CN115598700A - Seismic profile imaging method and device, storage medium and electronic equipment - Google Patents
Seismic profile imaging method and device, storage medium and electronic equipment Download PDFInfo
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Abstract
The invention discloses a method, a device, a storage medium and electronic equipment for seismic profile imaging, wherein the method comprises the following steps: respectively executing radon transformation on each first seismic wave field of the shot point to obtain a first plane wave component and obtain a numerical value of a first ray parameter so as to obtain an incident ray angle corresponding to the first ray parameter; respectively executing radon transformation on each second seismic wave field on one side of the wave detection point to obtain second plane wave components and obtaining numerical values of each second ray parameter so as to obtain each scattered ray angle corresponding to each second ray parameter; obtaining each inclination angle based on the incident angle and each scattering angle; obtaining a single-shot imaging function of each inclination angle through a single-shot imaging calculation formula; and circularly executing all the shot points to obtain imaging functions of all the shot points so as to obtain an inclination gather, and stacking the inclination gathers to obtain seismic section imaging. The method can efficiently obtain the accurate dip angle gather, thereby obtaining the seismic section imaging with high resolution and high signal-to-noise ratio.
Description
Technical Field
The invention relates to the technical field of geophysical exploration, in particular to a method and a device for seismic profile imaging, a storage medium and electronic equipment.
Background
The dip gather calculated in seismic data depth domain imaging can be used for imaging discontinuous discontinuities and velocity analysis, and is an important gather.
In the prior art, a method for calculating a dip gather calculates travel time from a shot point to an imaging point and an incident angle of a wave field, travel time from the imaging point to a demodulator probe and a propagation angle of a scattered wave field from the imaging point at each imaging point by a ray tracing method, so that a corresponding dip at the imaging point is calculated from the two angles, and corresponding offset energy is put on the dip. And calculating different dip angles by different shot point and demodulator probe combinations for each imaging point, and forming a dip gather of the imaging point by obtaining a dip angle offset result of the same imaging point. The method is the source of many methods for computing dip gathers based on ray migration. In the prior art, ray tracing is replaced by a travel time table from a shot point to an imaging point and a travel time table from a wave detection point to the imaging point, and then the angle of an incident ray and the angle of a scattered ray are calculated according to travel time gradient, so that an inclination angle is calculated and an inclination angle gather is obtained. The common problem of the methods is that ray tracing and the equation of the path function can not overcome the problem of multi-value travel time when the structure is complex, so that the precision of the dip angle gather can be influenced.
In the prior art, the incident ray angle from a shot point to an imaging point is obtained by ray tracing, then a construction dip angle is obtained from a velocity model, and the two angles are used for scanning to obtain the scattered ray angle scattered from the imaging point and transmitted to a demodulator probe. The method faces the problem that in actual work, an accurate construction dip angle is difficult to obtain from a speed model, so that the calculation precision of the dip angle gather is influenced.
In the prior art, the incident ray angle and the scattered ray angle are calculated by using a Gaussian beam ray tracing method, so that the method can adapt to more complicated structures to a certain extent, but the adaptability to complicated structures is not as good as that of a wave equation method.
The method comprises the steps of firstly obtaining a propagation section from a high-frequency shot point wave field to the whole geological model by using a one-way wave equation simulation method, then obtaining incident ray angle information from a shot point to an imaging point from the section by using a structure tensor technology, then carrying out plane wave decomposition on the wave field of the imaging point in a migration process, and calculating the angle of a scattered ray from the imaging point to the imaging point by using ray parameters corresponding to each plane wave component. And calculating the inclination angle by utilizing the angle of the incident ray and the angle of the scattered ray obtained in the front to generate the common imaging point inclination gather after deviation. The method needs to perform one-time simulation of the one-way wave before the migration, meanwhile, the accuracy is not high in the aspect of calculating the angle accuracy on the single-frequency section by adopting the structure tensor technology, and the calculation efficiency is relatively low because recursive linear radon transformation is adopted to perform plane wave decomposition on a CPU in the specific implementation process.
Therefore, a method for acquiring the seismic profile image by acquiring the dip angle gather with higher efficiency and more accurate angle is needed, and underground structure analysis in geological exploration and analysis can be performed more accurately.
Disclosure of Invention
The invention provides a seismic section imaging method, which solves the technical problem that multi-value travel time and complex structure seismic wave field description have defects in a ray seismic section imaging method, can efficiently and accurately obtain an inclination angle gather of a seismic wave field of a complex underground structure, and obtains high-resolution seismic section imaging.
