CN115570750A

CN115570750A - Injection mold and method for precise structural part of electronic product

Info

Publication number: CN115570750A
Application number: CN202211191546.0A
Authority: CN
Inventors: 夏伟; 余丽; 陆学军; 王永志
Original assignee: Anhui Green Energy Technology Research Institute Co Ltd
Current assignee: Anhui Green Energy Technology Research Institute Co Ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-01-06

Abstract

The invention discloses an injection mold and a method for a precise structural part of an electronic product, and particularly relates to the technical field of injection molds, wherein a molding cavity is preheated by high-temperature steam in a heating cavity, so that the molding cavity is ensured to be in a high-temperature state, injection liquid is ensured to have better flowing performance in the molding cavity, the defects of welding marks, gas marks and the like are eliminated, the end parts of two cooling water pipes are inserted, a connecting end enters an accommodating cavity, a conical pin enters a conical groove, and the two cooling water pipes are quickly communicated, so that the circulating circulation of cooling water between the two cooling water pipes is ensured, the electronic product in the molding cavity in a lower die holder is circularly cooled through the cooling water pipes, cooled and solidified, the molding is accelerated, and the production efficiency of the product is improved; the thread butting sleeve is rotatably connected with the steam guide pipe, so that the normal rotation work of the thread butting sleeve is ensured, and the communication between the steam guide pipe and the air inlet is realized.

Description

Injection mold and method for precise structural part of electronic product

Technical Field

The invention relates to the technical field of injection molds, in particular to an injection mold and a method for a precise structural part of an electronic product.

Background

The electronic products are related products based on electric energy, most of the electronic products such as routers and switches are produced by adopting plastic shells and generally adopting injection molds, and the injection mold method has the advantages of high production speed, high efficiency, automation realization of operation, various colors and varieties, simple and frequent shapes, small size and accurate product size.

Through the retrieval, the utility model patent of publication No. CN215283094U discloses an accurate injection mold of electronic product casing, through the design of stopper and reference column, utilize the reference column convenience to go up mould and bed die and once fix a position, laminate the in-process at last mould and bed die, the stopper can play the effect of spacing guide to last mould, carry out the secondary location to last mould, so that the briquetting of last mould can be fast and accurate inside in the mould groove of impressing, utilize the mould groove to carry out quick preparation to the product casing.

However, when the electronic product is injected, the injection molding liquid is poor in fluidity after being filled into the molding cavity, so that weld marks are easily generated, and the quality of the electronic product is affected.

Disclosure of Invention

The invention aims to provide an injection mold and a method for a precise structural part of an electronic product, wherein a molding cavity is preheated by high-temperature steam in a heating cavity, so that the molding cavity is ensured to be in a high-temperature state, injection liquid is ensured to have better flowing performance in the molding cavity, the defects of welding marks, gas marks and the like are eliminated, the end parts of two cooling water pipes are spliced, a connecting end enters an accommodating cavity, a conical pin enters a conical groove, and the two cooling water pipes are quickly communicated, so that the circulating circulation of cooling water between the two cooling water pipes is ensured, and the electronic product in the molding cavity in a lower die holder is circularly cooled, solidified and molded quickly by the cooling water pipes, so that the problems in the background technology are solved.

The invention can be realized by the following technical scheme: an injection mold for a precise structural part of an electronic product comprises a lower die holder which is arranged on a substrate and used for injecting the electronic product, wherein side plates are connected to the front side surface and the rear side surface of the lower die holder respectively, a circulating cooling mechanism used for cooling the lower die holder is arranged at the joint of the side plates and the lower die holder, a heating mechanism used for keeping injection molding liquid flowing is arranged in the lower die holder and positioned at the bottom of a molding die cavity, and the heating mechanism comprises a heating cavity body arranged at the bottom of the molding cavity; the circulative cooling mechanism includes two sealed joint each other and is the condenser tube of U-shaped structure, and one of them condenser tube's terminal surface is provided with the toper round pin, the terminal surface of toper round pin is provided with the link, and another condenser tube's tip is equipped with on the surface holds the chamber and with the toper round pin complex bell jar of pegging graft with the mutual joint of link.

