CN115544944A - Method and device for determining position of cutting path mark - Google Patents
Method and device for determining position of cutting path mark Download PDFInfo
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- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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Abstract
The disclosure discloses a method and a device for determining the position of a cutting path mark. The position determination method comprises the following steps: acquiring a target arrangement mode of chips in a target area, wherein the target area comprises a setting area of the chips and a cutting path area, and the cutting path area is used for setting a cutting path mark; determining the characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the preset number of the cutting path marks, wherein the characteristic parameters of the cutting path marks comprise at least one of the following parameters: the shape of the street sign, and the size of the street sign; and determining the position parameters of the cutting street marks which accord with the preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting street marks to obtain mark position information corresponding to the target area, wherein the position parameters of the cutting street marks are used for representing the setting positions of the cutting street marks in the cutting street area.
Description
Technical Field
The disclosure relates to the technical field of functional testing, in particular to a method and a device for determining the position of a cutting path mark.
Background
In the current manufacturing process of Dynamic Random Access Memory (DRAM) devices, the array arrangement (Shot array) of the chip in the whole exposure area needs to be simulated first, A cutting track area is arranged between adjacent chips, and then the position of an overlay error mark (OVL mark) is simulated in the cutting track area.
In the flow of placing the OVL marks on the cutting track, the size of the OVL marks is generally calculated according to the number of marks given by the mark owner, and then the OVL marks are placed by software. However, in the actual placement process, the OVL marks cannot be directly placed at corresponding positions, the existing software has no fixed program for placing the OVL marks, and can only randomly disperse, and then manually adjust the OVL marks one by one until the OVL marks conform to the placement rules of the OVL marks in the cutting path area, so that the efficiency is low, and the manpower is greatly wasted.
Disclosure of Invention
The present disclosure is directed to a method and an apparatus for determining a position of a scribe line mark, so as to solve the problem of low efficiency in setting the scribe line mark in the prior art.
In order to achieve the above object, according to one aspect of the present disclosure, there is provided a method of determining a position of a cutting street marker, comprising: acquiring a target arrangement mode of chips in a target area, wherein the target area comprises a setting area of the chips and a cutting path area, and the cutting path area is used for setting a cutting path mark; determining the characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the preset number of the cutting path marks, wherein the characteristic parameters of the cutting path marks comprise at least one of the following parameters: the shape of the street sign, and the size of the street sign; and determining the position parameters of the cutting street marks which accord with the preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting street marks to obtain mark position information corresponding to the target area, wherein the position parameters of the cutting street marks are used for representing the setting positions of the cutting street marks in the cutting street area.
Optionally, the obtaining of the target arrangement manner of the chips in the target region includes: acquiring a preset area of an exposure area in a target area, a preset area of a cutting street area and preset chip information, wherein the preset chip information at least comprises: presetting the type of the chip and the size of each preset chip; generating a plurality of candidate arrangement modes of the chips according to the preset area of the exposure area, the preset area of the cutting track area and the preset chip information, wherein the plurality of candidate arrangement modes of the chips are used for arranging the plurality of preset chips in the target area, and the difference among the plurality of candidate arrangement modes of the chips at least has one of the following differences: the number of the exposure areas is different, and the number of the preset chips is different; and determining the target arrangement mode of the chips from the plurality of candidate arrangement modes according to the number of the exposure areas and the number of the preset chips.
Optionally, determining a target arrangement of chips from a plurality of candidate arrangements according to the number of exposure areas and the number of preset chips, including: comparing the number of preset chips in the plurality of candidate arrangement modes to obtain a first comparison result; determining the first candidate arrangement mode as a target arrangement mode of the chips under the condition that the first comparison result indicates that the number of preset chips in the first candidate arrangement mode has a maximum value, wherein the plurality of candidate arrangement modes comprise the first candidate arrangement mode; and under the condition that the first comparison result indicates that the number of the preset chips in the second candidate arrangement modes has the same maximum value, determining the target arrangement mode of the chips according to the number of the exposure areas in the second candidate arrangement modes, wherein the candidate arrangement modes comprise the second candidate arrangement modes.
Optionally, determining the target arrangement of the chip according to the number of the exposure areas in the plurality of second candidate arrangements includes: comparing the number of the exposure areas in the plurality of second candidate arrangement modes to obtain a second comparison result; determining a third candidate arrangement mode as a target arrangement mode of the chips under the condition that the second comparison result indicates that the number of the exposure areas in the third candidate arrangement mode has a minimum value, wherein the plurality of second candidate arrangement modes comprise the third candidate arrangement mode; and under the condition that the second comparison result indicates that the number of the exposure areas in the plurality of fourth candidate arrangement modes has the same minimum value, determining any one fourth candidate arrangement mode in the plurality of fourth candidate arrangement modes as the target arrangement mode of the chip, wherein the plurality of second candidate arrangement modes comprise the plurality of fourth candidate arrangement modes.
Optionally, determining a characteristic parameter of the scribe line marks corresponding to the target arrangement of the chip according to the preset number of the scribe line marks includes: dividing the cutting street area into a plurality of sub-areas which correspond to the cutting street marks one by one according to the number of preset cutting street marks, wherein the areas of the plurality of sub-areas are the same, and the shapes of any two sub-areas in the plurality of sub-areas are the same or different; and determining characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the areas of the plurality of sub-regions, the shapes of the plurality of sub-regions and a preset proportion.
Optionally, determining a characteristic parameter of the scribe line mark corresponding to the target arrangement manner of the chip according to the areas of the plurality of sub-regions, the shapes of the plurality of sub-regions, and a preset ratio, includes: determining the size of a cutting path mark which meets the preset proportion with the area of each sub-region; and acquiring a preset graph corresponding to the shape of each sub-region from the plurality of preset graphs to obtain the shape of the cutting path mark corresponding to each sub-region.
Optionally, determining, according to the characteristic parameter of the scribe line mark, a position parameter of the scribe line mark that conforms to a preset relationship with the target arrangement manner of the chip, including: acquiring a first mark simulation position which accords with a preset relation with a target arrangement mode of a chip from a simulation database, wherein the simulation database comprises: the historical chip arrangement modes comprise a plurality of historical chip arrangement modes and mark simulation positions corresponding to the historical chip arrangement modes, wherein the preset relation is met between each historical chip arrangement mode and the corresponding mark simulation positions; generating mark position information corresponding to the target area according to a preset rule and the first mark simulation position, wherein the preset rule at least comprises the following steps: the minimum distance between the cutting path mark and the side line of the cutting path area is larger than or equal to a preset threshold value, and the cutting path marks are not overlapped.
Optionally, generating mark position information corresponding to the target area according to a preset rule and the first mark simulation position, including: judging whether the mark simulation position meeting the preset relation meets a preset rule or not; under the condition that the judgment result indicates yes, determining a first mark simulation position as mark position information corresponding to the target area; and under the condition that the judgment result indicates no, adjusting the first mark simulation position to a target mark position meeting a preset rule, and determining the target mark position as mark position information corresponding to the target area.
Optionally, adjusting the first marker simulation position to a target marker position meeting a preset rule according to the preset rule includes: establishing a coordinate system according to a first arrangement direction and a second arrangement direction of chips in a target area, wherein the chips in the target area are arranged in an array along the first arrangement direction and the second arrangement direction, any point in the target area is a coordinate origin of the coordinate system, the first arrangement direction is an x-axis of the coordinate system, and the second arrangement direction is a y-axis of the coordinate system; determining first coordinate information of a mark simulation position in a coordinate system; acquiring second coordinate information of the chip in the target area in a coordinate system; and generating third coordinate information meeting a preset rule according to the first coordinate information and the second coordinate information, and taking the target mark position as mark position information corresponding to the target area.
Optionally, the position determining method further includes: acquiring a plurality of historical chip arrangement modes and a mark simulation position corresponding to each historical chip arrangement mode; and establishing a simulation database according to the plurality of historical chip arrangement modes and the mark simulation position corresponding to each historical chip arrangement mode.
Optionally, when there are a plurality of target areas, the position determining method obtains mark position information corresponding to each target area, and further includes: and establishing a position information database according to the mark position information corresponding to each target area.
Optionally, the position determining method further includes: acquiring a new target arrangement mode of the chips in the target area; judging whether first mark position information corresponding to the new target area is stored in the position information database or not; and if the judgment result indicates yes, setting the preset cutting track mark in the new target area according to the first mark position information.
Optionally, the position determining method further includes: under the condition that the judgment result indicates that the target area is not the new target area, new position information corresponding to the new target area is obtained; and storing the newly added position information into a position information database.
According to another aspect of the embodiments of the present disclosure, there is also provided a device for determining a position of a scribe line mark, including: the chip arranging method comprises an obtaining module, a judging module and a judging module, wherein the obtaining module is used for obtaining a target arrangement mode of chips in a target area, the target area comprises a chip setting area and a cutting path area, and the cutting path area is used for setting a cutting path mark; a first determining module, configured to determine, according to a preset number of scribe line marks, a feature parameter of the scribe line mark corresponding to a target arrangement of the chip, where the feature parameter of the scribe line mark includes at least one of: the shape of the street sign, and the size of the street sign; and the second determining module is used for determining the position parameters of the cutting street marks which accord with the preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting street marks to obtain mark position information corresponding to the target area, wherein the position parameters of the cutting street marks are used for representing the setting positions of the cutting street marks in the cutting street area.
According to another aspect of the embodiments of the present disclosure, there is also provided a positioning system for a cutting street marker, including: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to execute the instructions to implement the method for determining the position of the cutting path mark.
By applying the technical scheme disclosed by the invention, the position determining method of the cutting path mark is provided, the automatic processing of the mark position determination in the cutting path is realized, the problem of long time consumption caused by manual placement is solved, and the setting efficiency of the mark in the cutting path area is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and are not to limit the disclosure. In the drawings:
fig. 1 is a block flow diagram illustrating a method for determining a position of a scribe lane mark according to embodiment 1 of the present disclosure;
fig. 2 is a schematic diagram of placing a dicing lane mark in a dicing lane area using the position determining method of the dicing lane mark shown in fig. 1;
FIG. 3 is a block diagram of a device for determining the position of a scribe line mark according to embodiment 2 of the present disclosure;
fig. 4 is a block diagram of an apparatus of a positioning system for a cutting street marker according to an embodiment of the present disclosure.
