CN115529810A - Novel IMA framework air-cooled heat dissipation system - Google Patents

Novel IMA framework air-cooled heat dissipation system Download PDF

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Publication number
CN115529810A
CN115529810A CN202211345479.3A CN202211345479A CN115529810A CN 115529810 A CN115529810 A CN 115529810A CN 202211345479 A CN202211345479 A CN 202211345479A CN 115529810 A CN115529810 A CN 115529810A
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CN
China
Prior art keywords
air
module
air outlet
fan assembly
heat dissipation
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Pending
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CN202211345479.3A
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Chinese (zh)
Inventor
谢馨
李慧利
郝丙仁
原作兰
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China Aviation Optical Electrical Technology Co Ltd
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China Aviation Optical Electrical Technology Co Ltd
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Priority to CN202211345479.3A priority Critical patent/CN115529810A/en
Publication of CN115529810A publication Critical patent/CN115529810A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/1418Card guides, e.g. grooves
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554Forced ventilation of a gaseous coolant
    • H05K7/20572Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • H05K7/20581Cabinets including a drawer for fans

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a novel IMA framework air-cooled heat dissipation system, which comprises a cabinet body, fan assemblies and modules arranged in the cabinet body, wherein the modules are provided with a plurality of layers along the height direction of the cabinet body, the lower side of each layer of module is provided with the fan assemblies, the two adjacent layers of modules are separated by the fan assemblies, the front panel of each fan assembly is provided with an air inlet, the rear panel of the cabinet body is provided with an air outlet, the inner space of each fan assembly is an air inlet cavity of the upper layer of module, the outer part of each fan assembly is an air outlet space of the lower layer of module, the rear end of the air outlet space is communicated with the air outlet cavity, one end of the air outlet cavity is fixed on a back panel mounting plate, and the other end of the air outlet cavity is communicated with the air outlet on the back panel; in two adjacent layers of modules, the air inlet cavity of the upper layer module is isolated from the air outlet space of the lower layer module. According to the invention, each layer of module is provided with the independent heat dissipation air channel and the fan assembly which are connected in parallel, so that the problems of heat accumulation, large wind resistance and low reliability caused by serial heat dissipation of each layer of module in the conventional IMA framework air cooling system are solved.

