CN115491082A - Ag @ SiO for silica gel key 2 Modified conductive ink and preparation method thereof - Google Patents
Ag @ SiO for silica gel key 2 Modified conductive ink and preparation method thereof Download PDFInfo
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- CN115491082A CN115491082A CN202211132927.1A CN202211132927A CN115491082A CN 115491082 A CN115491082 A CN 115491082A CN 202211132927 A CN202211132927 A CN 202211132927A CN 115491082 A CN115491082 A CN 115491082A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3045—Treatment with inorganic compounds
- C09C1/3054—Coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/06—Treatment with inorganic compounds
- C09C3/063—Coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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Abstract
The invention discloses Ag @ SiO for a silica gel key 2 The modified conductive ink comprises the following components in parts by mass: 300 to 400 portions of printing ink and 3 to 30 portions of SiO 2 Powder, 3-40 parts of Ag @ SiO 2 A core-shell powder; the SiO 2 The grain diameter of the powder is 100 nm-5 mu m; the Ag @ SiO 2 The particle size of the core-shell powder is 1 to 10 μm. The invention solves the problems of poor adhesive force and poor mechanical property of the existing conductive ink, which results in shorter service life of the key. The invention prepares Ag @ SiO 2 The modified conductive ink enhances the adhesive force between the conductive layer and the key while maintaining high conductivity, and optimizes the key pressThe key joint touches district mechanical properties, has improved the life of button.
Description
Technical Field
The invention relates to conductive ink, in particular to Ag @ SiO for a silica gel key 2 Modified conductive ink and a preparation method thereof.
Background
The conductive ink is printed on a non-conductive substrate to provide the substrate with the ability to conduct electrical current and dissipate accumulated static charge. The conductive ink is one of conductive pastes. At present, keys using silicon rubber as a base material in the field of electronic appliances account for over 75 percent of various keys, and conductive silicon rubber keys are the most mature in technology, the most extensive in application and the best in development prospect among numerous key products. The silicon rubber has the characteristics of large specific surface area, high internal porosity and large water absorption capacity. The conductive silica gel key mainly comprises amorphous silicon dioxide and a certain amount of crystal water, and the chemical formula can be expressed as follows: mSiO 2 ·nH 2 And O. Because the surface of the silicon rubber is smooth, the dielectric constant is less than 2.8, the macromolecule polarity is low, the chemical inertness is difficult to bond with other materials, and the sizing agent including the conductive ink is difficult to be firmly printed on the surface of the silicon rubber key. Therefore, the adhesion of the printed matter directly determines the service life of the key. In addition, the conductive ink can be applied to the surfaces of flexible substrates, curved surfaces, cambered surfaces, flexible display screens and the like, and therefore the stretch resistance of the ink needs to be considered.
The conductive filler of the ink mainly comprises graphite, carbon black, carbon fiber andthe composition of the mixture. However, the resistivity of the amorphous carbon black is larger than that of graphite, and the conductivity of the prepared ink after curing is lower (10) -2 ～10 2 Omega cm) and has poor moisture resistance, large temperature coefficient and weak adhesive force, and can only be used for electronic products with low requirements on conductivity. One way to effectively improve the electrical conductivity is by adding metal powder, providing an additional electrical connection bridge, thereby improving the electrical conductivity of the slurry. The common metal conductive fillers are silver, copper and gold. From the viewpoint of conductivity, the bulk resistivity of silver is 1.6X 10 -6 Omega cm, 1.7X 10 copper -6 Omega. Cm, gold 2.3X 10 -6 Omega cm, gold is about 25 times as much as silver and 8000 times as much as copper in terms of price. Copper is low in price, so that the development is fast at present, but copper is easily oxidized in air, poor in stability, high in modification treatment cost and only capable of being used for low-precision parts with low reliability requirements, and the conductivity of copper is affected. Therefore, the paste using silver as the conductive phase has been a hot spot in selection and research and development of electronic products, and is often used in situations with high requirements for reliability, conductivity and conductive layer precision. Under the influence of factors such as cost, curing characteristics, mechanical characteristics and the like, the conductive paste prepared by using the traditional silver powder as the conductive filler is gradually replaced by the nano silver powder conductive paste. However, the ink with the metal silver conductive phase added has lower mechanical strength, poorer wear resistance and higher cost.
The silicon dioxide powder has the characteristics of low price, no toxicity, stability, good heat conductivity and wear resistance and lower thermal expansion coefficient, and the silicon dioxide powder is added to adjust the thermal expansion coefficient mismatching of the composite ink and the matrix silicon rubber, so that the thermal deformation of the ink is smaller in the using process, the thermal property of the ink is improved, and the service life of the ink is prolonged. Meanwhile, the silicon dioxide powder can effectively improve mechanical properties such as hardness, tensile strength and the like of the ink, so that the composite conductive ink can be better suitable for a flexible substrate. However, the addition of silica powder results in poor conductivity of the ink.
Disclosure of Invention
The invention aims to provide Ag @ SiO for a silica gel key 2 The modified conductive ink and the preparation method thereof solve the problems of poor adhesive force and poor mechanical property of the existing conductive ink, which results in shorter service life of the key.
In order to achieve the purpose, the invention provides Ag @ SiO used for the silica gel key 2 The modified conductive ink comprises the following components in parts by mass:
300 to 400 portions of printing ink and 3 to 30 portions of SiO 2 Powder, 3-40 parts of Ag @ SiO 2 A core-shell powder; the SiO 2 The particle size of the powder is 100 nm-5 mu m; the Ag @ SiO 2 The particle size of the core-shell powder is 1 to 10 μm.
Preferably, the SiO 2 The particle size of the powder was 5 μm.
Preferably, the Ag @ SiO 2 The particle size of the core-shell powder was 5 μm.
Ag @ SiO for silica gel key 2 A method of preparing a modified conductive ink, the method comprising:
(1) Mixing silicon dioxide powder with methanol or ethanol, dispersing, adding stannous chloride, sealing (preventing dust, water drops and other impurities in the environment from entering), and preserving heat at 50-80 ℃ to obtain modified silicon dioxide powder;
(2) Mixing ammonia water, silver nitrate, sodium hydroxide and the modified silicon dioxide powder obtained in the step (1) to obtain silver plating solution; mixing glucose, tartrate and deionized water to obtain a reducing solution; adding the reducing solution into the silver plating solution, centrifuging, washing, drying the lower layer suspension at 60-80 ℃ to obtain Ag @ SiO 2 Core-shell powders. Ag @ SiO 2 The core-shell powder is Ag @ SiO 2 Core-shell structured powder, silver coated on SiO 2 Of (2) is provided. Ag @ SiO 2 The core-shell powder has a particle size of 1-10 microns and a resistivity of 10 -1 ～10 -3 Ω·cm。
(3) Mixing and stirring the ink and the acrylic resin liquid, controlling the viscosity to be 1-4 Pa.s (the mass of the added acrylic resin liquid is 30-40 percent of the total mass of the ink and the acrylic resin liquid, and the corresponding viscosity is 1-4 Pa.s after the acrylic resin liquid is added), addingSiO 2 Powder and Ag @ SiO obtained in step (2) 2 And mixing and dispersing the core-shell powder, defoaming in vacuum (10 KPa), and oscillating to obtain the modified conductive ink.
The viscosity is mainly related to the conditions of screen printing and curing of the subsequent process, and if the viscosity of the invention is too high, the screen printing effect is poor, and the circuit pattern is incomplete; if the viscosity is too low, the accuracy of the silk-screen printing pattern is not enough, and the pattern area is easy to expand.
Preferably, the alcohol in the step (1) is ethanol, and the mass ratio of the silicon dioxide powder, the ethanol and the stannous chloride is (20-40): (200-400): (5-25); the heat preservation time at 50-80 ℃ is 12 hours, so that the ethanol is completely volatilized.
Preferably, the mass ratio of the ammonia water, the silver nitrate, the sodium hydroxide and the modified silicon dioxide powder in the step (2) is (60-100): (8-14): (4-6): (20 to 60).
Preferably, the mass ratio of the glucose, the tartrate and the deionized water in the step (2) is (18-24): (15-30): (1200-150).
Preferably, the centrifugation in step (2) is at 10000r/min for 5min.
Preferably, the drying time in the step (2) is 24 hours.
Preferably, the oscillation in step (3) is an eccentric variable frequency oscillation.
More preferably, the oscillation in the step (3) adopts eccentric variable frequency oscillation for 1 hour, and the time is less than 1 hour, so that the ink cannot be sufficiently dispersed, and the ink is not uniform; the oscillation time is more than 1 hour, and the oscillation dispersion effect is not obviously improved.
