CN115629496A - Backlight module, preparation method thereof and display device - Google Patents
Backlight module, preparation method thereof and display device Download PDFInfo
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- CN115629496A CN115629496A CN202210994984.4A CN202210994984A CN115629496A CN 115629496 A CN115629496 A CN 115629496A CN 202210994984 A CN202210994984 A CN 202210994984A CN 115629496 A CN115629496 A CN 115629496A
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- 239000000758 substrate Substances 0.000 claims abstract description 139
- 238000009792 diffusion process Methods 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 136
- 239000011521 glass Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
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- 238000007641 inkjet printing Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
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- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 230000001788 irregular Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000012788 optical film Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The embodiment of the disclosure provides a backlight module, a preparation method thereof and a display device. The backlight module includes: a light emitting substrate including a base substrate and a plurality of light emitting elements disposed on the base substrate; the light diffusion layer is positioned on the light emitting side of the light emitting substrate and comprises a base material body and a plurality of grooves arranged on one side of the base material body, facing the light emitting substrate, the grooves correspond to the light emitting elements one to one, and the light emitting elements are embedded into the grooves. According to the technical scheme, the light diffusion layer and the light-emitting substrate can be accurately aligned, the light diffusion layer and the light-emitting substrate are prevented from moving relatively in the carrying process, the alignment precision is protected, and the operation difficulty is reduced.
Description
Technical Field
The disclosure relates to the technical field of display, and in particular relates to a backlight module, a manufacturing method thereof and a display device.
Background
The liquid crystal display device needs to adopt a backlight module, and the backlight module can adopt a Light Emitting Diode (LED) chip as a light source. In the prior art, when the LED backlight module with the glass diffusion plate is adopted, the problem that the glass diffusion plate and an LED chip are difficult to align exists.
Disclosure of Invention
The embodiment of the disclosure provides a backlight module, a preparation method thereof and a display device, so as to solve or alleviate one or more technical problems in the prior art.
As a first aspect of the embodiments of the present disclosure, an embodiment of the present disclosure provides a backlight module including:
a light emitting substrate including a base substrate and a plurality of light emitting elements disposed on the base substrate;
the light diffusion layer is positioned on the light emitting side of the light emitting substrate and comprises a base material body and a plurality of grooves arranged on one side of the base material body, facing the light emitting substrate, the grooves correspond to the light emitting elements one to one, and the light emitting elements are embedded into the grooves.
In some embodiments, the light diffusion layer further includes a light transmissive layer disposed on a side of the base material body facing the light emitting substrate, and the groove is disposed on a surface of the light transmissive layer facing the side of the light emitting substrate.
In some embodiments, the light-emitting substrate further includes a plurality of protection protrusions disposed on a surface of the substrate facing the light-emitting elements, the protection protrusions correspond to the light-emitting elements one to one, the protection protrusions cover the light-emitting elements, and the protection protrusions are inserted into the grooves.
In some embodiments, the surface shape of the groove matches the surface shape of the protective protrusion, and the surface of the protective protrusion conforms to the surface of the groove.
In some embodiments, the surface of the groove includes a second flat section at the bottom of the groove and a second side section connecting between an edge of the second flat section and an edge of the opening of the groove, the second side section being an inclined plane or a concave curved surface.
In some embodiments of the present invention, the,
the diameter range of the flat part is 0.2 mm-0.3 mm; and/or the presence of a gas in the atmosphere,
the diameter of the opening of the groove is larger than 2.5mm.
In some embodiments, the depth of the groove is less than 0.5mm.
In some embodiments, the material of the substrate body includes glass, and the transparent layer is a transparent adhesive layer.
In some embodiments, the light diffusion layer further includes a reflective layer, the reflective layer includes a plurality of reflective patterns, the plurality of reflective patterns correspond to the plurality of grooves one to one, and the reflective layer is disposed on a side surface of the base material body facing the light-emitting substrate or on a side surface of the base material body facing away from the light-emitting substrate.
In some embodiments, the light diffusion layer further comprises a light uniformizing layer, and the light uniformizing layer is positioned on one side of the substrate body, which faces away from the light-emitting substrate.
As a second aspect of the embodiments of the present disclosure, a method for manufacturing a backlight module includes: preparing a light-emitting substrate and a light diffusion layer; aligning and assembling the light-emitting substrate and the light diffusion layer;
the light-emitting substrate comprises a substrate base plate, a plurality of light-emitting elements arranged on the substrate base plate, and a plurality of protection bulges arranged on one side of the base material body, which faces the light-emitting elements, wherein the protection bulges correspond to the light-emitting elements one by one, and the protection bulges cover the light-emitting elements;
the preparation of the light diffusion layer comprises:
forming a light-transmitting layer on one side of the substrate body;
forming a plurality of grooves on the surface of one side of the light-transmitting layer, which is far away from the substrate body;
the light-emitting substrate and the light diffusion layer are assembled in an alignment mode, and the method comprises the following steps:
arranging the light diffusion layer opposite to the light emitting substrate so that the plurality of grooves face the plurality of protective protrusions; the plurality of protection protrusions are embedded into the plurality of grooves in a one-to-one correspondence.
As a third aspect of the embodiments of the present disclosure, an embodiment of the present disclosure provides a display device, including the backlight module in any embodiment of the present disclosure, and further including a display panel, where the display panel is located on a side of the light diffusion layer away from the light emitting substrate.
According to the technical scheme of the embodiment of the disclosure, accurate alignment of the light diffusion layer and the light-emitting substrate can be realized, relative movement between the light diffusion layer and the light-emitting substrate in a carrying process is avoided, the alignment precision is protected, and the operation difficulty is reduced.
The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present disclosure will be readily apparent by reference to the drawings and following detailed description.
Drawings
In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are not to be considered limiting of its scope.
Fig. 1 is a schematic structural diagram of a backlight module in the related art;
FIG. 2 is a schematic structural diagram of a backlight module before being assembled according to an embodiment of the disclosure;
FIG. 3 is a schematic structural diagram illustrating an assembled backlight module according to an embodiment of the disclosure;
FIG. 4 is a schematic plane structure diagram of a reflective pattern according to an embodiment of the disclosure;
FIG. 5 is a schematic cross-sectional view of a light diffusion layer in another embodiment of the present disclosure;
FIG. 6 is a schematic view of the male mold in one embodiment;
fig. 7 is a schematic structural diagram of a display device according to an embodiment of the disclosure.
Description of reference numerals:
10. a light-emitting substrate; 11. a substrate base plate; 12. a light emitting element; 13. a protective adhesive layer; 14. a protection protrusion; 141. a first planar portion; 142. a first side surface portion; 20. a light diffusion layer; 21. a substrate body; 22. a reflective pattern; 23. a leveling layer; 24. a light transmitting layer; 240. a groove; 241. a second planar section; 242. a second side surface portion.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, and the different embodiments may be combined in any way without conflict, without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
The Light Emitting Diode chip (LED chip) in the present disclosure may be a sub-millimeter Light Emitting Diode (Mini LED) chip, or may be a Micro Light Emitting Diode (Micro Light Emitting Diode, micro LED for short) chip.
For Mini LED products, the size of the Pitch (Pitch) between adjacent LEDs in the backlight module determines the Mura (irregular bright and dark stripes appearing on the screen), and to solve the Mura, an air layer and a diffusion plate are required to be added, which increases the thickness of the backlight module. Adopt the glass diffuser plate, can realize ultra-thin design.
When the backlight module is designed, if the mode of an air layer and a light homogenizing film is adopted, the problem of picture Mura caused by large distance between LEDs can be solved, but the thickness of the module is increased. In the case of using the same LED Pitch, if a glass diffusion plate is used, the module thickness can be reduced.
Adopt the glass diffuser plate, at the in-process of equipment, require pattern and the accurate counterpoint of LED on the glass diffuser plate, otherwise can't obtain better even light effect. However, the prior art has the problem that the alignment of the glass diffusion plate and the LED on the light-emitting substrate is difficult.
Fig. 1 is a schematic structural diagram of a backlight module in the related art. As shown in fig. 1, the light emitting substrate 10 includes a substrate 11 and a plurality of light emitting elements 12 disposed on the substrate 11, and the light emitting elements 12 may be LED chips. The light-emitting substrate 10 further includes a protective adhesive layer 13 covering the light-emitting elements 12, and an upper surface of the protective adhesive layer 13 is a flat surface. The light diffusion layer 20 includes a base material body 21, a reflection layer including a plurality of reflection patterns 22, and a light uniformizing layer 23, and the plurality of reflection patterns 22 correspond to the plurality of light emitting elements 12 one to one. The reflecting layer is positioned on one side of the base material body 21 departing from the light-emitting substrate 10, and the light homogenizing layer 23 is positioned on one side of the reflecting layer departing from the base material body 21 and covers the reflecting layer.
In the assembling process of the light diffusion layer 20 and the light emitting substrate 10, precise alignment between the reflective pattern in the reflective layer and the LED chip needs to be achieved, otherwise it is difficult to obtain a good light-homogenizing effect. However, in an actual assembly process, due to a cutting tolerance, an LED chip mounting tolerance, a pattern manufacturing tolerance, and the like, it is difficult to achieve accurate alignment between the pattern in the reflective layer and the LED chip by using the existing alignment method. Moreover, even if the alignment meets the requirement, the light diffusion layer 20 is easy to move in the product conveying process, and the alignment effect is damaged, so that the operation difficulty is increased.
Fig. 2 is a schematic structural view of a backlight module before being assembled according to an embodiment of the disclosure, and fig. 3 is a schematic structural view of the backlight module after being assembled according to an embodiment of the disclosure. In one embodiment, as shown in fig. 2, the backlight assembly may include a light emitting substrate 10 and a light diffusion layer 20. The light-emitting substrate 10 includes a substrate 11 and a plurality of light-emitting elements 12 disposed on the substrate 11. The light diffusion layer 20 is located on the light exit side of the light emitting substrate 10, and the light diffusion layer 20 includes a base material body 21 and a plurality of grooves 240 disposed on the base material body 21 on the side facing the light emitting substrate 10. The plurality of grooves 240 correspond to the plurality of light emitting elements 12 one to one, and the light emitting elements 12 are fitted into the grooves 240.
In the related art shown in fig. 1, when the light diffusion layer 20 and the light-emitting substrate 10 are assembled, precise alignment cannot be achieved by using a side alignment method.
In the backlight module according to the embodiment of the disclosure, the plurality of grooves 240 in the light diffusion layer 20 correspond to the plurality of light emitting elements 12 one by one, and the light emitting elements 12 are embedded in the grooves 240, so that when the light diffusion layer 20 and the light emitting substrate 10 are assembled, the plurality of grooves 240 correspond to the plurality of light emitting elements 12 one by one, and the light emitting elements 12 are embedded in the grooves 240, thereby realizing accurate alignment of the light diffusion layer 20 and the light emitting substrate 10. Moreover, after the backlight module is assembled, the light emitting element 12 is embedded into the groove 240, so that the light emitting element 12 and the groove 240 are limited mutually, the light diffusion layer 20 and the light emitting substrate 10 are prevented from moving relatively in the carrying process, the alignment precision is protected, and the operation difficulty is reduced. In addition, the light emitting element 12 is embedded in the groove 240, so that the distance between the light emitting substrate 10 and the light diffusion layer 20 can be reduced, and the light and thin design of the backlight module can be realized.
Illustratively, the light emitting elements 12 may be LED chips.
Illustratively, the material of the substrate body 21 includes glass, for example, the substrate body 21 may be glass.
In one embodiment, as shown in fig. 2 and 3, the light diffusion layer 20 may further include a light-transmitting layer 24, the light-transmitting layer 24 is disposed on a side of the base material body 21 facing the light-emitting substrate 10, and the groove 240 is disposed on a surface of the light-transmitting layer 24 facing the light-emitting substrate 10. With such a structure, the groove 240 can be formed on the surface of the light-transmitting layer 24 facing the light-emitting substrate 10, and the groove 240 does not need to be formed on the lower surface of the base material body 21, thereby reducing the difficulty in processing the groove 240. The light-transmitting layer 24 is disposed in the groove 240 to avoid the influence of light on the light-emitting element 12.
In one embodiment, the transparent layer 24 may be a transparent adhesive layer, and the transparent layer 24 made of such a material is relatively easy to prepare, and the groove 240 is relatively easy to form on the transparent adhesive layer, so that the processing difficulty of the groove 240 is reduced, and the cost is reduced.
In one embodiment, as shown in fig. 2 and 3, the light-emitting substrate 10 further includes a plurality of protection protrusions 14 disposed on a surface of the substrate 11 facing the light-emitting elements 12, and the plurality of protection protrusions 14 correspond to the plurality of light-emitting elements 12 one to one. The protection protrusion 14 covers the light emitting element 12, and the protection protrusion 14 is fitted into the groove 240 so that the light emitting element 12 is also fitted into the groove 240.
With the structure, the protection protrusion 14 can protect the light-emitting element 12, the size of the protection protrusion 14 is larger than that of the light-emitting element 12, after the protection protrusion 14 is embedded into the groove 240, the protection protrusion 14 and the groove 240 can form mutual limiting, and the structural firmness of the backlight module is improved.
Illustratively, the material of the protection protrusion 14 may include silicone.
In one embodiment, as shown in fig. 2 and 3, the surface shape of the groove 240 is matched with the surface shape of the protection protrusion 14, so that the surface of the protection protrusion 14 can be conformed to the surface of the groove 240 after the protection protrusion 14 is inserted into the groove 240. Therefore, the protection protrusion 14 and the groove 240 can be better limited, and the light diffusion layer 20 and the light-emitting substrate 10 are prevented from moving relatively during the transportation of the backlight module.
In one embodiment, as shown in fig. 2, the surface of the protection protrusion 14 includes a first plane portion 141 and a first side surface portion 142, and the first side surface portion 142 may be an inclined plane or an outwardly convex curved surface. Correspondingly, the surface of the groove 240 may include a second plane portion 241 and a second side portion 242, the second plane portion 241 being located at the bottom of the groove 240, the second side portion 242 being connected between the edge of the second plane portion 241 and the opening edge of the groove 240, the second side portion 242 being an inclined plane or a concave curved surface. Therefore, after the protection protrusion 14 is embedded in the groove 240, the first plane portion 141 is attached to the second plane portion 241, the first side surface portion 142 is attached to the second side surface portion 242, the protection protrusion 14 and the groove 240 are mutually limited in the direction parallel to the substrate base plate 11 and the direction perpendicular to the substrate base plate 11, and the limitation of the protection protrusion 14 and the groove 240 in the three-axis directions of X, Y and Z is realized.
The side surface portion is an inclined plane, and it should be understood that the cross-sectional edge of the side surface portion is a straight line. The first side surface part 142 is a curved surface which is convex outward, and it should be understood that the cross-sectional edge of the first side surface part 142 is a convex curved line. The second side portion 242 is a concave curved surface, and it should be understood that the cross-sectional edge of the second side portion 242 is a concave curve, as shown in fig. 2.
The surface shapes of the protection protrusion 14 and the groove 240 in one embodiment are only schematically shown in fig. 2 and 3. It is understood that the shapes of the protection protrusion 14 and the groove 240 are not limited to those of fig. 2 and 3. The surface shape of the protection protrusion 14 may be set as desired, for example, the surface shape of the protection protrusion 14 may be a spherical curved surface or a truncated cone shape, as long as the surface shape of the groove 240 matches the surface shape of the protection protrusion 14.
In one embodiment, as shown in fig. 2, the second plane portion 241 may be circular in shape, and the diameter D1 of the second plane portion 241 may range from 0.2mm to 0.3mm (inclusive). For example, the diameter D1 of the second plane portion 241 may be 0.2mm, 0.25mm, or 0.3mm.
In one embodiment, the opening shape of the groove 240 may be circular. The diameter D2 of the opening of the groove 240 may be greater than 2.5mm. Illustratively, the diameter D2 of the opening of the groove 240 may be 2.7mm.
In one embodiment, the depth of the groove 240 is less than or equal to 0.5mm. Thus, the thickness of the backlight module is not increased.
In one embodiment, as shown in fig. 2, the thickness of the transparent layer 24 may be smaller than or equal to the distance between the substrate 11 and the base material body 21, such that the thickness of the backlight module is not increased by the transparent layer 24.
In one embodiment, the light diffusion layer 20 further includes a reflective layer including a plurality of reflective patterns 22, and the reflective patterns 22 are used to reflect light incident on the reflective patterns 22. The plurality of reflective patterns 22 correspond to the plurality of grooves 240 one to one. Illustratively, the center of the reflective pattern 22 coincides with the center of the groove 240.
Fig. 4 is a schematic plan view illustrating a reflective pattern according to an embodiment of the disclosure. In one embodiment, as shown in fig. 4, the reflective pattern 22 may include a plurality of sub-protrusions 221, and gaps between adjacent sub-protrusions 221 are gradually increased from the center toward the edge of the reflective pattern 22. As can be seen from fig. 4, the gap between two adjacent sub-protrusions 221 positioned at the center of the reflective pattern 22 is smaller than the gap between two adjacent sub-protrusions 221 positioned at the edge.
Illustratively, the size of the sub-protrusion 221 may gradually decrease from the center toward the edge of the reflective pattern 22.
The reflection pattern 22 with the structure shown in fig. 4 can reduce the brightness of the backlight module at the position opposite to the light emitting element 12, so that the light emitted by the light emitting element 12 can be better reflected and diffused to the periphery after being irradiated on the reflection pattern 22, and the light uniformizing effect is improved. Moreover, a certain gap exists between adjacent sub-protrusions 221 located in the middle of the reflective pattern 22, and when the reflectivity of the material of the sub-protrusions 221 is too large, the light emitted by the light emitting element 12 can be emitted through the gap, thereby preventing the backlight module from generating dark spots at the position opposite to the light emitting element 12.
For example, the sub-protrusions 221 may be arranged in an array, a periodic array, or other states on the surface of the substrate body 21. For example, the plurality of sub protrusions 221 may be disposed in a manner such that the density gradually decreases from the center to the edge of the reflective pattern 22.
In the plurality of sub-protrusions 221, the shape and thickness of each sub-protrusion 221 may be the same or different.
In one embodiment, the orthographic shape of the sub-protrusions 221 on the substrate base plate 11 may be a circle.
Illustratively, the size of the orthographic projection of the sub-bump 221 on the substrate base 11 may be 0.05 to 1 times the size of the orthographic projection of the light emitting element 12 on the substrate base 11. For example, the size of the orthographic projection of the sub-protrusions 221 on the substrate base plate 11 can be adjusted according to the dodging requirement. Exemplarily, if the orthographic projection of the light emitting element 12 on the substrate base 11 is square, the orthographic projection size of the sub-bump 221 on the substrate base 11 may be 0.05 to 1 times the size of the side of the orthographic projection of the light emitting element 12 on the substrate base 11; if the orthographic projection of the light-emitting element 12 on the base substrate 11 is rectangular, the orthographic projection size of the sub-bump 221 on the base substrate 11 may be 0.05 to 1 times the size of the shorter side of the orthographic projection of the light-emitting element 12 on the base substrate 11.
Illustratively, the reflective pattern 22 may be formed on the surface of the substrate body 21 by a printing, inkjet printing or stamping process, and the material of the reflective pattern 22 may be the same as or different from that of the substrate body 21. Alternatively, the surface of the base material body 21 facing the light emitting element 12 may be processed to remove a part of the material to form the reflection pattern 22.
The reflective pattern 22 may homogenize light by reflecting the light irradiated to the reflective pattern 22. The light uniformizing effect can be controlled by controlling the thickness and density of the reflective patterns 22.
In one embodiment, the reflective layer is disposed on a side surface of the base body 21 facing away from the light-emitting substrate 10, as shown in fig. 2 and 3. For example, the reflective pattern 22 may be formed on the surface of the base material body 21 by a printing, inkjet printing or imprinting process on the surface of the base material body 21 on the side away from the light emitting substrate 10.
In one embodiment, the light diffusion layer 20 may further include a light uniformizing layer 23, and the light uniformizing layer 23 is located on a side of the base material body 21 facing away from the light-emitting substrate 10. The light homogenizing layer 23 can further homogenize light to provide light uniformity of the backlight module.
In one embodiment, as shown in fig. 2 and 3, in the case that the reflective layer is disposed on the surface of the base material body 21 on the side away from the light-emitting substrate 10, the reflective layer may be located between the light uniformizing layer 23 and the base material body 21, and the light uniformizing layer 23 may not only perform the function of uniformizing light but also protect the reflective pattern 22.
Illustratively, the material of the dodging layer 23 may include organic matter. For example, the levelling layer 23 may be a plastic diffusion film.
In the embodiment shown in fig. 2 and 3, the depth of the groove 240 may be the same as the thickness of the light-transmitting layer 24.
In one embodiment, the leveling layer 23 may include a transparent substrate layer and diffusion particles positioned in the transparent substrate layer. Such a light uniformizing layer 23 has a good light uniformizing effect. The specific material of the transparent substrate can be selected according to the requirement. The particle size and shape of the diffusion particles can be set as required.
For example, a transparent substrate film doped with diffusion particles may be coated on the surface of the substrate body 21 on the side where the reflection pattern 22 is formed, thereby forming the leveling layer 23.
Illustratively, the dodging layer 23 may be a plastic diffusion film. A plastic diffusion film may be attached to the surface of the substrate body 21 on which the reflection pattern 22 is formed.
Fig. 5 is a schematic cross-sectional view of a light diffusion layer in another embodiment of the present disclosure. In one embodiment, as shown in fig. 5, the reflective layer is disposed on a surface of the substrate body 21 facing the light-emitting substrate 10, the reflective layer is located between the substrate body 21 and the transparent layer 24, and the transparent layer 24 can protect the reflective pattern 22.
For example, as shown in fig. 5, the thickness of the transparent layer 24 may be greater than the sum of the depth of the groove 240 and the thickness of the reflective pattern 22 to prevent the reflective pattern 22 from being exposed through the groove 240, and the transparent layer 24 may protect the reflective pattern 22.
Illustratively, the reflective pattern 22 may be formed on the surface of the base material body 21 by printing, inkjet printing, or imprinting process on the surface of the base material body 21 on the side facing the light emitting substrate 10. A light-transmitting layer 24 is formed on the surface of the base material body 21 on which the reflection pattern 22 is formed.
The embodiment of the present disclosure further provides a method for manufacturing a backlight module, including:
preparing a light emitting substrate 10 and a light diffusion layer 20; the light-emitting substrate 10 and the light diffusion layer 20 are assembled in alignment.
The light-emitting substrate 10 includes a substrate 11, a plurality of light-emitting elements 12 disposed on the substrate 11, and a plurality of protection protrusions 14 disposed on a side of the base body 21 facing the light-emitting elements 12, the plurality of protection protrusions 14 corresponding to the plurality of light-emitting elements 12 one by one, and the protection protrusions 14 covering the light-emitting elements 12.
The light diffusion layer 20 includes a substrate body 21 and a light-transmitting layer 24 disposed on one side of the substrate body 21, a plurality of grooves 240 are disposed on a surface of the light-transmitting layer 24 on one side away from the substrate body 21, and the plurality of grooves 240 correspond to the plurality of protection protrusions 14 one to one.
The preparation of the light diffusion layer 20 includes: forming a light-transmitting layer 24 on one side of the base material body 21; a plurality of grooves 240 are formed on the surface of the light-transmitting layer 24 on the side away from the substrate body 21, and the plurality of grooves 240 correspond to the plurality of protection protrusions 14 one to one.
The light emitting substrate 10 and the light diffusion layer 20 are assembled in alignment, including: disposing the light diffusion layer 20 opposite to the light emitting substrate 10 such that the plurality of grooves 240 face the plurality of protective protrusions 14; the plurality of protection protrusions 14 are fitted into the plurality of grooves 240 in a one-to-one correspondence. Thereby completing the assembly of the backlight module.
In this assembly, the protection protrusions 14 are fitted into the grooves 240 in a one-to-one correspondence, so that the light diffusion layer 20 and the light-emitting substrate 10 are accurately aligned.
In one embodiment, preparing the light diffusion layer 20 may include the steps of: forming a plurality of reflection patterns 22 on one side surface of the base material body 21 by a printing technique; a layer of plastic diffusion film is attached to the reflection pattern 22 to serve as a light uniformizing layer 23, the plastic diffusion film can not only uniformize light, but also protect the reflection pattern 22 and prevent the reflection pattern 22 from being scratched; a layer of, for example, a transparent adhesive layer (e.g., a transparent silicone layer) is formed as the light-transmitting layer 24 on the other surface of the base material body 21 by printing, and the light-transmitting layer 24 is cured. A convex mold is adopted, as shown in fig. 6, fig. 6 is a schematic structural diagram of the convex mold in one embodiment, a plurality of protrusions 240 'matched with the surface shapes of the grooves 240 are arranged on the convex mold, and the shapes of the protrusions 240' on the convex mold are transferred to the transparent adhesive layer through a hot stamping process, so that the light diffusion layer 20 is manufactured.
The light-emitting substrate 10 and the light diffusion layer 20 are assembled in alignment, including: disposing the light diffusion layer 20 opposite to the light emitting substrate 10 such that the plurality of grooves 240 face the plurality of protective protrusions 14; the plurality of protection protrusions 14 are fitted into the plurality of grooves 240 in a one-to-one correspondence.
In one embodiment, a plurality of points of sealant can be disposed at the edge positions of the light diffusion layer 20 and the light emitting substrate 10 to further fix the light diffusion layer 20 and the light emitting substrate 10, and the light diffusion layer 20 and the light emitting substrate 10 can be bonded by the sealant to further prevent the light diffusion layer 20 and the light emitting substrate 10 from moving relatively during product transportation.
The preparation method of the backlight module in the embodiment of the disclosure can not only realize the accurate alignment of the light diffusion layer 20 and the light emitting substrate 10, but also has the advantages of simple alignment and assembly process of the light diffusion layer 20 and the light emitting substrate 10, easy operation, improved product quality and reduced cost.
Fig. 7 is a schematic structural diagram of a display device according to an embodiment of the disclosure. The embodiment of the present disclosure further provides a display device, the display device includes the backlight module in any embodiment of the present disclosure, and further includes a display panel 30, as shown in fig. 7, the display panel 30 is located on a side of the light diffusion layer 20 away from the light-emitting substrate 10. The backlight module provides backlight for the display panel 30.
Exemplarily, as shown in fig. 7, the display device may further include an optical film 40 disposed between the backlight module and the display panel 30.
Illustratively, the display panel 30 may be a liquid crystal panel, and the display device may be a liquid crystal display device.
The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
In the description of the present specification, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, are used based on the orientations and positional relationships shown in the drawings, and are used merely for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present disclosure.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.
In the present disclosure, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integral with; the connection can be mechanical connection, electrical connection or communication; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The above disclosure provides many different embodiments or examples for implementing different features of the disclosure. Specific example components and arrangements are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present disclosure. Moreover, the present disclosure may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed.
While the present disclosure has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (12)
1. A backlight module, comprising:
a light emitting substrate including a substrate and a plurality of light emitting elements disposed on the substrate;
the light diffusion layer is located the light-emitting side of luminescent substrate, the light diffusion layer includes the substrate body and sets up the orientation of substrate body a plurality of recesses of luminescent substrate one side are a plurality of the recess is with a plurality of light emitting component one-to-one, light emitting component embedding in the recess.
2. The backlight module according to claim 1, wherein the light diffusion layer further comprises a light-transmitting layer disposed on a side of the base material body facing the light-emitting substrate, and the groove is disposed on a surface of the light-transmitting layer facing the light-emitting substrate.
3. The backlight module according to claim 1, wherein the light-emitting substrate further comprises a plurality of protection protrusions disposed on a surface of the substrate facing the light-emitting elements, the protection protrusions are in one-to-one correspondence with the light-emitting elements, the protection protrusions cover the light-emitting elements, and the protection protrusions are embedded in the grooves.
4. The backlight module according to claim 3, wherein the surface shape of the groove matches with the surface shape of the protection protrusion, and the surface of the protection protrusion is attached to the surface of the groove.
5. A backlight module according to claim 4, wherein the surface of the groove comprises a second flat portion at the bottom of the groove and a second side portion connecting between an edge of the second flat portion and an edge of the opening of the groove, the second side portion being an inclined plane or a concave curved surface.
6. The backlight module according to claim 5,
the diameter range of the flat part is 0.2 mm-0.3 mm; and/or the presence of a gas in the gas,
the diameter of the opening of the groove is larger than 2.5mm.
7. A backlight module according to claim 1, wherein the depth of the grooves is less than 0.5mm.
8. The backlight module as claimed in claim 2, wherein the substrate body is made of glass, and the transparent layer is a transparent adhesive layer.
9. The backlight module according to claim 2, wherein the light diffusion layer further comprises a reflective layer, the reflective layer comprises a plurality of reflective patterns, the plurality of reflective patterns correspond to the plurality of grooves one to one, and the reflective layer is disposed on a side surface of the base material body facing the light-emitting substrate or on a side surface of the base material body facing away from the light-emitting substrate.
10. The backlight module according to claim 1, wherein the light diffusion layer further comprises a light uniformizing layer, and the light uniformizing layer is located on a side of the substrate body facing away from the light-emitting substrate.
11. A method for manufacturing a backlight module is characterized by comprising the following steps: preparing a light-emitting substrate and a light diffusion layer; aligning and assembling the light-emitting substrate and the light diffusion layer;
the light-emitting substrate comprises a substrate base plate, a plurality of light-emitting elements arranged on the substrate base plate, and a plurality of protection bulges arranged on one side, facing the light-emitting elements, of the base material body, wherein the protection bulges correspond to the light-emitting elements one by one, and the protection bulges cover the light-emitting elements;
the preparation of the light diffusion layer comprises:
forming a light-transmitting layer on one side of the substrate body;
forming a plurality of grooves on the surface of one side of the euphotic layer, which is far away from the substrate body;
the light-emitting substrate and the light diffusion layer are assembled in an alignment mode, and the method comprises the following steps:
disposing the light diffusion layer opposite to the light emitting substrate such that the plurality of grooves face the plurality of protective protrusions; and embedding the plurality of protection bulges into the plurality of grooves in a one-to-one correspondence manner.
12. A display device comprising the backlight module of any one of claims 1-10, and further comprising a display panel on a side of the light diffusion layer facing away from the light-emitting substrate.
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| CN115629496B (en) | 2024-05-17 |
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