CN115615535B - Low-frequency acoustic wave sensor - Google Patents

Low-frequency acoustic wave sensor Download PDF

Info

Publication number
CN115615535B
CN115615535B CN202211208368.8A CN202211208368A CN115615535B CN 115615535 B CN115615535 B CN 115615535B CN 202211208368 A CN202211208368 A CN 202211208368A CN 115615535 B CN115615535 B CN 115615535B
Authority
CN
China
Prior art keywords
air pressure
air
cavity
low
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202211208368.8A
Other languages
Chinese (zh)
Other versions
CN115615535A (en
Inventor
吉庆贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIANGTAN SHENJU ELECTROMECHANI
Original Assignee
XIANGTAN SHENJU ELECTROMECHANI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIANGTAN SHENJU ELECTROMECHANI filed Critical XIANGTAN SHENJU ELECTROMECHANI
Priority to CN202211208368.8A priority Critical patent/CN115615535B/en
Publication of CN115615535A publication Critical patent/CN115615535A/en
Application granted granted Critical
Publication of CN115615535B publication Critical patent/CN115615535B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H17/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention provides a low-frequency acoustic wave sensor, which relates to the technical field of low-frequency acoustic wave detection, and comprises: a housing; an inner cover; a micro-air pressure sensing assembly; the low-frequency sound wave acquisition assembly comprises an inner shell, a blocking piece and vibrating membranes, wherein two adjacent vibrating membranes and the inner shell form a resonant cavity, and the blocking piece is arranged in the resonant cavity to divide the resonant cavity into a first cavity and a second cavity; a first airway; a second air passage; according to the invention, the low-frequency sound wave signals detected by the vibrating membrane can be converted into the first air pressure and the second air pressure, the first air pressure and the second air pressure are led into the micro-air pressure sensing assembly through the first air pipe and the second air pipe, and finally the first air pressure and the second air pressure are converted into electric signals through the micro-air pressure sensing assembly. The resonant cavity is filled with air, the dielectric constant of the air is little changed by temperature, and the air can work stably under the scene of great temperature difference change.