The invention relates to Ag @ SiO used for a silica gel key 2 Modified conductive ink and a preparation method thereof. The problem of current conductive ink adhesive force poor, mechanical properties are not good, lead to button life shorter is solved, have following advantage:
1. ag @ SiO used in the invention 2 The core-shell powder has the characteristics of higher electric conductivity, higher heat conductivity and lower thermal diffusion coefficient, so that the Ag @ SiO powder is prepared 2 The modified conductive ink has better conductivityAnd heat-conducting properties;
2. the invention adopts Ag @ SiO 2 With SiO 2 The Ag @ SiO is prepared by adjusting the adding proportion of the additive and the additive 2 The modified conductive ink enhances the adhesive force between the conductive layer and the key while maintaining high conductivity, optimizes the mechanical property of a key contact area, and prolongs the service life of the key.
Drawings
FIG. 1 is an Ag @ SiO of the present invention 2 Scanning electron microscope images of the powder.
FIG. 2 shows Ag @ SiO of the present invention 2 Scanning electron microscope images of the modified conductive ink.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Reagents and corresponding treatments used in the following examples of the invention:
the silicon dioxide is purchased from Dowanglong chemical reagent factory, AR,200 mesh, and the purchase is ground to obtain SiO with the grain diameter of 100 nm-5 mu m 2 And (3) pulverizing.
Example 1
A Ag @ SiO for silica gel button 2 A method of preparing a modified conductive ink, the method comprising:
(1) Mixing 20 parts (by mass, the following parts are parts by mass) of silicon dioxide powder with 200 parts of absolute ethyl alcohol, dispersing for 15min by using ultrasonic, then adding 5 parts of stannous chloride, sealing by using tinfoil, putting into an electric heating air blowing drying oven, and preserving heat for 12 hours at 50 ℃ until the ethyl alcohol is completely volatilized to obtain modified silicon dioxide powder;
(2) Mixing 60 parts of ammonia water, 8 parts of silver nitrate, 4 parts of sodium hydroxide and 20 parts of modified silicon dioxide powder obtained in the step (1) to obtain silver plating solution; mixing 18 parts of glucose, 15 parts of sodium potassium tartrate and 1200 parts of deionized water to obtain a mixtureLiquid; adding the reduction solution into the silver plating solution while stirring, centrifuging in a centrifuge at 10000r/min for 5min, washing with deionized water, pouring out the supernatant, repeating the centrifuging and washing operation until the supernatant is clear and transparent, drying the lower layer suspension in an electrothermal blowing drying oven at 60 deg.C for 24 hr to obtain Ag @ SiO 2 Core-shell powder having an average particle diameter of 10 μm and a specific resistance of 10 -3 Ω·cm。
(3) Adding 300 parts of ink and acrylic resin liquid (the mass of the added acrylic resin liquid is 30-40% of the total mass of the ink and the acrylic resin liquid) into a dispersion kettle, fully stirring to obtain mixed ink with the viscosity of 1-4 Pa.s, and then adding 3 parts of SiO 2 Powder (particle size 5 μm) and 3 parts of Ag @ SiO obtained in step (2) 2 And mixing and dispersing core-shell powder (with the particle size of 5 mu m), defoaming in vacuum (10 KPa), and oscillating for 1 hour by adopting eccentric frequency conversion to obtain the modified conductive ink.
Example 2
A Ag @ SiO for silica gel button 2 A method of preparing a modified conductive ink, which is substantially the same as the method of preparing example 1, except that:
in the step (3), 400 parts of printing ink and acrylic resin liquid are put into a dispersion kettle to be fully stirred, the viscosity is controlled to be 1-4 Pa.s, and then 30 parts of SiO is added 2 Powder (particle size 1 μm) and 40 parts of Ag @ SiO obtained in step (2) 2 Mixing and dispersing core-shell powder (with the particle size of 1 mu m), defoaming in vacuum (10 KPa), and vibrating by adopting eccentric frequency conversion for a certain time to obtain the modified conductive ink.
Example 3
Ag @ SiO for silica gel key 2 A method of preparing a modified conductive ink, substantially the same as that of example 2, except that:
in step (3), siO 2 The particle size of the powder was 100nm.
Example 4
A Ag @ SiO for silica gel button 2 A method of preparing a modified conductive ink, substantially the same as that of example 1, except that:
in step (3), ag @ SiO 2 The core-shell powder is 30 parts by mass and has a particle size of 10 μm.
Example 5
A Ag @ SiO for silica gel button 2 A method of preparing a modified conductive ink, which is substantially the same as the method of preparing example 1, except that:
SiO in step (3) 2 The particle size of the powder is 100nm, and the mass portion is 30 portions; ag @ SiO 2 The particle size of the core-shell powder is 10 μm, and the mass portion is 30 portions.
Example 6
A Ag @ SiO for silica gel button 2 A method of preparing a modified conductive ink, which is substantially the same as the method of preparing example 1, except that:
in the step (1), mixing the silicon dioxide powder, the absolute ethyl alcohol and the stannous chloride in parts by mass: 40 parts, 400 parts and 25 parts;
in the step (2), ammonia water, silver nitrate, sodium hydroxide and the modified silicon dioxide powder obtained in the step (1) are sequentially prepared from the following components in parts by weight: 100 parts, 14 parts and 6 parts; the glucose, the potassium sodium tartrate and the deionized water sequentially comprise the following components in parts by weight: 24 parts, 30 parts and 1500 parts; followed by the same operation as in example 1 to obtain Ag @ SiO 2 Core-shell powders.
Example 7
Ag @ SiO for silica gel key 2 A method of preparing a modified conductive ink, substantially the same as that of example 1, except that:
in the step (1), keeping the temperature at 80 ℃ for 12 hours;
in the step (2), drying for 24 hours at 80 ℃; followed by the same operation as in example 1 to obtain Ag @ SiO 2 Core-shell powders.
Comparative example 1
A method of preparing a conductive ink, which is substantially the same as that of example 1, except that:
the steps (1) to (2) are omitted;
in the step (3), ag @ SiO is not added 2 Core-shell powders.
Example 1 analysis of the Properties of conductive ink
The adhesion, the sheet resistance, the tensile strength and the thermal diffusion system of the modified conductive ink prepared in example 1 were measured at normal temperature and pressure, the measurement results are shown in table 1, and the specific data and the adopted instruments are as follows:
table 1 testing the properties of the modified conductive ink prepared in example 1
From the results in Table 1, it can be seen that the adhesion force of the conductive ink prepared in example 1 on the silicone key is increased from 3B to 4B, the sheet resistance is decreased from 8k Ω/\9633, the sheet resistance is decreased from about 1k Ω/\ 9633, the hardness is increased from 198Hv0.5 to 232Hv0.5, and the thermal diffusivity is increased from 0.18cm 2 ·s -1 Left and right are lifted to 0.24cm 2 ·s -1 And about, the tensile strength is also obviously improved.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (10)
1. A Ag @ SiO for silica gel button 2 The modified conductive ink is characterized by comprising the following components in parts by mass:
300 to 400 portions of printing ink and 3 to 30 portions of SiO 2 Powder, 3-40 parts of Ag @ SiO 2 A core-shell powder;
the SiO 2 The particle size of the powder is 100 nm-5 mu m;
the Ag @ SiO 2 The particle size of the core-shell powder is 1 to 10 μm.
2. An Ag @ SiO for silica gel keys according to claim 1 2 Modified conductive ink, and process for producing the sameCharacterized in that the SiO 2 The particle size of the powder was 5 μm.
3. Ag @ SiO for silica gel keys according to claim 1 2 The modified conductive ink is characterized in that the Ag @ SiO 2 The particle size of the core-shell powder was 5 μm.
4. An Ag @ SiO for silica gel key as claimed in any one of claims 1-3 2 A method of preparing a modified conductive ink, the method comprising:
(1) Mixing silicon dioxide powder with methanol or ethanol, dispersing, adding stannous chloride, sealing, and keeping the temperature at 50-80 ℃ to obtain modified silicon dioxide powder;
(2) Mixing ammonia water, silver nitrate, sodium hydroxide and the modified silicon dioxide powder obtained in the step (1) to obtain silver plating solution; mixing glucose, tartrate and deionized water to obtain a reducing solution; adding the reducing solution into the silver plating solution, centrifuging, washing, and drying the lower layer suspension at 60-80 ℃ to obtain Ag @ SiO 2 A core-shell powder;
(3) Mixing and stirring the ink and the acrylic resin liquid, controlling the viscosity to be 1-4 Pa.s, adding SiO 2 Powder and Ag @ SiO obtained in step (2) 2 And mixing the core-shell powder, dispersing, defoaming in vacuum, and oscillating to obtain the modified conductive ink.
5. Ag @ SiO for silica gel keys according to claim 4 2 The preparation method of the modified conductive ink is characterized in that the alcohol in the step (1) is ethanol, and the mass ratio of the silicon dioxide powder, the ethanol and the stannous chloride is (20-40): (200-400): (5-25); the heat preservation time at 50-80 ℃ is 12 hours.
6. Ag @ SiO for silica gel keys according to claim 4 2 The preparation method of the modified conductive ink is characterized in that the mass ratio of the ammonia water, the silver nitrate, the sodium hydroxide and the modified silicon dioxide powder in the step (2) is (60-100):(8～14)：(4～6)：(20～60)。
7. ag @ SiO for silica gel keys according to claim 4 2 The preparation method of the modified conductive ink is characterized in that the mass ratio of the glucose, the tartrate and the deionized water in the step (2) is (18-24): (15-30): (1200-150).
8. The Ag @ SiO for silica gel key of claim 4 2 The preparation method of the modified conductive ink is characterized in that the centrifugation in the step (2) is performed for 5min at 10000 r/min.
9. The Ag @ SiO for silica gel key of claim 4 2 The preparation method of the modified conductive ink is characterized in that the drying time in the step (2) is 24 hours.
10. The Ag @ SiO for silica gel key of claim 4 2 The preparation method of the modified conductive ink is characterized in that the oscillation in the step (3) adopts eccentric variable frequency oscillation.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211132927.1A CN115491082A (en) | 2022-09-16 | 2022-09-16 | Ag @ SiO for silica gel key 2 Modified conductive ink and preparation method thereof |
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| CN202211132927.1A CN115491082A (en) | 2022-09-16 | 2022-09-16 | Ag @ SiO for silica gel key 2 Modified conductive ink and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010018473A1 (en) * | 2000-01-31 | 2001-08-30 | Takayoshi Otomo | Ink for silicone rubber, and molded silicone rubber |
| JP2009062525A (en) * | 2007-08-09 | 2009-03-26 | Mitsubishi Materials Corp | Conductive ink and method for manufacturing electrode substrate for plasma display panel using it |
| JP2012079457A (en) * | 2010-09-30 | 2012-04-19 | Taiyo Holdings Co Ltd | Conductive paste and conductive pattern |
| CN110903695A (en) * | 2019-12-23 | 2020-03-24 | 江门市阪桥电子材料有限公司 | Silica gel ink with high reflection performance |
-
2022
- 2022-09-16 CN CN202211132927.1A patent/CN115491082A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010018473A1 (en) * | 2000-01-31 | 2001-08-30 | Takayoshi Otomo | Ink for silicone rubber, and molded silicone rubber |
| JP2009062525A (en) * | 2007-08-09 | 2009-03-26 | Mitsubishi Materials Corp | Conductive ink and method for manufacturing electrode substrate for plasma display panel using it |
| JP2012079457A (en) * | 2010-09-30 | 2012-04-19 | Taiyo Holdings Co Ltd | Conductive paste and conductive pattern |
| CN110903695A (en) * | 2019-12-23 | 2020-03-24 | 江门市阪桥电子材料有限公司 | Silica gel ink with high reflection performance |
Non-Patent Citations (5)
| Title |
|---|
| YUJIE ZHENG, XIUTAO YANG, QIANYAN ZHAO: "\"Approach to the Modification of Carbon-Based Composite Conductive Ink for Silicone Keypads\"", 《COATINGS》, no. 12 * |
| 李金泽: ""Ag@SiO2复合填料导电胶的制备与表征"", 《中国优秀硕士学位论文全文数据库工程科技I辑》, pages 016 - 814 * |
| 李金泽: ""SiO2@Ag复合填料导电胶的制备与表征"", 《中国优秀硕士学位论文全文数据库工程科技Ⅰ辑》, pages 016 - 814 * |
| 黄茜, 《中国优秀硕士学位论文全文数据库 工程科技I辑》, pages 18 - 19 * |
| 黄茜， 黄惠， 郭忠诚: "\"二氧化硅微球化学镀银\"", 《电镀与精饰》, vol. 36, no. 5 * |
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