CN115623673A

CN115623673A - Circuit board module and electronic equipment

Info

Publication number: CN115623673A
Application number: CN202110785591.8A
Authority: CN
Inventors: 吴庆; 樊会忠
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-07-12
Filing date: 2021-07-12
Publication date: 2023-01-17
Also published as: WO2023284375A1

Abstract

The application provides a circuit board module, including first circuit board and second circuit board, the interval is provided with two at least first connectors on the first circuit board, and the second circuit board is provided with the second connector, first connector and second connector one-to-one, and first circuit board and second circuit board realize electric connection through first connector and second connector, and the second circuit board is provided with deformation structure. The second circuit board can adjust the relative position between the first connector and the second connector by adjusting the deformation structure. When one first connector is butted with the second connector and the other first connector is staggered with the second connector, the first connector and the second connector can be relatively displaced through the deformation structure, and the originally staggered first connector and the second connector are aligned. That is, the deformation structure can enable the first connectors and the second connectors to be simultaneously butted. The application also provides an electronic device.

Description

Circuit board module and electronic equipment

Technical Field

The application relates to the field of circuit board connection, in particular to a circuit board module and electronic equipment.

Background

With the coming of times of high speed and large capacity, the connector is higher and higher, the size of the back plate is larger and larger, and the back plate has larger and larger requirements on high speed of plates and larger differences between low speed or power supply plates. Splitting the back plate is an effective solution for physical size or cost considerations when the back plate size is too large to exceed factory manufacturability or the PCB (Printed Circuit Board) Board cost of the back plate is too high. After the back plates are disassembled, more tolerances on the tolerance chain are in conflict with the high precision of the connector, so that the matching of connecting multiple back plates by one plate has risks.

Disclosure of Invention

The application provides a circuit board module and electronic equipment, a plurality of connectors of a plurality of circuit boards of being convenient for dock simultaneously.

A first aspect of an embodiment of the present application provides a circuit board module. The circuit board module comprises a first circuit board and a second circuit board. The first circuit board is provided with at least two first connectors at intervals, and the second circuit board is provided with a second connector. The first connectors correspond to the second connectors one to one, and the first circuit board is electrically connected with the second circuit board through the first connectors. The second circuit board is provided with a deformation structure, and the second circuit board can adjust the relative position between the first connector and the second connector by adjusting the deformation structure.

In the circuit board module, a plurality of first connectors of a first circuit board need to be simultaneously butted with a plurality of second connectors of a second circuit board. When one first connector is butted with the second connector and the other first connector is misaligned with the second connector, the deformation structure can cause the first connector and the second connector to be relatively displaced, so that the misaligned first connector and the second connector are aligned. That is, the deformation structure can enable the first connectors and the second connectors to be simultaneously butted.

Based on the first aspect, in a possible implementation manner, the second circuit board is provided with a first deformation groove recessed along a first direction, and the first direction is a direction perpendicular to the first circuit board. The second circuit board comprises a first part and a second part which are positioned on two sides of the first deformation groove, and a first deformation part which is connected with the first part and the second part, wherein the first deformation part forms the deformation structure. The first portion and the second portion are each provided with at least one of the second connectors. The first portion and the second portion are displaceable relative to the first deformation portion.

In the circuit board module, the second circuit board is provided with the first deformation groove, so that the first part and the second part are separated, and the first part and the second part can move relative to the first deformation part. When the distance between the second connector on the first part and the second connector on the second part is different from the distance between the two first connectors on the first circuit board, the second connector on the first part and the second connector on the second part can be relatively displaced through the relative displacement of the first part and the second part until the two second connectors can be simultaneously in butt joint with the two first connectors on the first circuit board.

Based on the first aspect, in a possible implementation manner, the second circuit board has a deformation region, and the deformation region is located at a joint of the first deformation portion and the first portion and/or a joint of the first deformation portion and the second portion. The deformation area is provided with a groove.

In this circuit board module, can make the edge of first deformation portion thinner through the deformation district that has the recess to be convenient for the displacement of first portion and/or the relative first deformation portion of second portion. And the internal stress in the second circuit board after the first part and/or the second part move relative to the first deformation part can be reduced.

Based on the first aspect, in a possible implementation manner, the first circuit board includes a first sub board, a second sub board and a connecting piece, the first sub board and the second sub board are fixedly connected through the connecting piece, and at least one first connector is arranged on each of the first sub board and the second sub board.

In the circuit board module, the first sub-board and the second sub-board are connected through the connecting piece, so that the first circuit board can be made into a plurality of smaller sub-boards, and the manufacturing difficulty of the first circuit board is reduced. In addition, the assembly flexibility of the first circuit board can be improved, namely, the damaged first sub-board or second sub-board can be partially replaced to maintain the normal work of the first circuit board, and the modularized first sub-board and second sub-board can be assembled according to actual conditions to realize required functions.

Based on the first aspect, in a possible implementation manner, the first board is provided with a first mounting hole, and the second board is provided with a second mounting hole. The connecting piece comprises a first plug, a second plug and a base body, wherein the first plug and the second plug are fixedly connected with the base body. The first plug is inserted into the first mounting hole, and the second plug is inserted into the second mounting hole.

In the circuit board module, the connecting piece is assembled with the first sub-board and the second sub-board in a plug mode, so that the first sub-board, the second sub-board and the connecting piece are connected more easily, and the first circuit board is convenient to assemble.

Based on the first aspect, in a possible implementation manner, the second circuit board includes a third sub board and a fourth sub board spaced in parallel along a second direction, and the second direction is a direction perpendicular to the third sub board. The third division plate is provided with a second deformation groove which is sunken along a second direction. The third division plate comprises a third part and a fourth part which are positioned on two sides of the second deformation groove, and a second deformation part which connects the third part and the fourth part, wherein the second deformation part forms the deformation structure. The third portion is provided with the second connector, and the fourth portion is provided with the third connector. The fourth sub-board is provided with a fourth connector. The third portion and the fourth portion are displaceable relative to the second deforming portion.

In the circuit board module, after the third sub board and the fourth sub board are respectively electrically connected with the first circuit board, the fourth part of the third sub board can displace relative to the fourth sub board, so that the third connector and the fourth connector can be aligned. Correspondingly, after the third connector and the fourth connector are completely butted, the two second connectors of the second circuit board can be simultaneously butted with the first connector on the first circuit board through the relative displacement of the third part and the fourth part.

In a possible implementation manner based on the first aspect, the third board divider has a first mounting surface, the second deformation groove is disposed on the first mounting surface, and the second connector is disposed on the first mounting surface.

In the circuit board module, the second deformation groove is positioned on one surface on which the second connector is arranged. When the third portion and the fourth portion are relatively displaced, the internal stress concentration position in the third sub-plate, namely the position of the second deformation portion is far away from the second connector, and the internal stress is dispersed and then reaches the second connector, so that the influence on the second connector can be reduced.

