CN115643688A - COB circuit board manufacturing process - Google Patents
COB circuit board manufacturing process Download PDFInfo
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- CN115643688A CN115643688A CN202211425798.5A CN202211425798A CN115643688A CN 115643688 A CN115643688 A CN 115643688A CN 202211425798 A CN202211425798 A CN 202211425798A CN 115643688 A CN115643688 A CN 115643688A
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Abstract
The invention discloses a COB circuit board manufacturing process, which comprises the steps of preprocessing, manufacturing a PCB; cleaning the PCB for cleaning the manufactured PCB; dripping adhesive to prevent the DIE from falling off in the process of transferring and bonding the wires; chip pasting, namely pasting the PCB; the BONDING wire is used for connecting two welding points of each BONDING wire according to the position of the BONDING diagram so as to realize electrical and mechanical connection; sealing, performing black paste dispensing on the PCB with the test OK; testing, namely detecting the performance of the product before packaging the product; and warehousing, namely warehousing qualified products after the test is finished, and cleaning the manufactured PCB by the step of setting the clean PCB, thereby effectively reducing dirty parts such as oil stains or oxide layers reserved on the PCB, improving the quality of bonding, promoting the quality of the products, improving the manufacturing efficiency and further promoting the delivery efficiency of the products.
Description
Technical Field
The invention relates to the technical field of COB circuit board manufacturing, in particular to a COB circuit board manufacturing process.
Background
The name of the circuit board is: the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout.
The COB manufacturing process is complex in flow, multiple in control project, more in technical difficulty, low in product yield, high in rejection rate, capable of influencing production progress, and capable of bringing troubles, challenges and troubles to a plurality of manufacturers, and therefore the COB manufacturing process is provided for solving the problems.
Disclosure of Invention
The invention aims to provide a COB circuit board manufacturing process to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a COB circuit board manufacturing process comprises the following steps:
step one, pre-procedure treatment, which is used for manufacturing a PCB (printed Circuit Board) required to be used;
step two, cleaning the PCB, which is used for cleaning the PCB manufactured in the step one;
thirdly, adhesive glue is dripped to prevent the DIE from falling off in the process of transferring and bonding the product;
step four, chip pasting, which is used for pasting the PCB;
connecting two welding spots of each BONDING wire according to the position determined by the BONDING diagram so as to realize electrical and mechanical connection;
step six, sealing glue, performing black glue dispensing on the PCB board tested OK;
testing, namely detecting the performance of the product before packaging the product;
and step eight, warehousing, namely warehousing qualified products after the test is finished.
As a further scheme of the invention: the pre-process treatment comprises the manufacturing of a PCB, and the manufacturing of the PCB comprises the following steps:
s1, cutting a copper-clad plate, and manufacturing a circuit board by using a photosensitive plate, wherein the copper-clad plate is illustrated in the whole process, namely the circuit board with copper films coated on two sides is cut into the size of the circuit board without being too large so as to save materials;
s2, pretreating the copper-clad plate, and polishing an oxide layer on the surface of the copper-clad plate by using fine sand paper so as to ensure that carbon powder on thermal transfer paper can be firmly printed on the copper-clad plate when the circuit board is transferred, wherein the polished standard is that the plate surface is bright and has no obvious stain;
s3, transferring the circuit board, cutting the printed circuit board into a proper size, attaching one surface printed with the circuit board to a copper-clad plate, placing the copper-clad plate into a thermal transfer printing machine after aligning, and ensuring that transfer printing paper is not misplaced when placing the copper-clad plate;
s4, corroding the circuit board, checking whether the circuit board is completely transferred, if a few places without transferred printing can be repaired by using a black oil pen, corroding the circuit board, and taking the circuit board out of the corrosive liquid to clean when the copper film exposed on the circuit board is completely corroded, so that one circuit board is corroded;
s5, drilling the circuit board, selecting different drill points according to the thickness of pins of the electronic element, and then drilling the circuit board through a drilling machine;
s6, preprocessing the circuit board, after drilling, polishing off ink powder coated on the circuit board by using fine abrasive paper, cleaning the circuit board by using clear water, after drying, coating rosin water on one side with the circuit, and heating the circuit board by using an air heater for accelerating rosin solidification, wherein the rosin can be solidified in 2-3 minutes.
