CN115485828A - 倒装芯片微led及盒布置 - Google Patents

倒装芯片微led及盒布置 Download PDF

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CN115485828A
CN115485828A CN202180032842.3A CN202180032842A CN115485828A CN 115485828 A CN115485828 A CN 115485828A CN 202180032842 A CN202180032842 A CN 202180032842A CN 115485828 A CN115485828 A CN 115485828A
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格拉姆雷扎·查济
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Abstract

本发明涉及用于RGB垫的无干扰盒图案化。本公开进一步涉及通过图案化或填充在供体衬底中布置微装置,使得不存在与非接收垫的干扰并且最大化所述供体衬底中的无干扰区。这使得能够借助较少步骤将微装置转印到接收器衬底。

Description

倒装芯片微LED及盒布置
背景技术及技术领域
本发明涉及微裝置的转印。本公开进一步涉及通过图案化或填充在供体衬底中布置微装置,使得不存在与非接收垫的干扰并且最大化所述供体衬底中的无干扰区。这使得能够借助较少步骤将微装置转印到接收器衬底。
发明内容
所公开的本发明涉及一种用以在底板上图案化微装置盒转印的方法,所述方法包括以下步骤:在两条线上在所述底板中形成用于子像素的垫,同时将至少一个垫定位在所述两条线的相交点中;接着对于其中移除微装置的每一子像素,将盒放置在与所述两条线中的至少一者相关联的位置中;作为第一步骤,将与所述子像素中的一者相关联的所述盒中所述子像素的微装置与所述子像素垫对准,所述微装置不干扰其它子像素垫;及在第二步骤中,在所述两条所述线的所述方向上移动所述微装置盒转印。
本发明公开一种用以消除盒中一种类型的微装置与系统衬底上的垫之间的冲突的方法,所述方法包括:在条纹基座中使像素中具有三个微装置;使与一种类型的微装置相关联的一个垫与两个其它垫相比偏移,所述偏移大于所述盒中微装置的一个行的宽度或者至少与所述宽度相同;及具有对应于所述盒中用于每一微装置的空间的区。
附图说明
在阅读以下实施方式且在参考图式后即刻将明了本公开的前述及其它优点。
图1展示用于RGB的垫。
图2展示红色盒的转印过程。
图3展示红色盒的转印过程结果。
图4展示绿色盒的转印过程。
图5展示绿色盒的转印过程结果。
图6展示蓝色盒的转印过程。
图7展示蓝色盒的转印过程结果。
图8A展示消除盒中一种类型的微装置与系统衬底上的垫之间的冲突的结构。
图8B展示用于红色类型的微装置的盒结构。
图8C展示用于蓝色类型的微装置的盒结构。
图8D展示用于绿色类型的微装置的盒结构。
虽然本公开易于得出各种修改及替代形式,但已在图式中以实例方式展示且将在本文中详细描述特定实施例及实施方案。然而,应理解,本公开并不旨在限于所公开的特定形式。而是,本公开旨在涵盖归属于如由随附权利要求书界定的本发明的精神及范围内的所有修改、等效内容及替代方案。
具体实施方式
在本说明书中,术语“装置”、“微LED”及“微装置”可互换使用。然而,对所属领域的技术人员显而易见的是,此处所描述的实施例与装置大小无关。
在微装置的转印过程期间,图案化对于使得能够将微装置从盒可选择性地转印到底板中是重要的。图案化消除了微LED放置在与其它微装置相关联的非想要的区上的麻烦。这是无干扰盒图案化方法。为了实现无干扰盒图案化,已开发出特定方法。
此处,使用红色、绿色及蓝色微LED来解释本发明但其可被其它类型的微装置替换。
本发明一般来说涉及一种用以在底板上图案化微装置盒转印的方法,所述方法包括以下步骤:在两条线上在所述底板中形成用于子像素的垫,同时将至少一个垫定位在所述两条线的相交点中;对于其中移除微装置的每一子像素,将盒放置在与所述两条线中的至少一者相关联的位置中;作为第一步骤,将与所述子像素中的一者相关联的所述盒中所述子像素的微装置与所述子像素垫对准,所述微装置不干扰其它子像素垫;及在第二步骤中,在所述两条所述线的方向上移动所述微装置盒转印。
在另一实施例中,在像素区中将底板与用于子像素的垫成直角地对准的步骤,其中垫的数目可大于三。
在由图1所展示的主要实施例中,在阵列100中存在R、G、B的三个垫102。此处,内部垫间距与盒中微LED的间距相同。图1还展示透过转印工艺进行图案化以实现无干扰盒图案化。
图2展示用于红色盒转印的方法。用于红色的转印具有以下模式。首先将右隅角LED与红色垫202对准。在于隅角中将第一红色LED转印之后,第一红色LED在垂直方向204上向上移动。在于一个垂直列中完成LED之后,再次依序重复步骤,直到将盒完全图案化为止。