Based on the first aspect, in a possible implementation manner, the fourth division plate is provided with a second deformation groove which is concave along the second direction. The third minute board is including being located fifth portion and the sixth portion of second deformation groove both sides, and connect the fifth portion with the third deformation portion of sixth portion, the third deformation portion with the second deformation portion forms jointly the deformation structure. The fifth part is provided with the second connector, and the sixth part is provided with the fourth connector. The fifth portion and the sixth portion are displaceable relative to the third deformed portion to enable the third connector of the third sub-board to be displaced relative to the fourth connector of the fourth sub-board.

In this circuit board module, all set up partial deformation structure in third minute board and the fourth minute board, when two first connectors cooperate with two second connectors simultaneously, can make the counterpoint of third connector and fourth connector easier.

Based on the first aspect, in a possible implementation manner, the second circuit board includes a carrier, and the second circuit board further includes a fifth sub board and a sixth sub board that are mounted on the carrier, and the fifth sub board is electrically connected to the sixth sub board. The deformation structure comprises a protruding part arranged on the carrier and a floating part arranged on the fifth sub-plate. The floating piece is internally provided with a jack, and the protruding piece is inserted into the jack. The floating member is a flexible material.

In this circuit board module, fifth minute board and sixth minute board pass through the carrier and connect in the second circuit board for the second circuit board can have the equipment flexibility, also can locally change the fifth minute board or the sixth minute board of damage and maintain the normal work of second circuit board, also can assemble modular fifth minute board and sixth minute board according to actual conditions and realize the function of demand. Through the floating piece deformation make fifth minute board can be relative displacement for the sixth minute board to make second connector on the fifth minute board and the second connector on the sixth minute board can relative displacement, therefore the dislocation when fifth minute board and sixth minute board assemble can subduct through the floating fit between protruding piece and the floating piece. When the second connector on the fifth board is mated with the corresponding first connector, the second connector on the sixth board can also be mated with the corresponding first connector.

Based on the first aspect, in a possible implementation manner, the fifth dividing plate is provided with a fixing hole, and the floating piece is fixed in the fixing hole.

In this circuit board module, set up the fixed orifices on the fifth subplate and install the floating member, can make floating member and fifth subplate respectively to the installation corresponds the floating member of requirement on the fifth subplate. Different floating members can correspond to different dislocation effects.

In a possible implementation manner, based on the first aspect, the fixing hole includes a first hole section and a second hole section, and the second hole section forms a first stop surface toward an end surface of the first hole section. The float member is inserted into the first bore section with one end contacting the first stop surface.

In the circuit board module, the fifth sub-board is provided with the fixing hole for installing the floating piece, so that the floating piece and the fifth sub-board can be manufactured respectively, and the floating piece with the corresponding requirement is installed on the fifth sub-board. Different floating members can correspond to different dislocation effects.

Based on the first aspect, in a possible implementation manner, the protruding part includes a rod part and a head part, one end of the rod part is fixedly connected with the carrier, and the other end of the rod part is fixedly connected with the head part. The side of the head part facing the carrier forms a second stop surface which can limit the floating piece to move towards the direction far away from the carrier.

In the circuit board module, the bulge piece can also limit the displacement of the fifth partial board and the carrier in the direction parallel to the rod part, so that the connection stability between the fifth partial board and the carrier is higher.

Based on the first aspect, in a possible implementation manner, the second circuit board further includes a flexible line, and the fifth sub board and the sixth sub board are electrically connected through the flexible line.

In the circuit board module, the flexible wire is connected with the fifth sub-board and the sixth sub-board, so that the internal stress during relative displacement between the fifth sub-board and the sixth sub-board can be reduced.

Based on the first aspect, in a possible implementation manner, the material of the floating member includes at least one of natural rubber, styrene butadiene rubber, nitrile butadiene rubber, isoprene rubber, and butyl rubber.

In the circuit board module, the natural rubber, the styrene butadiene rubber, the nitrile rubber, the isoprene rubber and the butyl rubber have better elasticity, so that after the protrusion piece is inserted into the insertion hole of the floating piece, when the protrusion piece has a tendency of moving relative to the floating piece, the floating piece is matched with the movement of the protrusion piece through the deformation of the floating piece.

A second aspect of the embodiments of the present application provides an electronic device, including the circuit board module provided in the first aspect.

In the electronic equipment, the deformation structure deforms based on the circuit board module to reduce possible tolerance of the first circuit board and the second circuit board. Such electronic devices may be servers, switches, and other devices that require backplane and daughter boards to be connected to each other.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board module in the prior art.

Fig. 2 is a schematic structural diagram of another circuit board module in the prior art.

Fig. 3 is a schematic structural diagram of another circuit board module in the prior art.

Fig. 4 is a schematic structural diagram of a circuit board module according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a circuit board module according to an embodiment of the present application, wherein two sides of the first deformation groove are dislocated.

Fig. 6 is a schematic structural diagram of a circuit board module according to an embodiment of the present application, wherein an opening of the first deformation groove is enlarged.

Fig. 7 is a schematic structural diagram of a circuit board module according to another embodiment of the present application.

Fig. 8 is a schematic structural diagram of a circuit board module according to another embodiment of the present application, in which an opening of the second deformation groove is expanded, and an opening of the third deformation groove is contracted.

Fig. 9 is a schematic structural diagram of a circuit board module according to another embodiment of the present application.

Fig. 10 is a schematic structural diagram of a circuit board module according to another embodiment of the present application, wherein a fifth board is displaced by a certain distance in a third direction relative to a sixth board.

Fig. 11a is a partial structural schematic view of a fifth partial plate according to another embodiment of the present application, in which a second hole segment is formed.

FIG. 11b is a partial cross-sectional view of a fifth subplate having a second hole segment formed therein according to another embodiment of the present application.

Fig. 11c is a schematic partial structural view of a fifth subplate according to another embodiment of the present application, in which a first hole section is formed on the fifth subplate.

FIG. 11d is a partial cross-sectional view of a fifth subplate having a first hole segment formed therein according to another embodiment of the present application.

FIG. 11e is a partial schematic structural view of a fifth subplate according to another embodiment of the present application, wherein the float is inserted into the securing hole.

FIG. 11f is a partial cross-sectional view of a fifth subplate according to another embodiment of the present application, with a float inserted into a securing hole.

Fig. 12 is a partial cross-sectional view of a circuit board module according to another embodiment of the present application.

