature reflux, the production process is complex, the organic silicon pressure-sensitive adhesive needs to be cured at 180 ℃ after being coated, priming coating needs to be performed to improve the adhesiveness of the organic silicon pressure-sensitive adhesive to a base material, meanwhile, the organic silicon pressure-sensitive adhesive of the peroxide system is crosslinked through free radical addition, so that a large number of reactive groups are available, the obtained product is generally high in crosslinking degree, high in storage modulus, low in initial adhesion, poor in wettability to some base materials and incapable of being well attached to an attached object.
In addition, the addition type organic silicon pressure-sensitive adhesive does not need to be coated with a base coat, can be cured at 130 ℃ under the condition of a platinum catalyst, greatly improves the production efficiency, has fewer reactive groups, and obtains a product with a low crosslinking degree generally.
Disclosure of Invention
Aiming at the problems in the prior art, in order to improve the temperature resistance of the addition type organic silicon pressure-sensitive adhesive and improve the production efficiency of the pressure-sensitive adhesive, the invention provides the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition which has excellent comprehensive performance, good high-temperature resistance, good stripping force and exhaust property, no adhesive residue after stripping at high temperature, and due to the introduction of boron-doped organic silicon resin, compared with the traditional addition type organic silicon pressure-sensitive adhesive, the organic silicon pressure-sensitive adhesive obtained after crosslinking has lower energy storage modulus, excellent initial adhesion, good wettability on the surface of a lot of stuck objects which are difficult to stick, and better sticking property.
The invention also aims to provide a preparation method of the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition, which is relatively simple in process and convenient for realizing large-scale production.
Still another object of the present invention is to provide the use of such a high temperature resistant addition type silicone pressure sensitive adhesive composition.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the invention provides a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition which comprises the following components in parts by weight:
10-50 parts of vinyl raw rubber, preferably 25-35 parts;
5-20 parts of boron-doped organic silicon resin, preferably 5-10 parts;
20-60 parts of methyl MQ resin, preferably 35-55 parts;
40-80 parts of solvent, preferably 40-60 parts;
0.5-1.5 parts of hydrosilicon crosslinking agent, preferably 0.9-1.2 parts;
0.04-0.2 part of inhibitor, preferably 0.12-0.18 part.
In a particular embodiment, the vinyl crumb rubber has a molecular weight of from 50 to 70 ten thousand, preferably from 60 to 65 ten thousand;
the molar content of vinyl in the vinyl raw rubber is 0.03-0.10%, preferably 0.04-0.08%;
the vinyl raw rubber is preferably raw rubber of 110-0 series in silicon industry.
In a specific embodiment, the boron-doped organic silicon resin is prepared by taking phenyl triethoxysilane, dimethyl diethoxysilane and boric acid as raw materials through hydrolytic polycondensation; more specifically, the boron-doped organic silicon resin is prepared by hydrolyzing phenyltriethoxysilane and dimethyldiethoxysilane and then carrying out polycondensation with boric acid.
The boron-doped organic silicon resin is prepared by taking phenyl triethoxysilane, dimethyl diethoxysilane and boric acid as raw materials through hydrolytic polycondensation, is a material disclosed in the prior art, has unlimited sources, can be obtained through purchase, and can also be obtained through self-control, and the preparation method has no special requirements, for example, the preparation method can be prepared by referring to the method disclosed in the synthesis and temperature resistance research of phenyl dimethyl boron-doped organic silicon resin [ J ] Guangdong chemical industry 2015,42 (6): 3 ]; the boron-doped silicone resin thus prepared has a structure as shown in the following formula:
specifically, the molecular weight of the boron-doped silicone resin is 2000 to 8000, including, for example, but not limited to 2000, 3500, 4000, 4300, 4750, 5000, 6000, preferably 4000 to 8000.
Experiments show that the boron element in the boron-doped organic silicon resin can be doped into a skeleton structure of the organic silicon resin in a Si-O-B-O-Si bonding mode, and organic groups such as methyl can be wrapped in the boron-doped organic silicon resin, so that the boron-doped organic silicon resin is not easy to decompose and break chains at high temperature, and meanwhile, the B-O bond is higher than the Si-O bond and has better high temperature resistance than the common organic silicon resin; and the introduction of the boron-doped organic silicon resin in the structure can also improve the loss modulus of the siloxane cross-linked polymer, so that the siloxane cross-linked polymer shows good initial adhesive performance and has good wettability for difficult-to-adhere attached objects.
In a particular embodiment, the MQ silicone resin has a M/Q ratio of 0.5 to 0.8, preferably 0.6 to 0.7, a molecular weight of 2700 to 5000g/mol, including for example but not limited to 2700, 3000, 3200, 3500, 3800, 4000, 4300, 4500, 4750, 5000, preferably 4000 to 5000; for example, the methyl MQ silicone resin may be a morning fly CF-808 resin. The introduction of the methyl MQ silicone resin can lead the pressure-sensitive adhesive to show good peeling force on the attached object and improve the peeling force stability of the attached object.
In a specific embodiment, the solvent is selected from any one or combination of toluene, xylene, ester solvents such as but not limited to ethyl acetate, ketone solvents such as but not limited to acetone, and alkane solvents such as but not limited to heptane;
preferably, the solvent is toluene and/or xylene.
In a particular embodiment, the viscosity of the hydrosilicon crosslinker is from 20 to 50mpa.s, preferably from 20 to 30mpa.s; hydrogen content of 0.7-1.6%, including for example but not limited to 0.7%, 1.0%, 1.2%, 1.25%, 1.3%, 1.45%, 1.55%, 1.6%, preferably 1.0-1.6%;
preferably, the hydrosilation crosslinking agent is hydrogen-based polysiloxane with hydrogen content of 0.7-1.6 wt%.
In a specific embodiment, the inhibitor is selected from any one or combination of tetramethyltetravinylcyclotetrasiloxane, divinyltetramethyldisiloxane, methylacetylene alcohol, ethynylcyclohexanol, methylbutynol, 3, 5-dimethyl-1-hexyn-3-ol, 3-methyl-1-dodecyn-3-ol, preferably ethynylcyclohexanol.
The invention also provides a preparation method of the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition, which comprises the following steps:
mixing vinyl green rubber, boron-doped organic silicon resin, methyl MQ silicon resin, a silicon-hydrogen cross-linking agent, an inhibitor and a solvent, and stirring for 3-5h to fully dissolve to obtain the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition.
On the other hand, the invention provides the application of the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition, the organic silicon pressure-sensitive adhesive composition with the formula provided by the invention is not only suitable for the application field of common pressure-sensitive adhesives, but also is especially suitable for a high-temperature environment, and the performance of the organic silicon pressure-sensitive adhesive composition can be stably maintained for at least 3 hours at a high temperature of 260 ℃.
The high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition is used for preparing a pressure-sensitive adhesive tape after being cured into an adhesive film, or is used for preparing a pressure-sensitive adhesive protective film in the processes of production, processing, transportation and the like of an electronic device.
As a preferred scheme, the invention provides a preparation method of a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film, which comprises the following steps:
mixing the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition, the anchoring agent and toluene, then heating the platinum catalyst, uniformly stirring, coating on a substrate, and heating and curing to form the high-temperature resistant addition type organic silicon pressure-sensitive adhesive film.
In the invention, the anchoring agent is selected from any one of gamma-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane and the like or a mixture consisting of the gamma-glycidoxypropyltrimethoxysilane and the gamma-methacryloxypropyltrimethoxysilane;
the mass ratio of the anchoring agent to the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition is 0.3-1.5:100, preferably 0.5 to 1:100;
the mass ratio of the toluene to the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition is 30-60:100, preferably 35 to 45:100, respectively;
the mass ratio of the platinum catalyst to the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition is 0.8-2:100, preferably 1 to 1.5:100;
the platinum metal content of the platinum catalyst is 3000-5000ppm, for example 5000ppm, and the platinum catalyst is preferably Karstedt's catalyst by Heley.
The substrate is selected from PET (polyethylene terephthalate) film, PI (polyimide) film, PE (polyethylene) film, PP (polypropylene) film, etc., and the substrate has a thickness of 25-100 μm, such as 25 μm PI film, 50 μm PET film, 75 μm PET film, 100 μm PET film, etc.
The heating curing is carried out, wherein the curing temperature is 130-150 ℃, and the curing time is 1.5-2min, for example, the curing time is 2min at 150 ℃.
The thickness of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive film prepared by the method can be 5-70 μm, and preferably 20-35 μm.
The high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition prepared by the formula can be coated on base materials such as a PI film, a PET film and the like to be cured into a glue film, has good adhesion to the base materials, shows higher initial adhesion, and can reach a 30# ball in initial adhesion of a rolling ball; the stripping force to the stuck object is high, and the stripping force of the steel plate can reach more than 1300 g/inch; the adhesive has high cohesive strength, good adhesion to an adherend, good stability of adhesive force, no attenuation, good exhaust performance, and no obvious adhesive residue after peeling at a high temperature of 260 ℃.
As a preferred scheme, the invention provides a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive protective film which comprises a composite film material formed by a bottom base film layer, a middle high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film layer and a surface fluoroplastic release film layer.
The thickness of the base film layer is 5-100 μm, preferably 5-50 μm, and is selected from PET (polyethylene terephthalate) film, PI (polyimide) film, PE (polyethylene) film, PP (polypropylene) film, etc.;
the thickness of the fluoroplastic release film layer is 20-75 μm, and the fluoroplastic release film layer is selected from polyethylene terephthalate fluoroplastic release films;
the thickness of the middle high-temperature resistant addition type organic silicon pressure-sensitive adhesive film layer is 5-70 mu m.
The high-temperature-resistant addition type organic silicon pressure-sensitive adhesive protective film is obtained by coating the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition on a base film, curing according to the method (the preparation method of the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film) and then pasting a fluoroplastic release film on the surface of the base film.
Compared with the prior art, the technical scheme of the invention has the beneficial effects that:
1) Compared with the common addition type organic silicon pressure-sensitive adhesive, the boron-doped organic silicon resin is added into an interpenetrating structure addition system formed by the methyl MQ resin and the vinyl raw rubber, and the components have synergistic effect, so that the high-temperature resistance of the product can be obviously improved, no obvious residual rubber is stripped after high temperature, the cohesive strength of the pressure-sensitive adhesive can be improved, the stripping force stability is improved, and the pressure-sensitive adhesive obtained when the adhesive is solidified into a rubber film has good stripping force on an adhered object.
2) Compared with the common addition type organic silicon pressure-sensitive adhesive, the organic silicon pressure-sensitive adhesive crosslinked by adding the boron-doped organic silicon resin has lower storage modulus, good air permeability, excellent initial adhesion, good wettability on the surface of a plurality of stuck objects which are difficult to stick and better sticking property.
Detailed Description
The following examples will further illustrate the method provided by the present invention in order to better understand the technical solution of the present invention, but the present invention is not limited to the listed examples, and should also include any other known modifications within the scope of the claims of the present invention.
The main raw materials used in the following examples and comparative examples of the present invention are as follows, and the other raw materials of the reagents are common commercial products unless otherwise specified:
methyl MQ resin: morning fly photoelectricity, CF808;
vinyl raw rubber: mixing and containing organic silicon;
xylene: chemical purification of julong;
ethynylcyclohexanol: alatin, analytically pure;
hydrogen-based polysiloxane: kexin silicone;
platinum catalyst: helrich, karstedt's catalyst, platinum content 5000ppm;
gamma-glycidoxypropyltrimethoxysilane: shanghai Michelin Biochemical technology, inc.;
boron-doped silicone resin: the boron-doped phenyl dimethyl silicone resin is prepared by taking phenyl triethoxysilane and dimethyl diethoxysilane as raw materials, hydrolyzing and then carrying out polycondensation with boric acid, and is specifically prepared according to a method disclosed in a document [ Wangdan, shaohuahui, lin Tao, and the like ] synthesis and temperature resistance research of phenyl dimethyl boron-doped silicone resin [ J ]. Guangdong chemical industry 2015,42 (6): 3 ].
The method for testing the performance of the organic silicon pressure-sensitive adhesive product comprises the following steps:
1. the viscosity detection method comprises the following steps: reference GB/T10247-2008;
2. the peeling force detection method comprises the following steps: reference GB/T2792-1998;
3. the detection method of the initial viscosity of the rolling ball comprises the following steps: reference GB/T4852-2002;
4. the high temperature resistance detection method comprises the following steps: testing whether the PI film is degummed at 260 ℃, putting the pressure-sensitive adhesive tape which is coated on the PI film and is completely cured in a mirror steel plate (the thickness of the dry adhesive of the pressure-sensitive adhesive is 25-35 mu m) into a baking oven at 260 ℃, taking out the pressure-sensitive adhesive tape after 30min, and observing whether the steel plate has residual adhesive after tearing off the adhesive tape;
5. storage modulus: reference to ASTM D7028-2007 (2015);
6. air-releasing property: adhering the pressure-sensitive adhesive tape which is coated on the PI film and is completely cured on a mirror steel plate, observing whether obvious bubbles exist at the adhering position, and if not, ensuring that the air-release property is good;
7. wettability: refer to ASTM D7334-08.
Example 1
1) Preparing a high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition:
adding 60g of methyl MQ silicon resin (with the molecular weight of 2700 and the M/Q ratio of 0.8), 50g of vinyl raw rubber (with the molecular weight of 62 ten thousand and the vinyl molar content of 0.06%), 5g of boron-doped organic silicon resin (with the molecular weight of 5000), 1.5g of silicon-hydrogen cross-linking agent (with the viscosity of 20mPa.s and the hydrogen content of 1.6 wt%) and 0.2g of ethynyl cyclohexanol into a reaction kettle, adding 80g of toluene into the reaction kettle, stirring for 4 hours until all raw materials are fully dissolved and dispersed, and uniformly mixing to obtain the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition.
2) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film/protective film:
adding 0.5g of gamma-glycidoxypropyltrimethoxysilane and 60g of toluene into 100g of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition, uniformly stirring, adding 1.0g of platinum catalyst, uniformly stirring, coating on a PI film substrate with the thickness of 25 micrometers, placing in an oven, curing at 150 ℃ for 2min, and obtaining a high-temperature resistant addition type organic silicon pressure-sensitive adhesive film with the thickness of 30 micrometers;
then a polyethylene glycol terephthalate fluoroplastic release film with the thickness of 50 mu m is attached to obtain the high-temperature resistant addition type organic silicon pressure-sensitive adhesive protective film, and the performance test results are shown in the table 1.
Example 2
1) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition:
adding 30g of methyl MQ silicon resin (with the molecular weight of 5000 and the M/Q ratio of 0.8), 30g of vinyl raw rubber (with the molecular weight of 70 ten thousand and the vinyl molar content of 0.04%), 20g of boron-doped organic silicon resin (with the molecular weight of 4000), 1.0g of silicon-hydrogen cross-linking agent (with the viscosity of 25mPa.s and the hydrogen content of 1.6 wt%) and 0.15g of ethynyl cyclohexanol into a reaction kettle, adding 50g of dimethylbenzene into the reaction kettle, stirring for 4 hours until all raw materials are fully dissolved and dispersed, and uniformly mixing to obtain the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition.
2) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film/protective film:
adding 0.5g of gamma-glycidoxypropyltrimethoxysilane and 40g of toluene into 100g of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition, uniformly stirring, adding 1.0g of platinum catalyst, uniformly stirring, coating on a PI film substrate with the thickness of 25 micrometers, placing in an oven, curing at 150 ℃ for 2min, and obtaining a high-temperature resistant addition type organic silicon pressure-sensitive adhesive film with the thickness of 30 micrometers;
then a polyethylene glycol terephthalate fluoroplastic release film with the thickness of 50 mu m is attached to obtain the high-temperature resistant addition type organic silicon pressure-sensitive adhesive protective film, and the performance test results are shown in Table 1.
Example 3
1) Preparing a high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition:
adding 50g of methyl MQ silicon resin (with the molecular weight of 4500 and the M/Q ratio of 0.8), 30g of vinyl raw rubber (with the molecular weight of 65 ten thousand and the vinyl molar content of 0.05%), 5g of boron-doped organic silicon resin (with the molecular weight of 8000), 1.0g of silicon-hydrogen cross-linking agent (with the viscosity of 20mPa.s and the hydrogen content of 1.4 wt%) and 0.15g of ethynylcyclohexanol into a reaction kettle, adding 50g of toluene into the reaction kettle, stirring for 5 hours until all raw materials are fully dissolved and dispersed, and uniformly mixing to obtain the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition.
2) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film/protective film:
adding 0.5g of gamma-glycidyl ether oxypropyl trimethoxysilane and 50g of dimethylbenzene into 100g of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition, uniformly stirring, adding 1.0g of platinum catalyst, uniformly stirring, coating on a PI film substrate with the thickness of 25 micrometers, placing in an oven for curing at 150 ℃ for 1.5min, and obtaining a high-temperature resistant addition type organic silicon pressure-sensitive adhesive film with the thickness of 30 micrometers;
then a polyethylene glycol terephthalate fluoroplastic release film with the thickness of 50 mu m is attached to obtain the high-temperature resistant addition type organic silicon pressure-sensitive adhesive protective film, and the performance test results are shown in the table 1.
Example 4
1) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition:
adding 20g of methyl MQ silicon resin (with the molecular weight of 3500, the M/Q ratio of 0.7), 15g of vinyl crude rubber (with the molecular weight of 50 ten thousand and the vinyl molar content of 0.08%), 20g of boron-doped organic silicon resin (with the molecular weight of 6500), 0.5g of silicon-hydrogen cross-linking agent (with the viscosity of 30mPa.s and the hydrogen content of 1.0 wt%) and 0.04g of ethynyl cyclohexanol into a reaction kettle, adding 40g of toluene into the reaction kettle, stirring for 4 hours until all raw materials are fully dissolved and dispersed, and uniformly mixing to obtain the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition.
2) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film/protective film:
adding 0.6g of gamma-methacryloxypropyl trimethoxy silane and 50g of xylene into 100g of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition, uniformly stirring, adding 1.0g of platinum catalyst, uniformly stirring, coating on a PI film substrate with the thickness of 25 micrometers, placing in an oven for curing at 130 ℃ for 2min, and obtaining a high-temperature resistant addition type organic silicon pressure-sensitive adhesive film with the thickness of 30 micrometers;
then a polyethylene glycol terephthalate fluoroplastic release film with the thickness of 50 mu m is attached to obtain the high-temperature resistant addition type organic silicon pressure-sensitive adhesive protective film, and the performance test results are shown in the table 1.
Example 5
1) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition:
adding 50g of methyl MQ silicon resin (with the molecular weight of 4000 and the M/Q ratio of 0.8), 28g of vinyl raw rubber (with the molecular weight of 65 ten thousand and the vinyl molar content of 0.05%), 10g of boron-doped organic silicon resin (with the molecular weight of 5000), 0.8g of silicon-hydrogen cross-linking agent (with the viscosity of 20mPa.s and the hydrogen content of 1.6 wt%) and 0.15g of methyl butynol into a reaction kettle, adding 60g of toluene into the reaction kettle, stirring for 4 hours until all raw materials are fully dissolved and dispersed, and uniformly mixing to obtain the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition.
