CN115615135B - Cooling device capable of being overturned in multiple directions for semiconductor production - Google Patents
Cooling device capable of being overturned in multiple directions for semiconductor production Download PDFInfo
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- CN115615135B CN115615135B CN202211645697.9A CN202211645697A CN115615135B CN 115615135 B CN115615135 B CN 115615135B CN 202211645697 A CN202211645697 A CN 202211645697A CN 115615135 B CN115615135 B CN 115615135B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention belongs to the field of semiconductor production, and particularly relates to a cooling device capable of overturning in multiple directions for semiconductor production, which comprises a device shell, wherein a servo motor is fixedly welded on the side end face of the device shell, a fixing frame is fixedly welded on an output shaft of the servo motor, a connecting shaft is fixedly welded on the fixing frame, the other end of the connecting shaft is rotatably connected in the device shell, a multi-direction overturning mechanism, a circulating cooling assembly and a recycling filtering assembly are arranged in the device shell, and a clamping assembly is arranged on the fixing frame.
Description
Technical Field
The invention relates to the field of semiconductor production, in particular to a cooling device capable of being turned in multiple directions for semiconductor production.
Background
Semiconductor materials include silicon, germanium, gallium arsenide and the like, and can be widely applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination applications and the like, in the production process of semiconductors, when electrical testing is performed on semiconductor devices, a large amount of heat is often generated on the surface of the semiconductor, when the surface of the semiconductor focuses on excessive heat, the internal structure of the semiconductor is consumed or damaged, and therefore a cooling device needs to be combined to perform cooling treatment on the semiconductor after the electrical testing, the requirements of semiconductor processing production are met, and most of the existing cooling devices have some problems in use.
Conventional cooling device can not carry out convenient stable diversified upset work to the semiconductor in the course of the work, and then can not guarantee the follow-up comprehensive even stable cooling work of semiconductor, and conventional cooling device can not carry out rapid stabilization's cooling treatment work simultaneously to semiconductor in batches simultaneously in the course of the work, and the practicality is relatively poor, consequently need provide a cooling device for semiconductor production that can diversely overturn and satisfy user's demand.
Disclosure of Invention
The invention provides a cooling device for semiconductor production, which can be turned in multiple directions.
In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions: the utility model provides a cooling device for semiconductor manufacture that can diversely overturn, includes the device shell, welded fastening has servo motor on the side end face of device shell, welded fastening has fixed frame on servo motor's the output shaft, welded fastening has the connecting axle on the fixed frame, the other end of connecting axle rotates to be connected in the device shell, install diversified tilting mechanism, circulative cooling subassembly and retrieve filtering component in the device shell, install the centre gripping subassembly on the fixed frame.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device for semiconductor production comprises: the output shaft and the connecting shaft of the servo motor are both fixed at the middle part of the side end of the fixed frame, and the multi-directional turnover mechanism and the clamping assembly are both distributed on two sides of the fixed frame in a centrosymmetric manner.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device for semiconductor production comprises: diversified tilting mechanism includes the fixed plate, fixed plate welded fastening is on the inside side terminal surface of device shell, welded fastening has the tooth piece on the fixed plate, the meshing is connected with circular gear on the tooth piece, circular gear welded fastening is in the bottom of fixed axle, the fixed axle rotates to be connected in fixed frame, the top of fixed axle is connected with first drive belt, the other end of first drive belt is connected in the axis of rotation, axis of rotation welded fastening is on fixed frame, axis of rotation female connection has the threaded rod.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device comprises: the central axis of the fixed plate, the central axis of the servo motor output shaft and the central axis of the connecting shaft are all located on the same horizontal central line, the tooth blocks and other angles are distributed on the fixed plate, the diameter of the circular gear is larger than the thickness of the fixed frame, the diameter of the circular gear is smaller than the width of the fixed frame, and the rotating shaft is fixed in the middle of the end of the fixed frame.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device for semiconductor production comprises: the centre gripping subassembly includes grip block and flexible loop bar, the grip block rotates the bottom of connection at the threaded rod, the screw connection has the rubber slab on the grip block, the constant head tank has been seted up on the rubber slab, the top welded fastening of flexible loop bar is in the bottom of axis of rotation, the bottom welded fastening of flexible loop bar is on the grip block.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device for semiconductor production comprises: the length and the width of rubber slab equal with the length and the width of grip block respectively, the constant head tank equidistance distributes on the rubber slab, the middle part at the grip block is connected to the threaded rod, flexible loop bar symmetric distribution is in the both sides of grip block, the length of grip block is less than the inner space width of fixed frame.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device comprises: the circulative cooling subassembly includes the storage frame, storage frame welded fastening is on servo motor's output shaft and connecting axle, bolted mounting has the connection shower nozzle on the storage frame, the storage frame rotates through sealed the rotation and is connected with the go-between, bolted connection has the conveyer pipe on the go-between, flange joint has small-size water pump on the conveyer pipe, the bottom bolted connection of conveyer pipe is in the bottom of device shell, the installation is fixed with the cooling tube on the inside bottom face of device shell.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device comprises: the inner diameter of the connecting ring is larger than the diameter of the connecting shaft, the connecting ring is connected to the middle of the storage frame, the connecting nozzles are distributed on the storage frame at equal angles, the bottom end face of the conveying pipe is flush with the bottom end face of the inner portion of the device shell, and the cooling pipe is in a continuous S shape.
As a preferred scheme of the cooling device for semiconductor production, which can be overturned in multiple directions, the cooling device for semiconductor production comprises: the recycling filter assembly comprises a filter screen plate, the filter screen plate is welded and fixed in a device shell, a reciprocating screw rod is connected in the filter screen plate in a rotating mode, a linking push plate is connected to the reciprocating screw rod in a threaded mode, the linking push plate is connected to the filter screen plate in a limiting sliding mode, a second transmission belt is connected to the reciprocating screw rod, and the other end of the second transmission belt is connected to a connecting shaft.
Compared with the prior art, the invention has the beneficial effects that:
1. be provided with diversified tilting mechanism, utilize the drive coordination of servo motor and connecting axle to and the meshing cooperation between tooth piece and the circular gear, in fixed frame revolution, drive each semiconductor on its inside centre gripping subassembly and carry out the rotation, can drive the semiconductor and carry out the diversified upset work of continuous stability, and then can guarantee comprehensive and high-efficient of follow-up cooling work, thereby can effectively improve the work efficiency of device.
2. Be provided with the centre gripping subassembly, utilize the rotation of threaded rod, through each constant head tank on grip block and the rubber slab, can carry out stable equidistant centre gripping location work in batches to a plurality of semiconductors simultaneously, and then can guarantee the follow-up diversified upset of each semiconductor and the stability and the high efficiency of cooling work to can effectively improve the use high efficiency of device.
3. Be provided with the circulative cooling subassembly, utilize the cooperation of small-size water pump and cooling tube, can the stable circulation of coolant liquid of suction device shell bottom carry to the storage frame in, the storage frame that can drive both sides is stable to be rotated under the drive mating reaction of servo motor and connecting axle this moment, combines each to connect the shower nozzle and can carry out comprehensive even high-efficient cooling work to each semiconductor, has effectively improved the cooling rate of semiconductor, has increased the use variety of device.
4. Be provided with and retrieve filtering component, the coolant liquid is at the circulation in-process, can carry out the filtration work of automatic stabilization to the impurity in the coolant liquid under the effect of filter plate, meanwhile, the connecting axle can drive reciprocal lead screw through the second drive belt and stably rotate, and then can drive and link up the push pedal and carry out the reciprocating motion of automatic stabilization on filter plate, thereby can promote impurity to avris, make things convenient for staff's follow-up recovery processing work, simultaneously can effectively avoid filter plate to take place to block up in long-time working process, the safety in utilization of device has effectively been increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise. Wherein:
FIG. 1 is a schematic view of the overall structure of a cooling device for semiconductor manufacturing, which can be flipped in multiple directions;
FIG. 2 is a schematic view of a rubber plate of a cooling device for semiconductor production, which can be flipped in multiple directions;
FIG. 3 is a schematic view of the overall structure of a cooling apparatus for semiconductor manufacturing, which can be flipped in multiple directions;
FIG. 4 is a schematic view of a cooling apparatus for semiconductor manufacturing according to the present invention, which can be flipped in multiple directions, shown in FIG. 3;
FIG. 5 is a schematic side view of a fixing frame of a cooling device for semiconductor manufacturing, which can be flipped in multiple directions according to the present invention;
FIG. 6 is a schematic diagram of a side view of a tooth block of a cooling device for semiconductor production, which can be flipped in multiple directions;
FIG. 7 is a schematic diagram of a side view of a cooling device connecting nozzle capable of being flipped in multiple directions for semiconductor manufacturing according to the present invention;
FIG. 8 is a schematic side view of a connection ring of a cooling device for semiconductor manufacturing according to the present invention, which can be flipped in multiple directions;
FIG. 9 is a schematic top view of a cooling device engaging push plate for semiconductor manufacturing, which can be flipped in multiple directions.
Reference numbers in the figures: 1. a device housing; 2. a servo motor; 3. a fixing frame; 4. a connecting shaft; 5. a multi-directional turnover mechanism; 501. a fixing plate; 502. a tooth block; 503. a circular gear; 504. a fixed shaft; 505. a first drive belt; 506. a rotating shaft; 6. a threaded rod; 7. a clamping assembly; 701. a clamping plate; 702. a rubber plate; 703. positioning a groove; 704. a telescopic loop bar; 8. a circulating cooling assembly; 801. a storage frame; 802. connecting the spray head; 803. a connecting ring; 804. a delivery pipe; 805. a small-sized water pump; 806. a cooling tube; 9. a recovery filter assembly; 901. a filter screen plate; 902. a reciprocating screw rod; 903. connecting the push plate; 10. a second belt.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and it will be apparent to those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the drawings, wherein for convenience of illustration, the cross-sectional view of the device structure is not enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Examples
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and 3, a cooling device for semiconductor production that can diversely overturn, includes device shell 1, welded fastening has servo motor 2 on the side end face of device shell 1, welded fastening has fixed frame 3 on servo motor 2's the output shaft, welded fastening has connecting axle 4 on the fixed frame 3, the other end of connecting axle 4 rotates to be connected in device shell 1, install diversely tilting mechanism 5 in the device shell 1, circulation cooling module 8 and retrieve filtering component 9, install centre gripping subassembly 7 on the fixed frame 3.
The output shaft of servo motor 2 and connecting axle 4 all fix the side middle part at fixed frame 3, and diversified tilting mechanism 5 and centre gripping subassembly 7 all are the central symmetric distribution in the both sides of fixed frame 3, utilize servo motor 2 and connecting axle 4's drive cooperation.
Carry out the rotation through diversified tilting mechanism 5 when driving each semiconductor revolution on its inside centre gripping subassembly 7, and then can drive the semiconductor and carry out the diversified upset work that lasts stable, cooperation circulative cooling subassembly 8 can carry out comprehensive and efficient cooling work to the semiconductor to utilize and retrieve filtering component 9 and can carry out the automatic stabilization's filter work to the impurity in the coolant liquid, effectively increased the work efficiency and the safety in utilization of device.
As shown in fig. 3, in this example, the multi-directional turnover mechanism 5 includes a fixing plate 501, the fixing plate 501 is welded and fixed on the inner side end surface of the device housing 1, a tooth block 502 is welded and fixed on the fixing plate 501, a circular gear 503 is engaged and connected on the tooth block 502, the circular gear 503 is welded and fixed on the bottom end of a fixing shaft 504, the fixing shaft 504 is rotatably connected in the fixing frame 3, the top end of the fixing shaft 504 is connected with a first transmission belt 505, the other end of the first transmission belt 505 is connected on a rotating shaft 506, the rotating shaft 506 is welded and fixed on the fixing frame 3, and a threaded rod 6 is screwed in the rotating shaft 506.
By means of the transmission of the first transmission belt 505, the revolution of the fixing frame 3 can be stably transmitted to the rotation of the semiconductor, and the subsequent cooling efficiency can be effectively improved.
As shown in fig. 5 and 6, the central axis of the fixing plate 501, the central axis of the output shaft of the servo motor 2, and the central axis of the connecting shaft 4 are all located on the same horizontal central line, the matching between the output shaft of the servo motor 2 and the connecting shaft 4 can ensure the stability and safety of the rotating work of the fixing frame 3, the tooth blocks 502 are distributed on the fixing plate 501 at equal angles, the diameter of the circular gear 503 is greater than the thickness of the fixing frame 3, the adverse effect of the fixing frame 3 on the circular gear 503 can be effectively avoided, and further the stability of the subsequent meshing work of the circular gear 503 and the tooth blocks 502 can be ensured, the diameter of the circular gear 503 is less than the width of the fixing frame 3, the rotating shaft 506 is fixed in the middle part of the end part of the fixing frame 3, the stability of the connection state of the threaded rod 6 in the rotating shaft 506 can be ensured, and further the stability and convenience of the subsequent clamping work can be ensured, and the stability and safety of the subsequent turning and cooling work can be ensured.
As shown in fig. 3 and fig. 4, in this example, the clamping assembly 7 includes a clamping plate 701 and a telescopic sleeve rod 704, the clamping plate 701 is rotatably connected to the bottom end of the threaded rod 6, a rubber plate 702 is screwed on the clamping plate 701, a positioning groove 703 is formed on the rubber plate 702, the top end of the telescopic sleeve rod 704 is welded and fixed to the bottom end of the rotating shaft 506, and the bottom end of the telescopic sleeve rod 704 is welded and fixed to the clamping plate 701.
Under the limiting action of the telescopic sleeve rod 704, the clamping plate 701 can be guaranteed to perform convenient and stable movement work under the rotating action of the threaded rod 6, and then the stability of subsequent clamping work can be guaranteed.
As shown in the combined figure 2, the length and the width of the rubber plate 702 are respectively equal to those of the clamping plate 701, the positioning grooves 703 are equidistantly distributed on the rubber plate 702, convenient and stable batch equidistant clamping work can be performed on a plurality of semiconductors by utilizing the positioning grooves 703, and then the high efficiency and the stability of the subsequent cooling work of the semiconductors can be ensured, the threaded rod 6 is connected to the middle part of the clamping plate 701, the telescopic sleeve rods 704 are symmetrically distributed on two sides of the clamping plate 701, the length of the clamping plate 701 is smaller than the width of the inner space of the fixed frame 3, the adverse effect of the clamping plate 701 on the fixed frame 3 can be effectively avoided, and the stability and the convenience of the subsequent batch clamping work of the semiconductors can be ensured.
As shown in fig. 7 and 8, in this example, the circulation cooling assembly 8 includes a storage frame 801, the storage frame 801 is welded and fixed on the output shaft of the servo motor 2 and the connecting shaft 4, a connecting nozzle 802 is bolted on the storage frame 801, a connecting ring 803 is rotationally connected on the storage frame 801 through sealing, a delivery pipe 804 is bolted on the connecting ring 803, as shown in fig. 3, a small water pump 805 is flanged on the delivery pipe 804, the bottom end of the delivery pipe 804 is bolted on the bottom of the device housing 1, and a cooling pipe 806 is fixed on the inner bottom end face of the device housing 1.
The cooling pipe 806 can be used to cool the circulated cooling liquid continuously and uniformly, so that the stability of the long-time working state of the cooling liquid can be ensured.
The internal diameter of connecting ring 803 is greater than the diameter of connecting axle 4, and connecting ring 803 is connected in the middle part of storage frame 801, connects shower nozzle 802 etc. angular distribution on storage frame 801, utilizes a plurality of connection shower nozzles 802 of both sides can carry out high-efficient even coolant liquid spraying work to semiconductor in batches, and then can guarantee follow-up cooling work' S high efficiency and even, and the bottom face of conveyer pipe 804 is parallel and level with the inside bottom face of device shell 1, and cooling tube 806 is continuous "S" shape.
The S-shaped cooling pipe 806 can effectively improve the cooling rate, so that the cooling effect of the semiconductor can be effectively improved, and the working efficiency of the device is improved.
As shown in fig. 3 and fig. 9, in this example, the recovery filter assembly 9 includes a filter screen plate 901, the filter screen plate 901 is welded and fixed in the device housing 1, a reciprocating screw 902 is connected in the filter screen plate 901 in a rotating manner, a linking push plate 903 is connected to the reciprocating screw 902 in a threaded manner, the linking push plate 903 is connected to the filter screen plate 901 in a limited sliding manner, a second belt 10 is connected to the reciprocating screw 902, and the other end of the second belt 10 is connected to the connecting shaft 4.
The stability of the working state of the linking push plate 903 on the reciprocating screw rod 902 is ensured, and then the stability and the safety of the long-time filtering work of the filter screen plate 901 can be ensured, so that the stability of the subsequent cooling work can be ensured.
It should be noted that the present invention is a cooling device for semiconductor production, which can be turned in multiple directions, and firstly, an operator can place the semiconductors to be cooled one by one in each positioning groove 703 on a rubber plate 702, and then the operator can rotate threaded rods 6 in rotating shafts 506 on two sides of a fixed frame 3, and then under the rotating action of the threaded rods 6 on two sides and the limiting and guiding action of a telescopic sleeve 704, the clamping plates 701 on the threaded rods 6 on two sides can be ensured to move towards the middle in the fixed frame 3 at the same time, and at this time, under the action of each positioning groove 703 on the rubber plate 702, batch stable and equidistant clamping and positioning work can be simultaneously performed on a plurality of semiconductors, so that the stability and high efficiency of the subsequent multi-direction turning and cooling work of each semiconductor can be ensured.