Description

Low-frequency acoustic wave sensor
Technical Field
The invention relates to the technical field of low-frequency sound wave detection, in particular to a low-frequency sound wave sensor.
Background
The low-frequency sound wave sensor is a device for capturing low-frequency sound waves and converting the low-frequency sound waves into electric signals, and is suitable for predicting low-frequency sound wave signals emitted by earthquakes and tsunamis. The device can also be placed in a border defense area to measure low-frequency sound wave signals emitted by foot step sounds of people, and whether people illegally enter the environment is judged through analysis.
The infrasonic wave sensor is one of low-frequency acoustic wave sensors. The working principle of the existing infrasonic wave sensor can be divided into a capacitive infrasonic wave sensor and a piezoelectric sensor. The working principle of the piezoelectric infrasonic wave sensor is as follows: when the diaphragm detects the infrasonic wave signal, the diaphragm vibrates and transmits the vibration to the piezoelectric element, so that the piezoelectric element is stressed and deformed to generate electric charges, and the infrasonic wave signal is converted into an electric signal.
However, the piezoelectric element has pyroelectric characteristics, i.e., when the temperature rises, the piezoelectric element releases electric charges. That is, the piezoelectric element can release charges when detecting the infrasonic wave signal and the temperature change, thereby affecting the measurement accuracy and sensitivity of the infrasonic wave sensor. In order to adapt to the use environment with larger temperature difference, the size of the vibrating membrane is required to be increased to enhance the piezoelectric effect so as to reduce the influence of the pyroelectric characteristic. Thus, the entire infrasonic wave sensor is increased in size, inconvenient to carry, and high in manufacturing cost.
In view of this, a new solution is needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a low-frequency acoustic wave sensor which is small in size, high in sensitivity and high in measurement accuracy.
In order to achieve the above purpose, the invention adopts the following technical means:
a low frequency acoustic wave sensor comprising:
A housing;
an inner cover provided on an inner peripheral wall of the housing;
the micro-air pressure sensing assembly is arranged on the upper surface of the inner cover;
The low-frequency sound wave acquisition assembly comprises an inner shell, a plurality of blocking pieces and vibrating membranes, wherein the vibrating membranes are arranged on the inner wall of the inner shell at intervals along the length direction of the inner shell, two adjacent vibrating membranes and the inner shell form a resonant cavity, the blocking pieces are arranged in the resonant cavity to divide the resonant cavity into a first cavity and a second cavity, a first through hole and a second through hole are formed in the inner shell, the first through hole is communicated with the first cavity, and the second through hole is communicated with the second cavity;
One end of the first air passage is communicated with the first cavity of the low-frequency sound wave acquisition assembly through the first through hole, and the other end of the first air passage is connected with the micro-air pressure sensing assembly; and
And one end of the second air passage is communicated with the second cavity of the low-frequency sound wave acquisition assembly through the second through hole, and the other end of the second air passage is connected with the micro-air pressure sensing assembly.
Optionally, the micro air pressure sensing component comprises a circuit board, a micro air pressure sensor and a power circuit, wherein the circuit board is arranged on the upper surface of the inner cover; the micro air pressure sensor and the power supply circuit are arranged on the circuit board.
Optionally, the micro air pressure sensor is a differential pressure air pressure sensor.
Optionally, a first jack and a second jack are formed in the inner cover, the first air channel comprises a first air pipe and a first conduit, the first air pipe is communicated with the first chamber and the first jack, and the first conduit is communicated with the first jack and an interface of the differential pressure type air pressure sensor; the second airway comprises a second air pipe and a second conduit, the second air pipe is communicated with the second chamber and the second jack, and the second conduit is communicated with the second jack and the other interface of the differential pressure type air pressure sensor.
Optionally, the first protruding part and the second protruding part are formed on two opposite sides of the peripheral wall of the resonant cavity, and the third protruding part and the fourth protruding part are formed on two opposite sides of the inner side wall of the shell; the first bulge and the third bulge form the first air pipe, and the second bulge and the fourth bulge form the second air pipe.
Optionally, the shell comprises a shell main body and an upper cover, wherein the upper end of the shell main body is provided with an opening, and the upper cover is used for covering the opening of the shell main body.
Optionally, a step part is provided on the inner wall of the housing main body, and the inner cover is provided on the step part.
Optionally, the bottom of the shell main body protrudes downwards to form a base, and a positioning hole is formed in the base.
Optionally, the upper surface of the inner cover is provided with a plurality of first positioning cylinders, and the lower surface of the upper cover is provided with a second positioning cylinder matched with the first positioning cylinder.
Optionally, the cross section of the vibrating membrane is corrugated.
Compared with the prior art, the invention has the following technical effects:
