CN115499763A - Energy conversion assembly and manufacturing method thereof - Google Patents

Abstract

The present disclosure relates to a transducer assembly and a method for manufacturing the same, wherein the transducer assembly mainly comprises two parts, a first part comprising a first substrate, a carrier member formed on the first substrate, and a first assembly combined with the carrier member; the second part comprises a second substrate provided with a hole, a carrier is formed on the hole, the edge of the carrier is fixed on the second substrate, a second component is arranged on the carrier, when current is led into the second component, the generated magnetic field can interact with the first component, and the carrier is such as a vibrating diaphragm, so that the carrier vibrates along with the change of the current, and the transduction component is formed by combining the first part and the second part. The first component or the second component can be a micro-coil component formed by a plurality of circles of metal wire segments which are continuously wired or a group type micro-coil component formed by a plurality of micro-coil components.

Description

Energy conversion assembly and manufacturing method thereof

Technical Field

The present disclosure provides a transducer assembly, and more particularly, a transducer assembly having a micro-coil assembly formed by a plurality of metal wire segments and a method for manufacturing the same.

Background

The magnetic components that can form a magnetic field, such as a magnet or a coil formed by a metal winding, have a certain volume and weight, and if the magnetic components are applied to an electronic device, the electronic device is often heavy or an accommodating space for installing the magnetic components is required.

Conventionally, electronic devices requiring miniaturization, such as earphones, hearing aids or small loudspeakers, in which the magnetic components used generally require special materials or designs to be mounted in the device, have the problem of creating a requirement for a specific magnetic field strength and the associated physical limitations that limit the miniaturization, particularly in the case of miniaturization, by deliberately reducing the volume and weight of the magnetic components, and thus the effectiveness of the magnetic components.

Although there are significant advances in the art in the materials used for magnetic components that generate magnetic fields, there are physical limitations and high cost problems.

Disclosure of Invention

The present disclosure provides a transducer assembly and a method for manufacturing the same, wherein the transducer assembly mainly comprises two parts, the step of forming the first part of the transducer assembly comprises the steps of preparing a first substrate, forming a bearing member on the first substrate, and then combining the first assembly on the bearing member to connect the first assembly with the first substrate; the step of forming the second portion of the transducer assembly includes providing a second substrate, forming a hole in the second substrate, forming a carrier over the hole, the carrier having an edge that can be secured to the second substrate, and thereafter bonding the carrier to the second assembly. The first portion and the second portion are bonded to form the transducer assembly.

Furthermore, the second substrate of the second part is a circuit board for supporting the carrier, and the second component can be electrically connected to the circuit board by wire bonding or flip chip and is combined with the second substrate, i.e. the second circuit board. When current is led in the second assembly through the circuit board, the generated magnetic field can interact with the bearing part on the first base material, and the bearing part can be a vibrating diaphragm, so that the vibrating diaphragm vibrates along with the change of the current.

Furthermore, the first substrate can be a first circuit board, the first component is electrically connected to the first circuit board through a wire bonding or flip chip manner, the first circuit board is connected with the first substrate of the second part, namely the second circuit board, through a conductive material, and then the first component can be protected by a packaging body.

When the first part and the second part are combined and arranged in a shell, one or more air circulation structures can be formed on the shell to form a transducer assembly.

Further, the first component or the second component may be a micro-coil component formed by a plurality of metal wire segments, or a multi-array micro-coil component formed by a plurality of micro-coil components. Each micro-coil component comprises a wiring layer, wherein a plurality of metal wire sections which start from a starting point and form a plurality of circles of continuous wiring around the starting point are arranged in the wiring layer, two ends of each metal wire section are a first electrode end and a second electrode end, the starting point is a first electrode of the micro-coil component, and the tail ends of the metal wire sections of the plurality of circles of continuous wiring are second electrodes of the micro-coil component; each micro-coil assembly comprises an electrode layer, a first electrode area and a second electrode area, wherein the first electrode area is used for collecting the first electrode end of each metal line segment in the multiple metal line segments, and the second electrode area is used for collecting the second electrode end of each metal line segment in the multiple metal line segments.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

FIG. 1 shows a schematic diagram of an embodiment of the internal construction of a transducer assembly;

FIG. 2 shows a diagram of an embodiment of a micro-coil assembly;

