CN115515311A - Electronic device and method for manufacturing the same - Google Patents
Electronic device and method for manufacturing the same Download PDFInfo
- Publication number
- CN115515311A CN115515311A CN202211302131.6A CN202211302131A CN115515311A CN 115515311 A CN115515311 A CN 115515311A CN 202211302131 A CN202211302131 A CN 202211302131A CN 115515311 A CN115515311 A CN 115515311A
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- conductive adhesive
- component
- circuit board
- block
- bonding pad
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application provides an electronic device and a preparation method thereof. The first component is arranged on the substrate; the second component and the first component are arranged on the same surface of the substrate at intervals. The circuit board is disposed on the first member and the second member, and includes a first pad and a second pad disposed facing the substrate. The first conductive adhesive layer is arranged between the first component and the first bonding pad. The second conductive adhesive layer is arranged between the second component and the second bonding pad. The supporting block is arranged on the substrate and located between the first part and the second part, the height of the supporting block is equal to the sum of the height of the first part, the height of the first conductive adhesive layer and the height of the first bonding pad, and the height of the supporting block is also equal to the sum of the height of the second part, the height of the second conductive adhesive layer and the height of the second bonding pad.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to an electronic device and a method for manufacturing the same.
Background
At present, when a sensor (such as a pressure sensor, a vibration sensor or a CMOS sensor) is manufactured by using a piezoelectric material (such as PZT, lead zirconate titanate piezoelectric ceramic), at least two piezoelectric materials are generally used, and an electrical connection between the two piezoelectric materials is realized through a circuit board so as to realize signal transmission between the two piezoelectric materials.
In the prior art, a conductive adhesive is generally disposed on the top surfaces of the circuit board and the piezoelectric material, respectively, so as to electrically connect the circuit board and the piezoelectric material. However, in the actual manufacturing process, the conductive adhesive is easy to peel off, so that poor contact exists between the circuit board and the piezoelectric material.
Disclosure of Invention
In view of the above, the present application provides an electronic device and a method for manufacturing the same.
In order to achieve the above object, the present application provides an electronic device including a substrate, a first member, a second member, a circuit board, a first conductive adhesive layer, a second conductive adhesive layer, and a supporting block. A first member disposed on the substrate; the second component and the first component are arranged on the same surface of the substrate at intervals. A circuit board is disposed on the first and second components, the circuit board including first and second pads disposed facing the substrate. The first conductive adhesive layer is arranged between the first component and the first bonding pad. The second conductive adhesive layer is arranged between the second component and the second bonding pad. The supporting block is arranged on the substrate and located between the first part and the second part, the height of the supporting block is equal to the sum of the height of the first part, the height of the first conductive adhesive layer and the height of the first bonding pad, and the height of the supporting block is also equal to the sum of the height of the second part, the height of the second conductive adhesive layer and the height of the second bonding pad.
In some possible implementations, the support block includes an insulating glue.
In some possible implementations, the circuit board includes a first portion, a second portion, and a third portion connected between the first portion and the second portion, the third portion is disposed on the first member and the second member, the first pad and the second pad are both located on the third portion, the first member includes a first side surface away from the second member, the second member includes a second side surface away from the first member, the first portion is disposed on the first side surface, and the second portion is disposed on the second side surface.
In some possible implementations, along a direction perpendicular to the first portion to the second portion, a plurality of first through holes are provided at intervals at a joint of the first portion and the third portion, and a plurality of second through holes are provided at intervals at a joint of the second portion and the third portion.
In some possible implementation manners, a first rubber block is further arranged between the first portion and the first side surface, and a second rubber block is arranged between the second portion and the second side surface.
In some possible implementations, the first block of glue extends to a junction of the first portion and the third portion, and the second block of glue extends to a junction of the second portion and the third portion.
In some possible implementations, the length of the third portion is equal to a sum of a distance from the first side surface to the second side surface, a thickness of the first glue block, and a thickness of the second glue block.
The present application also provides a method for manufacturing an electronic device, comprising: providing a first component, a second component, a supporting block, a substrate and a circuit board, wherein the circuit board comprises a first bonding pad and a second bonding pad, a first conductive adhesive is arranged on the first component, and a second conductive adhesive is arranged on the second component; and arranging the first part and the second part on the substrate at intervals. Fixing the supporting block between the first bonding pad and the second bonding pad of the circuit board, placing the supporting block fixed on the circuit board between the first component and the second component, and making the first bonding pad correspond to the first conductive adhesive of the first component and the second bonding pad correspond to the second conductive adhesive of the second component. And applying pressure to the circuit board to enable the first conductive adhesive to connect the first bonding pad and the first component to obtain a first conductive adhesive layer, and enable the second conductive adhesive to connect the second bonding pad and the second component to obtain a second conductive adhesive layer.