图3展示与图2中所论述的转印方法结合工作的红色盒图案化。在与每一像素相关联的左列及底部行上移除或不形成微LED(也可在左下隅角处存在一个额外LED)。
图4展示用于绿色盒转印的方法。用于绿色的转印具有以下模式。首先将右隅角LED与绿色垫402对准。在于隅角处将第一绿色LED转印之后,第一绿色LED在水平方向404上朝向右侧移动。在于一个水平行中完成LED之后,再次依序重复步骤。
图5展示与图4中所论述的转印方法结合工作的绿色盒图案化。在与每一像素相关联的底部行上移除且不形成微LED。
图6展示用于蓝色盒转印的方法。用于蓝色的转印具有以下模式。首先将右隅角LED与蓝色垫602对准。在于隅角处将第一蓝色LED转印之后,第一蓝色LED在垂直方向604上朝向底部侧移动。在于一个垂直列中完成LED之后,再次依序重复步骤。
图7展示与图6中所论述的转印方法结合工作的蓝色盒转印图案化。在与每一像素相关联的左列上移除且不形成微LED。
在另一实施例中,如果底板垫定向不同,则转印的方向可改变。而且,可互换红色、绿色及蓝色LED位置。
方法方面
本发明公开一种用以在底板上图案化微装置盒转印的方法。所述方法包括:在两条线上在所述底板中形成用于子像素的垫,将至少一个垫定位在所述两条线的相交点中。第二,对于其中移除微装置的每一子像素,将盒放置在与所述两条线中的至少一者相关联的位置中。第三,作为第一步骤,将与所述子像素中的一者相关联的所述盒中所述子像素的微装置与所述子像素垫对准,所述微装置不干扰其它子像素垫。最后,在第二步骤中,在所述两条所述线的方向上移动所述微装置盒转印。此处,所述两条线是垂直的,并且所述两条线平行于所述底板中像素的行及列。所述方法进一步其中颜色垫是红色、绿色或蓝色的。
所述红颜色垫借助第一步骤进行图案化且在第二步骤中垂直向上移动。此外,所述绿颜色垫借助第一步骤进行图案化且在第二步骤中水平向右移动。另外,所述蓝颜色垫借助第一步骤进行图案化且在第二步骤中垂直向下移动。
盒布置
一种将微装置转印到系统衬底中的方法是:将微装置的盒与显示器对准,并将所选择的一组微装置与显示器上所选择的一组垫接合,且通过使用接合力将微装置与供体衬底分离将微装置从盒转印到系统衬底中。
如果应将多个不同装置转印到系统衬底,则将存在盒中一种类型的微装置与用于其它装置的系统衬底上的垫之间的冲突。
图8A展示消除盒中一种类型的微装置与用于其它装置的系统衬底上的垫之间的冲突的结构。此处,实例用于将三个不同微装置804、806及808形成一个像素802。在条纹定向上设定微装置。一个实例可以是红色、绿色及蓝色子像素。此处,使与一种类型的微装置相关联的垫中的一者与其它两个垫相比偏移。所述偏移可大于盒中微装置的一个行的宽度或者至少与所述宽度相同。区810对应于微装置104的盒中可具有微装置的空间。区812对应于微装置106的盒中可具有微装置的空间。区814对应于微装置108的盒中可具有微装置的空间。
图8B展示用于微装置804的盒结构。此处,802-1表示对应于系统衬底中像素的区。从左上隅角开始转印微装置。且接着盒向右偏移并且转印下一微装置。当完成顶部行时,从开始左上隅角微装置的行开始同一过程。
图8C展示用于微装置806的盒结构。此处,802-2表示对应于系统衬底中像素802的区。从右上隅角开始转印微装置,且接着盒向左偏移并且转印下一微装置。当完成顶部行时,从开始右上隅角微装置的下一行开始同一过程。
图8D展示用于微装置808的盒结构。此处,802-3表示对应于系统衬底中像素802的区。从左隅角或右隅角从顶部行开始转印微装置,且接着盒向左或向右偏移并且转印下一微装置。当完成顶部行时,从开始下行一微装置的行开始同一过程。
盒布置的方法方面
本发明公开一种用以消除盒中一种类型的微装置与系统衬底上的垫之间的冲突的方法。所述方法包括:在条纹基座中使像素中具有三个微装置;使与一种类型的微装置相关联的一个垫与两个其它垫相比偏移,所述偏移大于所述盒中微装置的一个行的宽度或者至少与所述宽度相同;及具有对应于所述盒中用于每一微装置的空间的区。
所述方法进一步包括:对于表示第一类型的微装置的所述区,从顶部行的左上隅角开始转印所述第一类型的微装置,后续接着盒右偏移,且然后后续接着转印第一类型的下一微装置。此处,当完成顶部行时,一旦顶部行被转印,就从在左上隅角处开始第一类型的微装置的行开始同一过程。
此外,从顶部行的右上隅角开始转印第二类型的微装置,后续接着盒左偏移,且然后后续接着转印第二类型的下一微装置。一旦顶部行被转印,就从第二类型的右上隅角微装置开始的行开始同一过程。
另外,从顶部行的右上隅角或左上隅角开始转印第三类型的微装置,后续接着盒左偏移或右偏移,且然后后续接着转印第三类型的下一微装置。此处,存在包含红色、绿色及蓝色三种类型的子像素。一旦顶部行被转印,就在右上隅角或左上隅角处从第三类型的微装置开始的行开始同一过程。
出于图解说明及描述的目的,已呈现对本发明的一或多个实施例的前述描述。前述描述并非旨在为穷尽性的或将本发明限于所公开之精确形式。鉴于以上教导,许多修改及变化是可能的。本发明的范围并非旨在受本具体实施方式限制,而是受所附权利要求书限制。

Claims (20)

1.一种用以在底板上图案化微装置盒转印的方法,所述方法包括:
在两条线上在所述底板中形成用于子像素的垫,同时将至少一个垫定位在所述两条线的相交点中;
对于其中移除微装置的每一子像素,将盒放置在与所述两条线中的至少一者相关联的位置中;
作为第一步骤,将与所述子像素中的一者相关联的所述盒中所述子像素的微装置与所述子像素垫对准,所述微装置不干扰其它子像素垫;及
在第二步骤中,在所述两条所述线的方向上移动所述微装置盒转印。
2.根据权利要求1所述的方法,其中所述两条线是垂直的。
3.根据权利要求2所述的方法,其中所述两条线平行于所述底板中像素的行及列。
4.根据权利要求1所述的方法,其中所述子像素垫是红色的。
5.根据权利要求1所述的方法,其中所述子像素垫是绿色的。
6.根据权利要求1所述的方法,其中所述子像素垫是蓝色的。
7.根据权利要求4所述的方法,其中所述红颜色垫借助所述第一步骤进行图案化且在所述第二步骤中垂直向上移动。
8.根据权利要求5所述的方法,其中所述绿颜色垫借助所述第一步骤进行图案化且在所述第二步骤中水平向右移动。
9.根据权利要求6所述的方法,其中所述蓝颜色垫借助所述第一步骤进行图案化且在所述第二步骤中垂直向下移动。
10.根据权利要求7所述的方法,其中在与每一像素相关联的左列及底部行上移除或不形成所述微装置。
11.根据权利要求8所述的方法,其中在与每一像素相关联的所述底部行上移除或不形成所述微装置。
12.根据权利要求9所述的方法,其中在与每一像素相关联的所述左列上移除或不形成所述微装置。
13.一种用以消除盒中一种类型的微装置与系统衬底上的垫之间的冲突的方法,所述方法包括:
在条纹基座中使像素中具有三个微装置;
使与一种类型的微装置相关联的一个垫与两个其它垫相比偏移,所述偏移大于所述盒中微装置的一个行的宽度或者至少与所述宽度相同;及
具有对应于所述盒中用于每一微装置的空间的区。
14.根据权利要求13所述的方法,其中对于表示第一类型的微装置的所述区,从顶部行的左上隅角开始转印所述第一类型的微装置,后续接着盒右偏移,且然后后续接着转印所述第一类型的下一微装置。
15.根据权利要求14所述的方法,其中一旦所述顶部行被转印,就从开始所述第一类型的所述左上隅角微装置的行开始所述同一过程。
16.根据权利要求13所述的方法,其中对于表示第二类型的微装置的所述区,从顶部行的右上隅角开始转印所述第二类型的微装置,后续接着盒左偏移,且然后后续接着转印所述第二类型的下一微装置。
17.根据权利要求16所述的方法,其中一旦所述顶部行被转印,就从开始所述第二类型的所述右上隅角微装置的行开始所述同一过程。
18.根据权利要求13所述的方法,其中对于表示第三类型的微装置的所述区,从顶部行的右上隅角或左上隅角开始转印所述第三类型的微装置,后续接着盒左偏移或右偏移,且然后后续接着转印所述第三类型的下一微装置。
19.根据权利要求13所述的方法,其中存在红色、绿色及蓝色三种类型的子像素。
20.根据权利要求18所述的方法,其中一旦所述顶部行被转印,就从开始所述第三类型的所述右上隅角或左上隅角微装置的行开始所述同一过程。
CN202180032842.3A 2020-04-14 2021-04-14 倒装芯片微led及盒布置 Pending CN115485828A (zh)

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