CN115579158B - Reactor core melt piece cooling device - Google Patents
Reactor core melt piece cooling device Download PDFInfo
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- CN115579158B CN115579158B CN202211103302.2A CN202211103302A CN115579158B CN 115579158 B CN115579158 B CN 115579158B CN 202211103302 A CN202211103302 A CN 202211103302A CN 115579158 B CN115579158 B CN 115579158B
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21C—NUCLEAR REACTORS
- G21C15/00—Cooling arrangements within the pressure vessel containing the core; Selection of specific coolants
- G21C15/18—Emergency cooling arrangements; Removing shut-down heat
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
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- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Structure Of Emergency Protection For Nuclear Reactors (AREA)
Abstract
The application discloses a reactor core melt fragment cooling device, which comprises a reactor pit, a fragment collecting assembly, a fragment dispersing and cooling assembly and a water injection assembly, wherein a pressure container is arranged at the upper part of the reactor pit; the debris collecting assembly is fixedly connected with the inner wall of the pit, the debris collecting assembly is provided with a debris discharging channel and a debris discharging outlet, and the pressure container is positioned above the debris discharging channel and/or inside the debris discharging channel; the debris dispersing and cooling assembly is arranged at the bottom of the stacking pit and is positioned below the debris discharge outlet of the debris collecting assembly; the water injection assembly is arranged outside the stacking pit and is communicated with the inside of the stacking pit; according to the application, the molten materials of the pressure vessel are collected by arranging the debris collecting assembly and discharged from the debris discharging port, the debris is dispersed on the debris dispersing and cooling assembly after being dispersed, and then the water injection assembly is used for cooling the debris positioned on the debris dispersing and cooling assembly.
Description
Technical Field
The application relates to the technical field of nuclear industry, in particular to a reactor core melt fragment cooling device.
Background
When a serious accident occurs in the nuclear power station, materials such as fuel components, control rods, stainless steel and the like in the reactor pressure vessel are melted to form high-temperature liquid melt. The core melt is at a temperature up to 3000 ℃, and the faster melt passes through the pressure vessel and then flows into the pit. When a large amount of water is present in the pit, the core melt is broken into pieces of about 1 to 10 mm. Without intervention, these fragments sink to the bottom of the pit and accumulate in a "chevron" shape, referred to herein as a bed of fragments. The decay heat of these fragments themselves can reach 15MW, and the water penetrating into the interior of the fragment bed can be heated to vaporize, producing a large amount of water vapor. The rapid removal of water vapor makes it difficult for water to re-penetrate into the interior of the chip bed, rendering the interior of the chip bed uncooled. The chips in the chip bed can heat up and melt to erode the raft foundation of the containment, if the raft foundation is not thick enough, the bottom plate can be melted through, the integrity of the containment is damaged, and then radioactive substances can directly enter the soil, so that serious influence is caused to the environment.
Disclosure of Invention
The application aims to provide a reactor core molten fragment cooling device, which can change the accumulation mode of molten fragments, disperse the molten fragments into a distribution mode favorable for cooling, and control the accumulation height, thereby realizing efficient cooling of the molten fragments and relieving the serious accident consequence of a reactor.
The application is realized by the following technical scheme:
a core melt chip cooling apparatus comprising:
a stacking pit, wherein a pressure container is arranged at the upper part of the stacking pit;
a debris collection assembly fixedly connected to the inner wall of the pit, the debris collection assembly having a debris discharge passage and a debris discharge outlet, the pressure vessel being located above and/or within the debris discharge passage;
a debris dispersing cooling assembly disposed at the bottom of the pit and below the debris discharge outlet of the debris collecting assembly;
the water injection assembly is arranged outside the stacking pit and communicated with the inside of the stacking pit.
Optionally, the debris collection assembly comprises:
the debris collecting plate is provided with a large-diameter end and a small-diameter end which are communicated with each other, the large-diameter end of the debris collecting plate is the debris discharging channel, the small-diameter end of the debris collecting plate is the debris discharging outlet, and the large-diameter end of the debris collecting plate is positioned above the small-diameter end of the debris collecting plate;
and the debris disperser is of a propeller structure and is fixedly arranged in the debris discharge outlet.
