CN115575439A - Semiconductor material heat conductivity detection device - Google Patents

Abstract

The invention discloses a semiconductor material thermal conductivity detection device, which belongs to the field of semiconductor detection and comprises a bottom plate, wherein one end of the upper surface of the bottom plate is fixedly connected with a fixed block, a temperature sensor and an electric heating wire are installed inside the fixed block, three groups of blocking blocks are fixedly connected to the upper surface of the fixed block, one side of each blocking block is fixedly connected with an elastic sheet, and the elastic sheet is designed into an arc structure; the position fixedly connected with controller of fixed block is kept away from to the upper surface of bottom plate, the display screen is installed to one side of controller, the position sliding connection that the upper surface of bottom plate is close to the controller has three group's sliding blocks, and this scheme detects through the semiconductor block to three groups, and the result of detection contrasts each other to further improvement testing result's accuracy projects the result of detection and demonstrates with curved form on the display screen, makes to present more directly perceived of result.

Description

Semiconductor material heat conductivity detection device

Technical Field

The invention relates to the field of semiconductor detection, in particular to a semiconductor material thermal conductivity detection device.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and for example, a diode is a device made of the semiconductor.

The resistivity of semiconductors generally increases with increasing temperature, as opposed to metallic conductors, where different types of semiconductor materials have different functions and characteristics, and the detection of the thermal conductivity of semiconductors is particularly important in order to understand the characteristics of different semiconductors.

The prior Chinese patent discloses a portable semiconductor material thermal conductivity detection device and a use method thereof, and the patent application publication number is as follows: CN113447524a, the detection of the thermal conductivity of the semiconductor in the publication is to heat the semiconductor by gradually heating up the heating wire, and then measure and record the temperature by using the temperature sensor, two variables appear in this detection mode, one variable is to gradually heat up the heating wire, and the other variable is to transfer the heat to the semiconductor in the heating up process by the heating wire, the semiconductor is gradually heated up, if the heating up of the heating wire is fast, the semiconductor is heated up quickly in a short time, if the heating up of the heating wire is slow, the semiconductor is difficult to be heated in a short time, so that the detection result error of the semiconductor is large, which is not favorable for the subsequent deep research on the semiconductor.

Disclosure of Invention

1. Technical problem to be solved

In view of the problems of the prior art, it is an object of the present invention to provide a semiconductor material thermal conductivity detection apparatus, which improves the detection effect by detecting the thermal conductivity of a semiconductor by contacting the semiconductor with a constant heat source, and reduces the error of the experiment by detecting a plurality of groups of semiconductors of the same material at a time and averaging the values of the detection results.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

The device for detecting the heat conductivity of the semiconductor material comprises a bottom plate, wherein one end of the upper surface of the bottom plate is fixedly connected with a fixed block, a temperature sensor and a heating wire are arranged in the fixed block, three groups of blocking blocks are fixedly connected to the upper surface of the fixed block, one side of each blocking block is fixedly connected with an elastic sheet, and the elastic sheet is in an arc-shaped structural design;

the utility model discloses a position fixed connection of fixed block is kept away from to the upper surface of bottom plate, the display screen is installed to one side of controller, the position sliding connection that the upper surface of bottom plate is close to the controller has three sliding blocks of group, three groups the sliding block carries out fixed connection through the connecting block between two liang, the internally mounted of sliding block has thermistor, thermistor and controller electric connection, the upper end fixedly connected with installation piece of sliding block, the inside of installation piece is provided with the extrusion piece, the first spring of fixedly connected with between extrusion piece and the installation piece two.

Further, the upper surface of bottom plate is close to the fixedly connected with rack plate of side, one side meshing of rack plate is connected with the latch, the first button of one side fixedly connected with of latch, the top of first button is provided with the second button, first button and second button are installed on the sliding block that corresponds, one side fixedly connected with rectangular block of first button, one side fixedly connected with third spring of rectangular block, the equal fixedly connected with triangle-shaped piece in the left and right sides of rectangular block, the oblique side of triangle-shaped piece is provided with the trapezoidal piece, the one end fixedly connected with second spring of trapezoidal piece, the one end and the sliding block fixed connection of second spring, it is two sets of the oblique side surface of trapezoidal piece is close to the upper end position and is provided with and promotes the piece, the one end and the second button fixed connection that promote the piece.