Detailed Description
It should be noted that, in the present disclosure, the embodiments and the features of the embodiments may be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the technical solutions of the present disclosure better understood by those skilled in the art, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the foregoing drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure may be described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
According to an embodiment of the present disclosure, an embodiment of a method for determining a position of a scribe lane mark is provided, and fig. 1 is a flowchart of the method for determining a position of a scribe lane mark according to embodiment 1 of the present disclosure, as shown in fig. 1, the method includes the following steps:
step S102, acquiring a target arrangement mode of chips in a target area, wherein the target area comprises a chip setting area and a cutting track area, and the cutting track area is used for setting a cutting track mark;
step S104, determining the characteristic parameters of the cutting street marks corresponding to the target arrangement mode of the chip according to the preset number of the cutting street marks, wherein the characteristic parameters of the cutting street marks comprise at least one of the following parameters: the shape of the street sign, and the size of the street sign;
and S106, determining the position parameters of the cutting street marks which accord with the preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting street marks to obtain mark position information corresponding to the target area, wherein the position parameters of the cutting street marks are used for representing the setting positions of the cutting street marks in the cutting street area.
By adopting the method for determining the position of the scribe line mark in the embodiment, the mark position information corresponding to the target area is obtained by obtaining the target arrangement mode of the chips in the target area, determining the characteristic parameter of the scribe line mark corresponding to the target arrangement mode of the chips according to the preset number of the scribe line marks, and then determining the position parameter of the scribe line mark corresponding to the target arrangement mode of the chips according to the characteristic parameter of the scribe line mark, so that the setting position of the scribe line mark in the target area can be determined based on the obtained arrangement mode of the chips in the target area, the automatic processing of determining the mark position in the scribe line is realized, the problem of long time consumption of manual placement is solved, and the setting efficiency of the mark in the scribe line area is improved.
In some optional embodiments, the acquiring of the target arrangement manner of the chips in the target region in step S102 includes: acquiring a preset area of an exposure area in a target area, a preset area of a cutting street area and preset chip information, wherein the preset chip information at least comprises: presetting the types of chips and the size of each preset chip; generating a plurality of candidate arrangement modes of the chips according to the preset area of the exposure area, the preset area of the cutting path area and the preset chip information, wherein the plurality of candidate arrangement modes of the chips are used for arranging a plurality of preset chips in the target area, and the difference among the plurality of candidate arrangement modes of the chips at least has one of the following differences: the number of the exposure areas is different, and the number of the preset chips is different; and determining the target arrangement mode of the chips from the plurality of candidate arrangement modes according to the number of the exposure areas and the number of the preset chips.
In the above embodiment, a plurality of candidate arrangement modes may be generated according to preset chip information, and an arrangement mode matched with a chip in the target region may be determined from the candidate arrangement modes. Illustratively, the candidate arrangement mode a and the candidate arrangement mode B are generated according to the type of the preset chips and the size of each preset chip, wherein: placing N first preset chips in the candidate arrangement mode A according to the first horizontal interval and the first vertical interval, wherein the cutting street area surrounding the first preset chips meets a first preset area, and each first preset chip is located in an exposure area meeting a second preset area; and arranging M second preset chips in the candidate arrangement mode B according to a second horizontal interval and a second vertical interval, wherein the cutting path area surrounding the second preset chips also meets the first preset area, each second preset chip is positioned in an exposure area meeting the second preset area, and N is not equal to M.
In some optional embodiments, determining a target arrangement of chips from a plurality of candidate arrangements according to the number of exposure areas and the number of preset chips includes: comparing the number of preset chips in the plurality of candidate arrangement modes to obtain a first comparison result; determining the first candidate arrangement mode as a target arrangement mode of the chips under the condition that the first comparison result indicates that the number of preset chips in the first candidate arrangement mode has a maximum value, wherein the plurality of candidate arrangement modes comprise the first candidate arrangement mode; and under the condition that the first comparison result indicates that the number of the preset chips in the second candidate arrangement modes has the same maximum value, determining the target arrangement mode of the chips according to the number of the exposure areas in the second candidate arrangement modes, wherein the candidate arrangement modes comprise the second candidate arrangement modes.
In the above embodiment, the chips with the largest number can be selected for placement, and the target arrangement mode of the chips is determined according to the number of the exposure areas, so as to reduce the number of exposure times. Exemplarily, in addition to the candidate arrangement mode a and the selected arrangement mode B, a candidate arrangement mode C is further generated according to the type of the preset chips and the size of each preset chip, wherein N third preset chips are placed in the candidate arrangement mode C according to a third horizontal pitch and a third vertical pitch, a scribe line region surrounding the third preset chips also satisfies the first preset area, and each third preset chip is located in an exposure region satisfying the second preset area; if the placing number of the chips in the candidate arrangement mode A and the candidate arrangement mode C is smaller than that of the chips in the candidate arrangement mode B, namely N is smaller than M, selecting the candidate arrangement mode B to place the chips to obtain a cutting path area surrounding the chips for placing cutting path marks; if the placing number of the chips in the candidate arrangement mode A and the candidate arrangement mode C is larger than that of the chips in the candidate arrangement mode B, namely N is larger than M, the candidate arrangement mode A or the candidate arrangement mode C is further selected for placing the chips according to the number of the exposure areas.