As one embodiment, the inner side surface of the debris collecting plate is a smooth surface, the downward inclination angle of the debris collecting plate is more than or equal to 45 degrees, and the diameter of the debris discharge outlet is more than or equal to 1.0m; the minimum distance between the debris collecting plate and the pressure vessel is more than or equal to 1.0m.
Optionally, the debris dispersing cooling assembly comprises:
the support plate is arranged at the bottom of the stacking pit, and a plurality of support columns supported at the bottom of the stacking pit are arranged on the lower side surface of the support plate;
the lower end faces of the cylinder assemblies are connected with the upper side face of the supporting plate, the central axes of the cylinder assemblies are overlapped, and a gap is arranged between two adjacent cylinder assemblies;
a plurality of support rings of different diameters fixedly disposed between two adjacent cylinder assemblies.
Optionally, the diameter of the cylinder assembly is inversely proportional to the height of the cylinder assembly, the upper end faces of the cylinder assemblies are of a declination structure, and the upper end faces of the cylinder assemblies are located on the same inclined face.
As one embodiment, the gap between two adjacent cylinder assemblies is an annular gap, and the width of the annular gap is less than or equal to 0.5m; setting the minimum height between the supporting circular ring and the upper end surfaces of two adjacent cylinder assemblies as the debris accumulation height which is less than or equal to 1.0m; the angle of the upper end face of the cylinder assembly is set to be the declination angle of the debris collecting assembly, and the declination angle of the debris collecting assembly is more than or equal to 45 degrees.
Optionally, a water gap communicated with the gap is arranged inside the cylinder assembly;
the cylinder assembly includes:
the lower end surface of the outer cylinder coaming is connected with the supporting plate;
the inner cylinder coaming is coaxially arranged in the outer cylinder coaming, the lower end face of the inner cylinder coaming is connected with the supporting plate, and a plurality of vertical water inlet strip holes are formed in the outer cylinder coaming and the inner cylinder coaming;
the inner annular surface of the inclined annular surrounding plate is connected with the upper end surface of the inner cylindrical surrounding plate, the outer annular surface of the inclined annular surrounding plate is connected with the upper end surface of the outer cylindrical surrounding plate, and the upper side surface of the inclined annular surrounding plate is the upper end surface of the cylinder assembly.
Optionally, a plurality of arc water inlets that run through are set up on the support ring, be provided with a plurality of inlet openings that run through in the backup pad, the inlet opening with two adjacent clearance intercommunication between the drum subassembly, the inlet opening still with the water gap intercommunication.
As one embodiment, the width of the arc-shaped water inlet is 2-3 mm, and the width of the water inlet strip hole is less than or equal to 2mm.
Optionally, the water injection assembly includes:
an emergency water source;
the two ends of the water inlet pipeline are respectively communicated with the emergency water source and the inside of the stacking pit, and the water inlet pipeline is provided with a switch valve;
the water level gauge is arranged in the pile pit and is positioned above the spherical sealing head at the lower part of the pressure container;
and when cooling is performed, the water injection quantity is not lower than the water level gauge.
Compared with the prior art, the application has the following advantages and beneficial effects:
the application collects the melt of the pressure vessel through arranging the debris collecting assembly, and discharges the melt from the debris discharge outlet, the dispersed debris is dispersed on the debris dispersing and cooling assembly, and then the water injection assembly is used for cooling the debris positioned on the debris dispersing and cooling assembly;
when a severe accident occurs in the reactor, the "mountain-shaped" accumulation of the molten fragments in the pit is altered, allowing the fragments to disperse into an accumulation more favorable for cooling. The height and the circumference of the chip bed are controlled through design parameters, so that the efficient cooling of the melt is realized, the secondary melting of the melt chips is avoided, and the serious accident consequence of the reactor is relieved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the application and together with the description serve to explain the principles of the application.
Fig. 1 is a schematic structural view of a core melt chip cooling apparatus according to the present application.
Fig. 2 is a schematic view of a chip dispersing cooling assembly according to the present application.
Fig. 3 is a top view of a support ring according to the present application.
Fig. 4 is a schematic view of the structure of the outer cylinder/inner cylinder panel according to the present application.
Fig. 5 is a schematic view of the dimensions of a debris collection plate according to the present application.
Fig. 6 is a schematic dimensional view of a cooling dispersion assembly according to the application.