Furthermore, both the elastic sheet and the extrusion block are made of conductive materials and are electrically connected with the controller, and the connecting block is made of insulating materials.

Furthermore, the left and right sides surface of controller is close to lower extreme position and rotates and is connected with the pivot, the one end fixedly connected with sealed cowling of pivot.

Furthermore, the inner wall of the sealing cover is fixedly connected with two groups of partition plates, and the outer surfaces of the two sides of each partition plate are fixedly connected with heat preservation cotton.

Furthermore, the open end of the sealing cover is fixedly connected with a first permanent magnet strip, a sealing groove is formed in the position, close to the edge, of the upper surface of the base plate, and a second permanent magnet strip is fixedly connected to the inner bottom of the sealing groove.

Furthermore, an air cushion is fixedly connected to the side surface of the sealing groove.

Furthermore, two groups of first permanent magnets are embedded into one end of the sealing cover, and second permanent magnets are embedded into the two sides of the upper surface of the bottom plate, which are located on the controller.

Furthermore, the thermistor is inserted in the sliding block, one side of the thermistor is tightly abutted with a rubber pad, one side of the rubber pad is fixedly connected with a screw, and one end of the screw penetrates through the sliding block and extends to the outside.

Furthermore, the lower surface of the extrusion block is fixedly connected with micro anti-slip strips which are uniformly distributed, and the micro anti-slip strips are obliquely arranged.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

1. this scheme is through detecting three semiconductor blocks of group, and the result that detects contrasts each other to further improvement testing result's accuracy projects the result that detects and demonstrates with the form of curve on the display screen, makes to present the result more directly perceived.

2. This scheme is passed through the controller to the interior electric current flow direction shell fragment of control power and is located with the extrusion piece, and the inside electric current that has of semiconductor block passes through, and controller electric current crescent, semiconductor block heat-up gradually, and the thermistor detects the temperature that corresponds, throws the result that detects again on the display screen, has increased the detection kind of this device to improve application range.

3. This scheme is through the installation sealed cowling. The sealing performance of the sealing cover and the bottom plate is improved, the problem that the change of the external temperature influences the detection result is avoided, the accuracy of semiconductor detection is ensured, fragments of the semiconductor block can be prevented from splashing, and the effect of protecting an operator is achieved.

4. This scheme is when the installation piece removes suitable position, and fixed sliding block avoids external rocking to lead to the problem that the sliding block removed to the accuracy that semiconductor block detected has been ensured.

Drawings

FIG. 1 is a perspective view of the overall structure of the present invention;

FIG. 2 is a back view of the overall construction of the present invention;

FIG. 3 is a perspective view of the slider and coupling member of the present invention;

FIG. 4 is a cross-sectional view of a slider of the present invention;

FIG. 5 is an enlarged view taken at point A of FIG. 1 in accordance with the present invention;

FIG. 6 is a cross-sectional view of the inside of a corresponding slider of the present invention;

FIG. 7 is a drawing showing a rectangular block and a connecting member according to the present invention;

FIG. 8 is a perspective view of the seal cap of the present invention;

FIG. 9 is a cross-sectional view of a base plate of the present invention;

FIG. 10 is a perspective view of an extrusion block of the present invention;

FIG. 11 is a semiconductor diagram of the present invention.