The invention provides a method for seismic profile imaging, which comprises the following steps:
respectively obtaining a first seismic wave field on a preset depth slice of a shot downward edge extension and a second seismic wave field of a downward edge extension at one side of a detection point by adopting a one-way wave phase shift and interpolation algorithm based on common shot seismic data;
respectively executing frequency radon transform on the first seismic wave field of all effective frequencies of the shot point to obtain each first plane wave component of a first preset frequency, performing norm square operation on each first plane wave component within a preset incident ray angle range to obtain a numerical value of each first plane wave component, sequencing the numerical value and the numerical value, and obtaining a first ray parameter, wherein the first ray parameter is the ray parameter corresponding to the first plane wave component with the maximum numerical value, and the only incident ray angle corresponding to the first ray parameter is obtained on the basis of the first ray parameter and a ray parameter calculation formula;
respectively executing the frequency radon transform on the second seismic wave field of all effective frequencies of the wave detection point to obtain second plane wave components corresponding to all effective frequencies, obtaining values of the second ray parameters under all effective frequencies through average sampling in a preset scattering ray angle range, and obtaining scattering ray angles corresponding to the second ray parameters on the basis of the second ray parameters and the ray parameter calculation formula;
calculating half of the difference value between the incident ray angle and each scattered ray angle based on the incident ray angle and each scattered ray angle to obtain each inclination angle;
obtaining a single shot imaging function of each inclination angle by substituting a single shot imaging calculation formula based on each inclination angle, the incident ray angle and each scattered ray angle;
and circularly executing the single shot imaging function on all shot points to obtain imaging functions of all shot points so as to obtain an inclination angle gather, and stacking the inclination angle gather to obtain seismic section imaging.
In an embodiment of the present invention in which,
the step of performing frequency radon transform on the first seismic wavefield for all effective frequencies of the shot point to obtain first plane wave components at a first preset frequency, respectively, comprises:
transforming the first seismic wavefield by a fourier transform to obtain a third seismic wavefield;
and transforming the third seismic wave field through the frequency radon transform to obtain each first plane wave component of the first preset frequency.
In an embodiment of the present invention in which,
the calculation formula of the Fourier transform is as follows:
wherein,
f (x, t) is the seismic wavefield in the time-space domain,
f (ω, x) is the Fourier transformed frequency-space domain seismic wavefield,
omega is frequency, t is time, x is the horizontal coordinate of the single shot imaging point, and i is an imaginary number index;
the calculation formula of the frequency radon transform is as follows:
wherein,
g (omega, p) is a plane wave component after frequency radon transformation,
f (ω, x) is the Fourier transformed frequency-space domain seismic wavefield,
omega is frequency, x is horizontal coordinate of single shot imaging point, i is imaginary index,
[ - δ x, + δ x ] is the extent of the local spatial window centered at the imaging point x,
p k is a ray parameter, representing the propagation direction of the kth plane wave component.
In an embodiment of the present invention, it is,
performing norm square operation on each first plane wave component within a preset incident ray angle range to obtain a numerical value of each first plane wave component, and sequencing the numerical values to obtain a first ray parameter, wherein the ray parameter corresponding to the first plane wave component with the first ray parameter being the maximum numerical value comprises the following steps:
setting an upper limit value and a lower limit value of the preset incident ray angle;
obtaining the maximum value and the minimum value of the ray parameters corresponding to the upper limit value and the lower limit value of the preset incident ray angle based on the upper limit value and the lower limit value of the preset incident ray angle and the ray parameter calculation formula;
carrying out average sampling based on the maximum value and the minimum value of the ray parameter, and obtaining the sampling interval of the ray parameter by dividing the difference value of the maximum value and the minimum value of the ray parameter by the sampling times;
based on the sampling interval and the minimum value of the ray parameters, obtaining each ray parameter corresponding to each first plane wave component propagation direction through the product of the sampling interval multiplied by the sampling times and the minimum value of the ray parameters in sequence;
obtaining each first plane wave component in the preset incident ray angle range based on the calculation formula of the frequency radon transform, the third seismic wave field, the first preset frequency and the horizontal coordinate of the single shot imaging point;
carrying out norm square operation on the first plane wave components to obtain numerical values of the first plane wave components and sequencing the numerical values from large to small;
and selecting the ray parameter corresponding to the first plane wave component with the maximum value as the first ray parameter.
In an embodiment of the present invention in which,
the ray parameter calculation formula is as follows:
wherein p is a ray parameter, theta is an angle, and v is a plane wave propagation velocity, and is generally obtained through measurement.
In an embodiment of the present invention, it is,
acquiring imaging results of all shot points in the process of circularly executing the single-shot imaging results on all shot points so as to obtain a dip gather, wherein the step of stacking the dip gathers to obtain seismic section imaging further comprises the following steps:
performing subsurface formation analysis based on the seismic imaging profile.
In an embodiment of the present invention, it is,
the single-shot imaging calculation formula is as follows:
wherein,
omega is the frequency of the light source,
x is the horizontal coordinate of the single shot imaging point,
z is the depth coordinate of the single shot imaging point,
θ S is the angle of incident ray, theta R For angle of scattered radiation, theta D In order to form the angle of the inclination angle,
I(x,z,θ D ) A single shot imaging function for an imaging point at a predetermined spatial location underground,
S(x,z,θ S (ii) a Omega) is a seismic wavefield of all effective frequencies and corresponding unique incident ray angles,
R(x,z,θ R (ii) a ω) is the seismic wavefield for all effective frequencies and corresponding scatter ray angles.
The invention provides a device for seismic profile imaging, which comprises:
the seismic wave field acquisition module is used for respectively acquiring a first seismic wave field on a preset depth slice of the downward edge extension of the shot point and a second seismic wave field of the downward edge extension of one side of the wave detection point by adopting a one-way wave phase shift and interpolation algorithm based on the common shot point seismic data;
a calculating incident angle module, configured to perform linear frequency radon transform on the first seismic wave field of all effective frequencies of the shot point to obtain first plane wave components of a first preset frequency, perform norm square operation on the first plane wave components within a preset incident ray angle range to obtain values of the first plane wave components, sort the values, and obtain a first ray parameter, where the first ray parameter is the ray parameter corresponding to the first plane wave component with the largest value, and obtain a unique incident ray angle corresponding to the first ray parameter based on the first ray parameter and a ray parameter calculation formula;
a scatter angle calculation module, configured to perform the frequency radon transform on the second seismic wavefield at all effective frequencies of the detection point to obtain second plane wave components corresponding to all effective frequencies, obtain values of the second ray parameters at all effective frequencies through average sampling within a preset scatter ray angle range, and obtain scatter ray angles corresponding to the second ray parameters based on the second ray parameters and the ray parameter calculation formula;
the single shot inclination angle calculating module is used for calculating half of the difference value between the incident ray angle and each scattered ray angle based on the incident ray angle and each scattered ray angle to obtain each inclination angle;
a single shot imaging generation module for obtaining a single shot imaging function of each dip angle based on each dip angle, the incident ray angle and each scattered ray angle, and substituting the single shot imaging function into a single shot imaging calculation formula;
and the seismic section imaging generation module is used for acquiring imaging functions of all shot points in the process of circularly executing the single-shot imaging functions on all the shot points so as to acquire an inclination angle gather, and stacking the inclination angle gather to acquire seismic section imaging.
The present invention provides a storage medium having stored thereon a computer program,
the program when executed by a processor performs the steps of a method of seismic profiling as described in any of the above.
The present invention provides an electronic device, including:
a memory having a computer program stored thereon; and
a processor for executing the computer program in the memory to implement the steps of a method of seismic profiling as described in any of the above.
One or more embodiments of the present invention may have the following advantages over the prior art:
the method comprises the steps of respectively carrying out Radon transformation on the linear frequency of seismic wave fields of a seismic source and a seismic point to obtain corresponding plane wave components, obtaining the unique angle of an incident ray corresponding to the maximum energy plane wave component in each plane wave component of the seismic source, then obtaining a plurality of scattering angles of the seismic point to obtain a plurality of dip angles, applying imaging conditions to the plurality of dip angles to obtain a single-shot imaging function, and superposing dip gathers of all shot points to obtain seismic section imaging.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic flow chart of a method of seismic profiling in accordance with embodiment 1 of the present invention;
FIG. 2 is a schematic view showing an incident angle, a scattering angle and a tilt angle in example 1 of the present invention;
FIG. 3 is a schematic flow chart of a dip gather generation method according to embodiment 1 of the present invention;
fig. 4 is a schematic cross-sectional view of a Sigbee2A seismic model according to embodiment 1 of the present invention;
FIG. 5 is a schematic view of a depth domain common image point dip gather according to embodiment 1 of the present invention;
FIG. 6 is a schematic diagram of a seismic model with a seismic gather stacked to form a migration profile according to example 1 of the present invention;
fig. 7 is a logical framework diagram of an apparatus for seismic profiling according to embodiment 2 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the following detailed description of the present invention is made with reference to the accompanying drawings, so that how to apply technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented. It should be noted that, as long as there is no conflict, the embodiments and the features of the embodiments of the present invention may be combined with each other, and the technical solutions formed are within the scope of the present invention.
First embodiment
FIG. 1 is a schematic flow chart of a method of seismic profile imaging according to an embodiment;
FIG. 2 is a schematic diagram showing an incident angle, a scattering angle, and an inclination angle of the present embodiment;
FIG. 3 is a flowchart illustrating a dip gather generation method according to the present embodiment;
FIG. 4 is a schematic cross-sectional view of a Sigbee2A seismic model according to this embodiment;
FIG. 5 is a schematic diagram of a depth domain common image point dip gather of the present embodiment;
FIG. 6 is a schematic diagram of a seismic model with dip gathers superimposed to form an offset profile according to the present embodiment.
In addition to stratifying, there are many special complex geological structures in actual geological media, such as faults, pinches 8230, etc., which constitute discontinuities (two-dimensional spaces) or break lines (three-dimensional spaces) of the earth. When the seismic waves propagate to the discontinuities (lines) of the stratum, the discontinuities can be regarded as a new seismic source like the phenomenon that light in physical optics is diffracted through a small hole, so that the new seismic source generates a new disturbance which is called diffraction waves in seismic exploration and propagates to the periphery of the elastic space.
In the embodiment, a Graphics Processor (GPU), also called a display core, a visual processor, and a display chip, is required, and is a microprocessor specially used for image and Graphics related operations on a personal computer, a workstation, a game machine, and some mobile devices (such as a tablet computer, a smart phone, and the like).
The embodiment provides a method for seismic profile imaging, which comprises the following steps:
s100, respectively obtaining a first seismic wave field on a preset depth slice of a shot point downward edge extension and a second seismic wave field of a wave detection point side downward edge extension by adopting a one-way wave phase shift and interpolation algorithm based on common shot point seismic data.
The single-pass wave migration algorithm is used as an important branch of seismic migration imaging, and is a method for decomposing an acoustic wave equation into an uplink wave equation and a downlink wave equation to perform wave field continuation calculation respectively.
