CN115537899A - Electroplating equipment - Google Patents

Electroplating equipment Download PDF

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Publication number
CN115537899A
CN115537899A CN202211367419.1A CN202211367419A CN115537899A CN 115537899 A CN115537899 A CN 115537899A CN 202211367419 A CN202211367419 A CN 202211367419A CN 115537899 A CN115537899 A CN 115537899A
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CN
China
Prior art keywords
block
electroplating
sliding
pipe
seat
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Withdrawn
Application number
CN202211367419.1A
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Chinese (zh)
Inventor
王五科
谭宏干
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Shenzhen Shilun Hardware & Electronics Co ltd
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Shenzhen Shilun Hardware & Electronics Co ltd
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Priority to CN202211367419.1A priority Critical patent/CN115537899A/en
Publication of CN115537899A publication Critical patent/CN115537899A/en
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present application relates to an electroplating apparatus, comprising a frame; the electroplating reaction tanks are arranged on the frame and are distributed along the circumferential direction; the cleaning pool is arranged on the rack and is positioned at the circle center of the area surrounded by the electroplating reaction pools; the fixing clamp is arranged on the rack and used for fixing anode metal; the movable clamp is detachably connected with the fixed clamp and is used for fixing cathode metal; the XYZ three-axis sliding table is arranged on the rack and is positioned above the electroplating reaction tank; the clamping manipulator is connected with the XYZ three-axis sliding table; and the direct current power supply is arranged on the fixing clamp and is used for being electrically connected with the anode metal, and the direct current power supply is used for being detachably and electrically connected with the cathode metal. The electroplating device has the effects of reducing the manufacturing cost of the electroplating device and improving the service performance of the electroplating device.

Description

Electroplating equipment
Technical Field
The application relates to the technical field of metal surface treatment equipment, in particular to electroplating equipment.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, increasing attractiveness and the like.
In the related technology, the electroplating equipment comprises a rack, electroplating reaction boxes, a cleaning box, a fixed clamp, a movable clamp and a manipulator, wherein electroplating liquid is contained in the electroplating reaction boxes, a plurality of electroplating reaction boxes are distributed along a straight line, and the components of the electroplating liquid in the electroplating reaction boxes are different; cleaning fluid is contained in the cleaning box, and the cleaning box is arranged between two adjacent electroplating reaction boxes; the fixing clamps are fixedly arranged on the rack, a plurality of fixing clamps are arranged corresponding to the electroplating reaction boxes, the fixing clamps are provided with direct-current power supplies, and the fixing clamps are used for clamping anode metal; the movable clamp is used for clamping cathode metal and detachably connected with the fixed clamp, and when the movable clamp is connected with the fixed clamp, the direct-current power supply is connected with the cathode metal; the manipulator is arranged on the rack and used for transferring the movable clamp to different fixed clamps, so that the cathode metal can be electroplated for multiple times.
Aiming at the related technologies, the defects that the moving stroke of cathode metal between different electroplating reaction tanks is long, and the cathode metal is easy to splash the residual electroplating solution into the adjacent electroplating reaction tanks in the transfer process due to the fact that the electroplating reaction tanks are linearly distributed exist, so that the manufacturing cost of electroplating equipment is high, and the use performance is poor are caused.
Disclosure of Invention
In order to reduce the manufacturing cost of electroplating equipment and promote electroplating equipment's performance, this application provides an electroplating equipment.
The application provides an electroplating device adopts following technical scheme:
an electroplating apparatus, comprising:
a frame;
a plurality of electroplating reaction tanks are arranged on the frame and distributed along the circumferential direction;
the cleaning pool is arranged on the rack and is positioned at the circle center of the area surrounded by the electroplating reaction pools;
the fixing clamp is arranged on the rack and used for fixing anode metal;
the movable clamp is detachably connected with the fixed clamp and is used for fixing cathode metal;
the XYZ three-axis sliding table is arranged on the rack and positioned above the electroplating reaction tank;
the clamping manipulator is connected with the XYZ three-axis sliding table;
and the direct current power supply is arranged on the fixing clamp, is used for being electrically connected with the anode metal and is used for being detachably and electrically connected with the cathode metal.
By adopting the technical scheme, after the cathode metal finishes one-time electroplating work, the clamping manipulator is moved to the position of the movable clamp through the XYZ three-axis sliding table, then the clamping manipulator takes the movable clamp, meanwhile, the fixed clamp is disconnected with the movable clamp, then the movable clamp is moved to the cleaning pool through the XYZ three-axis sliding table to wash away residual electroplating solution on the cathode metal, finally, the movable clamp is moved to the upper part of the next electroplating reaction pool, and meanwhile, the movable clamp is fixedly connected with the fixed clamp, so that the aim of electroplating the cathode metal for multiple times can be fulfilled.
Preferably, the fixing clamp comprises a fixing seat, a first three-jaw chuck and a positive conductive block, and the fixing seat is fixedly connected with the rack; the first three-jaw chuck is fixedly connected with the fixed seat and is used for clamping a workpiece in a cylindrical shape; the positive conductive block is arranged on the fixed seat and electrically connected with the direct-current power supply, and the positive conductive block is used for being abutted against the anode metal.
