CN115552558A - Capacitor with a capacitor element - Google Patents
Capacitor with a capacitor element Download PDFInfo
- Publication number
- CN115552558A CN115552558A CN202180034670.3A CN202180034670A CN115552558A CN 115552558 A CN115552558 A CN 115552558A CN 202180034670 A CN202180034670 A CN 202180034670A CN 115552558 A CN115552558 A CN 115552558A
- Authority
- CN
- China
- Prior art keywords
- hole
- connection terminal
- sealing member
- terminal portion
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 98
- 238000007789 sealing Methods 0.000 claims abstract description 68
- 229920005989 resin Polymers 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 52
- 230000000903 blocking effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 33
- 239000011104 metalized film Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a capacitor. The film capacitor includes a capacitor element, a bus bar connected to an electrode of the capacitor element, a case accommodating the capacitor element, a resin filled in the case, a through hole provided in the case, a connection terminal portion provided in the bus bar and led out of the through hole to the outside and connectable to an external terminal, and an annular sealing member interposed between an outer surface of the connection terminal portion and an inner wall surface of the through hole. Here, the sealing member has a deformable annular fin portion on an outer surface thereof. The sealing member including the fin portion has an outer diameter larger than a diameter of the through hole, and the fin portion is deformed to come into contact with an inner wall surface of the through hole.
Description
Technical Field
The present invention relates to capacitors.
Background
In the resin-sealed electric component of patent document 1, the filling resin in a melted state may leak from a minute gap between the terminal and the through hole through which the terminal passes. Therefore, in this resin-sealed electric component, a pair of first protruding portions extending in the vertical direction are formed on both the left and right sides of the through-hole in the side surface of the case (case side wall member), and the first resin receiving portion is formed so as to connect both lower end portions of the pair of first protruding portions 1 along the lower end of the through-hole. When the gap-closing resin is injected from the vicinity of the contact portion between the upper surface of the terminal inside the housing and the inner peripheral surface of the through-hole, the injected gap-closing resin enters a minute gap existing between the terminal and the inner peripheral surface of the through-hole due to capillary action, and the gap is closed by the gap-closing resin. After the gap closing resin is cured, the filling resin is filled in the case.
Prior art documents
Patent literature
Patent document 1: japanese laid-open patent publication No. 2010-093057
Disclosure of Invention
Problems to be solved by the invention
In the resin-sealed electric component of patent document 1, in the production, a step of injecting a gap-closing resin into the case and curing the injected gap-closing resin by raising the temperature of the resin is required before a step of injecting the resin into the case and curing the resin by raising the temperature of the injected resin.
In view of the above problems, an object of the present invention is to provide a capacitor capable of easily preventing resin leakage from a through hole of a case into which a connection terminal portion of a bus bar is inserted.
Means for solving the problems
A capacitor according to claim 1 of the present invention includes a capacitor element, a bus bar connected to an electrode of the capacitor element, a case accommodating the capacitor element, a resin filled in the case, a through hole provided in the case, a connection terminal portion provided in the bus bar, led out from the through hole to the outside, and connectable to an external terminal, and an annular sealing member interposed between an outer surface of the connection terminal portion and an inner wall surface of the through hole. Here, the sealing member has a deformable annular 1 st projection on an outer surface thereof. The sealing member including the 1 st projecting portion has an outer diameter larger than a diameter of the through hole, and the 1 st projecting portion is deformed to abut against an inner wall surface of the through hole.
Effects of the invention
According to the present invention, it is possible to easily prevent resin leakage from the through hole of the housing through which the connection terminal portion of the bus bar is inserted.
The effects and significance of the present invention will become more apparent from the following description of the embodiments. However, the embodiments described below are merely examples for carrying out the present invention, and the present invention is not limited to the contents described in the embodiments below.
Drawings
Fig. 1 (a) is a perspective view of the film capacitor according to the embodiment as viewed from the front upper side, and fig. 1 (b) is a perspective view of the film capacitor according to the embodiment as viewed from the front lower side.
Fig. 2 (a) is a perspective view of the capacitor element unit according to the embodiment as viewed from the front and upward direction, and fig. 2 (b) is a perspective view of the capacitor element unit according to the embodiment as viewed from the rear and upward direction.
Fig. 3 (a) is a perspective view of the 1 st bus bar of the embodiment as viewed from the front and downward, and fig. 3 (b) is a partial side sectional view of the 1 st bus bar of the embodiment showing the periphery of the 1 st projection.
Fig. 4 (a) is a perspective view of the 2 nd bus bar according to the embodiment as viewed from the front and downward, and fig. 4 (b) is a partial side sectional view of the 2 nd bus bar according to the embodiment showing the periphery of the 2 nd protrusion.
Fig. 5 (a) is a perspective view of the housing according to the embodiment as viewed from the front and upward, and fig. 5 (b) is a perspective view of the housing according to the embodiment as viewed from the rear and upward.
Fig. 6 (a) is a perspective view of a right side portion of the housing as viewed from the front downward direction according to the embodiment, and fig. 6 (b) is a partial front sectional view of the housing showing the peripheries of the 1 st through hole and the 2 nd through hole according to the embodiment.
Fig. 7 (base:Sub>A) and (b) arebase:Sub>A perspective view andbase:Sub>A plan view, respectively, of the sealing member according to the embodiment, and fig. 7 (c) isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A' of fig. 7 (b).
Fig. 8 (a) is a side sectional view of the film capacitor in a state before the filling resin according to the embodiment is filled, and fig. 8 (b) is a plan view of a central portion of the film capacitor in a state before the filling resin according to the embodiment is filled.
Fig. 9 is a sectional view of a main portion of the film capacitor according to embodiment 1, showing a state before the filling resin around the 1 st through hole is filled.
Detailed Description
In the following, the following description is given, a film capacitor 1 as an embodiment of the capacitor of the present invention will be described with reference to the drawings. For convenience, the front-back, left-right, and up-down directions are appropriately noted in the drawings. The directions shown in the drawings are only relative to the film capacitor 1, and do not indicate absolute directions. For convenience of explanation, some components such as the "bottom surface portion" and the "front surface portion" may be referred to by names in accordance with the directions shown in the drawings.
In the present embodiment, the film capacitor 1 corresponds to the "capacitor" described in the scope of the patent claims. The 1 st through hole 240 and the 2 nd through hole 250 correspond to "through holes" described in the claims. Further, the fin portion 410 corresponds to the "1 st projecting portion" described in the scope of the patent request. The flange portion 420 corresponds to the "closing portion" described in the scope of the patent claims. Further, the rib 430 corresponds to the "2 nd projecting portion" described in the scope of the patent request. The 1 st electrode 510 and the 2 nd electrode 520 correspond to "electrodes" described in the claims. Further, the 1 st bus bar 600 and the 2 nd bus bar 700 correspond to "bus bars" described in the scope of patent claims. Further, lower-1 connecting terminal portion 650 and lower-2 connecting terminal portion 750 correspond to "connecting terminal portions" described in the claims.
However, the above description is only for the purpose of making the structure of the scope of the claims correspond to the structure of the embodiments, and the invention described in the scope of the claims is not limited to the structure of the embodiments by making the above correspondence.
Fig. 1 (a) is a perspective view of the film capacitor 1 viewed from the front upper side, and fig. 1 (b) is a perspective view of the film capacitor 1 viewed from the front lower side.
As shown in fig. 1 (a) and (b), the film capacitor 1 includes a capacitor element unit 100, a case 200 accommodating the capacitor element unit 100, a filling resin 300 filled in the case 200, and two sealing members 400.
The filling resin 300 is a thermosetting resin such as an epoxy resin, is injected in a liquid phase state into the case 200 accommodating the capacitor element unit 100, and is then heated and cured in the case 200. Most of the capacitor element unit 100 buried in the filling resin 300 is protected from moisture and impact.
Three 1 st upper connection terminal portions 630 and three 2 nd upper connection terminal portions 730 in capacitor element unit 100 are led out to the outside from opening portion 200a on the upper surface of case 200. Upper-1 connection terminal portions 630 and upper-2 connection terminal portions 730 are arranged adjacently in the left-right direction. Further, 1 st lower connecting terminal portion 650 and 2 nd lower connecting terminal portion 750 are inserted through 1 st through hole 240 and 2 nd through hole 250 provided in bottom surface portion 201 of case 200, respectively, and led out to the outside. Sealing member 400 is interposed between the outer surface of 1 st lower connection terminal portion 650 and the inner wall surface of 1 st through hole 240 and between the outer surface of 2 nd lower connection terminal portion 750 and the inner wall surface of 2 nd through hole 250, respectively.
Fig. 2 (a) is a perspective view of the capacitor element unit 100 viewed from the front and above, and fig. 2 (b) is a perspective view of the capacitor element unit 100 viewed from the rear and above. Fig. 3 (a) is a perspective view of the 1 st bus bar 600 viewed from the front downward direction, and fig. 3 (b) is a partial side sectional view of the 1 st bus bar 600 showing the periphery of the 1 st protruding part 615. Fig. 4 (a) is a perspective view of the 2 nd bus bar 700 viewed from the front downward, and fig. 4 (b) is a partial side sectional view of the 2 nd bus bar 700 showing the periphery of the 2 nd protrusion 715.
Referring to fig. 2 to 4 (b), the capacitor element unit 100 includes three capacitor elements 500, a 1 st bus bar 600, a 2 nd bus bar 700, and an insulating plate 800.
The capacitor element 500 of the present embodiment is formed by a metallized thin film in which aluminum is deposited on a dielectric thin film, but may be formed by a metallized thin film in which another metal such as zinc or magnesium is deposited. Alternatively, capacitor element 500 may be formed by a metalized film in which a plurality of these metals are deposited, or may be formed by a metalized film in which an alloy of these metals is deposited.
The 1 st bus bar 600 is formed of a conductive material such as a copper plate, and includes a 1 st electrode terminal portion 610, a 1 st upper intermediate portion 620, three 1 st upper connection terminal portions 630, a 1 st lower intermediate portion 640, and a 1 st lower connection terminal portion 650. The 1 st bus bar 600 is formed by, for example, appropriately cutting and bending a single copper plate, and these 1 st electrode terminal portion 610, 1 st upper intermediate portion 620, 1 st upper connection terminal portion 630, 1 st lower intermediate portion 640, and 1 st lower connection terminal portion 650 are integrated.
The 1 st electrode terminal portion 610 has a substantially rectangular plate shape, and covers the 1 st electrode 510 of each capacitor element 500. In the 1 st electrode terminal portion 610, a notch 611 cut out in a substantially L shape is formed at a left end portion, an opening 612 in a substantially rectangular shape is formed at a central portion, and a notch 613 cut out in a substantially U shape is formed at a right end portion. A pair of electrode pins 614 are formed on the upper edges of the left and right notches 611 and 613 and the opening 612. Each of the pair of electrode leads 614 is bonded to the 1 st electrode 510 of the corresponding capacitor element 500 by a bonding method such as soldering. Thereby, the 1 st bus bar 600 is electrically connected to the capacitor element 500.
A plurality of 1 st protrusions 615 protruding forward are formed in an upper portion of the 1 st electrode terminal portion 610 so as to be aligned in the left-right direction, and four 1 st protrusions 615 are formed in the present embodiment. As shown in fig. 3 (b), each 1 st projecting portion 615 has a substantially flat truncated cone shape, a tip 615a is formed as a circular flat surface, and a circumferential surface 615b has a taper. Two circular holes 616 are formed in the lower portion of the 1 st electrode terminal portion 610.
The 1 st upper relay unit 620 relays between the 1 st electrode terminal unit 610 and the three 1 st upper connection terminal units 630. The 1 st upper relay portion 620 extends slightly rearward from the upper end edge of the 1 st electrode terminal portion 610 and then slightly upward. In the 1 st upper intermediate portion 620, two oblong holes 621 are formed so as to be aligned in the left-right direction.
Three 1 st upper connecting terminal portions 630 are formed at the upper edge portion of 1 st upper intermediate portion 620 with a predetermined interval. Each 1 st upper connection terminal portion 630 extends upward from the upper end edge of 1 st upper intermediate portion 620, has a base end portion expanded, and has a large R at both corner portions of the front end portion. Each 1 st upper connection terminal portion 630 is formed with a circular mounting hole 631.
The 1 st lower relay unit 640 relays between the 1 st electrode terminal unit 610 and the 1 st lower connection terminal unit 650. The 1 st lower intermediate portion 640 extends rearward from a lower end edge of the 1 st electrode terminal portion 610. Lower 1 relay part 640 includes, at its right end, a connecting part 641 extending rearward in the same width as lower 1 connecting terminal part 650 and connected to lower 1 connecting terminal part 650.
The 1 st lower connection terminal portion 650 extends downward from the tip of the connection portion 641 of the 1 st lower intermediate portion 640, and has a substantially rectangular plate shape. The 1 st lower connection terminal portion 650 is formed with a circular mounting hole 651.
The 2 nd bus bar 700 is formed of a conductive material, for example, a copper plate, and includes a 2 nd electrode terminal portion 710, a 2 nd upper intermediate portion 720, a 2 nd upper connection terminal portion 730, a 2 nd lower intermediate portion 740, and a 2 nd lower connection terminal portion 750. The 2 nd bus bar 700 is formed by, for example, appropriately cutting and bending a single copper plate, and these 2 nd electrode terminal portion 710, the 2 nd upper intermediate portion 720, the three 2 nd upper connection terminal portions 730, the 2 nd lower intermediate portion 740, and the 2 nd lower connection terminal portion 750 are integrated.
The 2 nd electrode terminal portion 710 has a substantially rectangular plate shape, and covers the 2 nd electrode 520 of each capacitor element 500. In the 2 nd electrode terminal portion 710, a notch portion 711 cut out in a substantially U shape is formed at a left end portion, and two openings 712 and 713 in a substantially rectangular shape are formed at a central portion and a right portion. A pair of electrode leads 714 are formed on the upper edges of the cutout 711 and the two openings 712 and 713. Each of the pair of electrode pins 714 is bonded to the 2 nd electrode 520 of the corresponding capacitor element 500 by a bonding method such as soldering. Thereby, the 2 nd bus bar 700 is electrically connected to the capacitor element 500.
A plurality of 2 nd protrusions 715, which protrude rearward, are formed in the upper portion of the 2 nd electrode terminal portion 710 so as to be arranged in the left-right direction, and four 2 nd protrusions 715 are formed in the present embodiment. As shown in fig. 4 (b), each 2 nd protrusion 715 has a substantially flat truncated cone shape, a tip 715a is formed as a circular flat surface, and a peripheral surface 715b has a taper. In addition, two circular holes 716 are formed at upper and lower portions of the 2 nd electrode terminal portion 710, respectively.
The 2 nd upper relay terminal portion 720 relays between the 2 nd electrode terminal portion 710 and the three 2 nd upper connection terminal portions 730. The 2 nd upper relay part 720 extends forward from the upper end edge of the 2 nd electrode terminal part 710 and then slightly upward. In the 2 nd upper relay section 720, two oblong holes 721 and four circular holes 722 are formed so as to be aligned in the left-right direction. Further, in the 2 nd upper intermediate portion 720, three oblong holes 723 are formed in front of the six holes 721 and 722 so as to be aligned in the left-right direction.
Three upper 2-th connecting terminal portions 730 are formed at the upper edge portion of upper 2-th intermediate portion 720 with a predetermined interval. Each 2 nd upper connection terminal portion 730 extends upward from the upper end edge of the 2 nd upper intermediate portion 720, has a base end portion expanded, and has a large R at both corner portions of the front end portion. Each 2 nd upper connection terminal portion 730 has a circular mounting hole 731.
The 2 nd lower relay section 740 relays between the 2 nd electrode terminal section 710 and the 2 nd lower connection terminal section 750. The 2 nd lower relay part 740 extends forward from the lower end edge of the 2 nd electrode terminal part 710. Lower 2 relay portion 740 includes, at its right end portion, a connecting portion 741 which extends rearward with the same width as lower 2 connecting terminal portion 750 and is connected to lower 2 connecting terminal portion 750.
The 2 nd lower connection terminal portion 750 has a substantially rectangular plate shape extending downward from the front end of the connection portion 741 of the 2 nd lower relay portion 740. The 2 nd lower connecting terminal portion 750 is formed with a circular mounting hole 751.
Insulating plate 800 is formed of a resin material such as polyphenylene sulfide (PPS) and interposed between 1 st upper relay part 620 and three 1 st upper connecting terminal parts 630 of 1 st bus bar 600 and 2 nd upper relay parts 720 and three 2 nd upper connecting terminal parts 730 of 2 nd bus bar 700, which overlap in the front-rear direction. Insulation between the 1 st bus bar 600 and the 2 nd bus bar 700 can be ensured by the insulation plate 800.
In the capacitor element unit 100, the 1 st lower connection terminal portion 650 of the 1 st bus bar 600 and the 2 nd lower connection terminal portion 750 of the 2 nd bus bar 700 are located at the lower portion of the right end.
Fig. 5 (a) is a perspective view of the housing 200 viewed from the front and above, and fig. 5 (b) is a perspective view of the housing 200 viewed from the rear and above. Fig. 6 (a) is a perspective view of a right portion of the housing 200 as viewed from the front downward direction, and fig. 6 (b) is a partial front sectional view of the housing 200 showing the peripheries of the 1 st through hole 240 and the 2 nd through hole 250.
Referring to fig. 5 (a) to 6 (b), the case 200 is made of resin, is formed of, for example, polyphenylene sulfide (PPS), has a substantially rectangular parallelepiped box shape elongated in the left-right direction, and has an open upper surface. The housing 200 includes a bottom surface portion 201 facing the opening 200a on the top surface, and front, rear, left, and right side portions 202, 203, 204, and 205 rising from the bottom surface portion 201 and surrounding the bottom surface portion 201. The front side surface 202 and the rear side surface 203 are a pair of side surface portions along the longitudinal direction of the housing 200, and have a relatively large width (dimension in the left-right direction), and the left side surface 204 and the right side surface 205 are a pair of side surface portions along the short direction of the housing 200, and have a relatively small width (dimension in the front-rear direction).
