CN115606876A - Atomizing core preparation method and electronic cigarette atomizer - Google Patents
Atomizing core preparation method and electronic cigarette atomizer Download PDFInfo
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- CN115606876A CN115606876A CN202211362408.4A CN202211362408A CN115606876A CN 115606876 A CN115606876 A CN 115606876A CN 202211362408 A CN202211362408 A CN 202211362408A CN 115606876 A CN115606876 A CN 115606876A
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Images
Classifications
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/70—Manufacture
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
- A24F40/46—Shape or structure of electric heating means
Landscapes
- Electrostatic Spraying Apparatus (AREA)
Abstract
The invention is applicable to the field of electronic cigarette atomizers and provides an atomizing core preparation method and an electronic cigarette atomizer. The preparation method of the atomization core comprises the following steps: preparing a ceramic matrix; printing or spraying electrode slurry on the ceramic substrate, wherein the electrode slurry is sintered to form two electrodes, and the two electrodes surround to form an atomization surface; and spraying a heating film on the atomization surface to form an atomization core. According to the preparation method of the atomizing core, the coating of the electrode does not influence the preparation of the subsequent heating film, so that the forming quality of the heating film is guaranteed, and the atomizing effect of the atomizing core is further guaranteed.
Description
Technical Field
The invention belongs to the field of electronic cigarette atomizers, and particularly relates to an atomizing core preparation method and an electronic cigarette atomizer.
Background
Atomizing core applies to electron cigarette, including drain structure and heating structure. The liquid guide structure is generally porous ceramic, and porous ceramic guides the tobacco tar to heating structure department, and heating structure makes the tobacco tar produce the phase transition atomizing through the heating. The heating structure comprises a heating body and an electrode, wherein the heating body can be a heating wire or a heating film, and the electrode can be filamentous or flaky.
The invention relates to an atomizing core, wherein a heating body is a heating film, and an electrode is of a sheet structure covering the heating film. In the existing design, for the preparation of the atomizing core, a ceramic matrix is generally prepared, then a heating film is added on the ceramic matrix, and then an electrode is coated on the ceramic matrix. The electrode is covered on the heating film by generally adopting a screen printing process or a spraying process, and the conditions of blocking a die hole of the heating film and the like are easily caused by exceeding a design area in the screen printing or spraying process, so that the atomization effect of the atomization core is further influenced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an atomizing core preparation method and an electronic cigarette atomizer, and aims to solve the problem that electrode preparation in the existing preparation method has adverse effects on a heating film.
The invention provides a preparation method of an atomization core, which comprises the following steps:
s1: preparing a ceramic matrix;
s2: printing or spraying electrode slurry on the atomized matrix, wherein the electrode slurry is sintered to form two electrodes, and the two electrodes surround to form an atomized surface;
s3: and spraying a heating film on the atomization surface to form an atomization core.
Optionally, in step S3, a heating film is sprayed after a transition film is sprayed on the atomized surface, where the transition film is a titanium or chromium metal film.
Optionally, in step S1, the ceramic slurry is shaped and then sintered at 600-650 ℃ to form a ceramic matrix;
in step S2, the sintering temperature is 500-550 ℃;
in step S3, a heating film is sprayed on the atomization surface, and an atomization core is formed after annealing at 300-500 ℃ in nitrogen or vacuum.
Optionally, in step S1, the ceramic slurry is shaped and then sintered at 900-1100 ℃ to form a ceramic matrix;
in step S2, the sintering temperature is 700-900 ℃;
in step S3, a heating film is sprayed on the atomization surface, and an atomization core is formed after annealing at 500-700 ℃ in nitrogen or vacuum.
Optionally, between step S1 and step S2, the method further includes: carrying out ultrasonic cleaning on the ceramic substrate and then drying; between step S2 and step S3, further comprising: and carrying out plasma cleaning on the ceramic substrate covered with the electrode.
Optionally, in step S3: the thickness of the heating film is not more than 10 micrometers.
Optionally, in step S3: and spraying a heating film on the ceramic substrate by a precision spraying process or a magnetron sputtering coating or evaporation coating process.
Optionally, the horizontal projection of the heating film is arranged in the ceramic substrate, and a gap exists between the edge side of the heating film and the ceramic substrate.