Description of the main elements

Circuit board module 001,001'

First circuit board 100,100'

Second circuit board 200,200'

First small plate 110'

Second platelet 130'

Flexible wire 150,150'

First connector 101,101'

Second connector 201,201'

Connecting piece 170,170'

First mounting holes 111,111'

Second mounting holes 131,131'

Matrix 171,171'

First plug 173,173'

Second plug 175,175'

Third small plate 220'

Fourth platelet 240'

Carrier 250,250'

Slotted hole 223'

Connecting post 253'

First board 110

Second plate 130

First mating face 110a

Second mating face 130a

First deformation groove 206

First portion 203

Second portion 205

First deformation part 207

Groove 209

Third fencing board 210

Fourth minute plate 230

Third connector 202

Fourth connector 204

Second deformation groove 211

Third part 213

Fourth portion 215

Second deformation part 217

Third deforming groove 231

Fifth part 233

Sixth part 235

Third deforming part 237

Fifth subplate 220

Sixth minute plate 240

Fixed surface 251

Protruding piece 253

Float member 221

Socket 221a

Fixing hole 223

First bore section 2231

Second bore section 2233

Rod portion 2531

Head 2533

A first direction X

Second direction Y

Third direction Z

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The following description is given by way of specific embodiments and other advantages and benefits of the present application will become apparent to those skilled in the art from the disclosure herein. While the description of the present application will be presented in conjunction with the preferred embodiments, it is not intended that the features of this application be limited to that embodiment. On the contrary, the application of the present disclosure with reference to the embodiments is intended to cover alternatives or modifications as may be extended based on the claims of the present disclosure. In the following description, numerous specific details are included to provide a thorough understanding of the present application. The present application may be practiced without these particulars. Moreover, some of the specific details have been omitted from the description in order to avoid obscuring, or obscuring, the focus of the present application. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Hereinafter, the terms "first", "second", and the like, if used, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to imply that the number of indicated technical features is significant. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified. "Upper," "lower," "left," "right," and like directional terms are defined relative to the schematically-disposed orientations of elements in the figures, and it is to be understood that the directional terms are relative terms, which are used for descriptive and clarity purposes and are intended to correspond to changes in the orientation in which the elements in the figures are disposed.

In the present application, the term "connected", if used, is to be understood broadly, unless otherwise explicitly stated or limited, for example "connected" may be a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings, the drawings showing the partial structure of the device are not necessarily to scale, and are merely exemplary, which should not limit the scope of the invention.

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

Fig. 1 shows a schematic structural diagram of a circuit board module 001' provided in the prior art.

As shown in fig. 1, such a circuit board module 001' includes a first circuit board 100' and a second circuit board 200'. The first circuit board 100 'is a backplane, and the second circuit board 200' is a daughter board. In order to facilitate the manufacture of the large-sized first circuit board 100', the first circuit board 100' is assembled after being divided into a plurality of small boards. Such a first circuit board 100' includes a first small board 110', a second small board 130', and a flexible wire 150', and the first small board 110' and the second small board 130' are connected by the flexible wire 150'. Information can be transferred between the first platelet 110' and the second platelet 130' via the flexible wire 150'. The first small board 110 'of the first circuit board 100' is provided with a first connector 101', the second circuit board 200' is provided with a second connector 201 'corresponding to the first connector 101', and after the first connector 101 'is butted with the second connector 201', the first circuit board 100 'and the second circuit board 200' are electrically connected.

The signal of the second small board 130' needs to be transmitted to the first small board 110' through the flexible wire 150', and then transmitted to the second circuit board 200' through the first small board 110 '. Resulting in a long signal transmission path from the second small board 130 'to the second circuit board 200' and a large signal loss. In addition, the signal transmission between the first circuit board 100 'and the second circuit board 200' is completed through the first small board 110', resulting in high density and high cost of electronic components on the first small board 110'. In addition, the positions of the first small board 110 'and the second small board 130' need to be additionally equipped for relative fixing of the positions, and the additional devices occupy a large amount of space, so that the actual use space of the first circuit board 100 'and the second circuit board 200' is reduced, the integration level of the circuit board module 001 'is reduced, and the overall cost of the circuit board module 001' is increased.

Fig. 2 shows a schematic structural diagram of another circuit board module 001' provided in the prior art.

As shown in fig. 2, such a circuit board module 001' includes a first circuit board 100' and a second circuit board 200'. The first circuit board 100 'is a backplane, and the second circuit board 200' is a daughter board. In order to facilitate the manufacture of the large-sized first circuit board 100', the first circuit board 100' is assembled after being divided into a plurality of small boards. The first circuit board 100 'includes a first small board 110', a second small board 130', and a connector 170', and the first small board 110 'and the second small board 130' are connected by the connector 170. A first mounting hole 111 'is formed at an edge of the first small plate 110' facing the second small plate 130', and a second mounting hole 131' is formed at an edge of the second small plate 130 'facing the first small plate 110'. The connector 170' includes a base 171', a first spigot 173' and a second spigot 175', the first spigot 173' and the second spigot 175' being fixedly attached to the same side of the base 171 '. The first plug 173' is inserted into the first mounting hole 111' and the second plug 175' is inserted into the second mounting hole 131', so that the first small plate 110' and the second small plate 130' are positionally fixed by the connector 170 '. One first connector 101' is provided on each of the first small board 110' and the second small board 130', and two corresponding second connectors 201' are provided on the second circuit board 200'. The first connector 101 'on the first platelet 110' is mated with one of the second connectors 201', and the first connector 101' on the second platelet 130 'is mated with the other second connector 201'.

In the circuit board module 001', the first small board 110' and the second small board 130 'are connected by the rigid connecting member 170', and when any one of the first small board 110', the second small board 130', the connecting member 170 'and the second circuit board 200' has a machining tolerance, a distance between the two first connectors 101 'may be different from a distance between the two second connectors 201', and it is difficult for the two first connectors 101 'to be simultaneously mated with the two second connectors 201'.

Fig. 3 shows a schematic structural diagram of another circuit board module 001' provided in the prior art.

As shown in fig. 3, such a circuit board module 001' includes a first circuit board 100' and a second circuit board 200'. The first circuit board 100 'is a backplane, and the second circuit board 200' is a daughter board. In order to facilitate the manufacture of the large-sized first circuit board 100 'and the large-sized second circuit board 200', the first circuit board 100 'and the second circuit board 200' are assembled after being split into a plurality of small boards. Such a first circuit board 100' comprises a first small board 110' and a second small board 130', and a second circuit board 200' comprises a third small board 220', a fourth small board 240' and a flexible wire 150'. Wherein, the third small board 220' and the fourth small board 240' are connected by a flexible wire 150'. In order to maintain the relative positions of the third small plate 220 'and the fourth small plate 240', the second circuit board 200 'further includes a carrier 250', the carrier 250 'has a fixing surface 251', the third small plate 220 'and the fourth small plate 240' are both disposed parallel to the carrier 250', and the third small plate 220' and the fourth small plate 240 'are both mounted on the fixing surface 251'. The third small plate 220' is provided with an oblong hole 223', the carrier 250' is provided with a connecting column 253', and the connecting column 253' can slide along the inner wall of the oblong hole 223' after being inserted into the oblong hole 223 '. The oblong hole 223' has a length direction with a larger size, and the length direction is a direction in which the third small plate 220' is close to or away from the fourth small plate 240 '. The connecting column 253 'can move in the long circular hole 223' along the length direction, so that the third small plate 220 'and the fourth small plate 240' are relatively close to or far away from each other.