The invention has the further technical improvements that: one side of condenser tube is provided with the water inlet, and condenser tube's opposite side is provided with the delivery port, the surface embedding of water inlet installs solenoid valve one, the embedding is installed solenoid valve two on the surface of delivery port, water inlet and delivery port all link to each other with recirculated cooling water tank.

The invention has further technical improvements that: all be equipped with the arc wall two of laminating mutually with the condenser tube surface on the front side surface and the rear side surface of die holder, the curb plate be equipped with the arc wall one of laminating mutually with the condenser tube surface on the surface, the inner wall of arc wall one is equipped with the constant head tank on the surface, install on the surface of condenser tube and peg graft complex reference column with the constant head tank.

The invention has the further technical improvements that: the utility model discloses a locking device of die holder, including curb plate, die holder, lateral plate, connecting plate, lateral plate, the lateral plate is kept away from the arc wall and is equipped with the lockhole on the surface, slidable mounting has the retaining member that is used for blockking the screens to the curb plate on the side of die holder, the retaining member includes the horizontal plate, and one side of horizontal plate is provided with the connecting plate with the laminating of curb plate surface, the connecting plate be provided with on the surface with lockhole grafting complex locking piece.

The invention has the further technical improvements that: the piston push block is installed on one side end of the horizontal plate and is in sliding fit with the lower die holder, the push plate is arranged on the other side of the horizontal plate, a reset cavity is arranged on the side face of the lower die holder and is in sliding fit with the end face of the piston push block, a sliding column is installed inside the reset cavity and is in sliding fit with the piston push block, and a spring is installed between the outer surface of the sliding column and the inner cavity of the piston push block and the reset cavity.

The invention has further technical improvements that: the temperature rising mechanism also comprises an air inlet which is arranged on one side of the lower die holder and communicated with the temperature rising cavity, the other side of the lower die holder is provided with an air outlet which is communicated with the temperature rising cavity, and the end part of the air outlet is connected with the air inlet end of the second air pump through a pipeline; the steam box is characterized in that a thread butting sleeve is sleeved on the outer thread of the air inlet, the end part of the thread butting sleeve is rotatably connected with a steam guide pipe, two shifting blocks are symmetrically arranged on the outer surface of the thread butting sleeve, the end part of the steam guide pipe is connected with the air outlet end of a first air pump, and the air inlet end of the first air pump is connected with the air outlet end of the steam box body.

The invention has the further technical improvements that: the lower die holder is provided with four ejector pins for ejecting a molded product, and the top surfaces of the ejector pins are flush with the bottom surface of the inner cavity of the molding cavity.

The invention also provides a method for the injection mold of the precise structural part of the electronic product, which comprises the following specific use steps:

step one, attaching the two cooling water pipes to the arc-shaped groove II and enabling the two cooling water pipes to be in sealed insertion connection, ensuring the circulation of cooling water, and installing the side plates and the corresponding cooling water pipes;

step two, firstly, the thread butting sleeve is stirred by the two stirring blocks to be in threaded sleeve joint on the outer surface of the thread butting sleeve, the end part of the thread butting sleeve and the steam guide pipe rotate to realize the sleeve joint installation of the thread butting sleeve and the air inlet, high-temperature steam in the steam guide pipe enters the heating cavity, injection molding liquid is injected, and the fluidity of the injection molding liquid is ensured through the high-temperature steam;

pumping high-temperature steam out by a second air pump, supplying water to two cooling water pipes by a circulating cooling water tank, attaching the surfaces of the cooling water pipes to the surfaces of the arc-shaped groove II and the arc-shaped groove I, transferring the heat of the molding cavity in the lower die holder into the cooling water pipes, increasing the temperature of the cooling water pipes, absorbing the heat of the molding cavity in the lower die holder, ensuring the circulating circulation of the cooling water in the cooling water pipes, reducing the temperature and accelerating the cooling molding of electronic products;

and step four, after cooling and forming, ejecting the formed workpiece of the electronic product by four ejector pins.

Compared with the prior art, the invention has the following beneficial effects:

1. according to the invention, the molding cavity is preheated by high-temperature steam in the heating cavity, the molding cavity is ensured to be in a high-temperature state, the injection molding liquid is ensured to have better flowing performance in the molding cavity, the defects of weld marks, gas marks and the like are eliminated, the quality is improved, then the molding cavity is switched into a circulating cooling mechanism, the end parts of two cooling water pipes are spliced, the connecting end enters the accommodating cavity, the conical pin enters the conical groove, the two cooling water pipes are quickly communicated, the circulating circulation of the cooling water between the two cooling water pipes is ensured, the cooling water pipes are attached to the surface of the arc-shaped groove II, heat is guided to be transferred into the cooling water pipes, the electronic product in the molding cavity in the lower die holder is circularly cooled through the cooling water pipes, the cooling and solidification are carried out, the molding is accelerated, and the production efficiency of the product is improved;

2. according to the invention, the horizontal plate is pulled by the push plate and the piston push block is driven to slide in the reset cavity, so that the spring is elastically deformed outside the sliding column, the corresponding side plate is attached to the end surface of the lower die holder at the moment, the cooling water pipe is stably placed by inserting the positioning column into the positioning groove, the pulling force acting on the locking part is removed, the spring is restored to deform, the piston push block on the locking part is restored to the initial state, the locking block enters the locking hole, the side plate and the lower die holder are quickly installed, the maintenance of the two cooling water pipes is facilitated, and the sealing property is improved;

3. in the invention, the thread butting sleeve is rotationally connected with the steam guide pipe, so that the normal rotation work of the thread butting sleeve is ensured, and the communication between the steam guide pipe and the air inlet is realized.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic external view of the present invention;

FIG. 2 is a schematic perspective view of the lower die holder and the cooling water tube of the present invention;

FIG. 3 is an enlarged view of a portion of the invention at A in FIG. 2;

FIG. 4 is a schematic view of the structure of two cooling water pipes according to the present invention;

FIG. 5 is a schematic view showing the structural connection between the locking member and the lower die base according to the present invention;

FIG. 6 is a plan view of the cooling water tube of the present invention;

FIG. 7 is a schematic structural view of a temperature-elevating chamber according to the present invention;

FIG. 8 is an enlarged view of a portion of the invention at B in FIG. 1;

fig. 9 is a schematic view of the structural connection of the steam guide pipe and the threaded coupling sleeve according to the present invention.

In the figure: 1. a lower die holder; 2. a fixed mount; 3. a side plate; 4. a cooling water pipe; 5. a lifting plate; 6. an upper die holder; 7. a first arc-shaped groove; 8. positioning a groove; 9. a water inlet; 10. a water outlet; 11. an arc-shaped groove II; 12. a locking member; 13. a positioning column; 14. a lock hole; 15. a first electromagnetic valve; 16. a second electromagnetic valve; 17. a tapered pin; 18. a tapered groove; 19. a connecting end; 20. an accommodating chamber; 21. resetting the cavity; 22. a traveler; 23. a spring; 24. a piston push block; 25. a connecting plate; 26. a locking block; 27. pushing the plate; 28. heating the cavity; 29. a thimble; 30. an air inlet; 31. a steam conduit; 32. the thread is butted with the sleeve.

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects according to the present invention will be given with reference to the accompanying drawings and preferred embodiments.