Through the setting of low frequency sound wave collection subassembly and little atmospheric pressure sensing subassembly to dispose low frequency sound wave collection subassembly into inner shell, separation spare and vibrating diaphragm, the vibrating diaphragm is a plurality ofly, and along inner shell length direction interval setting on the inner wall of inner shell, two adjacent vibrating diaphragms and inner shell formation resonant cavity, the separation spare is located in the resonant cavity, divide into first cavity and second cavity with the resonant cavity, two adjacent vibrating diaphragms are as condenser bipolar plate like this, and the interval is a distance between the vibrating diaphragm, has formed capacitive device. When the vibrating membranes are connected with the low-frequency sound wave signals, the vibrating membranes vibrate, so that the distance between two adjacent vibrating membranes can change, the volumes of the first containing cavity and the second containing cavity change, and the first air pressure and the second air pressure are generated. And moreover, the resonant cavity is filled with air, the dielectric constant of the air is little changed by temperature, and the air can be stably operated under the scene of great temperature difference change. The cooperation of low frequency sound wave acquisition assembly, first trachea, second trachea and little atmospheric pressure sensing subassembly of rethread can be with the low frequency sound wave signal conversion that the vibrating diaphragm detected first atmospheric pressure and second atmospheric pressure, and rethread first trachea and second trachea are leading-in little atmospheric pressure sensing subassembly with first atmospheric pressure and second atmospheric pressure, and finally through little atmospheric pressure sensing subassembly with first atmospheric pressure and second atmospheric pressure conversion electric signal. The resonant cavity is filled with air, the dielectric constant of the air is little changed by temperature, and the air can work stably under the scene of great temperature difference change.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 illustrates a perspective view of a low frequency acoustic wave sensor of an embodiment;
FIG. 2 is a perspective view of another view of the low frequency acoustic wave sensor of FIG. 1;
FIG. 3 is a top view of a housing body of the low frequency acoustic wave sensor;
FIG. 4 is a bottom view of the upper cover of the low frequency acoustic wave sensor;
FIG. 5 is a schematic diagram of the hidden housing of the low frequency acoustic wave sensor;
FIG. 6 is a schematic diagram of the structure of an infrasound collecting unit of the low frequency acoustic wave sensor;
FIG. 7 is a schematic diagram of another view of a low frequency acoustic wave acquisition unit;
FIG. 8 is a schematic structural view of the inner housing of the low frequency acoustic wave acquisition unit;
FIG. 9 is a schematic diagram of a barrier of a low frequency acoustic acquisition unit;
FIG. 10 is a schematic diagram of the structure of a diaphragm of a low frequency acoustic wave acquisition unit;
fig. 11 is a sectional view in the direction A-A of fig. 1.
Description of main reference numerals:
10-a housing; 11-a housing body; 111-third protrusions; 112-fourth projections; 113-a step; 1131-step hole; 12-an upper cover; 121-a second positioning cylinder; 13-a base; 131-positioning holes;
20-a micro-air pressure sensing assembly; 21-a circuit board; 22-micro air pressure sensor;
30-a low-frequency sound wave acquisition assembly; 31-an inner shell; 311-a first through hole; 312-a second through hole; 313-lap; 314—a first projection; 315-a second protrusion; 32-a barrier; 321-a first gap; 322-second gap; 33-a diaphragm;
40-inner cover; 41-a first positioning cylinder;
51-a first trachea; 52-a first conduit;
61-a second trachea; 62-second conduit.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other. Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout.
The low frequency sound wave is a sound wave with a frequency less than 100 HZ. The frequency of the infrasonic wave is less than 20HZ, and the infrasonic wave is one of low-frequency sound waves. Therefore, the low frequency acoustic wave sensor can be used for detection of infrasonic wave signals.
Referring to fig. 1, 5, 6, 7 and 11, in one embodiment of the present invention, a low frequency acoustic wave sensor is provided, comprising:
A housing 10;
An inner cover 40, the inner cover 40 being provided on an inner peripheral wall of the housing 10;
the micro-air pressure sensing component 20, the micro-air pressure sensing component 20 is arranged on the upper surface of the inner cover 40;
The low-frequency sound wave acquisition assembly comprises an inner shell 31, a plurality of blocking pieces 32 and vibrating membranes 33, wherein the vibrating membranes 33 are arranged on the inner wall of the inner shell 31 at intervals along the length direction of the inner shell 31, two adjacent vibrating membranes 33 and the inner shell 31 form a resonant cavity, the blocking pieces are arranged in the resonant cavity to divide the resonant cavity into a first cavity and a second cavity, a first through hole 311 and a second through hole 312 are formed in the inner shell 31, the first through hole 311 is communicated with the first cavity, and the second through hole 312 is communicated with the second cavity;
One end of the first air passage is communicated with the first chamber of the low-frequency sound wave acquisition assembly through a first through hole 311, and the other end of the first air passage is connected with the micro-air pressure sensing assembly 20; and
And one end of the second air passage is communicated with the second cavity of the low-frequency sound wave acquisition assembly through a second through hole, and the other end of the second air passage is connected with the micro-air pressure sensing assembly 20.
Through the setting of low frequency sound wave collection subassembly and little atmospheric pressure sensing subassembly 20 to dispose low frequency sound wave collection subassembly as inner shell 31, separation piece 32 and vibrating diaphragm 33, vibrating diaphragm 33 is a plurality of, and along inner shell 31 length direction interval setting on the inner wall of inner shell 31, adjacent two vibrating diaphragms 33 and inner shell 31 form the resonant cavity, and the separation piece 32 is located in the resonant cavity, divide into first cavity and second cavity with the resonant cavity, and like this two adjacent vibrating diaphragms are as condenser bipolar plate, and the certain distance of interval has formed capacitive device between the vibrating diaphragm. When the vibrating membranes are connected with the low-frequency sound wave signals, the vibrating membranes vibrate, so that the distance between two adjacent vibrating membranes can change, the volumes of the first containing cavity and the second containing cavity change, and the first air pressure and the second air pressure are generated.