A first connector 101 'is arranged on each of the first platelet 110' and the second platelet 130', and a second connector 201' is arranged on each of the third platelet 220 'and the fourth platelet 240'. The first connector 101 'on the first platelet 110' mates with the second connector 201 'on the third platelet 220', and the first connector 101 'on the second platelet 130' mates with the second connector 201 'on the fourth platelet 240'. Due to the arrangement of the oblong holes 223 'and the connecting columns 253', the third small plate 220 'can move relative to the fourth small plate 240', so that the distance between the two second connectors 201 'can be adjusted to adapt to the distance between the two first connectors 101'.

When the length direction of the circuit board module 001 'has a vertical component, that is, the third small board 220' is located above the fourth small board 240 'or the third small board 220' is located above the fourth small board 240', gravity may affect the movement of the third small board 220' relative to the carrier 250', so that the third small board 220 is easily shifted relative to the fourth small board 240', and the difficulty of docking is increased. Moreover, due to the unstable connection between the third small board 220' and the carrier 250', in a transportation scenario or when encountering vibration, the third small board 220' may be caused to move, so that the second connector 201' on the third small board 220' is loosened from the first connector 101' on the first circuit board 100', and the first connector 101' or the second connector 201' is even damaged.

Fig. 4 shows a schematic structural diagram of a circuit board module 001 provided by the present application.

As shown in fig. 4, the circuit board module 001 includes a first circuit board 100 and a second circuit board 200. The first circuit board 100 is a backplane, and the second circuit board 200 is a daughter board. The first circuit board 100 includes a first sub-board 110, a second sub-board 130, and a connection member 170. The first sub-board 110 and the second sub-board 130 are manufactured separately, so that the size of a single circuit board can be reduced, and the manufacturing difficulty of the circuit board can be reduced.

The connection member 170 connects the first and second divided

plates

110 and 130, respectively, such that the first and second divided

plates

110 and 130 are relatively fixed. Optionally, the first sub-plate 110 and the second sub-plate 130 are disposed in parallel, the first sub-plate 110 has a first mating surface 110a, the second sub-plate 130 has a second mating surface 130a, and when the connecting member 170 connects the first sub-plate 110 and the second sub-plate 130, the first mating surface 110a and the second mating surface 130a are substantially coplanar. A first mounting hole 111 is formed at one side of the first sub plate 110 close to the second sub plate 130, and a second mounting hole 131 is formed at one side of the second sub plate 130 close to the first sub plate 110. The connector 170 includes a base 171, a first plug 173, and a second plug 175, which are integrally formed. The first plug 173 corresponds to the first mounting hole 111, and the second plug 175 corresponds to the second mounting hole 131. When the connector 170 is coupled to the first and second divided

plates

110 and 130, the first plug 173 is inserted into the first mounting hole 111 such that the first divided plate 110 is coupled to the connector 170, and the second plug 175 is inserted into the second mounting hole 131 such that the second divided plate 130 is coupled to the connector 170. Alternatively, the connecting member 170 is made of a rigid material such as phenolic plastic or rigid polyurethane plastic. After the connection member 170 connects the first and second divided

plates

110 and 130, the relative position between the first and second divided

plates

110 and 130 is fixed. The connector 170 may be selected according to actual requirements, and the relative positions of the first plug 173 and the second plug 175 in different types of connectors 170 are different. The fixed distance between the first sub plate 110 and the second sub plate 130 can be adapted by selecting different types of connectors 170.

The first board 110 has a first connector 101 provided on a first mating surface 110a, and the second board 130 has the first connector 101 provided on a second mating surface 130 a.

The second circuit board 200 is substantially perpendicular to the first mating surface 110a. The second circuit board 200 is provided with a first deformation groove 206, and the first deformation groove 206 extends along a first direction X, which is a direction perpendicular to the first circuit board 100. Specifically, the first deformation groove 206 extends from one end of the second circuit board 200 close to the first circuit board 100 to a direction away from the first circuit board 100, and the opening of the first deformation groove 206 faces the first circuit board 100. The board body of the second circuit board 200 is divided into a first portion 203 and a second portion 205 by a first deforming groove 206, and the first portion 203 and the second portion 205 are connected by a first deforming portion 207. The first deformation portion 207 is a portion of the second circuit board 200 corresponding to the first deformation groove 206 in the first direction X, that is, the first portion 203, the first deformation portion 207 and the second portion 205 form three other sides of the first deformation groove 206 except for the opening.

The first deformation 207 forms a deformation structure so that the first portion 203 and the second portion 205 can move relative to each other. Specifically, the first portion 203 and the second portion 205 are separated at a position corresponding to the first deformation groove 206, so that the first portion 203 and the second portion 205 can move relatively to displace two sides of the first deformation groove 206, and the opening of the first deformation groove 206 can also move relatively to enlarge or reduce. A second connector 201 is provided on the side of the first portion 203 facing the first circuit board 100, and a second connector 201 is also provided on the side of the second portion 205 facing the first circuit board 100. By the relative movement of the first and

second portions

203, 205, the second connectors 201 on the first and

second portions

203, 205 can simultaneously align the two first connectors 101 on the first circuit board 100.

The first connector 101 and the second connector 201 are butted to realize the electrical connection between the first circuit board 100 and the second circuit board 200. After the first circuit board 100 and the second circuit board 200 are electrically connected, data transmission can be performed between the first circuit board 100 and the second circuit board. That is, data transmitted from the first circuit board 100 may be transmitted to the second circuit board through the first connector 101 and the second connector 201, and data transmitted from the second circuit board 200 may be transmitted to the first circuit board through the second connector 201 and the first connector 101. The electrical connection between the first circuit board 100 and the second circuit board 200 can also realize the power supply concentration between the first circuit board 100 and the second circuit board 200. Optionally, after the power source is connected to the first circuit board 100, the power source can supply power to the second circuit board 200 through the first circuit board 100.

Fig. 5 shows a schematic structural diagram of a circuit board module 001 provided by the present application, wherein the first portion 203 and the second portion 205 move relatively to cause two sides of the first deformation portion 207 to be dislocated.

When the first portion 203 and the second portion 205 are in the initial state without being subjected to an external force, a direction perpendicular to the first portion 203 is a second direction Y. As shown in fig. 6, the relative movement of the first portion 203 and the second portion 205 causes the two sides of the first deformation groove 206 to be displaced, i.e. the first portion 203 moves relative to the second portion 205 along the second direction Y, and the first deformation portion 207 and the adjacent region of the first deformation portion 207 are distorted. When the two first connectors 101 on the first and second divided

plates

110 and 130 have a tolerance in the second direction Y, the tolerance may be absorbed by the relative movement of the first and

second portions

203 and 205 in the second direction Y.

Fig. 6 shows a schematic structural diagram of a circuit board module 001 provided by the present application, wherein the first portion 203 and the second portion 205 move relatively to enlarge the opening of the first deformation slot 206.

