CN115618437A

CN115618437A - Stress analysis method, system and equipment for corrugated board

Info

Publication number: CN115618437A
Application number: CN202210842536.2A
Authority: CN
Inventors: 卢斌伟
Original assignee: Deppon Logistics Co ltd
Current assignee: Deppon Logistics Co ltd
Priority date: 2022-07-18
Filing date: 2022-07-18
Publication date: 2023-01-17

Abstract

The invention discloses a method, a system and equipment for analyzing stress of a corrugated board, and relates to the technical field of simulation analysis of paper boards. The stress analysis method comprises the following steps: establishing a geometric model of the corrugated board according to national standard parameters of the corrugated board structure; giving the geometric model material properties; selecting an actual compression test value according to a compression test standard of the corrugated board to define a working condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board; the results of the analysis are processed to assess the yield properties and/or design rationality of the corrugated board. The stress analysis method provided by the invention has the advantages of short test period, high calculation efficiency and high calculation precision.

Description

Stress analysis method, system and equipment for corrugated board

Technical Field

The invention relates to the technical field of simulation analysis of paper plates, in particular to a method, a system and equipment for analyzing stress of corrugated boards.

Background

The traditional corrugated board structure stress analysis method is generally a physical test method, and the whole corrugated board needs to be placed in various instruments such as an edge pressure instrument, a breakage resistance instrument and the like, and various testing machines are used for carrying out experiments on the corrugated board under corresponding standard conditions. The test period of the physical experiment process is long, the project development period is seriously influenced, the requirements of the corrugated board piece on the temperature and humidity conditions are high, and the experiment environment has direct influence on the test result. In addition, the physical test result cannot visually see the stress change of each point in the part, the improvement and analysis of the stress problem is lack of guidance, and the traditional physical test method cannot be adapted to the rapid market change nowadays, so that efficient and accurate experimental data becomes more important.

In order to solve the problems of the physical experiments, a method for carrying out stress analysis on the corrugated buffer solid unit through fine modeling is provided, although the method can accurately reflect nonlinear mechanical behaviors such as gaps of the structure, material yield and the like, the method has the advantages of large number of required units, low calculation efficiency, single structural stress test data in the same period, lack of complete data comparison and verification and difficulty in large-scale static dynamic elastoplasticity analysis of the whole structure. Although the calculation efficiency is high, the macroscopic analysis method represented by each mechanical equation cannot penetrate into the section of the buffer part to show the specific position and size of the damage of each buffer part after the test, and cannot meet the calculation precision requirement.

Therefore, a new method for analyzing stress of corrugated cardboard is needed to solve the above problems.

Disclosure of Invention

In order to solve the problems, the invention provides a method, a system and equipment for analyzing the stress of a corrugated board.

The invention provides the following scheme:

in a first aspect, a stress analysis method for a corrugated board is provided, where the corrugated board includes at least two board elements and at least one buffer element located between the board elements, and the stress analysis method includes:

establishing a geometric model of the corrugated board according to national standard parameters of the corrugated board structure;

endowing the geometric model with material properties;

selecting an actual compression test value according to a compression test standard of the corrugated board to define a working condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board;

the results of the analysis are processed to assess the yield properties and/or design rationality of the corrugated board.

Optionally, the selecting an actual compression test value according to the compression test standard of the corrugated board to define a condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board includes:

establishing an analysis step;

specifying the interaction and contact relation among all buffer parts of the corrugated board, and corresponding to the analysis step;

specifying the load, boundary conditions and field according to the compression resistance test value, and corresponding to the analysis step;

finite element analysis was performed using nonlinear mode loading in the geometric model.

Optionally, the selecting an actual compression test value according to the compression test standard of the corrugated board to define a condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board further includes:

and carrying out gridding treatment on the geometric model, and dividing the geometric model into eight-node linear hexahedron units, wherein the unit type is C3D8R.

Optionally, the specifying of the interaction and contact relationship between the buffers of the corrugated cardboard and the analyzing step includes:

performing fixed constraint on the bottom of the buffer part, and corresponding to the analysis step;

the mechanical option defining the interaction properties is a tangential action, the friction coefficient is 0.3, the tangential action is applied to each contact plane of the cache element, and the tangential action corresponds to the analysis step.

Optionally, the applying the load in the geometric model in the nonlinear mode for finite element analysis includes:

and applying uniform loads vertical to the plane on the top plane of the geometric model by adopting a nonlinear mode to perform finite element analysis.

Optionally, before the giving the material property of the geometric model, the method further includes:

the geometric model is simplified to remove non-or merged essential features.

Optionally, the material properties include modulus of elasticity, poisson's ratio, and mass density.

In a second aspect, a system for analyzing stress of corrugated cardboard is provided, comprising:

the model establishing unit is used for establishing a geometric model of the corrugated board according to national standard parameters of the corrugated board structure;

the analysis unit is used for receiving the imported geometric model, endowing the geometric model with material properties, selecting an actual compression test value according to the compression test standard of the corrugated board to define the working condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board;

and the post-processing unit is used for processing the analysis result so as to evaluate the yield performance and/or the design rationality of the corrugated board.

In a third aspect, a corrugated cardboard stress analysis device is provided, which comprises a memory and a processor, wherein the memory stores a computer program capable of running on the processor, and when the computer program is executed by the processor, the corrugated cardboard stress analysis device realizes the corrugated cardboard stress analysis method.

In a fourth aspect, a computer-readable storage medium is provided, in which a computer program is stored, and when the computer program is executed, the method for analyzing stress of corrugated cardboard is implemented.

According to the specific embodiment provided by the invention, the invention discloses the following technical effects:

the stress analysis method for the corrugated board provided by the invention comprises the steps of firstly establishing a geometric model of the actual corrugated board according to national standard parameters, selecting an actual compression test value according to a compression test standard, then adopting a finite element to analyze the stress of the geometric model, finally evaluating the yield performance and/or the design rationality of the corrugated board according to an analysis result, and improving the actual corrugated board according to an evaluation result. Compared with a physical test method, the stress analysis method provided by the application has the advantages that the test period is short, the influence on the project development period is small, and the actual corrugated board is not involved, so that the test process is not influenced by the test environment, the stress change of each point in the corrugated board can be obtained through finite element analysis, and the stress problem improvement analysis can be guided; compared with a method for carrying out stress analysis by refined modeling, the method has high calculation efficiency, comprehensive structural stress test data in the same period, capability of carrying out complete data comparison and verification, and capability of being used for large-scale static dynamic elastoplasticity analysis of the whole structure; compared with a macroscopic analysis method, the method can deeply penetrate into the cross section of the buffer part to show the specific position and size of the damage of each buffer part after the test, and cannot meet the requirement of calculation precision.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a partial schematic view of a geometric model of corrugated cardboard provided by one embodiment of the present invention;

fig. 2 is a block flow diagram of a stress analysis method for corrugated cardboard according to an embodiment of the present invention;

fig. 3 is a block flow diagram of a stress analysis method for corrugated cardboard according to another embodiment of the present invention;

fig. 4 is a diagram illustrating the interaction between buffers for a geometric model of corrugated cardboard according to an embodiment of the present invention;

FIG. 5 is a boundary condition diagram of a geometric model for corrugated cardboard provided by one embodiment of the present invention;

FIG. 6 is a deformation diagram of a geometric model for corrugated cardboard after application of a load according to one embodiment of the present invention;

FIG. 7 is a graph of the change in the geometric model for corrugated cardboard when a load is applied, according to one embodiment of the present invention;

FIG. 8 is a gridding diagram of a geometric model for corrugated cardboard provided by one embodiment of the present invention;

FIG. 9 is a differentiated layout for a geometric model of corrugated board provided by one embodiment of the present invention;

figure 10 is a schematic 100 x 100mm cut-out of a geometric model for corrugated board provided by one embodiment of the present invention;

fig. 11 is an XY data diagram of a stress analysis method for corrugated cardboards according to an embodiment of the present invention;

fig. 12 is a process energy variation diagram of a force analysis method for corrugated cardboards according to an embodiment of the present invention;

fig. 13 is an architecture diagram of a force analysis apparatus for corrugated cardboards according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.

The following describes specific implementations provided by embodiments of the present invention in detail.

