CN115528454A

CN115528454A - Chip connector

Info

Publication number: CN115528454A
Application number: CN202110713805.0A
Authority: CN
Inventors: 林暐智; 许修源
Original assignee: Foxconn Kunshan Computer Connector Co Ltd; Foxconn Interconnect Technology Ltd
Current assignee: Foxconn Kunshan Computer Connector Co Ltd; Foxconn Interconnect Technology Ltd
Priority date: 2021-06-26
Filing date: 2021-06-26
Publication date: 2022-12-27

Abstract

A chip connector is used for establishing connection between a BGA chip and a circuit mainboard and comprises a substrate, a first conductive piece, a second conductive piece and a solder ball, wherein the first conductive piece is positioned in the substrate. The first conductive member includes a soldering portion and a connecting portion exposed on the first surface of the substrate, and the chip solder balls are located on the first surface of the substrate and are soldered and fixed with the soldering portion. The first end of the second conductive piece is fixed on the circuit mainboard through the solder ball, the second end of the second conductive piece is inserted into the substrate and connected with the conductive connection part of the first conductive piece, and the first end of the second conductive piece and the solder ball are exposed below the substrate. The invention achieves the electrical connection through the first and the second conductive pieces, and simultaneously the lower end of the second conductive piece and the solder ball are exposed outside, thereby reducing the overall height of the chip connector and providing more possible changing spaces for the design of the first and the second conductive pieces.

Description

Chip connector

[ technical field ] A

The present invention relates to a chip connector, and more particularly, to a chip connector for establishing electrical connection between a BGA chip and a circuit board.

[ background of the invention ]

US9276336B2 discloses an electrical interconnection structure or an electrical connector for establishing electrical connection between a ball grid array packaged chip (i.e., a BGA chip having an integrated circuit chip having solder balls arranged in an array on the entire bottom surface of the chip) and a circuit board, and fig. 5 shows an embodiment in which the electrical interconnection structure includes an upper layer connected to the solder balls of the chip, a lower layer connected to the circuit board, the upper layer having a conductive member, the lower layer having a conductive member, and the conductive members of the upper and lower layers are butted against each other to thereby achieve electrical connection. The upper and lower layers must be supported by the base.

CN204885451U discloses an electrical connector for establishing electrical connection between a BGA chip and a circuit board, wherein a liquid metal is used as a conductive member of the electrical connector. The upper conductive piece of the electric connector adopts needle-shaped metal, and the lower conductive piece adopts liquid metal, but the upper conductive piece and the lower conductive piece are inevitably supported by adopting seat bodies.

In both of the above two methods, the upper and lower seats are required, which inevitably increases the overall height of the electrical connector. Therefore, there is a need to provide an improved electrical connector to solve the above problems.

[ summary of the invention ]

A primary object of the present invention is to provide a chip connector which can reduce the overall height of the connector.

In order to realize the purpose, the invention adopts the following technical scheme: a chip connector is used for establishing connection between a BGA chip and a circuit main board, wherein the BGA chip is provided with chip solder balls, and the chip connector comprises a substrate, a first conductive piece, a second conductive piece and solder balls, wherein the first conductive piece is positioned in the substrate; the substrate is provided with a first surface facing the BGA chip and a second surface facing the circuit main board, the first conductive piece comprises a welding part exposed on the first surface and a conductive connecting part, and the chip welding ball is located on the first surface of the substrate and is welded and fixed with the welding part; the first end of the second conductive piece is fixed on the circuit main board through the solder balls, the second end of the second conductive piece is inserted into the substrate and is connected with the conductive connection part of the first conductive piece, and the first end of the second conductive piece and the solder balls are exposed below the substrate.

Compared with the prior art, the invention achieves the electrical connection through the first and second conductive pieces, and simultaneously the lower end of the second conductive piece and the solder ball are exposed outside, thereby reducing the overall height of the chip connector and providing more possible change spaces for the design of the first and second conductive pieces.