Specifically, in this embodiment, a single-pass phase shift and interpolation algorithm is first used to shift the common shot seismic data to obtain a first seismic wave field on a depth slice of a downward edge extension of a shot and a second seismic wave field of a downward edge extension on one side of a demodulator probe. In the process, a single-pass wave operator is used for overcoming partial defects of a ray-like migration imaging method, such as defects of description of a complex-structured seismic wave field in the face of multi-value travel time. By adopting the one-way wave migration technology, the seismic wave field of the complex structure can be better approximated, the complex structure can be finely imaged, and meanwhile, higher imaging frequency can be ensured.
S110, frequency Radon transform is respectively executed on first seismic wave fields of all effective frequencies of a shot point to obtain each first plane wave component of first preset frequency, norm square operation is carried out on each first plane wave component in a preset incident ray angle range to obtain numerical values of each first plane wave component, the numerical values are sequenced, first ray parameters are obtained, and the only incident ray angle corresponding to each first ray parameter is obtained on the basis of the first ray parameters and the ray parameter calculation formula.
Specifically, in this embodiment, at a preset depth, a horizontal wave field component corresponding to a principal frequency of a source wavelet of a first seismic wave field of a shot source is subjected to local plane wave decomposition by using linear frequency Radon transform (i.e., radon transform) on each horizontal position of the preset depth to obtain each first plane wave component of the first preset frequency, and a GPU acceleration technology is used to improve the calculation efficiency during the plane wave decomposition. And after all the first plane wave components at the preset depth point are obtained, performing norm square operation on the first plane wave components within the preset incident ray angle range to obtain the numerical values of the first plane wave components and sequencing the numerical values, and obtaining a first ray parameter, wherein the first ray parameter is the ray parameter corresponding to the first plane wave component with the maximum numerical value, and the incident angle of the underground preset depth imaging point can be calculated by using the first ray parameter corresponding to the maximum energy plane wave component and the ray parameter calculation formula as the unique angle of the incident ray of the shot point at the first preset frequency.
In this embodiment, the step of performing frequency radon transform on the first seismic wavefield at all effective frequencies of the shot point to obtain first plane wave components at a first preset frequency, respectively, includes:
transforming the first seismic wavefield in the time-space domain by fourier transform to obtain a third seismic wavefield in the frequency-space domain;
and transforming the third seismic wave field through frequency Radon transformation to obtain each first plane wave component of the first preset frequency.
In this embodiment, the calculation formula of the fourier transform is:
wherein,
f (x, t) is a first seismic wavefield in the time-space domain,
f (ω, x) is a third seismic wavefield in the frequency-space domain after Fourier transform,
omega is frequency, t is time, x is the horizontal coordinate of the single shot imaging point, and i is an imaginary number index;
in this embodiment, the ray parameter-frequency wave field conversion calculation formula is:
wherein,
g (omega, p) is a first plane wave component after frequency radon transformation,
f (ω, x) is a third seismic wavefield in the frequency-space domain after Fourier transform,
omega is frequency, t is time, x is horizontal coordinate of single shot imaging point, i is imaginary index,
p k is a ray parameter, representing the propagation direction of the kth plane wave component.
In this embodiment, the ray parameter calculation formula is:
wherein p is a ray parameter, θ is an angle, and v is a plane wave propagation velocity, and is generally obtained through measurement.
Specifically, in this embodiment, the step of performing a norm square operation on each first plane wave component within a preset incident ray angle range to obtain a numerical value of each first plane wave component and sorting the numerical values to obtain a first ray parameter, where the first ray parameter is a ray parameter corresponding to the first plane wave component with the maximum numerical value includes:
1) Setting an upper limit value and a lower limit value of the preset incident ray angle;
2) Acquiring the maximum value and the minimum value of the ray parameter corresponding to the upper limit value and the lower limit value of the preset incident ray angle based on the upper limit value and the lower limit value of the preset incident ray angle and the ray parameter calculation formula;
3) Carrying out average sampling based on the maximum value and the minimum value of the ray parameters, and dividing the difference value of the maximum value and the minimum value of the ray parameters by the sampling times to obtain the sampling interval of the ray parameters;
4) Based on the sampling interval and the minimum value of the ray parameters, obtaining each ray parameter corresponding to each first plane wave component propagation direction through the product of the sampling interval multiplied by the sampling times and the minimum value of the ray parameters;
5) Acquiring each first plane wave component in a preset incident ray angle range based on a ray parameter-frequency wave field conversion calculation formula, a third seismic wave field, a first preset frequency and a horizontal coordinate of a single shot imaging point;
6) Performing norm square operation on the first plane wave components to obtain numerical values of the first plane wave components, and sequencing the numerical values from large to small;
7) And selecting the ray parameter corresponding to the first plane wave component with the maximum value as the first ray parameter.
Specifically, in this embodiment, an upper limit and a lower limit of a maximum possible angle of an incident ray angle are preset, and the specific preset incident ray angle is adjusted according to an actual exploration situation, and this embodiment is preferably [ -30 degrees, +30 degrees ], since a ray parameter p and an angle θ are related to a calculation formula, and a propagation velocity v of a plane wave can be obtained through measurement, a maximum value and a minimum value of a value of the ray parameter p corresponding to the upper limit and the lower limit of the preset incident ray angle can be obtained through calculation of the upper limit and the lower limit of the preset incident ray angle, average sampling is performed based on a maximum value pmax and a minimum value pmin of a numerical value of the ray parameter p, and a sampling interval of the ray parameter is obtained by dividing a difference between the maximum value and the minimum value of the ray parameter by a sampling number.
The sampling interval calculation is as follows: Δ p = (pmax-pmin)/n, Δ p represents the sampling interval of the ray parameter
Based on the sampling interval delta p and the minimum value pmin of the ray parameters, obtaining each ray parameter corresponding to each first plane wave component propagation direction through the product of the sampling interval multiplied by the sampling times and the minimum value of the ray parameters in turn, and obtaining the kth ray parameter p k Can be represented as, for example,
p k ＝p min+Δp*k
from this, n ray parameters p can also be calculated k Has n values, such as p ∈ [ p ] 1 ，p 2 ，…，p n ]。。
According to a first preset frequency omega 0 And related parameter data to obtain a transformed first plane wave formation G (omega) 0 ，p k ) Obtaining each first plane wave component G (omega) in a preset incident ray angle range based on a calculation formula of frequency Radon transform, a third seismic wave field, a first preset frequency and a horizontal coordinate x of a single-shot imaging point 0 ，p k )。
In particular, the other parameters and the respective ray parameters p k Substituting the frequency into the calculation formula of Radon transform to obtain the first plane wave component G (omega) 0 ，p k ) Performing a square operation of the norm
And obtaining the numerical values of the first plane wave components, sequencing the numerical values from large to small, and selecting the ray parameter corresponding to the first plane wave component with the maximum numerical value as the first ray parameter.
Then, the first ray parameter and the plane wave propagation velocity v are substituted into a ray parameter calculation formula to obtain an angle formula theta = arcsin (pv) to obtain an incident ray angle theta corresponding to the first ray parameter S . Different ray parameters p represent different plane wave components and wave fields propagating along different directions, and the incidence angle theta of the underground imaging point is calculated by the maximum first ray parameter corresponding to the first plane wave component with the maximum energy S Unique incident ray angles are determined as shown in fig. 2.
In the embodiment, only one incident ray angle needs to be obtained on the side of the shot source, so that the calculation amount is greatly reduced, the calculation speed is increased, and the calculation cost is reduced.
And S120, respectively executing frequency Radon transform on second seismic wave fields of all effective frequencies of the wave detection point to obtain second plane wave components corresponding to all effective frequencies, obtaining numerical values of second ray parameters under all effective frequencies through average sampling in a preset scattered ray angle range, and obtaining scattered ray angles corresponding to the second ray parameters based on the second ray parameters and the ray parameter calculation formula.
Specifically, in this embodiment, linear frequency Radon transform (i.e., radon transform) is also performed on the GPU device for the second seismic wavefield of all effective frequencies on the side of the detector point on the slice with the preset depth, and similar to the method in S110, second plane wave components related to the detector point are obtained, each second plane wave component represents a wavefield at a specific propagation angle, so that each second plane wave component corresponds to a scattering angle that is scattered from the imaging point to the earth surface, and the second plane wave components are functions including frequency and second ray parameters, and the computation efficiency is improved by using the GPU device for computation.
For the embodiment on the side of the wave detection point, screening of the second ray parameters corresponding to the maximum plane wave is not carried out, and for all the second ray parameters p on the side of the wave detection point, such as n ray parameters, p ∈ [ p ] 1 ，p 2 ，…，p n ]All calculate the corresponding scattering angle theta R 。
The step of obtaining the second ray parameter p is as follows:
1) Setting an upper limit value and a lower limit value of a preset incident ray angle, such as preset to [ -30 degrees, +30 degrees ];
2) Acquiring the maximum value and the minimum value of the ray parameter corresponding to the upper limit value and the lower limit value of the preset incident ray angle based on the upper limit value and the lower limit value of the preset incident ray angle and the ray parameter calculation formula;
3) Carrying out average sampling based on the maximum value and the minimum value in the numerical values of the ray parameters, and dividing the difference value of the maximum value and the minimum value of the ray parameters by the sampling times to obtain the sampling interval of the ray parameters;
the sampling interval is calculated as follows: Δ p = (pmax-pmin)/n, Δ p represents the sampling interval of the ray parameter.
4) Based on the sampling interval and the minimum value of the ray parameters, obtaining each ray parameter corresponding to each first plane wave component propagation direction through the product of the sampling interval and the sampling times in sequence and the minimum value of the ray parameters;
the k-th ray parameter p k Can be represented as p k ＝p min+Δp*k。
After each second ray parameter is obtained, each scattering angle theta corresponding to each second ray parameter is obtained according to the ray parameter calculation formula R 。
In this embodiment, since all the second plane wave components are retained on the side of the demodulator probe, a plurality of scattered wavefields are retained, including the multi-valued travel-time effect of complex seismic wavefields.