Then, the worker can open the servo motor 2 and the small water pump 805 under control, at this time, under the action of the servo motor 2, the fixed frame 3 can be driven by the output shaft to stably rotate in the device housing 1, at this time, the fixed frame 3 can drive the connecting shaft 4 to stably rotate in the device housing 1, and under the rotating action of the fixed frame 3, each semiconductor stably clamped can be driven to stably revolve, meanwhile, under the rotating action of the fixed frame 3, the circular gear 503 on the fixed shaft 504 can be driven to stably revolve and rotate, at this time, in the rotating process of the circular gear 503, the circular gear 503 can be driven to stably rotate by the meshing action of the tooth blocks 502 on the fixed plate 501, at this time, each semiconductor stably clamped on the clamping plate 701 can be driven to stably rotate in multiple directions by the first driving belt 505 on the fixed shaft 504, at this time, under the rotating action of the rotating shaft 506, each semiconductor stably clamped on the clamping plate 701 can be driven by the threaded rod 6 and the telescopic rod 704 to stably rotate in multiple directions, and further, so that comprehensive and efficient cooling work can be ensured.
In the process of multidirectional overturning of semiconductors, under the action of a small water pump 805, cooling liquid at the bottom of the device shell 1 can be sucked and conveyed into the storage frame 801 through the cooling pipe 806, at the moment, the storage frames 801 at two sides can be driven to rotate simultaneously under the driving cooperation effect of the servo motor 2 and the connecting shaft 4, the cooling pipe 806 can be sprayed on each semiconductor comprehensively and uniformly by combining each connecting spray nozzle 802, and further, each semiconductor can be cooled and cooled efficiently, used cooling liquid can fall to the bottom of the device shell 1 through the filter screen plate 901, and can be cooled again through the cooling pipe 806, so that the recycling work of the cooling liquid is completed, and under the action of the filter screen plate 901, impurities in the cooling liquid can be automatically and stably filtered, meanwhile, the connecting shaft 4 can drive the reciprocating screw rod 902 to stably rotate through the second driving belt 10, and further can drive the push plate 903 to automatically and stably reciprocate on the filter screen plate 901, so that the impurities filtered by the filter screen plate 901 can be pushed to the side, the subsequent recovery work of workers is facilitated, meanwhile, the filter screen plate can be effectively prevented from being blocked in the subsequent work, and the subsequent work of the filter screen plate can be prevented from being blocked effectively for a long time.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of the invention may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. The utility model provides a cooling device for semiconductor manufacture that can diversely overturn, includes device shell (1), its characterized in that: the device is characterized in that a servo motor (2) is fixedly welded on the side end face of the device shell (1), a fixed frame (3) is fixedly welded on an output shaft of the servo motor (2), a connecting shaft (4) is fixedly welded on the fixed frame (3), the other end of the connecting shaft (4) is rotatably connected in the device shell (1), a multi-directional turnover mechanism (5), a circulating cooling assembly (8) and a recycling filtering assembly (9) are installed in the device shell (1), and a clamping assembly (7) is installed on the fixed frame (3);
the multi-directional turnover mechanism (5) comprises a fixing plate (501), the fixing plate (501) is welded and fixed on the end face of the inner side of the device shell (1), a tooth block (502) is welded and fixed on the fixing plate (501), a circular gear (503) is meshed and connected onto the tooth block (502), the circular gear (503) is welded and fixed at the bottom end of a fixing shaft (504), the fixing shaft (504) is rotatably connected into the fixing frame (3), a first transmission belt (505) is connected to the top end of the fixing shaft (504), the other end of the first transmission belt (505) is connected onto a rotating shaft (506), the rotating shaft (506) is welded and fixed onto the fixing frame (3), and a threaded rod (6) is connected to the rotating shaft (506) in a threaded manner;
the central axis of the fixing plate (501), the central axis of the output shaft of the servo motor (2) and the central axis of the connecting shaft (4) are all located on the same horizontal central line, the tooth blocks (502) are distributed on the fixing plate (501) at equal angles, the diameter of the circular gear (503) is larger than the thickness of the fixing frame (3), the diameter of the circular gear (503) is smaller than the width of the fixing frame (3), and the rotating shaft (506) is fixed in the middle of the end part of the fixing frame (3);
the clamping assembly (7) comprises a clamping plate (701) and a telescopic loop bar (704), the clamping plate (701) is rotatably connected to the bottom end of the threaded rod (6), a rubber plate (702) is connected to the clamping plate (701) through a screw, a positioning groove (703) is formed in the rubber plate (702), the top end of the telescopic loop bar (704) is fixedly welded to the bottom end of the rotating shaft (506), and the bottom end of the telescopic loop bar (704) is fixedly welded to the clamping plate (701);
the length and the width of the rubber plate (702) are respectively equal to those of the clamping plate (701), the positioning grooves (703) are equidistantly distributed on the rubber plate (702), the threaded rod (6) is connected to the middle of the clamping plate (701), the telescopic loop bars (704) are symmetrically distributed on two sides of the clamping plate (701), and the length of the clamping plate (701) is smaller than the width of the inner space of the fixing frame (3);
at the moment, under the action of a servo motor (2), a fixed frame (3) is driven by an output shaft to rotate in a device shell (1), the fixed frame (3) drives a connecting shaft (4) to rotate in the device shell (1), each semiconductor which is stably clamped is driven to revolve under the rotating action of the fixed frame (3), a circular gear (503) on a fixed shaft (504) is driven to revolve to rotate under the rotating action of the fixed frame (3), the circular gear (503) is driven to rotate under the meshing action of each tooth block (502) on a fixed plate (501) in the rotating process of the circular gear (503), the circular gear (503) drives a rotating shaft (506) to rotate on the fixed frame (3) through a first transmission belt (505) on the fixed shaft (504), and each semiconductor on the clamping plate (701) can be driven to rotate under the rotating action of the rotating shaft (506) through a threaded rod (6) and a telescopic sleeve rod (704).
2. The cooling device capable of being overturned in multiple directions as claimed in claim 1, wherein: the output shaft and the connecting shaft (4) of the servo motor (2) are fixed at the middle part of the side end of the fixed frame (3), and the multi-directional turnover mechanism (5) and the clamping assembly (7) are both distributed on two sides of the fixed frame (3) in a centrosymmetric manner.
3. The cooling device for semiconductor production capable of being flipped in multiple directions as claimed in claim 1, wherein: circulative cooling subassembly (8) is including storing frame (801), storage frame (801) welded fastening is on output shaft and connecting axle (4) of servo motor (2), bolted mounting is gone up in storage frame (801) connects shower nozzle (802), storage frame (801) rotate through sealed and are connected with go-between (803), bolted connection is gone up in go-between (803) has conveyer pipe (804), flange joint has small-size water pump (805) on conveyer pipe (804), the bottom bolted connection of conveyer pipe (804) is in the bottom of device shell (1), installation is fixed with cooling tube (806) on the inside bottom face of device shell (1).
4. The cooling device for semiconductor production capable of being flipped in multiple directions as claimed in claim 3, wherein: the inner diameter of the connecting ring (803) is larger than the diameter of the connecting shaft (4), the connecting ring (803) is connected to the middle part of the storage frame (801), the connecting spray heads (802) are distributed on the storage frame (801) at equal angles, the bottom end face of the conveying pipe (804) is flush with the inner bottom end face of the device shell (1), and the cooling pipe (806) is in a continuous S shape.
5. The cooling device for semiconductor production capable of being flipped in multiple directions as claimed in claim 1, wherein: the recycling filter assembly (9) comprises a filter screen plate (901), the filter screen plate (901) is welded and fixed in a device shell (1), a reciprocating screw rod (902) is connected in the filter screen plate (901) in a rotating mode, a linking push plate (903) is connected to the reciprocating screw rod (902) in a threaded mode, the linking push plate (903) is connected to the filter screen plate (901) in a limiting sliding mode, a second transmission belt (10) is connected to the reciprocating screw rod (902), and the other end of the second transmission belt (10) is connected to a connecting shaft (4).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211645697.9A CN115615135B (en) | 2022-12-21 | 2022-12-21 | Cooling device capable of being overturned in multiple directions for semiconductor production |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211645697.9A CN115615135B (en) | 2022-12-21 | 2022-12-21 | Cooling device capable of being overturned in multiple directions for semiconductor production |
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| CN115615135A CN115615135A (en) | 2023-01-17 |
| CN115615135B true CN115615135B (en) | 2023-03-14 |
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