As a further scheme of the invention: and the transfer printing in the S3 is carried out for 2-3 times, the thermal transfer printing machine is preheated in advance during transfer printing, and the temperature is set to be 160-200 ℃.
As a further scheme of the invention: the corrosive liquid in the S4 comprises concentrated hydrochloric acid, concentrated hydrogen peroxide and water in a ratio of 1:2:3, when preparing the corrosive liquid, firstly discharging water, and then adding concentrated hydrochloric acid and concentrated hydrogen peroxide.
As a further scheme of the invention: the PCB cleaning method comprises the following steps of cleaning the cleaned PCB for the second time, and removing dirty parts such as oil stains or oxide layers still remained on the PCB to improve the bonding quality.
As a further scheme of the invention: the purpose of the adhesive drops is to prevent the DIE from falling off during the transferring and bonding processes of the product, and the adhesive drops generally adopt a needle transfer method and a pressure injection method in the COB process; the needle transfer method comprises the following steps: dispensing a small drop of adhesive from the container with a needle onto the PCB; the pressure injection method comprises the following steps: the glue is filled into a syringe, a certain air pressure is applied to extrude the glue, and the size of a glue point is determined by the size of the caliber of the nozzle of the syringe, the pressurizing time and the pressure and is related to the viscosity.
As a further scheme of the invention: in the chip pasting process, the hardness of the vacuum suction pen material is required to be small, the diameter of the suction nozzle is determined according to the size of the chip, the nozzle tip needs to be flat so as not to scratch the DIE surface, the models of the DIE and the PCB need to be checked during pasting, the pasting direction is correct, the DIE towel needs to be stable and flat on the PCB, namely the DIE and the PCB are pasted in parallel without virtual positions, the DIE and the PCB are not easy to fall off in the whole process, and the DIE and the PCB are pasted in reserved positions and are not biased.
As a further scheme of the invention: in the wire bonding process, the wire should be lightly taken and lightly placed, the point alignment needs to be accurate, an operator uses a microscope to observe the wire bonding process, whether wire breakage exists or not, wire coiling, deviation, cold and hot welding, aluminum removal and the like are observed, and if the bad phenomena exist, a manager or a technician is immediately informed.
As a further scheme of the invention: the sealant is mainly used for dispensing black glue on a PCB (printed Circuit Board) tested OK, pores are not formed on the surface of the dried black glue, the black glue is not cured, the height of the black glue is preferably not more than 1.8MM, and the temperature of a preheating plate and the drying temperature are strictly controlled when dispensing glue is required to BE less than 1.5MM (for example, a BE-08 black glue FR4PCB is vibrated, the preheating temperature is 120 +/-15 ℃ for 1.5-3.0 minutes, and the drying temperature is 140 +/-15 ℃ for 40-60 minutes).
As a still further scheme of the invention: the test is to test the finished product, and the detection mode can be divided into two types of non-contact detection (inspection) and contact detection (test), wherein the non-contact detection is developed from manual visual inspection to automatic optical image Analysis (AOI) X-ray analysis, from appearance circuit graph inspection to inner layer welding spot quality inspection, and from independent inspection to the direction of combining quality monitoring and defect repair.
Compared with the prior art, the invention has the beneficial effects that: this COB circuit board manufacturing process through the step that sets up clean PCB board, can clean the PCB board of preparation to effectively reduce dirty parts such as greasy dirt or oxide layer that persist on the PCB board, thereby improve the quality of nation, make the quality of product obtain promoting, the preparation efficiency is high, and then promotes the shipment efficiency of product.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic structural diagram of the PCB manufacturing method of the present invention.
Detailed Description
In one embodiment, as shown in fig. 1-2, a COB board manufacturing process includes:
step one, pre-procedure treatment, which is used for manufacturing a PCB (printed Circuit Board) required to be used;
step two, cleaning the PCB, and cleaning the PCB which is manufactured in the step one;
thirdly, adhesive is dripped to prevent the DIE from falling off in the process of transferring and bonding the product;
step four, chip pasting, which is used for pasting the PCB;
connecting two welding spots of each BONDING wire according to the position determined by the BONDING diagram so as to realize electrical and mechanical connection;
step six, sealing glue, performing black glue dispensing on the PCB board tested OK;
step seven, testing, namely detecting the performance of the product before packaging the product;
and step eight, warehousing, namely warehousing qualified products after the test is finished.
The pre-procedure treatment comprises the manufacturing of a PCB, wherein the manufacturing of the PCB comprises the following steps;
s1, cutting a copper-clad plate, and manufacturing a circuit board by using a photosensitive plate, wherein the copper-clad plate is illustrated in the whole process, namely the circuit board with copper films coated on two sides is cut into the size of the circuit board without being too large so as to save materials;
s2, pretreating the copper-clad plate, and polishing off an oxide layer on the surface of the copper-clad plate by using fine sand paper so as to ensure that carbon powder on the thermal transfer paper can be firmly printed on the copper-clad plate when the circuit board is transferred, wherein the polished standard is that the plate surface is bright and has no obvious stains;
s3, transferring the circuit board, cutting the printed circuit board into a proper size, attaching one surface printed with the circuit board to the copper-clad plate, placing the copper-clad plate into a thermal transfer printing machine after aligning, and ensuring that the transfer printing paper is not misplaced when placing the copper-clad plate;
s4, corroding the circuit board, namely checking whether the circuit board is completely transferred, repairing a few places without transferred images by using a black oil pen, corroding the circuit board, and taking the circuit board out of the corrosive liquid to clean when the copper film exposed on the circuit board is completely corroded, so that one circuit board is corroded;
s5, drilling the circuit board, selecting different drill points according to the thickness of pins of the electronic element, and then drilling the circuit board through a drilling machine;
s6, preprocessing the circuit board, after drilling, polishing off the powdered ink coated on the circuit board by using fine abrasive paper, cleaning the circuit board by using clear water, after drying, coating rosin water on the surface with the circuit, and heating the circuit board by using an air heater for accelerating rosin solidification, wherein the rosin can be solidified in 2-3 minutes.
The transfer printing times in the S3 are 2-3, the thermal transfer printing machine is preheated in advance during transfer printing, and the temperature is set to be 160-200 ℃; the corrosive liquid in the S4 comprises concentrated hydrochloric acid, concentrated hydrogen peroxide and water in a ratio of 1:2:3, when preparing the corrosive liquid, firstly discharging water, and then adding concentrated hydrochloric acid and concentrated hydrogen peroxide.
The PCB cleaning step is to perform secondary cleaning on the cleaned PCB, so that dirty parts such as oil stains or oxide layers still remained on the PCB are cleaned to improve the bonding quality.
The purpose of the adhesive is to prevent the DIE from falling off in the processes of transferring and bonding the product, and the adhesive is generally applied to a needle type transfer and pressure injection method in a COB process; needle transfer method: dispensing a droplet of adhesive from the container with a needle onto the PCB; pressure injection method: the glue is filled into a syringe and extruded out by applying a certain air pressure, and the size of the glue point is determined by the size of the caliber of the nozzle of the syringe, the pressurizing time and the pressure and is related to the viscosity.
In chip pasting, the hardness of the vacuum suction pen material is required to be small, the diameter of the suction nozzle is determined according to the size of the chip, the nozzle tip is required to be flat so as not to scratch the DIE surface, the models of the DIE and the PCB are required to be checked during pasting, the pasting direction is correct, the DIE towel is required to be stable and flat on the PCB, namely the DIE and the PCB are pasted in parallel without virtual positions, and the DIE and the PCB are not easy to fall off in the whole process, namely the DIE and the PCB are pasted in a reserved position and are not twisted.
In the wire binding process, the wire should be lightly taken and placed, the point is accurately pointed, an operator uses a microscope to observe the wire binding process, and the operator can see whether the wire is broken or not, winds the wire, deviates, performs cold and hot welding, starts aluminum and the like to achieve adverse phenomena, and if the adverse phenomena exist, the operator or a technician is immediately informed.
The sealing method is mainly to carry out black glue dispensing on the PCB for OK test, the dried black glue surface has no air holes and the black glue is not cured, the height of the black glue is preferably not more than 1.8MM, and the temperature of a preheating plate and the drying temperature are strictly controlled when the black glue is dispensed and is particularly required to BE less than 1.5MM (for example, the BE-08 black glue FR4PCB is vibrated, the preheating temperature is 120 +/-15 ℃ for 1.5-3.0 minutes, and the drying temperature is 140 +/-15 ℃ for 40-60 minutes).
The test is to test the finished product, the detection mode can be divided into two types of non-contact detection (inspection) and contact detection (test), the non-contact detection is developed from manual visual inspection to automatic optical image Analysis (AOI) X-ray analysis, the inspection of an appearance circuit graph is developed to the quality inspection of an inner layer welding spot, and the independent inspection is developed to the direction of combining quality monitoring and defect repair.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. The COB circuit board manufacturing process is characterized by comprising the following steps:
step one, pre-procedure treatment, which is used for manufacturing a PCB required to be used;
step two, cleaning the PCB, and cleaning the PCB which is manufactured in the step one;
thirdly, adhesive glue is dripped to prevent the DIE from falling off in the process of transferring and bonding the product;
step four, chip pasting, which is used for pasting the PCB;
step five, BONDING wires, wherein two welding points of each BONDING wire are connected according to the set position of the BONDING diagram, so that the BONDING wires are electrically and mechanically connected;
step six, sealing the glue, and performing black glue dispensing on the PCB board tested OK;
step seven, testing, namely detecting the performance of the product before packaging the product;
and step eight, warehousing, namely warehousing qualified products after the test is finished.
2. The COB circuit board manufacturing process of claim 1, wherein the pre-process treatment includes PCB board manufacturing, and the PCB board manufacturing includes the following steps:
s1, cutting a copper-clad plate, and manufacturing a circuit board by using a photosensitive plate, wherein the copper-clad plate is illustrated in the whole process, namely the circuit board with copper films coated on two sides is cut into the size of the circuit board without being too large so as to save materials;
s2, pretreating the copper-clad plate, and polishing an oxide layer on the surface of the copper-clad plate by using fine sand paper so as to ensure that carbon powder on thermal transfer paper can be firmly printed on the copper-clad plate when the circuit board is transferred, wherein the polished standard is that the plate surface is bright and has no obvious stain;
s3, transferring the circuit board, cutting the printed circuit board into a proper size, attaching one surface printed with the circuit board to a copper-clad plate, placing the copper-clad plate into a thermal transfer printing machine after aligning, and ensuring that transfer printing paper is not misplaced when placing the copper-clad plate;
s4, corroding the circuit board, checking whether the circuit board is completely transferred, if a few places without transferred printing can be repaired by using a black oil pen, corroding the circuit board, and taking the circuit board out of the corrosive liquid to clean when the copper film exposed on the circuit board is completely corroded, so that one circuit board is corroded;
s5, drilling the circuit board, selecting different drill points according to the thickness of pins of the electronic element, and then drilling the circuit board through a drilling machine;
s6, preprocessing the circuit board, after drilling, polishing off the powdered ink coated on the circuit board by using fine abrasive paper, cleaning the circuit board by using clear water, after drying, coating rosin water on the surface with the circuit, and heating the circuit board by using an air heater for accelerating rosin solidification, wherein the rosin can be solidified in 2-3 minutes.
