CN115505237B - Epoxy resin glue solution, epoxy-based CEM-3 copper-clad plate and preparation method thereof - Google Patents

Epoxy resin glue solution, epoxy-based CEM-3 copper-clad plate and preparation method thereof Download PDF

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Publication number
CN115505237B
CN115505237B CN202210985025.6A CN202210985025A CN115505237B CN 115505237 B CN115505237 B CN 115505237B CN 202210985025 A CN202210985025 A CN 202210985025A CN 115505237 B CN115505237 B CN 115505237B
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epoxy resin
parts
copper
epoxy
clad plate
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CN115505237A (en
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栾好帅
王丽亚
史晓杰
刘政
李凌云
秦伟峰
付军亮
刘俊秀
徐凤
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SHANDONG JINBAO ELECTRONICS CO Ltd
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SHANDONG JINBAO ELECTRONICS CO Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B32B5/265—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary characterised by one fibrous or filamentary layer being a non-woven fabric layer
    • B32B5/266—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary characterised by one fibrous or filamentary layer being a non-woven fabric layer next to one or more non-woven fabric layers
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
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    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
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    • B32B2260/04—Impregnation, embedding, or binder material
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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Abstract

The invention belongs to the technical field of copper-clad plates, and particularly relates to an epoxy resin glue solution, an epoxy-based CEM-3 copper-clad plate and a preparation method thereof, wherein the epoxy resin glue solution comprises the following components in parts by weight: brominated bisphenol a epoxy resin: 70-80 parts; hydrogenated bisphenol a epoxy resin: 10-15 parts of a lubricant; organic titanium epoxy resin: 10-15 parts of a lubricant; curing agent: 1-5 parts; solvent: 80-120 parts; silane coupling agent: 3-4 parts; and (3) filling: 120-140 parts. The invention adopts brominated bisphenol A epoxy resin as a main body, and mixes hydrogenated epoxy resin and organic titanium epoxy resin, thereby effectively reducing the cost, improving the heat resistance and the mechanical strength, and the added high dielectric constant filler ensures that the plate has high dielectric property and lower dielectric loss.

Description

Epoxy resin glue solution, epoxy-based CEM-3 copper-clad plate and preparation method thereof
Technical Field
The invention belongs to the technical field of copper-clad plates, and particularly relates to an epoxy resin glue solution, an epoxy-based CEM-3 copper-clad plate and a preparation method thereof.
Background
Today, the electronic industry is vigorously developed, and small intelligent devices such as semiconductors, capacitors and the like are frequently used, and 5G is promoted, so that various electronic products are continuously brought out. In order to achieve the goals of miniaturization, light weight and the like, and meet the requirements of high-frequency signal transmission, high transmission speed and high-frequency low loss, a copper-clad plate product with high dielectric constant and low loss must be developed.
The existing high-dielectric-constant copper-clad plate is generally manufactured by adding high-dielectric filler into polytetrafluoroethylene resin, cyanate resin or polyphenyl ether resin. Although the polytetrafluoroethylene resin has excellent dielectric property, the polytetrafluoroethylene resin has high melt viscosity, and the polytetrafluoroethylene copper-clad plate needs to be pressed and formed at a high temperature of 380-400 ℃ and has complex process; toluene is used in the manufacturing process of the polyphenyl ether resin-based copper-clad plate, so that the environment is polluted, and the problem of high melt viscosity is solved; the cyanate ester-based copper-clad plate has too high cost; the polyimide resin-based copper-clad plate has high cost and complex process.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides an epoxy resin glue solution, an epoxy CEM-3 copper-clad plate and a preparation method thereof.
The specific technical scheme of the invention is as follows:
the first aim of the invention is to provide an epoxy resin glue solution which comprises the following components in parts by weight:
brominated bisphenol a epoxy resin: 70-80 parts; hydrogenated bisphenol a epoxy resin: 10-15 parts of a lubricant; organic titanium epoxy resin: 10-15 parts of a lubricant; curing agent: 1-5 parts; solvent: 80-120 parts; silane coupling agent: 3-4 parts; and (3) filling: 120-140 parts.
