CN115488330A - Method for producing copper pellet and copper pellet - Google Patents
Method for producing copper pellet and copper pellet Download PDFInfo
- Publication number
- CN115488330A CN115488330A CN202110614981.9A CN202110614981A CN115488330A CN 115488330 A CN115488330 A CN 115488330A CN 202110614981 A CN202110614981 A CN 202110614981A CN 115488330 A CN115488330 A CN 115488330A
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- Prior art keywords
- copper
- slurry
- copper powder
- raw material
- primary
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 114
- 239000010949 copper Substances 0.000 title claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000008188 pellet Substances 0.000 title claims description 7
- 239000002245 particle Substances 0.000 claims abstract description 54
- 239000002994 raw material Substances 0.000 claims abstract description 32
- 239000002002 slurry Substances 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 6
- 238000006722 reduction reaction Methods 0.000 claims abstract description 6
- 229920005596 polymer binder Polymers 0.000 claims description 24
- 239000002491 polymer binding agent Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 14
- 229920002472 Starch Polymers 0.000 claims description 8
- 229920001592 potato starch Polymers 0.000 claims description 5
- 229920002261 Corn starch Polymers 0.000 claims description 4
- 240000003183 Manihot esculenta Species 0.000 claims description 4
- 235000016735 Manihot esculenta subsp esculenta Nutrition 0.000 claims description 4
- 239000008120 corn starch Substances 0.000 claims description 4
- 235000019698 starch Nutrition 0.000 claims description 4
- 239000008107 starch Substances 0.000 claims description 4
- 229940100445 wheat starch Drugs 0.000 claims description 4
- 239000008236 heating water Substances 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000009692 water atomization Methods 0.000 abstract description 4
- 229920000642 polymer Polymers 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/142—Thermal or thermo-mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/145—Chemical treatment, e.g. passivation or decarburisation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
- B22F5/106—Tube or ring forms
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Engineering & Computer Science (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention discloses a method for manufacturing copper particles and the copper particles. The manufacturing method provided by the invention comprises the following steps: mixing a primary copper powder raw material, a high-molecular adhesive and water to prepare slurry; heating the slurry to prepare a secondary copper powder raw material; and carrying out reduction reaction on the secondary copper powder raw material to prepare copper particles. Wherein, the primary copper powder raw material can be copper powder prepared by a water atomization method. The copper particles prepared by the invention contain more than three primary copper powders which are connected into a chain. The invention has the advantages that the manufacturing method is simple and easy for mass production, and the manufactured copper particles have larger surface area, lower apparent density and better capillary force. When the copper particles are used for manufacturing the heat pipe, the heat dissipation efficiency can be improved. In addition, the copper particles of the invention have simple components and do not affect the reliability of the heat pipe.
Description
Technical Field
The present invention relates to a metal particle and a method for manufacturing the metal particle, and more particularly, to a copper particle and a method for manufacturing the copper particle.
Background
The use of heat pipes has become increasingly common in the field of heat dissipation. The working principle of the heat pipe is that the inner wall surface of the heat pipe is provided with a capillary structure, so that the working fluid in the heat pipe can rapidly flow along the capillary structure to instantly transfer heat. The capillary structure of the heat pipe has various forms, wherein the copper powder sintered capillary structure has stronger capillary force, larger heat transfer capacity and better anti-gravity effect, and is most commonly used in the fields of high-power servers, high-level notebook computers and industrial computers.
In the manufacturing process of the heat pipe, copper powder raw materials are sintered in the inner wall surface of a pipe body. The method for producing a copper powder material mainly includes a water atomization method, an electrolysis method, a agglomeration method, and a ball milling method, and a low apparent density (apparent density) copper powder material is produced. To further reduce the apparent density and increase porosity, oxygen enrichment is used in the water atomization process, whereby voids or cracks are formed in the surface of the copper powder material. However, the copper powder material produced after the oxygen increasing operation may be oxidized, which will affect the performance of the sintered capillary structure and the reliability of the produced heat pipe.
In view of the above, a better solution is proposed, and a problem to be solved is needed in the art.
