CN115528158A

CN115528158A - LED support manufacturing method, LED lamp bead manufacturing method and LED lamp bead

Info

Publication number: CN115528158A
Application number: CN202110716600.8A
Authority: CN
Inventors: 陆学中
Original assignee: Guangdong Elite Optoelectronic Technology Co ltd
Current assignee: Guangdong Elite Optoelectronic Technology Co ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2022-12-27

Abstract

The invention discloses a manufacturing method of an LED bracket, which comprises the steps of providing a metal material belt, dividing the metal material belt into a plurality of processing units and a connecting frame connected among the processing units; and stamping and injection molding are carried out on the processing unit to form an LED support protruding downwards out of the connecting frame, the upper end face of the LED support and the upper end face of the connecting frame are provided with a height difference, and the height difference between the LED support and the connecting frame forms an accommodating space. According to the LED lamp bead, a plurality of processing units are separated without cutting and separating gaps on the metal material belt, so that material waste is reduced, more LED supports can be manufactured on the metal material belt, and the LED lamp bead with the fluorescent powder glue layer which is upwards beyond the LED supports can be manufactured by utilizing the accommodating space formed by the height difference between the LED supports and the connecting frame. The invention also discloses an LED lamp bead manufacturing method and an LED lamp bead, wherein the manufacturing method is based on the LED support manufacturing method, the upper surface of the fluorescent powder glue layer is flush with the upper surface of the connecting frame, and the light-emitting surface of the LED lamp bead is large.

Description

LED support manufacturing method, LED lamp bead manufacturing method and LED lamp bead

Technical Field

The invention relates to the technical field of LED packaging, in particular to a manufacturing method of an LED bracket, a manufacturing method of an LED lamp bead and the LED lamp bead.

Background

With the development of LED technology and the application of various scenes in various fields, LED structures satisfying various demands have been produced. LED holders are used in a variety of LED structures, and LED holders of various sizes, structures and materials have been derived to meet various requirements. For example, chinese patent CN201810979032.9 proposes a method for processing an LED support, which includes cutting a plurality of processing units and connecting frames on a metal strip, then turning up the processing units along a stamping line M to form a metal lead frame, where the inside of the stamping line M is a bottom wall of the metal lead frame, the outside of the stamping line M is turned up to be a side wall of the metal lead frame, then forming a gap in the metal lead frame to form two electrodes, and injecting an insulating material into the gap. Because this mode need process between processing unit and link and separate the clearance in order to separate processing unit and link, need wash away more waste material, cause the waste of material, and processing technology is comparatively complicated.

In addition, in the manufacturing process of the LED lamp bead, a fluorescent powder adhesive layer needs to be arranged in the accommodating cavity of the metal lead frame to cover the LED chip, so that the LED lamp bead can emit a specific light source. The fluorescent powder glue layer of the existing LED lamp bead is limited in the containing cavity of the LED support, the thickness of the LED lamp bead is the thickness of the LED support, the LED support is thick (the height of the side wall of the metal lead frame is high), the side wall of the metal lead frame can block a light source, and the light emitting surface of the LED lamp bead is small. And often can only add phosphor glue in holding the intracavity through modes such as some glue, need can form smooth phosphor glue film through more process steps, and manufacturing process is complicated.

Disclosure of Invention

The invention aims to provide a manufacturing method of an LED bracket, which is used for saving materials and simultaneously forming a containing space capable of containing fluorescent powder glue so as to manufacture an LED lamp bead with a fluorescent powder glue layer which is upwards beyond the LED bracket.

Another object of the present invention is to provide a method for manufacturing an LED lamp bead with a simple manufacturing process, so as to save materials and simultaneously manufacture an LED lamp bead with a phosphor glue layer extending upward beyond an LED support.

The invention further aims to provide the LED lamp bead with the thin LED support and the large light-emitting surface.

In order to achieve one of the above objects, the present invention discloses a method for manufacturing an LED support, comprising: providing a metal material belt, dividing the metal material belt into a plurality of processing units and connecting frames connected among the processing units; stamping and injection molding are carried out on the processing unit to form an LED bracket protruding downwards out of the connecting frame, the upper end face of the LED bracket and the upper end face of the connecting frame have a height difference, and the height difference between the LED bracket and the connecting frame forms an accommodating space; the LED support comprises a first electrode, a second electrode and an insulating spacing structure, wherein the first electrode and the second electrode are spaced apart, and the insulating spacing structure is filled between the first electrode and the second electrode and is connected with the first electrode and the second electrode.

Compared with the prior art, the LED support protruding downwards from the connecting frame is formed by stamping and injection molding in the processing units, a plurality of processing units are not required to be separated by cutting and separating gaps in the metal material belt, and material waste caused by cutting and separating the gaps is reduced, so that more LED supports are manufactured on the metal material belt with the same area. Moreover, the height difference is formed between the upper end surface of the manufactured LED support and the upper end surface of the connecting frame, a containing space capable of containing fluorescent powder glue is formed by the height difference between the LED support and the connecting frame, and the LED lamp bead with the fluorescent powder glue layer which is upwards beyond the LED support can be manufactured.

In one embodiment, the LED support is in a sheet shape, and the step of stamping and injection molding the processing unit to form the LED support protruding downward from the connecting frame includes: punching a first slit through the processing unit, wherein the first slit divides the processing unit into the first electrode and the second electrode; injecting an insulating material into the first gap to form the insulating interval structure; and the processing unit after the insulating material is punched and injection-molded enables the processing unit to downwards protrude out of the connecting frame to manufacture the LED bracket.

Preferably, the LED support further includes an insulating wall located around a structure formed by the first electrode, the second electrode, and the insulating spacer structure, before the processing unit after punching and injecting the insulating material makes the processing unit protrude downward from the connecting frame, a part of an edge of the processing unit is also punched to form a second gap between the processing unit and the connecting frame, and the first electrode has a first connecting arm connected to the connecting frame, and the second electrode has a second connecting arm connected to the connecting frame; and injecting an insulating material into the second gap to form the insulating wall, wherein the first connecting arm and the second connecting arm are embedded in the insulating wall.

Preferably, the upper end face of the LED support is flush with the lower end face of the connecting frame.

In one embodiment, "stamping and injection molding the processing unit to form the LED holder protruding downward from the connecting frame" includes: punching a first slit through the processing unit, wherein the first slit divides the processing unit into a first electrode and a second electrode; punching out part of the edge of the processing unit to form a second gap between the processing unit and the connecting frame, wherein the first electrode is provided with a first connecting arm connected with the connecting frame, and the second electrode is provided with a second connecting arm connected with the connecting frame; stamping the processing unit to enable the processing unit to downwards protrude out of the connecting frame; and injecting an insulating material into the first gap to form the insulating interval structure, and injecting an insulating material into the second gap to form an insulating wall to manufacture the LED bracket.

Specifically, the LED support includes the diapire and encloses to be established the peripheral lateral wall of diapire, diapire and lateral wall enclose to be located holding tank under the accommodation space, first electrode include first basal portion with first linking arm, the second electrode include the second basal portion with the second linking arm, the diapire includes first basal portion, second basal portion and insulating interval structure, the lateral wall is including enclosing to be established the peripheral and the parallel connection of first basal portion, second basal portion the insulating wall of link, first linking arm, second linking arm inlay and establish the insulating wall, the up end of lateral wall with the up end face of link has the difference in height.

Preferably, in the foregoing embodiment, before injecting the insulating material into the first gap and the second gap, the method further includes: and punching out partial thickness of the edge positions of the first electrode and the second electrode, so that the upper parts of the first electrode and the second electrode form accommodating grooves for injection molding of insulating materials.

In one embodiment, "stamping and injection molding the processing unit to form the LED bracket protruding downward from the connecting frame" includes: extruding the processing unit to form a metal frame protruding downwards out of the connecting frame, wherein the metal frame comprises a bottom wall and a side wall arranged around the bottom wall in a surrounding mode, two first gaps penetrating to the bottom wall are formed in the side wall, the bottom wall is provided with a second gap communicated with the two first gaps, and the first gap and the second gap divide the metal frame into a first electrode and a second electrode; stamping the metal frame to enable the upper end face of the metal frame and the upper end face of the connecting frame to have a height difference so as to form the accommodating space; and injecting an insulating material into the first gap and the second gap to form the insulating interval structure, so as to manufacture the LED bracket.

Preferably, the step of pressing the processing unit to form a metal frame protruding downward from the connecting frame includes: punching two through holes penetrating through the upper surface and the lower surface of the processing unit; extruding and forming the metal frame by the processing unit punched with the through hole, wherein the through hole is extruded into the first gap; and punching the second gap in the bottom wall.

In order to achieve the second purpose, the invention discloses a manufacturing method of an LED lamp bead, which comprises the following steps: manufacturing the LED bracket by using the manufacturing method of the LED bracket; fixing an LED chip on the first electrode and/or the second electrode, and enabling pins of the LED chip to be correspondingly and electrically connected with the first electrode and the second electrode; and injecting fluorescent glue into the accommodating space to form a fluorescent powder glue layer which is upwards beyond the LED bracket.

Preferably, the glue scraping and encapsulating are performed by using a glue scraping plate, so that the upper surface of the fluorescent powder glue layer is flush with the upper surface of the connecting frame.

Compared with the prior art, the processing units perform stamping and injection molding to form the LED support protruding downwards from the connecting frame, a plurality of processing units are not required to be separated by cutting and separating gaps in the metal material belt, material waste caused by cutting and separating the gaps is reduced, and therefore more LED supports are manufactured on the metal material belt with the same area. Moreover, the upper end surface of the manufactured LED bracket and the upper end surface of the connecting frame have height difference, a containing space capable of containing fluorescent powder glue is formed by the height difference between the LED bracket and the connecting frame, the upper surface of the fluorescent powder glue layer is flush with the upper surface of the connecting frame in glue scraping and other modes, and the process is simple; meanwhile, the thickness of the side wall of the obtained LED support is small, blocking of a light source is reduced, all side faces and the top face of the fluorescent powder glue layer can emit light, and the light emitting face of the manufactured LED lamp bead is large.

In order to achieve the third purpose, the invention further discloses an LED lamp bead, which comprises an LED support, an LED chip and a fluorescent powder glue layer, wherein the LED support comprises a first electrode and a second electrode which are spaced apart, and an insulating spacing structure which is filled between the first electrode and the second electrode and is connected with the first electrode and the second electrode, the LED chip is fixed on the first electrode and/or the second electrode, pins of the LED chip are correspondingly and electrically connected with the first electrode or the second electrode, and the fluorescent powder glue layer covers the LED chip and upwards exceeds the LED support.

Compared with the prior art, the fluorescent powder glue layer of the LED lamp bead structure exceeds the LED support upwards, the side wall thickness of the LED support can be made thinner under the condition that the total thickness of the LED lamp bead is fixed, the blocking of the LED support to a light source is reduced, all side surfaces and the top surface of the fluorescent powder glue layer can emit light, and the light emitting surface of the LED lamp bead is larger.

In an embodiment, the LED support is in a sheet shape, and the LED support further includes an insulating wall located at the periphery of a structure formed by the first electrode, the second electrode, and the insulating spacer structure.

Preferably, the edge of the phosphor glue layer is flush with the outer periphery of the insulating wall.

Preferably, the first electrode comprises a first base portion and a first connecting arm connected to a middle portion of a side of the first base portion, which is far away from the second electrode, the second electrode comprises a second base portion and a second connecting arm connected to a middle portion of a side of the second base portion, which is far away from the first electrode, the insulating spacing structure is connected with the first base portion and the second base portion, and the first connecting arm and the second connecting arm are embedded in the insulating wall.

In an embodiment, the LED support includes a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall define a receiving cavity, the LED chip is disposed in the receiving cavity, the first electrode includes a first base portion and a first connecting arm, the second electrode includes a second base portion and a second connecting arm, the bottom wall includes the first base portion, the second base portion and the insulating partition structure, the side wall includes an insulating wall surrounding the first base portion and the second base portion, and the first connecting arm and the second connecting arm are embedded in the insulating wall.

Preferably, the first electrode includes two first connecting arms arranged at an interval, the second electrode includes two second connecting arms arranged at an interval, and each first connecting arm is opposite to one second connecting arm.

Preferably, the phosphor glue layer includes a first phosphor glue layer and a second phosphor glue layer, the first phosphor glue layer is filled in the accommodating groove, and the second phosphor glue layer is upward beyond the LED support.

In an embodiment, the LED support includes a metal frame and the insulating partition structure, the metal frame includes a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall form an accommodating groove, the LED chip is disposed in the accommodating groove, the side wall is formed with two first gaps penetrating to the bottom wall, the bottom wall has a second gap communicating the two first gaps, and the first gap and the second gap separate the metal frame into the first electrode and the second electrode.

Preferably, the phosphor powder glue film includes first phosphor powder glue film and second phosphor powder glue film, first phosphor powder glue film is filled in the holding tank, the second phosphor powder glue film upwards surpasss the LED support, just the edge of second phosphor powder glue film with the outside periphery parallel and level of lateral wall.

Drawings

Fig. 1 is a schematic structural diagram of a metal material tape.

Fig. 2 to 5 are manufacturing process diagrams of the first embodiment of the method for manufacturing an LED lamp bead of the present invention.

Fig. 6 is a schematic structural diagram of an LED lamp bead according to a first embodiment of the present invention.

Fig. 7 is an exploded schematic view of the LED lamp bead shown in fig. 6.

Fig. 8 is another exploded view of the LED lamp bead shown in fig. 6.

Fig. 9 is another angle of fig. 8.

Fig. 10 to 12 are manufacturing process diagrams of a second embodiment of the method for manufacturing an LED lamp bead of the present invention.

Fig. 13 is a schematic structural diagram of an LED lamp bead according to a second embodiment of the present invention.

Fig. 14 is an exploded structural schematic diagram of the LED lamp bead shown in fig. 13.

Fig. 15 to 19 are manufacturing process diagrams of a third embodiment of the LED support manufacturing method of the present invention.

Fig. 20 is a sectional view of a manufacturing process of the LED lamp bead manufacturing method of the present invention.

Fig. 21 is a schematic structural diagram of an LED holder according to a third embodiment of the present invention.

Fig. 22 is another angle of the LED cradle shown in fig. 21.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

In the description of the present invention, it should be understood that the terms "upper", "lower", "inner", "outer", "top", "bottom", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, which are merely for convenience of description and simplification of description, and thus, should not be construed as limiting the contents of the present invention.

The invention provides a method for manufacturing an LED bracket, a method for manufacturing an LED lamp bead, and

LED lamp beads

100, 100 'and 100'. As shown in fig. 6-7, 13-14 and 21-22, the

LED bead

100, 100', 100 "includes an

LED support

20, 20', 20", an

LED chip

30, 30', 30 "and a

phosphor glue layer

40, 40', 40", the

LED support

20, 20', 20 "includes a

first electrode

21, 21', 21" and a

second electrode

22, 22', 22 "which are spaced apart, and an

insulating spacer structure

23, 23', 23" filled between the

first electrode

21, 21', 21", and the

second electrode

22, 22', 22" and connecting the

first electrode

21, 21', 21", and the

second electrode

22, 22', 22". The

LED chip

30, 30', 30 "is fixed on the

first electrode

21, 21', 21" and/or the

second electrode

22, 22', 22", and the pins of the

LED chip

30, 30', 30" are electrically connected to one

electrode

21, 21', 21 "or the

second electrode

22, 22', 22", respectively, and the

phosphor glue layer

40, 40', 40 "covers the

LED chip

30, 30', 30" and extends upward beyond the

LED support

20, 20', 20". The manufacturing method of the LED lamp bead comprises the steps of manufacturing an LED support, fixing the crystal, welding wires and sealing glue.

The manufacturing steps of the

LED lamp beads

100, 100' comprise the steps of:

s1, providing a metal strip 10 (as shown in fig. 1), dividing the metal strip 10 into a plurality of

processing units

101, 101', 101 ″ and connecting

frames

102, 102', 102 ″ connected between the

processing units

101, 101', 101 ″ as shown in fig. 2, 10, 15. For example, the metal strip 10 is rectangular, and m ×

n processing units

101, 101', 101 ″ can be divided on the metal strip 10 according to the size and shape of the

LED support

20, 20', 20 ″ to be manufactured, where m and n respectively represent rows and columns.

<xnotran> S2, 101, 101', 101" 102, 102', 102"

LED

20, 20', 20",

LED

20, 20', 20" 102, 102', 102" ,

LED

20, 20', 20" 102, 102', 102" 201, 201', 201", 3, 10, 18 . </xnotran>

The die bonding step comprises: the LED chips 30, 30', 30 "are fixed on the

first electrodes

21, 21', 21" and/or the

second electrodes

22, 22', 22", as shown in fig. 5, 12, 20. Specifically, the LED chips 30, 30', 30 "may be fixed on the

first electrodes

21, 21', 21" and/or the

second electrodes

22, 22', 22 "by means of an adhesive or the like.

The wire welding step comprises: gold wires 50, 50 'are soldered between the pins of the LED chips 30, 30', 30 "and the

first electrodes

21, 21', 21" (positive electrodes) and the

second electrodes

22, 22', 22 "(negative electrodes), so that the positive pins of the LED chips 30, 30', 30" are electrically connected to the

first electrodes

21, 21', 21", and the negative pins of the LED chips 30, 30', 30" are electrically connected to the

second electrodes

22, 22', 22", as shown in fig. 5 and 12. In some embodiments, the wire bonding step may be omitted, and the

LED chip

30, 30', 30 "is directly attached to the

first electrode

21, 21', 21", the

second electrode

22, 22', 22 "with its pin in contact with the

first electrode

21, 21', 21", the

second electrode

22, 22', 22 "for electrical connection.

The sealing step comprises: injecting fluorescent glue into the

accommodating space

201, 201', 201 "to form the

fluorescent glue layer

40, 40', 40" extending upwards beyond the

LED support

20, 20', 20", as shown in fig. 5, 12, 20. Specifically, after the

accommodating spaces

201, 201', 201 ″ are filled with the fluorescent glue, the glue scraping and potting are performed by using a glue scraping plate, so that the upper surfaces of the fluorescent glue layers 40, 40', 40 ″ are flush with the upper surfaces of the connecting

frames

102, 102', 102 ″. Therefore, the fluorescent powder glue layers 40, 40 'and 40' of the manufactured

LED lamp beads

100, 100 'and 100' are ensured to be flat and consistent, and the processing technology is simple.

The following detailed description of the present invention will be made by taking specific embodiments as examples and with reference to the accompanying drawings:

example one

Referring to fig. 6 to 9, as shown in fig. 6, the LED support 20 is in a sheet shape, and includes a first electrode 21, a second electrode 22 spaced apart from the first electrode 21, an insulating spacer 23 filled between the first electrode 21 and the second electrode 22 and connecting the first electrode 21 and the second electrode 22, and an insulating wall 24 (as shown in fig. 7) located at the periphery of a structure formed by the first electrode 21, the second electrode 22, and the insulating spacer 23. The first electrode 21 has a first connecting arm 212 connected to the connecting frame 102, the second electrode 22 has a second connecting arm 222 connected to the connecting frame 102, and the ends of the first connecting arm 212 and the second connecting arm 222 are exposed on the insulating wall 24 (as shown in fig. 7 to 9).

In step S2, the step of "performing stamping and injection molding on the processing unit 101 to form the LED holder 20 protruding downward from the connecting frame 102" includes:

s21, punching a first slit 25 penetrating the processing unit 101, and dividing the processing unit 101 into a first region 1011 and a second region 1012 by the first slit 25; a part of the edge of the processing unit 101 is punched out to form a second gap 26 communicating with the first gap 25 between the processing unit 101 and the link 102, and the first region 1011 has a connecting bridge 1013 connecting the link 102 and the second region 1012 has a connecting bridge 1014 connecting the link 102, as shown in fig. 2.

S22, injecting an insulating material into the first gap 25 to form an insulating interval structure 23; the second slot 26 is injected with an insulating material to form an insulating wall 24 around the first region 1011, the second region 1012 and the insulating spacer structure 23, as shown in fig. 2.

S23, the processing unit 101 after the insulating material is injection-molded by stamping makes the processing unit 101 protrude downward from the connecting frame 102, so as to form the LED holder 20, as shown in fig. 3 and 4. The first area 1011 serves as the first electrode 21, the second area 1012 serves as the second electrode 22, the connecting bridge 1013 serves as the first connecting arm 212, and the connecting bridge 1014 serves as the second connecting arm 222 (as shown in fig. 7).

In the embodiment shown in fig. 2, the first slit 25 is punched in the processing unit 101, and then two second slits 26 are punched in the processing unit 101, wherein two ends of the first slit 25 are connected to the two second slits 26, the first slit 25 and the second slit 26 separate the first region 1011 and the second region 1012, and the connecting

bridges

1013, 1014 are spaced between the two second slits 26. Alternatively, in some embodiments, two second slits 26 may be punched in the processing unit 101, and then the first slit 25 may be punched in the processing unit 101. The first slit 25 and the two second slits 26 may be punched out simultaneously in the processing unit 101 by using a punching die having a plurality of punches.

In addition, in some embodiments, it is not limited to injecting the insulating material after the processing unit 101 punches the first slit 25 and the two second slits 26, but the insulating material may be injected into one of the first slit 25 and the second slit 26 after the processing unit 101 punches one of the first slit 25 and the second slit 26, and then the insulating material is injected into the other of the first slit 25 and the second slit 26 after the processing unit 101 punches the other of the first slit 25 and the second slit 26. For example, after the processing unit 101 punches the first slit 25, the insulating spacer structure 23 is formed by injecting an insulating material into the first slit 25, and then the processing unit 101 punches the second slit 26.

As shown in fig. 3 and 4, in this embodiment, the upper end surface of the LED holder 20 is flush with the lower end surface of the connecting frame 102. That is, the thickness of the connecting frame 102 is the height of the accommodating space 201, and for the same reason, the thickness of the connecting frame 102 is the thickness of the phosphor glue layer 40. Of course, the specific implementation is not limited to this, for example, the upper end surface of the LED holder 20 may be slightly higher than the lower end surface of the connecting frame 102.