The left side surface 204 and the right side surface 205 are provided with attachment joints 210 on the outer wall surface. In each mount header 210, an insertion hole 211 is formed on the upper and lower sides. A metal collar (collar) 212 is fitted into the insertion hole 211 to increase the strength of the hole. When the film capacitor 1 is installed in an installation part of an external device, the mounting tabs 210 are fixed to the installation part by screws or the like.
In the front side portion 202 and the rear side portion 203, a plurality of 1 st ribs 220 and a plurality of 2 nd ribs 230, in the present embodiment, six 1 st ribs 220 and 2 nd ribs 230, which protrude from the inner wall surface toward the inside of the housing 200, are formed in a manner aligned in the left-right direction, respectively. That is, the 1 st rib 220 and the 2 nd rib 230 are disposed at a predetermined interval and are dispersed throughout the entire side surface portions 202 and 203 so as to reinforce the side surface portions.
The 1 st rib 220 and the 2 nd rib 230 extend from the vicinity of the bottom surface portion 201 to the vicinity of the opening portion 200 a. Each of the 1 st rib 220 and the 2 nd rib 230 has a substantially rectangular parallelepiped shape elongated in the vertical direction and flat in the front-rear direction. Thus, the leading ends 221 and 231 of the 1 st rib 220 and the 2 nd rib 230 form an elongated, rectangular flat surface. Upper end portions (end portions on the opening 200a side) 222 and 232 of the 1 st rib 220 and the 2 nd rib 230 are inclined so as to be away from the opening 200a toward the inside of the case 200.
Among the six 1 st ribs 220, the positions of four 1 st ribs 220 of the central portion are corresponded to the positions of four 1 st protrusions 615 of the 1 st bus bar 600. With regard to the four 1 st ribs 220, the dimension in the left-right direction is slightly smaller than the diameter (dimension in the left-right direction) of the tip 615a of the 1 st projecting portion 615, and the dimension in the up-down direction is much larger than the diameter (dimension in the up-down direction) of the tip 615a of the 1 st projecting portion 615.
Likewise, among the six 2 nd ribs 230, the positions of four 2 nd ribs 230 at the central portion are corresponded to the positions of four 2 nd protrusions 715 of the 2 nd bus bar 700. With regard to the four 2 nd ribs 230, the dimension in the left-right direction is slightly smaller than the diameter of the tip 715a of the 2 nd protrusion 715, and the dimension in the up-down direction is much larger than the diameter (dimension in the up-down direction) of the tip 715a of the 2 nd protrusion 715.
The bottom surface portion 201 has a shape in which the bottom of the right end vicinity portion 201a is slightly deeper than the other portions. A substantially square protrusion 206 protruding downward is formed in the right end vicinity portion 201a, and the thickness of the bottom portion 201 in the protrusion 206 is larger than the thickness of the other portions.
In the convex portion 206, a 1 st through hole 240 and a 2 nd through hole 250 are formed so as to be aligned in the left-right direction. The 1 st through hole 240 and the 2 nd through hole 250 include 1 st holes 241 and 251 and 2 nd holes 242 and 252 continuous to the 1 st holes 241 and 251. The 2 nd holes 242, 252 are larger and longer (deeper) than the 1 st holes 241, 251. The 1 st hole 241, 251 is located inside the housing 200, and the 2 nd hole 242, 252 is located outside the housing 200.
The 1 st holes 241 and 251 have shapes corresponding to the horizontal sectional shapes of the 1 st lower connection terminal portion 650 and the 2 nd lower connection terminal portion 750, that is, elongated square shapes, respectively. The inner wall surfaces of the 1 st holes 241 and 251 are inclined 241a and 251a so as to expand toward the inside of the housing 200. The diameters (front-rear dimension, left-right dimension) of the minimum opening lower end portions of 1 st holes 241 and 251 are slightly larger than the diameters (thickness dimension, width dimension) of 1 st lower connection terminal portion 650 and 2 nd lower connection terminal portion 750, respectively.
The 2 nd holes 242, 252 have a shape corresponding to the planar shape of the sealing member 400, that is, have an oblong shape. The inner wall surfaces of the 2 nd holes 242 and 252 are formed with a draft angle of a mold used when the housing 200 is molded.
Fig. 7 (base:Sub>A) and (b) arebase:Sub>A perspective view andbase:Sub>A plan view of the sealing member 400, respectively, and fig. 7 (c) isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A' of fig. 7 (b).
The two seal members 400 are formed of an elastic material, for example, a rubber material such as silicone rubber, and have an oblong cylindrical shape.
In each seal member 400, an elastically deformable annular fin portion 410 surrounding the outer peripheral surface thereof is formed at the tip end portion and the intermediate portion. As shown in fig. 7 c, the fin portion 410 has a shape similar to a right triangle in cross section, and a surface 411 facing the distal direction (upward direction) is gently convexly curved and inclined, and a surface 412 facing the proximal direction (downward direction) is gently concavely curved. The fin portion 410 at the tip end portion has a height slightly lower than that of the fin portion 410 at the intermediate portion in order to match the draft of the 2 nd holes 242 and 252 of the housing 200. Further, a flange portion 420 is formed at a base end portion of each seal member 400. Further, two elastically deformable annular ribs 430 are formed around the inner circumferential surface of each seal member 400. Each rib 430 has a semicircular shape in cross section. In the longitudinal direction (vertical direction) of the seal member 400, the rib 430 on the tip end side is positioned between the two fin portions 410, and the rib 430 on the base end side is positioned between the fin portion 410 and the flange portion 420 in the intermediate portion. That is, the positions of the two fin portions 410 and the positions of the two ribs 430 are different in the longitudinal direction of the sealing member 400.
The outer diameter of the sealing member 400 including the fin portion 410 is larger than the diameters of the 2 nd holes 242 and 252 of the 1 st through hole 240 and the 2 nd through hole 250. Further, the inner diameter of the sealing member 400 including the rib 430 is smaller than the diameters (thickness, width) of the 1 st lower connection terminal portion 650 and the 2 nd lower connection terminal portion 750.
Fig. 8 (a) is a side cross-sectional view of the film capacitor 1 in a state before the filling resin 300 is filled, and fig. 8 (b) is a plan view of the central portion of the film capacitor 1 in a state before the filling resin 300 is filled. Fig. 9 is a cross-sectional view of a main portion of the film capacitor 1 showing a state before the filling resin 300 around the 1 st through hole 240 is filled. In addition, in fig. 9, the sealing member 400 is illustrated in a state before the fin portion 410 and the rib 430 are deformed for convenience.
When the capacitor element unit 100 is inserted into the case 200, the 1 st electrode terminal portion 610 of the 1 st bus bar 600 faces the front side surface portion 202, and the four 1 st protrusions 615 of the 1 st electrode terminal portion 610 abut against the four 1 st ribs 220 at the central portion of the front side surface portion 202 at the upper portion of the case 200, that is, at positions closer to the opening portion 200a than the bottom surface portion 201. Similarly, the 2 nd electrode terminal portion 710 of the 2 nd bus bar 700 faces the rear side surface portion 203, and the four 2 nd protrusions 715 of the 2 nd electrode terminal portion 710 abut against the four 2 nd ribs 230 at the central portion of the rear side surface portion 203 at the upper portion of the housing 200.
At this time, the flat surfaces of the leading ends 221 and 615a of the 1 st rib 220 and the 1 st projecting portion 615 abut against each other, and the flat surfaces of the leading ends 231 and 715a of the 2 nd rib 230 and the 2 nd projecting portion 715 abut against each other. Therefore, even if the positions of the 1 st rib 220 and the 1 st projecting portion 615 or the positions of the 2 nd rib 230 and the 2 nd projecting portion 715 are shifted slightly in the left-right direction, they can be brought into contact with each other reliably. Further, the diameters (the dimension in the left-right direction) of the front ends 615a, 715a of the 1 st protruding portion 615 and the 2 nd protruding portion 715 are larger than the widths (the dimension in the left-right direction) of the front ends 221, 231 of the 1 st rib 220 and the 2 nd rib 230, so it is possible to more reliably abut the 1 st rib 220 and the 1 st protruding portion 615 and more reliably abut the 2 nd rib 230 and the 2 nd protruding portion 715, while suppressing an increase in the amount of resin of the housing 200 caused by a widening of the width of the 1 st rib 220 and the 2 nd rib 230.
The upper ends 222 and 232 of the 1 st rib 220 and the 2 nd rib 230 and the lower sides of the circumferential surfaces 615b and 715b of the 1 st protrusion 615 and the 2 nd protrusion 715, that is, the bottom surface 201 side, are inclined so as to be away from the opening 200a toward the inside of the housing 200. Thus, when the capacitor element unit 100 is inserted into the case 200 from above, the 1 st and 2 nd protrusions 615 and 715 are less likely to catch on the upper end portions 222 and 232 of the 1 st and 2 nd ribs 220 and 230. Therefore, the capacitor element unit 100 can be smoothly accommodated in the case 200.
After the capacitor element unit 100 is housed in the case 200, the sealing member 400 is inserted into the 1 st and 2 nd lower connection terminal portions 650 and 750, and into the 2 nd holes 242 and 252 of the 1 st and 2 nd through- holes 240 and 250 from the outside of the case 200. The sealing member 400 is completely assembled when the flange portion 420 of the sealing member 400 abuts the wall surface around the 2 nd holes 242 and 252 in the protruding portion 206 of the housing 200 and is press-fitted into the 2 nd holes 242 and 252. By confirming that the flange portion 420 abuts against the wall surface of the projection portion 206, it can be confirmed that the seal member 400 is completely assembled.
As shown in fig. 9, sealing member 400 is interposed between an outer surface of 1 st lower connection terminal portion 650 and an inner wall surface of 2 nd hole 242 of 1 st through-hole 240, so that 1 st lower connection terminal portion 650 and 1 st through-hole 240 are sealed. The two fin portions 410 on the outer peripheral surface of the sealing member 400 are deformed so as to collapse downward, that is, to contract inward in a direction opposite to the insertion direction of the sealing member 400 into the 1 st through hole 240, and come into contact with the inner wall surface of the 2 nd hole 242 over the entire circumference. Each fin 410 is pressed against the inner wall surface of the 2 nd hole 242.
The two ribs 430 on the inner circumferential surface of the sealing member 400 are deformed so as to contract inward, and abut against the outer surface of the 1 st lower connection terminal portion 650 over the entire circumference. Each rib 430 is pressed against the outer surface of the 1 st lower connection terminal portion 650. The portions of the inner circumferential surface of the sealing member 400 other than the ribs 430 are not in contact with the outer surfaces of the 1 st lower connection terminal portions 650. Thus, it becomes easy to insert the sealing member 400 into the 1 st lower connection terminal portion 650.
The length from the front end of the seal member 400 to the near side of the flange portion 420 is shorter than the length of the 2 nd hole 242. Thus, a slight gap is formed between the wall surface between the 1 st hole 241 and the 2 nd hole 242 of the 1 st through hole 240 and the distal end surface of the seal member 400.
Similarly, sealing member 400 is interposed between the outer surface of lower 2-th connection terminal portion 750 and the inner wall surface of 2-nd hole 252 of 2-nd through-hole 250, and thus, the space between lower 2-th connection terminal portion 750 and 2-nd through-hole 250 is sealed. The two fin portions 410 are deformed to be in contact with the inner wall surface of the 2 nd hole 252 over the entire circumference, and the two ribs 430 are deformed to be in contact with the outer surface of the 2 nd lower connecting terminal portion 750 over the entire circumference. A slight gap is formed between the wall surface between the 1 st hole 251 and the 2 nd hole 252 of the 2 nd through hole 250 and the distal end surface of the seal member 400.
Further, the fin portion 410 of the sealing member 400 is inclined toward a surface 411 in the distal end direction, i.e., the insertion direction. Therefore, resistance generated when the sealing member 400 is inserted into the 2 nd holes 242 and 252 is reduced, and the sealing member 400 is easily inserted into the 2 nd holes 242 and 252.
In case 200 housing capacitor element unit 100, filling resin 300 in a liquid phase is injected through opening 200a and stored. At this time, the sealing member 400 seals between the 1 st lower connection terminal portion 650 and the 1 st through hole 240, and the sealing member 400 seals between the 2 nd lower connection terminal portion 750 and the 2 nd through hole 250. This prevents the filling resin 300 in a liquid phase from leaking from the 1 st through hole 240 and the 2 nd through hole 250 to the outside of the case 200.
In particular, in the sealing member 400, the fin portion 410 is strongly in close contact with the inner wall surfaces of the 2 nd holes 242 and 252 of the 1 st through hole 240 and the 2 nd through hole 250 by the pressing force (stress) generated by the deformation thereof, and therefore, the sealing member 400 is strongly closed with the inner wall surfaces of the 2 nd holes 242 and 252. This can satisfactorily prevent the filling resin 300 from leaking from between the sealing member 400 and the 2 nd holes 242 and 252.
Further, in sealing member 400, since rib 430 strongly comes into close contact with the outer surfaces of 1 st lower connection terminal portion 650 and 2 nd lower connection terminal portion 750 by a pressing force (stress) generated by deformation thereof, the gap between sealing member 400 and the outer surfaces of 1 st lower connection terminal portion 650 and 2 nd lower connection terminal portion 750 is strongly closed. This can prevent the filling resin 300 from leaking from between the sealing member 400 and the 1 st and 2 nd lower connection terminal portions 650 and 750.
Further, since the 2 nd holes 242 and 252 are blocked from the outside of the case 200 by the flange portion 420 of the seal member 400, the filling resin 300 can be further prevented from leaking from the 1 st through hole 240 and the 2 nd through hole 250 to the outside of the case 200.
A part of the filling resin 300 injected into the case 200 flows into between the front side surface portion 202 and the 1 st electrode terminal portion 610 and between the rear side surface portion 203 and the 2 nd electrode terminal portion 710.
The dimension of the 1 st protrusion 615 in the vertical direction (the direction in which the opening 200a and the bottom surface 201 are aligned) is smaller than the dimension of the 1 st rib 220 in the vertical direction, and a gap is formed between the 1 st electrode terminal portion 610 and the 1 st rib 220 at the position of the four 1 st ribs 220 in the central portion in the vertical direction except for the portion where the 1 st rib 220 and the 1 st protrusion 615 are in contact. Similarly, the dimension of the 2 nd protrusion 715 in the vertical direction is smaller than the dimension of the 2 nd rib 230 in the vertical direction, and a gap is formed between the 2 nd electrode terminal portion 710 and the 2 nd rib 230 at the position of the four 2 nd ribs 230 at the central portion in the vertical direction except for the portion where the 2 nd rib 230 and the 2 nd protrusion 715 contact. Therefore, the filling resin 300 can smoothly flow in the left-right direction at the positions of the 1 st rib 220 and the 2 nd rib 230, and can satisfactorily spread between the front side surface portion 202 and the 1 st electrode terminal portion 610 and between the rear side surface portion 203 and the 2 nd electrode terminal portion 710.
Further, the filling resin 300 flowing into the case 200 flows through the holes 616 and 621 provided in the 1 st bus bar 600 and the holes 716, 721, 722, and 723 provided in the 2 nd bus bar 700, and thereby favorably spreads to the inside of the capacitor element unit 100, that is, between the 1 st bus bar 600 and the 2 nd bus bar 700 and the three capacitor elements 500.
When the injection of the potting resin 300 into the case 200 is completed, the case 200 is heated, and the potting resin 300 in the case 200 is cured. Then, the cured filling resin 300 is cooled, but at this time the filling resin 300 may shrink. At this time, the front side 202, the rear side 203, the left side 204, and the right side 205 of the case 200 are subjected to a stress of being pulled into the case 200 by the filling resin 300 which tends to shrink.
The front side 202 and the rear side 203 are reinforced by six 1 st ribs 220 and 2 nd ribs 230, respectively. Further, the four 1 st ribs 220 and the 2 nd ribs 230 in the central portion are in contact with the 1 st protrusions 615 and the 2 nd protrusions 715, whereby the front side surface portion 202 and the rear side surface portion 203 are supported by the 1 st protrusions 615 and the 2 nd protrusions 715 from the inside of the housing 200. This strongly suppresses the front side 202 and the rear side 203 from warping toward the inside of the housing 200. In particular, although the front side 202 and the rear side 203 are likely to warp on the upper side of the opening 200a, the 1 st projection 615 and the 2 nd projection 715 are located on the upper side, and therefore warping of the front side 202 and the rear side 203 can be effectively suppressed.
On the other hand, the left side surface 204 and the right side surface 205 are reinforced by the attachment joints 210 formed on the outer wall surface in addition to being small in size in the front-rear direction. Thus, even if the left side surface portion 204 and the right side surface portion 205 do not have the structure based on the 1 st rib 220 and the 2 nd rib 230 and the 1 st protrusion 615 and the 2 nd protrusion 715, warping to the inside of the case 200 can be prevented.
Thus, as shown in fig. 1 (a) and (b), the film capacitor 1 is completed.
The film capacitor 1 is mounted in various external devices such as an inverter device provided in an electric vehicle. A pair of external terminals (not shown) provided in an external device or the like and corresponding to the connection terminal portions 630 and 730 are connected to the 1 st upper connection terminal portion 630 and the 2 nd upper connection terminal portion 730. A pair of external terminals (not shown) provided in the external device and corresponding to the connection terminal portions 650 and 750 are connected to the 1 st lower connection terminal portion 650 and the 2 nd lower connection terminal portion 750.
The film capacitor 1 mounted on the external device is not necessarily identical in the front, rear, left, and right directions to the direction shown in the present embodiment, that is, in the direction in which the opening 200a of the case 200 is directed upward and the bottom surface portion 201 is directed downward. For example, the film capacitor 1 can be installed in an external device so that the rear side surface 203 faces downward. When the film capacitor 1 needs to be cooled intensively, a cooler (not shown) is attached to the outer surface of the rear side surface portion 203. In this case, since the flatness of the rear surface portion 203 is increased, the film capacitor 1 has good cooling performance because of good adhesion of the cooler.
< effects of the embodiment >
As described above, according to the present embodiment, the following effects can be exhibited.
According to this configuration, since the gap between the 1 st lower connection terminal portion 650 (the 2 nd lower connection terminal portion 750) and the 1 st through hole 240 (the 2 nd through hole 250) is sealed by the sealing member 400, the filling resin 300 in a liquid phase state can be prevented from leaking from the 1 st through hole 240 (the 2 nd through hole 250) to the outside of the case 200. In particular, since the fin portion 410 strongly blocks the gap between the sealing member 400 and the inner wall surface of the 1 st through-hole 240 (the 2 nd through-hole 250), the filler resin 300 can be satisfactorily prevented from leaking from the gap between the sealing member 400 and the 1 st through-hole 240 (the 2 nd through-hole 250). Further, the sealing member 400 only needs to be attached to the 1 st through-hole 240 (the 2 nd through-hole 250), and leakage of the filling resin 300 from the 1 st through-hole 240 (the 2 nd through-hole 250) can be easily prevented.
The film capacitor 1 is configured such that the sealing member 400 includes a flange portion 420, and the flange portion 420 abuts against a wall surface around the 1 st through hole 240 (the 2 nd through hole 250) on the outer side of the case 200 to close the 1 st through hole 240 (the 2 nd through hole 250) from the outer side of the case 200.
With this configuration, the filling resin 300 can be further prevented from leaking from the 1 st through hole 240 (2 nd through hole 250) to the outside of the case 200.
Furthermore, the film capacitor 1 is configured such that the 1 st through-hole 240 (the 2 nd through-hole 250) includes a 1 st hole 241 (251) and a 2 nd hole 242 (252) continuous with the 1 st hole 241 (251), the 2 nd hole 242 (252) is larger than the 1 st hole 241 (251), and the sealing member 400 is disposed in the 2 nd hole 242 (252).
According to this structure, while the position of 1 st lower connection terminal portion 650 (2 nd lower connection terminal portion 750) is restricted by 1 st hole 241 (251), the gap between 1 st lower connection terminal portion 650 (2 nd lower connection terminal portion 750) and 2 nd hole 242 (252) can be sealed by sealing member 400.
Further, film capacitor 1 is configured such that 1 st hole 241 (251) is located inside case 200 and 2 nd hole 242 (252) is located outside case 200.
According to this configuration, the sealing member 400 can be inserted into the 2 nd hole 242 (252) from the outside of the housing 200, and therefore, the fitting of the sealing member 400 to the housing 200 becomes easy.
Further, in the film capacitor 1, the sealing member 400 has a deformable annular rib 430 on the inner surface thereof. The inner diameter of the sealing member 400 including the rib 430 is smaller than the diameter of the 1 st lower connection terminal portion 650 (the 2 nd lower connection terminal portion 750), and the rib 430 is deformed to abut against the outer surface of the 1 st lower connection terminal portion 650 (the 2 nd lower connection terminal portion 750).
According to this structure, since the rib 430 strongly blocks the gap between the sealing member 400 and the outer surface of the 1 st lower connection terminal portion 650 (the 2 nd lower connection terminal portion 750), it is possible to satisfactorily prevent the filling resin 300 from leaking from the gap between the sealing member 400 and the 1 st lower connection terminal portion 650 (the 2 nd lower connection terminal portion 750).
Further, the film capacitor 1 is configured such that the position of the fin portion 410 and the position of the rib 430 are different in the longitudinal direction of the sealing member 400.
According to this configuration, the positions of the stress applied to the inner wall surfaces of the 1 st through-hole 240 (the 2 nd through-hole 250) by the fin portion 410 and the stress applied to the outer surface of the 1 st lower connection terminal portion 650 (the 2 nd lower connection terminal portion 750) by the rib 430 can be dispersed in the longitudinal direction of the sealing member 400, and therefore, the insertion of the sealing member 400 into the 1 st through-hole 240 (the 2 nd through-hole 250) is facilitated.
While the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications other than the above embodiments are possible in the application examples of the present invention.
For example, in the above embodiment, two fin portions 410 having a cross-section similar to a right triangle shape are formed on the outer peripheral surface of the sealing member 400. However, the shape of the fin portion 410 is not limited to the above shape, and may be appropriately changed, and the number of the fin portions 410 may be appropriately changed according to the length of the sealing member 400 or the like.
In the above embodiment, two ribs 430 having a semicircular shape in cross section are formed on the inner circumferential surface of the sealing member 400. However, the shape of the ribs 430 is not limited to the above shape, and may be changed as appropriate, and the number of ribs 430 may be changed as appropriate according to the length of the seal member 400 or the like. Further, the sealing member 400 may be configured such that the rib 430 is not provided on the inner circumferential surface, and the entire inner circumferential surface is in close contact with the outer surface of the 1 st lower connection terminal portion 650 (the 2 nd lower connection terminal portion 750).
Further, in the above embodiment, the flange portion 420 is provided in the seal member 400. However, the sealing member 400 may be configured without the flange portion 420.
Further, in the above embodiment, the 1 st through hole 240 and the 2 nd through hole 250 include the 1 st holes 241 and 251 and the 2 nd holes 242 and 252. However, the 1 st through hole 240 and the 2 nd through hole 250 may be configured not to have the 1 st holes 241 and 251, and the 2 nd holes 242 and 252 may be connected to the inside of the case 200. In this case, the length of the sealing member 400 may be changed as the length of the 2 nd holes 242 and 252 is changed.
In the above embodiment, the 1 st through hole 240 and the 2 nd through hole 250 are provided in the bottom surface portion 201 of the housing 200. However, the 1 st through hole 240 and the 2 nd through hole 250 may be provided in any one of the front side 202, the rear side 203, the left side 204, and the right side 205 of the housing 200. Further, a 1 st through hole and a 2 nd through hole may be provided in a plurality of side surface portions of the housing 200, and connection terminal portions corresponding to these through holes may be provided in the 1 st bus bar 600 and the 2 nd bus bar 700.
Further, in the above embodiment, the capacitor element unit 100 includes 3 capacitor elements 500. However, the number of capacitor elements 500 may be changed as appropriate, including the case where the number is 1.
Further, in the above-described embodiment, the capacitor element 500 is formed by overlapping 2 metallized films in which aluminum is deposited on a dielectric film and winding or laminating the overlapped metallized films, but in addition to this, these capacitor elements 500 may be formed by overlapping metallized films in which aluminum is deposited on both surfaces of a dielectric film and an insulating film and winding or laminating them.
Further, in the above-described embodiment, the film capacitor 1 is exemplified as an example of the capacitor of the present invention. However, the present invention can also be applied to capacitors other than the film capacitor 1.
In addition, the embodiments of the present invention can be modified in various ways as appropriate within the scope of the technical idea shown in the claims.
In the description of the above embodiment, terms indicating directions such as "upper" and "lower" indicate relative directions depending only on relative positional relationships of structural members, and do not indicate absolute directions such as vertical directions and horizontal directions.
Industrial applicability of the invention
The present invention is useful for capacitors used for various electronic devices, electrical devices, industrial devices, electrical components of vehicles, and the like.
Description of the symbols
1. A thin film capacitor (condenser);
200. a housing;
240. 1 st through hole (through hole);
241. 1, hole;
242. a 2 nd well;
250. 2 nd through hole (through hole);
251. 1, hole;
252. a 2 nd well;
300. filling resin;
400. a sealing member;
410. fin portions (1 st projecting portion);
420. a flange portion (closing portion);
430. ribs (No. 2 protrusions);
500. a capacitor element;
510. 1 st electrode (electrode);
520. 2 nd electrode (electrode);
600. 1 st bus bar (bus bar);
650. 1 st lower connection terminal portion (connection terminal portion);
700. 2 nd bus bar (bus bar);
750. and the 2 nd lower connection terminal portion (connection terminal portion).
Claims (6)
1. A capacitor is provided with:
a capacitor element;
a bus bar connected to an electrode of the capacitor element;
a case accommodating the capacitor element;
a filling resin filled in the housing;
a through hole provided in the housing;
a connection terminal portion provided in the bus bar, led out from the through hole to the outside, and connectable to an external terminal; and
an annular sealing member interposed between an outer surface of the connection terminal portion and an inner wall surface of the through hole,
the sealing member has a deformable annular 1 st projection on an outer surface thereof,
the sealing member including the 1 st projection has an outer diameter larger than a diameter of the through hole,
the 1 st projection is deformed to abut against an inner wall surface of the through hole.
2. The capacitor of claim 1, wherein,
the sealing member includes: and a blocking portion that abuts against a wall surface around the through hole on the outside of the housing to block the through hole from the outside of the housing.
3. The capacitor of claim 1 or 2,
the through-holes include a 1 st hole and a 2 nd hole continuous with the 1 st hole,
said 2 nd hole is larger than said 1 st hole,
the sealing member is disposed in the 2 nd hole.
4. The capacitor of claim 3, wherein,
the 1 st hole is located the inboard of casing, the 2 nd hole is located the outside of casing.
5. The capacitor of any one of claims 1 to 4,
the sealing member has a deformable annular 2 nd projection on an inner surface thereof,
the inner diameter of the sealing member including the 2 nd projecting portion is smaller than the diameter of the connection terminal portion,
the 2 nd projecting portion is deformed to come into contact with an outer surface of the connection terminal portion.
6. The capacitor of claim 5, wherein,
the position of the 1 st protrusion and the position of the 2 nd protrusion are different in the longitudinal direction of the sealing member.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020117162 | 2020-07-07 | ||
| JP2020-117162 | 2020-07-07 | ||
| PCT/JP2021/023817 WO2022009680A1 (en) | 2020-07-07 | 2021-06-23 | Capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115552558A true CN115552558A (en) | 2022-12-30 |
Family
ID=79552998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180034670.3A Pending CN115552558A (en) | 2020-07-07 | 2021-06-23 | Capacitor with a capacitor element |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022009680A1 (en) |
| CN (1) | CN115552558A (en) |
| WO (1) | WO2022009680A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790515U (en) * | 1980-11-22 | 1982-06-03 | ||
| JPS5897826U (en) * | 1981-12-24 | 1983-07-02 | 松下電器産業株式会社 | Capacitor lid |
| JP2004281226A (en) * | 2003-03-14 | 2004-10-07 | Yuasa Corp | Sealed storage battery |
| JP2016058688A (en) * | 2014-09-12 | 2016-04-21 | 株式会社豊田自動織機 | Capacitor module, and method of manufacturing capacitor module |
| JP7270123B2 (en) * | 2017-12-28 | 2023-05-10 | パナソニックＩｐマネジメント株式会社 | capacitor |
-
2021
- 2021-06-23 JP JP2022535009A patent/JPWO2022009680A1/ja active Pending
- 2021-06-23 WO PCT/JP2021/023817 patent/WO2022009680A1/en active Application Filing
- 2021-06-23 CN CN202180034670.3A patent/CN115552558A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022009680A1 (en) | 2022-01-13 |
| WO2022009680A1 (en) | 2022-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6425024B2 (en) | Capacitor and inverter | |
| JP7270123B2 (en) | capacitor | |
| US20180040425A1 (en) | Case-mold-type capacitor and method for producing same | |
| US11869717B2 (en) | Capacitor | |
| JP2012199350A (en) | Case mold type capacitor | |
| JP6145691B2 (en) | Case mold type capacitor | |
| JP7122657B2 (en) | capacitor | |
| US20220013298A1 (en) | Capacitor | |
| CN114072889B (en) | Capacitor with a capacitor body | |
| JP4940665B2 (en) | Case mold type capacitor | |
| JP6145631B2 (en) | Case mold type capacitor | |
| JP5919489B2 (en) | Case mold type capacitor | |
| CN115552558A (en) | Capacitor with a capacitor element | |
| CN115605971A (en) | Capacitor with a capacitor element | |
| CN108885939B (en) | Capacitor and method for manufacturing capacitor | |
| CN112531379B (en) | Circuit unit, electrical junction box, and method for manufacturing circuit unit | |
| JP6145690B2 (en) | Case mold type capacitor | |
| JP7403086B2 (en) | Capacitor and capacitor manufacturing method | |
| US11452228B2 (en) | Driver | |
| CN115298781A (en) | Capacitor and method for manufacturing the same | |
| CN113196427B (en) | Capacitor with a capacitor body | |
| WO2024058236A1 (en) | Capacitor and method for manufacturing same | |
| JP2010251399A (en) | Method of manufacturing case-molded capacitor | |
| WO2021085107A1 (en) | Capacitor | |
| CN116157882A (en) | Capacitor with a capacitor body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |