CN115504541B - Ion exchange resin positioning method and device for condensate polishing system - Google Patents
Ion exchange resin positioning method and device for condensate polishing system Download PDFInfo
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- CN115504541B CN115504541B CN202211116704.6A CN202211116704A CN115504541B CN 115504541 B CN115504541 B CN 115504541B CN 202211116704 A CN202211116704 A CN 202211116704A CN 115504541 B CN115504541 B CN 115504541B
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- 238000005498 polishing Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 34
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 239000003456 ion exchange resin Substances 0.000 title claims abstract description 27
- 229920003303 ion-exchange polymer Polymers 0.000 title claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 92
- 229920005989 resin Polymers 0.000 claims abstract description 92
- 238000012545 processing Methods 0.000 claims description 22
- 238000004590 computer program Methods 0.000 claims description 9
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 230000008929 regeneration Effects 0.000 description 13
- 238000011069 regeneration method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011835 investigation Methods 0.000 description 3
- 239000003957 anion exchange resin Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000003729 cation exchange resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J47/00—Ion-exchange processes in general; Apparatus therefor
- B01J47/14—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/008—Control or steering systems not provided for elsewhere in subclass C02F
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
- C02F2001/427—Treatment of water, waste water, or sewage by ion-exchange using mixed beds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Treatment Of Water By Ion Exchange (AREA)
Abstract
The application provides an ion exchange resin positioning method of a condensate polishing system, which relates to the technical field of intelligent monitoring of a condensate polishing system of a power station, wherein the method comprises the following steps: acquiring sequential control measuring point information of a condensate polishing system; adjusting the resin number according to the data characteristics of the sequential control point information to obtain an adjusted resin number; and taking the adjusted resin number as a positioning result, converting the positioning result into text information, and displaying the text information. The invention solves the technical problem that the resin flow track is not clear, and realizes the accurate positioning of the resin flow track.
Description
Technical Field
The application relates to the technical field of intelligent monitoring of a condensate polishing system of a power station, in particular to a method and a device for positioning ion exchange resin of the condensate polishing system.
Background
The high-speed mixed bed is equipment for removing salt substances in condensed water generated in the operation process of a thermal power plant and a nuclear power plant by utilizing anion exchange resin and cation exchange resin. The anion exchange resin and the cation exchange resin are mixed in the high-speed mixed bed according to a certain proportion, when the effluent quality is unqualified after the high-speed mixed bed is operated for a period of time, the whole set of resin in the mixed bed is required to be output to a resin regeneration system for acid-base regeneration, the resin exchange capacity is restored again, and the other set of effective resin stored in the resin regeneration system can be conveyed to the inside of the air-mixed bed for standby. In actual production, the resin in each mixed bed continuously goes through the process of running, failure and regeneration, and is conveyed to another mixed bed after each regeneration is finished, so that the resin in the mixed beds is continuously alternated in flow. When the water production amount of the high-speed mixed bed period is found to be lower than expected in the running process, the reason needs to be ascertained according to the actual situation, and if the flow track of the resin is not known, the reason for further investigation of the faster resin failure is hindered.
Disclosure of Invention
The present application aims to solve, at least to some extent, one of the technical problems in the related art.
Therefore, a first object of the present application is to provide a method for positioning ion exchange resin in a condensate polishing system, which solves the technical problem that the resin flow track of the existing method is not clear, and realizes accurate positioning of the resin flow track.
A second object of the present application is to provide an ion exchange resin positioning device for a condensate polishing system.
A third object of the present application is to propose a computer device.
A fourth object of the present application is to propose a non-transitory computer readable storage medium.
To achieve the above object, an embodiment of a first aspect of the present application provides a method for positioning an ion exchange resin in a condensate polishing system, including: acquiring sequential control measuring point information of a condensate polishing system; adjusting the resin number according to the data characteristics of the sequential control point information to obtain an adjusted resin number; and taking the adjusted resin number as a positioning result, converting the positioning result into text information, and displaying the text information.
According to the ion exchange resin positioning method for the condensate polishing system, sequential control point information of the condensate polishing system is acquired through the selected measuring points and the acquisition period, then the resin number is adjusted according to the acquired information, finally the adjusted resin number is displayed in a text form as a positioning result, relevant high-speed mixed bed operation information is selected according to the designed point taking rules, real-time positions of various sets of resins are automatically judged, operators are prompted, when water production amount of a certain high-speed mixed bed period is obviously reduced, an analyzer is helped to quickly know the number of invalid resin, so that investigation on the previous operation condition and regeneration condition is more convenient, the occurrence reason of a problem is quickly found, and the working efficiency is improved.
Optionally, in one embodiment of the present application, collecting the sequential control point information of the condensate polishing system includes:
selecting measuring points and acquisition periods according to actual sequential control signals of a high-speed mixed bed in a condensate polishing system, and acquiring preliminary sequential control point information from a DCS (distributed control system) according to the selected measuring points and the acquisition periods;
and converting the preliminary sequential control point information into a table, and interpolating and filling missing data in the table according to the data at the moment before the current moment to obtain the sequential control point information.
Optionally, in one embodiment of the present application, adjusting the resin number according to the data characteristic of the sequential point of measurement information includes:
if the value of a certain column in the table is switched from the first value to the second value, and the time that the column value lasts for the first value reaches a preset time threshold, the resin number is correspondingly changed.
In order to achieve the above object, a second embodiment of the present invention provides an ion exchange resin positioning device of a condensate polishing system, which comprises a signal acquisition module, a data processing module, and a platform output module, wherein,
the signal acquisition module is used for acquiring sequential control point information of the condensate polishing system;
the data processing module is used for adjusting the resin number according to the data characteristics of the sequential control point information to obtain an adjusted resin number;
the platform output module is used for taking the adjusted resin number as a positioning result, converting the positioning result into text information and outputting the text information to the platform for display.
Optionally, in one embodiment of the present application, the signal acquisition module includes a station acquisition unit and a signal processing unit, wherein,
the measuring point acquisition unit is used for selecting measuring points and acquisition periods according to actual sequential control signals of the high-speed mixed bed in the condensate polishing system and acquiring primary sequential control point information from the DCS according to the selected measuring points and the acquisition periods;
and the signal processing unit is used for converting the preliminary sequential control point information into a form of a table, and carrying out interpolation filling on the missing data in the table to obtain the sequential control point information, wherein a filling value adopted by the interpolation filling is the data at the previous moment.
Optionally, in an embodiment of the present application, the data processing module is specifically configured to:
if the value of a certain column in the table is switched from the first value to the second value, and the time that the column value lasts for the first value reaches a preset time threshold, the resin number is correspondingly changed.
In order to achieve the above object, an embodiment of the third aspect of the present invention provides a computer device, including a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the processor implements the above method for positioning ion exchange resin in a condensate polishing system when executing the computer program.
In order to achieve the above object, a fourth aspect of the present invention provides a non-transitory computer-readable storage medium, which when executed by a processor, enables the above-described condensate polishing system ion exchange resin positioning method to be performed.
Additional aspects and advantages of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic flow chart of a method for positioning ion exchange resin in a condensate polishing system according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of an ion exchange resin positioning platform of a condensate polishing system according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of an ion exchange resin positioning device of a condensate polishing system according to an embodiment of the present application.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended for the purpose of explaining the present application and are not to be construed as limiting the present application.
The following describes the ion exchange resin positioning method and apparatus of the condensate polishing system according to the embodiment of the present application with reference to the drawings.
Fig. 1 is a schematic flow chart of a method for positioning ion exchange resin in a condensate polishing system according to an embodiment of the present application.
As shown in fig. 1, the ion exchange resin positioning method of the condensate polishing system comprises the following steps:
step 101, acquiring sequential control point information of a condensate polishing system;
step 102, adjusting the resin number according to the data characteristics of the sequential control point information to obtain an adjusted resin number;
and step 103, taking the adjusted resin number as a positioning result, converting the positioning result into text information, and displaying the text information.
According to the ion exchange resin positioning method for the condensate polishing system, sequential control point information of the condensate polishing system is acquired through the selected measuring points and the acquisition period, then the resin number is adjusted according to the acquired information, finally the adjusted resin number is displayed in a text form as a positioning result, relevant high-speed mixed bed operation information is selected according to the designed point taking rules, real-time positions of various sets of resins are automatically judged, operators are prompted, when water production amount of a certain high-speed mixed bed period is obviously reduced, an analyzer is helped to quickly know the number of invalid resin, so that investigation on the previous operation condition and regeneration condition is more convenient, the occurrence reason of a problem is quickly found, and the working efficiency is improved.
Optionally, in one embodiment of the present application, collecting the sequential control point information of the condensate polishing system includes:
selecting measuring points and acquisition periods according to actual sequential control signals of a high-speed mixed bed in a condensate polishing system, and acquiring preliminary sequential control point information from a DCS (distributed control system) according to the selected measuring points and the acquisition periods;
and converting the preliminary sequential control point information into a table, and interpolating and filling missing data in the table according to the data at the moment before the current moment to obtain the sequential control point information.
Optionally, in one embodiment of the present application, adjusting the resin number according to the data characteristic of the sequential point of measurement information includes:
if the value of a certain column in the table is switched from the first value to the second value, and the time that the column value lasts for the first value reaches a preset time threshold, the resin number is correspondingly changed.
The ion exchange resin positioning platform of the other condensate polishing system is described below by combining the actual operation records of part of measuring points in the condensate polishing system of a certain power plant. The power plant currently has 2 units, is provided with 6 high-speed mixed beds, namely a 1A mixed bed, a 1B mixed bed, a 1C mixed bed, a 2A mixed bed, a 2B mixed bed and a 2C mixed bed, and is commonly provided with 1 resin regeneration system and 7 resin regeneration systems.
As shown in fig. 2, the ion exchange resin positioning platform of the condensate polishing system mainly comprises a signal acquisition system (001), a data processing system (002) and a platform output system (003).
Firstly, setting an initial number on a platform according to the condition of resin in a mixed bed when the platform is on line, and forming list format data, wherein the method comprises the following steps: [1,2,3,4,5,6,7,0] the first 6 elements in the list correspond to 6 mixed beds and the last 2 elements correspond to resins contained in the regeneration system, at this time, 1A mixed bed has 1 st set of resins, 1B mixed bed has 2 nd set of resins, 1C mixed bed has 3 rd set of resins, 2A mixed bed has 4 th set of resins, 2B mixed bed has 5 th set of resins, 2C mixed bed has 6 th set of resins, and regeneration system has 7 th set of resins.
The measuring points acquired by the measuring point acquisition module (01) comprise 1A mixed bed resin input sequential control, 1B mixed bed resin input sequential control, 1C mixed bed resin input sequential control, 2A mixed bed resin input sequential control, 2B mixed bed resin input sequential control, 2C mixed bed resin input sequential control, 1A mixed bed resin output sequential control, 1B mixed bed resin output sequential control, 1C mixed bed resin output sequential control, 2A mixed bed resin output sequential control, 2B mixed bed resin output sequential control and 2C mixed bed resin output sequential control, the acquisition period is 60 seconds, and the acquisition time period is 70 seconds to the acquisition time before acquisition. The measuring point acquisition module converts the acquired data into a file format of a table, and the table data are arranged in time sequence and only contain 0 or 1. The form is delivered to a data processing system (002).
Data processing system (002): the table provided by the signal acquisition system (001) is input by the data processing system (002), a certain column in the data table is continuously 1 for 10 seconds, and the data at the next moment is 0, so that the system completes a resin conveying process, at the moment, the resin number needs to be correspondingly changed, if no change occurs, the resin number is not changed, and a new resin number is conveyed to the platform output system (003) in a list form.
Examples: when the resin in the 1C mixed bed is completely output and sequential control, the resin number list is changed from [1,2,3,4,5,6,7,0] to [1,2,0,4,5,6,3,7], no resin exists in the 1C mixed bed, the 3 rd set of resin and the 7 th set of resin are stored in the regeneration system, and when the 1C mixed bed is completely input, the resin number list is changed to [1,2,7,4,5,6,3,0] inner mixed bed resin, the 7 th set of resin is stored in the 1C mixed bed, and the 3 rd set of resin is stored in the regeneration system.
The platform output system (003) converts the list output by the data processing system (002) into a text form and outputs the text form to the platform to finish positioning of the resin, and the data processing system (002) outputs a resin number every minute, so that the resin number updating period of the platform is one minute and is intuitively pushed to relevant operators in a factory.
In order to realize the embodiment, the application also provides an ion exchange resin positioning device of the condensate polishing system.
Fig. 3 is a schematic structural diagram of an ion exchange resin positioning device of a condensate polishing system according to an embodiment of the present application.
As shown in fig. 3, the ion exchange resin positioning device of the condensate polishing system comprises a signal acquisition module, a data processing module and a platform output module, wherein,
the signal acquisition module is used for acquiring sequential control point information of the condensate polishing system;
the data processing module is used for adjusting the resin number according to the data characteristics of the sequential control point information to obtain an adjusted resin number;
the platform output module is used for taking the adjusted resin number as a positioning result, converting the positioning result into text information and outputting the text information to the platform for display.
Further, in the embodiment of the application, the signal acquisition module comprises a measuring point acquisition unit and a signal processing unit, wherein,
the measuring point acquisition unit is used for selecting measuring points and acquisition periods according to actual sequential control signals of the high-speed mixed bed in the condensate polishing system and acquiring primary sequential control point information from the DCS according to the selected measuring points and the acquisition periods;
and the signal processing unit is used for converting the preliminary sequential control point information into a form of a table, and carrying out interpolation filling on the missing data in the table to obtain the sequential control point information, wherein a filling value adopted by the interpolation filling is the data at the previous moment.
Specifically, in the embodiment of the present application, the data processing module is specifically configured to:
if the value of a certain column in the table is switched from the first value to the second value, and the time that the column value lasts for the first value reaches a preset time threshold, the resin number is correspondingly changed.
It should be noted that the foregoing explanation of the embodiment of the ion exchange resin positioning method of the condensate polishing system is also applicable to the ion exchange resin positioning device of the condensate polishing system in this embodiment, and will not be repeated here.
In order to implement the above embodiment, the present invention further proposes a computer device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor implements the method described in the above embodiment when executing the computer program.
In order to implement the above-described embodiments, the present invention also proposes a non-transitory computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the method of the above-described embodiments.
In the description of the present specification, a description referring to the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and additional implementations are included within the scope of the preferred embodiment of the present application in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present application.
Logic and/or steps represented in the flowcharts or otherwise described herein, e.g., a ordered listing of executable instructions for implementing logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). In addition, the computer readable medium may even be paper or other suitable medium on which the program is printed, as the program may be electronically captured, via, for instance, optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner, if necessary, and then stored in a computer memory.
It is to be understood that portions of the present application may be implemented in hardware, software, firmware, or a combination thereof. In the above-described embodiments, the various steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. As with the other embodiments, if implemented in hardware, may be implemented using any one or combination of the following techniques, as is well known in the art: discrete logic circuits having logic gates for implementing logic functions on data signals, application specific integrated circuits having suitable combinational logic gates, programmable Gate Arrays (PGAs), field Programmable Gate Arrays (FPGAs), and the like.
Those of ordinary skill in the art will appreciate that all or a portion of the steps carried out in the method of the above-described embodiments may be implemented by a program to instruct related hardware, where the program may be stored in a computer readable storage medium, and where the program, when executed, includes one or a combination of the steps of the method embodiments.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing module, or each unit may exist alone physically, or two or more units may be integrated in one module. The integrated modules may be implemented in hardware or in software functional modules. The integrated modules may also be stored in a computer readable storage medium if implemented in the form of software functional modules and sold or used as a stand-alone product.
The above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, or the like. Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.
Claims (4)
1. The ion exchange resin positioning method of the condensate polishing system is characterized by comprising the following steps of:
acquiring sequential control measuring point information of the condensate polishing system;
adjusting the resin number according to the data characteristics of the sequential control point information to obtain an adjusted resin number;
taking the adjusted resin number as a positioning result, converting the positioning result into text information, and displaying the text information;
wherein, gather the sequential control survey point information of condensate polishing system, include:
selecting a measuring point and a collecting period according to an actual sequential control signal of a high-speed mixed bed in the condensate polishing system, and acquiring preliminary sequential control measuring point information from a DCS (distributed control system) according to the selected measuring point and the collecting period, wherein the measuring point comprises input sequential control and output sequential control of mixed bed resin;
converting the preliminary sequential control point information into a table, and interpolating and filling missing data in the table according to data at a time before the current time to obtain the sequential control point information;
the adjusting the resin number according to the data characteristic of the sequential control point information comprises the following steps:
if the value of a certain column in the table is switched from the first value to the second value, and the time that the column value lasts for the first value reaches a preset time threshold, the resin number is correspondingly changed.
2. An ion exchange resin positioning platform of a condensate polishing system is characterized by comprising a signal acquisition module, a data processing module and a platform output module, wherein,
the signal acquisition module is used for acquiring sequential control point information of the condensate polishing system;
the data processing module is used for adjusting the resin number according to the data characteristics of the sequential control point information to obtain the adjusted resin number;
the platform output module is used for taking the adjusted resin number as a positioning result, converting the positioning result into text information, and outputting the text information to a platform for display;
wherein the signal acquisition module comprises a measuring point acquisition unit and a signal processing unit, wherein,
the measuring point acquisition unit is used for selecting measuring points and acquisition periods according to actual sequential control signals of a high-speed mixed bed in the condensate polishing system and acquiring preliminary sequential control measuring point information from a DCS (distributed control system) according to the selected measuring points and the acquisition periods, wherein the measuring points comprise input sequential control and output sequential control of mixed bed resin;
the signal processing unit is used for converting the preliminary sequential control point information into a form of a table, and carrying out interpolation filling on missing data in the table to obtain the sequential control point information, wherein a filling value adopted by the interpolation filling is data at the previous moment;
the data processing module is specifically configured to:
if the value of a certain column in the table is switched from the first value to the second value, and the time that the column value lasts for the first value reaches a preset time threshold, the resin number is correspondingly changed.
3. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the method as claimed in claim 1 when executing the computer program.
4. A non-transitory computer readable storage medium, on which a computer program is stored, which computer program, when being executed by a processor, implements the method as claimed in claim 1.
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