Through seting up first through-hole 311 and second through-hole 312 on the inner shell, and first through-hole 311 intercommunication first cavity, second through-hole 312 intercommunication second cavity can be with first atmospheric pressure and second atmospheric pressure by first cavity and second cavity output respectively.
Through the setting of first tracheal and second tracheal to make first tracheal one end pass through first through-hole and connect first cavity, the micro-air pressure sensing subassembly is connected to the other end. One end of the second air pipe is connected with the second chamber through the first through hole, and the other end of the second air pipe is connected with the micro air pressure sensing assembly, so that the first air pressure can be transmitted to the micro air pressure sensing assembly through the first air pipe, and the second air pressure can be transmitted to the micro air pressure sensing assembly 20 through the second air pipe.
The micro air pressure sensing component 20 is used for converting the received first air pressure and the second air pressure into electrical signals, and then the micro air pressure sensing component is connected with a computer, so that the electrical signals can be obtained through the computer, and the detection result is further analyzed.
In summary, the low-frequency acoustic wave signal detected by the vibrating membrane 33 can be converted into the first air pressure and the second air pressure by the cooperation of the low-frequency acoustic wave acquisition assembly 30, the first air pipe, the second air pipe and the micro air pressure sensing assembly 20, the first air pressure and the second air pressure are led into the micro air pressure sensing assembly 20 through the first air pipe and the second air pipe, and finally the first air pressure and the second air pressure are converted into the electric signals through the micro air pressure sensing assembly 20. The resonant cavity is filled with air, the dielectric constant of the air is little changed by temperature, and the air can work stably under the scene of great temperature difference change.
Compared with the piezoelectric type infrasonic wave sensor in the related art, the volume of the vibrating membrane 33 is not required to be increased to overcome the interference of temperature on measurement precision and sensitivity, so that the volume of the whole low-frequency infrasonic wave sensor is reduced, and the manufacturing cost is reduced.
Referring to fig. 1, in one embodiment, a housing 10 includes a housing body 11 and an upper cover 12, wherein one end of the housing body 11 is opened, and the upper cover 12 is covered at the opening.
By providing the housing main body 11 and the upper cover 12, the upper cover 12 can open the housing main body 11 or close the opening of the housing main body 11, so as to replace the micro air pressure sensing assembly 20 provided in the housing main body 11.
Referring to fig. 2, in one specific embodiment, the housing main body 11 further includes a base 13, the base 13 is convexly disposed at the bottom of the housing main body 11, and a positioning hole 131 is formed on the base 13 and is used for being inserted into a positioning rod to realize the installation of the low-frequency acoustic wave sensor.
The positioning rod can be buried in the ground or water in advance according to the use requirement so as to provide an installation position for the low-frequency acoustic wave sensor.
In the related art, a low frequency acoustic wave sensor is generally placed directly on the ground or in water. However, under the interference of external conditions, such as rain, wind or animal activities, the position of the low-frequency acoustic wave sensor changes, resulting in deviation of the measurement range.
Through seting up locating hole 131 on base 13, the locating lever can peg graft on locating hole 131, can reduce the interference of external condition to low frequency acoustic wave sensor, improves low frequency acoustic wave sensor's job stabilization nature.
Referring to fig. 3, in one embodiment, a step portion 113 is provided on an inner wall of the housing main body 11, and the inner cover 40 is provided on the step portion 113.
Wherein the housing main body 11 is constituted by two straight sides and an outwardly convex arc side, the shape of the inner lid 40 is substantially identical to the shape of the housing main body 11, and the area of the inner lid 40 is configured to be slightly smaller than the housing main body 11.
By providing the stepped portion 113 and providing the inner lid 40 on the stepped portion 113, the inner lid 40 can be overlapped on the stepped portion 113, and thus the inner lid 40 and the housing main body 11 can be fixed.
Further, a stepped hole 1131 is formed in the stepped portion 113, and a mounting hole is formed in the inner cap 40, and the mounting hole and the stepped hole 1131 are penetrated by a screw.
The connection of the inner cap 40 and the housing main body 11 is further reinforced by the provision of the stepped hole 1131 with the mounting hole for transportation. And at the time of maintenance, the inner cover 40 can be detached from the housing main body 11 to facilitate the installation and replacement of the micro air pressure sensing assembly 20.
Specifically, the number of stepped holes 1131 and mounting holes is 4. In other embodiments, the number of stepped holes 1131 and mounting holes may be increased or decreased depending on the fastening requirements.
Referring to fig. 4 and 5, in a specific embodiment, a plurality of first positioning cylinders 41 are provided on the upper surface of the inner cap 40, and a second positioning cylinder 121 adapted to the first positioning cylinder 41 is provided on the lower surface of the upper cap 12.
