CN115561092A - Circuit board bending property testing device - Google Patents
Circuit board bending property testing device Download PDFInfo
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- CN115561092A CN115561092A CN202211545671.7A CN202211545671A CN115561092A CN 115561092 A CN115561092 A CN 115561092A CN 202211545671 A CN202211545671 A CN 202211545671A CN 115561092 A CN115561092 A CN 115561092A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
Abstract
The invention discloses a circuit board bending performance testing device, which relates to the technical field of circuit board testing, and comprises a base, a testing component, an airflow adjusting component and a temperature control component, wherein the testing component, the airflow adjusting component and the temperature control component are fixedly arranged on the base; by arranging the test assembly, the corresponding fixed position can be selected according to the test requirement of the circuit board, and various measurement methods are realized; the testing component is also provided with a handle capable of adjusting the testing rotation amplitude, so that the combination of multiple rotation amplitudes is realized, and the testing result is more accurate; the air flow adjusting assembly is arranged to evenly transmit air flow into the testing cavity, the temperature of the testing environment is controlled, the temperature control assembly is arranged, rapid temperature adjustment can be achieved according to actual testing requirements, the switch which is opened intermittently is arranged, and energy conservation and emission reduction to the greatest extent are achieved.
Description
Technical Field
The invention relates to the technical field of circuit board testing, in particular to a circuit board bending performance testing device.
Background
The bending test is mainly used for testing the performance of the material when the material is subjected to bending load, and the bending test is commonly used in production for evaluating the bending strength and the plastic deformation of the material. The bending test generates tensile stress on the convex side of the sample and compressive stress on the concave side. This creates a shear stress zone along the midline. Common bending test measurement methods include a two-point measurement method and a three-point measurement method; the two-point bending test is mainly suitable for testing paper, paperboard and films and determining the bending stiffness and bending strength of the paper, the paperboard and the paperboard; the three-point bending test is the most common test method for polymers, and the main test results include bending strength and bending modulus. In a three-point bending test, a uniform stress area is very small and is concentrated below a central loading point; the circuit board is widely applied to the fields of communication equipment, industrial control, medical electronics and the like, and the detection of the bending resistance of the circuit board needs to adopt a two-point measurement method and a three-point measurement method; however, the prior art has a single measurement mode, and the measurement amplitude cannot be adjusted in the measurement process, so that the test result is one-sided, and in addition, the performances of the materials are different at different temperatures, so that the temperature of the test environment needs to be controlled.
Chinese utility model patent publication No. CN210719962U discloses a circuit board solder joint bending stress experimental apparatus, which comprises a base and two paired clamping mechanisms for clamping a circuit board, wherein one of the clamping mechanisms is fixed on the base, and the side surface of the other clamping mechanism is connected with a power mechanism for driving the clamping mechanism to translate; the lower end of the other side of the power mechanism is fixed on the base; and displacement measuring mechanisms for measuring the deformation of the circuit board under bending stress are arranged above and below the circuit board clamped between the two clamping mechanisms through mounting frames, and the mounting frames can slide left and right relative to the base. According to the scheme, the circuit board is clamped by the two clamping mechanisms, so that the circuit board can be kept horizontal and does not creep; one clamping mechanism is driven to move through a power mechanism so as to exert deformation force on the circuit board and realize the bending deformation of the circuit board, and the deformation is measured through a displacement measuring mechanism so as to realize the bending performance test of the circuit board simply, conveniently and quickly; however, the device fails to solve the problems that the prior art has a single measurement mode, cannot adjust the test amplitude in the test process, cannot control the temperature of the test environment of the circuit board, and causes the test result of the circuit board to be one-sided, thereby affecting the product quality.
Disclosure of Invention
Aiming at the technical problems, the invention is provided with the testing component, the airflow adjusting component and the temperature control component, and solves the problems that the prior art has a single measuring mode, cannot adjust the testing amplitude and cannot control the testing environment temperature.