While the direction perpendicular to the first direction X and the second direction Y is the third direction Z. As shown in fig. 7, the relative movement of the first portion 203 and the second portion 205 causes the opening of the first deformation groove 206 to expand or contract, that is, the part of the first portion 203 moves in the third direction Z relative to the part of the second portion 205, and the end of the first deformation portion 207 facing the first deformation groove 206 and the end facing away from the first deformation groove 206 have opposite tensile and compression states. When the first portion 203 and the second portion 205 move relatively such that the opening of the first deformation groove 206 is enlarged, the first deformation portion 207 is stretched toward one end of the first deformation groove 206, and the end of the first deformation portion 207 that faces away from the first deformation groove 206 is compressed. When the first portion 203 and the second portion 205 move relative to each other so that the opening of the first deformation groove 206 is reduced, the first deformation portion 207 is compressed toward one end of the first deformation groove 206, and the first deformation portion 207 is stretched away from one end of the first deformation groove 206. When the two first connectors 101 on the first and second

partial plates

110 and 130 have a tolerance in the third direction Z, the tolerance can be absorbed by relative movement of a part of the first portion 203 and a part of the second portion 205 in the second direction Y.

A deformation region is formed at a connection position of the first portion 203 and the first deformation portion 207 and a connection position of the second portion 205 and the first deformation portion 207. Relative movement of the first portion 203 and the second portion 205 needs to be achieved by means of deformation of the first deformation portion 207, and the first deformation portion 207 can be deformed more easily by setting features in the deformation region, so that relative movement of the first portion 203 and the second portion 205 can be achieved more easily. Alternatively, the groove 209 may be formed by milling in the deformation region, and the groove 209 is recessed from the surface of the second circuit board 200 along the second direction Y. The groove 209 makes the size of the deformation zone in the second direction Y smaller than the size of the adjacent other areas in the second direction Y, so that the deformation zone is more easily deformed, thereby making it easier for the first portion 203 and the second portion 205 to perform relative movement.

It can be understood that the groove 209 may also be recessed from the surface of the second circuit board 200 along a direction oblique to the second direction Y, so that the size of the deformation region in the second direction Y becomes smaller, that is, the deformation region becomes thinner, thereby making the deformation region easier to deform.

It is understood that the first deformation groove 206 may also be disposed on a side of the second circuit board 200 facing away from the first circuit board 100. The first deformation groove 206 extends from a side of the second circuit board 200 facing away from the first circuit board 100 to a side close to the first circuit board 100, and the opening of the first deformation groove 206 faces the side facing away from the first circuit board 100. The first deformation portion 207 is located on a side of the second circuit board 200 facing the first circuit board 100. In this form, the first portion 203 and the second portion 205 can also easily achieve relative movement to change the spacing between the two second connectors 201.

It can be understood that the deformation regions on the second circuit board 200 may not be disposed at the connection position between the first portion 203 and the first deformation portion 207 and the connection position between the second portion 205 and the first deformation portion 207 at the same time, and the deformation regions may be disposed at the connection position between the first portion 203 and the first deformation portion 207 or the connection position between the second portion 205 and the first deformation portion 207 separately. That is, the groove 209 is separately disposed at the connection position of the first portion 203 and the first deformation portion 207 or the connection position of the second portion 205 and the first deformation portion 207, so that the difficulty of the relative movement of the first portion 203 and the second portion 205 can be reduced.

It is understood that the second circuit board 200 with the first deformation groove 206 can also be adapted to the first circuit board 100 manufactured in one piece. That is, the first circuit board 100 does not include the first and second divided

boards

110 and 130, which are separately manufactured, and the first circuit board 100 is integrally molded to have higher strength.

It can be understood that, this circuit board module 001 may also be configured as: the first circuit board 100 is a daughter board, and the second circuit board 200 is a backplane.

This kind of circuit board module 001 can make two second connectors 201 on the second circuit board 200 move relatively through the deformation of the area where the first deformation portion 207 is located, thereby making two second connectors 201 able to mate with two first connectors 101 simultaneously. Moreover, the relative movement of the first portion 203 and the second portion 205 can be realized only by the deformation of the area where the first deformation portion 207 is located, and the internal stress of the second circuit board 200 caused by the deformation can be reduced. The stress when the first connector 101 and the second connector 201 are connected is reduced, and the first connector 101 and the second connector 201 are protected.

Fig. 7 shows a schematic structural diagram of a circuit board module 001 provided by the present application.

As shown in fig. 7, the circuit board module 001 includes a first circuit board 100 and a second circuit board 200. The first circuit board 100 is a backplane, and the second circuit board 200 is a daughter board. The second circuit board 200 includes a third divided plate 210 and a fourth divided plate 230 spaced apart along a second direction Y, the third divided plate 210 and the fourth divided plate 230 being arranged in parallel, the second direction Y being a direction perpendicular to the third divided plate 210.

The third board 210 is disposed substantially perpendicular to the first circuit board 100, two first connectors 101 are disposed on the first circuit board 100 at intervals, one second connector 201 is disposed on each of the third board 210 and the fourth board 230, and the two second connectors 201 correspond to different first connectors 101 on the first circuit board 100 respectively.

In addition to the electrical connection between the third board segment 210 and the first circuit board 100, the fourth board segment 230 is electrically connected to the first circuit board 100. The third board 210 and the fourth board 230 need to be electrically connected, and the third board 210 and the fourth board 230 directly communicate with each other, so that the communication efficiency can be improved. The third board 210 is provided with a third connector 202, the fourth board 230 is provided with a fourth connector 204, and the third connector 202 and the fourth connector 204 are butted to realize the electrical connection between the third board 210 and the fourth board 230.

In general, after two first connectors 101 correspond to two second connectors 201, the third connector 202 should be aligned with the fourth connector 204, so as to realize the mating of the third connector 202 and the fourth connector 204. When manufacturing tolerances occur in any of the first circuit board 100, the third board part 210, and the fourth board part 230, it may be difficult to align the third connector 202 with the fourth connector 204 after the two first connectors 101 correspond to the two second connectors 201.

The third plate 210 is formed with a second deformation groove 211 recessed along the second direction Y. Specifically, the second deformation groove 211 penetrates the third minute plate 210 in the third direction Z, which is a direction parallel to both the first circuit board 100 and the third minute plate 210. The plate body of the third division plate 210 is partitioned into a third portion 213 and a fourth portion 215 by the second deformation groove 211, and the third portion 213 and the fourth portion 215 are connected by a second deformation portion 217. The second deformation part 217 is a portion of the third split plate 210 corresponding to the second deformation groove 211 in the second direction Y, that is, the third, second and

fourth parts

213, 217 and 215 form the other three sides of the second deformation groove 211 excluding the opening.

