CN115623107A - Loudspeaker module and terminal equipment - Google Patents
Loudspeaker module and terminal equipment Download PDFInfo
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- CN115623107A CN115623107A CN202110783305.4A CN202110783305A CN115623107A CN 115623107 A CN115623107 A CN 115623107A CN 202110783305 A CN202110783305 A CN 202110783305A CN 115623107 A CN115623107 A CN 115623107A
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- 238000005192 partition Methods 0.000 claims abstract description 46
- 238000003466 welding Methods 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 description 50
- 238000010586 diagram Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000005236 sound signal Effects 0.000 description 8
- 208000002925 dental caries Diseases 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
Abstract
The disclosure relates to a loudspeaker module and terminal equipment, and belongs to the technical field of terminals. The loudspeaker module comprises a shell, a first sounding main body, a second sounding main body and a partition plate; the shell is provided with a first opening, the partition plate is positioned in the shell and divides the cavity of the shell into a first cavity and a second cavity, and the first cavity and the second cavity are arranged side by side; the first sounding main body and the second sounding main body are respectively positioned in the first cavity and the second cavity, and a first sounding surface of the first sounding main body and a second sounding surface of the second sounding main body are both close to the first opening.
Description
Technical Field
The utility model relates to a terminal technology field especially relates to a speaker module and terminal equipment.
Background
In a terminal device such as a mobile phone, a speaker is disposed at the top of a screen for outputting an audio signal.
In the related art, the loudspeakers are all single-core loudspeakers, namely, only one sounding main body is provided, and the sounding quality has a certain bottleneck.
Disclosure of Invention
The present disclosure provides a speaker module and a terminal device, which improve sound quality by arranging a dual-sound-emitting main body.
At least one embodiment of the present disclosure provides a speaker module, including a housing, a first sounding body, a second sounding body, and a partition plate;
the shell is provided with a first opening, the partition plate is positioned in the shell and divides the cavity of the shell into a first cavity and a second cavity, and the first cavity and the second cavity are arranged side by side;
the first sounding main body and the second sounding main body are respectively positioned in the first cavity and the second cavity, and a first sounding surface of the first sounding main body and a second sounding surface of the second sounding main body are both close to the first opening.
In the embodiment of the present disclosure, by arranging two sound generating bodies in one housing of the speaker module, that is, the speaker module is dual-core, the first sound generating body and the second sound generating body are used to output the same audio, that is, the same audio signal is converted into sound to be output. First sound production main part and second sound production main part are arranged respectively in two cavitys of arranging side by side, and the play sound face of two sound production main parts all is close to first opening to make the same audio frequency of two sound production main part outputs, all follow first opening output, make the play sound quality of speaker module better. Since in this speaker module, first sound emission main part and second sound emission main part are arranged in a casing simultaneously, compare and arrange two sound emission main parts separately in two casings, speaker module occupation space is littleer.
Optionally, a distance between a side surface of the partition plate near the first opening and an end surface of the housing around the first opening is greater than 0.
Make the antetheca of first sound production main part and the antetheca of second sound production main part communicate like this to make the antetheca of two sound production main parts realize the sharing, under the prerequisite that can guarantee the antetheca size, suitably reduce the size of casing, thereby be favorable to the miniaturization of speaker module.
Optionally, the housing further has a second opening opposite to the first opening, and a distance between a side surface of the partition plate close to the second opening and an end surface of the housing around the second opening is greater than 0.
Make the rear chamber of first main part of making a sound 11 and the rear chamber of second sound production main part communicate like this, thereby make the rear chamber of two sound production main parts realize the sharing, because two sound production main part sharing rear chambers, the rear chamber size is bigger, make the resonant frequency F0 of first main part of making a sound in the speaker module bigger to cutoff frequency's scope, the resonant frequency F0 of second sound production main part is bigger to cutoff frequency's scope, thereby the frequency response bandwidth of speaker module has been increased, it exports to the low frequency to cover the high frequency. In addition, because first sound generating body and second sound generating body share the back chamber, can be under the prerequisite of guaranteeing the back chamber size, suitably reduce the size of casing to be favorable to the miniaturization of speaker module.
