CN115558435A - Preparation method of wave-absorbing material - Google Patents

Preparation method of wave-absorbing material Download PDF

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Publication number
CN115558435A
CN115558435A CN202211046133.3A CN202211046133A CN115558435A CN 115558435 A CN115558435 A CN 115558435A CN 202211046133 A CN202211046133 A CN 202211046133A CN 115558435 A CN115558435 A CN 115558435A
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China
Prior art keywords
wave
release paper
plate
glue
absorbing material
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Pending
Application number
CN202211046133.3A
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Chinese (zh)
Inventor
雷鸣
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Suzhou Heibo Information Technology Co ltd
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Suzhou Heibo Information Technology Co ltd
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Priority to CN202211046133.3A priority Critical patent/CN115558435A/en
Publication of CN115558435A publication Critical patent/CN115558435A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/26Porous or cellular plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2262Oxides; Hydroxides of metals of manganese
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • C09J2433/006Presence of (meth)acrylic polymer in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)

Abstract

The invention relates to the technical field of wave-absorbing materials, in particular to a preparation method of a wave-absorbing material, which comprises the following steps: the method comprises the following steps: adding water into acrylic acid and acrylonitrile in a certain proportion, uniformly mixing, adding magnesium oxide, stirring until the magnesium oxide is completely dissolved, adding sodium bicarbonate serving as a foaming agent, uniformly stirring, and injecting into a prepared injection mold to prepare a polymer plate: step two: and mixing the epoxy resin solution with carbon black, graphite and manganese dioxide according to a certain proportion to obtain the wave absorbing agent. According to the invention, the mass production of the plates can be carried out by adopting a production mode of injection molding, and then the prepared wave absorbing agent is coated on the plates in a spraying mode, so that a flaky wave absorbing coating can be effectively generated, the thickness of the wave absorbing coating can be effectively reduced, the cost is reduced, the wave absorbing coating is suitable for mass production, and meanwhile, the temperature control is adopted for coating and curing, so that the wave absorbing agent can be uniformly cured.

Description

Preparation method of wave-absorbing material
Technical Field
The invention relates to the technical field of wave-absorbing materials, in particular to a preparation method of a wave-absorbing material.
Background
The wave-absorbing materials can be divided into two categories according to the bearing capacity, namely coating wave-absorbing materials and structural wave-absorbing materials. The coating wave-absorbing material is formed by mixing a wave-absorbing agent and an adhesive and coating the mixture on the surface of a target, and although the wave-absorbing material has simple process and low cost, the coated wave-absorbing coating has the defects of large density, large thickness, easy falling, poor high-temperature thermal stability and the like and cannot meet the use requirements under more conditions. The structural wave-absorbing material is a multifunctional composite material developed on the basis of advanced composite materials, and has the functions of good wave-absorbing performance, corrosion resistance, moisture resistance, high temperature resistance, strong bearing capacity and the like. The existing wave-absorbing material is complex to prepare, high in manufacturing cost and not suitable for wide application.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a preparation method of a wave-absorbing material.
In order to achieve the purpose, the invention adopts the following technical scheme:
a preparation method of a wave-absorbing material is characterized by comprising the following steps:
the method comprises the following steps: adding water into acrylic acid and acrylonitrile according to a certain proportion, uniformly mixing, adding magnesium oxide, stirring until the magnesium oxide is completely dissolved, adding sodium bicarbonate as a foaming agent, uniformly stirring, and injecting into a prepared injection mold to prepare a polymer plate:
step two: mixing the epoxy resin solution with carbon black, graphite and manganese dioxide according to a certain proportion to obtain a wave absorbing agent;
step three: putting the high-molecular gel particles into an organic solvent, and stirring for dissolving to prepare glue;
step four: preparing release paper, and cutting the release paper by using a cutting device to ensure that the area of the release paper is the same as that of the plate;
step five: uniformly coating glue on the surface of the board, spraying the wave absorbing agent on the side of the board coated with the glue, and standing until the glue is dried;
step six: and coating glue on one side of the cut release paper, attaching the release paper to the side, provided with the wave absorbing agent, of the plate, and pressing the release paper and the plate to obtain the formed wave absorbing material.
Preferably, the ratio of acrylic acid to acrylonitrile in the first step is 1, the weight of the magnesium oxide is 10-15g, and the weight of the sodium bicarbonate is 20-25g.
Preferably, the ratio of the epoxy resin solution to the mixture of carbon black, graphite and manganese dioxide in the second step is about 35%:20%:25%:20 percent.
Preferably, the temperature for preparing the glue in the third step is kept between 30 and 35 ℃.
Preferably, the time for natural drying in the fifth step is 20-30min, and the time for drying at 40 ℃ in a dryer is 8-10min.
Preferably, in the sixth step, a roller press can be adopted to roll one side of the release paper and the plate to accelerate the attachment of the release paper and the plate, and the surplus glue pressed between the release paper and the plate is scraped and cleaned.
The invention has the beneficial effects that:
the production mode that adopts injection moulding can carry out the panel production in batches, scribbles the ripples agent that makes on panel through the mode of spraying again, can effectively produce flaky form inhale the ripples coating, can effectively reduce and inhale the thickness of ripples coating to reduce cost is fit for carrying out large batch production, adopts the accuse temperature to carry out the coating solidification simultaneously, ensures that the ripples agent can solidify evenly.
Drawings
FIG. 1 is a schematic flow structure diagram of a method for preparing a wave-absorbing material according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1:
referring to fig. 1, a method for preparing a wave-absorbing material is characterized by comprising the following steps:
the method comprises the following steps: adding water into acrylic acid and acrylonitrile according to a certain proportion, uniformly mixing, adding magnesium oxide, stirring until the magnesium oxide is completely dissolved, adding sodium bicarbonate as a foaming agent, uniformly stirring, and injecting into a prepared injection mold to prepare a polymer plate, wherein the ratio of the acrylic acid to the acrylonitrile is 1, the weight of the magnesium oxide is 10g, and the weight of the sodium bicarbonate is 20g:
step two: mixing the epoxy resin solution with carbon black, graphite and manganese dioxide according to a certain proportion to obtain a wave absorbing agent, wherein the proportion of the epoxy resin solution to the mixture of the carbon black, the graphite and the manganese dioxide is about 35%:20%:25%:20 percent;
step three: putting the polymer gel particles into an organic solvent, and stirring and dissolving at the temperature of 30-35 ℃ to prepare glue;
step four: preparing release paper, and cutting the release paper by using a cutting device to ensure that the area of the release paper is the same as that of the plate;
step five: uniformly coating glue on the surface of the board, spraying the wave absorbing agent on the side of the board coated with the glue, and naturally drying for 20-30 min;
step six: glue is coated on one side of the cut release paper, then the release paper is attached to one side, provided with the wave absorbing agent, of the plate, then the release paper and the plate are pressed to obtain a formed wave absorbing material, a roller press is adopted to roll one side of the release paper and one side of the plate to accelerate the attachment of the release paper and the plate, and the surplus pressed glue between the release paper and the plate is scraped and cleaned.
Example 2:
referring to fig. 1, a method for preparing a wave-absorbing material is characterized by comprising the following steps:
the method comprises the following steps: adding water into acrylic acid and acrylonitrile according to a certain proportion, uniformly mixing, adding magnesium oxide, stirring until the magnesium oxide is completely dissolved, adding sodium bicarbonate as a foaming agent, uniformly stirring, and injecting into a prepared injection mold to prepare a polymer plate, wherein the ratio of the acrylic acid to the acrylonitrile is 1, the weight of the magnesium oxide is 15g, and the weight of the sodium bicarbonate is 20:
step two: mixing the epoxy resin solution with carbon black, graphite and manganese dioxide according to a certain proportion to obtain a wave absorbing agent, wherein the proportion of the epoxy resin solution to the mixture of the carbon black, the graphite and the manganese dioxide is about 35%:20%:25%:20 percent;
step three: putting the polymer gel particles into an organic solvent, and stirring and dissolving at the temperature controlled between 30 and 35 ℃ to prepare glue;
step four: preparing release paper, and cutting the release paper by using a cutting device to ensure that the area of the release paper is the same as that of the board;
step five: uniformly coating glue on the surface of the board, spraying the wave absorbing agent on the side of the board coated with the glue, and drying in a dryer at 40 ℃ for 8-10 min;
step six: glue is coated on one side of the cut release paper, then the release paper is attached to one side, provided with the wave absorbing agent, of the plate, then the release paper and the plate are pressed to obtain a formed wave absorbing material, a roller press is adopted to roll one side of the release paper and one side of the plate to accelerate the attachment of the release paper and the plate, and the surplus pressed glue between the release paper and the plate is scraped and cleaned.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (6)

1. A preparation method of a wave-absorbing material is characterized by comprising the following steps:
the method comprises the following steps: adding water into acrylic acid and acrylonitrile according to a certain proportion, uniformly mixing, adding magnesium oxide, stirring until the magnesium oxide is completely dissolved, adding sodium bicarbonate as a foaming agent, uniformly stirring, and injecting into a prepared injection mold to prepare a polymer plate:
step two: mixing the epoxy resin solution with carbon black, graphite and manganese dioxide according to a certain proportion to obtain a wave absorbing agent;
step three: putting the polymer gel particles into an organic solvent, stirring and dissolving to prepare glue;
step four: preparing release paper, and cutting the release paper by using a cutting device to ensure that the area of the release paper is the same as that of the plate;
step five: uniformly coating glue on the surface of the board, spraying the wave absorbing agent on the side of the board coated with the glue, and standing until the glue is dried;
step six: and coating glue on one side of the cut release paper, attaching the release paper to one side of the plate with the wave absorbing agent, and pressing the release paper and the plate to obtain the formed wave absorbing material.
2. The method for preparing the wave-absorbing material according to claim 1, wherein in the first step, the ratio of acrylic acid to acrylonitrile is 1, the weight of magnesium oxide is 10-15g, and the weight of sodium bicarbonate is 20-25g.
3. The method for preparing a wave-absorbing material according to claim 1, wherein the ratio of the epoxy resin solution to the mixture of carbon black, graphite and manganese dioxide in the second step is about 35%:20%:25%:20 percent.
4. The method for preparing a wave-absorbing material according to claim 1, wherein the temperature for preparing the glue in the third step is kept between 30 ℃ and 35 ℃.
5. The method for preparing the wave-absorbing material according to claim 1, wherein the time for natural drying in the fifth step is 20-30min, and the time for drying at 40 ℃ in a dryer is 8-10min.
6. The method according to claim 1, wherein in the sixth step, a roll press is adopted to roll one side of the release paper and the plate to accelerate the attachment of the release paper and the plate, and the excess glue pressed between the release paper and the plate is scraped to clean.
CN202211046133.3A 2022-08-30 2022-08-30 Preparation method of wave-absorbing material Pending CN115558435A (en)

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CN115558435A true CN115558435A (en) 2023-01-03

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102529229A (en) * 2010-12-21 2012-07-04 镇江育达复合材料有限公司 Wave-absorbing polymethacrylimide (PMI) foam sandwich composite material and preparation method and use thereof
CN106749838A (en) * 2016-12-01 2017-05-31 浩博(福建)新材料科技有限公司 A kind of preparation method for inhaling wave mode polymethacrylimide plastic foam
CN112029376A (en) * 2020-08-18 2020-12-04 集美大学 High-performance radar composite wave-absorbing coating material and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102529229A (en) * 2010-12-21 2012-07-04 镇江育达复合材料有限公司 Wave-absorbing polymethacrylimide (PMI) foam sandwich composite material and preparation method and use thereof
CN106749838A (en) * 2016-12-01 2017-05-31 浩博(福建)新材料科技有限公司 A kind of preparation method for inhaling wave mode polymethacrylimide plastic foam
CN112029376A (en) * 2020-08-18 2020-12-04 集美大学 High-performance radar composite wave-absorbing coating material and preparation method thereof

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