Disclosure of Invention
The invention mainly aims to provide a method for manufacturing copper particles and the copper particles, wherein the method for manufacturing the copper particles is simple and easy to produce in mass, and the manufactured copper particles have large surface area and lower apparent density.
To achieve the above object, the manufacturing method of the present invention sequentially comprises the following steps:
mixing a primary copper powder raw material, a high-molecular adhesive and water to prepare slurry;
heating the slurry to prepare a secondary copper powder raw material; and
and carrying out reduction reaction on the secondary copper powder raw material to prepare copper particles.
In order to achieve the above object, the copper particles of the present invention comprise three or more primary copper powders connected in a chain.
Therefore, the invention has the advantages that the existing copper powder is combined into copper particles in a chain form, and the copper powder has larger surface area, lower apparent density (for example, 1.0g/cm < 3 > to 2.5g/cm < 3 >), and better capillary force. And the copper particle manufacturing method provided by the invention is simple and easy for mass production, and when the copper particle provided by the invention is used for manufacturing the heat pipe, the heat dissipation efficiency can be improved. In addition, the copper particles of the invention have simple components and do not affect the reliability of the heat pipe.
Further, in the method for manufacturing copper particles, in the step of mixing the primary copper powder raw material, the polymer binder, and water to form a slurry, the polymer binder is added after heating the water, and the primary copper powder raw material is added after the polymer binder is dissolved.
In the method for producing copper particles, the step of mixing the primary copper powder material, the polymer binder, and water to form a slurry includes heating water to 40 to 70 ℃.
In the method for producing copper particles, the polymer binder is heated to 60 to 90 ℃ in the process of dissolving the polymer binder in the step of "mixing the primary copper powder raw material, the polymer binder, and water to form a slurry", and then the primary copper powder raw material is added.
Further, in the method for producing copper particles as described above, in the step of "mixing a primary copper powder raw material, a polymer binder, and water to prepare a slurry", the primary copper powder raw material, the polymer binder, and water are mixed and then heated to 65 ℃ to 95 ℃ to prepare a slurry.
In the above-described method for producing copper particles, the slurry is first heated to be dehydrated in the "step of heating the slurry to produce the secondary copper powder raw material".
In the method for manufacturing copper pellets, the polymer binder may include corn starch, potato starch, wheat starch, tapioca starch, or a combination thereof.
Further, in the method for producing copper particles as described above, in the step of "heating the slurry to produce the secondary copper powder raw material", the slurry is heated to 300 to 600 ℃, whereby the polymer binder is burned off.
Further, the particle diameter of the copper particles is 40 to 325 mesh as described above.
Drawings
FIG. 1 is a flow chart of the manufacturing method of the present invention.
Fig. 2 is a photomicrograph of the copper particles of the present invention.
Detailed Description
The technical means adopted by the invention to achieve the preset purpose are further described below by combining the accompanying drawings and the preferred embodiments of the invention.
The invention provides a method for manufacturing copper particles and copper particles.
Please refer to fig. 1 first. The manufacturing method comprises a modulation step, a heating step and a reduction step in sequence.
In the preparation step, the primary copper powder raw material, the high molecular adhesive and water are mixed to prepare slurry. The primary copper powder raw material is copper powder prepared by the prior art. In other words, the present invention uses the existing copper powder as a raw material to perform a reprocessing process to produce particles having a lower apparent density and a higher porosity. In addition, it is preferable to use copper powder produced by water atomization as a raw material for the primary copper powder. The polymeric binder can be corn starch, potato starch, wheat starch, tapioca starch, or a combination thereof, such as: the high molecular adhesive can be the combination of corn starch and potato starch, or the high molecular adhesive can be the combination of potato starch, wheat starch and cassava starch.
In the preparation step, firstly, the polymer adhesive is fully mixed with water, and then the primary copper powder raw material is added and mixed to prepare slurry. Specifically, after water is heated, the polymer adhesive is added to the weight percentage of 5-20%, and after the polymer adhesive is dissolved, the primary copper powder raw material is added to the weight percentage of 5-50%. In the preparation step, the water is heated to 40 to 70 ℃ and then the polymer adhesive is added. In addition, the polymer adhesive can be further heated to 60 ℃ to 90 ℃ in the dissolving process, and then the primary copper powder raw material is added. Finally, the primary copper powder raw material, the high molecular adhesive and water are mixed and then heated to 65 ℃ to 95 ℃, and the mixture is uniformly mixed without layering, thus obtaining the slurry. Preferably, the primary copper powder material, the polymeric binder, and water are heated while being mixed.
In the heating step, the heating may be performed in two stages. The first stage heating may be to dehydrate the slurry, and the second stage heating may be to burn off the polymeric binder to form the secondary copper powder material. In the first stage heating, the slurry may be dried in an oven at 60 ℃ to 200 ℃. In the second stage of heating, the dried and dehydrated slurry can be placed in a roasting furnace for roasting, the temperature of the roasting furnace can be 300-600 ℃, and the roasting time can be two-six hours. Air is introduced during the baking process to burn the polymer binder at high temperature, thereby burning off the polymer binder. The secondary copper powder material is formed after the polymer binder is burned off.
Since the surface of the particles of the secondary copper powder material may have an oxide layer, a subsequent reduction step may be performed to remove the oxide layer. Specifically, in the reduction step, the secondary copper powder raw material is heated to 300 ℃ to 600 ℃, and mixed gas of hydrogen and nitrogen is introduced until all oxide layers are reduced, so that the copper particles of the invention are formed.
And then deironing, screening by different grades or particle sizes, testing, packaging and warehousing.
Referring to fig. 2, a photograph of the copper particles is taken at a working distance of 16.4 millimeters (mm), an acceleration voltage of 15.0k volts (V), and a magnification of 100 times. The distance between two adjacent reference points in the lower right corner of fig. 2 is 50 micrometers (μm). The copper particles produced by the above production method may have a particle size of 40 to 325 mesh per one copper particle, and each copper particle contains three or more primary copper powders. In other words, the copper particles of the present invention may be formed of a minimum of three primary copper powders joined together. These primary copper powders may be connected in a random chain form, and may be a single straight chain or dendritic or coral-like branched chain.
In conclusion, the invention combines the existing copper powder into copper particles in a chain form, has larger surface area and lower apparent density (for example, 1.0g/cm can be reached) 3 To 2.5g/cm 3 ) Preferably capillary forces. And the copper particle manufacturing method provided by the invention is simple and easy for mass production, and when the copper particle provided by the invention is used for manufacturing the heat pipe, the heat dissipation efficiency can be improved. In addition, the copper particles of the invention have simple components and do not influence the reliability of the heat pipe. Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.
Claims (10)
1. A method for manufacturing copper particles is characterized by sequentially comprising the following steps:
mixing a primary copper powder raw material, a high-molecular adhesive and water to prepare slurry;
heating the slurry to prepare a secondary copper powder raw material; and
and carrying out reduction reaction on the secondary copper powder raw material to prepare copper particles.
2. The method for producing copper particles as claimed in claim 1, wherein the step of mixing the primary copper powder material, the polymer binder and water to form a slurry comprises heating water, adding the polymer binder, and adding the primary copper powder material after the polymer binder is dissolved.
3. The method for producing copper particles as claimed in claim 2, wherein the step of mixing the primary copper powder material, the polymer binder and water to form a slurry comprises heating water to 40 ℃ to 70 ℃.
4. The method for producing copper particles as claimed in claim 2, wherein in the step of mixing a primary copper powder material, a polymer binder and water to form a slurry, the polymer binder is heated to 60 ℃ to 90 ℃ during the dissolution process, and then the primary copper powder material is added.
5. The method for producing copper particles according to claim 2, wherein in the step of mixing a primary copper powder raw material, a polymer binder, and water to prepare a slurry, the primary copper powder raw material, the polymer binder, and water are mixed and then heated to 65 ℃ to 95 ℃ to prepare the slurry.
6. The method for producing copper particles according to any one of claims 1 to 5, wherein the step of heating the slurry to produce the secondary copper powder raw material includes heating the slurry to dehydrate the slurry.
7. The method of manufacturing copper pellets according to any one of claims 1 to 5, wherein the polymer binder comprises corn starch, potato starch, wheat starch, tapioca starch, or a combination thereof.
8. The method for producing copper particles as claimed in claim 7, wherein in the step of heating the slurry to produce the secondary copper powder raw material, the slurry is heated to 300 ℃ to 600 ℃, thereby burning off the polymer binder.
9. A copper pellet characterized by comprising three or more primary copper powders connected in a chain form.
10. The copper particles according to claim 9, wherein the particle size is 40 to 325 mesh.
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CN202110614981.9A CN115488330B (en) | 2021-06-02 | 2021-06-02 | Method for producing copper particles and copper particles |
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CN202110614981.9A CN115488330B (en) | 2021-06-02 | 2021-06-02 | Method for producing copper particles and copper particles |
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CN115488330B CN115488330B (en) | 2024-05-10 |
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1472367A (en) * | 2003-06-16 | 2004-02-04 | 昆明理工恒达科技有限公司 | Preparing method for conductive composite bronze powder and composite bronze conductive sizing agent |
CN103357876A (en) * | 2013-07-29 | 2013-10-23 | 西北有色金属研究院 | Preparation method for nano multihole copper film |
CN103964488A (en) * | 2013-01-30 | 2014-08-06 | 江苏格业新材料科技有限公司 | Method for preparing micro or nano copper oxide powder |
CN104741615A (en) * | 2015-04-08 | 2015-07-01 | 华北电力大学(保定) | Super-fine grain twin-peak copper preparing method |
CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
CN110079691A (en) * | 2019-06-14 | 2019-08-02 | 安泰天龙钨钼科技有限公司 | A kind of low molybdenum content molybdenum-copper and preparation method thereof |
JP2020053404A (en) * | 2019-12-11 | 2020-04-02 | 三井金属鉱業株式会社 | Copper paste and manufacturing method of sintered body of copper |
CN111331129A (en) * | 2020-04-26 | 2020-06-26 | 杭州屹通新材料股份有限公司 | Preparation method of CuSn10 powder with low apparent density |
CN111390181A (en) * | 2020-04-16 | 2020-07-10 | 荣成中磊科技发展有限公司 | Preparation process of diamond tool |
CN111659405A (en) * | 2020-07-08 | 2020-09-15 | 朱丽英 | Method for preparing copper-based catalyst by spray drying |
CN112091208A (en) * | 2020-09-10 | 2020-12-18 | 安徽德诠新材料科技有限公司 | Heat-conducting copper powder with bimodal distribution characteristic and preparation method and application thereof |
-
2021
- 2021-06-02 CN CN202110614981.9A patent/CN115488330B/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1472367A (en) * | 2003-06-16 | 2004-02-04 | 昆明理工恒达科技有限公司 | Preparing method for conductive composite bronze powder and composite bronze conductive sizing agent |
CN103964488A (en) * | 2013-01-30 | 2014-08-06 | 江苏格业新材料科技有限公司 | Method for preparing micro or nano copper oxide powder |
CN103357876A (en) * | 2013-07-29 | 2013-10-23 | 西北有色金属研究院 | Preparation method for nano multihole copper film |
CN104741615A (en) * | 2015-04-08 | 2015-07-01 | 华北电力大学(保定) | Super-fine grain twin-peak copper preparing method |
CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
CN110079691A (en) * | 2019-06-14 | 2019-08-02 | 安泰天龙钨钼科技有限公司 | A kind of low molybdenum content molybdenum-copper and preparation method thereof |
JP2020053404A (en) * | 2019-12-11 | 2020-04-02 | 三井金属鉱業株式会社 | Copper paste and manufacturing method of sintered body of copper |
CN111390181A (en) * | 2020-04-16 | 2020-07-10 | 荣成中磊科技发展有限公司 | Preparation process of diamond tool |
CN111331129A (en) * | 2020-04-26 | 2020-06-26 | 杭州屹通新材料股份有限公司 | Preparation method of CuSn10 powder with low apparent density |
CN111659405A (en) * | 2020-07-08 | 2020-09-15 | 朱丽英 | Method for preparing copper-based catalyst by spray drying |
CN112091208A (en) * | 2020-09-10 | 2020-12-18 | 安徽德诠新材料科技有限公司 | Heat-conducting copper powder with bimodal distribution characteristic and preparation method and application thereof |
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