[ description of the drawings ]

Fig. 1 is a perspective view of a substrate and first conductive members of a chip connector according to a first embodiment of the present invention, wherein one of the first conductive members is disassembled.

Fig. 2 is a perspective view of fig. 1 from another angle.

Fig. 3 is a side view of the BGA chip mounted on the substrate.

Fig. 4 is a perspective view of an auxiliary socket, second conductive members and solder balls in the chip connector according to the first embodiment of the present invention, wherein one of the second conductive members and the solder balls is disassembled.

Fig. 5 is a perspective view of another angle in fig. 4.

Fig. 6 is a side view of the auxiliary socket of fig. 4 soldered to a circuit board.

Fig. 7 is a side view of the auxiliary seat of fig. 4 disassembled.

Fig. 8 is a side view of the chip connector connecting the BGA chip to the circuit main board.

Fig. 9 is a schematic cross-sectional view of fig. 8.

Fig. 10 is a perspective view of the first and second conductive members when they are butted.

Fig. 11 is a perspective view of the substrate, the first and second conductive members and the solder balls of the chip connector according to the second embodiment of the present invention, wherein one of the first and second conductive members and the solder balls are disassembled.

Fig. 12 is a perspective view of fig. 11 from another angle.

Fig. 13 is a perspective view of the first and second conductive members and the solder balls.

Fig. 14 is a schematic sectional view of the chip connector of the second embodiment connecting the BGA chip to the circuit board.

Fig. 15 is a perspective view of a substrate, first and second conductive members and solder balls of a chip connector according to a third embodiment of the present invention, wherein one of the first and second conductive members and the solder balls are disassembled.

Fig. 16 is a perspective view from another angle of fig. 15.

FIG. 17 is a cross-sectional view schematically showing the connection of the BGA chip to the circuit board by the chip connector of the third embodiment.

Fig. 18 is a perspective view of a substrate, first conductive members and solder balls of a chip connector according to a fourth embodiment of the present invention, wherein one of the first conductive members and the solder balls is disassembled.

Fig. 19 is a perspective view of fig. 18 from another angle.

Fig. 20 is a schematic sectional view of a fourth embodiment of a chip connector for connecting a BGA chip to a circuit board.

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

[ detailed description ] embodiments

For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.

The invention relates to a chip connector which is used for establishing electrical connection between a BGA chip and a circuit mainboard. BGA chips, i.e., ball grid array packaged integrated circuit chips, have solder balls, i.e., chip solder balls, arranged in an array on the entire bottom surface of the substrate.

Fig. 1-10 show a first embodiment of the present invention. Referring to fig. 8-9, a chip connector 100, alternatively referred to as an electrical connector, is positioned between BGA chip 91 and circuit board 92, BGA chip 100 includes chip solder balls 911 connected to an upper surface of chip connector 100, and the chip connector is connected to circuit board 92 via solder balls 40. It can be seen that the lower half of the chip connector 100 is exposed outside and is not supported by a base made of insulating material such as plastic, so that the overall height of the whole chip connector 100 can be reduced.

The specific structure of the chip connector 100 is described below. Referring to fig. 1-7, a chip connector 100 includes a substrate 10, a first conductive member 20 disposed in the substrate 10, a second conductive member 30, a solder ball 40, and an auxiliary seat 50.

Referring to fig. 1-3, the substrate 10 is provided with an upper surface, or first surface 101, facing the BGA chip 91 and a lower surface, or second surface 102, facing the circuit board 92. The first conductive element 20 includes a soldering portion 21 and a conductive portion 22 exposed on the first surface 101. In an embodiment, the substrate 10 is made of an insulating material and has a plurality of ball grooves 11, the ball grooves 11 are recessed from the first surface 101 to receive the solder balls 911, the shape of the hemisphere of the ball grooves 11 matches the shape of the solder balls 911, and the soldering portions 21 are exposed at the bottom surfaces of the ball grooves 11. The substrate 10 is provided with a plurality of insertion holes 12 penetrating the second surface 102, and the connecting portions 22 extend into the insertion holes 12.

In this embodiment, the welding portion 21 of the first conductive member 20 is a disc structure, the disc structure is exposed at the bottom surface of the ball groove 11, the guiding portion 22 is a pair of elastic arms 221 extending from the side surface of the disc structure, the elastic arms 221 transversely protrude into the insertion hole 12 from the side surface, and each elastic arm 221 forms a horn structure that firstly embraces outwards and then inwards, and then inclines outwards. The insertion hole 12 is provided at a side thereof with a receiving groove 13 for the elastic arm 221 to pass through and a deformation space for the elastic portion to elastically deform outwardly.

The BGA chip 91 is first placed on the first surface 101 of the substrate 10, the solder ball 911 is located in the ball groove 11, and the preliminarily melted solder ball 911 is soldered to the soldering portion 21 of the first conductive member 20 by passing through a high temperature furnace, so that the solder ball 911 is located on the first surface 101 of the substrate and soldered to the first conductive member 20.

Referring to fig. 4 to 6, the second conductive member 30 is first preliminarily fixed to the auxiliary seat 50. The auxiliary seat 50 is provided with terminal holes 51 arranged in a matrix, the second conductive member 30 is accommodated in the terminal holes 51, and the second conductive member 30 is fixed by the interference force between the second conductive member and the terminal holes 51. The solder ball 40 is primarily melted by a high temperature furnace-passing manner and fixed at the first end 301 or the lower end of the second conductive member 30. The auxiliary seat 50 with the second conductive member 30 and the solder balls 40 fixed thereon is placed on the circuit board 92, and the solder balls 40 are soldered and fixed on the circuit board 92 by means of a high temperature boiler. After the completion, the auxiliary seat 50 is removed, and the second conductive member 30 and the solder ball 40 are directly exposed to the outside, as shown in fig. 7.

Finally, referring to fig. 8-9, the BGA chip 91 with the substrate 10 fixed thereunder is assembled to the second conductive member 30, and the second end 302 or upper end of the second conductive member 30 is inserted into the mating hole 12 and connected to the mating portion 22. It can be seen that the first end 301 of the second conductive member 30 fixes the circuit board 92 through the solder ball 40, the second end 302 is inserted into the substrate 10 to be connected to the conductive portion 22 of the first conductive member 20, and the first end 301 of the second conductive member 30 and the solder ball 40 are exposed below the substrate. The second end 302 of the second conductive member is detachably contacted with the conductive connection portion 22, so that the chip 91 and the circuit board 92 have a flexible assembly relationship.

Referring to fig. 4-5 and 10, the second conductive member 30 is a flat column structure, and has an arc-shaped opening 32 at a bottom surface of a first end 301 for receiving a solder ball, and the elastic arm 221 is clamped at a second end 302 of the second conductive member. The second end is provided with a recessed neck portion 33, and the elastic arm 221 is clamped on the neck portion 33, so that the first conductive member and the second conductive member are stably held. The terminal hole 51 of the auxiliary socket is in a cross structure, and the two narrow sides of the second conductive component 30 are fixed in the terminal hole 51 in a hard interference manner, so that the second conductive component 30 is preliminarily fixed through the auxiliary socket 50, and after the auxiliary socket is welded on the circuit main board 92, the auxiliary socket 50 is taken out from the second conductive component 30 by means of a certain external force. Two slots 511 of the terminal hole of the cross are used to fix the second conductor, and the other two slots 512 are spaced apart from the two wide surfaces of the second conductor 30 to reduce interference force. The bottom surface of the auxiliary seat 50 is provided with a support pillar 52, the second conductive member 30 is welded to the first end 301 of the second conductive member after the auxiliary seat 50 is fixed, and the support pillar 52 helps to ensure the flatness of the solder ball 40. In an exemplary embodiment, the second end 302 of the second conductive member protrudes at least partially upward beyond the upper surface of the auxiliary seat, as shown in fig. 6.

In the invention, the distance between the solder balls of the BGA chip is 0.5 mm, the vertical height of the substrate 10 can be set to be as small as 0.5 mm, after the auxiliary seat 50 is removed, the distance between the substrate 10 and the circuit main board 92 is as small as 0.35 mm, the whole height of the chip connector 100 is reduced as much as possible by removing the auxiliary seat 50 and setting the second conductive piece 30, and the lower end of the second conductive piece is exposed, thus improving the heat dissipation.

Fig. 11-20 show other embodiments of the invention, primarily variations of the first and second connectors. The same portions will not be described in detail, and different points will be mainly described.

Referring to fig. 11-14, the substrate 61 is made of an insulating material, and has a ball groove 611 on its upper surface, the ball groove is a rectangular shallow groove structure, and the lower surface is provided with a plug hole 612, which is also a rectangular structure. The first conductive member 62 has a needle structure, the welding portion 621 thereof is a vertical needle structure extending into the ball groove 611, and the connecting portion 622 is of an inverted L shape. The second conductive member 63 is a brick-shaped structure, the side surface thereof is a concave structure 631, and the end of the conductive connection portion 622 has a hook portion 6221 fastened in the concave structure 631.

The first conductive member 62 is fixed in the substrate 61 by assembling or injection molding, the soldering portion 621 protrudes into the ball groove 611, and the chip solder ball 91 of the bga chip is located in the ball groove 611 of the substrate and soldered and fixed with the soldering portion 621. The second conductive member 63 is first fixed to the auxiliary seat 50, the solder ball 40 is then fixed to the first end of the second conductive member 63, and the auxiliary seat is then removed. The BGA chip with the substrate soldered thereto is inserted from the top down, and the second conductive member 63 enters the insertion hole 612. The second conductive member 63 has a guide block 632 protruding upward at one side of the top thereof, and the guide block helps guiding and provides a space for the concave structure 631. The first conductive member 62 is provided with a recessed hole 623 at the junction of the welding portion 621 and the connecting portion 622, and the recessed hole 623 is capable of being matched with the insulating protrusion of the substrate 61 to fix the first conductive member 62. As can be seen from fig. 14, after the solder ball 40 is soldered to the circuit board 92, the solder ball is deformed into a low configuration structure, and the bottom end of the second conductive member 63 protrudes downward to form a protrusion 633, which is beneficial for fixing with the solder ball 40.

Referring to the third embodiment shown in fig. 15-17, the main difference is that the substrate 71 is a circuit board structure, the circuit board structure has a conductive pad 711 and a through hole 712 electrically connected to the conductive pad, the conductive pad 711 and the through hole 712 form a first conductive member, the through hole 712 forms a plug hole, and the lower edge of the through hole has an inner flange 7121. The bottom surface of the first end 721 of the second conductive member 72 has an arc-shaped opening for receiving solder balls, the second end 722 is a latching arm 723, and the middle of the latching arm has a gap 7231 penetrating upwards, so that the latching arm is divided into left and right, and an elastic deformation space is added, so that the latching arm 723 can be inserted into the through hole 712 quickly. The latch arm 723 has a recessed neck 7232, the latch arm 723 is inserted into the through hole 712, and an inner flange 7121 of the through hole is clamped on the neck to restrict upward and downward directions.

In summary, the first to third embodiments of the present invention disclose a method for manufacturing a chip connector. The method comprises the following steps of providing a substrate and a first conductive piece, wherein the first conductive piece is fixed on the substrate, and a welding part of the first conductive piece is exposed on a first surface of the substrate. And secondly, placing the BGA chip on the first surface of the substrate, and welding a chip solder ball of the BGA chip with the welding part of the first conductive part. And step three, providing an auxiliary seat, a second conductive piece and a solder ball, wherein the second conductive piece is preliminarily fixed on the auxiliary seat, and the solder ball is connected to the first end of the second conductive piece. And step four, welding the welding part on the circuit main board by using the auxiliary seat. And step five, detaching the auxiliary seat from the second conductive piece. And step six, butting the substrate and the BGA chip after the step two with the second conductive piece after the step five, and inserting the second end of the second conductive piece into the substrate to be electrically connected with the conductive part.

Referring to the fourth embodiment shown in fig. 18-20, the present embodiment is different from the previous three embodiments in that the upper surface of the substrate 81 is provided with ball grooves 811, the shapes of the ball grooves match with the solder balls of the chip, and the bottom surfaces of the ball grooves are integrally provided with terminal grooves 812 and corresponding extended terminal holes 813. First conductive member 82 is a stamped member that is mounted downwardly from an upper surface within terminal slot 812. First conductive member 82 includes a vertical portion 821 and an elastic portion 822 bent in an arc shape from a side of a substantially middle of the vertical portion, an upper portion 8211 of vertical portion 821 and

the above description is only for the preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention. Therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. A chip connector is used for establishing connection between a BGA chip and a circuit main board, wherein the BGA chip is provided with chip solder balls, and the chip connector comprises a substrate, a first conductive piece, a second conductive piece and solder balls, wherein the first conductive piece is positioned in the substrate; the method is characterized in that: the substrate is provided with a first surface facing the BGA chip and a second surface facing the circuit main board, the first conductive piece comprises a welding part and a conductive connecting part exposed on the first surface, and the chip solder balls are located on the first surface of the substrate and are welded and fixed with the welding part; the first end of the second conductive piece is fixed on the circuit main board through the solder balls, the second end of the second conductive piece is inserted into the substrate and is connected with the conductive connection part of the first conductive piece, and the first end of the second conductive piece and the solder balls are exposed below the substrate.

2. The chip connector of claim 1, wherein: the chip connector comprises an auxiliary seat, the second conductive piece is connected to the welding ball and welded on the circuit main board through the auxiliary seat, and the auxiliary seat is removed before the first conductive piece and the second conductive piece are butted.

3. The chip connector of claim 1, wherein: the second end of the second conductive piece is detachably contacted with the guide connection part.

4. The chip connector of claim 1, wherein: the substrate is provided with a plurality of ball grooves which are sunken from the first surface and used for containing the chip solder balls, and a plurality of inserting holes which penetrate through the second surface downwards, the welding part of each first conductive piece extends to the ball grooves, the guide connecting part extends to the inserting holes, and the second end of the second conductive piece is inserted into the inserting holes and contacts the conductive part.

5. The chip connector of claim 4, wherein: the welding part of the first conductive part is of a disc structure, the disc structure is exposed on the bottom surface of the ball groove, and the guide connection part is a pair of elastic arms extending out of the side surface of the disc structure; the second conductive member is a columnar structure, the bottom surface of the first end of the second conductive member is provided with an arc-shaped opening for accommodating a solder ball, and the elastic arm is clamped at the second end of the second conductive member.

6. The chip connector of claim 5, wherein: the second end has a recessed neck portion, and the resilient portion is clamped to the neck portion.

7. The chip connector of claim 4, wherein: the welding part of the first conductive piece is of a needle-shaped structure extending into the ball groove, and the guide connection part is of an inverted L shape; the second conductive piece is of a brick-shaped structure, the side surface of the second conductive piece is of a sunken structure, and the tail end of the guide connection part is provided with a hook part buckled on the sunken structure.

8. The chip connector of claim 1, wherein: the first end of the second conductive piece is provided with an arc-shaped opening for accommodating the solder ball, or the first end is provided with a protruding part protruding towards the solder ball.

9. The chip connector of claim 1, wherein: the substrate is of a circuit board structure, the circuit board structure is provided with a conductive gasket and a through hole electrically connected with the conductive gasket, and the conductive gasket and the through hole form the first conductive piece; the bottom surface of the first end of the second conductive member is provided with an arc-shaped opening for accommodating a solder ball, the second end of the second conductive member is provided with a buckling arm, and the buckling arm is inserted into the through hole and electrically connected with the through hole.

10. The connector of claim 9, wherein: the through hole is provided with an inner flange, the buckling arm is provided with an upward penetrating spacing seam and a sunken neck, and the inner flange is clamped on the neck.