Optionally, the ceramic substrate includes a substrate and a boss, the substrate and the boss are integrally disposed, the electrode and the heating film are disposed on a surface of the boss departing from the substrate, and a gap is left between the boss and the edge of the substrate.
The invention also provides an electronic cigarette atomizer which comprises the atomizing core, wherein the atomizing core is prepared by the atomizing core preparation method.
According to the preparation method of the atomizing core, the coating step of the electrode is arranged before the coating step of the heating film, and the subsequent preparation of the heating film cannot be influenced by silk-screen printing or spraying of the electrode, so that the forming quality of the heating film is guaranteed, and the atomizing effect of the atomizing core is further guaranteed.
According to the electronic cigarette atomizer provided by the invention, the atomizing core adopts the heating film and the electrode as a structural form for heating atomized liquid, so that the atomizing core has the advantages of large atomizing area and uniform temperature, the phenomena of carbon deposition and liquid leakage cannot be generated while high smoke amount is ensured, and the problems of scorched smell and the like are avoided. In addition, because the atomizing surface does not have unbalanced thermal stress under high-temperature work, the risks of ceramic substrate fracture and heating film open circuit are effectively reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a method of making an atomizing core according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a second configuration of an atomizing core according to an embodiment of the present invention, in which the dotted line represents the boundary position of the electrode;
FIG. 3 is a disassembled schematic view of the structure of FIG. 2;
FIG. 4 is a schematic view of a first configuration of an atomizing core according to an embodiment of the present invention, wherein the dotted line represents the boundary position of the electrode;
FIG. 5 is a schematic view of a third configuration of an atomizing core in accordance with an embodiment of the present invention, wherein the dotted line represents the boundary position of the electrodes;
FIG. 6 is a schematic view showing a fourth structure of an atomizing core according to a first embodiment of the present invention, wherein the dotted line represents the boundary position of the electrode;
FIG. 7 is a schematic diagram of a fifth configuration of an atomizing core in accordance with an embodiment of the present invention, wherein the dotted line represents the boundary position of the electrode;
FIG. 8 is a schematic view of a sixth configuration of an atomizing core according to an embodiment of the present invention, wherein the dotted line represents the boundary position of the electrode;
FIG. 9 is a schematic view of a seventh configuration of an atomizing core in accordance with an embodiment of the present invention, wherein the dotted line represents the boundary position of the electrodes;
fig. 10 is a schematic view of an eighth structure of an atomizing core according to an embodiment of the present invention, wherein the dotted line represents the boundary position of the electrode.
The reference numbers illustrate:
10. a ceramic substrate; 20. an electrode; 30. the film is heated.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present invention are only relative concepts or reference to the normal use state of the product, and should not be considered as limiting.
Example one
Referring to fig. 1 to 10, the present application provides a method for preparing an atomizing core, which includes a ceramic substrate 10, two electrodes 20 and a heating film 30, wherein the two electrodes 20 are spaced apart from each other and disposed on two end sides of an upper surface of the ceramic substrate 10, and the heating film 30 is disposed on a side of the electrodes 20 away from the ceramic substrate 10 and covers the two electrodes 20 and a region of the ceramic substrate 10 between the two electrodes 20.
The ceramic base 10 has an atomizing area, and in the present embodiment, the atomizing area is provided on the upper surface of the ceramic base. The ceramic matrix is used to conduct the atomized liquid to the atomization zone. The ceramic substrate has a plurality of micropores, and the pore wall of each micropore forms a capillary phenomenon so as to guide and convey the atomized liquid to the atomization area.
In this embodiment, the atomized liquid is the tobacco tar of the electronic cigarette. In other embodiments, the atomized liquid may be other liquids that require heating for atomization.
The heating film 30 is placed in the atomization region, and when electricity is applied, the heating film 30 generates heat to heat and atomize the atomized liquid in the atomization region. The electrodes are two and are spaced on either side of the heater film 30, and it will be understood that the two electrodes correspond to an anode and a cathode, with current flowing from the anode to the cathode when the heater film is energized. The direction and distribution of the current in the heat generating layer 121 are controlled by the structure and the position arrangement of the anode and the cathode.