The technical scheme adopted by the invention is as follows: a circuit board bending performance testing device comprises a base, a testing component, an airflow adjusting component and a temperature control component, wherein the testing component, the airflow adjusting component and the temperature control component are fixedly arranged on the base; the temperature control assembly comprises a plurality of temperature control U-shaped convex blocks and temperature control concave convex blocks which are fixedly arranged on the first testing gear, the temperature control U-shaped convex blocks are in sliding fit with temperature control sliding blocks which are fixedly arranged on the temperature control rotating V-shaped frame, and the temperature control concave convex blocks are in sliding fit with temperature control fixing columns which are fixedly arranged on the temperature control rotating V-shaped frame.
Furthermore, the temperature control rotating V-shaped frame is rotatably arranged on the temperature control fixed support, a temperature control tensioning spring is movably arranged on the temperature control rotating V-shaped frame, the other end of the temperature control tensioning spring is movably arranged on the temperature control fixed support, one end of the temperature control rotating V-shaped frame is movably arranged in the temperature control rotating frame, a temperature control connecting rod is movably arranged on the temperature control rotating frame, and the temperature control connecting rod is rotatably arranged on the temperature control sliding plug.
Furthermore, the testing component comprises a testing motor fixedly arranged on the base, an output shaft of the testing motor is fixedly provided with a testing power gear, a testing sliding groove is fixedly arranged on the testing power gear, a testing sliding block is arranged on the testing sliding groove in a sliding manner, a testing touch column and a testing touch block are fixedly arranged on the testing sliding block, and the testing touch column is in sliding fit with a testing fixing frame fixedly arranged on the base; the test touch block is in sliding fit with a test fixed baffle fixedly arranged on the test rotating frame; the test rotating frame is fixedly arranged on the test transmission shaft.
Furthermore, a test clamping support is also rotatably arranged on the test transmission shaft, the test clamping support is fixedly arranged on the base, and a test tightening torsion spring is fixedly arranged between the test clamping support and the test rotating frame; the test clamping support is provided with a first test clamping connecting rod and a second test clamping connecting rod in a rotating mode, a first test fixing seat is fixedly arranged on the first test clamping connecting rod, a first test clamping column is arranged in the first test fixing seat in a sliding mode, a spring is fixedly arranged between the first test fixing seat and the first test clamping column, a second test fixing seat is fixedly arranged on the second test clamping connecting rod, a second test clamping column is arranged in the second test fixing seat in a sliding mode, a reset spring is fixedly arranged between the second test clamping column and the second test fixing seat, and the first test clamping column and the first test clamping support are in sliding fit with a round hole in the test clamping support.
Furthermore, a first test adjusting handle and a second test adjusting handle are rotatably arranged on the test clamping support, the second test adjusting handle is meshed with the second test clamping connecting rod, and the first test adjusting handle is meshed with the first test clamping connecting rod; the test device comprises a test transmission shaft, a test fixing plate, a test sliding ring, a test fixing column and a test eccentric wheel, wherein the test transmission shaft is fixedly provided with the test fixing plate, the test fixing plate is in sliding fit with the test sliding ring, the test sliding ring is arranged on the test fixing column in a sliding mode, and the test eccentric wheel is fixedly arranged on the test fixing column.
Further, it is provided with test transmission connecting rod to rotate on the test eccentric wheel, the test transmission connecting rod other end rotates and is provided with the test control post, the fixed test transmission ring that is provided with on the test control post, it is provided with the test movable support to rotate on the test transmission ring, the test movable support other end rotates and sets up on the test rotation mount, the test rotates the mount and rotates the setting on the test stationary cylinder, the fixed setting of test stationary cylinder is on test circle shell, the fixed test main mount that is provided with on the test rotation mount, the fixed test U-shaped mount that is provided with on the test circle shell, it is provided with test mount two and test mount one to slide on the test U-shaped mount, it is provided with the test screw thread to rotate on test mount two and the test mount one.
Furthermore, the airflow adjustment subassembly sets up the airflow adjustment rotating turret on the base including rotating, it is provided with test gear two to slide in the airflow adjustment rotating turret, it is provided with the airflow adjustment connecting rod to rotate on the test sliding tray, airflow adjustment connecting rod one end is rotated and is set up on the airflow adjustment carriage.
Furthermore, the airflow adjusting rotating frame is oval, and an annular groove is formed in the airflow adjusting rotating frame.
