CN115602472A - Thin film circuit board - Google Patents
Thin film circuit board Download PDFInfo
- Publication number
- CN115602472A CN115602472A CN202110766180.4A CN202110766180A CN115602472A CN 115602472 A CN115602472 A CN 115602472A CN 202110766180 A CN202110766180 A CN 202110766180A CN 115602472 A CN115602472 A CN 115602472A
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- CN
- China
- Prior art keywords
- thin film
- film substrate
- substrate
- carbon ink
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/78—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites
- H01H13/785—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the material of the contacts, e.g. conductive polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/78—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites
- H01H13/79—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the form of the contacts, e.g. interspersed fingers or helical networks
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- Push-Button Switches (AREA)
Abstract
The invention provides a thin film circuit board which comprises a first thin film substrate, a second thin film substrate, an extension thin film substrate and a protective film. The first thin film substrate has a first circuit pattern. The second film substrate has a second circuit pattern with a spacing distance therebetween. The extension film substrate extends from one side of the second film substrate. The extending film substrate is provided with a plurality of conductive parts extending from the second circuit pattern, and one side of each conductive part far away from the second film substrate is covered with a carbon ink layer. The protective film covers the conductive parts and the carbon ink layers, part of each carbon ink layer is exposed out of the protective film, an overlapping area is arranged between the protective film and each carbon ink layer, and the length of the overlapping area is larger than that of the part of each carbon ink layer, which is exposed out of the protective film.
Description
Technical Field
The invention relates to the field of input devices, in particular to a thin film circuit board applied to an input device.
Background
With the development of technology, the electronic devices are greatly developed to bring convenience to human life, and therefore it is an important issue how to make the operations of the electronic devices more humanized. Common input devices for electronic devices include mouse devices, keyboard devices, and trackball devices, wherein the keyboard devices allow users to directly input characters and symbols into a computer, and are therefore highly appreciated.
Most of the existing keyboard devices include a key bottom plate, a thin film circuit board and a plurality of key structures, the thin film circuit board includes a plurality of thin film switches, and the thin film switches are respectively corresponding to the key structures. Each key structure comprises a key cap, a scissors type connecting element and an elastic element, wherein the scissors type connecting element is connected between the key cap and the key bottom plate, the scissors type connecting element comprises a first frame and a second frame which can swing relative to each other, in addition, the elastic element is arranged between the key cap and the film circuit board, and the elastic element is provided with an abutting part. When the key cap of any key structure is touched and pressed and moves downwards relative to the key bottom plate, the first frame and the second frame of the scissors type connecting element are changed into a superposed state from an opening and closing state, the key cap moving downwards can extrude the elastic element, the abutting part of the elastic element abuts against and triggers the corresponding membrane switch, so that the corresponding membrane switch is electrically conducted, when the key cap of the key structure is not touched and pressed any more, the key cap moves upwards relative to the key bottom plate in response to the elastic force of the elastic element, at the moment, the first frame and the second frame are changed into the opening and closing state from the superposed state, and the key cap can restore to the original position.
Please refer to fig. 1, which is a schematic side view of a part of a thin film circuit board of a conventional keyboard device at a viewing angle. As shown in fig. 1, the thin film wiring board 1 includes an upper thin film substrate 11, a lower thin film substrate 12, and a middle thin film substrate 13 interposed between the upper thin film substrate 11 and the lower thin film substrate 12. The lower surface of the upper film substrate 11 has a first circuit pattern 110, and the first circuit pattern 110 has a plurality of upper contacts 1101 and a plurality of upper silver paste lines 1102 corresponding to the key structures. The upper surface of the lower film substrate 12 has a second circuit pattern 120, and the second circuit pattern 120 has a plurality of lower contacts 1201 and a plurality of lower silver paste lines 1202 corresponding to the upper contacts 1101, respectively. In addition, the middle layer film substrate 13 has a plurality of openings 130 corresponding to the upper contacts 1101 and the lower contacts 1201, respectively. Each of the upper contacts 1101 and the corresponding lower contact 1201 together form the membrane switch.
Please refer to fig. 2, which is a schematic side view of the thin film circuit board shown in fig. 1 at another viewing angle. As shown in fig. 2, the lower film substrate 12 of the film circuit board 1 further includes an extension portion 14, and at least a portion of the lower silver paste line 1202 of the second circuit pattern 120 is disposed on the extension portion 14 to form a plurality of pins (pins). A carbon ink protective layer 15 is disposed above each of the leads for protecting the lower silver paste line 1202, and when the leads are plugged into a connector (not shown), the connector can pierce the carbon ink protective layer 15 to contact the lower silver paste line 1202 to form an electrical connection. The conventional thin film circuit board 1 has a disadvantage that air containing sulfur enters the thin film circuit board 1 and contacts the upper silver paste circuit 1102 of the first circuit pattern 110 and the lower silver paste circuit 1202 of the second circuit pattern 120, so that the upper silver paste circuit 1102 and the lower silver paste circuit 1202 are gradually vulcanized to form silver sulfide, which causes an increase in conductive resistance and causes the upper silver paste circuit 1102 and the lower silver paste circuit 1202 to lose the function of conducting electronic signals. Therefore, how to improve the above problems is the focus of attention of those skilled in the art.
Disclosure of Invention
It is an object of the present invention to provide a thin film circuit board having a structural design that prevents the intrusion of sulfur-containing gas or other reactive gas.
Other objects and advantages of the present invention will be further understood from the technical features disclosed in the present invention.
In order to achieve one or a part of or all of the above or other objects, the present invention provides a thin film circuit board, including a first thin film substrate, a second thin film substrate, an extended thin film substrate and a protection film. The first thin film substrate has a first circuit pattern. The second film substrate is disposed opposite to the first film substrate, and has a second circuit pattern. The second circuit pattern has a spacing distance from the first circuit pattern. The extending film substrate extends from one side of the second film substrate, the extending film substrate is provided with a plurality of conductive parts, the conductive parts extend from the second circuit pattern, and one side of each conductive part, which is far away from the second film substrate, is covered with a carbon ink layer. The protective film covers the conductive parts and the carbon ink layers, part of each carbon ink layer is exposed out of the protective film, an overlapping area is arranged between the protective film and each carbon ink layer, and the length of the overlapping area is larger than that of the part of each carbon ink layer which is exposed out of the protective film.
In an embodiment of the invention, the length of the overlapping region is between 6 millimeters (mm) and 20 mm.
In an embodiment of the invention, the first circuit pattern of the first thin film substrate includes a first contact and a first metal line, the second circuit pattern of the second thin film substrate includes a second contact and a second metal line, the first contact and the second contact form a thin film switch, and the conductive portions of the extended thin film substrate extend from the second metal line.
In an embodiment of the invention, at least one of the first metal lines of the first circuit patterns and the second metal lines of the second circuit patterns is a silver paste line.
In an embodiment of the invention, the thin film circuit board further includes a spacer substrate. The spacing substrate is arranged between the first film substrate and the second film substrate so as to enable a spacing distance to be reserved between the first circuit pattern and the second circuit pattern, and the spacing substrate is provided with openings corresponding to the first contact and the second contact.
In an embodiment of the invention, an air channel structure is formed between the carbon ink layer on each conductive portion and the carbon ink layer on another adjacent conductive portion.
In an embodiment of the invention, the thin film circuit board further includes a supporting substrate. The support bottom plate is arranged below the extension film substrate, is positioned on one side of the extension film substrate far away from the second film substrate and corresponds to the carbon ink layer on each conductive part.
In an embodiment of the invention, the thin film circuit board further includes a first protection structure. The first film substrate and the second film substrate are respectively formed by splicing at least two plate parts, and the first protection structure covers the joint of the plate parts.
In an embodiment of the invention, the thin film circuit board further includes a second protection structure. The second protection structure is arranged on the extended film substrate and covers each carbon ink layer exposed out of the protection film.
In an embodiment of the invention, the first film substrate and the second film substrate both adopt a polyester film as a base material, and the film circuit board can be configured in the keyboard device.
The thin film circuit board of the embodiment of the invention mainly extends the carbon ink layers covered on each conductive part, so that the length of the overlapping area of the protective film and each carbon ink layer is larger than the length of the part of each carbon ink layer exposed out of the protective film. In addition, a protective structure may be added at other positions of the thin film circuit board to increase resistance to the destruction of the sulfur-containing gas or other active gas, such as covering the protective structure at the joint between the plurality of board portions of the thin film substrate and covering the protective structure on each carbon ink layer exposed to the protective film.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic side view of a thin film circuit board of a conventional keyboard device in a partial structure at a viewing angle.
Fig. 2 is a schematic side view of a portion of the thin film circuit board shown in fig. 1 at another viewing angle.
Fig. 3 is a schematic side view of a partial structure of a thin film circuit board at a viewing angle according to an embodiment of the invention.
FIG. 4 is a schematic side view of the thin film circuit board shown in FIG. 3 at another viewing angle.
Fig. 5 is a schematic top view of the thin film circuit board shown in fig. 4.
Fig. 6 is a schematic top view of the first thin film substrate shown in fig. 3.
Fig. 7 is a schematic side view of a partial structure of a thin film circuit board according to another embodiment of the invention at a viewing angle.
Wherein the reference numerals are as follows:
1. 2, 2a: thin film circuit board
11: upper layer film substrate
12: lower layer film substrate
13: middle layer film substrate
14: extension part
15: carbon ink protective layer
21: first film substrate
22: a second film substrate
23: stretched film substrate
24: protective film
25: carbon ink layer
26: spacer substrate
27: supporting bottom plate
28: first protection structure
29: second protection structure
110. 210: first circuit pattern
120. 220, and (2) a step of: second circuit pattern
130: opening holes
230: conductive part
260: opening holes
1101: upper contact
1102: silver coated circuit
1201: lower contact
1202: silver paste discharging circuit
2101: first contact
2102: a first metal line
2201: second contact
2202: second metal line
A: air flue structure
D: direction of rotation
G: separation distance
R: overlapping area
L1: first length
L2: second length
La, lb: length of
Detailed Description
Referring to fig. 3 to 5, fig. 3 is a schematic side view of a partial structure of a thin film circuit board at a viewing angle according to an embodiment of the present invention. FIG. 4 is a schematic side view of the thin film circuit board shown in FIG. 3 at another viewing angle. Fig. 5 is a schematic top view of the thin film circuit board shown in fig. 4.
As shown in fig. 3 to 5, the thin film wiring board 2 of the present embodiment includes a first thin film substrate 21, a second thin film substrate 22, an extended thin film substrate 23, and a protective film 24. The first thin film substrate 21 has a first circuit pattern 210. The second thin film substrate 22 is disposed opposite to the first thin film substrate 21, and the second thin film substrate 22 has a second circuit pattern 220, wherein the second circuit pattern 220 and the first circuit pattern 210 have a spacing distance G therebetween. The extended film substrate 23 extends from one side of the second film substrate 22. The extended film substrate 23 has a plurality of conductive portions 230, the conductive portions 230 extend from the second circuit pattern 220, and a side of each conductive portion 230 away from the second film substrate 22 is covered with a carbon ink layer 25. The protective film 24 is disposed above the extended film substrate 23 and covers the conductive portions and the carbon ink layers 25, a portion of each carbon ink layer 25 is exposed out of the protective film 24, and an overlapping region R is formed between the protective film 24 and each carbon ink layer 25. In the present embodiment, the length La of the overlap region R is greater than the length Lb of each carbon ink layer 25 where a portion of the protective film 24 is exposed.
The detailed structure of the thin film wiring board 2 according to the embodiment of the present invention will be further described below.