Optionally, the housing further has a second opening and a cover plate, the second opening is opposite to the first opening;
the cover plate is located in the second cavity, located on one side, away from the second sound emitting face, of the second sound emitting main body and connected with the shell and the partition plate.
In this implementation, the apron covers the one side of keeping away from first sound face at second sound production main part to make the back chamber that corresponds with second sound production main part removed, also do not have the back chamber for the resonant frequency F0 of second sound production main part diminishes, and second sound production main part realizes high frequency output.
Optionally, the casing further has a skirt disposed on an inner wall of the casing and close to the first opening, and the skirt is connected to the first sound-generating body and the second sound-generating body, respectively.
The skirt edge is connected with the first sounding main body and the second sounding main body, so that the sounding main body can be connected with two surfaces of the shell at the same time, and the connection is firmer.
Optionally, the first sound emitting surface and the second sound emitting surface are respectively provided with a diaphragm vibration area, and a gap is formed between the diaphragm vibration area and the skirt.
This is disclosed through letting first sound production main part and second sound production main part vibrating diaphragm vibrations region avoid the shirt rim to guarantee the sound production effect of first sound production main part and second sound production main part.
Optionally, the first sounding main body is connected with the casing and the partition plate in a sealing manner through glue, and the second sounding main body is connected with the casing and the partition plate in a sealing manner through glue.
Optionally, a welding point is further arranged between the first sounding main body and the shell and between the first sounding main body and the partition plate, a welding point is further arranged between the second sounding main body and the shell and between the second sounding main body and the partition plate, and the welding point is in contact with the glue.
Optionally, the shell has a wall thickness in the range of 0.2mm to 0.4mm.
Optionally, the volume of the first sounding body and the volume of the second sounding body are not equal.
Optionally, the housing includes a lower housing and an upper housing, the lower housing and the upper housing are butted, and a connection between the lower housing and the upper housing has a routing through hole;
the loudspeaker module further comprises an FPC wiring, the middle of the FPC wiring is located in the wiring through hole, one end of the FPC wiring is connected with the first sounding main body and the second sounding main body, and the other end of the FPC wiring is located outside the shell.
At least one embodiment of the present disclosure provides a terminal device, including a speaker module and a power supply module;
the speaker module is as any one of the speaker modules described above, and the power supply assembly is configured to supply power to the speaker module.
In the embodiment of the present disclosure, by arranging two sound generating bodies in one housing of the speaker module, that is, the speaker module is dual-core, the first sound generating body and the second sound generating body are used to output the same audio, that is, the same audio signal is converted into sound to be output. First sound production main part and second sound production main part are arranged respectively in two cavitys of arranging side by side, and the play sound face of two sound production main parts all is close to first opening to make the same audio frequency of two sound production main part outputs, all export from first opening, make the play sound quality of speaker module better. Since in this speaker module, first sound emission main part and second sound emission main part are arranged in a casing simultaneously, compare and arrange two sound emission main parts separately in two casings, speaker module occupation space is littleer.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic structural diagram of a speaker module according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a speaker module according to an embodiment of the present disclosure;
fig. 3 is a front view of the speaker module of fig. 2;
fig. 4 is a schematic structural diagram of another speaker module provided in the embodiment of the present disclosure;
fig. 5 is a front view of the speaker module of fig. 4;
fig. 6 is a schematic cross-sectional view of another speaker module provided in the embodiments of the present disclosure;
fig. 7 is a schematic top view of the speaker module shown in fig. 6;
fig. 8 is a schematic top view of another speaker module provided in the embodiments of the present disclosure;
fig. 9 is a schematic top view of another speaker module provided in the embodiments of the present disclosure;
FIG. 10 isbase:Sub>A schematic cross-sectional view taken along line A-A of FIG. 9;
fig. 11 is a schematic structural diagram of a terminal device according to an embodiment of the present disclosure.
The reference numerals referred to in this disclosure have the following meanings:
1-a loudspeaker module, 2-a screen, 3-a front frame and 4-a middle frame;
10-a shell, 11-a first sounding body, 12-a second sounding body, 13-a partition board, 14-glue, 15-welding points, 16-FPC wiring and 31-a sounding hole;
100-cavity, 101-first opening, 102-first cavity, 103-second cavity, 104-second opening, 105-cover plate, 106-skirt, 107-lower shell, 108-upper shell, 109-routing through hole;
1001-front cavity, 1002-back cavity, 1100-diaphragm vibration region.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," "third," and the like, as used in the description and in the claims of the present disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Fig. 1 is a schematic structural diagram of a speaker module according to an embodiment of the present disclosure. Referring to fig. 1, the speaker module includes a housing 10, a first sound emission body 11, a second sound emission body 12, and a partition 13.
The housing 10 has a first opening 101, and the partition 13 is located inside the housing 10 to divide the cavity 100 of the housing 10 into a first cavity 102 and a second cavity 103, where the first cavity 102 and the second cavity 103 are arranged side by side.
The first sound generating body 11 and the second sound generating body 12 are respectively located in the first cavity 102 and the second cavity 103, and the first sound emitting surface 110 of the first sound generating body 11 and the second sound emitting surface 120 of the second sound generating body 12 are both close to the first opening 101.
In the embodiment of the present disclosure, by arranging two sound generating bodies in one housing of the speaker module, that is, the speaker module is dual-core, the first sound generating body and the second sound generating body are used to output the same audio, that is, the same audio signal is converted into sound to be output. First sound production main part and second sound production main part are arranged respectively in two cavitys of arranging side by side, and the play sound face of two sound production main parts all is close to first opening to make the same audio frequency of two sound production main part outputs, all export from first opening, make the play sound quality of speaker module better. Since in this speaker module, first sound emission main part and second sound emission main part are arranged in a casing simultaneously, compare and arrange two sound emission main parts separately in two casings, speaker module occupation space is littleer.
In the embodiment of the present disclosure, the first cavity 102 and the second cavity 103 are both communicated with the first opening 101, so that the audio output from the sound output surfaces of the first sound generating body 11 and the second sound generating body 12 can be output through the first opening 101.
Here, the sound-generating main body is also called a speaker unit and is a core component of sound generation of the speaker, and the sound-generating main body includes a diaphragm, and the diaphragm is a main sound-generating structure in the sound-generating main body. In the terminal device, the diaphragm is generally parallel to the use surface of the terminal device, for example, the diaphragm of the speaker module in the mobile phone may be parallel to the light exit surface of the mobile phone screen.
The sounding main body comprises a vibrating diaphragm, and further comprises an outer frame, a voice coil, a Printed Circuit Board (PCB) and other structures.
In the embodiment of the present disclosure, the housing 10 has a columnar structure, and the first opening 101 is disposed at one end of the columnar structure. The surface of the partition 13 is parallel to the axis of the housing 10, and the first cavity 102 and the second cavity 103 are arranged side by side along the lateral direction of the housing 10, which is a direction perpendicular to the direction in which the axis extends. Accordingly, the first and second sounding bodies 11 and 12 are also arranged side by side.
As shown in fig. 1, a casing 10 provided in the embodiment of the present disclosure is a prism structure, and the prism structure is formed by connecting two rectangular parallelepiped casings, wherein two rectangular parallelepiped cavities are respectively used for arranging a first sound generating body 11 and a second sound generating body 12, and a partition 13 is located at a junction of the two rectangular parallelepiped casings.
In other embodiments, the housing 10 may also be a cylindrical structure, a circular truncated cone structure, a prismatic truncated cone structure, or other three-dimensional structures.
In the disclosed embodiment, the housing 10 and the partition 13 are formed as an integral structure or an assembled structure, which is convenient for manufacturing.
Fig. 2 is a schematic structural diagram of a speaker module according to an embodiment of the disclosure, and the structure shown in fig. 2 is a structure of the speaker module in fig. 1 after a cut-away portion is formed, so as to better show an internal structure of the speaker module. Fig. 3 is a front view of the speaker module shown in fig. 2, i.e., a schematic cross-sectional view of the speaker module.
As shown in fig. 2 and 3, both ends of the housing 10 are open, that is, the housing 10 has a second opening 104 in addition to the first opening 101, and the second opening 104 is opposite to the first opening 101.
As shown in fig. 2 and 3, the cavity 100 in the housing 10 includes portions located respectively in front and rear of the two sound emission bodies in the axial direction of the housing 10, a front cavity 1001 and a rear cavity 1002 as speaker modules, the front cavity 1001 being adjacent to the first opening 101, and the rear cavity 1002 being adjacent to the second opening 104. The vibrating diaphragm in the sound production main part can drive the air vibration in front chamber and/or the back chamber through self vibration, and then realizes the sound production.
As shown in fig. 3, a distance D1 between a side surface of the first opening 101 of the partition plate 13 and an end surface of the housing 10 around the first opening 101 is greater than 0, that is, a side surface of the partition plate 13 close to the first opening 101 is recessed into the cavity relative to the end surface of the housing 10 around the first opening 101, so that the front cavity of the first sound generating body 11 and the front cavity of the second sound generating body are communicated, thereby the front cavities of the two sound generating bodies are shared, and on the premise that the size of the front cavity 1001 can be ensured, the size of the housing is appropriately reduced, thereby being beneficial to the miniaturization of the speaker module.
As shown in fig. 3, the distance D2 between the side surface of the partition plate 13 close to the second opening 104 and the end surface of the housing 10 around the second opening 104 is greater than 0, that is, the side surface of the partition plate 13 close to the second opening 104 is recessed toward the cavity with respect to the end surface of the housing 10 around the second opening 104, so that the rear cavity of the first sound generating body 11 and the rear cavity of the second sound generating body are communicated, thereby making the rear cavities of the two sound generating bodies common.
As shown in fig. 3, the rear cavity 1002 is shared by the first sound generating body 11 and the second sound generating body 12, and the rear cavity is larger in size due to the fact that the two sound generating bodies share the rear cavity, so that the range from the resonance frequency F0 of the first sound generating body 11 to the cut-off frequency in the speaker module is larger, and the range from the resonance frequency F0 of the second sound generating body 12 to the cut-off frequency is larger, thereby increasing the frequency response bandwidth of the speaker module and covering high-frequency to low-frequency output. In addition, since the first sound generating body 11 and the second sound generating body 12 share the rear cavity 1002, the size of the housing can be appropriately reduced on the premise of ensuring the size of the rear cavity 1002, thereby being beneficial to the miniaturization of the speaker module.
Fig. 4 is a schematic structural diagram of another speaker module according to an embodiment of the present disclosure. In contrast to fig. 2, the housing 10 shown in fig. 4 also has a cover plate 105. Fig. 5 is a front view of the speaker module shown in fig. 4, i.e., a schematic cross-sectional view of the speaker module. Referring to fig. 4 and 5, the cover plate 105 is located in the second cavity 103 and on a side of the second sounding body 12 away from the second sounding surface 120, and is connected to the casing 10 and the partition 13.
In this implementation, the thickness of the cover plate 105 is equal to the distance D2 in fig. 3, and the cover plate 105 covers the side of the second sounding main body 12 away from the first sounding surface 110, so that the rear cavity corresponding to the second sounding main body 12 is removed, that is, the second sounding main body 12 has no rear cavity, so that the resonant frequency F0 of the second sounding main body 12 becomes small, and the second sounding main body 12 realizes high-frequency output.
Optionally, the cover plate 105 and the housing 10 are of an integrally formed structure or assembled.
As shown in fig. 1 to 4, in one possible implementation, the volumes of the first sound generating body 11 and the second sound generating body 12 are not equal, for example, as shown in the figure, the volume of the first sound generating body 11 is larger than the volume of the second sound generating body 12.
Here, the volumes of the first and second sounding bodies 11 and 12 are not equal, and may be generally achieved by at least one of the length, width, and height being different.
As shown in fig. 4, the volume of the first sounding body 11 is larger than that of the second sounding body 12, that is, a sounding body with a smaller volume is provided with the cover plate 105 in fig. 4, or a sounding body with a smaller volume is provided without a rear cavity.
When two sound production main parts are designed to be large and small, the small sound production main part is used for high-frequency output, and the large sound production main part is used for low-frequency output.
In other possible implementations, the volumes of the first and second sound emitting bodies 11 and 12 may be equal.
Fig. 6 is a schematic cross-sectional view of another speaker module according to an embodiment of the present disclosure. Compared with fig. 3, the housing 10 of the speaker module further has a skirt 106, the skirt 106 is located on the inner wall of the housing 10 and is close to the first opening 101, and the skirt 106 is connected to the first sound generating body 11 and the second sound generating body 12 respectively.
Because skirt 106 is set around the inside wall of casing 10 a week, can link to each other through skirt 106 and first sound main part 11 and second sound main part 12, can realize that the sound main part is connected with two faces of casing simultaneously for it is more firm to connect.
Illustratively, the skirt 106 is welded to the first sound emission body 11 and the second sound emission body 12, respectively.
Fig. 7 is a schematic top view of the speaker module shown in fig. 6. Referring to fig. 7, the first sound-emitting surface 110 and the second sound-emitting surface 120 each have a diaphragm vibration region 1100, and a gap is provided between the diaphragm vibration region 1100 and the skirt 106.
This disclosure is through letting first sound production body 11 and second sound production body 12 vibrating diaphragm vibrations region avoid shirt rim 106 to guarantee the sound production effect of first sound production body 11 and second sound production body 12.
In the embodiment of the present disclosure, the diaphragm vibration region 1100 is a corresponding region of the diaphragm in the sound output surface of the sound outputting body.
Fig. 8 is a schematic top view of another speaker module according to an embodiment of the disclosure. Referring to fig. 8, the first sounding body 11 is hermetically connected with the casing 10 and the partition 13 by glue 14, and the second sounding body 12 is hermetically connected with the casing 10 and the partition 13 by glue 14.
Through the sealing connection, the two sounding bodies can be completely separated into a front cavity and a rear cavity.
Referring to fig. 8 again, there are welding points 15 between the first sounding body 11 and the shell 10 and the partition 13, and welding points 15 between the second sounding body 12 and the shell 10 and the partition 13, where the welding points 15 are in contact with the glue 14.
In the actual manufacturing process, the sounding main body is welded with the shell and the partition plate, the welding mode can be spot welding, gaps exist among welding spots, and sealing is achieved through dispensing.
In one implementation of the present disclosure, the casing 10 is a metal casing, the partition 13 is a metal partition, and the metal casing and the metal partition are respectively welded to the first sound generating body 11 and the second sound generating body 12. In the related art, the plastic housing is usually more than 1mm due to the limitation of the injection molding process, and the metal housing has a smaller thickness compared to the injection molded housing, so that the size of the whole speaker module is smaller, for example, the wall thickness of the housing 10 ranges from 0.2mm to 0.4mm, and the wall thickness of the partition 13 ranges from 0.2mm to 0.4mm. Meanwhile, the connection mode is realized by adopting a spot welding and dispensing mode, and compared with the prior art in which glue is directly adopted for connection, the thickness is smaller.
Illustratively, the housing 10 is a steel housing, and the partition 13 is a steel partition.
Illustratively, the wall thickness of the housing is 0.2mm. The wall thickness of the partition 13 was 0.2mm.
For example, the housing 10 and the partition 13 are made of 0.2mm steel sheets.
Illustratively, the outer frame of the sounding main body is of a metal structure, and the outer frame, the metal shell and the metal partition plate are welded.
As shown in fig. 8, the sound emitting surface of the sound emitting body, the case and the partition plate may be welded, which facilitates the welding process. In other implementations, the welding may be performed at other positions, such as the side of the sound generating body away from the sound emitting surface.
In other implementations, the casing 10 is a plastic casing, and the casing 10 is hermetically connected to the first sound emission body 11 and the second sound emission body 12 respectively through glue.
Fig. 9 is a schematic top view of another speaker module provided in the embodiments of the present disclosure. Referring to fig. 9, the speaker module further includes a Flexible Printed Circuit (FPC) trace 16. Fig. 10 isbase:Sub>A schematic sectional view in the direction ofbase:Sub>A-base:Sub>A in fig. 9. Referring to fig. 9 and 10, the housing 10 includes a lower housing 107 and an upper housing 108, the upper housing 108 is butted with the lower housing 107, and a trace through hole 109 is formed at the joint of the upper housing 108 and the lower housing 107.
The middle of the FPC trace 16 is located in the trace through hole 109, one end of the FPC trace 16 is connected to the first sound generating main body 11 and the second sound generating main body 12, and the other end of the FPC trace 16 is located outside the housing 10.
Illustratively, one end of the FPC trace 16 connects the PCBs of the first and second sound emitting bodies 11 and 12.
Illustratively, the other end of the FPC trace 16 is used to connect to the motherboard of the terminal device.
For example, the end of the FPC trace 16 outside the housing has a plug terminal, through which the electrical connection between the FPC trace and the motherboard can be conveniently achieved.
The FPC wiring is arranged to connect the first sounding main body 11 and the second sounding main body 12, so that the first sounding main body 11 and the second sounding main body 12 can be connected with a main board, and audio output is achieved by receiving audio signals.
As shown in fig. 9 and 10, the FPC trace 16 is embedded in the trace through hole 109, which is a strip-shaped through hole, and the FPC trace is disposed in the strip-shaped through hole, so that the FPC trace 16 can extend from a position close to the first sound emitting body 11 to a position close to the second sound emitting body 12, thereby enabling the FPC trace 16 to be electrically connected to the two sound emitting bodies at the same time.
As shown in fig. 9, the distance of the circumference of the outer wall of the housing 10 that is bypassed by the FPC traces 16 is less than 1/2 of the total length of the circumference of the outer wall of the housing 10.
In the embodiment of the present disclosure, at the position having the trace through hole 109, the upper casing 108 and the lower casing 107 are hermetically connected by glue (for example, by dispensing), and at other positions except the position having the trace through hole 109, the upper casing 108 and the lower casing 107 are welded and sealed by glue, for example, spot welding is adopted for welding, and the gap between the welding points is sealed by dispensing. The lower shell and the upper shell are connected in a sealing mode through glue at the position with the wiring through hole, and the lower shell and the upper shell are welded and sealed through glue at the other positions except the position with the wiring through hole, so that a sealing structure is formed at the position of the FPC wiring.
The upper shell 108 and the lower shell 107 are hermetically connected in the above manner, so that the sound production effect of the speaker module is ensured.
In the embodiment of the present disclosure, two sound generating bodies are disposed in one housing of the speaker module, that is, the speaker module is dual-core, and the first sound generating body and the second sound generating body are used to output the same audio, that is, the same audio signal is converted into sound to be output. First sound production main part and second sound production main part are arranged respectively in two cavitys of arranging side by side, and the play sound face of two sound production main parts all is close to first opening to make the same audio frequency of two sound production main part outputs, all export from first opening, make the play sound quality of speaker module better. Since in this speaker module, the first and second sound emission bodies are arranged in one housing at the same time, the speaker module occupies a smaller space than when the two sound emission bodies are arranged in two housings separately.
In a possible implementation mode, the front cavities of the two sounding main bodies are shared, and the size of the shell is properly reduced on the premise that the size of the front cavity can be guaranteed, so that the miniaturization of the loudspeaker module is facilitated.
In a possible implementation mode, because the two sounding main bodies share the rear cavity, the size of the rear cavity is larger, so that the range from the resonance frequency F0 of the first sounding main body to the cut-off frequency in the loudspeaker module is larger, and the range from the resonance frequency F0 of the second sounding main body to the cut-off frequency is larger, thereby increasing the frequency response bandwidth of the loudspeaker module and covering high-frequency to low-frequency output. The back chamber sharing of two sound production main parts can suitably reduce the size of casing under the prerequisite of guaranteeing the back chamber size to be favorable to the miniaturization of speaker module.
The loudspeaker module provided by the embodiment of the disclosure has the characteristics of good sound quality, small volume, small weight and the like. The speaker module can be used as a top speaker of a terminal device.
The embodiment of the disclosure also provides a terminal device. The terminal device includes: speaker module and power supply unit. As shown in any one of fig. 1 to 10, the power supply module is configured to supply power to the speaker module, and the terminal device can convert the audio signal into audio through the speaker module to achieve audio output.
Illustratively, the terminal device includes, but is not limited to, a mobile phone terminal, a tablet terminal, a smart home, and the like.