Further, the curing agent is an amine curing agent and an imidazole curing agent; the amine curing agent is one of dicyandiamide, diamine diphenyl methane or diamine diphenyl sulfone; the imidazole curing agent is one of 2-phenylimidazole, 2-methylimidazole or 2-ethyl-4-methylimidazole.
Further, the silane coupling agent is one of KH550, KH560 or DL 602.
Further, the filler is two of titanium dioxide, strontium titanate, aluminum oxide and talcum powder; the solvent comprises dimethylformamide, butanone and propylene glycol monomethyl ether.
Further, the preparation method of the epoxy resin glue solution comprises the following steps:
S1: mixing brominated bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin, organic titanium epoxy resin and solvent, stirring and dissolving until the mixture is transparent to obtain a solution;
S2: adding a silane coupling agent and a curing agent into the solution in the step S1, stirring and dissolving the mixture to fully disperse the mixture, and stirring the mixture uniformly to obtain a mixed solution;
s3: and (2) adding two fillers into the mixed solution in the step (S2), uniformly stirring, and fully emulsifying to obtain the epoxy resin glue solution.
Further, the gel time of the epoxy resin glue solution prepared in the step S3 is 140-170S.
The second aim of the invention is to provide an epoxy CEM-3 copper-clad plate which is prepared by adopting the epoxy resin glue solution.
The third object of the invention is to provide a preparation method of an epoxy CEM-3 copper-clad plate, which comprises the following steps:
impregnating glass fiber cloth with the epoxy resin glue solution, and preparing a fabric prepreg by an oven;
Dipping the glass non-woven fabric into the epoxy resin glue solution, and preparing a core material prepreg by an oven;
and (3) stacking copper foil 1, fabric 1, core material 1-4 sheets and fabric 1 in sequence, placing the two steel plates between them, and placing them into a vacuum press to press so as to obtain the invented epoxy CEM-3 copper-clad plate.
Further, the glass fiber cloth is 7628 glass fiber cloth.
Further, the oven temperature for preparing the fabric prepreg and the core prepreg is 170 ℃, and the baking time is 3-5min.
Further, the glue content of the fabric prepreg is 41-44wt%; the glue content of the core prepreg is 80-84wt%.
Further, the pressing process parameters of the vacuum press are as follows: the temperature is 150-170 ℃, the pressure is 1.5-5 MPa, the time is 80-120 min, and the epoxy CEM-3 copper-clad plate is taken out after the temperature is reduced below 120 ℃.
The beneficial effects of the invention are as follows:
The invention adopts brominated bisphenol A epoxy resin with good technological performance and good dielectric property as a main body, and increases hydrogenated bisphenol A epoxy resin and organic titanium epoxy resin. Besides the performance of the general epoxy resin, the hydrogenated bisphenol A epoxy resin has the advantages that the benzene ring is converted into a saturated six-membered ring, no double bond is contained, the fracture defect of unsaturated double bonds is overcome, and the hydrogenated bisphenol A epoxy resin condensate has good weather resistance, corona resistance, tracking resistance and high dielectric strength; the organic titanium modified bisphenol A epoxy resin has greatly improved water absorption, moisture resistance, dielectric property and the like, and has large bond energy, good heat resistance and greatly reduced dielectric loss tangent. The high dielectric filler is adopted, so that the cured product has high dielectric constant, low dielectric loss and good mechanical strength. The epoxy resin glue solution adopted by the invention strengthens the overall comprehensive performance of the plate, and prepares the CEM-3 copper-clad plate with high dielectric constant and low dielectric loss.
Detailed Description
The principles and features of the present invention are described below in connection with examples, which are set forth only to illustrate the present invention and not to limit the scope of the invention.