The reference numbers in the figures illustrate:

1. a base plate; 2. a controller; 3. a barrier block; 4. a fixed block; 5. a spring plate; 6. a slider; 7. extruding the block; 8. mounting blocks; 9. connecting blocks; 10. a display screen; 11. a first spring; 12. a thermistor; 13. a first key; 14. a second key; 15. a rack plate; 16. clamping teeth; 17. a second spring; 18. a pushing block; 19. a sealing cover; 20. a rotating shaft; 21. a partition plate; 22. heat preservation cotton; 23. a first permanent magnet strip; 24. a sealing groove; 25. an air cushion; 26. a second permanent magnet bar; 27. a first permanent magnet; 28. a second permanent magnet; 29. a micro anti-slip strip; 30. rubber; 31. a screw; 32. a rectangular block; 33. a triangular block; 34. a trapezoidal block; 35. and a third spring.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1 to 4 and 11, a semiconductor material thermal conductivity detection device includes a bottom plate 1, a fixed block 4 is fixedly connected to one end of an upper surface of the bottom plate 1, a temperature sensor and an electric heating wire are installed inside the fixed block 4, three groups of blocking blocks 3 are fixedly connected to the upper surface of the fixed block 4, an elastic sheet 5 is fixedly connected to one side of each blocking block 3, and the elastic sheet 5 is designed to be an arc-shaped structure;

fixed block 4's position fixedly connected with controller 2 is kept away from to bottom plate 1's upper surface, display screen 10 is installed to one side of controller 2, bottom plate 1's upper surface is close to controller 2's position sliding connection has three sliding blocks of group 6, sliding block 6 of three groups carries out fixed connection through connecting block 9 between two liang, sliding block 6's internally mounted has thermistor 12, thermistor 12 and 2 electric connection of controller, sliding block 6's upper end fixedly connected with installation piece 8, the inside of installation piece 8 is provided with extrusion piece 7, extrusion piece 7 and installation piece 8 are the first spring 11 of fixedly connected with between two.

Firstly, an operator is required to operate the controller 2 to start the electric heating wire in the fixed block 4, heat the electric heating wire to a preset temperature and stop heating, and keep the temperature stable all the time, a temperature sensor arranged in the fixed block 4 is mainly used for monitoring the temperature change of the electric heating wire, after the temperature of the electric heating wire is stable, the operator picks up three groups of semiconductor blocks to be detected, the three groups of semiconductor blocks are same in shape and size, one end of each semiconductor block is inserted below the extrusion block 7, the extrusion block 7 moves up to the inside of the installation block 8 when the semiconductor blocks are inserted, the first spring 11 is compressed, the extrusion block 7 can tightly press the semiconductor blocks under the resilience force of the first spring 11 to fix the semiconductor, then one group of the installation blocks 8 is pushed, the three groups of installation blocks 8 can move, the sliding blocks 6 are fixedly connected with each other through the connecting block 9, and the installation blocks 8 are pushed to the fixed block 4, the other ends of the three groups of semiconductor blocks are correspondingly inserted between the elastic sheets 5 and the fixed blocks 4 until the blocking blocks 3 are tightly pressed to stop pushing the installation blocks 8, the temperature of the electric heating wires is transferred to the fixed blocks 4, the temperature of the fixed blocks 4 is transferred to one end of the semiconductor blocks, after one end of the semiconductor blocks is heated, the temperature of the semiconductor blocks is gradually transferred to the other end and heats the sliding blocks 6, the connecting blocks 9 and the bottom plate 1 are both made of materials with poor heat conductivity, or the surface of the connecting blocks is coated with aerogel, so that the heat transfer between every two sliding blocks 6 is avoided as much as possible, the detection accuracy is improved, the thermistor 12 monitors the temperature change of the sliding blocks 6 every second and transfers the data to the controller 2, the controller 2 respectively records the temperature changes of the three groups of sliding blocks 6, then the recorded data are projected onto the display screen 10, the upper half part of the display screen 10 shows that the temperature of the sliding blocks 6 gradually rises along with the time, the temperature of the three groups of sliding blocks 6 rises every second, the temperature of the three groups of sliding blocks 6 rises to be an average value, the temperature of the three groups of sliding blocks 6 rises to be projected to the lower half part of the display screen 10 in a curve mode, errors during detection are reduced through the average temperature value, results are presented in a curve mode to be more visual, and the detection results are mutually compared through detection of the three groups of semiconductor blocks, so that the accuracy of the detection results is further improved.

