CN115632037A - Special grid type liquid cooling radiator for high-density ASIC chip - Google Patents
Special grid type liquid cooling radiator for high-density ASIC chip Download PDFInfo
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- CN115632037A CN115632037A CN202211071384.7A CN202211071384A CN115632037A CN 115632037 A CN115632037 A CN 115632037A CN 202211071384 A CN202211071384 A CN 202211071384A CN 115632037 A CN115632037 A CN 115632037A
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- metal frame
- liquid
- asic chip
- frame body
- tortuous
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a grid type liquid cooling radiator special for a high-density ASIC chip, which relates to the technical field of radiating equipment and comprises a metal frame body and an infusion assembly, wherein a tortuous channel is formed in the metal frame body, the tortuous channel comprises a plurality of transverse grooves which are sequentially communicated, and a bridge channel is communicated between every two adjacent transverse grooves; the infusion set is in communication with the tortuous passageway. The metal frame has the beneficial effects that the tortuous channel is formed in the metal frame body and is used for circulating the heat dissipation liquid medium, the ASIC chip is connected with the bottom surface of the metal frame body, the heat transferred to the metal frame body by the ASIC chip can be taken away under the flowing of the heat dissipation liquid medium to achieve the purpose of heat dissipation, a fan is not needed to be adopted for heat dissipation like the traditional method, the mute work can be realized, and the service life is long.
Description
Technical Field
The invention relates to the technical field of heat dissipation equipment, in particular to a special grid type liquid cooling radiator for a high-density ASIC chip.
Background
ASIC chips refer to integrated circuit chips designed and manufactured to meet the needs of a particular user and the needs of a particular electronic system. The ASIC chip is characterized by facing the requirements of specific users, and compared with a general integrated circuit, the ASIC chip has the advantages of smaller volume, lower power consumption, improved reliability, improved performance, enhanced confidentiality, reduced cost and the like during batch production, so that the ASIC chip is widely applied at present.
Because ASIC chip generates heat in the use, the heat gives off when not in time and can take place to damage easily, but traditional ASIC chip adopts the fan to carry out the forced air cooling usually, but the noise that produces in the fan working process is great to long live time takes place to damage easily, and is very inconvenient.
Disclosure of Invention
The invention overcomes the defects in the prior art, and provides a grid type liquid cooling radiator special for a high-density ASIC chip.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a grid type liquid cooling radiator special for a high-density ASIC chip comprises a metal frame body and a liquid conveying assembly, wherein a tortuous channel is formed in the metal frame body and comprises a plurality of transverse grooves which are sequentially communicated;
the infusion assembly is communicated with the tortuous channel, and the infusion assembly is used for the heat dissipation liquid medium to enter and exit the tortuous channel;
a bridge channel is communicated between the adjacent transverse grooves, and a heat dissipation liquid medium flows between the adjacent transverse grooves;
the bottom surface of the metal frame body forms the inner wall of the bottom of the tortuous channel, and when a radiating liquid medium flows in the tortuous channel, the radiating liquid medium can take away heat on the bottom surface of the metal frame body;
the lower surface of the metal frame body is detachably provided with a plurality of convex plates which are used for being connected with the ASIC chip.
Still further, the infusion assembly comprises a liquid inlet head and a liquid outlet head, the liquid inlet head is communicated with the inlet of the tortuous channel, and the liquid outlet head is communicated with the outlet of the tortuous channel.
Furthermore, the device comprises a cover plate, wherein the shape of the cover plate is matched with that of the tortuous channel, and the cover plate covers the tortuous channel.
Further, when the cover plate is installed on the tortuous channel, the upper surface of the cover plate is flush with the upper surface of the metal frame.
Further, the convex plate is arranged in a square shape to match the size of the ASIC chip.
Furthermore, the metal frame body comprises a plurality of reinforcing plates, the reinforcing plates are positioned between the circuitous and tortuous channels, and connecting holes are formed in part of the reinforcing plates.
Furthermore, the protruding plate is provided with a through hole, the lower surface of the metal frame body is provided with a screw hole, and a screw penetrates through the through hole and is connected to the screw hole.