In some optional embodiments, determining the target arrangement of the chips according to the number of the exposure areas in the plurality of second candidate arrangements includes: comparing the number of the exposure areas in the plurality of second candidate arrangement modes to obtain a second comparison result; determining a third candidate arrangement mode as a target arrangement mode of the chips under the condition that the second comparison result indicates that the number of the exposure areas in the third candidate arrangement mode has a minimum value, wherein the plurality of second candidate arrangement modes comprise the third candidate arrangement mode; and under the condition that the second comparison result indicates that the number of the exposure areas in the plurality of fourth candidate arrangement modes has the same minimum value, determining any one fourth candidate arrangement mode in the plurality of fourth candidate arrangement modes as the target arrangement mode of the chip, wherein the plurality of second candidate arrangement modes comprise the plurality of fourth candidate arrangement modes.
In the above embodiment, the mode with the largest number of chips and the smallest exposure area is selected as the target arrangement mode of the chips. Illustratively, the candidate arrangement mode A, the candidate arrangement mode B and the candidate arrangement mode C are generated according to the type of preset chips and the size of each preset chip, N first preset chips are placed in the candidate arrangement mode A and the candidate arrangement mode C, M first preset chips are placed in the candidate arrangement mode B, if N is larger than M, the number of exposure areas in the candidate arrangement mode A and the candidate arrangement mode C is judged, the number of exposure areas in the candidate arrangement mode A is N, the number of exposure areas in the candidate arrangement mode C is M, if N is smaller than M, the candidate arrangement mode A is selected for placing the chips, and if N is larger than M, the candidate arrangement mode A or the candidate arrangement mode C is selected for placing the chips.
In some optional embodiments, the determining, in step S104, the characteristic parameter of the scribe lane marks corresponding to the target arrangement of the chips according to the preset number of the scribe lane marks includes: dividing the cutting street area into a plurality of sub-areas which correspond to the cutting street marks one by one according to the number of preset cutting street marks, wherein the areas of the plurality of sub-areas are the same, and the shapes of any two sub-areas in the plurality of sub-areas are the same or different; and determining characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the areas of the plurality of sub-regions, the shapes of the plurality of sub-regions and a preset proportion.
In the above embodiment, the size of the scribe line mark satisfying a preset ratio with the area of each sub-region may be determined; and acquiring a preset graph corresponding to the shape of each sub-region from the plurality of preset graphs to obtain the shape of the cutting channel mark corresponding to each sub-region, so as to determine characteristic parameters (shape and size) of the cutting channel mark placed in the corresponding sub-region, wherein the characteristic parameters of the cutting channel mark are used for determining position parameters of the cutting channel mark which accords with a preset relation with the target arrangement mode of the chip, and obtaining mark position information corresponding to the target region.
Illustratively, according to the number of preset cutting street marks, the cutting street area is divided into a plurality of sub-areas corresponding to the cutting street marks one by one, each sub-area is rectangular or square, a preset pattern corresponding to the shape of each sub-area is obtained from the plurality of preset patterns, that is, the cutting street marks are identical in shape, so that the characteristic parameters of the cutting street marks placed in the corresponding sub-areas are determined.
In some optional embodiments, the determining, in step S106, the position parameter of the scribe line mark that conforms to the preset relationship with the target arrangement of the chip according to the characteristic parameter of the scribe line mark includes: acquiring a first mark simulation position which accords with a preset relation with a target arrangement mode of a chip from a simulation database, wherein the simulation database comprises: the historical chip arrangement modes comprise a plurality of historical chip arrangement modes and mark simulation positions corresponding to the historical chip arrangement modes, wherein the preset relation is met between each historical chip arrangement mode and the corresponding mark simulation positions; generating mark position information corresponding to the target area according to a preset rule and the first mark simulation position, wherein the preset rule at least comprises the following steps: the minimum distance between the cutting path mark and the side line of the cutting path area is larger than or equal to a preset threshold value, and the cutting path marks are not overlapped.
In the above embodiment, a simulation database may be constructed in advance, and the simulation database includes: and the plurality of historical chip arrangement modes mark the simulation position corresponding to each historical chip arrangement mode, then the simulation position is directly obtained through the simulation database, and the actual setting position is obtained based on the simulation position, so that the problem that manual arrangement consumes long time is solved.
Specifically, the step of establishing a database for storing the marker simulation setup positions includes: acquiring a plurality of historical chip arrangement modes and a mark simulation position corresponding to each historical chip arrangement mode; and establishing a simulation database according to the plurality of historical chip arrangement modes and the mark simulation position corresponding to each historical chip arrangement mode.
In some optional embodiments, generating the marker position information corresponding to the target area according to the preset rule and the first marker simulation position includes: judging whether the mark simulation position meeting the preset relation meets a preset rule or not; under the condition that the judgment result indicates yes, determining a first mark simulation position as mark position information corresponding to the target area; and under the condition that the judgment result indicates no, adjusting the first mark simulation position to a target mark position meeting a preset rule, and determining the target mark position as mark position information corresponding to the target area.
In the above embodiment, by determining whether the simulation position satisfies the preset rule and adjusting the simulation position under the condition that the simulation position is not satisfied, the automatic adjustment of the placement position of the scribe line marks can be realized, and the scribe line marks placed in the scribe line area can satisfy the placement rule without manual adjustment.
In the above embodiment, adjusting the first marker simulation position to the target marker position meeting the preset rule according to the preset rule may include: establishing a coordinate system according to a first arrangement direction and a second arrangement direction of chips in a target area, wherein the chips in the target area are arranged in an array along the first arrangement direction and the second arrangement direction, any point in the target area is a coordinate origin of the coordinate system, the first arrangement direction is an x-axis of the coordinate system, and the second arrangement direction is a y-axis of the coordinate system; determining first coordinate information of a mark simulation position in a coordinate system; acquiring second coordinate information of the chip in the target area in a coordinate system; and generating third coordinate information meeting a preset rule according to the first coordinate information and the second coordinate information, and taking the target mark position as mark position information corresponding to the target area.