Wherein the number of the first positioning cylinders 41 and the second positioning cylinders 121 is configured to be 4.
Referring to fig. 5, in one embodiment, the micro air pressure sensor assembly 20 includes a circuit board 21, a micro air pressure sensor 22 and a power circuit (not shown), wherein the circuit board 21 is disposed on the upper surface of the inner cover 40; the micro air pressure sensor 22 and the power supply circuit are provided on the circuit board 21.
Wherein, 4 arc-shaped grooves are formed around the circuit board 21, and 4 first positioning cylinders 41 pass through the 4 arc-shaped grooves to fix the circuit board 21.
Through the setting of circuit board 21, micro-air pressure sensor 22 and power supply circuit, circuit board 21 provides the installation carrier for micro-air pressure and power supply circuit, and power supply circuit external power supply is the energy supply of micro-air pressure sensor 22 to realize the low frequency sound wave signal to low frequency sound wave acquisition assembly output.
In one particular embodiment, micro-air pressure sensor 22 is a differential pressure air pressure sensor.
By arranging the differential pressure type air pressure sensor and connecting two interfaces in the differential pressure type air pressure sensor with the first air pipe and the second air pipe respectively, the first air pressure output by the first cavity of the low-frequency sound wave acquisition unit 30 is received, and the second air pressure output by the second cavity of the low-frequency sound wave acquisition unit 30 is received.
Referring to fig. 5, 6 and 7, in one specific embodiment, the inner cover 40 is provided with a first jack and a second jack, the first air channel includes a first air pipe 51 and a first conduit 52, the first air pipe 51 is communicated with the first chamber and the first jack, and the first conduit 52 is communicated with the first jack and an interface of the differential pressure type air pressure sensor; the second air passage comprises a second air pipe 61 and a second conduit 62, the second air pipe 61 is communicated with the second chamber and the second jack, and the second conduit 62 is communicated with the second jack and the other interface of the differential pressure type air pressure sensor.
By providing the first insertion hole and the second insertion hole in the inner cover 40, the first insertion hole provides the installation position for the first air tube 51 and the first conduit 52, and the second insertion hole provides the installation position for the second air tube 61 and the second conduit 62, the housing main body 11 does not need to reserve space for the first air tube 51 and the second air tube 61, and the volume of the low-frequency acoustic wave sensor can be reduced.
In one specific embodiment, first and second protrusions 314 and 315 are formed at opposite sides of the outer circumferential wall of the inner case 31, and third and fourth protrusions 111 and 112 are formed at opposite sides of the inner sidewall of the outer case body 11; the first protruding portion 314 and the third protruding portion 111 constitute the first air pipe 51, and the second protruding portion 315 and the fourth protruding portion 112 constitute the second air pipe 61.
The third protruding part 111 and the fourth protruding part 112 are arranged on two opposite sides of the inner peripheral wall of the outer shell main body 11 of the low-frequency acoustic wave sensor, the first protruding part 314 is used for forming the first air pipe 51 with the third protruding part 111, the second protruding part 315 is used for forming the second air pipe 61 with the third protruding part 111, the first air pipe 51 and the second air pipe 61 are integrally arranged by the inner shell 31 and the outer shell main body 11, no external connecting pipeline is needed, the number of spare parts is reduced, and the assembly difficulty is reduced.
The resonant cavity is formed by an inner shell 31 and barriers 32 at both ends of the inner shell.
Referring to fig. 8, in a specific embodiment, a lap joint portion 313 is formed on the inner peripheral wall of the inner case 10, and the peripheral edge of the diaphragm 33 is disposed on the lap joint portion 313.
The vibrating membrane 33 can be fixed in the inner shell 10 by the arrangement of the lap joint part 313 on the inner peripheral wall of the inner shell 10, so that the vibrating membrane is stable and reliable; in addition, the contact area between the diaphragm 33 and the inner case 10 can be increased, and the sealing effect of the diaphragm 33 can be improved, so that the air pressure signal output from the first chamber and the signal output from the second chamber do not interfere with each other.
Referring to fig. 7, 8 and 9, in an alternative embodiment, a first notch 321 and a second notch 322 are formed in the blocking member 32, and the first notch 321 and the second notch 322 are distributed on two sides of the partition 21.
Specifically, the first through hole 11 is configured to be on the upper side of the first projection 14 of the inner case 10, and the first through hole 11 communicates with the first notch 321; the second through hole 12 is disposed at the lower side of the overlap 13 of the inner case 10, and communicates the second through hole 12 with the second notch 322.
Referring to fig. 10, in one embodiment, the cross section of the diaphragm 33 is corrugated.
The cross section of the vibrating membrane 33 is in a corrugated arrangement, namely, two side surfaces of the vibrating membrane 33 are configured to be uneven, so that the elastic coefficient of a vibrating membrane material can be reduced, the elastic modulus of the material is reduced, the compliance of the vibrating membrane during front-back displacement is improved, namely, the vibrating membrane 33 can capture and vibrate under the action of finer low-frequency sound wave signals, and the acuity of a low-frequency sound wave acquisition assembly is improved.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications of the invention are intended to fall within the scope of the invention.

Claims (7)

1. A low frequency acoustic wave sensor, comprising:
A housing;
an inner cover provided on an inner peripheral wall of the housing;
The micro-air pressure sensing assembly is arranged on the upper surface of the inner cover; the micro air pressure sensing assembly comprises a circuit board, a micro air pressure sensor and a power supply circuit, wherein the circuit board is arranged on the upper surface of the inner cover; the micro air pressure sensor and the power supply circuit are arranged on the circuit board, and the micro air pressure sensor is a differential pressure type air pressure sensor;
The low-frequency sound wave acquisition assembly comprises an inner shell, a plurality of blocking pieces and vibrating membranes, wherein the vibrating membranes are arranged in the inner shell at intervals along the length direction of the inner shell, two adjacent vibrating membranes and the inner shell form a resonant cavity, the blocking pieces are arranged in the resonant cavity and divide the resonant cavity into a first cavity and a second cavity, a first through hole and a second through hole are formed in the inner shell, the first through hole is communicated with the first cavity, and the second through hole is communicated with the second cavity;
One end of the first air passage is communicated with the first cavity of the low-frequency sound wave acquisition assembly through the first through hole, and the other end of the first air passage is connected with the micro-air pressure sensing assembly; and
One end of the second air passage is communicated with a second cavity of the low-frequency sound wave acquisition assembly through the second through hole, and the other end of the second air passage is connected with the micro-air pressure sensing assembly;
The inner cover is provided with a first jack and a second jack, the first air channel comprises a first air pipe and a first guide pipe, the first air pipe is communicated with the first chamber and the first jack, and the first guide pipe is communicated with the first jack and an interface of the differential pressure type air pressure sensor; the second airway comprises a second air pipe and a second conduit, the second air pipe is communicated with the second chamber and the second jack, and the second conduit is communicated with the second jack and the other interface of the differential pressure type air pressure sensor.
2. The low frequency acoustic wave sensor according to claim 1, wherein the first and second projections are formed on opposite sides of the outer peripheral wall of the resonant cavity, and the third and fourth projections are formed on opposite sides of the inner side wall of the housing; the first bulge and the third bulge form the first air pipe, and the second bulge and the fourth bulge form the second air pipe.
3. The low frequency acoustic wave sensor of claim 2, wherein: the shell comprises a shell main body and an upper cover, wherein the upper end of the shell main body is provided with an opening, and the upper cover is used for covering the opening of the shell main body.
4. A low frequency acoustic wave sensor according to claim 3, characterized in that: the inner wall of the shell main body is provided with a step part, and the inner cover is arranged on the step part.
5. A low frequency acoustic wave sensor according to claim 3, characterized in that: the bottom of the shell main body protrudes downwards to form a base, and a positioning hole is formed in the base.
6. A low frequency acoustic wave sensor according to claim 3, characterized in that: the upper surface of the inner cover is provided with a plurality of first positioning barrels, and the lower surface of the upper cover is provided with a second positioning barrel which is matched with the first positioning barrel.
7. The low frequency acoustic wave sensor of claim 1, wherein the cross section of the diaphragm is corrugated.
CN202211208368.8A 2022-09-30 2022-09-30 Low-frequency acoustic wave sensor Active CN115615535B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211208368.8A CN115615535B (en) 2022-09-30 2022-09-30 Low-frequency acoustic wave sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211208368.8A CN115615535B (en) 2022-09-30 2022-09-30 Low-frequency acoustic wave sensor

