CN115555329A

CN115555329A - Trimmer cleaning device and chemical mechanical polishing equipment

Info

Publication number: CN115555329A
Application number: CN202211185974.2A
Authority: CN
Inventors: 刘远航; 马旭
Original assignee: Huahaiqingke Co Ltd
Current assignee: Huahaiqingke Co Ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-01-03

Abstract

The invention discloses a dresser belt cleaning device and chemical mechanical polishing equipment, the dresser belt cleaning device includes: a cleaning tank for collecting fluid and contaminants; the cleaning device comprises at least two layers of cleaning assemblies, wherein the cleaning assemblies are arranged on the inner side wall of the cleaning tank and used for cleaning the side face of the trimmer at least by relative motion of the trimmer and the trimmer cleaning device after at least part of the trimmer is positioned inside the cleaning tank, and the cleaning assemblies on different layers are positioned at different heights.

Description

Trimmer belt cleaning device and chemical mechanical polishing equipment

Technical Field

The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a trimmer cleaning device and chemical mechanical polishing equipment.

Background

The manufacturing process of integrated circuits is generally divided into: silicon wafer fabrication, pre-processing (chip processing) and post-processing (package testing). The main purpose of silicon wafer fabrication is to convert natural raw materials (sand, etc.) into a wafer-like base substrate. The main purpose of the previous process (chip processing) is to grow circuit devices on a base substrate, and the manufacturing process of the previous process mainly comprises the following steps according to technical division: the method comprises the following process links of film deposition, chemical Mechanical Polishing (CMP), photoetching, etching, ion implantation and the like, wherein each process link needs to be circulated for many times. In the CMP, the global uniform planarization of the wafer is realized by utilizing the simultaneous action of chemical corrosion and mechanical grinding. In the former process, the removal thickness of CMP is generally 0.1-20 μm, the removed material amount is small, and the residual particles of chemical reaction are small, the pollutants generated in the polishing process are generally chemical liquid, fine particles and the like, and a large amount of large-particle pollutants cannot be generated.

The main purpose of the subsequent process (packaging test) is to manufacture the whole wafer with the circuit devices grown thereon into individual finished chips. The following processes can be roughly divided into: the method comprises 8 main steps of back thinning, wafer cutting, wafer mounting, lead bonding, plastic packaging, laser printing, rib cutting forming, finished product testing and the like. Thinning of the back surface of a wafer refers to Grinding various materials such as a silicon wafer or a compound semiconductor before packaging with high precision to reduce the thickness to an appropriate ultra-thin form. The thinning equipment integrates grinding and CMP functional components, the thinning removal thickness is about 700 mu m or more, the back thinning of the wafer is mainly used for removing materials of a substrate, a large amount of powder such as silicon powder is generated during grinding and polishing due to the large removal thickness, and after the total thickness of the wafer is thinned to a certain degree, for example, below 7 mu m, the edge of the wafer is slightly peeled off to generate slag, and large-size solid pollutants such as the dust and the slag can be attached to a dresser, particularly the side surface of a CMP unit. The continuous accumulation of contaminants on the surface of the dresser may further cause crystallization, large particles falling off and affecting the dressing effect, and may even cause the wafer surface to be scratched by the large particles to cause the problems of waste chips, fragments and the like. Therefore, the dresser cleaning of the CMP unit in the backside thinning apparatus becomes a problem to be solved.

Disclosure of Invention

The embodiment of the invention provides a dresser cleaning device and chemical mechanical polishing equipment, and aims to at least solve one of the technical problems in the prior art.

A first aspect of an embodiment of the present invention provides a dresser cleaning apparatus including:

a cleaning tank for collecting fluid and contaminants;

at least two-layer washing subassembly sets up the inside wall at the washing tank for thereby the side of trimmer is washd at least to trimmer and trimmer belt cleaning device relative motion behind the trimmer at least part is located the washing tank inside, and wherein, the washing subassembly of different layers is in not co-altitude.

In one embodiment, the dresser cleaning apparatus includes a first layer cleaning assembly and a second layer cleaning assembly, the first layer cleaning assembly is located above the second layer cleaning assembly, the first layer cleaning assembly includes a first brushing structure and at least one first nozzle, the first brushing structure is arranged on the inner side wall of the cleaning tank, the first brushing structure is used for brushing the side face of the dresser, and the first nozzle is used for supplying liquid during brushing and/or washing the side face of the dresser and/or cleaning the first brushing structure.

In one embodiment, the first brushing structure comprises a plurality of first brush bodies arranged at intervals, the first nozzles are arranged opposite to the first brush bodies, and the first nozzles are used for spraying the side surfaces of the trimmer when the trimmer is cleaned and flushing the opposite first brush bodies when the trimmer is not in position so as to realize self cleaning of the brush bodies.

In one embodiment, the first brushing arrangement comprises an annular brush body arranged annularly, the first nozzle being located inside the annular brush body.

In one embodiment, the first brush body or the annular brush body is arranged to be inclined from bottom to top, and the direction of inclination from bottom to top is opposite to the rotation direction of the dresser relative to the cleaning tank.

In one embodiment, the second layer cleaning assembly includes a second brush body configured to brush a bottom surface of the conditioner.

In one embodiment, the second layer cleaning assembly comprises at least one second nozzle for rinsing the inner wall of the cleaning tank, the bottom surface of the dresser and/or the second brush body.

In one embodiment, the dresser cleaning apparatus further includes a third layer of cleaning assemblies having a height between the first layer of cleaning assemblies and the second layer of cleaning assemblies for cleaning the bottom surface of the dresser and/or cleaning the first brushing structure.

In one embodiment, the relative movement of the dresser and the dresser cleaning apparatus includes a relative rotational movement and/or a relative up-down movement, which is achieved under drive by at least one of the dresser and the cleaning tank.

In one embodiment, the dresser cleaning apparatus further comprises a fourth layer cleaning assembly, the height of the fourth layer cleaning assembly is above the first layer cleaning assembly, and the fourth layer cleaning assembly is used for forming an air seal or a liquid seal above the cleaning tank so as to prevent pollutants from being splashed out.

In one embodiment, the inner bottom surface of the cleaning tank is provided with a conical surface which is inclined downwards from the edge to the center so as to facilitate the discharge of pollutants; the center of the inner bottom surface of the cleaning tank is provided with a discharge port.

A second aspect of the embodiments of the present invention provides a chemical mechanical polishing apparatus, including a carrier head, a polishing disk, a dresser, a polishing liquid supply device, and further including the dresser cleaning device as described above, where the dresser cleaning device is located beside the polishing disk and overlaps with a movement track of the dresser.

The embodiment of the invention has the beneficial effects that: the cleaning effect on the dresser can be improved, pollutants on the surface of the dresser can be effectively removed, and the risk of scratching the wafer by the pollutants is reduced.

Drawings

The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:

FIG. 1 is a schematic view of a chemical mechanical polishing unit provided in accordance with one embodiment of the present invention;

FIG. 2 is a schematic diagram of a dresser cleaning apparatus and a dresser according to an embodiment of the present invention;

FIGS. 3 to 5 show a dresser cleaning apparatus provided in accordance with a first embodiment;

FIG. 6 is a view showing a dresser cleaning apparatus provided in the second embodiment;

FIGS. 7 and 8 show a dresser cleaning apparatus provided in a third embodiment;

FIGS. 9 and 10 show a dresser cleaning apparatus provided in accordance with a fourth embodiment;

fig. 11 to 16 show a dresser cleaning apparatus provided in embodiment five.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the invention, and are presented to illustrate the concepts of the invention; the description is intended to be illustrative and exemplary in nature and is not to be construed as limiting the embodiment of the invention or the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions that are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions that make any obvious substitutions and modifications to the embodiments described herein. It should be understood that, unless otherwise specified, the following description of specific embodiments of the present invention is made for ease of understanding in a natural state where relevant devices, apparatuses, components, etc. are originally stationary and are not given external control signals and driving forces.

Further, it is also noted that terms used herein such as front, back, up, down, left, right, top, bottom, front, back, horizontal, vertical, and the like, to denote orientation, are used merely for convenience of description to facilitate understanding of relative positions or orientations, and are not intended to limit the orientation of any device or structure.

In order to explain the technical solution of the present invention, the following description is made with reference to the accompanying drawings and examples.

In the present application, chemical Mechanical Polishing (Chemical Mechanical Planarization) is also called Chemical Mechanical Planarization (Chemical Mechanical Planarization), wafer (wafer) is also called wafer, silicon wafer, substrate or substrate (substrate), etc., and the meaning and the actual function are equivalent.

As shown in fig. 1, the chemical mechanical polishing apparatus 1 includes a polishing disk 20, a polishing pad 30 adhered on the polishing disk 20, a carrier head 40 for adsorbing a wafer and driving the wafer to rotate, a dresser 60 for dressing the polishing pad 30, and a liquid supply part 50 for supplying a polishing liquid to a surface of the polishing pad 30.

In addition, as shown in fig. 1, the chemical mechanical polishing apparatus 1 further includes a dresser cleaning device 70 for cleaning the dresser 60, the dresser cleaning device 70 being located beside the polishing disk 20 and overlapping with a moving track of the dresser 60.

During chemical mechanical polishing, the carrier head 40 presses the wafer against the polishing pad 30 covered by the surface of the polishing disk 20, and the size of the polishing pad 30 is larger than the size of the wafer to be polished, for example, 1.2 times or more the size of the wafer, thereby ensuring that the wafer is uniformly polished. The carrier head 40 performs a rotational motion and reciprocates in a radial direction of the polishing platen 20 so that the surface of the wafer contacting the polishing pad 30 is gradually polished while the polishing platen 20 rotates, and the liquid supply portion 50 sprays the polishing liquid onto the surface of the polishing pad 30. Under the chemical action of the polishing solution, the wafer is rubbed with the polishing pad 30 by the relative movement of the carrier head 40 and the polishing disk 20 to perform polishing, so as to realize surface planarization, thereby achieving the purpose of global planarization. Also, the dresser 60 serves to dress and activate the topography of the polishing pad 30 during polishing. The dresser 60 can remove foreign particles remaining on the surface of the polishing pad 30, such as abrasive particles in the polishing slurry and waste materials falling off from the surface of the wafer, and can also flatten the surface deformation of the polishing pad 30 caused by grinding, thereby ensuring the consistency of the surface topography of the polishing pad 30 during polishing and further stabilizing the removal rate of polishing. The dresser 60 includes a swing arm and a dresser head attached to a swing end of the swing arm.

Particularly, in the process of thinning the wafer, the edge of the extremely thin wafer after grinding is easy to generate wafer broken edges in the grinding process and the CMP process. Particularly in the CMP process, the polishing process is performed at a high removal rate for efficiency, and wafer debris, wafer powder, and particles in the slurry are accumulated on the polishing pad 30 under high pressure. While the dresser 60 is dressing the polishing pad 30, these contaminants may collect on the sides of the dressing head, in other words, the sides of the dressing head may be dirty, and the continuous collection of contaminants may further cause problems such as crystallization, dropping of large particles, and scratching of the wafer surface.

In order to solve the above problem, the finisher cleaning device 70 needs to be added.

As shown in fig. 1, the swing arm of the dresser 60 swings around its stationary end to move the dresser head over the surface of the polishing pad 30. The dresser cleaning apparatus 70 is located close to the polishing disk 20, and the position of the dresser cleaning apparatus 70 overlaps with the movement locus of the dresser 60, so that the dresser can be lowered and inserted into the dresser cleaning apparatus 70 for cleaning when the dresser head is swung above the dresser cleaning apparatus 70.

As shown in fig. 1 and 2, the dresser cleaning apparatus 70 includes a cleaning tank 71 for collecting fluid and contaminants. The upper opening of the cleaning tank 71 is annular for the finishing head to extend into the cleaning tank 71 during cleaning. The shape of the cleaning tank 71 may be adapted to the shape of the trimming head, and may be a cylindrical shape or a truncated cone shape. The inner bottom surface of the cleaning tank 71 is provided as a tapered surface inclined downward from the edge toward the center to facilitate collection and discharge of contaminants. A discharge port 711 is provided at the center of the inner bottom surface of the cleaning tank 71.

The specific structure of the dresser cleaning apparatus 70 may have various embodiments, and in general, the dresser cleaning apparatus 70 includes a cleaning tank 71 and at least two layers of cleaning assemblies located on the inner side wall of the cleaning tank 71, the cleaning assemblies of different layers are located at different heights, and the dresser 60 and the dresser cleaning apparatus 70 are moved relative to each other after the dresser 60 is at least partially located inside the cleaning tank 71 so as to clean at least the side surface of the dresser 60. The following specifically describes the embodiments.