S130, calculating half of the difference value between the incident ray angle and each scattered ray angle based on the incident ray angle and each scattered ray angle to obtain each inclination angle;
specifically, in the present embodiment, the unique incident ray angle θ is obtained S Angle theta of scattered ray corresponding to arbitrary second plane wave component on side of the detection point R Substituting into a dip calculation formula, calculating the difference between the incident ray angle and a certain scattered ray angle, and dividing by 2 to obtain a dip angle theta D And repeating the calculation to calculate all the scattered ray angles, a plurality of dip angles corresponding to the unique incident ray angle and the plurality of scattered ray angles can be obtained, as shown in fig. 2.
The inclination calculation formula is:
and S140, substituting the single-shot imaging function of each inclination angle into a single-shot imaging calculation formula based on each inclination angle, incident ray angle and each scattered ray angle to obtain the single-shot imaging function of each inclination angle.
Specifically, in this embodiment, the incident wave field at the source side of the shot point and a plane wave component at the demodulator side are cross-correlated by a single-shot imaging calculation formula to obtain a single-shot imaging function, wherein the incident angles of the incident wave fields of all frequencies are set to be uniform θ S ，S(x,z,θ S (ii) a ω) is the seismic wavefield for all effective frequencies and unique incident ray angles for each effective frequency, R (x, z, θ) R (ii) a ω) is the total and each effective frequencyThe seismic wavefield for each corresponding scatter ray angle. Only selecting the unique incident ray angle corresponding to each effective frequency at one side of the shot source can greatly reduce the calculated amount, but does not reduce the imaging effect of single-shot imaging.
And applying imaging conditions to all plane wave components and incident wave fields on one side of the wave detection point to obtain single-shot imaging results on a plurality of dip angles.
In this embodiment, the single shot imaging calculation formula is:
wherein,
omega is the frequency of the light source,
x is the horizontal coordinate of the single shot imaging point,
z is the depth coordinate of the single shot into a bright spot,
θ S is the angle of incident ray, theta R For angle of scattered radiation, theta D In order to obtain the angle of the inclination angle,
I(x,z,θ D ) A single shot imaging function for an imaging point at a predetermined spatial location underground,
S(x,z,θ S (ii) a Omega) is a seismic wavefield of all effective frequencies and corresponding unique incident ray angles,
R(x,z,θ R (ii) a ω) is the seismic wavefield for all effective frequencies and corresponding scattered ray angles.
S150, acquiring imaging functions of all shot points in the process of circularly executing the single-shot imaging function on all the shot points so as to obtain an inclination angle gather, and stacking the inclination angle gathers to obtain seismic section imaging.
By adopting the method of the embodiment, the accurate dip angle gather can be efficiently obtained, so that the seismic section imaging with high resolution and high signal-to-noise ratio is further obtained.
In this embodiment, the step of obtaining the imaging result of all shots in the process of performing the imaging result of a single shot cyclically for all shots to obtain the dip gather further includes:
subsurface formation analysis is performed based on the seismic imaging profile.
As shown in fig. 4, the international standard sigabe 2A model includes a large number of reflection layers, faults, breakpoints, salt domes, etc., and the positions indicated by black arrows are geological bodies of different types, such as faults, salt dome boundaries, isolated diffraction points, etc. The corresponding shot gather seismic data modeled by finite difference forward modeling also contains a large amount of reflected and diffracted wave energy.
This embodiment uses this well-known model and the corresponding model data to perform an effect test, and forms a depth domain common image point dip gather, as shown in fig. 5.
The spatial locations of the dip gathers in FIG. 5 correspond to the spatial locations indicated by the white lines in FIG. 6, with two isolated diffraction points at different depths, as indicated by the two white arrows in FIG. 5. In fig. 5, the inclination angles of plus and minus 70 degrees are taken, and the energies corresponding to the inclination angle gather are arranged from minus 70 degrees to plus 70 degrees, so that it can be seen that at the position of the reflection point, a specific reflection stratum only corresponds to a specific geological inclination angle at a specific imaging point, and therefore all the reflection energies are relatively and centrally distributed around the inclination angle; isolated diffraction points have no specific geological dip, so the diffracted energy is distributed over a very wide range of geological dips from the gather.
FIG. 6 is an offset imaging section from the superposition of dip gathers, from which it can be seen that many slices, salt dome boundaries, and isolated diffraction points are imaged very clearly.
In summary, the embodiment provides a seismic section imaging method, a plane wave component with a preset frequency of a maximum value is obtained by calculation on one side of a shot source, a ray parameter corresponding to the plane wave component with the maximum value is obtained, a unique incident ray angle is obtained, a multiple scattering angle on one side of a wave detection point is reserved, and an accurate dip gather is efficiently obtained, so that seismic section imaging with high resolution and high signal-to-noise ratio is obtained, the accuracy of underground structure analysis is improved, and geological exploration work is facilitated.
Second embodiment
FIG. 7 is a logic framework diagram of an apparatus for seismic profiling of the present embodiment.