Compared with the prior art, the invention has the beneficial effects that: 1. according to the invention, by arranging the test assembly, the corresponding fixed position can be selected according to the test requirement of the circuit board, so that a two-point or three-point measurement method is realized; the test assembly is also provided with a handle capable of adjusting the test rotation range, so that the combination of multiple rotation ranges is realized, and the test result is more accurate. 2. The air flow is uniformly transmitted into the testing cavity by arranging the air flow adjusting assembly, so that the temperature of the testing environment is controlled. 3. Through setting up temperature control assembly, can realize the temperature rapid adjustment according to actual test demand to set up the switch that is interrupted and open, realize furthest energy saving and emission reduction.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic diagram (front view) of the overall structure of the present invention.
Fig. 3 is a third schematic view (side view) of the overall structure of the present invention.
Fig. 4 is a partial structural diagram of the first embodiment of the present invention.
Fig. 5 is a schematic view of a partial structure of the present invention.
FIG. 6 is a partial structure diagram of a testing assembly according to the present invention.
FIG. 7 is a partial structural diagram of a second testing assembly according to the present invention.
FIG. 8 is a third partial structural diagram of a testing assembly according to the present invention.
FIG. 9 is a schematic view of a portion of an airflow adjustment assembly according to the present invention.
FIG. 10 is a schematic view of a partial structure of a temperature control assembly according to the first embodiment of the present invention.
Fig. 11 is a partial structural schematic diagram of a temperature control assembly according to a second embodiment of the present invention.
Reference numerals: 1-testing the component; 2-an airflow adjustment assembly; 3-a temperature control component; 4-a base; 101-testing the motor; 102-test gear one; 103-test gear two; 104-test grip holder; 105-testing the power gear; 106-test fixture; 107-test sliding groove; 108-test slider; 109-test touch post; 110-test touch block; 111-test fixed baffles; 112-a test turret; 113-testing the clamping connecting rod I; 114-test chucking column one; 115-test fixture I; 116-test adjustment handle one; 117-test adjusting handle II; 118-testing the clamping column II; 119-a second test fixing seat; 120-testing a second clamping connecting rod; 121-testing to tighten the torsion spring; 122-testing the propeller shaft; 123-test fixing support; 124-testing the fixing plate; 125-test slip ring; 126-test fixing column; 127-testing the eccentric wheel; 128-test drive link; 129-test control column; 130-testing the U-shaped fixing frame; 131-testing the driving ring; 132-test movable rack; 133-testing the rotating holder; 134-test stationary cylinder; 135-test the first fixing frame; 136-testing the main fixing frame; 137-testing the second fixing frame; 138-test thread; 139-test ring housing; 201-airflow adjusting fan blades; 202-an airflow adjustment chute; 203-airflow adjusting rack; 204-airflow adjustment gear; 205-air flow adjustment carriage; 206-airflow adjustment linkage; 207-airflow adjustment turret; 301-temperature control U-shaped bumps; 302-temperature controlled concave convex block; 303-temperature control sliding blocks; 304-temperature control fixing column; 305-temperature controlled tensioning springs; 306-temperature control fixed support; 307-temperature control rotating V-shaped frame; 308-temperature control rotating frame; 309-temperature control connecting rod; 310-temperature controlled sliding plug; 311-temperature control fixed cylinder; 312-temperature controlled sliding plug box; 313-temperature controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
As shown in fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, a circuit board bending performance testing device includes a testing component 1, an airflow adjusting component 2, a temperature control component 3, and a base 4, where the testing component 1 includes a testing motor 101 fixedly disposed on the base 4, an output shaft of the testing motor 101 is fixedly disposed with a testing power gear 105, the testing power gear 105 is fixedly disposed with a testing sliding slot 107, the testing sliding slot 107 is slidably disposed with a testing slider 108, a spring is disposed between the testing slider 108 and the testing sliding slot 107, the testing slider 108 is fixedly disposed with a testing touch column 109 and a testing touch block 110, and the testing touch column 109 is slidably engaged with a testing fixing frame 106 fixedly disposed on the base 4; the test touch block 110 is in sliding fit with a test fixed baffle 111 fixedly arranged on a test rotating frame 112; the test rotating frame 112 is fixedly arranged on the test transmission shaft 122; the testing power gear 105 is rotatably connected with the testing transmission shaft 122, the testing transmission shaft 122 is further rotatably provided with a testing clamping support 104, the testing clamping support 104 is fixedly arranged on the base 4, and a testing tightening torsion spring 121 is fixedly arranged between the testing clamping support 104 and the testing rotating frame 112; the test clamping support 104 is rotatably provided with a first test clamping connecting rod 113 and a second test clamping connecting rod 120, a first test fixing seat 115 is fixedly arranged on the first test clamping connecting rod 113, a first test clamping column 114 is arranged in the first test fixing seat 115 in a sliding mode, a spring is fixedly arranged between the first test fixing seat 115 and the first test clamping column 114, a second test fixing seat 119 is fixedly arranged on the second test clamping connecting rod 120, a second test clamping column 118 is arranged in the second test fixing seat 119 in a sliding mode, a reset spring is fixedly arranged between the second test clamping column 118 and the second test fixing seat 119, and the second test clamping column 118 and the first test clamping column 114 are in sliding fit with a circular hole in the test clamping support 104.
The test clamping support 104 is also rotatably provided with a first test adjusting handle 116 and a second test adjusting handle 117, the second test adjusting handle 117 is meshed with the second test clamping connecting rod 120, and the first test adjusting handle 116 is meshed with the first test clamping connecting rod 113; a test fixing plate 124 is fixedly arranged on the test transmission shaft 122, the test fixing plate 124 is in sliding fit with a test sliding ring 125, the test sliding ring 125 is slidably arranged on a test fixing column 126, and a test eccentric wheel 127 is fixedly arranged on the test fixing column 126; the testing eccentric 127 is rotatably arranged on the testing fixing bracket 123, and the testing fixing bracket 123 is fixedly arranged on the base 4.
The testing eccentric wheel 127 is rotatably provided with a testing transmission connecting rod 128, the other end of the testing transmission connecting rod 128 is rotatably provided with a testing control column 129, a testing transmission ring 131 is fixedly arranged on the testing control column 129, a testing movable support 132 is rotatably arranged on the testing transmission ring 131, the other end of the testing movable support 132 is rotatably arranged on a testing rotary fixing frame 133, a testing rotary fixing frame 133 is rotatably arranged on a testing fixing cylinder 134, the testing fixing cylinder 134 is fixedly arranged on a testing ring shell 139, a testing main fixing frame 136 is fixedly arranged on the testing rotary fixing frame 133, a testing U-shaped fixing frame 130 is fixedly arranged on the testing ring shell 139, a testing fixing frame two 137 and a testing fixing frame one 135 are slidably arranged on the testing U-shaped fixing frame 130, and testing threads 138 are rotatably arranged on the testing fixing frame two 137 and the testing fixing frame one 135.
The airflow adjusting assembly 2 comprises an airflow adjusting rotating frame 207 which is rotatably arranged on the base 4, a second testing gear 103 is arranged in the airflow adjusting rotating frame 207 in a sliding manner, an airflow adjusting connecting rod 206 is rotatably arranged on the testing sliding groove 107, and one end of the airflow adjusting connecting rod 206 is rotatably arranged on an airflow adjusting sliding frame 205; an airflow adjusting rack 203 is slidably arranged on the airflow adjusting sliding frame 205, the airflow adjusting rack 203 is further slidably arranged in the airflow adjusting sliding groove 202, the airflow adjusting rack 203 is meshed with an airflow adjusting gear 204, and an airflow adjusting fan blade 201 is fixedly arranged on the airflow adjusting gear 204.
The temperature control assembly 3 comprises a plurality of temperature control U-shaped convex blocks 301 and temperature control concave convex blocks 302 which are fixedly arranged on the first test gear 102, the temperature control U-shaped convex blocks 301 are in sliding fit with temperature control sliding blocks 303 which are fixedly arranged on a temperature control rotating V-shaped frame 307, and the temperature control concave convex blocks 302 are in sliding fit with temperature control fixed columns 304 which are fixedly arranged on the temperature control rotating V-shaped frame 307; the temperature control rotating V-shaped frame 307 is rotatably arranged on the temperature control fixing support 306, a temperature control tensioning spring 305 is movably arranged on the temperature control rotating V-shaped frame 307, the other end of the temperature control tensioning spring 305 is movably arranged on the temperature control fixing support 306, one end of the temperature control rotating V-shaped frame 307 is movably arranged in the temperature control rotating frame 308, a temperature control connecting rod 309 is movably arranged on the temperature control rotating frame 308, the temperature control connecting rod 309 is rotatably arranged on the temperature control sliding plug 310, the temperature control sliding plug 310 is slidably arranged in the temperature control sliding plug box 312, a temperature controller 313 is fixedly arranged on one side of the temperature control sliding plug box 312, an airflow adjusting fan blade 201 is slidably arranged in the temperature control fixing cylinder 311, and the temperature control fixing cylinder 311 is fixedly arranged on the test ring shell 139.
The invention discloses a circuit board bending performance testing device, which has the working principle that: firstly, a tested circuit board penetrates through a testing main fixing frame 136, a knob is rotated to tightly press the circuit board, two ends of the circuit board are fixed on a testing fixing frame II 137 and a testing fixing frame I135, and a testing thread 138 is adjusted to a proper position; the testing motor 101 is started, the testing power gear 105, the testing gear II 103 and the testing gear I102 are driven to rotate, the testing power gear 105 drives the testing sliding groove 107 to rotate, the testing touch block 110 is driven, the testing touch block 110 rotates to drive the testing fixed baffle 111, when the testing fixed baffle 111 touches the testing clamping connecting rod I113, the testing touch column 109 touches the testing touch block 110, the testing slide block 108 slides, the testing touch block 110 is separated from the testing fixed baffle 111, the testing fixed baffle 111 enables the testing fixed baffle 111 to touch the testing clamping connecting rod II 120 under the action of the testing tightening torsion spring 121, when the testing sliding groove 107 rotates back again, the testing fixed baffle 111 is continuously driven to rotate, and the testing transmission shaft 122 is further driven to rotate in a reciprocating mode; when the rotation amplitude of the test transmission shaft 122 needs to be adjusted, the second test clamping column 118 or the first test clamping column 114 is pulled, so that the second test clamping column 118 and the first test clamping column 114 are separated from the round holes in the test clamping support 104, then the first test adjusting handle 116 and the second test adjusting handle 117 are manually adjusted, so that the second test clamping connecting rod 120 and the first test clamping connecting rod 113 move to the specified positions, and the second test clamping column 118 and the first test clamping column 114 are matched with the round holes in the test clamping support 104 again to lock the first test clamping connecting rod 113 and the second test clamping connecting rod 120.
The test transmission shaft 122 drives the test fixing plate 124, so that the test sliding ring 125 slides in the test fixing plate 124, and meanwhile, the test sliding ring 125 also slides on the test fixing column 126, so that the test eccentric wheel 127 rotates, the test eccentric wheel 127 drives the test transmission connecting rod 128 to further drive the test control column 129 to slide, the test control column 129 pulls the test transmission ring 131, and the test transmission ring 131 drives the test rotation fixing frame 133 to rotate in a reciprocating manner, so that the performance test of circuit board bending is realized.
The first test gear 102 rotates to enable the temperature control rotating V-shaped frame 307 to intermittently touch the temperature control rotating frame 308, so that the temperature control sliding plug 310 is pulled to slide in the temperature control sliding plug box 312, the temperature controller 313 and the temperature control fixing cylinder 311 are intermittently connected, meanwhile, the second test gear 103 rotates to drive the airflow adjusting rotating frame 207 to drive the airflow adjusting sliding frame 205 to slide, further, the airflow adjusting rack 203 drives the airflow adjusting gear 204 and the airflow adjusting fan blade 201, and the airflow adjusting fan blade 201 conveys airflow in the temperature controller 313 to the test ring shell 139 to achieve temperature control.
Claims (8)
1. The utility model provides a circuit board bending property testing arrangement, includes base (4), its characterized in that: the testing device is characterized by further comprising a testing component (1), an airflow adjusting component (2) and a temperature control component (3) which are fixedly arranged on the base (4), wherein the airflow adjusting component (2) and the temperature control component (3) are arranged on two sides of the testing component (1); the temperature control assembly (3) comprises a plurality of temperature control U-shaped convex blocks (301) and temperature control concave convex blocks (302) which are fixedly arranged on the first testing gear (102), the temperature control U-shaped convex blocks (301) are in sliding fit with temperature control sliding blocks (303) fixedly arranged on a temperature control rotating V-shaped frame (307), and the temperature control concave convex blocks (302) are in sliding fit with temperature control fixing columns (304) fixedly arranged on the temperature control rotating V-shaped frame (307).
2. The device for testing the bending property of the circuit board according to claim 1, wherein: v-arrangement frame (307) is rotated in control by temperature change and is set up on control by temperature change fixed bolster (306), V-arrangement frame (307) is rotated in control by temperature change goes up the activity and is provided with control by temperature change tension spring (305), control by temperature change tension spring (305) other end activity sets up on control by temperature change fixed bolster (306), V-arrangement frame (307) one end activity sets up in control by temperature change rotating turret (308) is rotated in control by temperature change, the activity is provided with control by temperature change connecting rod (309) on control by temperature change rotating turret (308), control by temperature change connecting rod (309) rotate the setting on control by temperature change sliding plug (310).
3. The device for testing the bending performance of the circuit board according to claim 1, wherein: the testing assembly (1) comprises a testing motor (101) fixedly arranged on a base (4), an output shaft of the testing motor (101) is fixedly provided with a testing power gear (105), the testing power gear (105) is fixedly provided with a testing sliding groove (107), a testing sliding block (108) is arranged on the testing sliding groove (107) in a sliding manner, a testing touch column (109) and a testing touch block (110) are fixedly arranged on the testing sliding block (108), and the testing touch column (109) is in sliding fit with a testing fixing frame (106) fixedly arranged on the base (4); the test touch block (110) is in sliding fit with a test fixed baffle (111) fixedly arranged on a test rotating frame (112); the test rotating frame (112) is fixedly arranged on the test transmission shaft (122).
4. The device for testing the bending property of the circuit board according to claim 3, wherein: the test transmission shaft (122) is further rotatably provided with a test clamping support (104), the test clamping support (104) is fixedly arranged on the base (4), and a test tightening torsion spring (121) is fixedly arranged between the test clamping support (104) and the test rotating frame (112); rotate on test chucking support (104) and be provided with test chucking connecting rod (113) and test chucking connecting rod two (120), test chucking connecting rod (113) are gone up the fixed test fixing base (115) that is provided with, it is provided with test chucking post (114) to slide in test fixing base (115), the fixed spring that is provided with between test fixing base (115) and test chucking post (114), test chucking connecting rod two (120) are gone up the fixed test fixing base two (119) that is provided with, it is provided with test chucking post two (118) to slide in test fixing base two (119), it is provided with reset spring to fix between test chucking post two (118) and test fixing base two (119), test chucking post two (118), test chucking post (114) all with test chucking support (104) on the round hole sliding fit.
5. The device for testing the bending property of the circuit board according to claim 4, wherein: the test clamping support (104) is further rotatably provided with a first test adjusting handle (116) and a second test adjusting handle (117), the second test adjusting handle (117) is meshed with the second test clamping connecting rod (120), and the first test adjusting handle (116) is meshed with the first test clamping connecting rod (113); the testing device is characterized in that a testing fixing plate (124) is fixedly arranged on the testing transmission shaft (122), the testing fixing plate (124) is in sliding fit with a testing sliding ring (125), the testing sliding ring (125) is slidably arranged on a testing fixing column (126), and a testing eccentric wheel (127) is fixedly arranged on the testing fixing column (126).
6. The device for testing the bending property of the circuit board according to claim 5, wherein: rotate on test eccentric wheel (127) and be provided with test drive connecting rod (128), test drive connecting rod (128) other end rotates and is provided with test control post (129), the fixed test drive ring (131) that is provided with on test control post (129), it is provided with test movable support (132) to rotate on test drive ring (131), test movable support (132) other end rotates and sets up on test rotation mount (133), test rotation mount (133) rotate and set up on test stationary cylinder (134), test stationary cylinder (134) is fixed to be set up on test circle shell (139), the fixed test main mount (136) that is provided with on test rotation mount (133), the fixed test U-shaped mount (130) that is provided with on test circle shell (139), it is provided with test mount two (137) and test mount one (135) to slide on test U-shaped mount (130), it is provided with test screw thread (138) to rotate on test mount two (137) and test mount (135).
7. The device for testing the bending property of the circuit board according to claim 1, wherein: airflow adjustment subassembly (2) are including rotating airflow adjustment rotating turret (207) that sets up on base (4), it is provided with test gear two (103) to slide in airflow adjustment rotating turret (207), rotates on test sliding tray (107) and is provided with airflow adjustment connecting rod (206), airflow adjustment connecting rod (206) one end is rotated and is set up on airflow adjustment carriage (205).
8. The device for testing the bending property of the circuit board according to claim 7, wherein: the airflow adjusting rotating frame (207) is oval, and an annular groove is formed in the airflow adjusting rotating frame (207).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211545671.7A CN115561092B (en) | 2022-12-05 | 2022-12-05 | Circuit board bending property testing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211545671.7A CN115561092B (en) | 2022-12-05 | 2022-12-05 | Circuit board bending property testing device |
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| CN115561092A true CN115561092A (en) | 2023-01-03 |
| CN115561092B CN115561092B (en) | 2023-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211545671.7A Active CN115561092B (en) | 2022-12-05 | 2022-12-05 | Circuit board bending property testing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116087772A (en) * | 2023-04-03 | 2023-05-09 | 江苏航天动力机电有限公司 | Comprehensive testing device for motor performance |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08128934A (en) * | 1994-11-01 | 1996-05-21 | Shinagawa Refract Co Ltd | Hot bending strength testing device |
| JP2001013052A (en) * | 1999-06-29 | 2001-01-19 | Shinagawa Refract Co Ltd | Testing apparatus for hot bending strength |
| JP2010078351A (en) * | 2008-09-24 | 2010-04-08 | Fuji Xerox Co Ltd | Bending characteristic measuring device and method for measuring bending characteristic |
| CN209485881U (en) * | 2018-10-25 | 2019-10-11 | 宁波公牛精密制造有限公司 | A kind of electric equipment products bend testing apparatus and socket low-temperature bending test equipment |
| CN210719962U (en) * | 2019-09-23 | 2020-06-09 | 成都航空职业技术学院 | Circuit board solder joint bending stress experimental apparatus |
| CN111337209A (en) * | 2018-12-18 | 2020-06-26 | 波音公司 | Cyclic flexure environment chamber and method |
| CN112903474A (en) * | 2021-01-14 | 2021-06-04 | 上海交通大学 | Metal sheet current-assisted micro-bending mechanical property testing device |
| CN215985590U (en) * | 2021-09-29 | 2022-03-08 | 昆山意力电路世界有限公司 | Flexible high-density circuit board bending tester |
-
2022
- 2022-12-05 CN CN202211545671.7A patent/CN115561092B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08128934A (en) * | 1994-11-01 | 1996-05-21 | Shinagawa Refract Co Ltd | Hot bending strength testing device |
| JP2001013052A (en) * | 1999-06-29 | 2001-01-19 | Shinagawa Refract Co Ltd | Testing apparatus for hot bending strength |
| JP2010078351A (en) * | 2008-09-24 | 2010-04-08 | Fuji Xerox Co Ltd | Bending characteristic measuring device and method for measuring bending characteristic |
| CN209485881U (en) * | 2018-10-25 | 2019-10-11 | 宁波公牛精密制造有限公司 | A kind of electric equipment products bend testing apparatus and socket low-temperature bending test equipment |
| CN111337209A (en) * | 2018-12-18 | 2020-06-26 | 波音公司 | Cyclic flexure environment chamber and method |
| CN210719962U (en) * | 2019-09-23 | 2020-06-09 | 成都航空职业技术学院 | Circuit board solder joint bending stress experimental apparatus |
| CN112903474A (en) * | 2021-01-14 | 2021-06-04 | 上海交通大学 | Metal sheet current-assisted micro-bending mechanical property testing device |
| CN215985590U (en) * | 2021-09-29 | 2022-03-08 | 昆山意力电路世界有限公司 | Flexible high-density circuit board bending tester |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116087772A (en) * | 2023-04-03 | 2023-05-09 | 江苏航天动力机电有限公司 | Comprehensive testing device for motor performance |
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