Example 1
A preparation method of a high heat-resistant low-loss epoxy CEM-3 copper-clad plate comprises the following steps:
1. Preparation of epoxy resin adhesive:
S1: according to parts by weight, 70 parts of brominated bisphenol A epoxy resin, 15 parts of hydrogenated bisphenol A epoxy resin, 15 parts of organic titanium epoxy resin, 50 parts of dimethylformamide, 25 parts of butanone and 25 parts of propylene glycol monomethyl ether are mixed and then stirred for dissolving until the mixture is transparent, so as to obtain a dissolving solution;
S2: adding 3 parts of KH550 silane coupling agent, 1.5 parts of dicyandiamide and 0.3 part of 2-methylimidazole into the solution in the step S1, stirring to fully disperse the solution, and uniformly stirring to obtain a mixed solution;
S3: and (3) adding 60 parts of titanium dioxide and talcum powder into the mixed solution in the step (S2), uniformly stirring, and fully emulsifying to obtain the epoxy resin glue solution.
2. Preparation of epoxy CEM-3 copper-clad plate:
Dipping 7628 glass fiber cloth in the epoxy resin glue solution, and baking for 3min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 42.3wt%;
dipping 75g/m 2 of glass non-woven fabric into the epoxy resin glue solution, and baking for 4min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 81.8wt%;
and stacking copper foil 1, fabric 1, core material 1 and fabric 1 in sequence, placing the two steel plates between the two steel plates, placing the steel plates in a vacuum press, wherein the temperature of the vacuum press is 160 ℃, the pressure is 1.5MPa, the pressing time is 100min, and taking out the steel plates below 120 ℃ to obtain the high heat-resistant low-loss epoxy CEM-3 copper-clad plate.
Example 2
A preparation method of a high heat-resistant low-loss epoxy CEM-3 copper-clad plate comprises the following steps:
1. Preparation of epoxy resin adhesive:
S1: according to parts by weight, 75 parts of brominated bisphenol A epoxy resin, 12.5 parts of hydrogenated bisphenol A epoxy resin, 12.5 parts of organic titanium epoxy resin, 50 parts of dimethylformamide, 25 parts of butanone and 25 parts of propylene glycol monomethyl ether are mixed and then stirred for dissolving until the mixture is transparent, so as to obtain a dissolving solution;
S2: adding 3.5 parts of KH560 silane coupling agent, 3 parts of diamine diphenyl sulfone and 0.2 part of 2-phenylimidazole into the solution in the step S1, stirring to fully disperse the materials, and stirring uniformly to obtain a mixed solution;
S3: and (2) adding 65 parts of strontium titanate and aluminum oxide into the mixed solution in the step (S2), uniformly stirring, and fully emulsifying to obtain the epoxy resin glue solution.
2. Preparation of epoxy CEM-3 copper-clad plate:
Dipping 7628 glass fiber cloth in the epoxy resin glue solution, and baking for 3.5min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 43.1wt%;
Dipping 75g/m 2 of glass non-woven fabric into the epoxy resin glue solution, and baking for 3min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 82.4wt%;
And stacking copper foil 1, fabric 1, core material 2 and fabric 1 in sequence, placing the two steel plates between the two steel plates, placing the steel plates in a vacuum press, wherein the temperature of the vacuum press is 170 ℃, the pressure is 3MPa, the pressing time is 80min, and taking out the steel plates below 120 ℃ to obtain the high heat-resistant low-loss epoxy CEM-3 copper-clad plate.
Example 3
A preparation method of a high heat-resistant low-loss epoxy CEM-3 copper-clad plate comprises the following steps:
1. Preparation of epoxy resin adhesive:
S1: mixing 80 parts of brominated bisphenol A epoxy resin, 10 parts of hydrogenated bisphenol A epoxy resin, 10 parts of organic titanium epoxy resin, 50 parts of dimethylformamide, 25 parts of butanone and 25 parts of propylene glycol monomethyl ether, and stirring to dissolve until the mixture is transparent to obtain a dissolving solution;
S2: adding 4 parts of DL602 silane coupling agent, 2.5 parts of diaminodiphenyl methane and 0.5 part of 2-ethyl-4-methylimidazole into the solution in the step S1, stirring to fully disperse the components, and uniformly stirring to obtain a mixed solution;
S3: and (2) adding 70 parts of titanium dioxide and aluminum oxide into the mixed solution in the step (S2), uniformly stirring, and fully emulsifying to obtain the epoxy resin glue solution.
2. Preparation of epoxy CEM-3 copper-clad plate:
Dipping 7628 glass fiber cloth in the epoxy resin glue solution, and baking for 4min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 42.7wt%;
Dipping 75g/m 2 of glass non-woven fabric into the epoxy resin glue solution, and baking for 5min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 83.2wt%;
And stacking copper foil 1, fabric 1, core 3 and fabric 1 in sequence, placing the two steel plates between the two steel plates, placing the steel plates in a vacuum press, wherein the temperature of the vacuum press is 150 ℃, the pressure is 5MPa, the pressing time is 120min, and taking out the steel plates below 120 ℃ to obtain the high heat-resistant low-loss epoxy CEM-3 copper-clad plate.
Comparative example
A preparation method of an epoxy CEM-3 copper-clad plate comprises the following steps:
1. Preparation of epoxy resin adhesive:
s1: 100 parts of brominated bisphenol A epoxy resin, 150 parts of dimethylformamide, 25 parts of butanone and 25 parts of propylene glycol monomethyl ether are mixed and stirred for dissolving until the mixture is transparent, so as to obtain a dissolving solution;
s2: adding 3 parts of KH550 silane coupling agent, 1.5 parts of dicyandiamide and 0.3 part of dimethyl imidazole into the solution in the step S1, stirring to fully disperse the components, and uniformly stirring to obtain a mixed solution;
s3: and (3) adding 60 parts of aluminum hydroxide and silicon micropowder into the mixed solution in the step (S2), uniformly stirring, and fully emulsifying to obtain the epoxy resin glue solution.
2. Preparation of epoxy CEM-3 copper-clad plate:
dipping 7628 glass fiber cloth in the epoxy resin glue solution, and baking for 4min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 41.9wt%;
Dipping 75g/m 2 of glass non-woven fabric into the epoxy resin glue solution, and baking for 5min in a baking oven at 170 ℃ to obtain a prepreg with the glue content of 82.6wt%;
and stacking copper foil 1, fabric 1, core material 1 and fabric 1 in sequence, placing the two steel plates between the two steel plates, placing the steel plates in a vacuum press, pressing at 165 ℃ under 4MPa for 90min, and taking out the steel plates below 120 ℃ to obtain the epoxy CEM-3 copper-clad plate.
The test method comprises the following steps:
(1) Dielectric constant: GB/T4722-2017-8.5;
(2) Dielectric loss (10G): GB/T4722-2017-8.5;
(3)T288：GB/T 4722-2017-6.11；
(4) Peel strength (N/mm): GB/T4722-2017-7.2.1;
(5) Flame retardancy: GB/T4722-2017-6.4.1;
the test experimental data of each example and comparative example are shown in table 1.
Table 1 test experimental data for each of examples and comparative examples
Test item Example 1 Example 2 Example 3 Comparative example
Dielectric constant 8.7 9.4 10.1 7.3
Dielectric loss (10G) 0.0077 0.0075 0.0069 0.0106
T288/min >10 >10 >10 6
Peel strength N/mm 1.53 1.48 1.42 1.47
Flame retardancy FV-0 FV-0 FV-0 FV-0
As can be seen from comparison of the test experimental data in table 1, the copper clad laminate of example 3 has the highest dielectric constant of 10.1, the lowest dielectric loss of 0.0069, examples 2 and 1 times, and the worst is the comparative example. And the heat resistance of the examples is obviously better than that of the comparative examples, and other comprehensive properties are good.
It will be understood that the application has been described in terms of several embodiments, and that various changes and equivalents may be made to these features and embodiments by those skilled in the art without departing from the spirit and scope of the application. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the application without departing from the essential scope thereof. Therefore, it is intended that the application not be limited to the particular embodiment disclosed, but that the application will include all embodiments falling within the scope of the appended claims.

Claims (7)

1. The epoxy resin glue solution is characterized by comprising the following components in parts by weight:
Brominated bisphenol a epoxy resin: 70-80 parts; hydrogenated bisphenol a epoxy resin: 10-15 parts of a lubricant; organic titanium epoxy resin: 10-15 parts of a lubricant; curing agent: 1-5 parts; solvent: 80-120 parts; silane coupling agent: 3-4 parts; and (3) filling: 120-140 parts;
The curing agent is an amine curing agent and an imidazole curing agent; the amine curing agent is one of dicyandiamide, diamine diphenyl methane or diamine diphenyl sulfone; the imidazole curing agent is one of 2-phenylimidazole, 2-methylimidazole or 2-ethyl-4-methylimidazole; the silane coupling agent is one of KH550, KH560 or DL 602; the filler is two of titanium dioxide, strontium titanate, aluminum oxide and talcum powder; the solvent comprises dimethylformamide, butanone and propylene glycol monomethyl ether;
the preparation method of the epoxy resin glue solution comprises the following steps:
S1: mixing brominated bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin, organic titanium epoxy resin and solvent, stirring and dissolving until the mixture is transparent to obtain a solution;
S2: adding a silane coupling agent and a curing agent into the solution in the step S1, stirring and dissolving the mixture to fully disperse the mixture, and stirring the mixture uniformly to obtain a mixed solution;
s3: and (2) adding two fillers into the mixed solution in the step (S2), uniformly stirring, fully emulsifying, and obtaining the epoxy resin glue solution with the gelling time of 140-170S.
2. An epoxy CEM-3 copper-clad plate, which is characterized in that the copper-clad plate is prepared by adopting the epoxy resin glue solution as in claim 1.
3. A method for preparing the epoxy CEM-3 copper-clad plate according to claim 2, which is characterized by comprising the following steps:
impregnating glass fiber cloth with the epoxy resin glue solution, and preparing a fabric prepreg by an oven;
Dipping the glass non-woven fabric into the epoxy resin glue solution, and preparing a core material prepreg by an oven;
And (3) stacking copper foil 1, fabric 1, core material 1-4 and fabric 1 in sequence, placing the two steel plates between them, and placing them into a vacuum press to press so as to obtain the epoxy CEM-3 copper-clad plate.
4. The method for producing an epoxy-based CEM-3 copper-clad plate according to claim 3, wherein the glass fiber cloth is 7628 glass fiber cloth.
5. The method for preparing the epoxy CEM-3 copper-clad plate according to claim 3, wherein the oven temperature for preparing the fabric prepreg and the core prepreg is 170 ℃ and the baking time is 3-5min.
6. The method for preparing the epoxy CEM-3 copper-clad plate according to claim 3, wherein the glue content of the fabric prepreg is 41-44wt%; the glue content of the core prepreg is 80-84wt%.
7. The method for preparing the epoxy CEM-3 copper-clad plate according to claim 3, wherein the pressing process parameters of the vacuum press are as follows: the temperature is 150-170 ℃, the pressure is 1.5-5 MPa, the time is 80-120 min, and the epoxy CEM-3 copper-clad plate is taken out after the temperature is reduced below 120 ℃.
CN202210985025.6A 2022-08-17 2022-08-17 Epoxy resin glue solution, epoxy-based CEM-3 copper-clad plate and preparation method thereof Active CN115505237B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06182932A (en) * 1992-12-21 1994-07-05 Toshiba Chem Corp Copper-plated laminated plate
CN103289322A (en) * 2013-03-01 2013-09-11 广东丹邦科技有限公司 Dielectric compound, embedded capacitor film and its preparation method
CN109517538A (en) * 2018-11-22 2019-03-26 广东莱尔新材料科技股份有限公司 A kind of adhesive and preparation method thereof, Flexible copper-clad plate and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06182932A (en) * 1992-12-21 1994-07-05 Toshiba Chem Corp Copper-plated laminated plate
CN103289322A (en) * 2013-03-01 2013-09-11 广东丹邦科技有限公司 Dielectric compound, embedded capacitor film and its preparation method
CN109517538A (en) * 2018-11-22 2019-03-26 广东莱尔新材料科技股份有限公司 A kind of adhesive and preparation method thereof, Flexible copper-clad plate and preparation method thereof

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