The invention provides a stress analysis method for corrugated boards, which analyzes the stress of the corrugated boards by means of finite elements, can solve the problems of the traditional physical experiment, fine modeling and macroscopic analysis methods mentioned in the background technology, and can also provide design data reference and calibration in each stage in the design process at the initial stage of design, thereby achieving the balance of material selection and structural design.

Example one

In view of the technical problems set forth in the background art, the present application provides a stress analysis method for corrugated boards. The corrugated board comprises at least two plate elements and at least one buffer element positioned between the plate elements. Fig. 1 is a partial schematic view of a geometric model of corrugated cardboard provided in accordance with an embodiment of the present invention. As shown in fig. 1, in one example, the corrugated cardboard includes three plate members and two buffers. Fig. 2 is a block flow diagram of a stress analysis method for corrugated boards according to an embodiment of the present invention. As shown in fig. 2, the force analysis method includes:

s10: establishing a geometric model of the corrugated board according to national standard parameters of the corrugated board structure;

wherein, the national standard is GB/T6544-2008. The existing corrugated boards are generally produced according to the national standard, so that the geometric model constructed according to the national standard can basically simulate the structure same as the actual corrugated board. In one example, as shown in fig. 1, the two buffering members are respectively a flute a and a flute B, the flute a is positioned above the flute B, the flute width of the flute a is 6mm, the flute height is 3mm, the flute paper thickness is 0.3mm, the flute width of the flute B is 9mm, the flute height is 5mm, and the flute paper thickness is 0.3mm.

In one example, a geometric model is built using three-dimensional modeling software, such as SolidWorks.

S20: giving the geometric model material properties;

wherein the material properties comprise at least an elastic modulus, a poisson's ratio, and a mass density.

S30: selecting an actual compression test value according to a compression test standard of the corrugated board to define a working condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board;

wherein, resistance to compression test standard can be for the current standard of carrying out cardboard resistance to compression test, and this application does not set up it, can set up resistance to compression load through this resistance to compression test standard. And during finite element analysis, the stress analysis can be carried out on the buffer part by combining the actual condition. The actual compression test values at least comprise load, speed and acceleration acting on the geometric model. In one example, according to the range of the load borne by the corrugated board in the actual transportation, loading and unloading and stacking processes, the buffer is subjected to finite element analysis by taking the corresponding standard working condition of the compression test.

S40: the results of the analysis are processed to assess the yield properties and/or design rationality of the corrugated board.

It should be noted in particular that the corrugated cardboard can be modified and improved accordingly by means of the yield properties and/or design rationality.

In one example, step S20, step S30 and step S40 may be performed in finite element analysis software, which may include ABAQUS, and may further include a process of setting a coordinate system and a reference point in step S20.

According to the stress analysis method for the corrugated board, firstly, a geometric model of the actual corrugated board is established according to national standard parameters, an actual compression test value is selected according to a compression test standard, then, a finite element is adopted to analyze the stress of the geometric model, finally, the yield performance and/or the design rationality of the corrugated board can be evaluated according to an analysis result, and the actual corrugated board can be improved according to the evaluation result. Compared with a physical test method, the stress analysis method provided by the application has the advantages that the test period is short, the influence on the project development period is small, and the actual corrugated board is not involved, so that the test process is not influenced by the test environment, the stress change of each point in the corrugated board can be obtained through finite element analysis, and the stress problem improvement analysis can be guided; compared with a method for carrying out stress analysis by refined modeling, the method has high calculation efficiency, comprehensive structural stress test data in the same period, capability of carrying out complete data comparison and verification, and capability of being used for large-scale static dynamic elastoplasticity analysis of the whole structure; compared with a macroscopic analysis method, the method can deeply penetrate into the cross section of the buffer part to show the specific position and size of the damage of each buffer part after the test, and cannot meet the requirement of calculation precision.

Fig. 3 is a block flow diagram of a stress analysis method for corrugated cardboard according to another embodiment of the present invention. As shown in fig. 3, in one example, the S30 includes:

s31: establishing an analysis step;

wherein the sequence of analysis steps embodies the changes of the geometric model in load and boundary conditions. And establishing power in the analysis step, displaying the analysis step-1, starting a geometric nonlinear mode, and limiting the maximum time increment step.

S32: specifying the interaction and contact relation among all buffer parts of the corrugated board, and corresponding to the analysis step;

wherein, in one example, the interaction between the buffers is as shown in fig. 4.

S33: specifying the load, boundary conditions and field according to the compression resistance test value, and corresponding to the analysis step;

wherein, when ABAQUS is adopted as finite element analysis software, step S33 is performed in the LOAD module in ABAQUS. In one example, the boundary conditions are as in FIG. 5.

In one example, the deformation of the geometric model after the application of the load is as in FIG. 6, and becomes a process as in FIG. 7.

S34: finite element analysis was performed using nonlinear mode loading in the geometric model.

In one example, the arc length method is used to load the solution step by step, and is used during loading not only because of the need for step loading, but also because the arc length method has its own advantages. Under the condition that the rigidity matrix is zero or a negative value, the arc length method can prevent the divergence of the equilibrium iteration and achieve the convergence effect; the arc length method can obtain the ultimate bearing capacity value of the member; the arc length method can automatically select the step length according to the solving requirement, so that the solving efficiency is improved; the convergence rate of the arc length method is also higher; the arc length method is used for numerical analysis, and the stability and the solving efficiency are high.

Table 1 shows an example solution process.

TABLE 1

Specifically, in one example, the S30 includes, before:

the structural section characteristics are defined, the relative materials and cross sections of the corrugated board assembly are defined, and the components are assigned.

Therefore, the damage position and the damage size of each buffer piece after the test can be deeply shown in the section of each buffer piece, and the requirement on calculation precision is met.

Specifically, in one example, to provide the calculation speed, the S30 further includes:

and (3) performing gridding processing on the geometric model (as shown in fig. 8), and dividing the geometric model into eight-node linear hexahedron units, wherein the unit type is C3D8R.

It should be particularly noted that the gridding process is a key link in the finite element model, and the accuracy of the calculation result and the size of the calculation scale are directly affected by the number of grids and the quality of the grids. Generally, when the number of the divided grids is more, the calculation precision is also improved, but meanwhile, the degree of freedom of the model is multiplied, and the calculation time is longer; when the number of the divided grids is small, the grids can be properly and locally encrypted at the stress concentration part of the structure, the grids in the stress gentle region can be sparse, the accuracy requirement of a calculation result can be met, and the calculation efficiency can be considered. Therefore, in one example of the present application, as shown in fig. 9, the grid division is performed on the plate and the buffer in different local arrangements, so as to reduce the number of the whole model grids. Further, the number of grids is 71928.

When the Hex hexahedral cell Sweep method (Sweep) is used to divide the mesh, there are two meshing techniques: media Axis (neutral Axis algorithm) and Advancing Front (step-up algorithm). The media Axis algorithm can more easily obtain grid cells with regular shapes, and the choice of Minimize the mesh transition can improve the quality of the grid to some extent. The Advancing Front algorithm firstly generates quadrilateral units on the boundary and then expands the quadrilateral units into the region, and the algorithm can easily realize the transition from the coarse grid to the fine grid, so the algorithm is used in a grid transition region.

It should be noted that the gridding process may be performed at any stage before S34 in step S30 to increase the calculation speed.

Specifically, in one example, the specifying of the interaction and contact relationship between the buffers of the corrugated cardboard includes, corresponding to the analyzing step:

In one example, because the A edge and the B edge have 5 components, the contact of each component can be matched in an automatic contact finding and matching mode, and the setting efficiency can be improved.

Further, in an example of the present application, the performing finite element analysis by applying a load in a geometric model using a nonlinear mode includes:

Preferably, in one example, the load is 300N.

Specifically, in an example of the present application, the giving the geometric model material property further includes:

the geometric model is simplified to remove non-or merged essential features.

The unnecessary features are unnecessary or non-critical features which have no influence on the analysis result basically, so that the influence of unnecessary or non-critical components on the convergence of the analysis result can be reduced.

The simplification of the geometric model can be performed in pre-processing software, such as HyperMesh, where the geometric model output from the three-dimensional modeling software is required to be in step format.

Further, the simplifying the geometric model, after removing or combining necessary features, further comprises:

and carrying out standardized cutting on the geometric model.

In one example, the cut was 100 x 100mm in size (see fig. 10).