Furthermore, the liquid inlet head and the liquid outlet head are arranged on the same side of the metal frame body; and temperature detection probes are arranged in the liquid inlet head and the liquid outlet head.
Further, the bridge is hollow cylindrical.
Furthermore, the liquid inlet head and the liquid outlet head are both arranged into a pagoda joint.
Furthermore, a step position is formed on the inner side of the circuitous and tortuous channel, and the cover plate is mounted on the step position in an overlapping manner; the upper surface of step position is inlayed and is provided with the magnetic stripe, the lower surface of apron corresponds magnetic stripe department inlays and has the magnetic metal strip.
Compared with the prior art, the invention has the beneficial effects that:
the invention is formed with the circuitous tortuous channel in the metal frame, the circuitous tortuous channel is for the circulation of liquid medium of heat dissipating, the liquid medium of heat dissipating can be water, antifreeze or other heat dissipating liquid, the ASIC chip is connected to the bottom surface of the metal frame, the heat that the ASIC chip transmits to the metal frame can take away under the liquid medium of heat dissipating flows and reaches the goal of heat dissipating, there are bridges in the circuitous tortuous channel, the fluidity to strengthen the liquid medium of heat dissipating, does not need to adopt the blower to dispel the heat like the tradition, can realize the work of muting, have long performance life, the structure is ingenious.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, with the understanding that the present disclosure is to be considered as an exemplification of the invention and is not intended to limit the invention to the embodiments illustrated in the drawings, in which:
FIG. 1 is a schematic diagram of the present heat sink in a detached state from an ASIC chip;
FIG. 2 is a first perspective view of the heat sink;
FIG. 3 is a second perspective view of the heat sink;
fig. 4 is a schematic view of the state where the metal frame and the cover plate are separated from each other in the heat sink.
In the figure: the liquid level sensor comprises a metal frame body 1, a convex plate 101, a reinforcing plate 102, a connecting hole 1021, a liquid inlet head 2, a liquid outlet head 3, a tortuous channel 4, a transverse groove 401, a step 402, a cover plate 5, an ASIC chip 6 and a bridge 7.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
As shown in fig. 1 to 4, a high-density ASIC chip dedicated grid type liquid cooling radiator comprises a metal frame 1 and a liquid infusion assembly, wherein the metal frame 1 is made of aluminum material and has the characteristics of light weight and good heat conduction performance, a tortuous channel 4 is formed in the metal frame 1, the tortuous channel 4 comprises a plurality of transverse grooves 401 which are sequentially communicated, and a bridge passage 7 is communicated between adjacent transverse grooves 401, so that the adjacent transverse grooves 401 are communicated end to end for the flow of a heat dissipation liquid medium, and the heat dissipation liquid medium can also circulate through the bridge passage 7, thereby enhancing the flow speed of the heat dissipation liquid medium in the tortuous channel 4 and improving the heat dissipation effect; the infusion component is communicated with the tortuous channel 4 and is used for assisting the heat dissipation liquid medium to enter and exit the tortuous channel 4.
The bottom surface of the metal frame body 1 forms the bottom inner wall of the circuitous and tortuous channel 4, and the ASIC chip 6 is connected with the bottom surface of the metal frame body 1 for heat dissipation, so when a heat dissipation liquid medium flows in the circuitous and tortuous channel 4, the heat transferred from the ASIC chip 6 to the bottom surface of the metal frame body 1 is taken away, and the effect of heat dissipation of the ASIC chip 6 is achieved.
In addition, the bridge passage 7 is hollow and cylindrical, and the flow rate is large; the plurality of transverse grooves 401 are arranged at equal intervals and have uniform structures.
The liquid conveying assembly comprises a liquid inlet head 2 and a liquid outlet head 3, the liquid inlet head 2 is communicated with an inlet of the roundabout channel 4, the liquid outlet head 3 is communicated with an outlet of the roundabout channel 4, and a radiating liquid medium flows into the roundabout channel 4 from the liquid inlet head 2 and is finally discharged from the liquid outlet head 3, so that heat in the metal frame body 1 is taken away; wherein, the heat dissipation liquid medium can be water, antifreeze or other heat dissipation liquid; liquid inlet head 2 and liquid outlet head 3 all set to the pagoda and connect, and the pagoda connects and helps strengthening liquid inlet head 2 and the stability of liquid outlet head 3 and external pipeline connection, makes external pipeline be difficult to take place the pine and take off.