Example one

Fig. 3 to 5 illustrate a dresser cleaning apparatus 70 according to a first embodiment of the present invention.

As shown in fig. 3 to 5, the dresser cleaning apparatus 70 includes a first layer cleaning assembly 72 and a second layer cleaning assembly 73, both mounted on the inner side wall of the cleaning tank 71, the first layer cleaning assembly 72 being located above the second layer cleaning assembly 73. The first layer of cleaning assemblies 72 above may effect cleaning of the sides of the conditioning head as well as self-cleaning. The lower second-layer cleaning assembly 73 can be used for cleaning the bottom surface of the trimming head and also for washing the inner wall of the cleaning tank 71 to prevent the deposition of contaminants in the cleaning tank 71.

As shown in fig. 3 to 5, the first layer cleaning assembly 72 includes a first brushing structure 721 provided on an inner sidewall of the cleaning tank 71 for brushing a side of the dresser 60. The first brushing structure 721 may include a brush body arranged along an inner sidewall of the ring-shaped washing tub 71. The first layer cleaning assembly 72 further includes at least one first nozzle 722 disposed on an inner sidewall of the cleaning tank 71, the first nozzle 722 being for providing liquid and/or rinsing the sides of the dresser 60 and/or cleaning the first brushing structure 721 during the brushing process.

As shown in fig. 3 to 5, the second-level cleaning assembly 73 includes at least one second nozzle 731 for spraying the inner wall of the cleaning tank 71 and/or the bottom surface of the spray dresser 60.

As shown in fig. 5, the working process of the first embodiment includes:

1) The dresser 60 swings right above the cleaning tank 71 after finishing dressing the polishing pad 30; the dresser 60 turns off the negative pressure source and the dresser head descends into the interior of the cleaning tank 71.

2) After entering the cleaning tank 71, the first nozzle 722 supplies water to open to clean the side surface of the dresser 60; meanwhile, the trimmer 60 and the cleaning tank 71 move relatively, specifically, the trimmer 60 and the cleaning tank 71 move relatively, the motor inside the trimmer 60 drives the trimming head to rotate or the cleaning tank 71 is connected with the driving mechanism to rotate, or the trimmer 60 and the cleaning tank 71 move relatively up and down, at least one of the trimmer 60 and the cleaning tank 71 moves up and down, so that the brush body can brush a circle of the side surface of the trimming head, and the pollutants are carried to the bottom of the cleaning tank 71 by the water mist sprayed by the first nozzle 722. In addition, the second nozzle 731 may also flush the bottom surface of the trimming head at the same time.

3) After the cleaning of the dresser 60 is completed, the movement of the dresser 60 or the cleaning tank 71 is stopped, the negative pressure source is turned on by the dresser 60, and the dresser head is lifted up away from the interior of the cleaning tank 71.

4) After the dresser 60 is removed, the second nozzle 731 starts to supply liquid and wash the inner wall of the cleaning tank 71, the discharge port 711 discharges liquid, and the washed contaminants are discharged from the discharge port 711 in time by the washing action of the second nozzle 731.

According to the embodiment of the invention, pollutants on the side surface of the dresser 60 can be cleaned, and the pollutants can be prevented from being deposited in a cleaning structure.

In one embodiment, the first brushing arrangement comprises an annular brush body arranged annularly, the first nozzle being located inside the annular brush body. Further, the annular brush body is disposed to be inclined from bottom to top, and an inclined direction from bottom to top is opposite to a rotation direction of the dresser with respect to the cleaning tank. In other words, the annular brush body is spiral, and the spiral direction from bottom to top is opposite to the rotating direction of the dresser relative to the cleaning tank, so that the pollutants on the side surface of the dresser can be brushed off by the annular brush body, and the pollutants can drop downwards, and secondary pollution caused by a large amount of pollutants attached to the brush body can be avoided.

Specifically, as shown in fig. 3, the brush body is composed of PVC filaments, and is annularly disposed on an upper inner wall of the washing tub 71. Of course, the brush body can be divided into a plurality of brush bodies which are separately arranged.

As shown in FIG. 4, the brush body is made of polyurethane sponge or PVA sponge and is bonded to the inner wall of the cleaning tank 71, and when cleaning, the brush body contacts with the trimming head and is matched with the water mist formed by the nozzle to effectively remove pollutants.

In addition, the first nozzle 722 may be located inside the brush body to spray a tapered water mist, and a plurality of the first nozzles 722 are uniformly arranged on the inner sidewall of the cleaning bath 71. The second nozzles 731 may be provided in plural and uniformly distributed on the inner sidewall of the cleaning tank 71. The first nozzle 722 and/or the second nozzle 731 may also be coupled with a swing mechanism and/or a telescopic mechanism to change a spray angle, a spray direction, a spray distance, a spray force, etc.

Example two

Fig. 6 shows a dresser cleaning apparatus 70 according to a second embodiment of the present invention.

As shown in fig. 6, the dresser cleaning apparatus 70 further includes a third layer cleaning assembly 74 in addition to the first layer cleaning assembly 74, wherein the third layer cleaning assembly 74 is disposed between the first layer cleaning assembly 72 and the second layer cleaning assembly 73 and is used for cleaning the bottom surface of the dresser 60 and/or cleaning the first brushing structure 721.

Specifically, the third cleaning assembly includes at least one third nozzle 741 provided at an inner sidewall of the cleaning bath 71, the third nozzle 741 having a height between the first nozzle 722 and the second nozzle 731.

When the dresser 60 is inserted into the cleaning tank 71 to perform cleaning by moving relative to the cleaning tank 71, the third nozzle 741 can simultaneously rinse the bottom surface of the dresser 60. After the dresser 60 finishes cleaning and leaves the interior of the cleaning tank 71, the third nozzle 741 may rinse the first layer cleaning assembly 72, the second layer cleaning assembly 73, and/or the cleaning tank 71, for example, to align and rinse the first brushing structure 721, thereby achieving self-cleaning of the dresser cleaning apparatus 70.

EXAMPLE III

Fig. 7 and 8 show a dresser cleaning apparatus 70 provided in a second embodiment of the present invention.

As shown in fig. 7 and 8, the dresser cleaning apparatus 70 further includes a fourth layer cleaning assembly 75 according to the first embodiment or the second embodiment, wherein the fourth layer cleaning assembly 75 is located at a height above the first layer cleaning assembly 72, and is used for forming an air seal or a liquid seal above the cleaning tank 71 to prevent contaminants from being splashed out.

Specifically, the fourth cleaning assembly includes at least one fourth nozzle 751 disposed at an inner sidewall of the top of the cleaning bath 71, the fourth nozzle 751 being positioned at a height above the first nozzle 722. The plurality of fourth nozzles 751 are uniformly distributed.

When the dresser 60 is cleaned or the dresser cleaning apparatus 70 is self-cleaned, the fourth nozzle 751 is utilized to spray fluid to form a layer of air-tight or liquid-tight surface at the opening of the cleaning tank 71, thereby preventing the contaminants inside the cleaning tank 71 from being splashed out and contaminating the external environment.

Example four

Fig. 9 and 10 show a dresser cleaning apparatus 70 provided by a fourth embodiment of the present invention.

As shown in fig. 9 and 10, the dresser cleaning apparatus 70 includes a first layer cleaning assembly 72 and a second layer cleaning assembly 73, both mounted on the inner side wall of the cleaning tank 71, the first layer cleaning assembly 72 being located above the second layer cleaning assembly 73.

As shown in fig. 9 and 10, the first layer cleaning assembly 72 includes a first brushing structure disposed on an inner sidewall of the cleaning tank 71 for brushing a side of the dresser, and at least one first nozzle 722 for supplying liquid during the brushing process and/or rinsing the side of the dresser and/or cleaning the first brushing structure.

As shown in fig. 9 and 10, the first brushing structure includes a plurality of first brush bodies 723 arranged at intervals, the first nozzles 722 are arranged opposite to the first brush bodies 723, or the first nozzles 722 are arranged at intervals to the first brush bodies 723, or the first spraying groups and the first brush bodies 723 are arranged symmetrically with respect to the axial direction of the cleaning tank 71.