In some possible implementations, the preparation method further includes: dividing the circuit board into a first portion, a second portion, and a third portion connected between the first portion and the second portion, the third portion being disposed on the first component and the second component; the second portion and the first member include a first side distal from the second member, and the second member includes a second side distal from the first member. Respectively pasting a first glue block and a second glue block on the surfaces of the first part and the second part facing the substrate, bending the first part along the joint of the first part and the third part and pasting the first part on the first side surface through the first glue block, and bending the second part along the joint of the second part and the third part and pasting the second part on the second side surface through the second glue block.
In some possible implementations, the bending specifically includes the following steps: the circuit board is pressed by a pressing head, the pressing head comprises a pressing block and two convex blocks arranged on the same surface of the pressing block, the pressing block and the two convex blocks form a groove, and the third portion is accommodated in the groove; and moving the pressure head along the direction from the third part to the substrate, so that the first part and the second part gradually draw close to the first side surface and the second side surface respectively until the first part is attached to the first side surface and the second part is attached to the second side surface.
Through set up the supporting shoe between circuit board and base plate in this application, not only play the effect of supporting the circuit board, but also make first conducting resin with the second conducting resin keeps certain height, reduces the deformation of first conducting resin and second conducting resin, maintains the thickness of first conducting resin and second conducting resin for the area of contact between circuit board and first conducting resin and the second conducting resin keeps stable, thereby improves the bad contact's phenomenon between circuit board and first part and the second part.
Drawings
Fig. 1 is a schematic cross-sectional view of an electronic device provided in the present application.
Fig. 2 is a top view of the circuit board shown in fig. 1 when unfolded.
Fig. 3 is a schematic cross-sectional view of the first, second and third portions of the circuit board shown in fig. 1.
Fig. 4 is a top view of the first and second components provided herein mounted on a substrate.
Fig. 5 is a schematic cross-sectional view illustrating that the supporting block, the first rubber block and the second rubber block provided by the present application are fixed on the circuit board.
Fig. 6 is a top view of the structure shown in fig. 5 placed on the structure shown in fig. 4.
Fig. 7 is a schematic cross-sectional view illustrating a process of placing the structure shown in fig. 6 on a machine table and pressing the structure by a pressing head.
Description of the main elements
First through hole 46
Second via hole 47
First conductive adhesive layer 51
Second conductive adhesive layer 52
First conductive paste 71
Second conductive paste 72
Indenter 200
Bump 220
Groove 230
Detailed Description
The following describes in detail embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1, the present application provides an electronic device 100 including a substrate 10, a first component 20, a second component 30, a circuit board 40, a first conductive adhesive layer 51, a second conductive adhesive layer 52, and a supporting block 60. The first member 20, the second member 30 and the supporting block 60 are disposed on the same surface of the substrate 10. A support block 60 is located between the first member 20 and the second member 30. The circuit board 40 is disposed on the first member 20, the second member 30 and the supporting block 60. The first conductive adhesive layer 51 is disposed between the circuit board 40 and the first component 20, and the electrical connection between the first component 20 and the circuit board 40 is achieved through the first conductive adhesive layer 51. The second conductive adhesive layer 52 is disposed between the circuit board 40 and the second component 30, and the second conductive adhesive layer 52 is used to electrically connect the second component 30 and the circuit board 40, so as to transmit signals between the first component 20 and the second component 30.
In some embodiments, the electronic device 100 may be a pressure sensor, a vibration sensor, a CMOS sensor, or the like; or filters, resonators, etc., but not limited thereto.
Referring to fig. 1, the circuit board 40 includes a first pad 44 and a second pad 45 disposed facing the substrate 10, the first pad 44 and the second pad 45 are disposed at an interval, and the circuit board 40 is electrically connected to the first part 20 through the first pad 44 and electrically connected to the second part 30 through the second pad 45. The height H of the supporting block 60 is equal to the sum of the height H1 of the first part 20, the height H2 of the first conductive paste layer 51 and the height H3 of the first pads 44, and is also equal to the sum of the height H4 of the second part 30, the height H5 of the second conductive paste layer 52 and the height H6 of the second pads 45. That is, the supporting block 60 is disposed between the substrate 10 and the circuit board 40, and not only supports the circuit board 40, but also maintains the height of the first conductive adhesive layer 51 and the height of the second conductive adhesive layer 52, and reduces the deformation of the first conductive adhesive layer 51 and the second conductive adhesive layer 52, so that the contact area between the circuit board 40 and the first conductive adhesive layer 51 and the second conductive adhesive layer 52 is kept stable, and the phenomenon of poor contact between the circuit board 40 and the first component 20 and the second component 30 is improved.
In some embodiments, in order to dissipate heat generated from the first and second members 20 and 30, the substrate 10 is generally made of a metal material to dissipate heat from the first and second members 20 and 30. The supporting block 60 in the present application can also prevent the first and second conductive adhesive layers 51 and 52 from overflowing along the outer walls of the corresponding first and second components 20 and 30 and flowing toward the substrate 10, so that a short circuit phenomenon occurs between the circuit board 40 and the substrate 10.
In some embodiments, the supporting block 60 includes an insulating adhesive, such as a pressure sensitive adhesive, and the supporting block 60 not only can support the circuit board 40, but also can adhere the supporting block 60 to the substrate 10 and the circuit board 40.
Referring to fig. 2 and 3, in some embodiments, circuit board 40 includes a first portion 41, a second portion 42, and a third portion 43 connected between first portion 41 and second portion 42. The third portion 43 is provided on the first member 20 and the second member 30, and the first pad 44 and the second pad 45 are located on the third portion 43. The first member 20 includes a first side 21 remote from the second member 30, the second member 30 includes a second side 31 remote from the first member 20, the first portion 41 is disposed on the first side 21, and the second portion 42 is disposed on the second side 31. The stability of the adhesion between the first conductive adhesive layer 51 and the first pad 44 and the first member 20, respectively, and the stability of the adhesion between the second conductive adhesive layer 52 and the second pad 45 and the second member 30, respectively, can be further enhanced by correspondingly fixing the first portion 41 and the second portion 42 of the circuit board 40 to the first side surface 21 and the second side surface 31, so that the phenomenon of poor contact between the circuit board 40 and the first member 20 and the second member 30 due to low peeling force of the first conductive adhesive layer 51 and the second conductive adhesive layer 52 itself can be improved.
In some embodiments, the circuit board 40 is a rigid-flex board, the third portion 43 is a flexible board, and the first portion 41 and the second portion 42 are both rigid boards. In some embodiments, first portion 41, second portion 42, and third portion 43 are all soft plates.
In some embodiments, a first glue 61 is disposed between the first portion 41 and the first side 21, and a second glue 62 is disposed between the second portion 42 and the second side 31. The first portion 41 and the second portion 42 can be adhered to the corresponding first side surface 21 and the corresponding second side surface 31 through the first rubber block 61 and the second rubber block 62, and the first rubber block 61 and the second rubber block 62 can prevent the rubber in the first conductive adhesive layer 51 and the second conductive adhesive layer 52 from overflowing from the corresponding connection position of the first portion 41 and the first side surface 21 and the connection position of the second portion 42 and the second side surface 31, so that the phenomenon of short circuit caused by the electric connection of the circuit board 40 and the substrate 10 is overcome.
In some embodiments, the first block of glue 61 extends to the junction of the first portion 41 and the third portion 43, and the second block of glue 62 extends to the junction of the second portion 42 and the third portion 43. With the arrangement, a supporting force can be provided for the first portion 41 and the second portion 42, and the problem that the joint between the third portion 43 and the first conductive adhesive layer 51 or between the third portion 43 and the second conductive adhesive layer 52 is poor due to the fact that the joint between the third portion 43 and the first conductive adhesive layer 51 or between the third portion 43 and the second conductive adhesive layer 52 is pulled due to the deformation of the joint between the first portion 41 and the third portion 43 or between the second portion 42 and the third portion 43 is avoided.
Referring to fig. 2 and 3, in some embodiments, along a direction perpendicular to the first portion 41 and the second portion 42, a plurality of first through holes 46 are formed at intervals at a joint of the first portion 41 and the third portion 43, and a plurality of second through holes 47 are formed at intervals at a joint of the second portion 42 and the third portion 43. The arrangement of the first through hole 46 and the second through hole 47 can deepen the bending between the third portion 43 and the first portion 41, and between the third portion 43 and the second portion 42, reduce the acting force at the bending position between the third portion 43 and the first portion 41 and the acting force at the bending position between the third portion 43 and the second portion 42, and further improve the bonding strength between the first portion 41 and the first rubber block 61 and between the second portion 42 and the second rubber block 62. In particular during the preparation process, it is also convenient to achieve a bending of the first portion 41 and the second portion 42, respectively, compared to the third portion 43. In some embodiments, the first and second through- holes 46, 47 may be postage stamp holes. In some embodiments, the connection between the first portion 41 and the third portion 43 and the connection between the second portion 42 and the third portion 43 may not be provided with through holes, and the connection between the first portion 41 and the third portion 43 and the connection between the second portion 42 and the third portion 43 may be provided with creases along a direction perpendicular to the direction from the first portion 41 to the second portion 42.
Referring to fig. 2 and 3, in some embodiments, the length L of the third portion 43 is equal to the sum of the distance I from the first side surface 21 to the second side surface 31, the thickness d1 of the first rubber block 61, and the thickness d2 of the second rubber block 62. The arrangement reduces the acting force between the third part 43 and the first part 41 or the second part 42, and improves the stability of the first part 41 and the second part 42 respectively adhered to the first side surface 21 and the second side surface 31.
In some embodiments, the first member 20 and the second member 30 are both piezoelectric materials, for example, the first member 20 and the second member 30 may be a lead zirconate titanate piezoelectric ceramic, a transparent ferroelectric piezoelectric ceramic, a niobate piezoelectric ceramic, or a barium titanate piezoelectric ceramic, etc., but not limited thereto. The first conductive adhesive layer 51 and the second conductive adhesive layer 52 are both silver paste. The first glue block 61 and the second glue block 62 are both pressure sensitive glue.
The present application also provides a method of manufacturing an electronic device 100, comprising the steps of:
s1, referring to fig. 4, the first member 20 and the second member 30 are fixed to the substrate 10 with a space therebetween.
S2, referring to fig. 5 and 6, the circuit board 40 is divided into a first portion 41, a second portion 42, and a third portion 43 connected between the first portion 41 and the second portion 42, the third portion 43 is disposed on the first member 20 and the second member 30, and a plurality of first through holes 46 and a plurality of second through holes 47 are cut at a connection portion between the first portion 41 and the third portion 43 and a connection portion between the second portion 42 and the third portion 43.
S3, referring to fig. 6 and 7, the supporting block 60 is fixed between the first pad 44 and the second pad 45 of the third portion 43, the first conductive adhesive 71 is disposed on the first component 20, the second conductive adhesive 72 is disposed on the second component 30, the first adhesive block 61 and the second adhesive block 62 are respectively fixed to the corresponding first portion 41 and the second portion 42, the supporting block 60 fixed to the circuit board 40 is placed between the first component 20 and the second component 30, the first pad 44 and the second pad 45 respectively correspond to the first conductive adhesive 71 and the second conductive adhesive 72, the supporting block 60 is fixed on the substrate 10 by applying pressure between the circuit board 40 and the substrate 10, the first conductive adhesive 71 connects the first pad 44 and the first component 20 to obtain the first conductive adhesive layer 51, and the second conductive adhesive 72 connects the second pad 45 and the second component 30 to obtain the second conductive adhesive layer 52. The first portion 41 is bent along the joint between the first portion 41 and the third portion 43, and the first portion 41 is adhered to the first side surface 21 by the first adhesive tape 61, and the second portion 42 is bent along the joint between the second portion 42 and the third portion 43, and the second portion 42 is adhered to the second side surface 31 by the second adhesive tape 62.
Referring to fig. 7, in some embodiments, the components assembled in step S3 are placed on a machine 300, and a press head 200 is used to press the circuit board 40. The bending process is specifically that the pressing head 200 includes a pressing block 210 and two bumps 220 disposed on the same surface of the pressing block 210, the pressing block 210 and the two bumps 220 form a groove 230, the third portion 43 is accommodated in the groove 230, and the pressing head 200 moves along the direction from the third portion 43 to the substrate 10, so that the first portion 41 and the second portion 42 gradually get close to the first side surface 21 and the second side surface 31 along the first through hole 46 and the second through hole 47 and bend until the first portion 41 is attached to the first side surface 21 and the second portion 42 is attached to the second side surface 31.
In some embodiments, the applied pressure is less than 0.1Mp, and the thickness of each of the first conductive adhesive layer 51 and the second conductive adhesive layer 52 is greater than 20 μm.
Although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention.
Claims (10)
1. An electronic device, comprising:
a substrate;
a first member provided on the substrate;
a second member disposed on the same surface of the substrate at an interval from the first member;
a circuit board disposed on the first and second components, the circuit board including first and second pads disposed facing the substrate;
the first conductive adhesive layer is arranged between the first component and the first bonding pad;
the second conductive adhesive layer is arranged between the second component and the second bonding pad; and
the supporting block is arranged on the substrate and located between the first part and the second part, the height of the supporting block is equal to the sum of the height of the first part, the height of the first conductive adhesive layer and the height of the first bonding pad, and the height of the supporting block is also equal to the sum of the height of the second part, the height of the second conductive adhesive layer and the height of the second bonding pad.