As shown in fig. 3 to 5, the first circuit pattern 210 of the first film substrate 21 of the present embodiment includes a first contact 2101 and a first metal line 2102. The second circuit pattern 220 of the second film substrate 22 includes second contacts 2201 and second metal lines 2202. The first contact 2101 of the first circuit pattern 210 and the second contact 2201 of the second circuit pattern 220 together form a thin film switch, and the conductive portions 230 of the extended thin film substrate 23 extend from the second metal line 2202 of the second circuit pattern 220. In the present embodiment, the first metal line 2102 of the first circuit pattern 210 is, for example, a silver paste line, and the second metal line 2202 of the second circuit pattern 220 is, for example, a silver paste line, but the invention is not limited thereto.
As shown in fig. 3 to 5, the thin film wiring substrate 2 of the present embodiment further includes a spacer substrate 26. The spacer substrate 26 is disposed between the first thin film substrate 21 and the second thin film substrate 22, so that a distance G is formed between the first circuit pattern 210 on the first thin film substrate 21 and the second circuit pattern 220 on the second thin film substrate 22. In the present embodiment, the spacer substrate 26 has an opening 260, and the opening 260 is opposite to the first contact 2101 of the first circuit pattern 210 and the second contact 2201 of the second circuit pattern 220.
It should be noted that, for example, the first film substrate 21 and the second film substrate 22 of the present embodiment use a polyester film (PET) as a base material, and the base material used for the extended film substrate 23 extending from the second film substrate 22 is the same as the base material used for the second film substrate 22, but the present invention is not limited thereto. In the present embodiment, the first circuit pattern 210 and the second circuit pattern 220 are formed on the surfaces of the first film substrate 21 and the second film substrate 22 according to a specified circuit pattern by printing, for example, and the conductive parts 230 extending from the second circuit pattern 220 are pins (pins) electrically connected to a connector (not shown), for example, but the invention is not limited thereto. The thin film circuit board 2 of the present embodiment may be configured on an external keyboard (for example, a PS2 interface keyboard or a USB interface keyboard) used in a desktop computer or a built-in keyboard used in a notebook computer or a laptop computer, but the present invention is not limited thereto, that is, the concept of the thin film circuit board 2 of the present embodiment may be applied to any electronic product using the thin film circuit board 2 as a signal input interface.
Specifically, the film circuit board 2 of the present embodiment is disposed below a plurality of key structures (not shown) in the keyboard device. Generally, the key structure includes key caps, scissors-type connecting members, elastic members, and the like, and the connection relationship between these elements is not described herein. A plurality of membrane switches may be formed between the first circuit pattern 210 on the first film substrate 21 and the second circuit pattern 220 on the second film substrate 22, that is, the membrane switches are formed between the first contacts 2101 of the first circuit pattern 210 and the second contacts 2201 of the second circuit pattern 220, and the membrane switches respectively correspond to the key structures. The first contacts 2101 are respectively contacted with the second contacts 2201 through the corresponding openings 260 on the spacer substrate 26. Specifically, when the key cap of the key structure is not pressed, the first contact 2101 on the first film substrate 21 and the second contact 2201 on the second film substrate 22 are separated from each other by the two sides of the spacer substrate 26 and electrically separated. When the key cap is pressed to move toward the thin-film circuit board 2, the key cap directly or indirectly pushes the first thin-film substrate 21 partially into the opening 260 of the spacer substrate 26, so that the first contact 2101 on the first thin-film substrate 21 passes through the opening 260 of the spacer substrate 26 and contacts the second contact 2201 on the second thin-film substrate 22. Therefore, the triggered membrane switch generates a trigger signal corresponding to the pressed key structure immediately.
As shown in fig. 3 and 4, the film wiring board 2 of the present embodiment further includes a supporting base plate 27. The supporting bottom plate 27 is disposed under the extended film substrate 23, and the supporting bottom plate 27 is located on a side of the extended film substrate 23 away from the second film substrate 22 and corresponds to the carbon ink layers 25 covering each conductive portion 230. Specifically, the supporting substrate 27 of the present embodiment extends along the direction D to have a first length L1, the carbon ink layers 25 covering each conductive portion 230 extend along the direction D to have a second length L2, and the first length L1 of the supporting substrate 27 is greater than the second length L2 of each carbon ink layer 25, in other words, the supporting substrate 27 of the present embodiment has a projection area projected vertically upward, and the carbon ink layers 25 covering each conductive portion 230 are located in the projection area. The supporting substrate 27 is effective in increasing the structural strength of the carbon ink layers 25, and the supporting substrate 27 can prevent the carbon ink layers 25 from bending and breaking during the process of inserting the conductive parts 230 covered with the carbon ink layers 25 into a connector (not shown).
As shown in fig. 4 and fig. 5, an air channel structure a is formed between the carbon ink layer 25 covering each conductive portion 230 and the adjacent carbon ink layer 25 covering another conductive portion 230. For example, in the present embodiment, the total length of the carbon ink layers 25 (i.e., the first length L1) covered on each conductive portion 230 is 10 mm, the length Lb of each carbon ink layer 25 exposed outside the protective film 24 is 4 mm, and the length La of the overlapping region R between the protective film 24 and each carbon ink layer 25 is 6 mm, that is, the total length of the air channel structure a in the present embodiment is 10 mm, and the length of the air channel structure a covered by the protective film 24 is 6 mm. The main purpose of the present invention is to extend the length of the gas channel structure a covered by the protective film 24, and the length of the gas channel structure a covered by the protective film 24 is further extended to 6 mm from the existing 1 mm to 1.3 mm, under such a structural design, the sulfur-containing gas or other active gas is less likely to penetrate into the interior of the membrane circuit board 2 through the gas channel structure a, that is, the sulfur-containing gas or other active gas is confined in the extended gas channel structure a and will not flow out from the gas channel structure a.
It should be noted that, the length La of the overlapping region R between the protection film 24 and each of the carbon ink layers 25 is 6 mm, which is only one embodiment of the present invention, and the present invention does not limit the length La of the overlapping region R, and on the premise that the length La of the overlapping region R is greater than the length Lb of each of the carbon ink layers 25 exposed outside the protection film 24, the length La of the overlapping region R between the protection film 24 and each of the carbon ink layers 25 can be extended to a required length according to actual requirements, for example, under the condition that the length Lb of each of the carbon ink layers 25 exposed outside the protection film 24 is not changed, the length La of the overlapping region R between the protection film 24 and each of the carbon ink layers 25 can be extended to 20 mm, that is, the length La of the overlapping region R is between 6 mm and 20 mm.
Please refer to fig. 6, which is a schematic top view of the first film substrate 21 shown in fig. 3. As shown in fig. 6, the thin film wiring board 2 of the present embodiment further includes a first protection structure 28. In the present embodiment, the first thin film substrate 21 and the second thin film substrate 22 are respectively formed by splicing two plate portions B1 and B2, and the first thin film substrate 21 is taken as an example in fig. 6, the plate portion B1 and the plate portion B2 of the first thin film substrate 21 are spliced to form a joint C, and the first protection structure 28 covers the joint C between the plate portion B1 and the plate portion B2, so as to prevent sulfur-containing gas or other active gas from flowing into the thin film circuit board 2 from the joint C between the plate portion B1 and the plate portion B2. It should be noted that the number of the plate portions is not limited in the present invention, and in other embodiments, the first film substrate 21 and the second film substrate 22 are formed by splicing more than two plate portions, for example, and the first protection structure 28 can be covered on the joint formed by splicing the plate portions regardless of the number of the plate portions. In the embodiment, the first protection structure 28 is, for example, a UV glue or other filling materials, but the invention is not limited thereto.
Please refer to fig. 7, which is a schematic side view of a partial structure of a thin film circuit board according to another embodiment of the present invention. As shown in fig. 7, the thin film circuit board 2a of the present embodiment is similar to the thin film circuit board 2 shown in fig. 3 to 5, and the difference is that the thin film circuit board 2a of the present embodiment further includes a second protection structure 29. The second protection structure 29 is disposed on the extended film substrate 23, and the second protection structure 29 covers each of the carbon ink layers 25 exposed from the protection film 24. With such a structure, it is possible to further prevent sulfur-containing gas or other active gas from entering the inside of the thin film circuit board 2a as compared with the passage through the gas passage structure a. In the embodiment, the second protection structure 29 is, for example, a UV glue or a water glue, but the invention is not limited thereto.