Through adopting above-mentioned technical scheme, when changing the positive pole metal on the mounting fixture, do not let DC power supply start earlier, unblock first three-jaw chuck after that, put into the axle center position department of first three-jaw chuck with positive pole metal simultaneously, and make positive pole metal and anodal conducting block butt, then fix positive pole metal on the fixing base through first three-jaw chuck, thereby can change positive pole metal, also can realize the detachable electricity intercommunication between positive pole metal and the DC power supply.
Preferably, the fixed seat is provided with an electromagnet and a negative electrode conductive output block, the electromagnet is connected to the fixed seat, and the electromagnet is used for being connected with the movable clamp; the negative electrode conductive output block is connected to the surface of one side, where the electromagnet is located, of the fixing seat, the negative electrode conductive output block is electrically connected with the direct-current power supply, and the negative electrode conductive output block is used for being abutted to the movable clamp.
Through adopting above-mentioned technical scheme, because of the electro-magnet and the setting of the electrically conductive output piece of negative pole, then can realize for contact releasable connection between mounting fixture and the activity anchor clamps, also can realize being connected for the contact electricity between mounting fixture and the activity anchor clamps, then when mounting fixture is connected with the activity anchor clamps, can also realize the electricity intercommunication between DC power supply and the cathode metal to make the joint construction between anode metal and the cathode metal more succinct.
Preferably, the movable clamp comprises a connecting seat, a second three-jaw chuck, a negative conductive introduction block and a negative conductive connecting block, the connecting seat is connected with the clamping manipulator, and the connecting seat is connected with the electromagnet in a magnetic attraction manner; the second three-jaw chuck is connected to the connecting seat and is used for clamping a cylindrical workpiece; the negative conductive lead-in block is connected to the connecting seat and can be abutted with the negative conductive output block; the negative electrode conductive connecting block is arranged on the connecting seat and is electrically connected with the negative electrode conductive leading-in block, and the negative electrode conductive connecting block is used for being abutted against the cathode metal.
By adopting the technical scheme, on one hand, when the connecting seat is adsorbed on the fixing seat by the electromagnet, the negative conductive leading-in block can be abutted against the negative conductive output block, so that the purpose of leading the current of the direct current power supply into the movable clamp is realized; on the other hand, after the cathode metal passes through the second three-jaw chuck to be fixed on the connecting seat, the cathode metal can be with the electrically conductive connecting block butt of negative pole to can change the cathode metal, also can realize the detachable electricity intercommunication between cathode metal and the DC power supply.
Preferably, the connecting seat comprises a mounting part, a sliding part and an abutting spring, the mounting part is provided with a connecting sliding hole, and the inner wall of the connecting sliding hole is provided with a negative electrode conductive communicating block; the sliding part is connected in the connecting sliding hole in a sliding mode, the second three-jaw chuck and the negative conductive connecting block are arranged on the sliding part, and the negative conductive connecting block is in sliding abutting joint with the negative conductive communicating block; one end of the abutting spring abuts against the inner wall of the connecting sliding hole, and the other end of the abutting spring is connected with the sliding part; and a stirring telescopic cylinder is arranged on the rack, the telescopic direction of a piston rod of the stirring telescopic cylinder is parallel to the motion direction of the sliding part, and the piston rod of the stirring telescopic cylinder is abutted against the sliding part so as to enable the sliding part to reciprocate.
Through adopting above-mentioned technical scheme, on the one hand, fix the back on the fixing base at the connecting seat, can be under the effect of stirring telescoping cylinder and butt spring, make the piston rod that the sliding part can follow the stirring telescoping cylinder do reciprocal linear motion, then can enough stir the plating solution, with the quality that promotes electroplating work, the number of times that also can pass through the sliding part reciprocating motion changes the operating time of cathode metal at the electroplating reaction tank, thereby can accomplish the electroplating work of different grade type with higher quality, on the other hand, because of the setting of the electrically conductive intercommunication piece of negative pole, so reciprocating motion's in-process is done at the sliding part, the electrically conductive piece of introducing of negative pole, can keep the electricity always connecting between electrically conductive intercommunication piece of negative pole and the electrically conductive connecting block three of negative pole, then at the in-process that the stirring was removed to cathode metal, electroplating work is difficult for taking place to be interrupted, thereby can accomplish electroplating work high-efficiently.
Preferably, the clamping manipulator comprises a mounting seat, a rotating pipe, a clamping jaw cylinder, an air guide pipe and a rotary joint, and the mounting seat is connected with the XYZ three-axis sliding table; the rotating pipe is rotatably arranged on the mounting seat in a penetrating way through a bearing; the clamping jaw air cylinder is fixedly connected with one end face of the rotating pipe and is used for clamping the movable clamp; the air guide pipe penetrates through the inner ring of the rotating pipe, one end of the air guide pipe is communicated with the clamping jaw cylinder, and the other end of the air guide pipe penetrates out of one end of the rotating pipe, which is far away from the clamping jaw cylinder; the rotary joint is connected to one end, far away from the clamping jaw cylinder, of the air duct, and a movable part on the rotary joint is communicated and connected with the air duct; and the polishing wheel assembly is arranged on the frame and is positioned between the electroplating reaction tank and the cleaning tank, and after the polishing wheel assembly is abutted against the cathode metal, the movable clamp can rotate around the axis of the rotating pipe.