2. The electronic device of claim 1, wherein the support block comprises an insulating glue.
3. The electronic device of claim 1, wherein the circuit board includes a first portion, a second portion, and a third portion connected between the first portion and the second portion, the third portion being disposed on the first member and the second member, the first pads and the second pads each being located on the third portion, the first member including a first side remote from the second member, the second member including a second side remote from the first member, the first portion being disposed on the first side, the second portion being disposed on the second side.
4. The electronic device according to claim 3, wherein a plurality of first through holes are provided at intervals at a junction of the first portion and the third portion, and a plurality of second through holes are provided at intervals at a junction of the second portion and the third portion, in a direction perpendicular to the first portion to the second portion.
5. The electronic device of claim 3, wherein a first glue block is further disposed between the first portion and the first side surface, and a second glue block is disposed between the second portion and the second side surface.
6. The electronic device of claim 5, wherein the first block of glue extends to a junction of the first portion and the third portion, and the second block of glue extends to a junction of the second portion and the third portion.
7. The electronic device of claim 5, wherein a length of the third portion is equal to a sum of a distance from the first side to the second side, a thickness of the first glue slug, and a thickness of the second glue slug.
8. A method of making an electronic device, comprising:
providing a first component, a second component, a supporting block, a substrate and a circuit board, wherein the circuit board comprises a first bonding pad and a second bonding pad, a first conductive adhesive is arranged on the first component, and a second conductive adhesive is arranged on the second component;
disposing the first and second components on the substrate at intervals;
fixing the supporting block between the first bonding pad and the second bonding pad of the circuit board, placing the supporting block fixed on the circuit board between the first component and the second component, and making the first bonding pad correspond to the first conductive adhesive of the first component and the second bonding pad correspond to the second conductive adhesive of the second component;
and applying pressure to the circuit board to enable the first conductive adhesive to connect the first bonding pad and the first component to obtain a first conductive adhesive layer, and enable the second conductive adhesive to connect the second bonding pad and the second component to obtain a second conductive adhesive layer.
9. The method of claim 8, further comprising:
dividing the circuit board into a first portion, a second portion, and a third portion connected between the first portion and the second portion, the third portion being disposed on the first component and the second component; the second portion and the first member including a first side remote from the second member, the second member including a second side remote from the first member;
respectively pasting a first glue block and a second glue block on the surfaces of the first part and the second part facing the substrate, bending the first part along the joint of the first part and the third part and pasting the first part on the first side surface through the first glue block, and bending the second part along the joint of the second part and the third part and pasting the second part on the second side surface through the second glue block.
10. The manufacturing method according to claim 9, wherein the bending specifically comprises the steps of:
the circuit board is pressed by a pressing head, the pressing head comprises a pressing block and two convex blocks arranged on the same surface of the pressing block, the pressing block and the two convex blocks form a groove, and the third portion is accommodated in the groove;
and moving the pressure head along the direction from the third part to the substrate, so that the first part and the second part gradually approach to the first side surface and the second side surface respectively until the first part is attached to the first side surface and the second part is attached to the second side surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211302131.6A CN115515311A (en) | 2022-10-24 | 2022-10-24 | Electronic device and method for manufacturing the same |
| TW111141048A TWI848415B (en) | 2022-10-24 | 2022-10-28 | Electronic device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211302131.6A CN115515311A (en) | 2022-10-24 | 2022-10-24 | Electronic device and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115515311A true CN115515311A (en) | 2022-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211302131.6A Pending CN115515311A (en) | 2022-10-24 | 2022-10-24 | Electronic device and method for manufacturing the same |
Country Status (2)
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| CN (1) | CN115515311A (en) |
| TW (1) | TWI848415B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI620356B (en) * | 2016-10-07 | 2018-04-01 | 欣興電子股份有限公司 | Package structure and manufacturing method thereof |
| US11107630B2 (en) * | 2018-09-26 | 2021-08-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device |
| US20220199449A1 (en) * | 2020-12-23 | 2022-06-23 | Intel Corporation | Carrier for microelectronic assemblies having direct bonding |
| KR20220117384A (en) * | 2021-02-15 | 2022-08-24 | 삼성디스플레이 주식회사 | Input sensing panel and display apparatus including the same |
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- 2022-10-24 CN CN202211302131.6A patent/CN115515311A/en active Pending
- 2022-10-28 TW TW111141048A patent/TWI848415B/en active
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| TW202418900A (en) | 2024-05-01 |
| TWI848415B (en) | 2024-07-11 |
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