The embodiment provides a device for seismic profile imaging, which comprises:
the seismic wave field acquisition module is used for respectively acquiring a first seismic wave field on a depth slice of the downward edge extension of the shot point and a second seismic wave field of the downward edge extension on one side of the wave detection point by adopting a one-way wave phase shift and interpolation algorithm based on common shot point seismic data;
a calculating incident angle module, configured to perform linear frequency radon transform on the first seismic wave field of all effective frequencies of the shot point to obtain first plane wave components of a first preset frequency, perform norm square operation on the first plane wave components within a preset incident ray angle range to obtain values of the first plane wave components, sort the values, and obtain a first ray parameter, where the first ray parameter is the ray parameter corresponding to the first plane wave component with the largest value, and obtain a unique incident ray angle corresponding to the first ray parameter based on the first ray parameter and a ray parameter calculation formula;
a scatter angle calculation module, configured to perform the frequency radon transform on the second seismic wavefield at all effective frequencies of the detection point to obtain second plane wave components corresponding to all effective frequencies, obtain values of the second ray parameters at all effective frequencies through average sampling within a preset scatter ray angle range, and obtain scatter ray angles corresponding to the second ray parameters based on the second ray parameters and the ray parameter calculation formula;
the single shot inclination angle calculating module is used for calculating half of the difference value between the incident ray angle and each scattered ray angle based on the incident ray angle and each scattered ray angle to obtain each inclination angle;
generating a single-shot imaging module, which is used for obtaining a single-shot imaging function of each inclination angle based on each inclination angle, the incident ray angle and each scattered ray angle which are brought into a single-shot imaging calculation formula;
and the seismic section imaging generation module is used for acquiring imaging results of all shot points in the process of circularly executing the single shot imaging results on all the shot points so as to acquire an inclination angle gather, and stacking the inclination angle gather to acquire seismic section imaging.
The embodiment provides a seismic section imaging device, which is characterized in that a plane wave component with the maximum value and preset frequency is obtained by calculation on one side of a shot point seismic source, a ray parameter corresponding to the plane wave component with the maximum value is obtained, a unique incident ray angle is obtained, a multi-scattering angle on one side of a wave detection point is reserved, and an accurate dip angle gather is efficiently obtained, so that seismic section imaging with high resolution and high signal-to-noise ratio is obtained, the accuracy of underground structure analysis is improved, and geological exploration work is facilitated.
Third embodiment
The present invention provides a storage medium having stored thereon a computer program,
the program when executed by a processor performs the steps of a method of seismic profiling as described in any of the above.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above may be implemented by hardware that is instructed by a computer program, and the computer program may be stored in a non-volatile computer-readable storage medium, and when executed, may include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), rambus (Rambus) direct RAM (RDRAM), direct Rambus Dynamic RAM (DRDRAM), and Rambus Dynamic RAM (RDRAM), among others.
Fourth embodiment
The present invention provides an electronic device, including:
a memory having a computer program stored thereon; and
a processor for executing the computer program in the memory to implement the steps of a method of seismic profiling as described in any of the above.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method of seismic profiling, comprising:
respectively obtaining a first seismic wave field on a preset depth slice of the downward edge extension of the shot point and a second seismic wave field of the downward edge extension of one side of the wave detection point by adopting a one-way wave phase shift and interpolation algorithm based on the common shot point seismic data;
respectively executing frequency radon transform on the first seismic wave field of all effective frequencies of the shot point to obtain each first plane wave component of a first preset frequency, performing norm square operation on each first plane wave component within a preset incident ray angle range to obtain a numerical value of each first plane wave component, sequencing the numerical value and the numerical value, and obtaining a first ray parameter, wherein the first ray parameter is the ray parameter corresponding to the first plane wave component with the maximum numerical value, and the only incident ray angle corresponding to the first ray parameter is obtained on the basis of the first ray parameter and a ray parameter calculation formula;
respectively executing the frequency radon transform on the second seismic wave field of all effective frequencies of the wave detection point to obtain second plane wave components corresponding to all effective frequencies, obtaining numerical values of second ray parameters under all effective frequencies through average sampling in a preset scattering ray angle range, and obtaining scattering ray angles corresponding to the second ray parameters based on the second ray parameters and the ray parameter calculation formula;
calculating half of the difference value between the incident ray angle and each scattered ray angle based on the incident ray angle and each scattered ray angle to obtain each inclination angle;
obtaining a single shot imaging function of each inclination angle by substituting a single shot imaging calculation formula based on each inclination angle, the incident ray angle and each scattered ray angle;
and circularly executing the single shot imaging function on all shot points to obtain imaging functions of all shot points so as to obtain an inclination angle gather, and stacking the inclination angle gather to obtain seismic section imaging.
2. The method of claim 1, wherein said step of performing a frequency radon transform on said first seismic wavefield for all effective frequencies of said shot to obtain first plane-wave components of a first predetermined frequency respectively comprises:
transforming the first seismic wavefield by a fourier transform to obtain a third seismic wavefield;
and transforming the third seismic wave field through the frequency radon transform to obtain each first plane wave component of the first preset frequency.
3. The method of claim 2,
the calculation formula of the Fourier transform is as follows:
wherein,
f (x, t) is the seismic wavefield in the time-space domain,
f (ω, x) is the Fourier transformed frequency-space domain seismic wavefield,
omega is frequency, t is time, x is the horizontal coordinate of the single shot imaging point, and i is an imaginary number index;
the calculation formula of the frequency radon transform is as follows:
wherein,
g (omega, p) is a plane wave component after frequency radon conversion,
f (omega, x) is the seismic wavefield in the frequency-space domain after Fourier transform,
omega is frequency, x is horizontal coordinate of single shot imaging point, i is imaginary index,
[ - δ x, + δ x ] is the extent of the local spatial window centered at the imaging point x,
p k the ray parameters represent the propagation direction of the k-th plane wave component.