Through adopting above-mentioned technical scheme, on the one hand, when needs centre gripping activity anchor clamps, can move the position department at activity anchor clamps place with the clamping jaw cylinder through XYZ triaxial slip table earlier, grasp activity anchor clamps through the clamping jaw cylinder again, thereby just realize being connected between centre gripping manipulator and the activity anchor clamps, on the other hand, because of the setting of rotating tube, air duct and rotary joint, the clamping jaw cylinder can wholly revolve the axis of rotating tube and rotate, then before the negative pole metal leaves the washing pond and prepares to get into next electroplating reaction tank, can carry out polishing treatment to the negative pole metal through the polishing wheel subassembly, thereby can make the week side surface of negative pole metal more smooth before the negative pole metal carries out next electroplating reaction, and then help promoting the operating mass of many times electroplating, in addition in this in-process negative pole metal also can rotate around self axis, then can spin-dry remaining washing liquid on the negative pole metal.
Preferably, the polishing wheel assembly comprises:
the lifting cylinder is arranged on the rack;
the mounting pipe is connected with a piston rod of the lifting cylinder, and the cleaning pool is positioned on the inner side of the mounting pipe;
one end of the polishing pipe is rotatably connected to the inner wall of the upper end of the mounting pipe through a bearing, the other end of the polishing pipe is positioned outside the mounting pipe, and the inner wall of the polishing pipe is used for being abutted to the cathode metal;
the driving motor is arranged on the upper end surface of the mounting pipe;
the driving gear is fixedly connected with an output shaft of the driving motor;
the driven gear is sleeved on the outer wall of the installation pipe, and the polishing pipe is located on the outer wall of the installation pipe, and the driven gear is meshed with the driving gear.
By adopting the technical scheme, after the cathode metal leaves from the cleaning pool, the mounting pipe and the polishing pipe can be lifted for a preset distance by the lifting cylinder, then the cathode metal is abutted against the inner wall of the upper end of the polishing pipe by the XYZ three-axis sliding table, then the polishing pipe rotates around the axis of the polishing pipe under the matching of the driving motor, the driving gear and the driven gear, then the circumferential side surface of the cathode metal can be polished, and in addition, the abrasive paper arranged on the inner wall of the polishing pipe can select the abrasive paper with water absorption performance, so that the cathode metal can be dried in the polishing process.
Preferably, the electroplating reaction tank comprises a working part, a circulating part and a circulating pipeline, wherein the working part is used for soaking anode metal and cathode metal, an overflow port is arranged on the inner wall of the working part close to the opening of the working part, and the overflow port is positioned on the extension line of the sliding path of the sliding part; the circulating part is used for soaking the working part, and the liquid level in the circulating part is lower than that in the working part; one end of the circulating pipeline is communicated with the circulating part in a filtering way, and the other end of the circulating pipeline is communicated with the working part.
Through adopting above-mentioned technical scheme, because of the surface of plating solution can float there is impurity in electroplating process, so overflow mouth and overflow mouth's position sets up, then at sliding part reciprocating motion's in-process, the floating impurity in plating solution surface can be followed the overflow mouth and discharged into the circulation portion, thereby can keep the clean of plating solution in the work portion, help promoting the electroplating quality, in addition at the in-process of work portion work, the circulating line can pour into clean plating solution into the work portion again, in order to keep the liquid level of plating solution in the work portion to be higher than the lower side edge of overflow mouth all the time.
Preferably, the cleaning pool comprises a soaking part, a water outlet pipeline and a water inlet pipeline, wherein the soaking part is used for soaking and cleaning the cathode metal; one end of the water outlet pipeline is communicated with the soaking part, and the water outlet pipeline is used for discharging the liquid in the soaking part to the outside; one end of the water inlet pipeline is communicated with the soaking part, the communication position of the water inlet pipeline is higher than the liquid level in the soaking part, and the water inlet pipeline is used for guiding clean cleaning liquid into the soaking part.
Through adopting above-mentioned technical scheme, when the cathodic metal was placed and is washd in the soak, remaining plating solution just can be sneaked into the washing liquid of soak on the cathodic metal, simultaneously at this in-process, outlet conduit can arrange the liquid in the soak to the outside, simultaneously the inlet channel is again with clean washing liquid leading-in soak in, thereby make the washing liquid in the soak can keep certain clean degree, simultaneously at this in-process, the washing liquid in the soak is in the circulation flow state always, so when soaking cathodic metal in the soak, cathodic metal can be washd more totally.