Referring to fig. 2, further, before injecting the insulating material into the first gap 25 and the second gap 26 in step S2, the method further includes: punching out a part of the thickness of the edge positions of the first region 1011 and the second region 1012, so that the first region 1011 and the second region 1012 respectively have a base 1015 and a protrusion 1016 protruding upwards from the base, the height difference between the protrusion 1016 and the base 1015 forms a receiving groove 202 (as shown in fig. 8), and injecting an insulating material into the first gap 25, the second gap 26 and the receiving groove 202 to form the insulating spacer structure 23 and the insulating wall 24. Thereby, the insulating spacing structure 23 and the insulating wall 24 are combined with the first electrode 21 and the second electrode 22 more tightly; meanwhile, the LED support 20 has better moisture-proof effect.

Referring to fig. 2, 6 to 9, in the embodiment shown in fig. 6 to 9, the LED support 20 is rectangular, the first slit 25 is a strip extending along the width direction of the LED support 20, the second slit 26 includes a first strip-shaped slit 261 extending along the length direction of the LED support 20 and communicating with the first slit 25, and a second strip-shaped slit 262 connected to two ends of the first strip-shaped slit 261 and extending along the width direction of the LED support 20, and the two second slits 26 are symmetrically disposed along the central axis of the LED support 20, as shown in fig. 2. Accordingly, as shown in fig. 8, the insulating spacer structure 23 is a strip extending along the width direction of the LED support 20, and the insulating wall 24 has a rectangular outline and includes two first insulating walls 241 extending along the length direction of the LED support 20 and connected to two ends of the insulating spacer structure 23, and two second insulating walls 242 connected to two ends 241 of the two first insulating walls and extending along the width direction of the LED support 20.

Of course, the specific form of the first connecting arm 212, the second connecting arm 222, the first slit 25, the second slit 26, and the insulating wall 24 may be flexibly adjusted according to the requirement, for example, in some embodiments, the first connecting arm 212 and the second connecting arm 222 may also be a short side of the LED support 20, in this case, the second slit 26 is only a strip slit 261 extending along the length direction of the LED support 20, and correspondingly, the insulating wall 24 is composed of two first insulating walls 241 extending along the length direction of the LED support 20, and two ends of the two first insulating walls 241 are connected to the first connecting arm 212 and the second connecting arm 222, respectively.

Referring to fig. 8 and 9, the first electrode 21 includes a first base 211 and a first connecting arm 212 connected to a middle portion of a side of the first base 211 away from the second electrode 22; the second electrode 22 comprises a second base part 221 and a second connecting arm 222 connected to the middle of one side of the second base part 221 far away from the first electrode 21, the insulating partition structure 23 connects the first base part 211 and the second base part 221, and the first connecting arm 212 and the second connecting arm 222 are embedded in the insulating wall 24 (as shown in fig. 7).

As shown in fig. 7 to 9, specifically, the area of the first base portion 211 is larger than that of the second base portion 221, and the LED chip 30 is fixed to the first base portion 211. The first base 211 includes a first base 2111 and a first protrusion 2112 protruding upward from the first base 2111, and the second base 221 includes a second base 2211 and a second protrusion 2212 protruding upward from the second base 2211. The first connection arm 212 and the second connection arm 222 are step-shaped, one side of the first connection arm 212 close to the first base 2111 is flush with the first base 2111, one side of the first connection arm away from the first base 2111 is higher than the first base 2111, one side of the second connection arm 222 close to the second base 2211 is flush with the second base 2211, one side of the second connection arm away from the second base 2211 is higher than the second base 2211, and the accommodating grooves 202 are formed by the height difference among the first connection arm 212, the first protrusion 2112, the first base 2111, the second connection arm 222, the second protrusion 2212 and the second base 2211. Accordingly, the insulating wall 24 has a portion embedded in the accommodating groove 202, and finally, the insulating wall 24 and the insulating spacer 23 are flush with the first electrode 21 and the second electrode 22, so that the LED support 20 with a flat surface is obtained.

Referring to fig. 6, the edge of the phosphor glue layer 40 is flush with the periphery of the insulating wall 24. The light source emitted by the LED chip 30 can emit light from the periphery and the top surface of the fluorescent powder glue layer 40, and the light emitting surface of the LED lamp bead 100 is large. Of course, the specific implementation is not limited thereto.

Example two

Referring to fig. 13 to 14, as shown in fig. 14, the LED support 20 'is cup-shaped, and includes a bottom wall 203' and a sidewall 204 'surrounding the bottom wall 203', the bottom wall 203 'and the sidewall 204' define a receiving groove 205 'located below the receiving space 201', and the LED chip 30 'is disposed in the receiving groove 205'. The first electrode 21' includes a first base 211' and a first connecting arm 212', the second electrode 22' includes a second base 221' and a second connecting arm 222', the first connecting arm 212', the second connecting arm 222' are connected to the connecting frame 102', the bottom wall 203' includes a first base 211', a second base 221', and an insulating partition structure 23', the side wall 204' includes an insulating wall 24' surrounding the periphery of the first base 211', the second base 221' and connected to the connecting frame 102', the first connecting arm 212', the second connecting arm 222' are embedded in the insulating wall 24', and the upper end surface of the side wall 204' has a height difference with the upper end surface of the connecting frame 102 '.

In step S2, "stamping and injection molding the processing unit 101 'to form the LED holder 20' protruding downward from the connecting frame 102" includes:

s21, the processing unit 101 'is punched with a first slit 25' penetrating therethrough, and the processing unit 101 'is divided into a first region 1011' and a second region 1012 'by the first slit 25', as shown in fig. 10.

S22, a portion of the edge of the processing unit 101' is punched out to form a second gap 26' communicating with the first gap 25' between the processing unit 101' and the link 102', and the first region 1011' has a connection bridge 1013' connecting the link 102', and the second region 1012' has a connection bridge 1014' connecting the link 102', as shown in fig. 10.

S23, the press working unit 101' causes the working unit 101' to protrude downward from the connecting frame 102', as shown in fig. 10 and 11. In which the first region 1011 'serves as the first electrode 21', the second region 1012 'serves as the second electrode 22', the connecting bridge 1013 'serves as the first connecting arm 212', and the connecting bridge 1014 'serves as the second connecting arm 222', as shown in fig. 10.

S24, injecting an insulating material into the first gap 25' to form an insulating spacer structure 23', and injecting an insulating material into the second gap 26' to form an insulating wall 24', thereby forming the LED support 20', as shown in fig. 10.

In the sealing step, phosphor paste is added to the accommodating space 201 'of the LED support 20', and the accommodating groove 205 'and the accommodating space 201' are filled with the phosphor paste, so as to form a first phosphor paste layer 41 'located in the accommodating groove 205' and a second phosphor paste layer 42 'located in the accommodating space 201', and the upper surface of the phosphor paste layer 40 'is flush with the upper surface of the connecting frame 102' by performing the scraping and sealing with a scraping plate (as shown in fig. 12). Therefore, the fluorescent powder glue layers 40 'of the manufactured LED lamp beads 100' are smooth and consistent, and the processing technology is simple. Of course, the specific implementation is not limited thereto.

In the embodiment shown in fig. 10, a first slit 25' is punched in the processing unit 101', and two second slits 26' are punched in the processing unit 101', wherein two ends of the first slit 25' are connected to the two second slits 26', the first slit 25' and the second slit 26' separate the first area 1011' and the second area 1012', and the two second slits 26' are separated by the connecting bridges 1013' and 1014'. Alternatively, in some embodiments, two second slits 26 'may be punched in the processing unit 101', and then the first slit 25 'may be punched in the processing unit 101'. Alternatively, the first slit 25' and the two second slits 26' may be punched out simultaneously in the processing unit 101' by using a punching die having a plurality of punches.

In addition, in some embodiments, it is not limited to injecting the insulating material after the processing unit 101' punches the first slit 25' and the two second slits 26', but the insulating material may be injected into one of the first slit 25' and the second slit 26' after the processing unit 101' punches one of the first slit 25' and the second slit 26', and then the other of the first slit 25' and the second slit 26' is punched out of the processing unit 101', and then the insulating material is injected into the other of the first slit 25' and the second slit 26'. For example, after the processing unit 101 'punches the first slit 25', the insulating spacer structure 23 'is formed by injecting an insulating material into the first slit 25', and then the processing unit 101 'punches the second slit 26'.

Referring to fig. 10, further, before step S23, step S2 further includes: the edge positions of the first region 1011' and the second region 1012' are punched out by a part of thickness, so that the first region 1011' and the second region 1012' respectively have a base 1015' and a protruding part 1016' protruding upwards from the base 1015', the height difference between the protruding part 1016' and the base 1015' forms a receiving groove 202', and insulating materials are injected into the first gap 25', the second gap 26' and the receiving groove 202' to form an insulating interval structure 23' and an insulating wall 24'. Thereby, the insulating spacer structure 23', the insulating wall 24' and the first electrode 21', the second electrode 22' can be bonded more tightly; meanwhile, the LED support 20' has better moisture-proof effect.

Referring to fig. 13 and 14, in a difference from the first embodiment, the first electrode 21 'includes two first connecting arms 212' spaced apart from each other, the second electrode 22 'includes two second connecting arms 222' spaced apart from each other, and each of the first connecting arms 212 'is opposite to one of the second connecting arms 222'. Accordingly, the second slit 26' is a U-shaped slit communicating with the first slit 25', and the two first connecting arms 212' and the two second connecting arms 222' are separated by a strip-shaped slit 27' (as shown in fig. 10).

EXAMPLE III

Referring to fig. 20 to 22, as shown in fig. 21, the LED support 20 "is cup-shaped, and includes a metal frame 210" and an insulating spacer 23", the metal frame 210" includes a bottom wall 203 "and a sidewall 204 surrounding the bottom wall 203", the bottom wall 203 "and the sidewall 204" surround a receiving cavity 205", the LED chip 30" is disposed in the receiving cavity 205 "(as shown in fig. 20), the sidewall 204" forms two first slits 25 penetrating to the bottom wall 203", the bottom wall 203" has a second slit 26 communicating the two first slits 25", and the first slit 25" and the second slit 26 "separate the metal frame 210" into a first electrode 21 "and a second electrode 22" (as shown in fig. 18).

In step S2, the step of stamping and injection molding the processing unit 101 to form the LED bracket 20 "protruding downward from the connecting frame 102" includes:

s21, two through holes 1017 "are punched through the upper and lower surfaces of the processing unit 101", as shown in fig. 15.

S22, the processing unit 101 ″ punched with the through hole 1017 ″ is extruded along the boundary line P (non-real line) and the extrusion line Q (non-real line) to form a metal frame 210 ″ protruding downward from the connecting frame 102 ″ and the top of the sidewall 204 ″ of the metal frame 210 ″ is connected to the connecting frame 102 ″ as shown in fig. 16. In step S22, in the process of extruding the processing unit 101 "to form the metal frame 210", the processing unit 101 "may be drawn or not drawn.

S23, the second slit 26 "communicating the two first slits 25" is punched out of the bottom wall 203 "of the metal frame 210", so that the metal frame 210 "is divided into the first electrode 21" and the second electrode 22 "by the two first slits 25" and the second slit 26", as shown in fig. 17.

S24, stamping the metal frame 210", so that the upper end face of the metal frame 210" has a height difference with the upper end face of the connecting frame 102 "to form a containing space 201", as shown in FIG. 18.

S25, injecting an insulating material into the first gap 25 ″ and the second gap 26 ″ to form an insulating spacer structure 23 ″ to form the LED support 20 ″ as shown in fig. 19.

In this embodiment, two through holes 1017 are punched in the processing unit 101 "in advance to form the first slit 25" on the metal frame 210 "before the extrusion, which is less difficult to process than punching the first slit 25" on the side wall 204 "after the extrusion of the metal frame 210". Alternatively, in some embodiments, the sequence of steps S21, S22, S23 and the sequence of steps S24, S25 may also be adjusted, for example, after the metal frame 210 "is extruded from the processing unit 101", two first slits 25 "are punched on the side wall 204". The extrusion line Q crosses the through hole 1017", and the metal frame 210" is extruded along the middle of the through hole 1017 ". That is, the first slit 25 "includes a side wall slit 251" at the side wall 204 "and a bottom wall slit 252" (shown in fig. 17) at the bottom wall 203 "and communicating with the side wall slit 251". Of course, in other embodiments, the pressing line Q may be located at the edge of the through hole 1017", in which case, the first slit 25" formed by pressing the through hole 1017 "is only located on the side wall 204" of the metal frame 210".

In the molding step, phosphor glue is added to the accommodating space 201 "of the LED support 20", and the accommodating groove 205 "and the accommodating space 201" are filled with the phosphor glue, so as to form a first phosphor glue layer 41 "located in the accommodating groove 205" and a second phosphor glue layer 42 "located in the accommodating space 201", and a glue scraping plate is used to perform glue scraping and encapsulation, so that the upper surface of the phosphor glue layer 40 "is flush with the upper surface of the connecting frame 102" (as shown in fig. 20). Therefore, the fluorescent powder glue layers 40 'of all the manufactured LED lamp beads 100' are ensured to be flat and consistent, and the processing technology is simple. Of course, the specific implementation is not limited thereto.

Referring to fig. 21 and 22, as shown in fig. 21, the sidewall 204 "has four sides, and two first slits 25" are respectively disposed on two opposite sides of the sidewall 204 "and are opposite to each other (as shown in fig. 17). The second gap 26", the sidewall gap 251" and the bottom wall gap 252 "are rectangular, and the width of the first gap 25" is greater than that of the second gap 26", so that the connection area between the two electrodes 21", 22 "and the insulating spacer structure 23" is increased, and the structural strength of the LED support 20 "is improved. Alternatively, the width of the first slit 25 "may be the same as the width of the second slit 26", the two first slits 25 "may be disposed not to face each other, and the second slit 26" may have another shape, such as a broken line shape. Accordingly, the insulating spacer 23 "also includes a rectangular first insulating spacer 231" filled in the two sidewall slots 251 "and an" i "second insulating spacer 232" filled in the two bottom wall slots 252 "and the second slot 26" (as shown in fig. 8). In addition, in the embodiment shown in fig. 21 and 22, the two first slits 25 "and the two second slits 26" are used to divide the metal frame 210 "into the two electrodes 21" and 22 "which are not equally divided, and in other embodiments, the two first slits 25" and the two second slits 26 "may be respectively located at the middle positions of the side wall 204" and the bottom wall 203 "to divide the metal frame 210" into two identical electrodes equally.

In summary, the

processing units

101, 101', 101 ″ of the present invention perform stamping and injection molding to form the LED supports 20, 20', 20 ″ protruding downward from the connecting

frames

102, 102', 102 ″, so that there is no need to cut a plurality of

processing units

101, 101', 101 ″ into the metal strip 10 to separate them, and waste of material due to the cutting of the separation gaps is reduced, thereby manufacturing more LED supports 20, 20', 20 ″ on the same area of the metal strip 10. <xnotran> ,

LED

20, 20', 20" 102, 102', 102" ,

LED

20, 20', 20" 102, 102', 102" 201, 201', 201", 40, 40', 40" 102, 102', 102" , ; </xnotran> Meanwhile, the thickness of the insulating wall 24, 24 '/the side wall 204', 204 'of the obtained LED support 20, 20' is thinner, so that the blocking to a light source is reduced, all side surfaces and top surfaces of the fluorescent powder glue layers 40, 40 'and 40' can emit light, and light emitting surfaces of the manufactured

LED lamp beads

100, 100 'and 100' are large.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.

Claims

1. A method for manufacturing an LED support is characterized by comprising the following steps:

providing a metal material belt, dividing the metal material belt into a plurality of processing units and connecting frames connected among the processing units;

stamping and injection molding are carried out on the processing unit to form an LED bracket protruding downwards out of the connecting frame, the upper end face of the LED bracket and the upper end face of the connecting frame have a height difference, and the height difference between the LED bracket and the connecting frame forms an accommodating space; the LED support comprises a first electrode, a second electrode and an insulating spacing structure, wherein the first electrode and the second electrode are spaced, and the insulating spacing structure is filled between the first electrode and the second electrode and is used for connecting the first electrode and the second electrode.

2. The method of claim 1, wherein the LED support is in the form of a sheet, and the step of stamping and injection molding the processing unit to form the LED support protruding downward from the connecting frame comprises:

punching a first slit through the processing unit, wherein the first slit divides the processing unit into a first electrode and a second electrode;

injecting an insulating material into the first gap to form the insulating interval structure;

and the processing unit after the insulating material is punched and injected enables the processing unit to downwards protrude out of the connecting frame to manufacture the LED bracket.

3. The method according to claim 2, wherein the LED holder further comprises an insulating wall around the first electrode, the second electrode and the insulating spacer, and before the processing unit protrudes downward from the connection frame after the step of stamping and injecting the insulating material,

punching out part of the edge of the processing unit to form a second gap between the processing unit and the connecting frame, wherein the first electrode is provided with a first connecting arm connected with the connecting frame, and the second electrode is provided with a second connecting arm connected with the connecting frame;

and injecting an insulating material into the second gap to form the insulating wall, wherein the first connecting arm and the second connecting arm are embedded in the insulating wall.

4. The method of manufacturing an LED holder according to claim 3, wherein an upper end surface of the LED holder is flush with a lower end surface of the connection holder.

5. The method of claim 1, wherein the step of stamping and injection molding the processing unit to form the LED support protruding downward from the connecting frame comprises the steps of:

punching out a part of the edge of the processing unit to form a second gap between the processing unit and the connecting frame, wherein the first electrode is provided with a first connecting arm connected with the connecting frame, and the second electrode is provided with a second connecting arm connected with the connecting frame;

stamping the processing unit to enable the processing unit to downwards protrude out of the connecting frame;

and injecting an insulating material into the first gap to form the insulating interval structure, and injecting an insulating material into the second gap to form an insulating wall to manufacture the LED bracket.

6. The method according to claim 5, wherein the LED support comprises a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall surround a receiving groove located below the receiving space, the first electrode comprises a first base portion and the first connecting arm, the second electrode comprises a second base portion and the second connecting arm, the bottom wall comprises the first base portion, the second base portion and the insulating partition structure, the side wall comprises the insulating wall surrounding the first base portion and the second base portion and connected with the connecting frame, the first connecting arm and the second connecting arm are embedded in the insulating wall, and an upper end surface of the side wall has a height difference with an upper end surface of the connecting frame.

7. The method for manufacturing an LED support according to any one of claims 3 to 6, further comprising, before injecting the insulating material into the first and second slits:

and punching out partial thickness of the edge positions of the first electrode and the second electrode, so that the upper parts of the first electrode and the second electrode form accommodating grooves for injection molding of insulating materials.

8. The method of claim 1, wherein the step of stamping and injection molding the processing unit to form the LED support protruding downward from the connecting frame comprises the steps of:

extruding the processing unit to form a metal frame protruding downwards from the connecting frame, wherein the metal frame comprises a bottom wall and a side wall arranged around the bottom wall, two first gaps penetrating through the side wall to the bottom wall are formed in the side wall, the bottom wall is provided with a second gap communicating the two first gaps, and the first gap and the second gap divide the metal frame into a first electrode and a second electrode;

stamping the metal frame to enable the upper end face of the metal frame and the upper end face of the connecting frame to have a height difference so as to form the accommodating space;

and injecting an insulating material into the first gap and the second gap to form the insulating interval structure, so as to manufacture the LED bracket.

9. The method of claim 8, wherein extruding the processing unit to form a metal frame protruding downward from the connecting frame comprises:

punching two through holes penetrating through the upper surface and the lower surface of the processing unit;

extruding and forming the metal frame by the processing unit punched with the through hole, wherein the through hole is extruded into the first gap;

and punching the second gap in the bottom wall.

10. The manufacturing method of the LED lamp bead is characterized by comprising the following steps:

manufacturing an LED support using the LED support manufacturing method according to any one of claims 1 to 9;

fixing an LED chip on the first electrode and/or the second electrode, and enabling pins of the LED chip to be correspondingly and electrically connected with the first electrode and the second electrode;

and injecting fluorescent glue into the accommodating space to form a fluorescent glue layer which is upwards beyond the LED bracket.

11. The method for manufacturing an LED lamp bead according to claim 10, wherein a squeegee is used for squeegee potting so that an upper surface of the phosphor glue layer is flush with an upper surface of the connection frame.

12. The utility model provides a LED lamp pearl, its characterized in that includes LED support, LED chip and phosphor powder glue film, the LED support include spaced apart first electrode and second electrode and fill in connect between first electrode, the second electrode the insulating interval structure of first electrode, second electrode, the LED chip is fixed first electrode and/or on the second electrode, just the pin of LED chip corresponds the electricity and connects first electrode or second electrode, the phosphor powder glue film hides and covers the LED chip just upwards surpasss the LED support.

13. The LED lamp bead of claim 12, wherein the LED support is in the form of a sheet, and further comprising an insulating wall located around the first electrode, the second electrode, and the insulating spacer structure.

14. The LED lamp bead of claim 13, wherein an edge of the phosphor glue layer is flush with an outer peripheral edge of the insulating wall.

15. The LED lamp bead of claim 13, wherein the first electrode comprises a first base portion and a first connecting arm connected to a middle portion of a side of the first base portion away from the second electrode, the second electrode comprises a second base portion and a second connecting arm connected to a middle portion of a side of the second base portion away from the first electrode, the insulating spacer structure is connected to the first base portion and the second base portion, and the first connecting arm and the second connecting arm are embedded in the insulating wall.

16. The LED lamp bead of claim 12, wherein the LED support includes a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall define a receiving cavity, the LED chip is disposed in the receiving cavity, the first electrode includes a first base portion and a first connecting arm, the second electrode includes a second base portion and a second connecting arm, the bottom wall includes the first base portion, the second base portion and the insulating partition structure, the side wall includes an insulating wall surrounding the first base portion and the second base portion, and the first connecting arm and the second connecting arm are embedded in the insulating wall.

17. The LED lamp bead of claim 16, wherein said first electrode includes two spaced apart said first connecting arms, said second electrode includes two spaced apart said second connecting arms, each of said first connecting arms facing a said second connecting arm.

18. The LED lamp bead of claim 16, wherein the phosphor glue layer includes a first phosphor glue layer and a second phosphor glue layer, the first phosphor glue layer is filled in the receiving groove, and the second phosphor glue layer extends upward beyond the LED support.

19. The LED lamp bead according to claim 12, wherein the LED support includes a metal frame and the insulating partition structure, the metal frame includes a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall form a receiving groove, the LED chip is disposed in the receiving groove, two first slits penetrating through the side wall to the bottom wall are formed on the side wall, the bottom wall has a second slit communicating the two first slits, and the first slit and the second slit separate the metal frame into the first electrode and the second electrode.