Description

Novel IMA framework air-cooled heat dissipation system
Technical Field
The invention belongs to the technical field of heat dissipation systems, and particularly relates to a novel IMA framework air-cooled heat dissipation system.
Background
An integrated modular avionics system (IMA) is an integral architecture which is formed by a general functional module, a standard data bus and a general operating system and realizes information exchange and processing. An open architecture with an LRM module as an interconnection unit is usually adopted in the IMA architecture, and the LRM module as a replaceable unit in the IMA architecture has strong environmental adaptability and functional independence. More importantly, the modular design adopted by the IMA framework can quickly locate the fault position and facilitate the replacement of the fault module, thereby improving the universality and maintainability of the equipment and having great application prospect in the fields of military vehicle-mounted and aerospace.
With the improvement of the industrial intelligence degree, the requirements on signal processing and data transmission are increased day by day, the number of modules in the system is increased, and the IMA architecture is gradually expanded from a single layer to a plurality of layers. The heat flow density in the equipment is sharply increased, and higher requirements are put on the heat dissipation performance of the equipment. The conventional IMA framework adopts direct air cooling heat dissipation, the single-layer LRM module structure is generally that a fan assembly 01 is installed at the bottom of a cabinet body 02, cold air blown by a fan penetrates through heat dissipation teeth between LRM modules 03, and heat generated by the modules is taken away through forced air cooling. When the number of modules is increased and the single-layer module is expanded to more than two layers, as shown in fig. 1, the fan assembly 01 is generally installed in the middle of the whole equipment cabinet. The whole air duct is linear, and air is supplied from the lower part and discharged from the upper part, as shown in fig. 2, an air outlet 05 is arranged on an upper cover plate 04 of the cabinet body, an air inlet is arranged at the bottom of the cabinet body, a signal roll-out connector 07 is arranged on a side panel of the cabinet body, and the equipment is lifted to a certain height through bottom support legs 06 to provide an air inlet space.
In a conventional IMA framework heat dissipation system, serial heat dissipation is performed between each layer of modules, and in the process that air passes through each layer of modules from an air inlet at the bottom of a cabinet body to reach an air outlet, heat is gradually accumulated, and the air temperature is higher when the air is closer to the air outlet. The heat dissipation of the rear layer of module is influenced by the heat accumulation of the front layers of modules, particularly the module close to the air outlet layer is influenced most, and the overheating risk exists. In addition, cold air needs to pass through the heat dissipation teeth between the modules to take away heat, the more the number of the module layers is, the longer the air channel is, the larger the resistance which needs to be overcome by the fan is, the less the effective air quantity is, and the lower the working efficiency of the fan is. Moreover, for an IMA architecture with more than three layers, a plurality of fan assemblies are connected in series to work simultaneously, and if a fault occurs in an individual fan, the heat dissipation effect of the whole equipment is affected, and the reliability is seriously reduced.
Disclosure of Invention
The invention provides a novel IMA framework air-cooled heat dissipation system, which aims to solve the problems of heat accumulation, large wind resistance and low reliability caused by serial connection heat dissipation of modules at each layer in a multi-layer IMA framework.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The novel IMA framework air-cooled heat dissipation system comprises a cabinet body, fan assemblies and modules arranged in the cabinet body, wherein the modules are provided with a plurality of layers along the height direction of the cabinet body, the lower side of each layer of module is provided with the fan assemblies, the two adjacent layers of modules are separated by the fan assemblies, the front panel of each fan assembly is provided with an air inlet, the rear panel of the cabinet body is provided with an air outlet, the inner space of each fan assembly is an air inlet cavity of the module on the upper layer of the fan assembly, the outer part of each fan assembly is an air outlet space of the module on the lower layer of the fan assembly, the air outlet space is surrounded by the fan assemblies and the side panels of the cabinet body, the rear end of the air outlet space is communicated with the corresponding air outlet cavity, one end of the air outlet cavity is fixed on a back panel mounting plate arranged in the cabinet body, and the other end of the air outlet correspondingly formed in the rear panel is communicated with the air outlet correspondingly formed in the rear panel; in two adjacent layers of modules, the air inlet cavity of the upper layer module is isolated from the air outlet space of the lower layer module, so that the fan assembly is prevented from sucking air heated by the lower layer module.
Furthermore, the fan assembly comprises a frame body, a cover plate, a fan and the front panel, wherein the front panel is arranged at the front end of the frame body; the upper side of the front panel is provided with the air inlet, and the lower side of the front panel is closed; the fan is fixed on the cover plate, the fan enables cold air to flow from bottom to top, the cover plate is fixed at the top of the frame body, and the frame body can separate an air inlet cavity of an upper layer module from an air outlet space of a lower layer module in two adjacent layers of modules.
Further, the fan assembly is fixed on the cabinet body through the front panel of the fan assembly in a matched mode, or the fan assembly is in sliding fit with the cabinet body through the sliding rails arranged on the two sides of the frame body.
Furthermore, a shielding wire mesh is arranged on the rear end face of the front panel.
Furthermore, during operation, the fan assembly sucks cold air into the air inlet cavity from the air inlet, the cold air takes away heat of the module from bottom to top after passing through the heat dissipation teeth of the module, the cold air after absorbing the heat is changed into hot air to reach the air outlet space, and finally the hot air is discharged from the corresponding air outlet on the rear panel through the air outlet cavity.
Furthermore, when a certain layer of modules is not fully inserted, the corresponding empty slot position of the cover plate is not provided with a fan, and a covering plate is arranged at the fan air outlet of the empty slot position.
Furthermore, the air outlet space of the top layer module is enclosed by the baffle, the upper cover plate and the side panel of the cabinet body.
Furthermore, the fan assembly positioned at the bottom layer is attached to or close to the base of the cabinet body.
Furthermore, the heat dissipation air duct of each layer of module is Z-shaped.
Furthermore, the front end of the cabinet body is opened so that the modules can be conveniently inserted in the front-back direction, and a guide rail for realizing module plug-in guiding and positioning is arranged in the cabinet body.
By means of the technical scheme, each layer of module in the air cooling system has the independent heat dissipation air channel and the fan assembly which are connected in parallel, and the problems of heat accumulation, large wind resistance and low reliability caused by serial heat dissipation of each layer of module in the conventional IMA framework air cooling system are solved. The invention can independently adjust the number and the type (performance) of the fans in the fan assembly of the layer aiming at the module layout and the board heat consumption difference of each layer, namely, the fans matched with the heat consumption can be selected for the fan assemblies of different layers, thereby having more flexibility. In addition, the invention has stronger expansibility, and can be expanded or reduced on the basis of a single-layer single-row or multi-layer multi-row IMA architecture.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of a conventional IMA architecture air-cooled heat dissipation system.
Fig. 2 is a schematic diagram of a heat dissipation principle of a conventional IMA architecture air-cooled heat dissipation system.
Fig. 3 is a schematic perspective view of an IMA architecture air-cooled heat dissipation system according to the present invention.
Fig. 4 is an exploded view of an IMA architecture air-cooled heat dissipation system of the present invention.
Fig. 5 is a schematic diagram of the internal structure of the IMA architecture air-cooled heat dissipation system of the present invention.
Fig. 6 is a schematic view of an air duct of the IMA architecture air-cooled heat dissipation system of the present invention.
Fig. 7 is a schematic structural diagram of a fan assembly in the IMA architecture air-cooled heat dissipation system of the present invention.
Fig. 8 is a schematic view of different fan levels of the IMA architecture air-cooled heat dissipation system of the present invention.
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description is further provided in conjunction with the accompanying drawings and preferred embodiments.
Referring to fig. 3 to 8, a novel IMA framework air-cooling heat dissipation system includes a cabinet 1 and a module 2 installed in the cabinet 1, wherein the module has multiple layers, and the multiple layers of modules are distributed at intervals along the height direction of the cabinet. In this embodiment, the module is an LRM module. The front end of the cabinet body 1 is opened so as to facilitate the insertion or the disassembly of the LRM module along the front-back direction, and a guide rail 11 for realizing the insertion, the extraction, the guidance and the fixation of the LRM module is arranged in the cabinet body 1. The lower side of each layer of LRM module is provided with a fan assembly 3 in a matching way, and the LRM modules of adjacent layers are separated by the fan assembly 3; the whole body of the invention is in a heat dissipation mode of front air inlet and rear air outlet, the air inlet 4 is arranged on the front panel 31 of the fan component 3, the air outlet 5 is arranged on the rear panel 12 of the cabinet body 1, the air inlet and the air outlet are correspondingly communicated, cold air is sucked by a fan in the fan component from the air inlet, passes through the heat dissipation teeth 21 on the module from bottom to top, takes away heat generated by the module, and finally flows out from the air outlet. The fan components 3 between different layers are connected in parallel, even if a certain fan fails, the heat dissipation of other layers of modules cannot be influenced, and only the failed fan of the layer needs to be replaced. In conclusion, the heat dissipation paths of the modules at different levels in the IMA framework air-cooled heat dissipation system are independent from each other, the fan assemblies do not influence each other, and the reliability is higher.
Specifically, as shown in fig. 5, in this embodiment, a three-layer LRM module and a three-layer fan assembly are arranged in a cabinet 1, each LRM module has an independent air inlet cavity and an independent air outlet cavity, an inner space of the fan assembly 3 is an air inlet cavity 6 adjacent to the LRM module on the upper layer, an outer space of the fan assembly 3 is an air outlet space 7 adjacent to the LRM module on the lower layer, and the air outlet space 7 is specifically defined by the fan assembly 3 and side panels 13 on two sides of the cabinet; except for the fan assembly at the bottom layer, the rear part of each fan assembly 3 is provided with an air outlet cavity 8, the air outlet cavities can be integrally located at the same height so as to fully utilize the height space in the cabinet body, the air outlet cavity is the air outlet cavity of the module at the lower layer of the fan assembly, the air outlet cavity 8 is communicated with the corresponding air outlet space 7 to form an air outlet channel of the module at the lower layer, and the rear panel 12 of the cabinet body is provided with the air outlet 5 correspondingly communicated with the outlet of the corresponding air outlet cavity. In two adjacent LRM modules, because the air inlet cavity of the upper module is completely isolated from the air outlet space of the lower module, the fan assembly can be prevented from sucking the air heated by the lower module. Cold air is sucked from an air inlet of the front panel, heat is taken away through gaps of the heat dissipation teeth 21 of the module, the cold air after absorbing the heat is changed into hot air to reach an air outlet space, and finally the hot air is discharged from an air outlet of the rear panel through the air outlet cavity. One end of the air outlet cavity 8 is fixed on the back plate mounting plate 9, the other end of the air outlet cavity is connected with the back plate 12, and the back plate mounting plate 9 is fixed in the cabinet body 1. The air duct form of each layer of modules in the working state is shown in fig. 6, the air inlet cavity, the heat dissipation space gap of the module, the air outlet space arranged above the corresponding layer of modules, the air outlet cavity and the air outlet are sequentially communicated to form the heat dissipation air duct of the corresponding layer of modules, and the heat dissipation air duct of each layer of LRM modules is Z-shaped. It is worth to say that the air outlet space of the top LRM module is enclosed by the baffle 10, the upper cover plate 14 and the side panel 13 of the cabinet, and the air outlet space is located right above the corresponding layer of modules; the side panels are provided with signal roll-out connectors 16 connected to the modules. The air outlet can be in a rectangular shape matched with the shape of the air outlet cavity and is provided with a filter screen.
Referring to fig. 7, the fan assembly 3 includes a front panel 31, a frame 32, a cover plate 33 and a fan 34, the front panel 31 is disposed at the front end of the frame 32, the air inlet 4 is disposed at the upper side of the front panel, a projection plane of the air inlet 4 in the front-back direction should fall into a projection plane of the front-back direction of the opening at the front end of the frame to ensure that the cold air sucked into the air inlet can only enter the air inlet cavity, the lower side of the front panel is located outside the inner space of the corresponding fan assembly, and the lower side of the front panel is sealed with the front end of the cabinet to prevent the hot air in the lower air outlet space from overflowing from the front end of the fan assembly; the front panel 31 and the frame 32 are welded together, the fans 34 are fixed on the cover plate 33 and located in the frame 32, the fans 34 are arranged in an array to match with the LRM modules in each layer, and the cover plate 33 is fixed on the top of the frame 32 by screws 35. Enclose into fan unit's inner space (be the air inlet chamber) behind front panel, framework and the apron connection, whole fan unit all the other is airtight except that air intake 4, fan outlet 331, and fan unit 3's inner space constitutes upper LRM module air inlet chamber 6, framework 32 separates the air inlet chamber of the upper module in the adjacent two-layer module and the air-out space of lower floor's module. The fan assembly 3 can be fixed on the cabinet body by the front panel 31 matching with the mounting screws, and can also be fixed on the two sides of the frame body 32 by installing slide rails and sliding matching with the cabinet body. If a single fan in the fan assembly 3 fails, the fan assembly can be disassembled by first grasping the handle 36 on the front panel, and then removing the cover plate from the fan assembly, and then replacing the fan. In addition, a shielding wire mesh 37 can be arranged on the rear end face of the front panel for improving the anti-electromagnetic interference capability of the fan assembly and playing roles of dust prevention, sand filtration and the like to a certain extent. In this embodiment, the fan assembly who is located the bottom can with the base 15 laminating or be close the setting of the cabinet body, need not to reserve the air inlet space in base below to be favorable to reducing the whole height of equipment, and improve the installation stability of the cabinet body.
In addition, because the heat dissipation systems of the modules of each layer do not influence each other, the performance, the number and the installation position of the fans in the fan assemblies of different levels can be adjusted according to the heat consumption difference of the modules of each layer and whether the modules are fully inserted. As shown in fig. 8, when the module 2 is not fully plugged, no fan is installed at the corresponding empty slot 332 of the cover plate 33, i.e. no fan needs to be installed at the lower side of the plugged module, a cover plate is installed on the fan outlet 331 corresponding to the empty slot on the original cover plate to shield the fan outlet, the cover plate can be a rectangular plate to avoid air backflow, and the installation hole of the rectangular plate is consistent with the position of the original fan installation hole. When the overall heat consumption of a certain layer of module (the middle layer module shown in fig. 8) is large, the high performance fan 341 is selected in the layer of fan assembly to meet the heat dissipation requirement. Conversely, when the overall heat consumption of a certain layer of modules (the bottom layer of modules shown in fig. 8) is low, the low-performance fan 342 is selected.
In this embodiment, only the module is taken as an LRM module for illustration; in other embodiments, the modules are of other types, so as to form air-cooled heat dissipation systems of other types of architectures.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a novel IMA framework forced air cooling system, includes the cabinet body, fan assembly and installs at the internal module of cabinet, and the module is equipped with multilayer, its characterized in that along cabinet body direction of height: the lower side of each layer of module is provided with a fan assembly, and the two adjacent layers of modules are separated by the fan assembly, the front panel of the fan assembly is provided with an air inlet, the rear panel of the cabinet body is provided with a corresponding air outlet, the inner space of the fan assembly is an air inlet cavity of the module on the upper layer of the fan assembly, the outer part of the fan assembly is an air outlet space of the module on the lower layer of the fan assembly, the air outlet space is enclosed by the fan assembly and the side panel of the cabinet body, the air outlet space of the module on the lower layer of the fan assembly is enclosed between the fan assembly and the side panel of the cabinet body, and the rear end of the air outlet space is communicated with the corresponding air outlet cavity; one end of the air outlet cavity is fixed on a back plate mounting plate arranged in the cabinet body, and the other end of the air outlet cavity is communicated with an air outlet correspondingly formed in the back panel; in two adjacent layers of modules, the air inlet cavity of the upper layer module is isolated from the air outlet space of the lower layer module.
2. The novel IMA architecture air-cooled heat dissipation system of claim 1, wherein: the fan assembly comprises a frame body, a cover plate, a fan and the front panel, and the front panel is arranged at the front end of the frame body; the upper side of the front panel is provided with the air inlet, and the lower side of the front panel is closed; the fan is fixed on the cover plate, the cover plate is fixed at the top of the frame body, and the air inlet cavity of the upper layer module and the air outlet space of the lower layer module in the two adjacent layers of modules are separated by the frame body.
3. The novel IMA architecture air-cooled heat dissipation system of claim 2, wherein: the fan assembly is fixed on the cabinet body through the front panel of the fan assembly in a matched mode, or the fan assembly is in sliding fit with the cabinet body through the sliding rails arranged on the two sides of the frame body of the fan assembly.
4. The novel IMA architecture air-cooled heat dissipation system of claim 2, wherein: the rear end face of the front panel is provided with a shielding wire mesh.
5. The novel IMA architecture air-cooled heat dissipation system of claim 1, wherein: when the air conditioner works, the fan assembly sucks cold air into the air inlet cavity from the air inlet, the cold air takes away heat of the module after passing through the heat dissipation teeth on the module from bottom to top, the cold air after absorbing the heat is changed into hot air to reach an air outlet space arranged above the module, and finally the hot air is discharged from the corresponding air outlet on the rear panel through the air outlet cavity.
6. The novel IMA architecture air-cooled heat dissipation system of claim 1, wherein: when a certain layer of module is not fully inserted, the fan is not installed at the corresponding empty slot position of the cover plate, and the covering plate is installed at the fan air outlet at the empty slot position.
7. The novel IMA architecture air-cooled heat dissipation system of claim 1, wherein: the air outlet space of the top layer module is enclosed by the baffle, the upper cover plate and the side panel of the cabinet body.
8. The novel IMA architecture air-cooled heat dissipation system of claim 1, wherein: the fan component positioned at the bottom layer is attached to or close to the base of the cabinet body.
9. The novel IMA architecture air-cooled heat dissipation system of claim 1, wherein: the heat dissipation air duct of each layer of module is Z-shaped.
10. The novel IMA architecture air-cooled heat dissipation system of claim 1, wherein: the front end of the cabinet body is opened so that the modules can be conveniently inserted in the front-back direction, and a guide rail for realizing module plug-in guiding and positioning is arranged in the cabinet body.
CN202211345479.3A 2022-10-31 2022-10-31 Novel IMA framework air-cooled heat dissipation system Pending CN115529810A (en)

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Application Number Priority Date Filing Date Title
CN202211345479.3A CN115529810A (en) 2022-10-31 2022-10-31 Novel IMA framework air-cooled heat dissipation system

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Application Number Priority Date Filing Date Title
CN202211345479.3A CN115529810A (en) 2022-10-31 2022-10-31 Novel IMA framework air-cooled heat dissipation system

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Publication Number Publication Date
CN115529810A true CN115529810A (en) 2022-12-27

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