In summary, the present application includes at least one of the following beneficial technical effects:
1. through the mode that a plurality of electroplating reaction tanks are distributed in a circumferential manner, on one hand, the stroke of cathode metal among different electroplating reaction tanks can be shortened, so that the device cost for moving the movable clamp can be reduced, and the manufacturing cost of electroplating equipment can be reduced;
2. through the setting that centre gripping manipulator self can rotation and polishing subassembly, then leave at the cathode metal and wash the pond and prepare before will getting into next electroplating reaction pond, can polish the processing through polishing wheel subassembly to cathode metal to can make cathode metal's week side surface more smooth before cathode metal carries out the next electroplating reaction, and then help promoting the operating mass with earth of many times electroplating.
Drawings
FIG. 1 is a schematic view of an electroplating apparatus in an embodiment of the present application.
Fig. 2 is a schematic view of a fixing jig in the embodiment of the present application.
Fig. 3 is a schematic view of a movable clamp in an embodiment of the present application.
FIG. 4 is a schematic view of a polishing wheel assembly in an embodiment of the present application.
Description of reference numerals: 1. a frame; 11. a stirring telescopic cylinder; 2. electroplating a reaction tank; 21. a working part; 211. an overflow port; 22. a circulating part; 23. a circulation pipe; 3. a cleaning tank; 31. a soaking part; 32. a water outlet pipeline; 33. a water inlet pipe; 4. fixing the clamp; 41. a fixed seat; 42. a first three-jaw chuck; 43. a positive electrode conductive block; 44. an electromagnet; 45. a negative conductive output block; 5. a movable clamp; 51. a connecting seat; 511. an installation part; 512. a sliding part; 513. an abutment spring; 52. a second three-jaw chuck; 53. a negative conductive lead-in block; 54. a negative conductive connecting block; 55. a connecting slide hole; 56. a negative conductive communicating block; 6. an XYZ three-axis sliding table; 7. clamping the manipulator; 71. a mounting seat; 72. rotating the tube; 73. a clamping jaw cylinder; 74. an air duct; 75. a rotary joint; 8. a direct current power supply; 9. a polishing wheel assembly; 91. a lifting cylinder; 92. installing a pipe; 93. polishing the light pipe; 94. a drive motor; 95. a driving gear; 96. a driven gear.
Detailed Description
The present application is described in further detail below with reference to figures 1-4.
The embodiment of the application discloses electroplating equipment. Referring to fig. 1 and 2, the electroplating apparatus includes a frame 1, an electroplating reaction tank 2, a cleaning tank 3, a fixing clamp 4, a movable clamp 5, an XYZ three-axis sliding table 6, a clamping manipulator 7 and a dc power supply 8, specifically, the electroplating reaction tank 2 is horizontally arranged on the frame 1, and a plurality of electroplating reaction tanks 2 are arranged in a manner of circumferential distribution; the cleaning pool 3 is also horizontally arranged on the frame 1, and the cleaning pool 3 is positioned at the circle center position of the area surrounded by the electroplating reaction pools 2; the fixed clamps 4 are fixedly arranged on the frame 1, a plurality of fixed clamps 4 are arranged corresponding to the electroplating reaction tank 2, and the fixed clamps 4 are clamped with anode metal in a cylindrical shape; the number of the movable clamp 5 is one, wherein the movable clamp 5 is detachably connected with the fixed clamp 4, and the cathode metal in a cylindrical shape is clamped on the movable clamp 5.
Referring to fig. 1 and 2, an XYZ three-axis slide table 6 is provided on a frame 1, and the XYZ three-axis slide table 6 is located above an electroplating reaction tank 2; the clamping manipulator 7 is connected with the XYZ three-axis sliding table 6, the clamping manipulator 7 can move in the X direction, the Y direction and the Z direction under the action of the XYZ three-axis sliding table 6, and the clamping manipulator 7 is used for clamping the movable clamp 5; the direct current power supply 8 is arranged on the fixed clamp 4, wherein when the anode metal is fixed on the fixed clamp 4, the anode of the direct current power supply 8 is electrically connected with the anode metal, and meanwhile, the direct current power supply 8 is electrically connected with the cathode metal in a separable manner, so that after the movable clamp 5 is fixed on the fixed clamp 4, the cathode metal can be electrically connected with the cathode of the direct current power supply 8.
Referring to fig. 1, in the embodiment, because the plurality of electroplating reaction cells 2 are circumferentially distributed, when the cathode metal moves between the upper sides of different electroplating reaction cells 2, the cathode metal can move to the inner side of the area surrounded by the plurality of electroplating reaction cells 2 first, and then move to the upper side of the corresponding electroplating reaction cell 2, on one hand, the stroke of the cathode metal between different electroplating reaction cells 2 can be shortened, so that the device cost for moving the movable clamp 5 can be reduced, thereby reducing the manufacturing cost of the electroplating equipment, on the other hand, the electroplating solution carried on the cathode metal is not easy to splash into the adjacent electroplating reaction cells 2, thereby reducing the adverse effect on the electroplating reaction cells 2 and being beneficial to improving the service performance of the electroplating equipment.
Referring to fig. 1 and 2, the fixing clamp 4 includes a fixing seat 41, a first three-jaw chuck 42, and a positive conductive block 43, the fixing seat 41 is fixedly connected to the frame 1, and the fixing seat 41 is used for installing the dc power supply 8; the first three-jaw chuck 42 is fixedly installed on the lower surface of the fixed seat 41, and the anode metal is clamped by the first three-jaw chuck 42; the positive conductive block 43 is fixedly connected to the lower surface of the fixed base 41, wherein the positive conductive block 43 is located at the axial center position of the first three-jaw chuck 42, the positive conductive block 43 is connected to the positive electrode of the dc power supply 8, and the positive conductive block 43 is abutted to the anode metal after the anode metal is clamped by the first three-jaw chuck 42.
Referring to fig. 1 and 2, in order to connect the cathode metal to the negative electrode of the dc power supply 8 after the movable clamp 5 is connected to the fixed clamp 4, there are a first arrangement in which an electromagnet 44 and a negative electrode conductive output block 45 are disposed on the fixed seat 41, specifically, the electromagnet 44 is disposed on one side surface of the fixed seat 41, and the electromagnet 44 is used for adsorbing the movable clamp 5; the negative conductive output block 45 is fixedly connected to one side surface of the fixing base 41, the negative conductive output block 45 and the electromagnet 44 are located on the same surface of the fixing base 41, and the negative conductive output block 45 is connected to the negative electrode of the dc power supply 8 to serve as a structural foundation for connecting the fixing clamp 4 as a cathode metal with the dc power supply 8.
Referring to fig. 2 and 3, the movable clamp 5 includes a connecting seat 51, a second three-jaw chuck 52, a negative conductive lead-in block 53 and a negative conductive connecting block 54, specifically, two insertion holes are spaced on the upper surface of the connecting seat 51, and the two insertion holes are used for inserting a claw part on the clamping manipulator 7, so that the clamping manipulator 7 can take the movable clamp 5, and meanwhile, the connecting seat 51 is magnetically connected with the electromagnet 44; the second three-jaw chuck 52 is fixedly coupled to a lower surface of the coupling holder 51, and the second three-jaw chuck 52 holds cathode metal in a cylindrical shape; the negative conductive lead-in block 53 is fixedly connected to the connecting seat 51, and after the connecting seat 51 is fixedly connected with the fixed seat 41, the negative conductive lead-in block 53 is abutted against the negative conductive output block 45, so that the current can be transmitted to the movable clamp 5; the negative conductive connecting block 54 is disposed on the lower surface of the connecting base 51, the negative conductive connecting block 54 is located at the axial position of the second three-jaw chuck 52, and after the cathode metal is clamped by the second three-jaw chuck 52, the cathode metal is abutted against the negative conductive connecting block 54, so that the purpose of connecting the cathode metal with the negative electrode of the dc power supply 8 is achieved.
Referring to fig. 2 and 3, in the present embodiment, in order to improve the quality of the electroplating operation, there are corresponding arrangements, in which, firstly, the connection socket 51 further includes a mounting portion 511, a sliding portion 512 and an abutting spring 513, specifically, the mounting portion 511 is connected with the electromagnet 44, so that the insertion hole and the negative conductive introduction block 53 are both disposed on the mounting portion 511, meanwhile, the upper surface of the mounting portion 511 is further provided with a connecting sliding hole 55 in a kidney-round shape, and the inner wall of the connecting sliding hole 55 is provided with a negative conductive communicating block 56, and the negative conductive communicating blocks 56 are disposed along the length direction of the connecting sliding hole 55; the sliding part 512 is slidably connected in the connecting sliding hole 55, meanwhile, the lower surface of the sliding part 512 is provided for the second three-jaw chuck 52 to be arranged, one end of the negative conductive connecting block 54 penetrates out from the lower surface of the sliding part 512, and the other end penetrates out from the side surface of the sliding part 512 so as to be capable of slidably abutting against the negative conductive communicating block 56, so that the cathode metal can still keep the electrical communication with the direct current power supply 8 in the moving process of the sliding part 512;
referring to fig. 2 and 3, one end of the contact spring 513 is fixedly connected to the inner wall of one end of the connection slide hole 55 in the longitudinal direction, and the other end is connected to the sliding portion 512; secondly, a stirring telescopic cylinder 11 is arranged on the rack 1, the structural form of the stirring telescopic cylinder 11 is an electric cylinder, and the stirring telescopic cylinder 11 is provided with a plurality of stirring telescopic cylinders corresponding to the electroplating reaction tank 2, wherein after the movable clamp 5 is connected with the fixed clamp 4, the stretching direction of a piston rod of the stirring telescopic cylinder 11 is parallel to the motion direction of the sliding part 512, and the piston rod of the stirring telescopic cylinder 11 can be always abutted against the sliding part 512 under the action of the abutting spring 513, so that the sliding part 512 can be in reciprocating linear motion through the stirring telescopic cylinder 11, and the cathode metal can stir the electroplating solution in the moving process, thereby being beneficial to improving the processing quality after electroplating.
Referring to fig. 1 and 3, the clamping robot 7 includes a mounting base 71, a rotating tube 72, a jaw cylinder 73, an air duct 74, and a rotary joint 75, the mounting base 71 being connected to the XYZ three-axis slide table 6 so that the mounting base 71 can move in the X direction, the Y direction, and the Z direction; the rotating pipe 72 is rotatably arranged on the mounting seat 71 through a bearing in a penetrating way, and the rotating pipe 72 is coaxially arranged with the cathode metal on the movable clamp 5; the shell of the clamping jaw cylinder 73 is fixedly connected to the lower end face of the rotating pipe 72, and the two clamping jaws of the clamping jaw cylinder 73 can be inserted into the two insertion holes respectively; the air duct 74 penetrates through the inner ring of the rotating pipe 72, one end of the air duct 74 is communicated with the clamping jaw air cylinder 73, and the other end of the air duct 74 penetrates out of one end of the rotating pipe 72, which is far away from the clamping air cylinder; the rotary joint 75 is connected with one end of the air duct 74 far away from the clamping jaw air cylinder 73, the movable part of the rotary joint 75 is communicated with the air duct 74, the fixed part of the rotary joint 75 is connected with the air pump through a pipeline, so that the clamping jaw air cylinder 73 can still be communicated with the external air pump during the rotation of the clamping jaw air cylinder 73 around the axis of the rotation pipe 72, and the normal work of the clamping jaw air cylinder 73 is kept.
Referring to fig. 1 and 4, a polishing wheel assembly 9 is arranged between an electroplating reaction tank 2 and a cleaning tank 3 of a rack 1, specifically, the polishing wheel assembly 9 includes a lifting cylinder 91, an installation pipe 92, a polishing pipe 93, a driving motor 94, a driving gear 95 and a driven gear 96, the lifting cylinder 91 is fixedly arranged on the rack 1, and a piston rod of the lifting cylinder 91 extends and retracts in a vertical direction; the mounting tube 92 is fixedly connected with the piston rod of the lifting cylinder 91, and the washing tank 3 is located in the inner area of the mounting tube 92; one end of the polishing tube 93 is rotatably connected to the inner wall of the upper end of the mounting tube 92 through a bearing, the other end of the polishing tube 93 is positioned outside the mounting tube 92, and meanwhile, the inner wall of the upper end of the polishing tube 93 is also abutted to the cathode metal so as to polish the cathode metal; the driving motor 94 is fixedly installed on the upper end surface of the installation tube 92, and the output shaft of the driving motor 94 faces upward; the driving gear 95 is fixedly connected to an output shaft of the driving motor 94, and the driving gear 95 is in a straight gear structure; the driven gear 96 is fixedly sleeved on the outer wall of the upper end of the polishing tube 93, and the driven gear 96 is meshed with the driving gear 95, so that the driving motor 94 can drive the polishing tube 93 to rotate around the axis of the driving motor.
Referring to fig. 1 and 4, in this embodiment, after the cathode metal leaves from the cleaning bath 3, the mounting tube 92 and the polishing tube 93 can be raised by the lifting cylinder 91 for a predetermined distance, then the cathode metal abuts against the inner wall of the upper end of the polishing tube 93 by the XYZ three-axis sliding table 6, and then the polishing tube 93 is rotated around its own axis by the cooperation of the driving motor 94, the driving gear 95 and the driven gear 96, so that the circumferential side surface of the cathode metal can be polished, and the sand paper selected for the inner wall of the polishing tube 93 can be selected from the sand paper with water absorption property, thereby contributing to the improvement of the cleanliness of the polished cathode metal surface.
Referring to fig. 1 and 2, each electroplating reaction tank 2 comprises a working part 21, a circulating part 22 and a circulating pipeline 23, the working part 21 is also in the shape of a rectangular parallelepiped tank, the working part 21 is soaked by anode metal and cathode metal, two overflow ports 211 are respectively arranged on two inner walls of the working part 21 opposite to the opening of the working part, and the two overflow ports 211 are both positioned on the extension line of the motion path of the sliding part 512, so that impurities floating on the liquid level of the electroplating solution can be gradually introduced to the overflow ports 211 in the process of reciprocating movement of the cathode metal, and then leave the working part 21 from the overflow ports 211; the circulating part 22 is also in the shape of a rectangular parallelepiped pool, the working part 21 is soaked by the circulating part 22, and the liquid level in the circulating part 22 is lower than that in the working part 21, so that the liquid flowing out of the overflow port 211 falls into the circulating part 22; the circulation pipe 23 is made of a pipe, a water pump, a filter, and the like, wherein one end of the circulation pipe 23 is connected to the circulation part 22, the impurities in the circulation part 22 cannot flow into the circulation pipe 23, and the other end of the circulation pipe 23 is connected to the working part 21 to replenish the plating solution into the working part 21.
Referring to fig. 1 and 4, each cleaning pool 3 comprises a soaking part 31, a water outlet pipeline 32 and a water inlet pipeline 33, the soaking part 31 is in the shape of a rectangular parallelepiped pool, clean water is contained in the soaking part 31, and the soaking part 31 is used for cleaning cathode metal; one end of the water outlet pipe 32 is communicated with the lower end of the soaking part 31, and the water outlet pipe 32 is used for discharging the liquid in the soaking part 31 to external equipment; one end of the water inlet pipe 33 is communicated with the upper end of the soaking part 31, and the communication position is higher than the liquid level of the soaking part 31, and the water inlet pipe 33 is used for guiding clean water into the soaking part 31, so that the cleaning liquid in the soaking part 31 can be kept at a certain degree of cleanness.
The implementation principle of the electroplating equipment in the embodiment of the application is as follows: after the cathode metal finishes one electroplating work, firstly, the clamping manipulator 7 is moved to the position of the movable clamp 5 through the XYZ three-axis sliding table 6, then the clamping manipulator 7 takes the movable clamp 5, meanwhile, the fixed clamp 4 is disconnected with the movable clamp 5, then the movable clamp 5 is moved to the cleaning pool 3 through the XYZ three-axis sliding table 6 to wash away residual electroplating solution on the cathode metal, and finally, the movable clamp 5 is moved to the upper part of the next electroplating reaction pool 2, and meanwhile, the movable clamp 5 is fixedly connected with the fixed clamp 4, so that the purpose of electroplating the cathode metal for multiple times can be realized.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (9)

1. An electroplating apparatus, characterized in that: the method comprises the following steps:
a frame (1);
the electroplating reaction tanks (2) are arranged on the rack (1), and a plurality of electroplating reaction tanks (2) are distributed along the circumferential direction;
the cleaning pool (3) is arranged on the rack (1), and the cleaning pool (3) is positioned at the circle center position of the area surrounded by the electroplating reaction pools (2);
the fixing clamp (4) is arranged on the rack (1), and the fixing clamp (4) is used for fixing anode metal;
the movable clamp (5) is detachably connected with the fixed clamp (4), and the movable clamp (5) is used for fixing cathode metal;
the XYZ three-axis sliding table (6) is arranged on the rack (1), and the XYZ three-axis sliding table (6) is positioned above the electroplating reaction tank (2);
the clamping manipulator (7) is connected with the XYZ three-axis sliding table (6);
and the direct current power supply (8) is arranged on the fixing clamp (4), the direct current power supply (8) is used for being electrically connected with the anode metal, and the direct current power supply (8) is used for being electrically connected with the cathode metal in a separable mode.
2. The plating apparatus as recited in claim 1, wherein: the fixing clamp (4) comprises a fixing seat (41), a first three-jaw chuck (42) and a positive conductive block (43), and the fixing seat (41) is fixedly connected with the rack (1); the first three-jaw chuck (42) is fixedly connected with the fixed seat (41), and the first three-jaw chuck (42) is used for clamping a workpiece in a cylindrical shape; the positive conductive block (43) is arranged on the fixed seat (41), the positive conductive block (43) is electrically connected with the direct current power supply (8), and the positive conductive block (43) is used for being abutted to the anode metal.
3. The plating apparatus as recited in claim 2, wherein: an electromagnet (44) and a negative electrode conductive output block (45) are arranged on the fixed seat (41), the electromagnet (44) is connected to the fixed seat (41), and the electromagnet (44) is used for being connected with the movable clamp (5); the negative electrode conductive output block (45) is connected to the surface of one side, where the electromagnet (44) is located, of the fixed seat (41), the negative electrode conductive output block (45) is electrically connected with the direct-current power supply (8), and the negative electrode conductive output block (45) is used for being abutted to the movable clamp (5).
4. The plating apparatus as recited in claim 3, wherein: the movable clamp (5) comprises a connecting seat (51), a second three-jaw chuck (52), a negative conductive introduction block (53) and a negative conductive connecting block (54), the connecting seat (51) is used for connecting the clamping manipulator (7), and the connecting seat (51) is connected with the electromagnet (44) in a magnetic attraction manner; the second three-jaw chuck (52) is connected to the connecting seat (51), and the second three-jaw chuck (52) is used for clamping a workpiece in a cylindrical shape; the negative conductive introduction block (53) is connected to the connecting seat (51), and the negative conductive introduction block (53) can be abutted against the negative conductive output block (45); the negative electrode conductive connecting block (54) is arranged on the connecting seat (51), the negative electrode conductive connecting block (54) is electrically connected with the negative electrode conductive leading-in block (53), and the negative electrode conductive connecting block (54) is used for being abutted to the cathode metal.
5. The plating apparatus as recited in claim 4, wherein: the connecting seat (51) comprises a mounting part (511), a sliding part (512) and an abutting spring (513), wherein a connecting sliding hole (55) is formed in the mounting part (511), and a negative electrode conductive communicating block (56) is arranged on the inner wall of the connecting sliding hole (55); the sliding part (512) is connected in the connecting sliding hole (55) in a sliding manner, the second three-jaw chuck (52) and the negative conductive connecting block (54) are arranged on the sliding part (512), and the negative conductive connecting block (54) is in sliding contact with the negative conductive communicating block (56); one end of the abutting spring (513) abuts against the inner wall of the connecting sliding hole (55), and the other end of the abutting spring is connected with the sliding part (512); the stirring telescopic cylinder (11) is arranged on the rack (1), the telescopic direction of a piston rod of the stirring telescopic cylinder (11) is parallel to the motion direction of the sliding part (512), and the piston rod of the stirring telescopic cylinder (11) is abutted against the sliding part (512) to enable the sliding part (512) to reciprocate.
6. The plating apparatus as recited in claim 1, wherein: the clamping manipulator (7) comprises a mounting seat (71), a rotating pipe (72), a clamping jaw air cylinder (73), an air guide pipe (74) and a rotary joint (75), wherein the mounting seat (71) is connected with the XYZ three-axis sliding table (6); the rotating pipe (72) is rotatably arranged on the mounting seat (71) in a penetrating way through a bearing; the clamping jaw air cylinder (73) is fixedly connected with one end face of the rotating pipe (72), and the clamping jaw air cylinder (73) is used for clamping the movable clamp (5); the air duct (74) penetrates through the inner ring of the rotating pipe (72), one end of the air duct (74) is communicated with the clamping jaw cylinder (73), and the other end of the air duct penetrates out of one end, far away from the clamping jaw cylinder (73), of the rotating pipe (72); the rotary joint (75) is connected to one end, away from the clamping jaw cylinder (73), of the air duct (74), and a movable part on the rotary joint (75) is communicated and connected with the air duct (74); the polishing wheel assembly (9) is arranged on the rack (1), the polishing wheel assembly (9) is located between the electroplating reaction tank (2) and the cleaning tank (3), and after the polishing wheel assembly (9) is abutted to cathode metal, the movable clamp (5) can rotate around the axis of the rotating pipe (72).
7. The plating apparatus as recited in claim 6, wherein: the polishing wheel assembly (9) comprises:
a lifting cylinder (91) arranged on the frame (1);
the mounting pipe (92) is connected with a piston rod of the lifting cylinder (91), and the cleaning pool (3) is positioned on the inner side of the mounting pipe (92);
one end of the polishing pipe (93) is rotatably connected to the inner wall of the upper end of the mounting pipe (92) through a bearing, the other end of the polishing pipe is positioned outside the mounting pipe (92), and the inner wall of the polishing pipe (93) is used for being abutted to the cathode metal;
a drive motor (94) provided on an upper end surface of the mounting tube (92);
a driving gear (95) fixedly connected with an output shaft of the driving motor (94);
the driven gear (96) is sleeved on the polishing tube (93) and is positioned on the outer wall of the mounting tube (92), and the driven gear (96) is meshed with the driving gear (95).
8. The plating apparatus as recited in claim 5, wherein: the electroplating reaction tank (2) comprises a working part (21), a circulating part (22) and a circulating pipeline (23), wherein the working part (21) is soaked by anode metal and cathode metal, an overflow port (211) is formed in the inner wall, close to the opening of the working part (21), of the working part, and the overflow port (211) is located on the extension line of the sliding path of the sliding part (512); the circulating part (22) is used for soaking the working part (21), and the liquid level in the circulating part (22) is lower than that in the working part (21); one end of the circulating pipeline (23) is communicated with the circulating part (22) in a filtering way, and the other end of the circulating pipeline is communicated with the working part (21).
9. The plating apparatus as recited in claim 1, wherein: the cleaning pool (3) comprises a soaking part (31), a water outlet pipeline (32) and a water inlet pipeline (33), wherein the soaking part (31) is used for soaking and cleaning cathode metal; one end of the water outlet pipeline (32) is communicated with the soaking part (31), and the water outlet pipeline (32) is used for discharging liquid in the soaking part (31) to the outside; one end of the water inlet pipeline (33) is communicated with the soaking part (31), the communicated part is higher than the liquid level in the soaking part (31), and the water inlet pipeline (33) is used for guiding clean cleaning liquid into the soaking part (31).
CN202211367419.1A 2022-11-03 2022-11-03 Electroplating equipment Withdrawn CN115537899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211367419.1A CN115537899A (en) 2022-11-03 2022-11-03 Electroplating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211367419.1A CN115537899A (en) 2022-11-03 2022-11-03 Electroplating equipment

Publications (1)

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CN202211367419.1A Withdrawn CN115537899A (en) 2022-11-03 2022-11-03 Electroplating equipment

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116377542A (en) * 2023-03-29 2023-07-04 扬州市景杨表面工程有限公司 Passivation treatment process for new energy automobile workpiece
CN117587487A (en) * 2024-01-18 2024-02-23 南京海创表面处理技术有限公司 High-precision magnesium alloy workpiece surface electroplating equipment and control method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116377542A (en) * 2023-03-29 2023-07-04 扬州市景杨表面工程有限公司 Passivation treatment process for new energy automobile workpiece
CN117587487A (en) * 2024-01-18 2024-02-23 南京海创表面处理技术有限公司 High-precision magnesium alloy workpiece surface electroplating equipment and control method
CN117587487B (en) * 2024-01-18 2024-04-02 南京海创表面处理技术有限公司 High-precision magnesium alloy workpiece surface electroplating equipment and control method

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