FIG. 3 shows a schematic diagram of one embodiment of the wiring on the micro-coil assembly;

FIG. 4 illustrates a schematic diagram of another embodiment of a contact surface on a microcoil device;

FIG. 5 is a schematic diagram of several embodiments of a micro-coil assembly forming an array of micro-coil assemblies;

FIG. 6 shows a schematic diagram of an embodiment of a transducer assembly;

FIGS. 7 (A) (B) (C) (D) (E) are schematic diagrams illustrating an embodiment of fabricating a first portion of a transducer assembly;

FIGS. 8 (A) (B) (C) (D) (E) are schematic diagrams illustrating a second portion of the transducer assembly;

FIG. 9 shows a schematic diagram of a structural embodiment of a transducer assembly;

FIGS. 10A, 10B, 10C show schematic diagrams of side structural embodiments of the transducer assembly;

fig. 11 is a schematic view of an embodiment of a magnetic conductive structure in a speaker assembly;

FIG. 12 is a schematic diagram of an embodiment of a magnetic assembly in an acoustic speaker assembly;

FIG. 13 is a schematic diagram of a second embodiment of a magnetic element structure in a speaker assembly;

fig. 14 shows a third exemplary schematic view of a magnetic element structure of a speaker element;

FIG. 15 shows a schematic view of an embodiment of the structure of the speaker assembly;

FIG. 16 shows a perspective view of an embodiment of a speaker assembly;

figure 17 shows one of the examples of implementing the speaker assembly with a transducer assembly;

figure 18 shows a second embodiment of the speaker assembly implemented with a transducer assembly; and

fig. 19 is a flow chart of an embodiment of a method of manufacturing a transducer assembly using a micro-coil assembly.

Detailed Description

According to the embodiments disclosed in the present disclosure, a transducer assembly and a manufacturing method thereof are provided, taking a speaker assembly that can be realized as an example, wherein one of the main purposes is to replace a conventional magnetic assembly such as a coil and a magnet in the speaker assembly with a magnetic assembly formed by a miniaturized coil assembly, the speaker assembly is an electronic assembly performing electrical signal conversion into an acoustic signal in devices such as an earphone, a hearing aid, a speaker, etc., and the internal assembly can refer to the schematic illustration of the speaker assembly shown in fig. 1.

In fig. 1, which shows a main component of the speaker assembly, the sound membrane 101 is a component that generates sound by vibration, and is fixed on a suspended edge (dangling edge) 102 and combined with the second magnetic assembly 103 and the core fixing support 105 fixing the second magnetic assembly 103, these components may be installed in a gasket 107, and other components also have a magnetic conductive component 111 and a first magnetic component 109 on the other side, and are finally installed in a housing 113.

Wherein the membrane 101 (a practical implementation may be a membrane with a thickness of about 0.1mm or less, but not limiting to the proposed membrane 101) may be made of different materials according to different audio frequencies, for example, the membrane material that can generate high tones may be ceramic, glass or metal; a low-pitched sound generating diaphragm material such as carbon, plastic (e.g., PEI, PEK, PET, etc.), or a specific metal alloy. The second magnetic component 103 is conventionally mainly a coil, and forms a magnetic field on the coil after being energized with current, and interacts with the magnetic conducting component 111 and the first magnetic component 109 (such as a magnet or other components capable of inducing to form a magnetic field) which guide the magnetic field, and forms a magnetic field capable of changing polarity by changing current and direction, that is, drives the sound membrane 101 to move back and forth, and pushes air to generate sound due to vibration.

Other components of the speaker assembly, such as the stator plate 105, serve as damping to stabilize the vibration of the second magnetic assembly 103. And an air valve arranged on a side wall, for example, a hole can be formed on the side or the bottom of the loudspeaker assembly to allow air to enter and exit, so that the sound generated by pushing the air can be output. Specifically, the second magnetic element 103 and the first magnetic element 109 of the speaker device can be a plated, metalized or etched element (such as a chip), such as a micro-coil element, and the driving circuits thereof are electrically connected by wire bonding or flip chip. The micro-coil component may be used for both of the two components (the first magnetic component 109 and the second magnetic component 103) of the speaker component, or a group type micro-coil component formed by a plurality of micro-coil components, or one of them may be used, and the other may be a specific magnetic object.