The heating film 30 is in a shape of a diaphragm and is approximate to a two-dimensional surface, the arrangement is favorable for improving the temperature rise efficiency of the atomizing core, the heating power is more uniform, and the atomizing temperature is more stable. Thereby ensuring that the atomizing core has high smoke amount and simultaneously avoiding the phenomena of carbon deposition and liquid leakage, avoiding the problems of scorched smell and the like. In addition, since the heating film 30 is in the form of a diaphragm, the heat distribution is balanced when the power is applied, thereby preventing the risk of breakage of the ceramic body 10 due to unbalanced thermal stress or the risk of disconnection of the heating film 30 itself.
The electrode 122 is in a layer shape and is in surface contact with the heating film 30, and the arrangement is beneficial to miniaturization of the atomizing core 10 on one hand and can effectively reduce the contact resistance between the electrode 122 and the heat generating layer 121 on the other hand.
The preparation method of the atomizing core provided in this embodiment includes:
s1: preparing a ceramic substrate 10;
s2: printing or spraying electrode slurry on the ceramic substrate 10, sintering the electrode slurry to form two electrodes 20, and enclosing the two electrodes 20 to form an atomization surface;
s3: a heating film 30 is thermally sprayed on the atomization surface to form an atomization core.
In this embodiment, after the ceramic body 10 is formed by sintering the ceramic slurry, the electrode slurry is applied to the upper surface of the ceramic body 10. The electrode paste is applied to the ceramic body 10, and then sintered and cured on the ceramic body 10 to form the electrode 20. Then, the heating film 30 is thermally sprayed on the atomization surface to form an atomization core.
In this embodiment, the electrodes 20 are coated on the ceramic substrate 10, the two electrodes 20 surround to form an atomized surface, and the heating film 30 is sprayed on the atomized surface. The two electrodes 20 surround to form an atomization surface, which means that the area where the two electrodes 20 are located and the interval area between the two electrodes 20 jointly form the atomization surface. The heating film 30 is sprayed on the atomization surface, and the heating film 30 may completely cover or partially cover the atomization surface (i.e. the heating film 30 covers the two electrodes 20 and the area of the ceramic substrate 10 between the two electrodes 20). In the case where the heating film 30 partially covers the atomization surface, the heating film 30 covers at least a spacing region between the two electrodes and is in contact with the two electrodes by abutment or stacking to achieve electrical connection. The atomized region of the ceramic substrate 10 can be simply understood as an atomized surface here from the viewpoint of heating of the atomizing core.
The connection between the heating film 30 and the ceramic substrate 10 is similar to the crystal phase combination, the combination is tighter, and the heating and heat transfer efficiency is improved. The heating film 30 and the exposed area of the ceramic substrate 10 between the two electrodes are fully covered, so that the atomizing core is ensured to have a larger heating area to ensure the atomizing efficiency. The heating film 30 covers the exposed area of the ceramic base 10 between the two electrodes and extends to the positions of the two electrodes 20 to ensure the electrical connection of the heating film 30 with the two electrodes 20. The heating film 30 completely covers or partially covers the electrode 20 to ensure that the contact between the heating film 30 and the electrode 20 is surface contact, thereby ensuring the structural connection firmness and the quality of the electrical connection between the heating film 30 and the electrode 20. In other embodiments, the heating film 30 and the electrode 20 may abut against each other, and are not limited herein.
When the heating film 30 covers the exposed areas of the electrodes 20 and the ceramic substrate 10 between the electrodes 20 (the electrodes 20 are sandwiched between the heating film 30 and the ceramic substrate 10), the external device is directly electrically connected to the heating film 30, and the heating film 30 is electrically connected. In the case where the electrode 20 is not completely covered with the heating film 30, an external device may be electrically connected to the electrode, and power connection to the heating film 30 is achieved.
In the method for preparing the atomizing core provided by this embodiment, the step of coating the electrode 20 is performed before the step of coating the heating film 30, and the screen printing or spraying of the electrode 20 does not affect the subsequent preparation of the heating film 30, so that the molding quality of the heating film 30 is ensured, and the atomizing effect of the atomizing core is further ensured.