As shown in fig. 9 and 10, the first brush body 723 is provided with at least one, separate arrangement. The number of the first brush 723 may be 3 as shown in fig. 9 and 10, or may be other natural numbers. When the dresser enters the cleaning tank 71 and moves relative to the cleaning tank 71, for example, axially rotates, the first brush 723 can brush the side of the dresser for one circle.

In one embodiment, the first brush 723 may have various shapes, for example, a projection on the inner wall of the cleaning tank 71 may be square, circular, polygonal, etc.

In another embodiment, the first brush body 723 is elongated, is disposed to be inclined from bottom to top, and the inclined direction from bottom to top is opposite to the rotation direction of the dresser with respect to the cleaning bath 71. The first brush 723 arranged in an inclined manner can brush off pollutants on the side surface of the dresser and guide the pollutants to fall downwards when the dresser rotates relatively, so that the pollutants can be reduced to be attached to the first brush 723, and secondary pollution is avoided.

As shown in fig. 9 and 10, the first nozzle 722 is disposed opposite to the first brush 723, and the first nozzle 722 may spray the cleaning liquid against the first brush 723. This design may allow the first nozzle 722 to serve multiple functions: when the dresser is positioned in the cleaning tank 71 for cleaning, the first nozzle 722 can spray the side surface of the dresser to realize wetting, auxiliary cleaning and the like; when the dresser leaves the cleaning tank 71, that is, the dresser is not in place, the first nozzle 722 washes the opposite first brush 723 to realize self-cleaning of the brush; the first nozzle 722 may also be used to wash the inner wall of the washing tub 71 or wash a second brush body 732 to be described later.

EXAMPLE five

Fig. 11 to 16 show a dresser cleaning apparatus 70 provided in a fifth embodiment of the present invention.

As shown in fig. 11-16, the second layer cleaning assembly 73 includes a second brush body 732 for brushing the bottom surface of the trimmer. The second brush 732 is located under the first brush 723. After the dresser enters the cleaning tank 71, the second brush body 732 abuts against the bottom surface of the dresser, and when the dresser and the cleaning tank 71 rotate relatively, the first brush body 723 brushes the side surface of the dresser, and the second brush body 732 brushes the bottom surface of the dresser. The material of the second brush body 732 may be PVC filament, polyurethane sponge or PVA sponge. As shown in fig. 11 to 13, in one embodiment, the second brush body 732 is elongated in the radial direction of the cleaning tank 71, and the surface of the second brush body 732 has upward bristles or protrusions for brushing against the bottom surface of the dresser when the dresser rotates relative to the second brush body 732. As shown in fig. 11 and 12, the length of the second brush body 732 in the diameter direction of the cleaning tank 71 is equal to or greater than the diameter length of the dresser, and both ends of the second brush body 732 are fixed to the side wall of the cleaning tank 71, so that the connection is stable. As a modification, as shown in fig. 13, the length of the second brush body 732 in the diameter direction of the cleaning tank 71 may also be equal to the length of the radius of the dresser or between the radius and the diameter of the dresser at the length of the second brush body 732. In the present embodiment, the second brush body 732 brushes when the dresser rotates relatively, so the length of the second brush body 732 can be at least equal to the radius of the dresser, which occupies a small space and facilitates installation and use of other components.

In another embodiment, as shown in fig. 14 to 16, the second brush body 732 is cylindrical and can roll in a diameter direction of the washing tub 71, and has spirally distributed bristles or protrusions on a surface thereof. One end of the second brush body 732 is connected to a rolling driving member, such as a motor, so that the second brush body 732 rolls and brushes the bottom surface of the dresser. As shown in fig. 15, the spiral bristles or protrusions on the surface of the second brush body 732 are sparsely distributed, or in other words, have a larger pitch, so that the second brush body 732 can guide the pollutants to be brushed downwards when rolling and brushing the bottom surface of the trimmer, which is beneficial for the pollutants to fall rather than being accumulated on the second brush body 732. As shown in fig. 14 and 15, the length of the second brush body 732 is equal to the diameter of the dresser. As a variation, as shown in FIG. 16, the second brush body 732 may also have a length equal to the radius of the dresser.