In an example of the present application, the processing the analysis result includes:

and creating a job task in the finite element software and submitting the job task.

The analysis calculation is realized by creating a job task, defining the name of the job task as Top _ pressure _300N, and monitoring the prompt information encountered in the analysis process until the final analysis is completed.

In an example of the present application, after S40, the method further includes:

and visualizing the result, creating a cloud graph and XY data (such as FIG. 11, wherein LE is MAX Primary PI maximum stress component, LE is MIN primary PI minimum stress component, S is MAX primary PI maximum strain component, and S is MIN primary PI minimum strain component) according to the analysis result of the finite element, and explicitly expressing each deformation stage by using the energy data change of each stage in the pressure bearing process of the buffer (such as FIG. 12).

Example two

Corresponding to the stress analysis method, the application also provides a stress analysis system of the corrugated board, which generally comprises a model establishing unit, an analysis unit and a post-processing unit. The model establishing unit is used for establishing a geometric model of the corrugated board according to national standard parameters of the corrugated board structure. The analysis unit is used for receiving the imported geometric model, giving material properties to the geometric model, selecting an actual compression test value according to a compression test standard of the corrugated board to define a working condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board. The post-processing unit is used to process the analysis results to assess the yield performance and/or design rationality of the corrugated board.

According to the stress analysis system for the corrugated board, firstly, a geometric model of the actual corrugated board is established according to national standard parameters, an actual compression test value is selected according to a compression test standard, then, a finite element is adopted to analyze the stress of the geometric model, finally, the yield performance and/or the design rationality of the corrugated board can be evaluated according to an analysis result, and the actual corrugated board can be improved according to the evaluation result. Compared with a physical test method, the stress analysis method provided by the application has the advantages that the test period is short, the influence on the project development period is small, and the actual corrugated board is not involved, so that the test process is not influenced by the test environment, the stress change of each point in the corrugated board can be obtained through finite element analysis, and the stress problem improvement analysis can be guided; compared with a method for carrying out stress analysis by refined modeling, the method has high calculation efficiency, comprehensive structural stress test data in the same period, capability of carrying out complete data comparison and verification, and capability of being used for large-scale static dynamic elastoplasticity analysis of the whole structure; compared with a macroscopic analysis method, the method can penetrate into the section of the buffer part to show the specific position and size of the damage of each buffer part after the test, and cannot meet the requirement on calculation precision.

Wherein the model building unit can be existing three-dimensional modeling software such as SolidWorks, and the analyzing unit and the post-processing unit can be finite element analyzing software such as ABAQUS.

For the parts of the second embodiment that are not described in detail, reference may be made to the descriptions of the first embodiment, and details are not repeated here.

EXAMPLE III

Corresponding to the method, the invention also provides a stress analysis device of the corrugated board, which comprises the following steps:

the processor and the memory, the memory stores the computer program which can run on the processor, when the computer program is executed by the processor, the stress analysis method for the corrugated board provided by any one of the above embodiments is executed.

Fig. 13 schematically illustrates a force analysis apparatus for corrugated cardboard, which includes a computer system 1500, where the computer system 1500 may specifically include a processor 1510, a video display adapter 1511, a disk drive 1512, an input/output interface 1513, a network interface 1514, and a memory 1520. The processor 1510, video display adapter 1511, disk drive 1512, input/output interface 1513, network interface 1514, and memory 1520 may be communicatively coupled via a communication bus 1530.

The processor 1510 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an Application Specific Integrated Circuit (ASIC), or one or more Integrated circuits, and is configured to execute related programs to implement the technical solution provided by the present invention.

The Memory 1520 may be implemented in the form of a ROM (Read Only Memory), a RAM (Random Access Memory), a static storage device, a dynamic storage device, or the like. The memory 1520 may store an operating system 1521 for controlling the operation of the electronic device, a Basic Input Output System (BIOS) for controlling low-level operations of the electronic device. In addition, a web browser 1523, a data storage management system 1524, an icon font processing system 1525, and the like can also be stored. The icon font processing system 1525 can be an application program that implements the operations of the foregoing steps in this embodiment of the present invention. In summary, when the technical solution provided by the present invention is implemented by software or firmware, the relevant program codes are stored in the memory 1520 and called for execution by the processor 1510.

The input/output interface 1513 is used for connecting an input/output module to realize information input and output. The i/o module may be configured as a component in a device (not shown) or may be external to the device to provide a corresponding function. The input devices may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output devices may include a display, a speaker, a vibrator, an indicator light, etc.

The network interface 1514 is used to connect a communication module (not shown) to enable the communication interaction of the present device with other devices. The communication module can realize communication in a wired mode (such as USB, network cable and the like) and also can realize communication in a wireless mode (such as mobile network, WIFI, bluetooth and the like).

The bus includes a path that transfers information between the various components of the device, such as the processor 1510, the video display adapter 1511, the disk drive 1512, the input/output interface 1513, the network interface 1514, and the memory 1520.

In addition, the electronic device may further obtain information of specific pickup conditions from the virtual resource object pickup condition information database for performing condition judgment, and the like.

It should be noted that although the above devices only show the processor 1510, the video display adapter 1511, the disk drive 1512, the input/output interface 1513, the network interface 1514, the memory 1520, the bus, etc., in the implementation, the device may also include other components necessary for normal operation. Furthermore, it will be understood by those skilled in the art that the apparatus described above may also include only the components necessary to implement the inventive arrangements, and need not include all of the components shown in the figures.

Example four

The invention further provides a computer-readable storage medium, wherein a computer program is stored in the computer-readable storage medium, and when the computer program is executed, the method for analyzing the stress of the corrugated board provided by any one of the above embodiments is realized.

From the above description of the embodiments, it is clear to those skilled in the art that the present invention can be implemented by software plus necessary general hardware platform. Based on such understanding, the technical solutions of the present invention may be embodied in the form of software products, which may be stored in a storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and include instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method according to the embodiments or some parts of the embodiments.

All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, the system or system embodiments are substantially similar to the method embodiments and therefore are described in a relatively simple manner, and reference may be made to some of the descriptions of the method embodiments for related points. The above-described system and system embodiments are only illustrative, wherein the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

The technical solutions provided by the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, which are merely used to help understanding the method and the core ideas of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the foregoing, the description is not to be taken in a limiting sense.

Claims

1. A stress analysis method for corrugated boards, wherein the corrugated boards comprise at least two board elements and at least one buffer element positioned between the board elements, the stress analysis method comprising:

giving the geometric model material properties;

2. The stress analysis method according to claim 1, wherein the selecting of the actual compression test value according to the compression test standard of the corrugated cardboard defines the condition constraint condition of the geometric model, and the performing of the finite element analysis on the corrugated cardboard comprises:

establishing an analysis step;

specifying the interaction and contact relation among all the buffering parts of the corrugated board, and corresponding to the analysis step;

finite element analysis was performed using a nonlinear mode to apply loads in the geometric model.

3. The force analysis method according to claim 2, wherein the selecting of the actual compression test value according to the compression test standard of the corrugated cardboard defines a condition constraint condition of the geometric model, and performing the finite element analysis on the corrugated cardboard further comprises:

4. The force analysis method according to claim 2, wherein the step of specifying the interaction and contact relationship between the buffers of the corrugated cardboard comprises the steps of:

5. The force analysis method of claim 2, wherein the performing finite element analysis using the nonlinear mode to apply a load in the geometric model comprises:

6. A force analysis method according to claim 1, wherein said assigning geometric model material properties further comprises, prior to:

the geometric model is simplified to remove non-or merged essential features.

7. A force analysis method as claimed in claim 1, wherein the material properties include modulus of elasticity, poisson's ratio and mass density.

8. A corrugated board stress analysis system, comprising:

the analysis unit is used for receiving the imported geometric model, giving material properties to the geometric model, selecting an actual compression test value according to a compression test standard of the corrugated board to define a working condition constraint condition of the geometric model, and performing finite element analysis on the corrugated board;

9. A corrugated cardboard stress analyzing apparatus comprising a memory and a processor, wherein the memory stores thereon a computer program operable on the processor, and when the computer program is executed by the processor, the method of analyzing the stress of the corrugated cardboard according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium having a computer program stored therein, wherein the computer program, when executed, implements the method for analyzing stress of corrugated cardboard according to any one of claims 1 to 7.