In this embodiment, the ceramic substrate 10 is a conventional porous ceramic, and the ceramic substrate 10 may be obtained by sintering a ceramic slurry after hot-pressing injection molding or injection molding. The ceramic slurry comprises the following raw materials in parts by weight: 200 to 250 portions of ceramic powder, 200 to 250 portions of low-temperature glass powder, 160 to 170 portions of pore-forming agent, 300 to 330 portions of adhesive and 160 to 170 portions of surfactant.
Wherein, the ceramic powder comprises one or more of diatomite, cordierite, alumina, silicon oxide, silicon carbide, silicon nitride, quartz sand, corundum sand, glass sand, kaolin, clay and spray granulation. The pore-forming agent comprises one or more of polystyrene, polymethyl methacrylate, polyurethane, polypropylene, polyvinyl chloride, carbon powder, carbonate, nitrate, ammonium salt, wood dust, flour, corn flour, starch and bean flour. The adhesive comprises one or more of paraffin, beeswax, polyethylene wax and polypropylene wax. The surfactant comprises at least one of stearic acid and oleic acid.
The ceramic slurry can also comprise the following components in parts by weight: 200-300 parts of main material, 50-80 parts of heat-conducting filler, 200-250 parts of first binder, 170-220 parts of pore-forming agent, 240-330 parts of plasticizer and 30-40 parts of stearic acid.
Wherein the main material is at least one of diatomite, alumina, zirconia, silicon carbide and silicon nitride; the heat-conducting filler is at least one of first metal powder and carbon powder, the first metal powder is at least one of copper powder, platinum powder, aluminum powder and silver powder, and the heat-conducting filler is used for improving the heat-conducting property of the porous ceramic body; the first binder is glass powder, and the glass powder comprises at least one of SiO2, li2O, znO, baO, K2O and Na 2O; the pore-forming agent is PMMA; the plasticizer is at least one of paraffin and beeswax.
The ceramic substrate 10 can be prepared by one skilled in the art by selecting other raw materials and proportions, which are not limited herein.
The electrode slurry can be silver slurry, platinum slurry, aluminum slurry and other slurries with good conductive performance. The electrode paste may be coated on the ceramic substrate 10 by a screen printing or spraying process. After the electrode paste is coated on the ceramic substrate 10, the electrode 20 is formed by sintering and curing.
The material of the heating film 30 may be gold, silver, platinum, gold-silver alloy, silver-platinum alloy, nickel-chromium alloy, iron-chromium-aluminum alloy, stainless steel alloy, etc., and is not limited herein. The heating film 30 may be coated on the atomized surface by a precision spray coating process, a magnetron sputtering coating process, or an evaporation coating process.
The heating film 30 is prepared by adopting a precise spraying process, so that the precision is high, the operation is simple, the film preparation efficiency is high, and the cost is low. The precise spraying process can be plasma thermal spraying, electric arc thermal spraying, supersonic thermal spraying, cold spraying, electron gun and ion gun assisted coating and the like. The thickness of the heating film 30, which is prepared by a precision spray process, may be 1 to 10 micrometers.
The film with stronger bonding force can be obtained by adopting magnetron sputtering coating and evaporation coating, and the thickness of the prepared heating film 30 can be 0.01-10 microns.
In another embodiment of the present application, before step S3, a transition film is sprayed on the atomized surface, wherein the transition film is a titanium or chromium metal film. The transition film is prepared by coating titanium slurry or chromium slurry on the atomized surface by PVD technique. The arrangement of the transition film can not only enhance the adhesion between the heating film 30 and the ceramic substrate 10, but also prevent the heating film 30 from reacting with the silicon material in the ceramic substrate 10 to form silicide at the high temperature of the atomizer.
In another embodiment of the present application, between step S1 and step S2, further comprising: carrying out ultrasonic cleaning on the ceramic substrate 10 and then drying; between step S2 and step S3, further comprising: the ceramic base 10 coated with the electrode 20 is plasma-cleaned.
Specifically, the preparation method of the atomization core comprises the following steps:
preparation of the ceramic substrate 10: shaping the ceramic slurry and then sintering at 600-650 ℃ to form a ceramic matrix 10;
carrying out ultrasonic cleaning on the ceramic substrate 10 and then drying;
printing or spraying electrode slurry on the ceramic substrate 10, and sintering at 500-550 ℃ to form a first blank;
carrying out plasma cleaning on the first blank;
and sequentially spraying a transition film and a heating film 30 on the first blank, and annealing at 300-500 ℃ in nitrogen or vacuum to form an atomized core.
The ceramic slurry is sintered by adopting a low-temperature sintering process, the temperature is 600-650 ℃, the sintering temperature of the electrode slurry is adjusted according to the temperature of the ceramic slurry and is set to be 500-550 ℃, and annealing is carried out at 300-500 ℃ after the heating film 30 is sprayed.
The preparation method of the atomization core can also comprise the following steps:
preparation of the ceramic substrate 10: shaping the ceramic slurry and sintering at 900-1100 ℃ to form a ceramic matrix 10;
carrying out ultrasonic cleaning on the ceramic substrate 10 and then drying;
printing or spraying silver paste on the ceramic substrate 10, and sintering at 700-900 ℃ to form a first blank;
carrying out plasma cleaning on the first blank;
and sequentially spraying a transition film and a heating film 30 on the first blank, and annealing at 500-700 ℃ in nitrogen or vacuum to form an atomized core.
The ceramic slurry is sintered at 900-1100 deg.c, and most ceramic slurry may be used in the sintering temperature. The sintering temperature of the electrode slurry is adjusted according to the temperature of the ceramic slurry, the sintering temperature is set to be 700-900 ℃, the heating film 30 is sprayed and then annealed at 500-700 ℃, and the temperature is reasonably set so as to ensure the quality of the finished product of the atomized core.
In another embodiment of the present application, the thickness of the heating film 30 is not greater than 10 micrometers. The heating film 30 has a through film hole, and the film hole communicates with the micro-hole to guide the atomized liquid to approach the film hole together, and leave the film hole after being heated and atomized by the heating film 30. The thickness of heating film 30 is below 10 microns for heating film 30 is approximate to the two-dimensional face, and this is provided with and does benefit to the temperature rise efficiency that improves heating film 30, and makes the power of generating heat more even, and atomizing temperature is more stable, thereby makes the atomizing smog fine and smooth, and the taste is stable. The pore diameter of the micropores can be set to 0.01. Mu.m, 0.05. Mu.m, 0.1. Mu.m, 0.16. Mu.m, 0.18. Mu.m, 0.24. Mu.m, 0.29. Mu.m, 0.35. Mu.m, 0.36. Mu.m, 0.41. Mu.m, 0.45. Mu.m, 0.48. Mu.m, 0.50. Mu.m, 0.55. Mu.m, 0.60. Mu.m, 0.62. Mu.m, 0.68. Mu.m, 0.70. Mu.m, 0.77. Mu.m, 0.80. Mu.m, 0.88. Mu.m, 0.90. Mu.m, 0.95. Mu.m, 1.0. Mu.m, 1.3. Mu.m, 1.55. Mu.m, according to practical circumstances 1.68 μm, 1.7 μm, 1.86 μm, 2.0 μm, 2.6 μm, 3.0 μm, 3.2.0 μm, 3.67.0 μm, 4.0 μm, 4.32 μm, 4.46 μm, 4.8 μm, 5.0 μm, 5.33 μm, 5.76 μm, 6.0 μm, 6.3 μm, 6.5 μm, 6.75 μm, 7.0 μm, 7.3 μm, 7.8 μm, 8.0 μm, 8.45 μm, 8.77 μm, 9.0 μm, 9.2 μm, 9.44 μm, 9.5 μm, 9.8 μm, 10 μm, etc., and are not intended to be limited solely thereto.
In another embodiment of the present application, the anode and the cathode are rectangular and symmetrically disposed on both sides of the ceramic substrate 10 along the length direction. In general, the anode and the cathode are provided at equal thicknesses. The anode and the cathode are rectangular such that the anode and the cathode have the same sectional size in the width direction of the ceramic substrate 10. The anode and the cathode are symmetrically disposed along the length direction of the ceramic substrate 10, thereby ensuring that the anode and the cathode have the same distance at each section along the width direction of the ceramic substrate 10, and thus ensuring uniform distribution of current at the anode and the cathode along the width direction of the ceramic substrate 10.
In another embodiment of the present application, the heating film 30 is formed in a symmetrical pattern and is symmetrically disposed along a center line in a width direction of the ceramic substrate 10. The heating film 30 is symmetrically arranged, and the anode and the cathode are symmetrically arranged at two sides of the heating film 30, so that the current of the heating film 30 flows from the anode to the cathode under the electrification, and the distribution of the current is symmetrically arranged along the center line of the width direction of the ceramic substrate 10, thereby being beneficial to the uniform distribution of heat.
In another embodiment of the present application, at least both sides of the heating film 30 in the length direction are spaced apart from the edge of the ceramic substrate 10. The arrangement is convenient for subsequent glue sealing and assembling operations of the atomizing core. In addition, the projection size of the heating film 30 on the horizontal plane is smaller than that of the ceramic substrate 10, which is beneficial to the concentrated liquid supply from the ceramic substrate 10 to the heating film 30, thereby ensuring the rapid supply of the atomized liquid to a certain extent and being beneficial to improving the atomization efficiency. .
In another embodiment of the present application, the heating film 30 is disposed to have the same width as the electrode 20 and spaced apart from the widthwise edge of the ceramic substrate 10. The width of the heating structure formed by the two electrodes 20 and the heating film 30 is smaller than the size of the ceramic substrate 10, so that under the action of the same current, heat is further concentrated, and concentrated liquid supply is facilitated to improve the atomization efficiency of the atomization core.
In another embodiment of the present application, the heating film 30 is recessed toward the center along both sides (illustrated as long sides of the heating film 30) in the width direction of the ceramic substrate 10, and the recess is located between the two electrodes 20. This arrangement makes the current distribution on the heating film 30 more dense at the center than at both sides in the length direction of the ceramic body 10, thereby achieving the effect of collecting heat at the center.
In the structure shown in fig. 6, two long sides of the heating film 30 have a plurality of arc-shaped grooves depressed toward the center at a position between the two electrodes 20, and one side has three arc-shaped grooves and is symmetrically arranged with respect to the center line of the ceramic body 10 in the longitudinal direction.
In the structure shown in fig. 7, rectangular grooves are formed in both long sides of the heating film 30 at positions between the two electrodes 20.
In the structure shown in fig. 9, the two long sides of the heating film 30 are provided with a single arc-shaped groove at a position between the two electrodes 20.
In the structure shown in fig. 10, in addition to the structure shown in fig. 9, the heating film has a through hole formed at a central position thereof so as to vertically penetrate therethrough and extend in the longitudinal direction of the ceramic body 10.
The size and shape of the heating film 30 can also be related to the actual need by those skilled in the art to adjust the current distribution.
In another embodiment of the present application, the ceramic substrate 10 includes a substrate and a protrusion protruding from the substrate, the electrode 20 and the heating film 30 are disposed on a surface of the protrusion facing away from the substrate, and a gap is left between the protrusion and an edge of the substrate. In other words, in horizontal projection, the projection area of the boss is smaller than that of the substrate. The size of the atomizing surface is smaller than that of the bottom plate.
The boss size is less than the base plate, realizes the effect that the atomized liquid of base plate concentrates the confession liquid to the boss, has ensured the quick supply of the atomized liquid of atomizing surface to a certain extent, and is favorable to improving atomization efficiency.
In the structure shown in fig. 2, the ceramic body 10 has a symmetrical pattern in a horizontal projection. The base plate is rectangular, the boss is arranged on the base plate, and the center lines of the base plate and the boss in the length direction are overlapped. The size of the boss in the length direction is smaller than that of the substrate, so that a step is formed between the boss and the substrate.
In the structure shown in fig. 4, the ceramic body 10 has a symmetrical pattern in a horizontal projection. The base plate is rectangular, the boss is arranged on the base plate, and the center lines of the base plate and the boss in the length direction are overlapped. The size of the boss in the width direction is smaller than that of the substrate, so that a step is formed between the boss and the substrate. In the structure shown in fig. 5, the ceramic substrate 10 has a symmetrical pattern in horizontal projection. The base plate is rectangular, the boss is arranged on the base plate, and the center lines of the base plate and the boss in the length direction are overlapped. The size of the boss in the length direction and the width direction is smaller than that of the substrate, so that a step is formed between the boss and the substrate.
In the structure shown in fig. 6, on the basis of the structure shown in fig. 5, the convex plate is recessed inward at the side between the two electrodes 20 to form a plurality of semicircular grooves, and the shape of the heating film 30 is adjusted correspondingly to the convex plate. This arrangement further enhances the concentration of heat and atomized liquid. In the structure shown in fig. 7, the ceramic body 10 is depressed toward the center in the region between the two electrodes 20 on both sides in the width direction, and the depressed portion is rectangular in shape. The area where the recess is a boss.
In the structure shown in fig. 8, the ceramic body 10 is recessed toward the center in the region between the two electrodes 20 on both sides in the width direction. The concave part is semi-cylindrical and is provided with a plurality of concave parts. The area where the recess is a boss.
In the structure shown in fig. 9, the ceramic body 10 is depressed toward the center at both sides in the width direction and in the region between the two electrodes 20, and the depressed portion is an arc-shaped groove. The area where the recess is a boss.
In the structure shown in fig. 10, a through hole is formed in the center of the heating film 30 in addition to the structure shown in fig. 9, and a blind hole is formed in the boss at the through hole. This arrangement further enhances the concentration of heat and atomized liquid.
The shape of the boss can be set by those skilled in the art according to actual needs, and is not limited herein.
Example two
The embodiment provides an electronic cigarette atomizer which comprises an atomizing core. The atomizing core is prepared by the preparation method of the first embodiment. Since the atomizing core in this embodiment adopts all the technical solutions of the first embodiment, all the technical effects that can be brought by the above technical solutions are also achieved, and details are not described herein.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method of making an atomizing core, comprising:
s1: preparing a ceramic matrix;
s2: printing or spraying electrode slurry on the ceramic substrate, wherein the electrode slurry is sintered to form two electrodes, and the two electrodes surround to form an atomization surface;
s3: and spraying a heating film on the atomization surface to form an atomization core.
2. The atomizing core preparation method according to claim 1, wherein in step S3, a heating film is sprayed after a transition film is sprayed on the atomizing surface, and the transition film is a titanium or chromium metal film.
3. The atomization core preparation method according to claim 1, wherein in step S1, the ceramic slurry is shaped and then sintered at 600 to 650 ℃ to form a ceramic matrix;
in step S2, the sintering temperature is 500-550 ℃;
in step S3, a heating film is sprayed on the atomization surface, and an atomization core is formed after annealing at 300-500 ℃ in nitrogen or vacuum.
4. The atomization core preparation method according to claim 1, wherein in step S1, the ceramic slurry is shaped and then sintered at 900 to 1100 ℃ to form a ceramic matrix;
in the step S2, the sintering temperature is 700-900 ℃;
in step S3, a heating film is sprayed on the atomization surface, and an atomization core is formed after annealing at 500-700 ℃ in nitrogen or vacuum.
5. The atomizing core preparation method according to claim 1, further comprising, between step S1 and step S2: carrying out ultrasonic cleaning on the ceramic substrate and then drying; between step S2 and step S3, further comprising: and carrying out plasma cleaning on the ceramic substrate covered with the electrode.
6. The atomizing core preparation method according to claim 1, characterized in that, in step S3: the thickness of the heating film is not more than 10 micrometers.
7. The atomizing core preparation method according to claim 1, wherein in step S3: and spraying a heating film on the ceramic substrate by a precision spraying process or a magnetron sputtering coating or evaporation coating process.
8. The atomizing core preparation method according to one of claims 1 to 7, characterized in that the horizontal projection of the heater film is disposed in the ceramic substrate with its edge side spaced from the ceramic substrate.
9. The atomizing core preparation method according to any one of claims 1 to 7, wherein the ceramic base includes a base plate and a boss integrally provided, the electrode and the heating film are provided on a surface of the boss facing away from the base plate, and a gap is left between the boss and an edge of the base plate.
10. An electronic cigarette atomizer, comprising an atomizing core prepared by the atomizing core preparation method of any one of claims 1 to 9.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024159809A1 (en) * | 2023-02-03 | 2024-08-08 | 深圳市基克纳科技有限公司 | Atomization core, electronic atomization apparatus, and preparation method for atomization core |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024159809A1 (en) * | 2023-02-03 | 2024-08-08 | 深圳市基克纳科技有限公司 | Atomization core, electronic atomization apparatus, and preparation method for atomization core |
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