The fourth sub plate 230 is formed with a third deformation groove 231 recessed along the second direction Y. Specifically, the third deforming groove 231 penetrates the fourth sub plate 230 in the third direction Z, which is a direction parallel to both the first circuit board 100 and the fourth sub plate 230. The plate body of the fourth sub-plate 230 is divided into a fifth portion 233 and a sixth portion 235 by the third deforming groove 231, and the fifth portion 233 and the sixth portion 235 are connected by a third deforming part 237. The third deforming part 237 is a part of the fourth partial plate 230 corresponding to the third deforming groove 231 in the second direction Y, that is, the fifth part 233, the third deforming part 237 and the fifth part 233 form three sides of the third deforming groove 231 except for the opening.

The second deformation part 217 and the third deformation part 237 form a deformation structure, so that after the third sub board 210 and the fourth sub board 230 are connected with the first circuit board 100, the third connector 202 and the fourth connector 204 can move relatively to realize the butt joint. Specifically, the third and

fourth portions

213 and 215 are separated at a position corresponding to the second deformation groove 211, so that the third and

fourth portions

213 and 215 can move relatively such that the opening of the second deformation groove 211 is expanded or reduced. The fifth and

sixth portions

233 and 235 are separated at a position corresponding to the third deformation groove 231 so that the fifth and

sixth portions

233 and 235 can move relatively to enlarge or reduce the opening of the third deformation groove 231. When the second connector 201 of the third board segment 210 and the second connector 201 of the fourth board segment 230 are both mated with the first circuit board 100, the third connector 202 and the fourth connector 204 can be brought into relative proximity by the relative movement of the third portion 213 and the fourth portion 215 and the relative movement of the fifth portion 233 and the sixth portion 235, thereby achieving the mating of the third connector 202 and the fourth connector 204.

Fig. 8 shows a schematic structural diagram of a circuit board module 001 provided by the present application, wherein the third portion 213 and the fourth portion 215 move relatively to enlarge the opening of the second deformation groove 211, and the fifth portion 233 and the sixth portion 235 move relatively to reduce the opening of the third deformation groove 231.

Specifically, the relative movement of the third and

fourth portions

213 and 215 causes the opening of the second deformation groove 211 to expand or contract, i.e., the portion of the third portion 213 moves in the second direction Y relative to the portion of the fourth portion 215, and the end of the second deformation portion 217 facing the second deformation groove 211 and the end facing away from the second deformation groove 211 have opposite tension-compression states. Referring to fig. 8, when the third and

fourth portions

213 and 215 are relatively moved such that the opening of the second deformation groove 211 is widened, the second deformation portion 217 is stretched toward one end of the second deformation groove 211, and the second deformation portion 217 is compressed away from one end of the second deformation groove 211. When the opening of the second deformation groove 211 is reduced by the relative movement of the third and

fourth portions

213 and 215, the second deformation portion 217 is compressed toward one end of the second deformation groove 211, and the second deformation portion 217 is stretched away from one end of the second deformation groove 211. When the two first connectors 101 on the first circuit board 100 have a tolerance in the second direction Y, the tolerance can be reduced by the deformation of the second deformation portion 217 when the second circuit board 200 is mated with the first circuit board 100 after the third connector 202 and the fourth connector 204 are mated.

Correspondingly, the relative movement of the fifth portion 233 and the sixth portion 235 causes the opening of the third deformation groove 231 to expand or contract, i.e. the part of the fifth portion 233 moves in the second direction Y relative to the part of the sixth portion 235, and the end of the third deformation portion 237 facing the third deformation groove 231 and the end facing away from the third deformation groove 231 have opposite tensile and compression states. When the fifth and

sixth portions

233 and 235 move relatively such that the opening of the third deformation groove 231 is expanded, the third deformation portion 237 is stretched toward one end of the third deformation groove 231, and one end of the third deformation portion 237 facing away from the third deformation groove 231 is compressed. When the openings of the third deformation groove 231 are reduced by the relative movement of the fifth and

sixth portions

233 and 235, the third deformation portion 237 is compressed toward one end of the third deformation groove 231, and one end of the third deformation portion 237 opposite to the third deformation groove 231 is stretched. The second circuit board 200, which is completed by the mating of the third connector 202 and the fourth connector 204, is mated with the first circuit board 100, and when the two first connectors 101 on the first circuit board 100 have a tolerance in the second direction Y, the tolerance can be reduced by the deformation of the third deformation portion 237.

When the size of the second deforming groove 211 in the third direction Z is too large, the relative movement of the third portion 213 and the fourth portion 215 in the third direction Z may be relatively difficult, but the relative displacement may still be performed within a small range, so that the third connector 202 has a certain displacement amount in the third direction Z with respect to the second connector 201. When the size of the third deforming groove 231 in the third direction Z is too large, the relative movement of the fifth and

sixth parts

233 and 235 in the third direction Z may be relatively difficult, but still may be relatively displaced within a small range, so that the fourth connector 204 has a certain displacement amount in the third direction Z relative to the second connector 201. Therefore, when the third connector 202 and the fourth connector 204 are not greatly displaced in the third direction Z, the third connector 202 and the fourth connector 204 can be mated by the deformation of the second deforming part 217 and the third deforming part 237.

The third partial plate 210 has a first mounting surface, which is a surface of the third partial plate 210 facing away from the fourth partial plate 230. When the second deformation portion 217 is deformed to realize the relative displacement of the third portion 213 and the fourth portion 215, the internal stress of the third division plate 210 is concentrated at the position of the second deformation portion 217, and the second deformation portion 217 is located on the third division plate 210 at the side opposite to the first mounting surface, so that the area where the internal stress is calculated is far away from the second connector 201, and the influence of the internal stress on the second connector 201 can be reduced.

On the opposite side, the fourth partial plate 230 has a second mounting surface, which is a surface of the fourth partial plate 230 facing the third partial plate 210. The opening of the third deforming groove 231 is located on the second mounting surface, the second connector 201 on the fourth sub-plate 230 is also disposed on the second mounting surface, when the third deforming portion 237 is deformed to realize the relative displacement of the fifth portion 233 and the sixth portion 235, the internal stress of the fourth sub-plate 230 is concentrated at the position of the third deforming portion 237, and the third deforming portion 237 is located on the surface of the fourth sub-plate 230 opposite to the second mounting surface, so that the area for calculating the internal stress is far away from the second connector 201, and the influence of the internal stress on the second connector 201 can be reduced.

It is understood that the first mounting surface may also be a surface of the third sub-plate 210 facing the fourth sub-plate 230. The second mounting surface may also be a surface of the fourth subpanel 230 facing away from the third subpanel 210.

It can be understood that the circuit board module 001 may also be configured as: the third division plate 210 is provided with the second deformation groove 211, and the fourth division plate 230 is not provided with the third deformation groove 231; alternatively, third minute plate 210 is not provided with second deformation groove 211, and fourth minute plate 230 is provided with third deformation groove 231. Only one of the third and fourth

partial plates

210 and 230 needs to be deformable.

It can be understood that the circuit board module 001 may also be configured as: the first circuit board 100 is a daughter board, and the second circuit board 200 is a backplane.