3. The COB circuit board manufacturing process according to claim 2, wherein the number of times of the transfer printing in S3 is 2-3, the thermal transfer printing machine is preheated in advance during the transfer printing, and the temperature is set to 160-200 ℃.
4. The COB circuit board manufacturing process of claim 2, wherein the corrosive liquid in S4 comprises concentrated hydrochloric acid, concentrated hydrogen peroxide and water in a ratio of 1:2:3, when preparing the corrosive liquid, firstly discharging water, and then adding concentrated hydrochloric acid and concentrated hydrogen peroxide.
5. The COB circuit board manufacturing process according to claim 1, wherein the cleaning of the PCB is to perform secondary cleaning on the cleaned PCB, so that oil stains or dirty oxide layers still remaining on the PCB are removed to improve bonding quality.
6. The COB circuit board manufacturing process according to claim 1, wherein the adhesive drops are generally subjected to needle transfer and pressure injection in the COB process in order to prevent DIE from falling off during product transfer and wire bonding; the needle type transfer method comprises the following steps: dispensing a small drop of adhesive from the container with a needle onto the PCB; the pressure injection method comprises the following steps: the glue is filled into a syringe, a certain air pressure is applied to extrude the glue, and the size of a glue point is determined by the size of the caliber of the nozzle of the syringe, the pressurizing time and the pressure and is related to the viscosity.
7. The COB circuit board manufacturing process according to claim 1, wherein in chip bonding, the hardness of a vacuum suction pen material is required to be small, the diameter of a suction nozzle is determined according to the size of a chip, the nozzle tip needs to be flat so as not to scratch the DIE surface, the DIE and PCB models need to be checked during bonding, the bonding direction is correct, and a DIE towel needs to be 'stable and positive' to the PCB, namely that the DIE and the PCB are tightly bonded in parallel without virtual positions, and the DIE and the PCB are not easy to fall off and 'positive' in the whole process, namely that the DIE and the PCB are positively bonded and cannot be twisted.
8. The COB circuit board manufacturing process according to claim 1, wherein the bonding process is carried out lightly and accurately, an operator observes the bonding process through a microscope to see whether the bonding process is broken or not, winds, deviates, carries out cold and hot welding, starts aluminum and the like, and notifies a manager or a technician immediately if the bonding process is bad.
9. The COB circuit board manufacturing process according to claim 1, wherein the sealant is mainly used for dispensing black glue on a PCB (printed Circuit Board) for testing OK, air holes are not formed on the surface of the dried black glue, the black glue is not cured, the height of the black glue is preferably not more than 1.8MM, the temperature of a preheating plate and the drying temperature are strictly controlled when dispensing is carried out with the height of the black glue being particularly required to BE less than 1.5MM, and the BE-08 black glue FR4PCB is vibrated as an example: preheating temperature of 120 + -15 deg.C for 1.5-3.0 min, drying temperature of 140 + -15 deg.C for 40-60 min, and sealing with adhesive by needle transfer method and pressure injection method.
10. The COB circuit board manufacturing process according to claim 1, wherein the testing is performed on the manufactured product, and the testing mode can be classified into two types, namely non-contact type testing and contact type testing, wherein the non-contact type testing is developed from manual visual inspection to automatic X-ray analysis by optical image analysis, from appearance circuit pattern inspection to inner layer welding spot quality inspection, and from independent inspection to the direction of combining quality monitoring and defect repair.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211425798.5A CN115643688A (en) | 2022-11-15 | 2022-11-15 | COB circuit board manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211425798.5A CN115643688A (en) | 2022-11-15 | 2022-11-15 | COB circuit board manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115643688A true CN115643688A (en) | 2023-01-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211425798.5A Pending CN115643688A (en) | 2022-11-15 | 2022-11-15 | COB circuit board manufacturing process |
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|---|---|
| CN (1) | CN115643688A (en) |
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- 2022-11-15 CN CN202211425798.5A patent/CN115643688A/en active Pending
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