As shown in fig. 12, 13 and 16, the inner sidewall of the cleaning tank 71 is further provided with a second nozzle 731, the second nozzle 731 can be used for cooperating with the second brush body 732 to flush the bottom surface of the dresser when the dresser is cleaned, and the second nozzle 731 can also be used for flushing the second brush body 732 or the inner wall of the cleaning tank 71 when the dresser is separated.

It should be noted that the nozzles of the present invention can eject fluid or two fluids, and can be connected to the swing mechanism and/or the telescopic mechanism to change the ejection angle, the ejection direction, the ejection distance, the ejection force, and the like.

In conclusion, the embodiment of the invention can improve the cleaning effect on the dresser 60, effectively remove the pollutants on the surface of the dresser 60 and reduce the risk of scratching the wafer by the pollutants.

The drawings accompanying this specification are for the purpose of illustrating the concepts of the invention and are a schematic representation of the shapes of parts and their interrelationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to indicate the same parts throughout the drawings in order to clearly show the structure of the parts of the embodiments of the invention.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A dresser cleaning apparatus, comprising:

a cleaning tank for collecting fluid and contaminants;

the cleaning device comprises at least two layers of cleaning assemblies, wherein the cleaning assemblies are arranged on the inner side wall of the cleaning tank and used for cleaning the side face of the trimmer at least by relative motion of the trimmer and the trimmer cleaning device after at least part of the trimmer is positioned inside the cleaning tank, and the cleaning assemblies on different layers are positioned at different heights.

2. A conditioner cleaning apparatus as claimed in claim 1, wherein said conditioner cleaning apparatus includes a first layer cleaning assembly and a second layer cleaning assembly, the first layer cleaning assembly being positioned above the second layer cleaning assembly, the first layer cleaning assembly including a first scrubbing structure disposed on an inner sidewall of the cleaning tank for scrubbing a side of the conditioner and at least one first nozzle for supplying liquid during scrubbing and/or washing the side of the conditioner and/or cleaning the first scrubbing structure.

3. The dresser cleaning apparatus of claim 2, wherein the first brushing structure includes a plurality of first brush bodies arranged at intervals, the first nozzles being arranged opposite the first brush bodies, the first nozzles being adapted to spray the sides of the dresser when cleaning the dresser and to flush the opposite first brush bodies when the dresser is not in place to thereby effect self-cleaning of the brush bodies.

4. The conditioner cleaning apparatus of claim 2, wherein the first brushing structure includes an annular brush body arranged in an annular shape, the first nozzle being located inside the annular brush body.

5. The dresser cleaning apparatus of claim 3 or 4, wherein the first brush body or the annular brush body is disposed to be inclined from bottom to top, and an inclination direction from bottom to top is opposite to a rotation direction of the dresser with respect to the cleaning tank.

6. The dresser cleaning apparatus of claim 2, wherein the second tier cleaning assembly includes a second brush body configured to brush a bottom surface of the dresser.

7. The dresser cleaning apparatus of claim 6, wherein the second tier cleaning assembly includes at least one second nozzle for rinsing the inner wall of the cleaning tank, the bottom surface of the dresser, and/or the second brush body.

8. The dresser cleaning apparatus of claim 2, further comprising a third layer cleaning assembly having a height between the first layer cleaning assembly and the second layer cleaning assembly for cleaning a bottom surface of the dresser and/or cleaning the first scrubbing structure.

9. A dresser cleaning apparatus according to claim 1 wherein the relative movement of the dresser and the dresser cleaning apparatus includes relative rotational movement and/or relative up-and-down movement, being effected under drive by at least one of the dresser and the cleaning tank.

10. The dresser cleaning apparatus of claim 2, further comprising a fourth layer of cleaning elements positioned at a height above the first layer of cleaning elements for forming an air or liquid seal over the cleaning tank to prevent contaminants from spilling.

11. The dresser cleaning apparatus of claim 1, wherein the inner bottom surface of the cleaning tank is provided as a tapered surface inclined downward from the edge toward the center to facilitate discharge of contaminants; the center of the inner bottom surface of the cleaning tank is provided with a discharge port.

12. A chemical mechanical polishing apparatus comprising a carrier head, a polishing disk, a dresser, and a slurry supply device, and further comprising a dresser cleaning device according to any one of claims 1 to 11, the dresser cleaning device being located beside the polishing disk and overlapping a movement locus of the dresser.