In the embodiment of the present disclosure, two sound generating bodies are disposed in the speaker module, that is, the speaker module is dual-core, and the first sound generating body and the second sound generating body are used to output the same audio, that is, the same audio signal is converted into sound to be output. First sound production main part and second sound production main part are arranged respectively in two cavitys of arranging side by side, and the play sound face of two sound production main parts all is close to first opening to make the same audio frequency of two sound production main part outputs, all export from first opening, make the play sound quality of speaker module better. Meanwhile, in the loudspeaker module, the first sounding main body and the second sounding main body are arranged in one shell, and compared with the case that the two sounding main bodies are separately arranged in the two shells, the loudspeaker module occupies a smaller space.
Fig. 11 is a schematic structural diagram of a terminal device according to an embodiment of the present disclosure. Referring to fig. 11, the terminal device includes, in addition to the speaker module 1 and the power supply component (not shown), the following:
a screen 2, a front frame 3 and a middle frame 4. The front frame 3 is arranged between the screen 2 and the middle frame 4, and the front frame 3 is sleeved on the edge of the screen 2, wherein the phrase that the front frame 3 is sleeved on the edge of the screen 2 means that the front frame is arranged around the screen 2 and is connected with the screen 2.
In one implementation manner in the embodiment of the present disclosure, the front frame 3 has at least one sound outlet hole 31, the direction of the sound outlet hole 31 is the same as the light outlet direction of the screen, the cavity 100 of the speaker module 10 corresponds to the sound outlet hole 31, and the audio generated by the speaker module 10 can be output to the user through the sound outlet hole 31.
In this implementation manner, the sound outlet holes 31 of the speaker module 1 may be oriented to the display side of the terminal device as shown in fig. 11, and for example, 3 sound outlet holes may be provided, and different numbers of sound outlet holes may be provided as required.
In another implementation manner in the embodiment of the present disclosure, the sound outlet hole 31 of the speaker module 1 may face a side surface of the terminal device.
In another implementation manner of the embodiment of the present disclosure, the sound outlet hole 31 of the speaker module 1 may face a non-display side of the terminal device, which is opposite to the display side.
Illustratively, the screen 2 is a Liquid Crystal Display (LCD), an Organic Light Emitting Diode (OLED) Display, a Quantum Dot Light Emitting Diode (QLED), or other types of screens.
In the embodiment of the present disclosure, the terminal device further includes a main board (not shown in the figure), and the main board is electrically connected to the speaker module 10.
In the embodiment of the present disclosure, the main board and the speaker module 10 are connected by the aforementioned FPC wiring.
In the embodiment of the present disclosure, the terminal device further includes a rear shell (not shown in the figure), the rear shell is connected to the middle frame, after the rear shell, the middle frame, the front frame and the screen are assembled, a containing cavity is formed inside the terminal device, and the speaker module 10 and the main board are arranged inside the containing cavity.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosed embodiments. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (12)
1. A loudspeaker module is characterized by comprising a shell (10), a first sound-producing main body (11), a second sound-producing main body (12) and a partition plate (13);
the shell (10) is provided with a first opening (101), the partition plate (13) is positioned inside the shell (10) and divides the cavity (100) of the shell (10) into a first cavity (102) and a second cavity (103), and the first cavity (102) and the second cavity (103) are arranged side by side;
the first sounding body (11) and the second sounding body (12) are respectively located in the first cavity (102) and the second cavity (103), and a first sounding surface (110) of the first sounding body (11) and a second sounding surface (120) of the second sounding body (12) are both close to the first opening (101).
2. A loudspeaker module according to claim 1, wherein the distance (D1) between the side of the partition (13) adjacent the first opening (101) and the end face of the housing (10) surrounding the first opening (101) is greater than 0.
3. A loudspeaker module according to claim 1, wherein the housing (10) further has a second opening (104), the second opening (104) being opposite to the first opening (101), and the distance (D2) between the side of the partition (13) adjacent to the second opening (104) and the end face of the housing (10) around the second opening (104) is greater than 0.
4. A loudspeaker module according to claim 1, wherein the housing (10) further has a second opening (104) and a cover plate (105), the second opening (104) being opposite to the first opening (101);
the cover plate (105) is located in the second cavity (103), located on one side, away from the second sound emitting surface (120), of the second sound emitting main body (12), and connected with the shell (10) and the partition plate (13).
5. A loudspeaker module according to any one of claims 1 to 4, wherein the housing (10) further comprises a skirt (106), the skirt (106) being located on the inner wall of the housing (10) and adjacent to the first opening (101), the skirt (106) being connected to the first sound generating body (11) and the second sound generating body (12), respectively.
6. A loudspeaker module according to claim 5, wherein the first sound outlet face (110) and the second sound outlet face (120) each have a diaphragm vibration region (1100), and a gap is provided between the diaphragm vibration region (1100) and the skirt (106).
7. The speaker module as claimed in any one of claims 1 to 4,
the first sounding main body (11) is connected with the shell (10) and the partition plate (13) in a sealing mode through glue (14), and the second sounding main body (12) is connected with the shell (10) and the partition plate (13) in a sealing mode through the glue (14).
8. A loudspeaker module according to claim 7, wherein there are further welding spots (15) between the first sound generating body (11) and the housing (10) and the partition (13), and welding spots (15) between the second sound generating body (12) and the housing (10) and the partition (13), the welding spots (15) being in contact with the glue (14).
9. A loudspeaker module according to any one of claims 1 to 4, wherein the wall thickness of the housing (10) is in the range 0.2mm to 0.4mm.
10. A speaker module according to any one of claims 1 to 4, wherein the volume of the first sound generating body (11) and the volume of the second sound generating body (12) are not equal.
11. The speaker module according to any one of claims 1 to 4, wherein the housing (10) comprises a lower housing (107) and an upper housing (108), the lower housing (107) and the upper housing (108) are butted, and a trace through hole (109) is formed at the joint of the lower housing (107) and the upper housing (108);
the loudspeaker module further comprises an FPC (flexible printed circuit) wiring (16), the middle of the FPC wiring (16) is located in the wiring through hole (109), one end of the FPC wiring (16) is connected with the first sounding main body (11) and the second sounding main body (12), and the other end of the FPC wiring (16) is located outside the shell (10).
12. The terminal equipment is characterized by comprising a loudspeaker module and a power supply assembly;
the speaker module as claimed in any one of claims 1 to 11, wherein the power supply assembly is configured to supply power to the speaker module.
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CN202110783305.4A CN115623107A (en) | 2021-07-12 | 2021-07-12 | Loudspeaker module and terminal equipment |
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CN202110783305.4A CN115623107A (en) | 2021-07-12 | 2021-07-12 | Loudspeaker module and terminal equipment |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103458336A (en) * | 2012-05-29 | 2013-12-18 | Jvc建伍株式会社 | Earphone |
TWM532125U (en) * | 2016-06-24 | 2016-11-11 | 宏碁股份有限公司 | Speaker and electric device using the same |
CN106454653A (en) * | 2010-01-06 | 2017-02-22 | 苹果公司 | Low-profile speaker arrangements for compact electronic devices |
CN206658274U (en) * | 2017-03-14 | 2017-11-21 | 深圳市信维通信股份有限公司 | A kind of double horn formula loadspeaker structure |
CN107547991A (en) * | 2016-06-24 | 2018-01-05 | 宏碁股份有限公司 | Loudspeaker and electronic device using same |
-
2021
- 2021-07-12 CN CN202110783305.4A patent/CN115623107A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106454653A (en) * | 2010-01-06 | 2017-02-22 | 苹果公司 | Low-profile speaker arrangements for compact electronic devices |
CN103458336A (en) * | 2012-05-29 | 2013-12-18 | Jvc建伍株式会社 | Earphone |
TWM532125U (en) * | 2016-06-24 | 2016-11-11 | 宏碁股份有限公司 | Speaker and electric device using the same |
CN107547991A (en) * | 2016-06-24 | 2018-01-05 | 宏碁股份有限公司 | Loudspeaker and electronic device using same |
CN206658274U (en) * | 2017-03-14 | 2017-11-21 | 深圳市信维通信股份有限公司 | A kind of double horn formula loadspeaker structure |
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