Reference numerals:
1-pressure vessel, 2-core melt, 3-chip, 4-chip collection plate, 5-mound pit, 6-chip disperser, 7-chip dispersing cooling assembly, 8-water inlet pipe, 9-water gauge, 10-switch, 11-emergency water source, 12-inclined ring roof, 13-cylinder assembly, 14-support ring, 15-support plate, 16-water inlet hole, 17-support column, 18-water gap, 19-gap, 20-arc water inlet, 21-water inlet bar hole, minimum distance between x 1-chip collection plate and pressure vessel, declining angle of x 2-chip collection plate, diameter of x 3-chip discharge port, declining angle of x 4-chip collection assembly, x 5-annular gap width, x 6-chip mound height, width of x 7-arc water inlet, width of x 8-water inlet bar hole.
Detailed Description
The present application will be described in further detail with reference to the drawings and embodiments, for the purpose of making the objects, technical solutions and advantages of the present application more apparent. It is to be understood that the specific embodiments described herein are merely illustrative of the substances, and not restrictive of the application.
It should be further noted that, for convenience of description, only the portions related to the present application are shown in the drawings.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
Embodiments of the present application and features of the embodiments may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Example 1
When a serious accident occurs in the reactor, the temperature of the reactor core melt 2 can reach over 2600 ℃, and the reactor core melt 2 has a continuous decay heat internal heat source which can be easily melted through the pressure vessel 1, and the liquid reactor core melt 2 is instantaneously disintegrated into reactor core melt 2 fragments 3 after meeting water.
As shown in fig. 1, the present embodiment provides a cooling device for the core melt 2 chips 3, which includes a pit 5, a chip collecting assembly, a chip dispersing cooling assembly 7, and a water injection assembly.
The pressure vessel 1 is provided at the upper portion of the pit 5 and is fixed by an existing device, and this embodiment will not be described in detail.
The scrap collecting assembly is fixedly connected with the inner wall of the pit 5, the scrap collecting assembly is provided with a scrap discharging channel and a scrap discharging outlet, the pressure vessel 1 is positioned above the scrap discharging channel and/or inside the scrap discharging channel, and by placing the pressure vessel 1 at the position, the scrap collecting assembly can collect the scrap 3 of the core melt when the accident occurs in the reactor, and then the scrap is discharged from the scrap discharging outlet.
The debris dispersing and cooling assembly 7 is arranged at the bottom of the stacking pit 5 and is positioned below the debris discharge outlet of the debris collecting assembly; the melt chips 3 collected by the chip collecting assembly fall onto the chip dispersing and cooling assembly 7 from the chip discharge outlet, and the dispersion of the melt chips 3 is realized by the chip dispersing and cooling assembly 7, so that the accumulation of the melt chips into a mountain-shaped structure is avoided.
The water injection assembly is arranged outside the stacking pit 5 and is communicated with the inside of the stacking pit 5, after the fragments 3 of the melt are dispersed through the fragment dispersion cooling assembly 7, the fragments 3 are cooled through the water injection assembly, so that the high-efficiency cooling of the melt can be realized, and the secondary melting of the melt is avoided.
The water injection assembly comprises an emergency water source 11, a water inlet pipeline 8 and a water level gauge 9.
Two ends of the water inlet pipeline 8 are respectively communicated with an emergency water source 11 and the inside of the pit 5, and a switch valve 10 is arranged on the water inlet pipeline 8;
the water level gauge 9 is arranged in the pile pit 5 and is positioned above the spherical sealing head at the lower part of the pressure vessel 1, wherein the water injection rate is not lower than the water level gauge 9 when cooling is performed.
After an accident, the on-off valve 10 is opened, water is injected into the pit 5 through the water inlet pipe 8 and floods the leakage of the debris collecting assembly, the debris dispersing cooling assembly 7 and the pressure vessel 1, thereby achieving cooling of the core melt 2. The water level gauge 9 measures the water level, which is required to submerge the spherical head in the lower part of the pressure vessel 1.
Example two
This embodiment is a description of a specific structure of the debris collection assembly in the first embodiment.
As shown in fig. 1 and 5, the debris collection assembly includes a debris collection plate 4 and a debris disperser 6.
The debris collecting plate 4 has a large-diameter end and a small-diameter end which are communicated with each other, and can be regarded as a funnel-like structure, the large-diameter end of the debris collecting plate 4 is a debris discharging channel, the small-diameter end of the debris collecting plate 4 is a debris discharging outlet, and the large-diameter end of the debris collecting plate 4 is positioned above the small-diameter end of the debris collecting plate 4; part of the pressure vessel 1 may be placed inside the debris collection plate 4 or the pressure vessel 1 may be placed above the debris collection plate 4.