Referring to fig. 1 to 9, the invention provides an injection mold for a precision structural member of an electronic product, which includes a lower die holder 1 installed on a substrate and used for injection molding of the electronic product, side plates 3 are connected to the front side and the rear side of the lower die holder 1, a circulating cooling mechanism for cooling the lower die holder 1 is installed at the joint of the side plates 3 and the lower die holder 1, a heating mechanism for keeping injection molding liquid flowing is arranged inside the lower die holder 1 and at the bottom of a molding cavity, and the heating mechanism includes a heating cavity 28 arranged at the bottom of the molding cavity; the circulating cooling mechanism comprises two cooling water pipes 4 which are hermetically clamped and connected with each other and are of a U-shaped structure, a conical pin 17 is arranged on the end face of one cooling water pipe 4, a connecting end 19 is arranged on the end face of the conical pin 17, a containing cavity 20 which is mutually clamped with the connecting end 19 and a conical groove 18 which is in plug-in fit with the conical pin 17 are arranged on the end face of the other cooling water pipe 4, in a use state, the lower die base 1 is firstly heated, injection molding liquid flows into the forming cavity, the forming cavity is preheated through high-temperature steam in a heating cavity 28, the forming cavity is ensured to be in a high-temperature state, the injection molding liquid is ensured to have better flowing performance in the forming cavity, defects such as welding marks, gas marks and the like are eliminated, before hot steam is introduced, one cooling water pipe 4 is attached to the inner cavities corresponding to the two arc-shaped grooves 11, then the other cooling water pipe 4 is installed, the two cooling water pipes 4 are flush, the end portions of the two cooling water pipes 4 are plugged, the connecting end portions 19 enter the containing cavity 20, the conical pin 17 enters the conical groove 18, quick communication of the two cooling water pipes 4 is ensured, the cooling water pipes are convenient for cooling and the ejector pin cooling water pipe 1 for improving the production efficiency of the ejector pin for the circulating cooling of the ejector pin.

All be equipped with arc two 11 with 4 surface facies laminating of condenser tube on the preceding side surface of die holder 1 and the rear side surface, the curb plate 3 be equipped with on the surface with 4 surface facies laminating of condenser tube arc 7, the inner wall of arc 7 is equipped with constant head tank 8 on the surface, install on the surface of condenser tube 4 with constant head tank 8 grafting complex reference column 13, after condenser tube 4 has been installed, curb plate 3 that will correspond and the 4 involutions of condenser tube that correspond, wherein reference column 13 pegs graft with constant head tank 8 and realizes the installation of curb plate 3, two condenser tube 4 and two 11 surface laminatings of arc, guide heat transfer to in two condenser tube 4.

One side of cooling water pipe 4 is provided with water inlet 9, and the opposite side of cooling water pipe 4 is provided with delivery port 10, solenoid valve one 15 is installed to the surface embedding of water inlet 9, solenoid valve two 16 is installed to the embedding on the surface of delivery port 10, water inlet 9 all links to each other with recirculated cooling water tank with delivery port 10, supply water to cooling water pipe 4 by recirculated cooling water tank, water in cooling water pipe 4 passes through delivery port 10 and enters into recirculated cooling water tank again, reenter in cooling water pipe 4 through water inlet 9, through the circulation of solenoid valve one 15 and the two 16 control water of solenoid valve, satisfy different user state.

A locking hole 14 is formed in the surface, away from the arc-shaped groove I7, of the side plate 3, a locking part 12 used for blocking and clamping the side plate 3 is slidably mounted on the side surface of the lower die holder 1, the locking part 12 comprises a horizontal plate, a connecting plate 25 attached to the surface of the side plate 3 is arranged on one side of the horizontal plate, and a locking block 26 in inserting fit with the locking hole 14 is arranged on the surface of the connecting plate 25; the end part of one side of the horizontal plate is provided with a piston push block 24 which is in sliding fit with the lower die holder 1, the other side of the horizontal plate is provided with a push plate 27, the side surface of the lower die holder 1 is provided with a reset cavity 21 which is in sliding fit with the end surface of the piston push block 24, the inside of the reset cavity 21 is provided with a slide column 22 which is in sliding fit with the piston push block 24, the outer surface of the slide column 22 is positioned between the piston push block 24 and the inner cavity of the reset cavity 21 and is provided with a spring 23, before the side plate 3 is installed, the locking member 12 is pulled outwards and slides with the side surface of the lower die holder 1, so that the side plate 3 is convenient to be installed, the specific operation is as follows, the horizontal plate is pulled through the push plate 27 and the piston push block 24 is driven to slide in the reset cavity 21, so that the spring 23 is elastically deformed outside the slide column 22, at the moment, the corresponding side plate 3 and the end surface of the lower die holder 1 are installed in an attaching mode, the positioning column 13 and the positioning groove 8 are inserted to realize the stable placement of the cooling water pipe 4, then, the pulling force acting on the locking member 12 is removed, the spring 23 recovers the deformation, the locking member 24 recovers the locking member, the locking block 26 enters the initial state, the locking hole 14 and further realizes the quick installation of the lower die holder 1, the cooling water pipe 4, and the maintenance of the lower die holder, and the cooling water pipe, and the side plate, and the maintenance of the lower die holder 1 is convenient for the cooling water pipe, and the side plate, and maintenance of the side plate.

The temperature-raising mechanism also comprises an air inlet 30 which is arranged at one side of the lower die holder 1 and is communicated with the temperature-raising cavity 28, an air outlet which is communicated with the temperature-raising cavity 28 is arranged at the other side of the lower die holder 1, and the end part of the air outlet is connected with the air inlet end of a second air pump through a pipeline; the external thread of the air inlet 30 is sleeved with a thread butting sleeve 32, the end part of the thread butting sleeve 32 is rotatably connected with a steam conduit 31, two shifting blocks are symmetrically arranged on the outer surface of the thread butting sleeve 32, the end part of the steam conduit 31 is connected with the air outlet end of a first air pump, the air inlet end of the first air pump is connected with the air outlet end of a steam box body, the inner cavity of the steam conduit 31 is communicated with the inner wall of the thread butting sleeve 32, when the heating mechanism is used, the thread butting sleeve 32 is sleeved outside the air inlet 30 through the two shifting blocks, the thread butting sleeve 32 is rotatably connected with the steam conduit 31, the normal rotating work of the thread butting sleeve 32 is ensured, the communication between the steam conduit 31 and the air inlet 30 is realized, high-temperature steam enters the heating cavity 28 from the air inlet 30 through the steam conduit 31 under the input of the first air pump, and is further preheated in the molding cavity, and the flowability of injection molding liquid is ensured.

Install mount 2 through four support columns on the top surface of base plate, the below of mount 2 is provided with the lifter plate 5 that slides and link to each other with four support columns, installs on the bottom surface of lifter plate 5 with 1 cooperation injection moulding's of die holder upper die base 6, and lifter plate 5 is driven by hydraulic cylinder.

The lower die holder 1 is provided with four ejector pins 29 for ejecting a molded product, and the top surfaces of the ejector pins 29 are flush with the bottom surface of the inner cavity of the molding cavity, so that the injection molding of the electronic product is ensured.

step one, attaching the two cooling water pipes 4 to the arc-shaped groove II 11, enabling the two cooling water pipes 4 to be in sealed insertion connection, ensuring the circulation of cooling water, and installing the side plates 3 and the corresponding cooling water pipes 4;

step two, firstly, the two shifting blocks are used for shifting the thread butting sleeve 32 to be in thread sleeving connection with the outer surface of the thread butting sleeve 32, the end part of the thread butting sleeve 32 and the steam guide pipe 31 are rotated to realize the sleeving connection of the thread butting sleeve 32 and the air inlet 30, high-temperature steam in the steam guide pipe 31 enters the heating cavity 28, injection molding liquid is injected, and the fluidity of the injection molding liquid is ensured through the high-temperature steam;

pumping high-temperature steam out by a second air pump, supplying water to the two cooling water pipes 4 by a circulating cooling water tank, attaching the surfaces of the cooling water pipes 4 to the surfaces of the arc-shaped groove II 11 and the arc-shaped groove I7, transferring the heat of the molding cavity in the lower die holder 1 into the cooling water pipes 4, increasing the temperature of the cooling water pipes 4, absorbing the heat of the molding cavity in the lower die holder 1, ensuring the circulating circulation of the cooling water in the cooling water pipes 4, reducing the temperature and accelerating the cooling molding of the electronic product;

and step four, after cooling and forming, ejecting the formed workpiece of the electronic product by four ejector pins 29.