According to the embodiment, when the magnetic elements (103, 109) are implemented by single or group type micro-coil elements, the micro-coil elements can generate a magnetic field after being energized, and the movement of the voice diaphragm 101 and the suspended edge thereof can be more detailed and output better sound because the impedance is better controlled. The embodiments of the components (the first magnetic component 109 and the second magnetic component 103) applied in the speaker component as described above are illustrated as a single micro-coil component or a multi-micro-coil component with reference to fig. 2 to 5.

The basic structure of the micro-coil assembly is shown in the embodiment shown in fig. 2, in which the micro-coil assembly can be formed by a plating or metallization process, or a masking and etching process on a substrate (e.g., an insulator) to form a continuous metal line 20, and electrical contacts are formed at two ends of the metal line 20, wherein the first electrode 21 at one end can be the negative electrode of the micro-coil assembly, and the second electrode 22 at the other end can be the positive electrode of the micro-coil assembly.

After the micro-coil assembly is connected to a power supply and powered on, a uniform magnetic field can be formed on the micro-coil assembly by the stable current flowing through the micro-coil assembly, and the material, the line width, the length, the number of turns and the like of the metal wire 20 are parameters determining the impedance value of the whole micro-coil assembly, so that the impedance and the condition of the magnetic field to be formed need to be known in designing the micro-coil assembly.

The main implementation aspect of the micro-coil assembly proposed according to the present disclosure is to form a plurality of break points on the metal wires on the micro-coil assembly according to the requirement, as shown in fig. 3, which is a schematic diagram of an embodiment of the wiring on the micro-coil assembly.

Fig. 3 shows a micro-coil unit 30, which has a wiring layer with icons and an electrode layer, wherein the wiring layer is provided with a plurality of metal wire segments (301, 302, …, 310) starting from a starting point and forming a plurality of continuous wiring circles around the starting point, and the starting point can be located at any position of the micro-coil assembly, preferably, a position close to a central region of the micro-coil assembly, but not limited thereto, and the starting point position can be determined according to actual requirements. The starting point forms a first electrode 31, such as the negative electrode of the micro-coil assembly, and the end of the metal wire segment, i.e., the end of the plurality of metal wire segments continuously wired, is the second electrode 32 of the micro-coil assembly, which may be the positive electrode of the micro-coil assembly.

Each of the plurality of metal line segments (301, 302, …, 310) has two end points, one of which is a first electrode end, such as an end of the first electrode 31 formed closer to the starting point; the other end is the second electrode 32, which is the end point closer to the end of the metal line segment.

Referring next to fig. 4, a schematic diagram of another embodiment of a contact surface in the microcoil device of fig. 3 is shown. The view shows the micro-coil assembly corresponding to the contacts 41 at two ends of the metal wire segments on the wiring layer, and the other electrodes corresponding to the first electrode 31 and the second electrode 32, such as the first electrode contact 31 'and the second electrode contact 32'.

According to the structural features of the wiring layers in the micro-coil assemblies shown in fig. 3 and 4, the design of the proposed micro-coil assembly can determine a total length, a line width, a distance between adjacent metal line segments, a length, a turn number, a turn distance of each metal line segment, and/or a material of the metal line segments according to actual requirements (such as impedance values, magnetic fields, or dimensions). The actual requirements are mainly the requirements of the applied micro-coil device, and it is also determined to use a single micro-coil assembly or to form several micro-coil assemblies as shown in fig. 5.

Referring to fig. 5, an array type micro-coil assembly 50 composed of a plurality of micro-coil units 30 arranged in an array is shown, and the shape of the array type micro-coil assembly 50 and the number of micro-coil assemblies are not shown to limit the scope of the present invention.

Similarly, a single micro-coil assembly 30 is shown with the wiring layer of the above-described embodiment, wherein a plurality of metal wire segments starting from a starting point and forming a plurality of circles of continuous wiring around the starting point, and an electrode layer are provided, wherein at least one first electrode region and at least one second electrode region are provided to respectively collect the first electrode end and the second electrode end of each metal wire segment, and one or more first electrode regions and one or more second electrode regions can be provided according to practical requirements and designs. It is worth mentioning that the first electrode region and the second electrode region, which collect the first electrode end and the second electrode end of each metal line segment, can realize the function of collecting each electrode end through an electrical connection layer in another assembly, for example, in the electrical connection layer, a plurality of metal lines can guide the first electrode end of each metal line segment on the wiring layer to the first electrode region of the electrode layer through a via hole (via) or a wire on the substrate, and also guide the second electrode end of each metal line segment to the second electrode region of the electrode layer.