In summary, the thin film circuit board according to the embodiment of the invention mainly extends the carbon ink layers covering each conductive portion, so that the length of the overlapping area between the protective film and each carbon ink layer is greater than the length of the portion of each carbon ink layer exposed out of the protective film. In addition, a protective structure may be added at other positions of the thin film circuit board to increase resistance to the destruction of the sulfur-containing gas or other active gas, such as covering the protective structure at the joint between the plurality of board portions of the thin film substrate and covering the protective structure on each carbon ink layer exposed to the protective film.
While the invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Moreover, not all objects or advantages or features disclosed herein are necessarily achieved by any one embodiment or claim of the invention. In addition, the abstract and the title of the disclosure are provided to facilitate the search of patent documents and are not intended to limit the scope of the disclosure. Furthermore, the terms "first," "second," and the like in the description or in the claims are used only for naming elements (elements) or distinguishing different embodiments or ranges, and are not used for limiting the upper limit or the lower limit on the number of elements.
Claims (10)
1. A thin film wiring board comprising:
a first film substrate having a first circuit pattern;
a second thin film substrate disposed opposite to the first thin film substrate, the second thin film substrate having a second circuit pattern with a spacing distance therebetween;
an extended film substrate extending from one side of the second film substrate, the extended film substrate having a plurality of conductive portions extending from the second circuit pattern, and a carbon ink layer covering one side of each conductive portion away from the second film substrate; and
and the protective film covers the conductive parts and the carbon ink layers, part of each carbon ink layer is exposed out of the protective film, an overlapping region is arranged between the protective film and each carbon ink layer, and the length of the overlapping region is greater than that of the part of each carbon ink layer which is exposed out of the protective film.
2. The thin film circuit board of claim 1, wherein the length of the overlap region is between 6 mm and 20 mm.
3. The thin film circuit board of claim 1, wherein the first circuit pattern of the first thin film substrate comprises a first contact and a first metal line, the second circuit pattern of the second thin film substrate comprises a second contact and a second metal line, the first contact and the second contact form a thin film switch, and the conductive portions of the extended thin film substrate extend from the second metal line.
4. The thin film circuit board of claim 3, wherein at least one of the first metal lines of the first circuit pattern and the second metal lines of the second circuit pattern is a silver paste line.
5. The thin film circuit board of claim 3, further comprising a spacer substrate disposed between the first thin film substrate and the second thin film substrate such that the first circuit pattern and the second circuit pattern have the separation distance therebetween, and the spacer substrate has an opening corresponding to the first contact and the second contact.
6. The thin film wiring board of claim 1, wherein an air channel structure is provided between the carbon ink layer on each conductive portion and the carbon ink layer on another adjacent conductive portion.
7. The thin film circuit board of claim 1, further comprising a support substrate disposed below the extended film substrate, the support substrate being located on a side of the extended film substrate away from the second film substrate corresponding to the carbon ink layer on each of the conductive portions.
8. The thin film circuit board of claim 1, further comprising a first protection structure, wherein the first thin film substrate and the second thin film substrate are respectively formed by splicing at least two plate portions, and the first protection structure covers the joints of the plate portions.
9. The thin film circuit board of claim 1, further comprising a second protective structure disposed on the extended film substrate and covering each carbon ink layer exposed from the protective film.
10. The film circuit board of claim 1, wherein the first film substrate and the second film substrate are both made of polyester film, and the film circuit board can be disposed in a keyboard device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110766180.4A CN115602472A (en) | 2021-07-07 | 2021-07-07 | Thin film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110766180.4A CN115602472A (en) | 2021-07-07 | 2021-07-07 | Thin film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115602472A true CN115602472A (en) | 2023-01-13 |
Family
ID=84841507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110766180.4A Pending CN115602472A (en) | 2021-07-07 | 2021-07-07 | Thin film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115602472A (en) |
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2021
- 2021-07-07 CN CN202110766180.4A patent/CN115602472A/en active Pending
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