2) Preparing a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film/protective film:
adding 0.5g of gamma-methacryloxypropyl trimethoxy silane and 60g of xylene into 100g of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition, uniformly stirring, adding 1.2g of platinum catalyst, uniformly stirring, coating on a PI film substrate with the thickness of 25 micrometers, placing in an oven for curing at 150 ℃ for 2min, and obtaining a high-temperature resistant addition type organic silicon pressure-sensitive adhesive film with the thickness of 30 micrometers;
then a polyethylene glycol terephthalate fluoroplastic release film with the thickness of 50 mu m is attached to obtain the high-temperature resistant addition type organic silicon pressure-sensitive adhesive protective film, and the performance test results are shown in Table 1.
Comparative example 1
The process of example 1 is referred to with the only difference that: the boron-doped organic silicon resin is not added into the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition, other operations and parameters are unchanged, and the test performance results are shown in table 1.
Comparative example 2
The process of example 1 is referred to with the only difference that: the addition amount of the boron-doped organic silicon resin in the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition is 30g, other operations and parameters are unchanged, and the test performance results are shown in table 1.
Comparative example 3
The process referred to in example 1 differs only in that: the boron-doped organic silicon resin in the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition is replaced by tributyl borate, other operations and parameters are unchanged, and the test performance results are shown in table 1.
The test performance data of the silicone pressure-sensitive adhesive prepared in the above examples and comparative examples are shown in table 1 below:
TABLE 1 Silicone pressure sensitive adhesive Properties of examples 1-5 and comparative examples 1-3
As can be seen from Table 1, compared with the common addition type organic silicon pressure-sensitive adhesive, in the invention, the high temperature resistance of the product can be obviously improved by adding the boron-doped organic silicon resin, and the adhesive tape is torn after high temperature treatment at 260 ℃ without adhesive residue. An interpenetrating structure is formed by methyl MQ resin and vinyl raw rubber, and when the raw rubber is cured into a colloidal film, a silicon-hydrogen crosslinking agent reacts with the vinyl under the action of a platinum catalyst to provide the adhesive force and the cohesive force required by a product; the required peeling force of the product is adjusted by controlling the content of the methyl MQ silicon resin and the content of the vinyl. Compared with the common addition type organic silicon pressure-sensitive adhesive, the organic silicon pressure-sensitive adhesive added with the boron-doped organic silicon resin has lower storage modulus, shows excellent initial adhesion, good stripping force and air exhaust performance, has good wettability on the surfaces of a plurality of stuck objects which are difficult to stick, and has better sticking performance.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. It will be appreciated by those skilled in the art that modifications and adaptations to the invention may be made in light of the teachings of the present disclosure. Such modifications or adaptations are intended to be within the scope of the present invention as defined by the claims.
Claims (10)
1. The high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition is characterized by comprising the following components in parts by weight:
10-50 parts of vinyl raw rubber, preferably 25-35 parts;
5-20 parts of boron-doped organic silicon resin, preferably 5-10 parts;
20-60 parts of methyl MQ resin, preferably 35-55 parts;
40-80 parts of solvent, preferably 40-60 parts;
0.5-1.5 parts of hydrosilicon crosslinking agent, preferably 0.9-1.2 parts;
0.04-0.2 part of inhibitor, preferably 0.12-0.18 part.
2. The high temperature resistant addition silicone pressure sensitive adhesive composition of claim 1, wherein the vinyl green adhesive has a molecular weight of 50-70 ten thousand, preferably 60-65 ten thousand;
the vinyl raw rubber has a vinyl molar content of 0.03-0.10%, preferably 0.04-0.08%.
3. The high-temperature-resistant addition type silicone pressure-sensitive adhesive composition according to claim 1 or 2, wherein the boron-doped silicone resin is prepared by taking phenyltriethoxysilane, dimethyldiethoxysilane and boric acid as raw materials and performing hydrolytic polycondensation reaction;
the molecular weight of the boron-doped organic silicon resin is 2000-8000, preferably 4000-8000.
4. The high temperature resistant addition silicone pressure sensitive adhesive composition according to any of claims 1-3, characterized in that the methyl MQ silicone resin has a M/Q ratio of 0.5-0.8, preferably 0.6-0.7, a molecular weight of 2700-5000, preferably 4000-5000;
the solvent is selected from any one or combination of a plurality of toluene, xylene, ester solvents, ketone solvents and alkane solvents, and toluene and/or xylene are preferred.
5. The high temperature resistant addition silicone pressure sensitive adhesive composition according to any of claims 1-4, wherein the viscosity of the hydrosilicon crosslinker is from 20 to 50mPa.s, preferably from 20 to 30mPa.s; hydrogen content of 0.7-1.6%, preferably 1.0-1.6%;
preferably, the hydrosilation crosslinking agent is hydrogen-based polysiloxane with hydrogen content of 0.7-1.6 wt%;
the inhibitor is selected from one or more of tetramethyltetravinylcyclotetrasiloxane, divinyl tetramethyldisiloxane, methyl acetylene alcohol, ethynyl cyclohexanol, methyl butynol, 3, 5-dimethyl-1-hexynl-3-ol and 3-methyl-1-dodecyn-3-ol, and is preferably ethynyl cyclohexanol.
6. A method for preparing the high temperature resistant addition type silicone pressure sensitive adhesive composition according to any one of claims 1 to 5, characterized by comprising the steps of:
mixing vinyl raw rubber, boron-doped organic silicon resin, methyl MQ silicon resin, a silicon-hydrogen cross-linking agent, an inhibitor and a solvent, and stirring to fully dissolve to obtain the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition.
7. The application of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition in any one of claims 1 to 5 in the field of common pressure-sensitive adhesives, in particular to be suitable for high-temperature environments, and the performance of the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition can be stably maintained for at least 3 hours at a high temperature of more than 260 ℃;
the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition is used for preparing a pressure-sensitive adhesive tape after being cured into an adhesive film, or is used for preparing a pressure-sensitive adhesive protective film in the processes of production, processing, transportation and the like of an electronic device.
8. A preparation method of a high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film is characterized by comprising the following steps: mixing the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition, the anchoring agent and the toluene, heating the platinum catalyst, uniformly stirring, coating the mixture on a substrate, and heating and curing to form the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film.
9. The method according to claim 8, wherein the anchoring agent is selected from any one of gamma-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, and the like, or a mixture thereof;
the mass ratio of the anchoring agent to the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition is (0.3-1.5): 100, preferably 0.5 to 1:100;
the mass ratio of the toluene to the high-temperature resistant addition type organic silicon pressure-sensitive adhesive composition is 30-60:100, preferably 35 to 45:100, respectively;
the mass ratio of the platinum catalyst to the high-temperature-resistant addition type organic silicon pressure-sensitive adhesive composition is 0.8-2:100, preferably 1 to 1.5:100;
the platinum catalyst has a platinum metal content of 3000-5000ppm, preferably Karstedt's catalyst of Heley.
The base material is selected from a PET film, a PI film, a PE film or a PP film, and the thickness of the base material is 25-100 mu m.
And heating and curing at 130-150 deg.C for 1.5-2min.
10. The high-temperature-resistant addition type organic silicon pressure-sensitive adhesive protective film is characterized by comprising a composite film material formed by a bottom base film layer, a middle high-temperature-resistant addition type organic silicon pressure-sensitive adhesive film layer and a surface fluoroplastic release film layer;
preferably, the base film layer has a thickness of 5 to 100 μm, preferably 5 to 50 μm, and is selected from a PET film, a PI film, a PE film, or a PP film;
preferably, the thickness of the fluoroplastic release film layer is 20-75 μm, and the fluoroplastic release film layer is selected from polyethylene terephthalate fluoroplastic release films;
preferably, the thickness of the intermediate high-temperature-resistant addition-type silicone pressure-sensitive adhesive film is 5-70 μm, and the intermediate high-temperature-resistant addition-type silicone pressure-sensitive adhesive film is selected from the high-temperature-resistant addition-type silicone pressure-sensitive adhesive films prepared by the method of claim 8 or 9.
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| CN116004181A (en) * | 2023-02-07 | 2023-04-25 | 太仓斯迪克新材料科技有限公司 | Impact-resistant organic silicon pressure-sensitive adhesive and preparation method thereof |
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