Exemplarily, as shown in fig. 2, a plurality of chips 10 with the same size are arranged in a target area, a scribe lane area 20 surrounds each chip 10, the position of the upper left corner of the first chip 10 on the uppermost left side is taken as an origin of coordinates, the coordinates of the position of the upper left corner of each chip 10 are respectively (0, 0) to (2, 2), the coordinate values of the scribe lane mark 30 are determined based on the coordinate system to obtain a mark simulation position of the scribe lane mark, whether the mark simulation position meets a preset rule is determined, if the minimum distance between the mark simulation position and the edge of the scribe lane area is determined to be greater than or equal to a preset threshold value, the distance between the scribe lane mark and the chip is prevented from being too small or overlapping after the scribe lane mark is placed, and if the scribe lane mark is determined not to be overlapping after the mark simulation position is placed, the preset rule is met, at this time, the position of the scribe lane mark in the target area is simulated according to the mark simulation position; and if the first marker simulation position does not meet the preset rule, adjusting the first marker simulation position to a target marker position meeting the preset rule.
In some optional embodiments, in a case that there are a plurality of target areas, the mark position information corresponding to each target area is obtained, and the position determining method in this embodiment further includes: and establishing a position information database according to the mark position information corresponding to each target area.
In the embodiment, the database for storing the setting position of the mark target is established in advance, the setting position of the mark target is determined and then directly called from the information database, and the placing position of the cutting road mark in the cutting road area is simulated according to the called data, so that the problem that manual placing consumes long time is solved, and the setting efficiency of the mark in the cutting road area is improved.
The method for determining the position of the scribe line mark in this embodiment may further include: acquiring a new target arrangement mode of the chips in the target area; judging whether first mark position information corresponding to the new target area is stored in the position information database or not; if the judgment result indicates yes, setting the preset cutting track mark in the new target area according to the first mark position information; under the condition that the judgment result indicates no, obtaining new position information corresponding to the new target area; and storing the newly added position information into a position information database.
In the above embodiment, by determining whether the information database stores the mark target setting position corresponding to the current target area, and updating the information database when the information database does not store the mark target setting position corresponding to the current target area, the data in the information database can be continuously updated when a new placement position of the scribe lane mark is determined, so that more placement positions of the scribe lane mark can be called in the information database, and various requirements of different customers can be met.
Example 2
According to an embodiment of the present disclosure, there is also provided a device for determining a position of a cutting street sign, and fig. 3 is a block diagram of a structure of the device for determining a position of a cutting street sign according to an embodiment 3 of the present disclosure, as shown in fig. 3, the device includes: an acquisition module 202, a first determination module 204, and a second determination module 206, which are described in detail below.
An obtaining module 202, configured to obtain a target arrangement manner of chips in a target region, where the target region includes a chip setting region and a scribe lane region, and the scribe lane region is used to set scribe lane marks;
a first determining module 204, configured to determine, according to the preset number of street marks, a characteristic parameter of a street mark corresponding to a target arrangement of a chip, where the characteristic parameter of the street mark includes at least one of: the shape of the street sign, and the size of the street sign;
the second determining module 206 is configured to determine, according to the characteristic parameter of the scribe line mark, a position parameter of the scribe line mark that conforms to a preset relationship with the target arrangement manner of the chip, and obtain mark position information corresponding to the target area, where the position parameter of the scribe line mark is used to represent a setting position of the scribe line mark in the scribe line area.
It should be noted that the obtaining module 202, the first determining module 204, and the second determining module 206 correspond to steps S102 to S106 in embodiment 1, and a plurality of modules are the same as the corresponding steps in implementation examples and application scenarios, but are not limited to the disclosure in embodiment 1.
Example 3
Embodiments of the present disclosure may provide a positioning system for a cutting street sign, and fig. 4 is a block diagram illustrating a positioning system for a cutting street sign according to an exemplary embodiment. As shown in fig. 4, the positioning system may include: one or more processors 31 (only one shown), a memory 32 for storing processor-executable instructions; wherein the processor is configured to execute the instructions to implement the above-mentioned method for determining the position of the cutting path mark.
The memory may be used to store software programs and modules, such as program instructions/modules corresponding to the method and apparatus for determining the position of a cutting street sign in the embodiments of the present disclosure, and the processor executes various functional applications and data processing by running the software programs and modules stored in the memory, that is, implements the method for determining the position of a cutting street sign. The memory may include high speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory may further include memory located remotely from the processor, and these remote memories may be connected to the computer terminal through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The processor can call the information and application program stored in the memory through the transmission device to execute the following steps: acquiring a target arrangement mode of chips in a target area, wherein the target area comprises a setting area of the chips and a cutting road area, and the cutting road area is used for setting a cutting road mark; determining the characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the preset number of the cutting path marks, wherein the characteristic parameters of the cutting path marks comprise at least one of the following parameters: the shape of the street sign, and the size of the street sign; and determining the position parameters of the cutting street marks which accord with the preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting street marks to obtain mark position information corresponding to the target area, wherein the position parameters of the cutting street marks are used for representing the setting positions of the cutting street marks in the cutting street area.