The circuit board module 001 can make the third connector 202 and the second connector 201 on the third sub-board 210 move relatively through the deformation of the area where the second deformation portion 217 is located, and make the fourth connector 204 and the second connector 201 on the fourth sub-board 230 move relatively through the deformation of the area where the third deformation portion 237 is located, so that when two second connectors 201 are simultaneously butted with two first connectors 101, the third connector 202 can be butted with the fourth connector 204.

Fig. 9 shows a schematic structural diagram of a circuit board module 001 provided in the present application.

As shown in fig. 9, such a circuit board module 001 includes a first circuit board 100 and a second circuit board 200. The first circuit board 100 is a backplane, and the second circuit board 200 is a daughter board. The second circuit board 200 includes a carrier 250, a fifth divided board 220, a sixth divided board 240, and a flexible wire 150. The carrier 250 has a fixing surface 251, the fifth board 220 and the sixth board 240 are disposed on the fixing surface 251, and the fifth board 220 and the sixth board 240 are electrically connected by the flexible wire 150. Fifth minute board 220 and sixth minute board 240 all are on a parallel with stationary plane 251 setting, and wherein sixth minute board 240 and carrier 250 fixed connection, fifth minute board 220 is connected with carrier 250 through deformation structure. The first circuit board 100 is provided with two first connectors 101 at intervals, the fifth board 220 and the sixth board 240 are respectively provided with one second connector 201, and the two first connectors 101 are simultaneously butted with the opposite second connectors 201.

The deformation structure comprises a protruding piece 253 and a floating piece 221, wherein the protruding piece 253 is fixedly arranged on the fixing surface 251, and the floating piece 221 is arranged on the fifth dividing plate 220. The floating member 221 is provided with an insertion hole 221a, and the carrier 250 can restrict the movement of the fifth division plate 220 on the fixing surface 251 when the protrusion 253 is inserted into the insertion hole 221a of the floating member 221. And the floating piece 221 can deform to deform the insertion hole 221a, so that the fifth board 220 can displace in the deformation range of the floating piece 221 relative to the protruding piece 253, that is, the fifth board 220 can displace in the deformation range of the floating piece 221 relative to the carrier 250.

Specifically, the floating member 221 is made of a flexible material, the fifth division plate 220 is provided with a fixing hole 223, and the floating member 221 is fixedly arranged in the fixing hole 223. When the floating member 221 is not deformed, the insertion hole 221a corresponds to a predetermined standard position on the fifth subpanel 220. When the insertion hole 221a in the standard position is mated with the protrusion 253, the second connector 201 on the fifth board segment 220 and the second connector 201 on the sixth board segment 240 have a predetermined pitch, which corresponds to the pitch of the two first connectors 101 on the first circuit board 100. However, in actual manufacturing, there may be tolerance, which results in the floating member 221 not being deformed, and when the protruding member 253 is inserted into the insertion hole 221a, the spacing between the two second connectors 201 is not equal to the spacing between the two first connectors 101. At this time, the insertion hole 221a may be deformed by the deformation of the floating member 221, so that the fifth sub plate 220 is displaced relative to the sixth sub plate 240 to adjust the distance between the two second connectors 201.

The flexible material used by the floating member 221 needs to have certain elasticity, so that when the protruding member 253 moves to various positions relative to the fifth division plate 220, the protruding member 253 can be wrapped well by the elastic deformation of the floating member 221. The floating member 221 may be made of at least one of natural rubber, styrene butadiene rubber, nitrile rubber, isoprene rubber, and butyl rubber, or may be made of other elastic materials such as latex.

Fig. 10 shows a schematic structural diagram of a circuit board module 001 provided in the present application, wherein the fifth board 220 is displaced from the sixth board 240 in a third direction Z, and the third direction Z is parallel to the fixing surface 251 and the first circuit board 100.

Referring to fig. 9 and 10, the fixing hole 223 is an oblong hole having a width dimension, and the width dimension is a dimension along a first direction X, and the first direction X is perpendicular to the first circuit board 100. The width dimension of the fixing hole 223 is small, and after the floating member 221 is disposed in the fixing hole 223, the amount of elastic compression of the floating member 221 in the first direction X is small, so that the protruding member 253 inserted into the insertion hole 221a is difficult to move in the first direction X relative to the fifth division plate 220. The fixing hole 223 has a length dimension, which is a dimension in the third direction Z. The length dimension of the fixing hole 223 is large, and after the floating member 221 is disposed in the fixing hole 223, the floating member 221 is elastically compressed by a large amount in the third direction Z, so that the protrusion 253 inserted into the insertion hole 221a can move in the third direction Z to a large extent with respect to the fifth division plate 220.

It is understood that the fixing hole 223 may be a hole having other shape instead of the long round hole. The direction perpendicular to the fixing surface 251 is the second direction Y, and the fixing hole 223 may have a square shape, a circular shape, an oval shape, a triangular shape, and the like on a projection plane perpendicular to the second direction Y. On a projection plane perpendicular to the second direction Y, the insertion hole 221a may be located in the fixing hole 223.

Fig. 11a, 11b, 11c, 11d, 11e and 11f are partial schematic diagrams illustrating a circuit board module 001 provided by the present application. Fig. 11a, 11c and 11e are partial views of the fastening hole 223 formed in different steps. Fig. 11b, 11d and 11f are partial sectional views corresponding to different steps in the molding of the fixing hole 223, respectively.

The fastening bores 223 include, from the side remote from the carrier 250 to the side close to the carrier 250, a first bore section 2231 and a second bore section 2233, the end face of the second bore section 2233 facing away from the carrier 250 forming a first stop face. The floating member 221 has an undeformed shape corresponding to the inner wall of the first bore section 2231 such that, when the floating member 221 is inserted into the first bore section 2231, an end of the floating member 221 adjacent the carrier 250 contacts the first stop surface. The first stop surface may limit further movement of the float member 221 in the direction of the carrier 250.

As shown in fig. 11a and 11b, a smaller-sized hole is first formed in the fifth subpanel 220, and a portion of the hole adjacent to the carrier 250 forms a second hole segment 2233. As shown in fig. 11c and 11d, a larger-sized hole is further provided on the basis of the smaller-sized hole, and the larger-sized hole does not penetrate through the fifth partial plate 220, so that the portion of the hole facing away from the carrier 250 forms the first hole section 2231, and the portion of the second hole section 2233 facing away from the carrier 250 forms the first stop surface. As shown in fig. 11e and 11f, the float member 221 is inserted into the first bore section 2231 until the end of the float member 221 contacts the first stop surface. The insertion hole 221a of the float member 221 is located substantially at the center of the first hole section 2231.

It is to be understood that the securing aperture 223 may not include the first aperture section 2231 and the second aperture section 2233. After the floating member 221 is inserted into the fixing hole 223, the outer circumference of the floating member 221 may be fixed to the inner wall of the fixing hole 223 by means of glue or the like.

Fig. 12 shows a partial cross-sectional view of a circuit board module 001 provided by the present application.

The projection 253 includes a stem portion 2531 and a head portion 2533. When the protrusion 253 is engaged with the floating member 221, the head portion 2533 of the protrusion 253 is located on a side of the floating member 221 facing away from the carrier 250, and the stem portion 2531 of the protrusion 253 connects the head portion 2533 with the carrier 250. The side of the head portion 2533 facing the carrier 250 forms a second stop surface, and a spacing space is formed between the second stop surface and the fixing surface 251, and the floating member 221 is located in the spacing space. That is, the second stop surface of the head portion 2533 can limit the displacement of the floating member 221 further away from the carrier 250, so as to reduce the probability that the floating member 221 is driven by the fifth sub-plate 220 to disengage from the carrier 250.

The fixing of the protruding member 253 to the carrier 250 may also be performed by: the carrier 250 is provided with threaded holes through which bolts are screwed to the carrier 250, the bolts forming bosses 253. The bolt shank forms the shank portion 2531 of the projection 253 and the bolt head forms the head portion 2533 of the projection 253.

When the fifth sub-plate 220 is moved relative to the carrier 250 by the cooperation of the floating members 221 and the protruding members 253, the flexible wires 150 between the fifth sub-plate 220 and the sixth sub-plate 240 are deformed in accordance with the displacement, so as to maintain the electrical connection between the fifth sub-plate 220 and the sixth sub-plate 240.

The first circuit board 100 includes the first sub board 110 and the second sub board 130, and the first sub board 110 and the second sub board 130 are manufactured separately, so that the size of a single circuit board can be reduced, thereby reducing the manufacturing difficulty of the first circuit board 100. The first board segment 110 and the second board segment 130 are spaced apart from each other in the third direction Z, and one first connector 101 is disposed on each of the first board segment 110 and the second board segment 130. The first connector 101 of the first divided plate 110 is mated with the second connector 201 of the fifth divided plate 220, and the first connector 101 of the second divided plate 130 is mated with the second connector 201 of the sixth divided plate 240.

It is understood that the first circuit board 100 may also be a one-piece manufactured circuit board. That is, the first circuit board 100 does not include the first and second divided

plates

110 and 130 that are separately manufactured, and the first circuit board 100 is integrally molded to have higher strength.

Such a circuit board module 001 can enable the second connectors 201 on the fifth sub board 220 and the sixth sub board 240 to move relatively by the engagement of the protruding members 253 with the floating members 221, so that the two second connectors 201 can be simultaneously mated with the two first connectors 101 on the first circuit board 100.

The present application further provides an electronic device (not shown in the drawings), which uses any one of the circuit board modules 001 described above.

The electronic device is a server, a backplane of the server is the first circuit board 100, and expansion cards such as a network card, a SCSI (Small Computer System Interface) control card, and the like are disposed on the backplane. These expansion cards are the second circuit board 200. In the server, accurate butt joint with the first circuit board 100 is realized through deformation of the deformation structure in the second circuit board 200, and the situation of difficult butt joint caused by manufacturing tolerance can be reduced.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the disclosure of the present application.

Claims

1. The utility model provides a circuit board module, includes first circuit board and second circuit board, the interval is provided with two at least first connectors on the first circuit board, the second circuit board is provided with the second connector, first connector with second connector one-to-one, first circuit board with the second circuit board passes through first connector with electric connection, its characterized in that are realized to the second connector:

the second circuit board is provided with a deformation structure, and the second circuit board can adjust the relative position between the first connector and the second connector by adjusting the deformation structure.

2. The circuit board module as claimed in claim 1, wherein the second circuit board defines a first deformation groove recessed along a first direction, the first direction being perpendicular to the first circuit board;

the second circuit board comprises a first part, a second part and a first deformation part, wherein the first part and the second part are positioned on two sides of the first deformation groove, the first deformation part is connected with the first part and the second part, and the first deformation part forms the deformation structure;

at least one second connector is arranged on each of the first part and the second part;

the first portion and the second portion are displaceable relative to the first deformation portion.

3. The circuit board module of claim 2, wherein the second circuit board has a deformation region located at a connection of the first deformation portion and the first portion and/or a connection of the first deformation portion and the second portion;

the deformation area is provided with a groove.

4. The circuit board module of claim 1, wherein the first circuit board comprises a first board sub-assembly, a second board sub-assembly, and a connector;

the first board that divides with the second board that divides passes through connecting piece fixed connection, first board that divides with all be provided with at least one on the second board first connector.

5. The circuit board module of claim 4, wherein the first sub-board is provided with a first mounting hole, and the second sub-board is provided with a second mounting hole;

the connecting piece comprises a first plug, a second plug and a base body, and the first plug and the second plug are fixedly connected with the base body;

the first plug is inserted into the first mounting hole, and the second plug is inserted into the second mounting hole.

6. The circuit board module of claim 1, wherein the second circuit board includes a third board segment and a fourth board segment spaced in parallel along a second direction, the second direction being perpendicular to the third board segment;

the third batten is provided with a second deformation groove which is sunken along a second direction;

the third division plate comprises a third part and a fourth part which are positioned at two sides of the second deformation groove, and a second deformation part which connects the third part and the fourth part, wherein the second deformation part forms the deformation structure;

the third part is provided with the second connector, and the fourth part is provided with a third connector;

the fourth sub-board is provided with a fourth connector;

the third portion and the fourth portion are displaceable relative to the second deformed portion.

7. The circuit board module of claim 6, wherein the third board splitter has a first mounting surface, the second deformation groove is disposed on the first mounting surface, and the second connector is disposed on the first mounting surface.

8. The circuit board module of claim 1, wherein the second circuit board comprises a carrier, the second circuit board further comprising a fifth subplate and a sixth subplate mounted on the carrier, the fifth subplate and the sixth subplate being electrically connected;

the deformation structure comprises a protruding piece arranged on the carrier and a floating piece arranged on the fifth sub-plate;

the floating piece is internally provided with a jack, and the protruding piece is inserted into the jack;

the floating member is a flexible material.

9. The circuit board module of claim 8, wherein the fifth board is provided with fixing holes, and the floating members are fixed in the fixing holes.

10. The circuit board module of claim 9, wherein the securing hole includes a first hole section and a second hole section, the second hole section forming a first stop surface toward an end surface of the first hole section;

the float member is inserted into the first bore section with one end contacting the first stop surface.

11. The circuit board module of claim 8, wherein the protrusion comprises a shaft and a head, the shaft is fixedly connected to the carrier at one end and fixedly connected to the head at the other end;

one side of the head part facing the carrier forms a second stop surface which can limit the floating piece to move towards the direction far away from the carrier.

12. The circuit board module of claim 8, wherein the second circuit board further comprises a flex line, and the fifth subplate and the sixth subplate are electrically connected by the flex line.

13. The circuit board module of claim 8, wherein the floating member is made of at least one of natural rubber, styrene butadiene rubber, nitrile butadiene rubber, isoprene rubber and butyl rubber.

14. An electronic device, characterized in that it comprises a circuit board module according to any one of claims 1-13.