The lower surface of the metal frame body 1 is detachably provided with a plurality of convex plates 101 used for being connected with the ASIC chip 6, the convex plates 101 are provided with through holes, the lower surface of the metal frame body 1 is provided with screw holes, screws penetrate through the through holes and are connected to the screw holes, so that the convex plates 101 are fixed on the lower surface of the metal frame body 1, and the screw holes can be distributed on the lower surface of the metal frame body 1; the convex plate 101 is arranged in a square shape, and is matched with the size of the ASIC chip 6 and corresponds to the ASIC chip one by one; the metal frame body 1 comprises a plurality of reinforcing plates 102, the reinforcing plates 102 are located between the circuitous and tortuous channels 4, the reinforcing plates 102 have the function of reinforcing the whole structure, connecting holes 1021 are formed in part of the reinforcing plates 102, as seen from fig. 1, a plurality of ASIC chips 6 are arranged on the chip plates, the number and the positions of the reinforcing plates 102 correspond to those of the ASIC chips 6, holes corresponding to the connecting holes 1021 are also formed in the chip plates, when the temperature is reduced, the ASIC chips 6 correspond to the convex plates 101, at the moment, the connecting holes 1021 and the holes of the chip plates are also in a corresponding state, bolts are locked in the connecting holes 1021 and the holes to lock the chip plates and the metal frame body 1, at the moment, the ASIC chips 6 cling to the convex plates 101, heat generated when the ASIC chips 6 work can be transferred to the convex plates 101, namely, and is transferred to the metal frame body 1, and the heat is taken away by the flow of a heat dissipation medium in the circuitous and tortuous channels 4. The convex plate 101 is designed to protrude from the lower surface of the metal frame 1, and contributes to enhancing the adhesion and the tightness of the contact with the ASIC chip 6.
As shown in fig. 4, the winding and meandering channel 4 is formed on the metal frame 1 in a winding manner, which is helpful for extending the flow path of the heat dissipation medium in the metal frame 1, enhancing the heat dissipation effect on the metal frame 1, and also capable of providing as many arrangement numbers of the convex plates 101 as possible, thereby increasing the heat dissipation number on the ASIC chip 6.
The heat dissipation device comprises a cover plate 5, wherein the arrangement shape of the cover plate 5 is matched with that of a tortuous channel 4, the cover plate 5 covers the tortuous channel 4, in the practical design, the edge of the inner wall of the tortuous channel 4 can be provided with a step 402 for supporting the cover plate 5, the cover plate 5 has a sealing effect on the tortuous channel 4, and the heat dissipation medium in the tortuous channel 4 is prevented from being easily polluted; in addition, as seen from fig. 2, when the cover plate 5 is installed on the tortuous channel 4, the upper surface of the cover plate 5 is flush with the upper surface of the metal frame 1, so that the structure is compact, the appearance is high, and the subsequent assembly with other components is facilitated.
The step 402 is positioned at the inner side of the circuitous and tortuous channel, and the cover plate 5 is lapped and installed on the step 402; the upper surface of the step position 402 is embedded with a magnetic strip, the lower surface of the cover plate 5 is embedded with a magnetic metal strip corresponding to the magnetic strip, and the magnetic strip has an adsorption effect on the magnetic metal strip, so that the cover plate 5 is stably lapped on the tortuous channel 4 and is not easy to loosen; the sled opening can be preset at the edge of apron 5, when needs take away apron 5, stretch into through the instrument to sled the opening and carry out the perk can, very convenient.
The lower surfaces of the plurality of convex plates 101 are positioned on the same horizontal plane, so that the lower surfaces of the plurality of convex plates are favorably attached to the ASIC chip 6 to be flat; the convex plates 101 are uniformly arrayed on the lower surface of the metal frame 1, and are neat and beautiful.
The liquid inlet head 2 and the liquid outlet head 3 are arranged on the same side of the metal frame body 1, so that the insertion installation of an external pipeline is facilitated, the external pipeline can be connected with the liquid inlet head 2 and the liquid outlet head 3 on the same side, the bending or winding problem of the external pipeline cannot occur, and the assembly is also facilitated; all be provided with temperature detect probe in liquid inlet head 2 and the liquid outlet head 3 for survey the inflow temperature and the outflow temperature of heat dissipation liquid medium respectively, be convenient for look over the cooling effect in real time.
The radiator can meet the requirement of high-power and high-density ASIC chip on mute heat dissipation, is simple to install and easy to process, can realize on-line detection of the working state of the ASIC chip, can realize on-line maintenance and mute work.
Finally, it should be noted that: although the present invention has been described in detail with reference to the embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (10)
1. A grid type liquid cooling radiator special for a high-density ASIC chip is characterized by comprising a metal frame body and an infusion assembly, wherein a tortuous channel is formed in the metal frame body and comprises a plurality of transverse grooves which are sequentially communicated;
the infusion assembly is communicated with the tortuous channel, and the infusion assembly is used for the heat dissipation liquid medium to enter and exit the tortuous channel;
a bridge passage is communicated between the adjacent transverse grooves, and a heat dissipation liquid medium flows between the adjacent transverse grooves through the bridge passage; the bottom surface of the metal frame body forms the inner wall of the bottom of the tortuous channel, and when a radiating liquid medium flows in the tortuous channel, the radiating liquid medium can take away heat on the bottom surface of the metal frame body;
the lower surface of the metal frame body is detachably provided with a plurality of convex plates which are used for being connected with the ASIC chip.
2. The grid-type liquid-cooled heat sink as claimed in claim 1, wherein the liquid-feeding module comprises a liquid-feeding head and a liquid-discharging head, the liquid-feeding head is connected to the inlet of the winding channel, and the liquid-discharging head is connected to the outlet of the winding channel.
3. The grid-type liquid-cooled heat sink as claimed in claim 2, wherein the heat sink comprises a cover plate, the shape of the cover plate is matched with the shape of the tortuous channel, and the cover plate covers the tortuous channel.
4. The liquid cooled heat sink as claimed in claim 3, wherein when the cover plate is mounted on the tortuous path, the top surface of the cover plate is flush with the top surface of the metal frame.
5. The high-density ASIC chip specific grid-type liquid-cooled heat sink of claim 1, wherein said raised plate is square shaped to match the size of said ASIC chip.
6. The special grid type liquid cooling radiator for high-density ASIC chips as claimed in claim 1, wherein said metal frame includes several reinforcing plates between said circuitous and tortuous channels, wherein some of said reinforcing plates have connecting holes.
7. The grid-type liquid-cooled heat sink as claimed in claim 5, wherein the protruding plate has a through hole, and the lower surface of the metal frame has a screw hole, and a screw is inserted through the through hole and connected to the screw hole.
8. The special grid type liquid cooling radiator for the high-density ASIC chip as claimed in claim 2, wherein the liquid inlet head and the liquid outlet head are installed on the same side of the metal frame; and temperature detection probes are arranged in the liquid inlet head and the liquid outlet head.
9. The special grid type liquid cooling radiator for the high-density ASIC chip as claimed in claim 2, wherein the liquid inlet and the liquid outlet are both arranged as pagoda joints.
10. The special grid type liquid cooling radiator for high density ASIC chip as defined in claim 3, wherein, the inside of said tortuous path is formed with a step, and said cover plate is mounted on said step in a lap joint manner; the upper surface of the step position is inlaid with a magnetic stripe, and the lower surface of the cover plate corresponding to the magnetic stripe is inlaid with a magnetic metal strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211071384.7A CN115632037A (en) | 2022-09-01 | 2022-09-01 | Special grid type liquid cooling radiator for high-density ASIC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211071384.7A CN115632037A (en) | 2022-09-01 | 2022-09-01 | Special grid type liquid cooling radiator for high-density ASIC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115632037A true CN115632037A (en) | 2023-01-20 |
Family
ID=84903184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211071384.7A Pending CN115632037A (en) | 2022-09-01 | 2022-09-01 | Special grid type liquid cooling radiator for high-density ASIC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115632037A (en) |
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2022
- 2022-09-01 CN CN202211071384.7A patent/CN115632037A/en active Pending
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