Except for the above embodiments, the shape and number of turns of a single micro-coil assembly or the length and width of each line segment are not limited to the above square embodiments, but may be designed into different shapes according to actual requirements, and a plurality of micro-coil assemblies with different shapes or sizes may be provided in the array type micro-coil assembly according to actual requirements (such as the requirement of a magnetic field), which are not described herein again.

It is noted that, in addition to the design that may be specifically considered for a particular application, according to the main embodiment, each single micro-coil assembly shown in fig. 3 and 5, when energized, can generate currents in the same direction in a plurality of metal wire segments, i.e., can form a magnetic field equivalent to a multi-turn coil, and if the array type micro-coil assembly 50 composed of a plurality of micro-coil assemblies 30, can also generate an equivalent magnetic field that can eliminate the weak non-uniform magnetic field at the edges of the individual micro-coil assemblies as a whole.

It should be noted that the above-described micro-coil units 30 or array micro-coil assemblies 50 are not limited to the illustrated examples, wherein the starting point of the plurality of metal wire segments (e.g., the first electrode 31 shown in fig. 3) in each micro-coil unit can be an electrode end close to the central region, and the starting point can be located at any position deviated from the center according to the actual design.

Further, the assembly includes a first assembly (in the embodiment, a first chip) and a second assembly (in the embodiment, a second chip) that can form a first magnetic assembly and a second magnetic assembly, respectively, and one of the first and second magnetic assemblies can be a chip, the other one can be a magnetic assembly such as a magnet, or both the first and second magnetic assemblies can be chips. In embodiments where the magnetic assembly is implemented as a single microcoil assembly or as a plurality of groups of microcoil assemblies, there are a number of ways to increase the magnetic permeability of the magnetic assembly. For example, in one embodiment, when fabricating a magnetic component with a multi-layer structure, one or more layers of the structure may be plated with a magnetic conductive material instead of a circuit to increase the overall magnetic permeability of the magnetic component. In another embodiment, when the material of the magnetic component is selected, the substrate doped with the magnetic conductivity element is selected to manufacture the magnetic component, so that the overall magnetic conductivity of the magnetic component can be effectively increased. In yet another embodiment, after the magnetic component is fabricated, a layer of magnetic material can be directly plated on the structure on one side to increase the magnetic permeability of the component.

Referring next to the schematic diagram of the transducer assembly embodiment of FIG. 6, there is shown a transducer assembly 60, the transducer assembly 60 being constructed in two parts included in the cladding of the side wall 607.

The first part is a lower structure of the transducer module, wherein the first substrate 608 can be a common plastic substrate or a circuit board, a carrier 611 is formed on the first substrate 608, and then the first module 609 is formed on the carrier 611. According to an embodiment, the first component 609 may be a fixed chip (i.e., a first chip) connected to the carrier 611, and electrically connected to the circuit board by a wire 615, and may generate a fixed magnetic field after being powered on.

The second part is the upper half structure of the transducer assembly, the carrier 601 can be connected to the second substrate 603 through the conventional suspension edge, and the second substrate 603 preferably uses an elastic material to support the assembly of the carrier 601 and the second assembly 605, and can have the function of connecting circuits, and also has the effect of stabilizing the vibration of the assembly to generate damping, such as a Flexible Printed Circuit (FPC). The carrier 601 is provided with a second component 605, such as a second chip, which can be a general coil or a micro-coil unit or a plurality of micro-coil units as proposed in the above embodiments, and is electrically connected to the second substrate 603 through a second component wire bonding 613, and generates vibration by interaction with the first component 609 and the carrier wafer 611 after being energized.

It is noted that the second substrate 603 can be a flexible circuit board, and the material can be PI, PET, PEI, PEK, etc., and can replace the functions of the conventional dangling edge and the fixed core supporting plate, even in an embodiment, because it is an elastic material, it can directly replace the carrier (only one flexible circuit board), or in another embodiment, the carrier can be directly attached to the whole flexible circuit board without leaving holes.

In accordance with an embodiment of fabricating the transducer assembly, reference is made to fig. 7 (a) (B) (C) (D) (E) and fig. 8 (a) (B) (C) (D) (E), wherein a first portion of the embodiment is illustrated in fig. 7 (a) (B) (C) (D) (E), wherein a top view of one assembly is shown, as opposed to a side view. The related process can refer to the process embodiment shown in fig. 19.

Initially, as shown in fig. 7 (a), a first substrate 701 is provided (step S171 in fig. 19), and the first substrate 701 may be a printed circuit board (pcb) prepared with wiring (wiring), one of the main purposes is to provide a current to be introduced into the first chip 705. In fig. 7B, an air valve structure is formed on the first base 701 by means of a drill, a laser, etching, or the like (step S173 in fig. 19), which is used to output vibrating air, to form a first base 701' (which may be referred to as a first circuit board) having an air valve. In fig. 7 (C), the carrier 703 is formed at a position on the first substrate 701 'having the air valve (step S175 in fig. 19), and the carrier 703 is preferably made of a metal material, and the carrier 703 may be formed on the first substrate 701' having the air valve by plating or by pasting. In fig. 7 (D), the first chip 705 is bonded to the carrier 703, and the first chip 705 can be electrically connected to the first substrate 701 'with the dam through a wire bonding 707 or electrically connected to the first substrate 701' with the dam in a flip chip manner (step S177 in fig. 19). The first substrate 701' is configured for air flow and heat dissipation purposes. Finally, as shown in fig. 7 (E), a package 709 for protecting the first chip 705 and the carrier 703 may be formed by glue filling (step S179 in fig. 19). The package 709 may not be used in actual implementation, and the components in the transducer assembly may be protected by a housing formed by side walls.

Next, as shown in FIGS. 8 (A) (B) (C) (D) (E), a schematic view of an embodiment of fabricating a second portion of the transducer assembly is shown.

Next, a second part of the process is performed, and as shown in fig. 8 a, a second substrate 801 is provided (step S181 in fig. 19), according to the circuit design, the second substrate 801 may be processed to form a circuit board, which may be a flexible circuit board in one embodiment besides a general circuit board, and has a circuit thereon for electrically connecting a control circuit for controlling the operation of the transducer assembly and generating an electrical signal according to an input signal (e.g. audio), and the second substrate 801 is also used for supporting components in the transducer assembly, such as a carrier 805. As shown in fig. 8B, a hole 803 is formed in the second substrate 801 by etching, punching or the like (step S183 in fig. 19) to form a second substrate 801 '(which may be referred to as a second circuit board) having a hole, which is used to dispose the carrier 805 on the hole 803 as shown in fig. 8C, and the edge of the carrier 805 can be fixed to the second substrate 801' having a hole (step S185 in fig. 19). According to one of the above embodiments, when the second substrate 801 is a flexible circuit board, the second substrate itself can be directly used as the carrier 805 under a suitable material.

It is noted that the holes are provided as required, and in practice, the holes may optionally not be used, but the carrier 805 may be directly provided on the second substrate 801.

Next, as shown in fig. 8 (D), the assembly is turned over, a circuit board 807 is provided, which is a control circuit for controlling the operation of the transducer assembly and generating electrical signals according to the input signals (e.g., audio), and a second substrate 801' having holes is disposed on the circuit board 807 (step S187 in fig. 19). This example shows that this is a circular circuit board. As shown in fig. 8 (E), a second chip 809 is bonded to the middle portion of the carrier 805, and the second chip 809 is electrically connected to the second substrate 801 'having holes by wire bonding 811 or flip chip (step S189 in fig. 19), so that the second chip 809 is bonded to the second substrate 801'.

According to one embodiment, the second substrate 801 'with holes is used to support the vibratable carrier 805 and the second chip 809 as the carrier forming the sound wave, so that the second substrate 801' with holes can be made of flexible material and can form an elastic structure, and the carrier 805 can realize a diaphragm or a sound film, so that the carrier 805 can vibrate together with the supported carrier 805 as a whole. Furthermore, in one embodiment, the second substrate 801' with holes is not all of a flexible structure, but the portion connected to the carrier 805 is designed to be a flexible structure.

In operation, an electrical signal is generated according to the circuit board 807, such that the circuit board conducts current to the second chip 809, and the generated magnetic field interacts with the first chip 705 and the second chip 809 of the first portion, such that the carrier 805 vibrates along with the change of the current.

It should be noted that the step of manufacturing the first chip 705 and the second chip 809 (or one of them) may be to bond the first chip 705 that has been manufactured to the carrier 703 and attach the second chip 809 that has been manufactured to the carrier 805, or in these steps, a plating process, a metallization process, or an etching process is used to form the first chip 705 and the second chip 809 with multiple turns of multiple metal wire segments on the carrier 703 and the carrier 805, respectively.

Finally, the process of forming the transducer structure shown in fig. 9 with the first portion shown in fig. 7 (E) and the second portion shown in fig. 8 (E) (step S191 in fig. 19) includes applying conductive materials such as solder balls, solder paste or conductive paste to the peripheral points of the first portion structure, inverting the second portion, and placing the whole assembly into an oven to cure (cure) the bonded portion after controlling the distance between the two portions (step S193 in fig. 19).

FIG. 10A shows that one or more air flow structures for air to flow in and out are required to be disposed on the side walls of the transducer assembly, and the heat dissipation structure can also be formed by holes in the side walls 10 of the assembly, and the top view of the side walls 11 is shown in FIG. 10B, and the form of the holes is not limited to the figure, and the holes can also be formed in staggered manner on the side walls (12a, 12b,12c, 12d) around the transducer assembly as shown in FIG. 10C.

It is mentioned that holes are needed to be opened on the side wall of the transducer assembly for air to enter and exit, and the number and size of the holes are specially designed, wherein the number of the holes is prime (2, 3, 5, 7, 11, etc.), so that better effect can be achieved. The size of the holes can also change the sound, and if the total area of the holes is 0-20% of the area of the diaphragm, higher pitch can be generated; the total area of the holes is 20-50% of the diaphragm area, or larger, and can produce bass. The drilling method can be machine drilling, laser, etching, etc.

The height of the holes affects the overall sound production efficiency, mainly because when the distance between the chips in the upper and lower parts of the transducer assembly is controlled, the magnetic field and the stroke (stroke) are changed, the stroke and the sound are related in such a way that the stroke required by higher sound is smaller, the stroke required by lower sound is larger, and the sound production efficiency is affected by too long distance.

In view of the above, when the transducer assembly provided by the present disclosure converts an electrical signal into a vibration signal, a speaker assembly, or a driving assembly in a specific type of motor, can be realized, and fig. 11 next shows a form in which the magnetic conductive metal 112 is disposed on the circuit board 110, which can be in an array form as shown in the figure according to the requirement.

Fig. 12 next shows a structure of forming a magnetic conductive metal 123 and a magnetic component 125 on a circuit board 121 in the speaker component, in this structural embodiment, the magnetic component (covering the first and second magnetic components) can be electrically connected to the circuit board 121 by wire bonding 127. As shown in fig. 13, a magnetic conductive metal 133 and a magnetic element 135 are formed on a circuit board 131, in this example, the magnetic element 135 is formed on the magnetic conductive metal 133 in a flip-chip manner, in which a solder joint 137 is schematically shown and electrically connected to the circuit board 131 through a circuit.

In one embodiment, the magnetic conductive member can be omitted from the speaker assembly, as shown in fig. 14, the magnetic element 143 is electrically connected to the circuit board 141 directly in a flip-chip manner by the solder 145. That is, the magnetic assembly 143 is directly responsible for stabilizing the magnetic field. The design purpose of the magnetic conductive metal is to enhance the efficiency of the magnetic field, when the side wall of the loudspeaker component uses the magnetic conductive metal material, the magnetic conductive metal does not need to be additionally arranged, the shape of the magnetic conductive metal can be a sheet shape, and the area of the magnetic conductive metal is equal to or within 10% larger than the area of the magnetic conductive metal determined according to the shape of the fixed magnetic field; the shape of the magnetic field generator can be bowl-shaped, the fixed magnetic field is surrounded, only the upper part is exposed, and the height of the magnetic field generator is higher than that of the fixed magnetic field; the thickness of the magnetic conductive metal is larger than or equal to that of the fixed magnetic field.

Fig. 15 is a schematic view of a speaker assembly according to an exemplary embodiment, and fig. 16 is a perspective view of the speaker assembly after assembly. According to the above manufacturing method, the main components of the speaker assembly include the diaphragm 151, the suspended edge 153, and the second magnetic member 155, and the first magnetic member 158 and the circuit board 159 are combined through the side wall 157. In one embodiment, the upper half structure of the side wall 157 is partially connected to the upper half structure, and may be integrally formed with the side wall, or may be separately produced, and if the circuit needs to be integrally connected, the contacts may be exposed at the bottom or the side, and the material of the side wall 157 may be magnetic conductive metal, plastic injection molding, PCB, FPCB, or the like. If the side wall is designed to be made of magnetic conductive metal, the thickness of the side wall is more than or equal to that of the fixed magnetic field.

Fig. 17 shows one example of an embodiment of a speaker assembly implemented by a transducer assembly, which shows a speaker assembly whose main components include a diaphragm 171 provided on a suspension 173, and includes a first magnetic member 177 and a second magnetic member 175 implemented by a transducer assembly, which can replace conventional magnetic members such as a coil and a magnet in a conventional speaker assembly, and determine the vibration mode of the diaphragm 171 by the magnetic field variation of the magnetic members, and these members are combined with a circuit board 179 to form the speaker assembly, in which case, air holes 176,178 for allowing air to flow are formed on the circuit board 179.

Fig. 18 shows another embodiment, which illustrates a first magnetic element 187 and a second magnetic element 183 implemented by transducer elements, and a sound film 181 disposed on the suspension edge 182, wherein the sound film 181 moves according to the interaction between the first magnetic element 187 and the second magnetic element 183 due to the magnetic field variation, so as to generate sound waves. The device is connected with a circuit through a metal structure 185, air holes 186 and 188 for sound wave flow are formed in the metal structure 185, and particularly, an upper suspension edge 182,189 is arranged on the metal structure in this example, the metal structure can carry a first magnetic assembly 187 and a second magnetic assembly 183, and the loudspeaker assembly is realized after the whole combination.

In summary, according to the above-mentioned embodiments of the transducer assembly and the method for manufacturing the transducer assembly, the magnetic assembly can be a semiconductor chip, and the mode of the chip in the transducer assembly can be realized by a single micro-coil assembly, or the mode of the chip can be realized by a plurality of micro-coil assemblies forming a plurality of micro-coil assemblies, and particularly, because each micro-coil assembly is composed of a plurality of metal wire segments, compared to the coil design of the prior art, the concept of the micro-coil design proposed in the present disclosure is to stack the magnetic field in a winding manner by a plurality of unconnected wires, which has an objective of increasing the current density and reducing the overall resistance in a parallel manner. Therefore, in the electrical design, the cathodes of a plurality of line segments of each micro-coil assembly are connected to a cathode contact area, the anodes of a plurality of line segments of a plurality of micro-coil assemblies are connected to an anode contact area, not only can a plurality of metal line segments be connected in parallel with each other, but also can be respectively connected in parallel to a total cathode contact area and a total anode contact area, and the wiring design that a plurality of micro-coil assemblies are connected in parallel with each other is also achieved. In design, various wiring parameters of the metal wire segment in the micro-coil assembly can be determined according to actual requirements such as impedance value, magnetic field or size, and diversified applications are provided.

The disclosure is only a preferred embodiment of the invention and should not be taken as limiting the scope of the invention, so that the invention is not limited by the disclosure of the specification and drawings.

Claims (20)

1. A method of manufacturing a transducer assembly, the method comprising:

forming a first portion of the transducer assembly, comprising:

preparing a first substrate;

the first substrate is combined with a first assembly which is connected with the first substrate;

forming a second portion of the transducer assembly, comprising:

preparing a second substrate;

forming a carrier on the second substrate, wherein the edge of the carrier is fixed on the second substrate;

combining a second assembly on the carrier, wherein the second assembly is connected with the second substrate;

combining the first portion and the second portion to form the transducer assembly.

2. The method of claim 1, wherein a second substrate is used to support the carrier, and the second component is electrically connected to the second substrate.

3. The method of claim 2, wherein the second substrate is linked to the carrier by a flexible structure.

4. The method of claim 2, wherein a current is introduced through the second substrate to the second assembly, and the magnetic field generated interacts with the first assembly to cause the carrier to vibrate as the current changes.

5. The method of claim 4, wherein the first component is protected by a package in the first portion after the electrical connection is made.

6. The method of claim 1, wherein a carrier is formed on the first substrate, and the first substrate is bonded to the first component through the carrier.

7. The method of claim 6, wherein a hole is formed in the second substrate and a carrier is formed over the hole.

8. The method of claim 1, wherein an air circulation structure is formed on the first substrate after the first substrate is provided.

9. The method of any one of claims 1 to 8, wherein the first component or the second component is a micro-coil component or a multi-piece micro-coil component formed by a plurality of micro-coil components, wherein the micro-coil component comprises:

a wiring layer, which is provided with a plurality of metal line segments starting from a starting point and forming a plurality of circles of continuous wiring around the starting point, wherein two ends of each metal line segment are a first electrode end and a second electrode end, the starting point is a first electrode of the micro-coil component, and the tail ends of the plurality of metal line segments of continuous wiring are a second electrode of the micro-coil component; and

and the electrode layer is provided with at least one first electrode region and at least one second electrode region, the at least one first electrode region is used for collecting the first electrode end of each metal line segment in the plurality of metal line segments, and the at least one second electrode region is used for collecting the second electrode end of each metal line segment in the plurality of metal line segments.

10. The method of claim 9, wherein the micro-coil assembly further comprises an electrical connection layer in which a plurality of metal wires guide the first electrode end of each metal wire segment on the wiring layer to the at least one first electrode region of the electrode layer and guide the second electrode end of each metal wire segment to the at least one second electrode region of the electrode layer.

11. The method of claim 10, wherein a total length, a line width, a pitch between adjacent metal line segments, a length, a turn, a pitch of each metal line segment, and/or a material of the metal line segment in the micro-coil assembly are determined according to impedance, magnetic field, or size requirements.

12. A transducer assembly, said transducer assembly comprising:

a first part comprising:

a first substrate;

a first assembly connected to the first substrate;

a second part comprising:

a second substrate;

a carrier formed on the second substrate, an edge of the carrier being fixed to the second substrate;

a second assembly combined with the carrier, the second assembly being connected to the second substrate;

wherein the transducer assembly is formed by combining the first portion and the second portion.

13. The transducer assembly of claim 12, wherein a hole is formed in the second substrate and a carrier is formed over the hole.

14. The transducer assembly of claim 13, wherein a second substrate is used to support the carrier, the second assembly being electrically connected to the second substrate; a current is conducted through the second substrate to the second assembly, and the generated magnetic field interacts with the first assembly, so that the carrier vibrates along with the change of the current.

15. The transducer assembly of claim 12, wherein the second substrate is linked to the carrier by a resilient structure.

16. The transducer assembly of claim 12, wherein a carrier is formed on the first substrate, the first substrate being coupled to the first assembly via the carrier.

17. The transducer assembly of claim 12, wherein the first and second elements are a first and second magnetic elements, respectively, and wherein one or more of the first and second magnetic elements having a multi-layer structure are coated with a magnetically conductive material.

18. The transducer assembly of claim 12, wherein the first element and the second element are a first magnetic element and a second magnetic element, respectively, and the first or second magnetic element is made of a substrate selected to be doped with a magnetic permeability element.

19. The transducer assembly of claim 12, wherein the first assembly and the second assembly are a first magnetic assembly and a second magnetic assembly, respectively, and a layer of magnetically permeable material is deposited on a side structure of the first or second magnetic assembly.

20. The transducer assembly of any of claims 12-19, wherein the first assembly or the second assembly is a micro-coil assembly or a multi-piece micro-coil assembly formed by a plurality of micro-coil assemblies, wherein the micro-coil assembly comprises:

a wiring layer, which is provided with a plurality of metal line segments starting from a starting point and forming a plurality of circles of continuous wiring around the starting point, wherein two ends of each metal line segment are a first electrode end and a second electrode end, the starting point is a first electrode of the micro-coil component, and the tail ends of the plurality of metal line segments of continuous wiring are a second electrode of the micro-coil component; and

and the electrode layer is provided with at least one first electrode region and at least one second electrode region, the at least one first electrode region is used for collecting the first electrode end of each metal line segment in the plurality of metal line segments, and the at least one second electrode region is used for collecting the second electrode end of each metal line segment in the plurality of metal line segments.

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