4. The method according to claim 1, wherein the step of performing a norm square operation on each of the first plane wave components within a preset incident ray angle range to obtain a numerical value of each of the first plane wave components and sorting the numerical values to obtain a first ray parameter, wherein the ray parameter corresponding to the first plane wave component with the first ray parameter being a maximum numerical value comprises:
setting an upper limit value and a lower limit value of the preset incident ray angle;
obtaining the maximum value and the minimum value of the ray parameter corresponding to the upper limit value and the lower limit value of the preset incident ray angle based on the upper limit value, the lower limit value and the ray parameter calculation formula of the preset incident ray angle;
carrying out average sampling based on the maximum value and the minimum value of the ray parameter, and obtaining the sampling interval of the ray parameter by dividing the difference value of the maximum value and the minimum value of the ray parameter by the sampling times;
based on the sampling interval and the minimum value of the ray parameters, obtaining each ray parameter corresponding to each first plane wave component propagation direction through the product of the sampling interval multiplied by the sampling times and the minimum value of the ray parameters in sequence;
obtaining each first plane wave component in the preset incident ray angle range based on the frequency radon transform calculation formula, the third seismic wave field, the first preset frequency and the horizontal coordinate of the single shot imaging point;
performing norm square operation on the first plane wave components to obtain numerical values of the first plane wave components, and sequencing the numerical values from large to small;
and selecting the ray parameter corresponding to the first plane wave component with the maximum value as the first ray parameter.
5. The method of claim 4, wherein the step of removing the metal oxide layer comprises removing the metal oxide layer from the metal oxide layer
The ray parameter calculation formula is as follows:
wherein p is a ray parameter, θ is an angle, and v is a plane wave propagation velocity, and is generally obtained through measurement.
6. The method of claim 1, wherein performing the single shot imaging results for all shot cycles obtains imaging results for all shots to obtain dip gathers, and wherein stacking the dip gathers to obtain seismic section imaging further comprises:
performing subsurface formation analysis based on the seismic imaging profile.
7. The method of claim 1,
the single-shot imaging calculation formula is as follows:
wherein,
omega is the frequency of the wave to be measured,
x is the horizontal coordinate of the single shot imaging point,
z is the depth coordinate of the single shot imaging point,
θ S is the angle of incident ray, theta R For angle of scattered radiation, theta D In order to obtain the angle of the inclination angle,
I(x,z,θ D ) A single shot imaging function for an imaging point at a predetermined spatial location underground,
S(x,z,θ S (ii) a Omega) is the seismic wavefield for all effective frequencies and corresponding unique incident ray angles,
R(x,z,θ R (ii) a ω) is the seismic wavefield for all effective frequencies and corresponding scatter ray angles.
8. An apparatus for seismic profiling, comprising:
the seismic wave field acquisition module is used for respectively acquiring a first seismic wave field on a preset depth slice of the downward edge extension of the shot point and a second seismic wave field of the downward edge extension of one side of the wave detection point by adopting a one-way wave phase shift and interpolation algorithm based on the common shot point seismic data;
a calculating incident angle module, configured to perform linear frequency radon transform on the first seismic wave field of all effective frequencies of the shot point to obtain first plane wave components of a first preset frequency, perform norm square operation on the first plane wave components within a preset incident ray angle range to obtain values of the first plane wave components, sort the values, and obtain a first ray parameter, where the first ray parameter is the ray parameter corresponding to the first plane wave component with the largest value, and obtain a unique incident ray angle corresponding to the first ray parameter based on the first ray parameter and a ray parameter calculation formula;
a scatter angle calculation module, configured to perform the frequency radon transform on the second seismic wavefield at all effective frequencies of the detection point to obtain second plane wave components corresponding to all effective frequencies, obtain values of the second ray parameters at all effective frequencies through average sampling within a preset scatter ray angle range, and obtain scatter ray angles corresponding to the second ray parameters based on the second ray parameters and the ray parameter calculation formula;
the single shot inclination angle calculating module is used for calculating half of the difference value between the incident ray angle and each scattered ray angle based on the incident ray angle and each scattered ray angle to obtain each inclination angle;
generating a single-shot imaging module, which is used for obtaining a single-shot imaging function of each inclination angle based on each inclination angle, the incident ray angle and each scattered ray angle which are brought into a single-shot imaging calculation formula;
and the seismic section imaging generation module is used for acquiring imaging results of all shot points in the process of circularly executing the single shot imaging results on all the shot points so as to acquire an inclination angle gather, and stacking the inclination angle gather to acquire seismic section imaging.
9. A storage medium having a computer program stored thereon, wherein,
the program when executed by a processor implements the steps of a method of seismic profiling as claimed in any of claims 1 to 7.
10. An electronic device, comprising:
a memory having a computer program stored thereon; and
a processor for executing the computer program in the memory to carry out the steps of a method of seismic profiling as claimed in any of claims 1 to 7.
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