When the injection molding device is used, injection molding liquid flows into a molding cavity, the molding cavity is preheated by high-temperature steam in the heating cavity 28, the molding cavity is ensured to be in a high-temperature state, the injection molding liquid has better flowing performance in the molding cavity, the defects of welding marks, gas marks and the like are eliminated, the end parts of the two cooling water pipes 4 are inserted, the connecting end 19 enters the accommodating cavity 20, the conical pin 17 enters the conical groove 18, the two cooling water pipes 4 are quickly communicated, the circulating flow of cooling water between the two cooling water pipes 4 is ensured, the electronic product in the molding cavity in the lower die holder 1 is circularly cooled through the cooling water pipes 4, the cooling and solidification are realized, the molding is accelerated, and the production efficiency of the product is improved;

the horizontal plate is pulled through the push plate 27 and the piston push block 24 is driven to slide in the reset cavity 21, so that the spring 23 elastically deforms outside the sliding column 22, the corresponding side plate 3 is attached to and installed on the end face of the lower die holder 1 at the moment, stable placement of the cooling water pipe 4 is achieved through insertion of the positioning column 13 and the positioning groove 8, then the pulling force acting on the locking part 12 is removed, the spring 23 restores deformation, the piston push block 24 on the locking part 12 restores to the initial state, the locking block 26 enters the locking hole 14, rapid installation of the side plate 3 and the lower die holder 1 is achieved, further, overhaul of the two cooling water pipes 4 is facilitated, and sealing performance is improved;

because the thread butting sleeve 32 is rotatably connected with the steam conduit 31, the normal rotation work of the thread butting sleeve 32 is ensured, and the communication between the steam conduit 31 and the air inlet 30 is realized.

Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.

Claims

1. The utility model provides a precision structure spare injection mold of electronic product, is including installing die holder (1) that is used for moulding plastics electronic product on the base plate, its characterized in that: the injection molding machine is characterized in that side plates (3) are connected to the front side surface and the rear side surface of the lower die holder (1), a circulating cooling mechanism for cooling the lower die holder (1) is installed at the joint of the side plates (3) and the lower die holder (1), a heating mechanism for keeping injection molding liquid flowing is arranged in the lower die holder (1) and at the bottom of a molding die cavity, and the heating mechanism comprises a heating cavity (28) arranged at the bottom of the molding die cavity; the circulative cooling mechanism includes two condenser tube (4) that seal joint each other and be the U-shaped structure, and the terminal surface of one of them condenser tube (4) is provided with toper round pin (17), the terminal surface of toper round pin (17) is provided with link (19), and the tip surface of another condenser tube (4) is equipped with holds chamber (20) and with toper round pin (17) grafting complex tapered groove (18) with the mutual joint of link (19).

2. The injection mold for the precise structural part of the electronic product as claimed in claim 1, wherein one side of the cooling water pipe (4) is provided with a water inlet (9), the other side of the cooling water pipe (4) is provided with a water outlet (10), a first electromagnetic valve (15) is embedded in the surface of the water inlet (9), a second electromagnetic valve (16) is embedded in the surface of the water outlet (10), and the water inlet (9) and the water outlet (10) are both connected with a circulating cooling water tank.

3. The injection mold for the precise structural part of the electronic product as claimed in claim 1, wherein the front side surface and the rear side surface of the lower mold base (1) are provided with arc-shaped grooves II (11) which are attached to the surface of the cooling water pipe (4), the surface of the side plate (3) is provided with arc-shaped grooves I (7) which are attached to the surface of the cooling water pipe (4), the inner wall surface of each arc-shaped groove I (7) is provided with a positioning groove (8), and the outer surface of the cooling water pipe (4) is provided with a positioning column (13) which is matched with the positioning groove (8) in an inserted manner.

4. The injection mold for the precise structural part of the electronic product, according to claim 1, is characterized in that the side plate (3) away from the arc-shaped groove I (7) is provided with a locking hole (14) on the surface, the side surface of the lower die holder (1) is provided with a locking member (12) for blocking the locking position of the side plate (3), the locking member (12) comprises a horizontal plate, one side of the horizontal plate is provided with a connecting plate (25) attached to the surface of the side plate (3), and the connecting plate (25) is provided with a locking block (26) which is matched with the locking hole (14) in an inserted manner on the surface.

5. The injection mold for the precise structural part of the electronic product as claimed in claim 1, wherein a piston push block (24) in sliding fit with the lower die holder (1) is installed on one side end of the horizontal plate, a push plate (27) is arranged on the other side of the horizontal plate, a reset cavity (21) in sliding fit with the end face of the piston push block (24) is arranged on the side face of the lower die holder (1), a sliding column (22) in sliding fit with the piston push block (24) is installed inside the reset cavity (21), and a spring (23) is installed between the outer surface of the sliding column (22) and the inner cavities of the piston push block (24) and the reset cavity (21).

6. The injection mold for the precise structural part of the electronic product as claimed in claim 1, wherein the warming mechanism further comprises an air inlet (30) arranged at one side of the lower mold base (1) and communicated with the warming cavity (28), an air outlet communicated with the warming cavity (28) is arranged at the other side of the lower mold base (1), and the end of the air outlet is connected with the air inlet end of the second air pump through a pipeline; the outside screw thread of air inlet (30) has cup jointed cover (32) with screw thread, the tip of screw thread butt joint cover (32) rotates and is connected with steam pipe (31), and the symmetry is provided with two shifting blocks on the surface of screw thread butt joint cover (32), the tip of steam pipe (31) links to each other with the end of giving vent to anger of first air pump, and the inlet end of first air pump links to each other with the end of giving vent to anger of steam box.

7. The injection mold for the precise structural part of the electronic product as claimed in claim 1, wherein the lower mold base (1) is provided with four ejector pins (29) for ejecting the molded product, and the top surfaces of the ejector pins (29) are flush with the bottom surface of the inner cavity of the molding cavity.

8. A method for an injection mold of a precise structural part of an electronic product is characterized by comprising the following specific using steps:

step one, two cooling water pipes (4) are attached to a second arc-shaped groove (11) and the two cooling water pipes (4) are in sealed insertion connection, circulation of cooling water is guaranteed, and the side plates (3) and the corresponding cooling water pipes (4) are installed;

secondly, the thread butting sleeve (32) is shifted through the two shifting blocks to be in threaded socket joint with the outer surface of the thread butting sleeve (32), the thread butting sleeve (32) and the air inlet (30) are installed in a sleeved mode through rotation of the end portion of the thread butting sleeve (32) and the steam guide pipe (31), high-temperature steam in the steam guide pipe (31) enters the temperature rise cavity (28), injection molding liquid is injected, and the flowability of the injection molding liquid is guaranteed through the high-temperature steam;

pumping high-temperature steam out by a second air pump, supplying water to two cooling water pipes (4) by a circulating cooling water tank, attaching the surfaces of the cooling water pipes (4) to the surfaces of an arc-shaped groove II (11) and an arc-shaped groove I (7), transferring the heat of a molding cavity in the lower die holder (1) into the cooling water pipes (4), increasing the temperature of the cooling water pipes (4), absorbing the heat of the molding cavity in the lower die holder (1), ensuring the circulating circulation of the cooling water in the cooling water pipes (4), reducing the temperature and accelerating the cooling molding of the electronic product;

and step four, after cooling and forming, ejecting the formed workpiece of the electronic product by four ejector pins (29).