The chip disperser 6 is of a propeller structure, the chip disperser 6 is fixedly arranged in the chip discharge port, and when the molten chip 3 is discharged from the chip collecting assembly, the molten chip 3 is impacted by the propeller, so that the chips 3 are uniformly dispersed to the chip dispersing cooling assembly 7 in the circumferential direction.
In addition, the present embodiment provides an example for better implementation of the collection function.
The inner side surface of the debris collecting plate 4 is a smooth surface, the declining angle x2 of the debris collecting plate 4 is more than or equal to 45 degrees, the upper surface layer of the debris collecting plate 4 is smooth, and materials such as concrete, ceramics and stainless steel can be selected, so that the debris 3 can slide downwards on the debris collecting plate 4 smoothly, and the accumulation of the melt debris 3 on the debris collecting plate 4 is prevented.
The diameter x3 of the chip discharge port is more than or equal to 1.0m, so that the blockage of the chip 3 is avoided.
The minimum distance x1 between the chip collecting plate 4 and the pressure vessel 1 is more than or equal to 1.0m, and a certain distance is maintained between the chip collecting plate 4 and the pressure vessel 1, so that the liquid melt can flow out of the pressure vessel 1, and can be fully broken into small chips 3 after contacting with water.
Example III
The present embodiment is a description of the specific structure of the chip dispersing cooling assembly 7 in the first embodiment.
As shown in fig. 2, the debris dispersing cooling assembly 7 includes a support plate 15, a cylinder assembly 13, and a support ring 14.
The supporting plate 15 is arranged at the bottom of the stacking pit 5, and a plurality of supporting columns 17 supported at the bottom surface of the stacking pit 5 are arranged on the lower side surface of the supporting plate 15; a gap 19 exists between the chip dispersing cooling assembly 7 and the bottom of the pit 5 through the support columns 17, so that water injected into the pit 5 enters the chip dispersing cooling assembly 7.
The lower end faces of the cylinder assemblies 13 with different diameters are connected with the upper side face of the supporting plate 15, the central axes of the cylinder assemblies 13 are overlapped, and a gap 19 is arranged between two adjacent cylinder assemblies 13; the melt chips 3 falling from above fall into the gap 19.
A plurality of support rings 14 of different diameters are fixedly disposed between two adjacent cylinder assemblies 13.
Whether the molten chip 3 can be cooled effectively is related to the height and the circumference of the chip 3 accumulation, and when the height and the circumference are too large, water cannot enter the inside of the chip 3 bed due to the outward discharge of water vapor, thereby causing the chip 3 to heat up and melt. For this purpose, the chip 3 accumulation height is controlled by adjusting the height of the support ring 14; the diameter of the cylinder assembly 13 is adjusted to control the mounting interval and thus the packing circumference of the chips 3.
Meanwhile, since the fall of the melt chips 3 is normally distributed, the mounting position of the supporting ring 14 of the inner ring is generally high, and the mounting position of the supporting ring 14 of the outer ring is low.
Meanwhile, in order to enable the fragments 3 to slide to the outer ring gap 19 after the inner ring gap 19 is fully stacked, the diameter of the cylinder assembly 13 is inversely proportional to the height of the cylinder assembly 13, and the upper end surfaces of the cylinder assemblies 13 are inclined downward, and the upper end surfaces of the cylinder assemblies 13 are positioned on the same inclined surface, since the triangular structure is set as shown in fig. 2.
The height is gradually reduced from inside to outside, so that the fragments 3 of the molten material can slide downwards smoothly, and when the stacking height of the fragments 3 on the inner side is larger than a certain value, the fragments 3 can slide downwards automatically to the next stacking area of the fragments 3.
In addition, the present embodiment provides an example for better implementation of the dispersion function.
As shown in FIG. 6, the gap 19 between two adjacent cylinder assemblies 13 is set to be an annular gap, and the annular gap width x5 is less than or equal to 0.5m.
The minimum height between the supporting circular ring 14 and the upper end surfaces of the two adjacent cylinder assemblies 13 is set to be the stacking height of the fragments 3, and the stacking height x6 of the fragments 3 is less than or equal to 1.0m.
The angle of the upper end face of the cylinder assembly 13 is set as the declination angle of the debris collecting assembly, and the declination angle x4 of the debris collecting assembly is more than or equal to 45 degrees.
Meanwhile, the cylinder assembly 13 in the present embodiment is explained, and in order to facilitate cooling of the chips 3 located in the gap 19, it is assumed that the inside of the cylinder assembly 13 is provided with a water gap 18 communicating with the gap 19; meanwhile, water inlet holes are formed in the supporting plate 15, the cylinder assemblies 13 and the supporting circular ring 14, a plurality of through arc-shaped water inlets 20 are formed in the supporting circular ring 14, a plurality of through water inlet holes 16 are formed in the supporting plate 15, the water inlet holes 16 are communicated with gaps 19 between two adjacent cylinder assemblies 13, and the water inlet holes 16 are communicated with the water gaps 18.
Thus, when cooling water is injected through the water injection assembly, water can enter the bed of chips 3 from the bottom, sides and upper, achieving effective cooling of the bed of chips 3.
Under the condition of ensuring the strength, the supporting plate 15 can be provided with a plurality of arc-shaped water inlets 20, and the supporting plate 15 can be provided with a plurality of water inlets 16.
In this embodiment, the cylinder assembly 13 is structured to include an outer cylinder shroud, an inner cylinder shroud, and an inclined annular shroud.
The lower end surface of the outer cylinder coaming is connected with a supporting plate 15; the inner cylinder coaming is coaxially arranged in the outer cylinder coaming, the lower end face of the inner cylinder coaming is connected with the supporting plate 15, and a plurality of vertical water inlet strip holes 21 are formed in the outer cylinder coaming and the inner cylinder coaming; communication between the water gap 18 and the gap 19 is achieved by means of the water inlet strip holes 21.
The inner ring surface of the inclined ring coaming is connected with the upper end surface of the inner cylinder coaming, the outer ring surface of the inclined ring coaming is connected with the upper end surface of the outer cylinder coaming, and the upper side surface of the inclined ring coaming is the upper end surface of the cylinder assembly 13.
Meanwhile, the outer cylinder coaming and the inner cylinder coaming can be formed by splicing a plurality of arc plates.
The size of the water inlet is strictly controlled to prevent too many small chips 3 from leaking out of the cooler, so in this embodiment, the width x7 of the arcuate water inlet 20 is 2mm to 3mm and the width x8 of the water inlet strip holes 21 is 2mm or less.
In the description of the present specification, reference to the terms "one embodiment/manner," "some embodiments/manner," "example," "a particular example," "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment/manner or example is included in at least one embodiment/manner or example of the application. In this specification, the schematic representations of the above terms are not necessarily for the same embodiment/manner or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/modes or examples described in this specification and the features of the various embodiments/modes or examples can be combined and combined by persons skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
It will be appreciated by persons skilled in the art that the above embodiments are provided for clarity of illustration only and are not intended to limit the scope of the application. Other variations or modifications of the above-described application will be apparent to those of skill in the art, and are still within the scope of the application.
Claims (8)
1. A core melt chip cooling apparatus, comprising:
a pit (5), wherein the pressure vessel (1) is arranged at the upper part of the pit (5);
a debris collecting assembly fixedly connected with the inner wall of the stacking pit (5), wherein the debris collecting assembly is provided with a debris discharging channel and a debris discharging outlet, and the pressure vessel (1) is positioned above the debris discharging channel and/or inside the debris discharging channel;
a debris dispersing cooling assembly (7) disposed at the bottom of the pit (5) below the debris discharge port of the debris collecting assembly;
the water injection assembly is arranged outside the stacking pit (5) and is communicated with the inside of the stacking pit (5);
wherein the chip dispersing cooling assembly (7) comprises:
the support plate (15) is arranged at the bottom of the stacking pit (5), and a plurality of support columns (17) supported on the bottom surface of the stacking pit (5) are arranged on the lower side surface of the support plate (15);
the lower end faces of the cylinder assemblies (13) with different diameters are connected with the upper side face of the supporting plate (15), the central axes of the cylinder assemblies (13) are overlapped, and a gap (19) is formed between two adjacent cylinder assemblies (13);
a plurality of supporting rings (14) of different diameters, fixedly arranged between two adjacent cylinder assemblies (13);
the diameter of the cylinder assembly (13) is inversely proportional to the height of the cylinder assembly (13), the upper end faces of the cylinder assemblies (13) are of a declination structure, and the upper end faces of the cylinder assemblies (13) are located on the same inclined plane;
setting the minimum height between the supporting circular ring (14) and the upper end surfaces of the two adjacent cylinder assemblies (13) as a debris accumulation height which is less than or equal to 1.0m;
the respective debris accumulation heights of each of the support rings (14) are substantially equal, and the value of the debris accumulation height is adjusted by adjusting the height of the support ring (14).
2. The core melt chip cooling apparatus as set forth in claim 1, wherein said chip collection assembly comprises:
a debris collecting plate (4) having a large diameter end and a small diameter end which are communicated with each other, the large diameter end of the debris collecting plate (4) being the debris discharge passage, the small diameter end of the debris collecting plate (4) being the debris discharge outlet, the large diameter end of the debris collecting plate (4) being located above the small diameter end of the debris collecting plate (4);
and the debris disperser (6) is of a propeller structure, and the debris disperser (6) is fixedly arranged in the debris discharge outlet.
3. The reactor core melt chip cooling device according to claim 2, characterized in that the inner side surface of the chip collecting plate (4) is a smooth surface, the declination angle of the chip collecting plate (4) is not less than 45 °, and the diameter of the chip discharge port is not less than 1.0m; the minimum distance between the debris collecting plate (4) and the pressure vessel (1) is more than or equal to 1.0m.
4. The core melt chip cooling apparatus as set forth in claim 2, characterized in that a gap (19) between two adjacent cylinder assemblies (13) is set to be an annular gap, and the annular gap width is equal to or less than 0.5m; the angle of the upper end face of the cylinder assembly (13) is set to be the declination angle of the debris disperser (6), and the declination angle of the debris disperser (6) is more than or equal to 45 degrees.
5. The core melt chip cooling device according to claim 1, characterized in that the inside of the cylinder assembly (13) is provided with a water gap (18) communicating with the gap (19);
the cylinder assembly (13) comprises:
the lower end surface of the outer cylinder coaming is connected with the supporting plate (15);
an inner cylindrical coaming which is coaxially arranged in the outer cylindrical coaming, the lower end face of the inner cylindrical coaming is connected with the supporting plate (15), and a plurality of vertical water inlet strip holes (21) are formed in the outer cylindrical coaming and the inner cylindrical coaming;
the inner annular surface of the inclined annular surrounding plate is connected with the upper end surface of the inner cylindrical surrounding plate, the outer annular surface of the inclined annular surrounding plate is connected with the upper end surface of the outer cylindrical surrounding plate, and the upper side surface of the inclined annular surrounding plate is the upper end surface of the cylinder assembly (13).
6. The core melt chip cooling device according to claim 5, characterized in that a plurality of through arc-shaped water inlets (20) are provided on the support ring (14), a plurality of through water inlets (16) are provided on the support plate (15), the water inlets (16) are communicated with a gap (19) between two adjacent cylinder assemblies (13), and the water inlets (16) are also communicated with the water gap (18).
7. The reactor core melt chip cooling device according to claim 6, wherein the width of the arc-shaped water inlet (20) is 2 mm-3 mm, and the width of the water inlet strip hole (21) is less than or equal to 2mm.
8. The core melt chip cooling apparatus as set forth in claim 1, wherein said water injection assembly comprises:
an emergency water source (11);
the two ends of the water inlet pipeline (8) are respectively communicated with the emergency water source (11) and the interior of the pit (5), and a switch valve (10) is arranged on the water inlet pipeline (8);
the water level gauge (9) is arranged in the stacking pit (5) and is positioned above the spherical sealing head at the lower part of the pressure container (1);
wherein, when cooling, the water injection quantity is not lower than the water level gauge (9).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211103302.2A CN115579158B (en) | 2022-09-09 | 2022-09-09 | Reactor core melt piece cooling device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211103302.2A CN115579158B (en) | 2022-09-09 | 2022-09-09 | Reactor core melt piece cooling device |
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| CN115579158B true CN115579158B (en) | 2023-08-22 |
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| WO2012145020A1 (en) * | 2011-04-21 | 2012-10-26 | Performance Contracting, Inc. | Multimodal debris trap |
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