Optionally, the processor may further execute the program code of the following steps: the method for acquiring the target arrangement mode of the chips in the target area comprises the following steps: acquiring a preset area of an exposure area in a target area, a preset area of a cutting street area and preset chip information, wherein the preset chip information at least comprises: presetting the types of chips and the size of each preset chip; generating a plurality of candidate arrangement modes of the chips according to the preset area of the exposure area, the preset area of the cutting path area and the preset chip information, wherein the plurality of candidate arrangement modes of the chips are used for arranging a plurality of preset chips in the target area, and the difference among the plurality of candidate arrangement modes of the chips at least has one of the following differences: the number of the exposure areas is different, and the number of the preset chips is different; and determining the target arrangement mode of the chips from the plurality of candidate arrangement modes according to the number of the exposure areas and the number of the preset chips.
Optionally, the processor may further execute the program code of the following steps: determining a target arrangement mode of the chips from a plurality of candidate arrangement modes according to the number of the exposure areas and the number of the preset chips, wherein the method comprises the following steps of: comparing the number of preset chips in the plurality of candidate arrangement modes to obtain a first comparison result; determining the first candidate arrangement mode as a target arrangement mode of the chips under the condition that the first comparison result indicates that the number of preset chips in the first candidate arrangement mode has a maximum value, wherein the plurality of candidate arrangement modes comprise the first candidate arrangement mode; and under the condition that the first comparison result indicates that the number of preset chips in the second candidate arrangement modes has the same maximum value, determining the target arrangement modes of the chips according to the number of exposure areas in the second candidate arrangement modes, wherein the second candidate arrangement modes comprise the second candidate arrangement modes.
Optionally, the processor may further execute the program code of the following steps: determining the target arrangement mode of the chips according to the number of the exposure areas in the plurality of second candidate arrangement modes, wherein the method comprises the following steps: comparing the number of the exposure areas in the plurality of second candidate arrangement modes to obtain a second comparison result; determining a third candidate arrangement mode as a target arrangement mode of the chips under the condition that the second comparison result indicates that the number of the exposure areas in the third candidate arrangement mode has a minimum value, wherein the plurality of second candidate arrangement modes comprise the third candidate arrangement mode; and under the condition that the second comparison result indicates that the number of the exposure areas in the fourth candidate arrangement modes has the same minimum value, determining any one fourth candidate arrangement mode in the fourth candidate arrangement modes as the target arrangement mode of the chips, wherein the second candidate arrangement modes comprise the fourth candidate arrangement modes.
Optionally, the processor may further execute the program code of the following steps: determining the characteristic parameters of the cutting street marks corresponding to the target arrangement mode of the chip according to the number of the preset cutting street marks, wherein the characteristic parameters comprise the following steps: dividing the cutting street area into a plurality of sub-areas which correspond to the cutting street marks one by one according to the number of preset cutting street marks, wherein the areas of the plurality of sub-areas are the same, and the shapes of any two sub-areas in the plurality of sub-areas are the same or different; and determining characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the areas of the plurality of sub-regions, the shapes of the plurality of sub-regions and a preset proportion.
Optionally, the processor may further execute the program code of the following steps: determining characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the areas of the plurality of sub-regions, the shapes of the plurality of sub-regions and a preset proportion, wherein the characteristic parameters comprise: determining the size of a cutting path mark which meets the preset proportion with the area of each sub-region; and acquiring a preset graph corresponding to the shape of each sub-area from the plurality of preset graphs to obtain the shape of the cutting path mark corresponding to each sub-area.
Optionally, the processor may further execute the program code of the following steps: determining the position parameters of the cutting path marks which accord with the preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting path marks, wherein the method comprises the following steps: acquiring a first mark simulation position which accords with a preset relation with a target arrangement mode of a chip from a simulation database, wherein the simulation database comprises: the historical chip arrangement modes comprise a plurality of historical chip arrangement modes and mark simulation positions corresponding to the historical chip arrangement modes, wherein the preset relation is met between each historical chip arrangement mode and the corresponding mark simulation positions; generating mark position information corresponding to the target area according to a preset rule and the first mark simulation position, wherein the preset rule at least comprises the following steps: the minimum distance between the cutting path mark and the side line of the cutting path area is larger than or equal to a preset threshold value, and the cutting path marks are not overlapped.
Optionally, the processor may further execute the program code of the following steps: generating mark position information corresponding to the target area according to a preset rule and the first mark simulation position, wherein the mark position information comprises the following steps: judging whether the mark simulation position meeting the preset relation meets a preset rule or not; under the condition that the judgment result indicates yes, determining a first mark simulation position as mark position information corresponding to the target area; and under the condition that the judgment result indicates no, adjusting the first mark simulation position to a target mark position meeting a preset rule according to the preset rule, and determining the target mark position as mark position information corresponding to the target area.
Optionally, the processor may further execute the program code of the following steps: according to a preset rule, adjusting the first mark simulation position to a target mark position meeting the preset rule, comprising: establishing a coordinate system according to a first arrangement direction and a second arrangement direction of chips in a target area, wherein the chips in the target area are arranged in an array along the first arrangement direction and the second arrangement direction, any point in the target area is a coordinate origin of the coordinate system, the first arrangement direction is an x-axis of the coordinate system, and the second arrangement direction is a y-axis of the coordinate system; determining first coordinate information of a mark simulation position in a coordinate system; acquiring second coordinate information of the chip in the target area in a coordinate system; and generating third coordinate information meeting a preset rule according to the first coordinate information and the second coordinate information, and taking the target mark position as mark position information corresponding to the target area.
Optionally, the processor may further execute the program code of the following steps: acquiring a plurality of historical chip arrangement modes and a mark simulation position corresponding to each historical chip arrangement mode; and establishing a simulation database according to the plurality of historical chip arrangement modes and the mark simulation position corresponding to each historical chip arrangement mode.
Optionally, the processor may further execute the program code of the following steps: in a case where there are a plurality of target areas, obtaining mark position information corresponding to each target area, the position determination method further includes: and establishing a position information database according to the mark position information corresponding to each target area.
Optionally, the processor may further execute the program code of the following steps: acquiring a new target arrangement mode of the chips in the target area; judging whether first mark position information corresponding to the new target area is stored in the position information database or not; and if the judgment result indicates yes, setting the preset cutting track mark in the new target area according to the first mark position information.
Optionally, the processor may further execute the program code of the following steps: under the condition that the judgment result indicates no, obtaining new position information corresponding to the new target area; and storing the newly added position information into a position information database.
Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by a program instructing hardware associated with the terminal device, where the program may be stored in a computer-readable storage medium, and the storage medium may include: flash disks, read-Only memories (ROMs), random Access Memories (RAMs), magnetic or optical disks, and the like.
The above-mentioned serial numbers of the embodiments of the present disclosure are merely for description, and do not represent the advantages or disadvantages of the embodiments.
In the above embodiments of the present disclosure, the description of each embodiment has its own emphasis, and reference may be made to the related description of other embodiments for parts that are not described in detail in a certain embodiment.
In the embodiments provided in the present application, it should be understood that the disclosed technical content can be implemented in other manners. The above-described embodiments of the apparatus are merely illustrative, and for example, a division of a unit is merely a division of a logic function, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, units or modules, and may be in an electrical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a separate product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present disclosure may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present disclosure. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.
The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.
Claims (15)
1. A method for determining a position of a scribe lane mark, comprising:
acquiring a target arrangement mode of chips in a target area, wherein the target area comprises a setting area of the chips and a cutting path area, and the cutting path area is used for setting the cutting path mark;
determining the characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the preset number of the cutting path marks, wherein the characteristic parameters of the cutting path marks comprise at least one of the following parameters: the shape of the cutting line mark and the size of the cutting line mark;
and determining the position parameters of the cutting street marks which accord with a preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting street marks to obtain mark position information corresponding to the target area, wherein the position parameters of the cutting street marks are used for representing the setting positions of the cutting street marks in the cutting street area.
2. The method according to claim 1, wherein the obtaining of the target arrangement of the chips in the target area comprises:
acquiring a preset area of an exposure area in the target area, a preset area of the cutting track area and preset chip information, wherein the preset chip information at least comprises: presetting the type of chips and the size of each preset chip;
generating a plurality of candidate arrangement modes of the chips according to the preset area of the exposure area, the preset area of the cutting track area and the preset chip information, wherein the plurality of candidate arrangement modes of the chips are used for arranging a plurality of preset chips in the target area, and the difference among the plurality of candidate arrangement modes of the chips at least has one of the following differences: the number of the exposure areas is different, and the number of the preset chips is different;
and determining the target arrangement mode of the chips from the plurality of candidate arrangement modes according to the number of the exposure areas and the number of the preset chips.
3. The method according to claim 2, wherein the determining the target arrangement of the chips from the plurality of candidate arrangements according to the number of the exposure areas and the number of the preset chips comprises:
comparing the number of the preset chips in the plurality of candidate arrangement modes to obtain a first comparison result;
determining a first candidate arrangement mode as a target arrangement mode of the chips under the condition that the first comparison result indicates that the number of the preset chips in the first candidate arrangement mode has a maximum value, wherein the plurality of candidate arrangement modes comprise the first candidate arrangement mode;
and under the condition that the first comparison result indicates that the number of the preset chips in a plurality of second candidate arrangement modes has the same maximum value, determining the target arrangement mode of the chips according to the number of the exposure areas in the plurality of second candidate arrangement modes, wherein the plurality of candidate arrangement modes comprise the plurality of second candidate arrangement modes.
4. The method of claim 3, wherein determining the target arrangement of the chips based on the number of the exposure areas in the second candidate arrangements comprises:
comparing the number of the exposure areas in the plurality of second candidate arrangement modes to obtain a second comparison result;
determining a third candidate arrangement mode as a target arrangement mode of the chip under the condition that the second comparison result indicates that the number of the exposure areas in the third candidate arrangement mode has a minimum value, wherein the plurality of second candidate arrangement modes comprise the third candidate arrangement mode;
and under the condition that the second comparison result indicates that the number of the exposure areas in a plurality of fourth candidate arrangement modes has the same minimum value, determining any one fourth candidate arrangement mode in the plurality of fourth candidate arrangement modes as the target arrangement mode of the chip, wherein the plurality of second candidate arrangement modes comprise the plurality of fourth candidate arrangement modes.
5. The method according to claim 1, wherein the determining the characteristic parameters of the scribe lane marks corresponding to the target arrangement of the chip according to the preset number of the scribe lane marks comprises:
dividing the scribe line area into a plurality of sub-areas corresponding to the scribe line marks one by one according to the number of the preset scribe line marks, wherein the areas of the plurality of sub-areas are the same, and the shapes of any two sub-areas in the plurality of sub-areas are the same or different;
and determining characteristic parameters of the cutting path marks corresponding to the target arrangement mode of the chip according to the areas of the plurality of sub-regions, the shapes of the plurality of sub-regions and a preset proportion.
6. The method according to claim 5, wherein the determining the characteristic parameters of the scribe lane marks corresponding to the target arrangement of the chip according to the areas of the sub-regions, the shapes of the sub-regions and a preset ratio comprises:
determining the size of the cutting path mark which meets the preset proportion with the area of each sub-region;
and acquiring a preset graph corresponding to the shape of each sub-region from a plurality of preset graphs to obtain the shape of the cutting path mark corresponding to each sub-region.
7. The method according to any one of claims 1 to 6, wherein the determining the position parameter of the scribe lane mark according to the characteristic parameter of the scribe lane mark, the position parameter of the scribe lane mark having a preset relationship with a target arrangement of the chip, includes:
acquiring a first mark simulation position which accords with a preset relation with a target arrangement mode of the chip from a simulation database, wherein the simulation database comprises: the historical chip arrangement modes comprise a plurality of historical chip arrangement modes and mark simulation positions corresponding to the historical chip arrangement modes, wherein the preset relation is met between each historical chip arrangement mode and the corresponding mark simulation positions;
generating mark position information corresponding to the target area according to a preset rule and the first mark simulation position, wherein the preset rule at least comprises the following steps: the minimum distance between the cutting path mark and the side line of the cutting path area is larger than or equal to a preset threshold value, and the cutting path marks are not overlapped.
8. The method according to claim 7, wherein the generating mark position information corresponding to the target area according to a preset rule and the first mark simulation position includes:
judging whether the mark simulation position meeting the preset relation meets a preset rule or not;
under the condition that the judgment result indicates yes, determining the first mark simulation position as mark position information corresponding to the target area;
and under the condition that the judgment result indicates no, adjusting the first mark simulation position to a target mark position meeting the preset rule, and determining the target mark position as mark position information corresponding to the target area.
9. The method according to claim 8, wherein the adjusting the first marker simulation position to a target marker position satisfying the preset rule according to the preset rule comprises:
establishing a coordinate system according to a first arrangement direction and a second arrangement direction of chips in the target area, wherein the chips in the target area are arranged in an array along the first arrangement direction and the second arrangement direction, any point in the target area is a coordinate origin of the coordinate system, the first arrangement direction is an x-axis of the coordinate system, and the second arrangement direction is a y-axis of the coordinate system;
determining first coordinate information of the mark simulation position in the coordinate system;
acquiring second coordinate information of the chip in the target area in the coordinate system;
and generating third coordinate information meeting the preset rule according to the first coordinate information and the second coordinate information, and taking the target mark position as mark position information corresponding to the target area.
10. The position determination method according to claim 7, characterized by further comprising:
acquiring a plurality of historical chip arrangement modes and a mark simulation position corresponding to each historical chip arrangement mode;
and establishing the simulation database according to the plurality of historical chip arrangement modes and the mark simulation position corresponding to each historical chip arrangement mode.
11. The position determination method according to claim 7, wherein when there are a plurality of the target areas, marker position information corresponding to each of the target areas is obtained, the position determination method further comprising:
and establishing a position information database according to the mark position information corresponding to each target area.
12. The position determination method according to claim 11, characterized by further comprising:
acquiring a new target arrangement mode of the chips in the target area;
judging whether first mark position information corresponding to the new target area is stored in the position information database or not;
and if the judgment result indicates yes, setting preset cutting track marks in the new target area according to the first mark position information.
13. The position determination method according to claim 12, characterized by further comprising:
under the condition that the judgment result indicates no, obtaining newly added position information corresponding to the new target area;
and storing the newly added position information into the position information database.
14. A position determining apparatus for a cutting street marker, comprising:
an obtaining module, configured to obtain a target arrangement manner of chips in a target area, where the target area includes a setting area of the chips and a scribe lane area, and the scribe lane area is used to set the scribe lane marks;
a first determining module, configured to determine, according to a preset number of street marks, a feature parameter of a street mark corresponding to a target arrangement of the chip, where the feature parameter of the street mark includes at least one of: the shape of the cutting line mark and the size of the cutting line mark;
and the second determining module is used for determining the position parameters of the cutting street marks which accord with a preset relation with the target arrangement mode of the chip according to the characteristic parameters of the cutting street marks to obtain mark position information corresponding to the target area, wherein the position parameters of the cutting street marks are used for representing the setting positions of the cutting street marks in the cutting street area.
15. A system for locating a cutting street marker, comprising:
a processor;
a memory for storing the processor-executable instructions;
wherein the processor is configured to execute the instructions to implement the method of determining the position of a cutting street marking according to any one of claims 1 to 13.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117631437A (en) * | 2024-01-25 | 2024-03-01 | 合肥晶合集成电路股份有限公司 | Mask structure and method for placing alignment marks of semiconductor wafer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117631437A (en) * | 2024-01-25 | 2024-03-01 | 合肥晶合集成电路股份有限公司 | Mask structure and method for placing alignment marks of semiconductor wafer |
| CN117631437B (en) * | 2024-01-25 | 2024-05-07 | 合肥晶合集成电路股份有限公司 | Method for placing alignment marks of semiconductor wafer |
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