In addition, the sliding block 6 can move, so that semiconductor materials with different lengths can be detected, the application range of the device is enlarged, and the practicability is improved.

As an embodiment of the present invention, referring to fig. 5 to 7, a rack plate 15 is fixedly connected to a position close to a side edge of the upper surface of the bottom plate 1, a latch 16 is engaged and connected to one side of the rack plate 15, a first key 13 is fixedly connected to one side of the latch 16, a second key 14 is disposed above the first key 13, the first key 13 and the second key 14 are mounted on the corresponding sliding block 6, a rectangular block 32 is fixedly connected to one side of the first key 13, a third spring 35 is fixedly connected to one side of the rectangular block 32, triangular blocks 33 are fixedly connected to both left and right sides of the rectangular block 32, a trapezoidal block 34 is disposed on an oblique side surface of the triangular block 33, a second spring 17 is fixedly connected to one end of the trapezoidal block 34, one end of the second spring 17 is fixedly connected to the sliding block 6, a pushing block 18 is disposed on an oblique side surface close to an upper end of the two sets of trapezoidal blocks 34, and one end of the pushing block 18 is fixedly connected to the second key 14.

After the mounting block 8 is pushed, the three groups of sliding blocks 6 need to be fixed, the sliding blocks 6 are prevented from moving due to the fact that the external environment shakes during detection, and the detection result is inaccurate, the first key 13 is pressed before the mounting block 8 is pushed, the first key 13 moves into the sliding blocks 6 and drives the rectangular blocks 32 to move together, the rectangular blocks 32 compress the third springs 35, meanwhile, the inclined surfaces of the two groups of triangular blocks 33 can extrude the inclined surfaces of the corresponding trapezoidal blocks 34, the trapezoidal blocks 34 can extrude the second springs 17, when the inclined surfaces of the triangular blocks 33 are not in contact with the inclined surfaces of the trapezoidal blocks 34, the back surfaces of the trapezoidal blocks 34 can be clamped on the back surfaces of the triangular blocks 33, so that the triangular blocks 33 are prevented from moving reversely, the first key 13 is prevented from moving, the teeth 16 are not meshed with the rack plates 15 any more at the moment, the mounting block 8 can be pushed, the second keys 14 move inwards, the pushing blocks 18 can extrude the two groups of trapezoidal blocks 34, the two groups of trapezoidal blocks 34 move towards the two sides, the key blocks 33 are not pressed at the proper position, the second keys 14 is pressed, the third keys 35 is prevented from moving, the sliding blocks 6, and the third keys 6 are prevented from moving accurately, and the sliding blocks 6 are prevented from being meshed, and the sliding blocks 6, the sliding blocks 6 are prevented from moving, and the sliding blocks 6 are prevented from moving accurately detected, and the sliding blocks 6, and the sliding blocks 13 are prevented from moving, and the sliding blocks.

Referring to fig. 1 to 2, as an embodiment of the present invention, the elastic sheet 5 and the pressing block 7 are both made of a conductive material and are electrically connected to the controller 2, and the connection block 9 is made of an insulating material.

When the passing magnitude of the current in the semiconductor block needs to be detected and the heating speed of the semiconductor block is influenced, firstly, the electric heating wire does not supply power during detection, the current flowing into the control power supply through the controller 2 flows to the spring piece 5 and the squeezing block 7, the current passes through the semiconductor block, the current of the controller 2 is gradually increased, the semiconductor block is gradually heated, the thermistor 12 detects the corresponding temperature, the detected result is projected on the display screen 10, the detection type of the device is increased, and therefore the application range is enlarged.

Referring to fig. 1 and 8, as an embodiment of the present invention, a rotating shaft 20 is rotatably connected to the left and right side surfaces of the controller 2 near the lower end, and a seal cover 19 is fixedly connected to one end of the rotating shaft 20.

When detecting the thermal conductivity or the power-on heating property of the semiconductor, the external temperature change easily influences the experimental data of the semiconductor block, the sealing cover 19 is rotated when detecting the semiconductor, the sealing cover 19 rotates by taking the rotating shaft 20 as the rotating center, and the sealing cover 19 covers the bottom plate 1, so that the problem that the change of the external temperature influences the detection result is avoided, and the error generated during detection is reduced as much as possible.

Referring to fig. 8, two sets of partition plates 21 are fixedly connected to the inner wall of the sealing cover 19, and insulation cotton 22 is fixedly connected to both outer surfaces of the partition plates 21.

When the sealing cover 19 covers the bottom plate 1, the partition plate 21 is located between every two of the three groups of semiconductor blocks, the effect of partitioning the semiconductor blocks is achieved, the problem that the detection result is affected due to the fact that the semiconductor blocks are heated when heat is transmitted mutually through air is avoided, the heat insulation cotton 22 mounted on the partition plate 21 is used for preventing the temperatures on the two sides of the partition plate 21 from being transmitted mutually, meanwhile, the semiconductor blocks are located in a relatively stable environment, accuracy of semiconductor detection is guaranteed, in addition, when the semiconductor blocks are detected, the semiconductor blocks are splashed due to overhigh temperature, the sealing cover 19 can prevent the splashed semiconductor blocks, and the effect of protecting operators is achieved.

Referring to fig. 1, 2, 8 and 9, as an embodiment of the present invention, a first permanent magnet bar 23 is fixedly connected to an opening end of the seal cover 19, a seal groove 24 is formed in a position close to an edge of an upper surface of the base plate 1, and a second permanent magnet bar 26 is fixedly connected to an inner bottom of the seal groove 24.

When 19 lids on bottom plate 1 at the sealed cowling, in 23 joint seal grooves 24 of first permanent magnet strip, first permanent magnet strip 23 and the mutual magnetism of second permanent magnet strip 26 are inhaled simultaneously, realize the fixed to sealed cowling 19, avoid external rocking to lead to rocking of sealed cowling 19, sealed cowling 19 rocks and causes sealed cowling 19 to open easily, make in the external air enters into sealed cowling 19, influence the testing result of semiconductor block, ensure through fixed sealed cowling 19 that the detection of semiconductor block is in the relatively stable environment.

Referring to fig. 9, an air cushion 25 is fixedly coupled to a side surface of the sealing groove 24.

When the first permanent magnet strip 23 is clamped in the sealing groove 24, the first permanent magnet strip 23 can extrude the air cushions 25 on two sides, so that the sealing cover 19 is in close contact with the bottom plate 1, and air is prevented from entering the sealing cover 19 from a gap between the first permanent magnet strip and the bottom plate.

As an embodiment of the present invention, referring to the figure, two sets of first permanent magnets 27 are embedded in one end of the sealing cover 19, and second permanent magnets 28 are embedded in both sides of the controller 2 on the upper surface of the base plate 1.

When the sealing cover 19 is opened, the sealing cover 19 needs to be fixed, otherwise, the bottom plate 1 is shaken when the semiconductor blocks are installed or removed, the sealing cover 19 is easy to rotate downwards to influence the operation, and when the sealing cover 19 is opened, the first permanent magnet blocks 27 and the second permanent magnet blocks 28 are mutually attracted by magnetic force, so that the sealing cover 19 is fixed, and the operation of an operator on the semiconductor blocks is facilitated.

Referring to fig. 3 and 4, in an embodiment of the present invention, the thermistor 12 is inserted into the sliding block 6, a rubber pad 30 is tightly pressed against one side of the thermistor 12, a screw 31 is fixedly connected to one side of the rubber pad 30, and one end of the screw 31 penetrates through the sliding block 6 and extends to the outside.

When thermistor 12 damages, through unscrewing screw 31, and no longer fix thermistor 12, alright change with extracting thermistor 12 this moment, easy operation is convenient, after changing the completion, insert new thermistor 12 again and screw up screw 31 in sliding block 6, rubber pad 30 on the screw 31 supports tight thermistor 12, the realization is fixed thermistor 12, rubber pad 30 texture is softer and avoids the extrusion to damage thermistor 12, rubber pad 30 adopts high temperature resistant material preparation to form simultaneously, ensure that rubber pad 30 can use in high temperature environment.

Referring to fig. 10, as an embodiment of the present invention, micro anti-slip strips 29 are fixedly connected to the lower surface of the extrusion block 7, and the micro anti-slip strips 29 are obliquely arranged.

The micro anti-slip strips 29 can increase the friction between the semiconductor block and the squeeze block 7 when the semiconductor block is inserted under the squeeze block 7, thereby improving the fixing effect of the semiconductor block.

The working principle is as follows: firstly, an operator is required to operate the controller 2 to start the heating wire in the fixed block 4 and heat the heating wire to a preset temperature to stop heating, and the temperature is kept stable all the time, the temperature sensor arranged in the fixed block 4 is mainly used for monitoring the temperature change of the resistance wire, after the temperature of the electric heating wire is stabilized, an operator takes three groups of semiconductor blocks to be tested, the three groups of semiconductor blocks have the same shape and size, one end of each semiconductor block is inserted below the extrusion block 7, the pressing blocks 7 move up to the inside of the mounting blocks 8 and compress the first springs 11 when the semiconductor blocks are inserted, the pressing blocks 7 press the semiconductor blocks under the repulsive force of the first springs 11 to achieve the fixing of the semiconductor, and then push one set of the mounting blocks 8, three groups of mounting blocks 8 all move, because the sliding blocks 6 are fixedly connected with each other through the connecting blocks 9, the mounting blocks 8 are pushed to the fixing blocks 4, the other ends of the three groups of semiconductor blocks are correspondingly inserted between the elastic sheets 5 and the fixing blocks 4 until the blocking blocks 3 are tightly pressed to stop pushing the mounting blocks 8, the temperature of the electric heating wire is transferred to the fixing blocks 4, the temperature of the fixing blocks 4 is transferred to one ends of the semiconductor blocks, after one ends of the semiconductor blocks are heated, the temperature of the sliding block can be gradually transferred to the other end to heat the sliding block 6, the connecting block 9 and the bottom plate 1 are both made of materials with poor heat conductivity, or aerogel is coated on the surface of the connecting block to avoid heat transfer between every two sliding blocks 6 as much as possible, thus improving the detection accuracy, the thermistor 12 monitors the temperature change of the sliding block 6 every second, and transmits the data to the controller 2, the controller 2 records the temperature changes of the three groups of sliding blocks 6 respectively, then, the recorded data is projected on a display screen 10, so that the detection result can be observed conveniently;

when the passing magnitude of the current in the semiconductor block needs to be detected and the temperature rising speed of the semiconductor block is influenced, firstly, the electric heating wire does not supply power during detection, the current in the control power supply flows to the spring piece 5 and the squeezing block 7 through the controller 2, the current passes through the semiconductor block, the current of the controller 2 is gradually increased, the semiconductor block is gradually heated, the thermistor 12 detects the corresponding temperature, and the detected result is projected on the display screen 10, so that the detection type of the device is increased.

The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.

Claims (10)

1. A semiconductor material thermal conductivity detection device comprises a bottom plate (1), and is characterized in that: a fixed block (4) is fixedly connected to one end of the upper surface of the bottom plate (1), a temperature sensor and an electric heating wire are installed inside the fixed block (4), three groups of blocking blocks (3) are fixedly connected to the upper surface of the fixed block (4), an elastic sheet (5) is fixedly connected to one side of each blocking block (3), and the elastic sheet (5) is designed to be of an arc-shaped structure;

the utility model discloses a position fixed connection of fixed block (4) is kept away from to the upper surface of bottom plate (1) has controller (2), display screen (10) are installed to one side of controller (2), the position sliding connection that the upper surface of bottom plate (1) is close to controller (2) has three group's sliding block (6), three group sliding block (6) carry out fixed connection through connecting block (9) between two liang, the internally mounted of sliding block (6) has thermistor (12), thermistor (12) and controller (2) electric connection, the upper end fixedly connected with installation piece (8) of sliding block (6), the inside of installation piece (8) is provided with extrusion piece (7), the first spring (11) of fixedly connected with between extrusion piece (7) and installation piece (8) two.

2. The apparatus for detecting thermal conductivity of semiconductor material according to claim 1, wherein: the upper surface of the bottom plate (1) is close to a rack plate (15) fixedly connected with the position of a side edge, one side of the rack plate (15) is meshed with a latch (16), one side of the latch (16) is fixedly connected with a first key (13), a second key (14) is arranged above the first key (13), the first key (13) and the second key (14) are installed on corresponding sliding blocks (6), one side of the first key (13) is fixedly connected with a rectangular block (32), one side of the rectangular block (32) is fixedly connected with a third spring (35), the left side and the right side of the rectangular block (32) are both fixedly connected with triangular blocks (33), the inclined side surfaces of the triangular blocks (33) are provided with trapezoidal blocks (34), one end of each trapezoidal block (34) is fixedly connected with a second spring (17), one end of each second spring (17) is fixedly connected with the corresponding sliding block (6), the inclined side surfaces of the two sets of the trapezoidal blocks (34) are close to the upper end positions and provided with pushing blocks (18), and one end of the pushing blocks (18) is fixedly connected with the second key (14).

3. The apparatus for detecting thermal conductivity of semiconductor material according to claim 1, wherein: the elastic sheet (5) and the extrusion block (7) are both made of conductive materials and are electrically connected with the controller (2), and the connecting block (9) is made of insulating materials.

4. The apparatus for detecting thermal conductivity of semiconductor material according to claim 1, wherein: the left and right sides surface of controller (2) is close to lower extreme position and rotates and is connected with pivot (20), the one end fixedly connected with sealed cowling (19) of pivot (20).

5. The apparatus for detecting thermal conductivity of a semiconductor material according to claim 4, wherein: the inner wall of the sealing cover (19) is fixedly connected with two groups of partition plates (21), and the outer surfaces of two sides of each partition plate (21) are fixedly connected with heat preservation cotton (22).

6. The apparatus for detecting thermal conductivity of semiconductor material according to claim 4, wherein: the opening end fixedly connected with first permanent magnetism strip (23) of sealed cowling (19), seal groove (24) have been seted up near the marginal position to the upper surface of bottom plate (1), the interior bottom fixedly connected with second permanent magnetism strip (26) of seal groove (24).

7. The apparatus for detecting thermal conductivity of a semiconductor material according to claim 6, wherein: and an air cushion (25) is fixedly connected to the side surface of the sealing groove (24).

8. The apparatus for detecting thermal conductivity of semiconductor material according to claim 4, wherein: two sets of first permanent magnets (27) are installed in the one end embedding of sealed cowling (19), second permanent magnets (28) are all installed in the both sides that the upper surface of bottom plate (1) is located controller (2) embedding.

9. The apparatus for detecting thermal conductivity of semiconductor material according to claim 1, wherein: the thermal resistor (12) is inserted into the sliding block (6), one side of the thermal resistor (12) is tightly abutted with a rubber pad (30), one side of the rubber pad (30) is fixedly connected with a screw (31), and one end of the screw (31) penetrates through the sliding block (6) and extends to the outside.

10. The apparatus for detecting thermal conductivity of semiconductor material according to claim 1, wherein: the lower surface of the extrusion block (7) is fixedly connected with micro anti-slip strips (29) which are uniformly distributed, and the micro anti-slip strips (29) are obliquely arranged.

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