Publications (2)

Publication Number Publication Date
CN115615535A CN115615535A (en) 2023-01-17
CN115615535B true CN115615535B (en) 2024-04-30

Family

ID=84861501

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211208368.8A Active CN115615535B (en) 2022-09-30 2022-09-30 Low-frequency acoustic wave sensor

Country Status (1)

Country Link
CN (1) CN115615535B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012127759A (en) * 2010-12-14 2012-07-05 Murata Mfg Co Ltd Impact and acoustic sensor
WO2014201750A1 (en) * 2013-06-17 2014-12-24 北京大学深圳研究生院 System for monitoring imminent earthquake and installation method therefor
CN104483012A (en) * 2014-12-05 2015-04-01 南京俏声波动科技有限公司 All-weather low-frequency acoustic sensor
CN104596637A (en) * 2015-01-26 2015-05-06 深圳职业技术学院 Calabash-shaped resonant cavity sensor collecting infrasonic waves by aid of pressure, and demonstration device
CN105387925A (en) * 2014-08-20 2016-03-09 韩国地质资源研究院 Apparatus for detecting infrasound
CN206459744U (en) * 2017-02-21 2017-09-01 万季梅 Infrasound sensor and corresponding caliberating device
CN110579269A (en) * 2019-08-14 2019-12-17 中国地震局地壳应力研究所 infrasonic wave sensor for rarefied atmosphere space and sound detection load cabin
CN110832293A (en) * 2017-06-30 2020-02-21 雅马哈株式会社 Vibration sensor
CN111780862A (en) * 2020-07-20 2020-10-16 中国计量大学 Very low frequency self-contained piezoelectric hydrophone

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012127759A (en) * 2010-12-14 2012-07-05 Murata Mfg Co Ltd Impact and acoustic sensor
WO2014201750A1 (en) * 2013-06-17 2014-12-24 北京大学深圳研究生院 System for monitoring imminent earthquake and installation method therefor
CN105387925A (en) * 2014-08-20 2016-03-09 韩国地质资源研究院 Apparatus for detecting infrasound
CN104483012A (en) * 2014-12-05 2015-04-01 南京俏声波动科技有限公司 All-weather low-frequency acoustic sensor
CN104596637A (en) * 2015-01-26 2015-05-06 深圳职业技术学院 Calabash-shaped resonant cavity sensor collecting infrasonic waves by aid of pressure, and demonstration device
CN206459744U (en) * 2017-02-21 2017-09-01 万季梅 Infrasound sensor and corresponding caliberating device
CN110832293A (en) * 2017-06-30 2020-02-21 雅马哈株式会社 Vibration sensor
CN110579269A (en) * 2019-08-14 2019-12-17 中国地震局地壳应力研究所 infrasonic wave sensor for rarefied atmosphere space and sound detection load cabin
CN111780862A (en) * 2020-07-20 2020-10-16 中国计量大学 Very low frequency self-contained piezoelectric hydrophone

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
基于次声波法的输气管道泄漏检测技术研究;万顺;《中国优秀硕士学位论文全文数据库信息科技辑》;20141031(第10期);第16-35页 *

Also Published As

Publication number Publication date
CN115615535A (en) 2023-01-17

Similar Documents

Publication Publication Date Title
CN111131988B (en) Vibration sensor and audio device
CN108513241B (en) Vibration sensor and audio device
US7136500B2 (en) Electret condenser microphone
CN212086490U (en) Vibration sensor and electronic device
CN212572961U (en) Vibration sensor and audio equipment with same
CN218679379U (en) Vibration sensor
US7383737B1 (en) Capacitive pressure sensor
US11317184B2 (en) Vibration sensor and audio device
CN210464558U (en) Sensor
CN105891878B (en) A kind of shock sensor
US6753583B2 (en) Electrostatic electroacoustical transducer
CN218679382U (en) Vibration sensor
CN205946166U (en) Single directional pickup silicon microphone
US11895452B2 (en) Bone conduction microphone
CN214177566U (en) Capacitance microphone
CN115615535B (en) Low-frequency acoustic wave sensor
CN212110308U (en) Vibration detection structure, bone voiceprint sensor and electronic device
EP2113760A1 (en) Capacitive pressure sensor
CN101995289A (en) Ultralow frequency broadband capacitive infrasound sensor
CN218679380U (en) Vibration sensor
CN115655393A (en) MEMS airflow sensor
CN213094485U (en) MEMS microphone
CN218584186U (en) Low-frequency sound wave acquisition unit and low-frequency sound wave acquisition assembly
CN1839415A (en) Small smog alarm
WO2022000853A1 (en) Vibration sensor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant