CN115476213A - Polishing method, polishing apparatus, polishing device and storage medium - Google Patents

Abstract

The application relates to a polishing method, polishing equipment, polishing device and storage medium. The polishing method comprises the following steps: acquiring operation information of a current site and analyzing the operation information to obtain task data; analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position; acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; and the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state. The matched polishing strategy is obtained and output according to the analysis result of the task data by analyzing the operation information of the current station, so that the polishing equipment can adopt different polishing strategies according to the operation information of different stations to realize continuous and effective automatic construction operation. Compare in the conventional art and effectively improved work efficiency, also further promoted the intelligent level of the equipment of polishing, and then help improving the suitability of the automatic operation of the equipment of polishing.

Description

Polishing method, polishing apparatus, polishing device and storage medium

Technical Field

The application relates to the technical field of surface polishing of building concrete structures, in particular to a polishing method, polishing equipment, polishing device and storage medium.

Background

The polishing of the concrete inner wall surface is a necessary process of the current commercial residential development project, generally speaking, the processing method of the standard inner wall surface is to manually detect a wall surface polishing area and a slurry supplementing area by a guiding rule, and then manually hold a polisher to polish and supplement slurry.

In the implementation process, the inventor finds that at least the following problems exist in the traditional technology: the traditional method has the problems of low efficiency, low applicability and the like.

Disclosure of Invention

In view of the above, it is necessary to provide a polishing method, a polishing apparatus, a polishing device, and a storage medium, which are efficient and highly adaptable to the above-mentioned technical problems.

In order to achieve the above object, in one aspect, an embodiment of the present invention provides a polishing method, including:

acquiring operation information of a current site and analyzing the operation information to obtain task data;

analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

In one embodiment, the method further comprises the steps of:

detecting that the polishing equipment is separated from a corresponding polishing working state, and acquiring the type of a corresponding operation object and corresponding polishing data;

comparing the corresponding polishing data with preset standard data according to the type of the corresponding operation object; the preset standard data is obtained according to the type of the operation object;

and determining the grinding quality according to the comparison result.

In one embodiment, the corresponding grinding data comprises grinding depth and grinding times; the preset standard data comprises preset depth and preset times;

the step of comparing the corresponding grinding data with the preset standard data according to the type of the corresponding operation object comprises the following steps:

if the type of the operation object is a blasting point, comparing the polishing depth with a preset depth;

if the type of the operation object is any one of the following positions: and (5) matching the polishing times with the preset times for the seam splicing and the step splicing.

In one embodiment, the method further comprises the steps of:

and under the condition that the polishing quality of the current station is qualified, the polishing equipment is instructed to perform polishing operation of the next station until the polishing operation of all stations is completed.

In one embodiment, before the step of acquiring the job information of the current site, the method further includes the steps of:

acquiring wall data and a construction area map;

planning the sites according to the wall data and the construction area map to obtain each site and the construction sequence of each site;

and instructing the grinding equipment to move to a station at the first position in the construction sequence.

In one embodiment, the method further comprises the steps of:

and under the condition that the motor receiving the polishing equipment sends out the early warning signal, adjusting the polishing position of the polishing equipment until the number of times of receiving the early warning signal is greater than a preset value.

In one embodiment, the warning signal is sent out when any of the following conditions is met: and detecting that the motor torque is greater than the set torque and the motor current value is greater than the set current value.

In one embodiment, the step of adjusting the dressing position of the dressing apparatus comprises:

instructing a feeding electric cylinder of the polishing equipment to perform contraction action so as to enable a polishing mechanism of the polishing equipment to be far away from a corresponding operation object;

and under the condition that the grinding mechanism is detected to be separated from the corresponding operation object, the grinding equipment is indicated to move for a preset distance along the grinding path.

In one embodiment, the work locations include wall surfaces, bay windows, door openings, and beams; the operation objects comprise abutted seams, explosion points, steps and barriers;

the polishing strategy comprises a abutted seam polishing strategy, an explosion point polishing strategy, a step polishing strategy, an obstacle avoidance polishing strategy, a wall surface polishing strategy, a bay window polishing strategy, a door opening polishing strategy and a beam polishing strategy.

In one embodiment, the method further comprises the steps of:

outputting safety parameters to polishing equipment; the safety parameters comprise a first safety distance between a polishing mechanism of the polishing equipment and the internal corner of the wall surface, a second safety distance between the polishing mechanism of the polishing equipment and an adjacent vertical surface, a third safety distance between the polishing mechanism of the polishing equipment and the floor, and a fourth safety distance beyond the edge of the wall body.

In one aspect, an embodiment of the present invention further provides a polishing apparatus, including:

a chassis;

a polishing mechanism;

a feeding mechanism; the feeding mechanism is used for controlling the distance between the polishing mechanism and the wall surface and the polishing pressure applied by the polishing mechanism;

a pitch adjustment mechanism; the pitching adjusting mechanism is used for adjusting the perpendicularity of the polishing mechanism and the ground;

a lifting mechanism; the lifting mechanism is used for adjusting the height position of the polishing mechanism;

a traversing mechanism; the transverse moving mechanism is used for adjusting the horizontal position of the polishing mechanism

A master control device; the master control equipment is respectively connected with the chassis, the polishing mechanism, the feeding mechanism, the pitching adjusting mechanism, the lifting mechanism and the transverse moving mechanism; the master control device implements the steps of any of the methods described above.

In one aspect, an embodiment of the present invention further provides a polishing device, including:

the task data acquisition module is used for acquiring the operation information of the current site and analyzing the operation information to obtain task data;

the analysis module is used for analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

the output module is used for acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; and the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

In another aspect, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the steps of any one of the methods described above.

One of the above technical solutions has the following advantages and beneficial effects:

according to the polishing method, the task data is obtained by analyzing the operation information of the current station, and then the matched polishing strategy is obtained and output according to the analysis result of the task data, so that the polishing equipment can adopt different polishing strategies according to the operation information of different stations to realize continuous and effective automatic construction operation. Compare in the conventional art and effectively improved work efficiency, also further promoted the intelligent level of the equipment of polishing, and then help improving the suitability of the automatic operation of the equipment of polishing.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a first schematic flow chart diagram of a grinding method in one embodiment;

FIG. 2 is a second schematic flow chart diagram of a grinding method in one embodiment;

FIG. 3 is a third schematic flow chart diagram of a grinding process in one embodiment;

FIG. 4 is a fourth schematic flow chart diagram of a grinding process in one embodiment;

FIG. 5 is a schematic flow chart illustrating the steps of adjusting the polishing position of the polishing apparatus in one embodiment;

FIG. 6 is a first schematic view of a grinding track in one embodiment;

FIG. 7 is a second schematic of a grinding track in one embodiment;

FIG. 8 is a third schematic of a sanding track in one embodiment;

FIG. 9 is a schematic view of a wall in one embodiment;

FIG. 10 is a schematic view of a door opening in one embodiment;

FIG. 11 is a schematic view of a bay window in one embodiment;

FIG. 12 is a block diagram showing the construction of a polishing apparatus according to one embodiment;

fig. 13 is a block diagram showing a structure of a polishing apparatus according to an embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In one embodiment, as shown in fig. 1, there is provided a grinding method comprising the steps of:

s110, acquiring the operation information of the current site and analyzing the operation information to obtain task data;

the polishing method is used for polishing the surface of the concrete structure of the building. In the polishing process, each area of a building needs to be polished in a segmented manner, each polishing area is divided into stations for respective operation, and the current station is the polishing area where polishing equipment is located currently. Each site corresponds to the operation information. The task data may be packets of any format known in the art.

Specifically, the job information may be analyzed to obtain a plurality of pieces of task data, or may be analyzed to obtain one piece of task data. In one particular example, the task data is json data. The operation information of the current site can be acquired through any technical means in the field, and in a specific example, the operation information of the current site can be directly extracted from the storage device when the polishing device is detected to move to the site, or the operation information of the current site can be acquired from a cloud.

S120, analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

wherein, the operation objects comprise abutted seams, explosion points, barriers and steps; the operation positions comprise wall surfaces, bay windows, door openings and cross beams.

Specifically, the task data is parsed to obtain a parsing result including a job object and/or a job location. The analysis results correspond to the task data one by one, and the number of the task data is the same as that of the analysis results. In one specific example, the job location may be resolved by a flag in the json data.

S130, acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

The polishing strategies comprise a seam polishing strategy, an explosion point polishing strategy, a step polishing strategy, an obstacle avoidance polishing strategy, a wall surface polishing strategy, a bay window polishing strategy, a door opening polishing strategy and a beam polishing strategy. Further, the wall surface polishing strategy comprises a wall surface abutted seam polishing strategy and a wall surface explosion point polishing strategy; the bay window polishing strategy comprises a bay window seam polishing strategy and a bay window explosion point polishing strategy; the door opening polishing strategy comprises a door opening seam polishing strategy and a door opening explosion point polishing strategy; the beam polishing strategy comprises a beam joint polishing strategy and a beam explosion point polishing strategy; the step polishing strategies comprise a transverse step polishing strategy and a vertical step polishing strategy.

The grinding working state is a working state for executing a grinding strategy. Each sanding strategy includes any one or combination of the following parameters: a grinding path, grinding pressure, grinding speed, type of grinding mechanism, priority of grinding object, safety distance and the like.

Specifically, the corresponding polishing strategy may be matched based on the analysis result. For example: if the operation object is a seam and the operation position is empty, matching a seam polishing strategy; for another example: and if the operation object is a seam and the operation position is a bay window, matching a bay window seam polishing strategy. In a specific example, the matching may be performed according to a preset mapping relationship, and the mapping relationship may be a mapping table or the like.

Further, if the polishing task of the current station is completed, the polishing equipment is instructed to perform the polishing operation of the next station until the polishing operations of all stations are completed. It should be noted that, the polishing quality can be detected when the polishing task of the current station is completed, and the polishing equipment is instructed to perform the polishing operation of the next station until the polishing operations of all stations are completed when the polishing quality of the current station is qualified.

According to the polishing method, the task data is obtained by analyzing the operation information of the current station, and then the matched polishing strategy is obtained and output according to the analysis result of the task data, so that the polishing equipment can adopt different polishing strategies according to the operation information of different stations to realize continuous and effective automatic construction operation. Compare in the conventional art and effectively improved work efficiency, also further promoted the intelligent level of the equipment of polishing, and then help improving the suitability of the automatic operation of the equipment of polishing.

In one embodiment, as shown in fig. 2, further comprising the steps of:

s210, detecting that the polishing equipment is separated from the corresponding polishing working state, and acquiring the type of the corresponding operation object and the corresponding polishing data;

and the grinding data are operation parameters executed according to the grinding strategy.

Specifically, when the grinding equipment is detected to be separated from the corresponding grinding working state, namely the grinding equipment finishes grinding according to the grinding strategy, the type of the corresponding operation object and the corresponding grinding data are obtained. In one particular example, the sanding data may include sanding depth and number of sandings.

S220, comparing the corresponding polishing data with preset standard data according to the type of the corresponding operation object; the preset standard data is obtained according to the type of the operation object;

specifically, the preset criterion data may be determined according to the type of the job object. And then comparing the preset standard data with the polishing data to obtain a comparison result.

And S230, determining the grinding quality according to the comparison result.

Specifically, the results obtained by comparison reflect the grinding quality. In one embodiment, the corresponding grinding data comprises grinding depth and grinding times; the preset standard data comprises preset depth and preset times;

the step of comparing the corresponding grinding data with the preset standard data according to the type of the corresponding operation object comprises the following steps: if the type of the operation object is a detonation point, comparing the polishing depth with a preset depth; the type of the work object is any one of the following positions: and (4) matching the polishing times with the preset times by the seam splicing and the step.

And under the condition that the operation objects are the seam and the step, comparing the actual times of polishing the seam and the step with the preset times. And if the actual times are less than the preset times, the polishing quality is considered to be unqualified, and if the actual times are more than or equal to the preset times, the polishing quality is considered to be qualified. Similarly, under the condition that the operation object is a blasting point, the actual polishing depth of polishing the blasting point is compared with the preset depth, if the actual polishing depth is smaller than the preset depth, the polishing quality is considered to be unqualified, and if the actual number of times is larger than or equal to the preset number of times, the polishing quality is considered to be unqualified.

The method is beneficial to providing the grinding effect by checking the grinding quality of each operation object.

In one embodiment, as shown in fig. 3, the method further comprises the steps of:

and S310, under the condition that the polishing quality of the current station is qualified, instructing polishing equipment to perform polishing operation of the next station until the polishing operation of all stations is completed.

In one embodiment, as shown in fig. 4, there is provided a grinding method comprising the steps of:

s410, acquiring wall data and a construction area map;

the wall surface data can comprise parameters of steps, explosion points, abutted seams and barriers; the parameters may include one or more of location and depth. The wall data can be acquired by any means in the field, for example, the wall data can be acquired by laser, can be manually input, and can also be acquired by converting construction drawings.

S420, planning the sites according to the wall data and the construction area map to obtain each site and the construction sequence of each site;

specifically, site planning can be performed according to wall data and a construction area map by adopting any strategy in the field. In one specific example, the station planning is performed according to the principle of shortest travel path of the grinding equipment and obstacle avoidance.

And S430, indicating the grinding equipment to move to a first station in the construction sequence.

Specifically, each station has a corresponding construction sequence, and the station at the head in the construction sequence is the first station to be polished.

S440, acquiring the operation information of the current site and analyzing the operation information to obtain task data;

s450, analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

s460, acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

In one embodiment, the method further comprises the following steps:

and under the condition that the motor receiving the polishing equipment sends out the early warning signal, adjusting the polishing position of the polishing equipment until the number of times of receiving the early warning signal is greater than a preset value.

Specifically, the motor of the polishing device may include a motor of the polishing mechanism, a motor of the traverse device, and a motor of the lifting device. No matter meet the protruding or external disturbance of foreign matter and can lead to among grinding device, sideslip device or the elevating gear to send early warning signal according to on-the-spot operating condition, adjust the position of polishing of equipment that grinds this moment, just adjust the position of grinding machanism for the operation object promptly. In one embodiment, the warning signal is sent when any of the following conditions is met: and detecting that the motor torque is larger than the set torque and the motor current value is larger than the set current value.

Further, if the number of times of adjusting the polishing position reaches a preset value, the motor still sends out an early warning signal, and then polishing operation is stopped.

In one embodiment, as shown in fig. 5, the step of adjusting the grinding position of the grinding apparatus comprises:

s510, instructing a feeding electric cylinder of the polishing equipment to contract so as to enable a polishing mechanism of the polishing equipment to be far away from a corresponding operation object;

specifically, the feeding electric cylinder is contracted, and the grinding mechanism of the grinding equipment is far away from the corresponding operation object. In one particular example, the grinding mechanism is a grinding disc.

S520, under the condition that the grinding mechanism is detected to be separated from the wall surface, the grinding equipment is indicated to move for a preset distance along the grinding path.

Specifically, instruct the equipment of polishing to remove along the route of polishing and predetermine the distance, can remove for the chassis of the equipment of polishing and predetermine the distance, also can remove through sideslip device and elevating gear's cooperation, as long as make polishing mechanism remove along the route of polishing and predetermine the distance can. For example, the polishing mechanism motor sends out an early warning signal (exceeding a set torque or a current detection value) in the polishing process, the polishing direction movement is stopped, the feeding device electric cylinder shrinks to reduce the pressure of the polishing mechanism on the wall surface until the polishing mechanism is separated from the wall surface, the polishing mechanism is moved by 0.5 times of the diameter distance of the polishing disc along the polishing direction (namely the preset distance), the feeding electric cylinder stretches out to press the polishing device on the wall surface to be continuously polished, the polishing direction movement is stopped if the polishing mechanism motor still gives an early warning, the feeding device electric cylinder shrinks to withdraw the polishing device to separate from the wall surface, the polishing mechanism is continuously moved by 0.5 times of the diameter distance of the polishing disc along the polishing direction, the feeding electric cylinder stretches out to press the polishing device on the wall surface to be continuously polished, the operation is continuously performed if the motor works normally, and the warning is given to prompt for manual detection and judgment if the motor continuously gives an early warning for reaching the preset times.

The transverse moving or lifting device motor sends out an early warning signal (exceeding a set torque or a current detection value) in the polishing process, the polishing direction is stopped to move, the feeding device electric cylinder shrinks to withdraw the polishing mechanism to be separated from the wall surface, the polishing device is moved by 0.5 time of the diameter distance of the polishing disc along the polishing direction (namely the preset distance), if the moving direction motor (the transverse moving or lifting device motor) does not have an early warning, the feeding electric cylinder extends out to press the polishing device to the wall surface to be continuously polished, and if the motor continuously gives an early warning to reach the preset times, an alarm is given to prompt for manual detection and judgment.

In one embodiment, the method further comprises the steps of:

outputting safety parameters to polishing equipment; the safety parameters comprise a first safety distance between a polishing mechanism of the polishing equipment and the internal corner of the wall surface, a second safety distance between the polishing mechanism of the polishing equipment and an adjacent vertical surface, a third safety distance between the polishing mechanism of the polishing equipment and the floor, and a fourth safety distance beyond the edge of the wall body.

Specifically, the safety parameters are used for indicating that the grinding equipment keeps a safe distance from each area in the grinding process. The distance between a polishing mechanism of the polishing equipment and the internal corner of the wall surface is greater than a first safety distance; the distance between the polishing mechanism of the polishing device and the adjacent vertical surface is greater than a second safety distance; the distance between a polishing mechanism of the polishing equipment and the floor is greater than a third safety distance; the distance that the grinding mechanism of the grinding equipment exceeds the edge of the wall body is less than the fourth safety distance. In a specific example, the first safety distance is 8cm, the second safety distance is 10cm, the third safety distance is 8cm, and the fourth safety distance is 3cm.

According to the method, the first safety distance, the second safety distance, the third safety distance and the fourth safety distance are set, so that the grinding equipment is prevented from colliding with an external building in the working process, and continuous and stable construction in the grinding operation process is guaranteed.

It should be understood that although the various steps in the flow diagrams of fig. 1-5 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 1-5 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternating with other steps or at least some of the sub-steps or stages of other steps.

To further illustrate the grinding method of the present application, the grinding strategy will now be further described:

the polishing pressure of the abutted seam polishing strategy is a third pressure, the polishing movement speed is a first speed, and the polishing mechanism is a diamond grinding disc; the grinding pressure of the explosion point grinding strategy is a first pressure, the grinding direction is single-track reciprocating grinding, and the grinding speed is matched according to the type of a grinding mechanism and the grinding pressure; the polishing pressure of the step polishing strategy is a second pressure, and the polishing speed is a second speed; wherein the first speed is greater than the second speed; the first pressure is greater than the second pressure, which is greater than the third pressure;

the wall surface polishing strategy comprises polishing the explosion points of the wall surface after finishing polishing the abutted seams of the wall surface;

the bay window polishing strategy comprises polishing the wall surface on the upper side of the bay window after polishing the wall surface on the lower side of the bay window;

the door opening polishing strategy comprises the steps that the size of a polishing disc of polishing equipment, which exceeds the edge of a door opening, is smaller than a preset size;

the beam sanding strategy includes transverse sanding in the beam direction.

Further, the grinding strategy specified according to the work object and the work position is as follows:

1. and (3) seam polishing strategy: the joint grinding mainly aims to remove laitance at the joint of the aluminum template, the operation joint is a straight line, the required operation pressure is small, grinding parameters are set to be low-pressure high-speed grinding, namely the grinding disc pressure is low, the grinding motion speed is high, and the grinding disc adopts the diamond grinding disc to realize high-efficiency grinding on the premise of guaranteeing the grinding quality and improving the visual effect.

The robot is divided into a transverse joint and a vertical joint according to the joint splicing direction, the coverage range of each station of the robot is 800mm multiplied by the height of a wall body, 800mm is the width of the wall body covered by a single station, and the polishing track is set as follows based on the characteristics of the station coverage area so as to realize efficient operation with the least action track.

1.1. Transverse seam polishing strategy: the parameter setting mode is that the low pressure is high-speed, polishes along the transversal joint direction, and the single covers 800mm wide, and the design has 30mm coincidence zone to avoid polishing the omission between the website, and the direction of polishing is from a left side to the right side, realizes polishing at a high speed in succession. The grinding trajectory is shown in fig. 6.

1.2. Perps sanding strategy: the parameter setting mode is low pressure and high speed, the track is single 'nearly' type operation, adjusts the polishing disc between the piece, and the initial point of polishing is left side piece lower extreme point, from bottom to top, polishes from left to right, and the polishing disc compresses tightly the wall throughout and does not retract the adjustment and realize high-speed polishing. The grinding traces are shown in fig. 6 and 7.

2. And (3) blasting point polishing strategy: the blasting point polishing is mainly to polish the concrete wall surface by the aid of bulges generated when the concrete is poured due to deformation of an aluminum template, and the hardness of the concrete is higher between C25 and C55, so that a high-cutting-performance cutter is required for polishing operation (namely, a polishing mechanism is a high-cutting-performance prop), high polishing pressure is required, polishing speed is matched according to the characteristics of a polishing disc and the polishing pressure (the speed is counted by a large number of engineering construction statistics according to the performance of the cutter, the hardness of the concrete and the optimal principle of highest cutting efficiency under the set target polishing pressure), a polishing strategy is single-track reciprocating polishing, the current polishing depth is monitored in the operation process and compared and judged with the target depth, and the polishing disc moves to the next track for reciprocating polishing operation after the target polishing depth is met.

The grinding tracks of the explosion point area are transversely and reciprocally ground and vertically and reciprocally ground, the grinding direction is selected according to an optimal operation path planning system, the judging algorithm of the system is planned by taking the minimum grinding track quantity as an optimal principle, the smaller the grinding track quantity, the fewer the pose adjustment times of the grinding device, and the longer the effective grinding time.

According to the blasting point polishing track strategy, no matter horizontal polishing or vertical polishing is adopted, the set length of the polishing track is larger than the length of a blasting point area, a transition buffer area with the length of 100mm is reserved to avoid height difference of a polished wall surface, the polishing speed of the buffer area in the polishing direction is 1.5 times of that of the blasting point area, and the polishing pressure is 0.5 times of that of the blasting point area; a row of polishing tracks are added in a buffer area in the vertical polishing direction, the coverage area of the polishing disk of the polishing tracks is increased by 50% and is overlapped with an explosion point area, and the polishing speed and pressure are consistent with the explosion point area. The polishing logic is that the polishing track covers the polishing area from left to right and from top to bottom.

3. Step grinding strategy: the step polishing mainly comprises the steps of polishing the vertical height difference of concrete between aluminum templates during pouring to be in uniform transition, wherein the actual polishing object is still concrete, the polishing amount is small, and the step height difference is less than 4mm. Because its operation object is got rid of the degree of difficulty and is between piece and explosion, consequently compare the grinding pressure and the speed of adopting with preceding both and be placed in the middle, grind test data analysis grinding device perpendicular to step direction through reality and polish, and efficiency of polishing is the highest.

The grinding track strategy is that the grinding track is performed for 2 times in a reciprocating mode in a direction perpendicular to the step direction, the overlapping rate of effective grinding areas between adjacent grinding track routes is 50%, and the grinding track logic is from left to right and from top to bottom. The grinding trajectory is shown in fig. 6.

3.1 transverse step grinding strategy: same website is from last to polishing down, and the orbit of polishing reciprocates 2 times from top to bottom, and the dish of polishing continuously compresses tightly 0.5 times of wall sideslip polishing dish diameter distance, and the orbit of polishing is 2 times from top to bottom repeatedly to analogize and accomplish the operation of polishing in this way. The grinding trajectory is shown in fig. 6.

3.2 vertical step grinding strategy: same website is from last to polishing down, and the orbit of polishing is transversely reciprocal to be polished for 2 times, and the dish of polishing continuously compresses tightly the wall and moves down 0.5 times the dish diameter distance of polishing, and the orbit of repeatedly transversely polishing is 2 times to analogize and accomplish the operation of polishing in this way. The grinding trace is shown in fig. 6.

4. Obstacle avoidance and polishing strategies: keep away barrier grinding strategy is mainly for meeting in the process of polishing that foreign matter such as the clean reinforcing bar of earlier stage is protruding, or grinding device meets external disturbance and leads to when causing the overload grinding trouble or the suspension and the grinding strategy that designs.

And starting a detection strategy in an obstacle avoidance mode: according to the actual working condition of a site, whether the situation meets a foreign matter bulge or external interference, the torque value of one motor in the grinding device, the transverse moving device or the lifting device is overloaded or exceeds a set value, the obstacle avoidance grinding detection strategy is to detect the output torque (or current) of three motors in the machine, and various conditions can be judged by detecting the working torque of the three motors in the grinding process. The following two rail avoiding and polishing track obstacle tracking strategies are adopted according to the early warning state of the motor and the polishing strategy being executed:

polishing device motor early warning (surpass and set for moment of torsion or current detection value) among the polishing process, the direction motion of stopping polishing, feeding device electric cylinder shrink reduces polishing device to wall pressure until breaking away from with the wall, along polishing direction removal polishing device 0.5 times polishing dish diametral distance, feeding electric cylinder stretches out and compresses tightly the wall with polishing device and continues to polish, if polishing device motor still early warning then stop the direction motion of polishing, feeding device electric cylinder shrink withdraws polishing device and breaks away from the wall, continue along polishing direction removal polishing device 0.5 times polishing dish diametral distance, feeding electric cylinder stretches out and compresses tightly the wall with polishing device and continues to polish, if motor operating condition is normal then continue the operation, if the motor lasts the early warning then reports to the police and reminds artifical the detection and judges.

In the polishing process, the motor of the traversing or lifting device performs early warning (the motor exceeds a set torque or current detection value), the polishing direction is stopped to move, the electric cylinder of the feeding device contracts to withdraw the polishing device to be separated from the wall surface, the polishing device is moved by 0.5 time of the diameter distance of the polishing disc along the polishing direction, if the motor (the motor of the traversing or lifting device) in the moving direction does not perform early warning, the electric cylinder is fed to stretch out to press the polishing device to the wall surface for continuous polishing, and if the motor continues to perform early warning, the motor gives an alarm to prompt manual detection and judgment.

5. A wall surface grinding strategy: the wall surface polishing strategy has the principle that the abutted seams are polished first and then the explosion points are polished, and in actual construction, all abutted seams in one house type are polished and then the polishing discs are replaced to polish the explosion points.

5.1. Wall surface joint polishing strategy: according to the actual size and the seam distribution of the wall surface, on the premise of ensuring the safe construction of the robot, the required distances between the polishing device and the wall surface internal corner, the ceiling and the floor are reserved to plan the starting point of the polishing track, the transverse seam and the vertical seam finish polishing operation in the same station at one time, the vertical seam is polished first, and then the transverse seam is polished, so that the principle of from bottom to top is that the transverse seam is polished. As shown in fig. 6 and 7.

5.2. Wall surface blasting point polishing strategy: according to the actual size of the wall surface and the distribution of explosion points, on the premise of ensuring the safe construction of the robot, the required distances between the polishing device and the internal corner of the wall surface, the ceiling and the floor are reserved to plan the starting point of the polishing track, and the polishing track and the polishing direction are calculated and output according to the characteristics of the explosion point area by the optimal path planning system. As shown in fig. 7.

6. And (3) a floating window polishing strategy: the design is carried out in order to realize the most efficient polishing in the bay window area, wall features are arranged around the bay window, which is the conventional wall face middle area lacking wall features, when the station planning needs to obtain bay window position marks in advance, and the station planning needs to comprehensively consider wall internal corners and four edge size data of the bay window to comprehensively evaluate and plan an optimal path. Dividing the wall surface with the bay window into four parts according to the characteristics of the bay window: the wall surface on the left side of the bay window, the wall surface on the right side of the bay window, the wall surface on the lower side of the bay window and the wall surface on the upper side of the bay window. The explosion point and seam polishing strategy of the left and right wall surfaces of the bay window is consistent with the conventional wall surface strategy; polishing the upper side of the bay window, and then processing the conventional wall surface polishing strategy, wherein the only difference is that the distance X between the conventional wall surface polishing and the floor is adjusted to be the distance Y between the polishing device and the upper edge of the bay window; and the polishing of the lower side of the bay window is carried out by a conventional wall surface polishing strategy, and the only difference is that the distance H from the conventional wall surface polishing to the ceiling is adjusted to be the distance Y from the polishing device to exceed the lower edge of the bay window.

6.1. And (3) a bay window seam polishing strategy: the seam polishing strategy of the left side surface of the bay window and the right side surface of the bay window is consistent with the wall surface seam polishing strategy; waft window upside and downside wall piece and polish the tactics and polish window downside wall for same website is polished earlier, the orbit of polishing is by lower supreme, from left to right, the orbit of polishing upper limit position grinding device surpasss the window top edge distance Y that wafts, the telescoping device electric jar shrink behind the window downside wall that wafts has been polished, drive grinding device and retrieve and break away from the wall, elevating gear drives grinding device and rises, the initial height of orbit of polishing when grinding device bottom edge distance wafts window top edge distance Y, the orbit of polishing is by lower supreme, from left to right.

6.2. And (3) a floating window explosion point polishing strategy: the floating window explosion point polishing mainly aims at avoiding interference between a polishing device and a wall body caused by the fact that excessive breaking length exceeds the edge of a floating window in a conventional explosion point polishing track, therefore, the minimum distance between the edge of the explosion point area and the edge of the floating window needs to be acquired simultaneously when the explosion point area polishing track is designed, an explosion point polishing strategy is formulated through optimal path planning, the polishing track limits the polishing device to exceed the distance Y between the edge of the floating window and the nearest limit position of the edge of the floating window, the polishing logic is from bottom to top, from left to right, and the polishing device is transferred between the explosion points and requires the polishing device to be separated from the wall surface.

7. Door opening grinding strategy: the polishing strategy is designed according to the space size of a door opening of a room, the aim is to ensure the safety of robot construction, and the strategy coverage range is the area above the side edge of the door opening and the upper edge of the door opening. The edge of the door opening is used as a robot station planning reference position, and the polishing path planning in the polishing operation requires that the polishing device exceeds the edge of the door opening by a size Y which is less than or equal to 3cm, and all edge polishing areas need to be covered at the same time. As shown in fig. 8

7.1. Door opening seam polishing strategy: the side edge area requires the track planning of the polishing disc to cover all the abutted seams, and if the abutted seams are closer to the side edge, the distance Y of the protruding edge line of the polishing disc is less than or equal to 3cm. The polishing rule of the region right above the door opening is executed according to a splicing polishing strategy, the only difference is that the starting point of the polishing disc for compressing the wall surface is higher than the height h of the door opening, and the polishing disc of the polishing device is far away from the wall surface before the polishing disc rises to the starting point, so that the polishing device is prevented from colliding with the upper edge of the door opening.

7.2. Door opening explosion point grinding strategy: the polishing track is required to cover the edge area of the door opening, the distance Y of the polishing disc exceeding the edge line of the door opening is less than or equal to 3cm, the polishing track is output through an optimal path planning system on the basis, and the polishing logic is consistent with the explosion point polishing logic.

8. Beam polishing strategy: the grinding strategy formulated aiming at the cross beam in a room or in a passageway is characterized in that the height dimension of the cross beam in the building environment is generally small, the length dimension is large, the grinding device required by the vertical grinding strategy is long in adjustment time no matter in seam splicing or explosion point grinding, the effective grinding time is small, and therefore the cross beam grinding strategy adopts transverse grinding along the cross beam direction. The robot station planning is different from the wall floating window in that the distance between the robot chassis and the wall below the cross beam increases the depth of the cross beam, and interference collision between the lifting device and the cross beam in the lifting process is avoided. The safe distance between the grinding device and the ceiling and the internal corner follows the grinding distance of the wall surface, H is more than or equal to 8cm, L is more than or equal to 10cm, and the distance Y between the grinding device and the lower edge line of the cross beam is less than or equal to 3cm. As shown in fig. 6.

8.1. Beam abutted seam polishing strategy: the robot station planning takes the principle that the minimum station covers the largest number of abutted seams as the principle, the minimum station finishes the beam polishing operation, the abutted seam polishing track strategy is from top to bottom and from left to right, the transverse polishing distance is the single-station coverage width, and 50% of polishing disc diameter size coverage areas are overlapped among the stations.

8.2. Beam detonation point polishing strategy: the robot station planning takes the principle that the minimum stations cover all the explosion point areas, the minimum stations finish the beam explosion point polishing operation, polishing follows a transverse polishing explosion point polishing track strategy, the explosion point polishing track strategy is from top to bottom and from left to right, the transverse polishing distance is the single-station coverage width, and 50% of polishing disc diameter size coverage areas are overlapped among the stations.

Further, a schematic view of a wall surface is shown in fig. 9, a schematic view of a door opening is shown in fig. 10, and a schematic view of a bay window is shown in fig. 11.

In one embodiment, as shown in fig. 12, there is provided a grinding apparatus including:

a chassis 10;

a grinding mechanism 20;

a feeding mechanism 30; the feeding mechanism 30 is used for controlling the distance between the polishing mechanism 10 and the wall surface and the polishing pressure applied by the polishing mechanism;

a pitch adjustment mechanism 40; the pitching adjusting mechanism 40 is used for adjusting the verticality of the polishing mechanism 10 and the ground;

a lifting mechanism 50; the lifting mechanism 50 is used for adjusting the height position of the polishing mechanism 10;

a traversing mechanism 60; the traversing mechanism 60 is used to adjust the horizontal position of the grinding mechanism 10

A central control device 70; the master control equipment is respectively connected with the chassis 10, the polishing mechanism 20, the feeding mechanism 30, the pitching adjusting mechanism 40, the lifting mechanism 50 and the traversing mechanism 60; the master control device implements the steps of any of the methods described above.

Further, the device comprises a navigation radar 80, a dust collection device 90, an obstacle avoidance radar 100 and a telescopic device 110 which are connected with the master control equipment and are used for controlling the lifting mechanism to adjust forwards and backwards;

in one embodiment, as shown in fig. 13, there is provided a grinding apparatus including:

the task data acquisition module is used for acquiring the operation information of the current site and analyzing the operation information to obtain task data;

the analysis module is used for analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

the output module is used for acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

In one embodiment, the grinding device further comprises:

the detection module is used for detecting that the polishing equipment is separated from the corresponding polishing working state and acquiring the type of the corresponding operation object and the corresponding polishing data;

the comparison module is used for comparing the corresponding polishing data with preset standard data according to the type of the corresponding operation object; the preset standard data is obtained according to the type of the operation object;

and the grinding quality determining module is used for determining the grinding quality according to the comparison result.

In one embodiment, the alignment module comprises:

the detonation point comparison module is used for comparing the polishing depth with a preset depth if the type of the operation object is a detonation point;

and the abutted seam step comparison module is used for comparing the type of the operation object with any one of the following positions: and (5) matching the polishing times with the preset times for the seam splicing and the step splicing.

In one embodiment, the grinding device further comprises:

and the circulating module is used for indicating the polishing equipment to perform polishing operation on the next station until polishing operation of all stations is completed under the condition that the polishing quality of the current station is qualified.

In one embodiment, the grinding device further comprises:

the initial data acquisition module is used for acquiring wall data and a construction area map;

the planning module is used for planning the sites according to the wall data and the construction area map to obtain each site and the construction sequence of each site;

and the moving module is used for indicating the grinding equipment to move to a first station in the construction sequence.

In one embodiment, the grinding device further comprises:

and the obstacle avoidance module is used for adjusting the polishing position of the polishing equipment until the number of times of receiving the early warning signal is greater than a preset value under the condition that the motor of the polishing equipment sends the early warning signal.

In one embodiment, the obstacle avoidance module includes:

the contraction module is used for indicating a feeding electric cylinder of the polishing equipment to perform contraction action so as to enable a polishing mechanism of the polishing equipment to be far away from a corresponding operation object;

and the driving module is used for indicating the polishing equipment to move for a preset distance along the polishing path under the condition that the polishing mechanism is detected to be separated from the corresponding operation object.

In one embodiment, the grinding device further comprises:

the safety module is used for outputting safety parameters to the polishing equipment; the safety parameters comprise a first safety distance between a polishing mechanism of the polishing equipment and the internal corner of the wall surface, a second safety distance between the polishing mechanism of the polishing equipment and an adjacent vertical surface, a third safety distance between the polishing mechanism of the polishing equipment and the floor, and a fourth safety distance beyond the edge of the wall body.

For the specific definition of the polishing device, reference may be made to the above definition of the polishing method, which is not described herein again. The various modules in the above described grinding apparatus may be implemented in whole or in part by software, hardware, and combinations thereof. The modules can be embedded in a hardware form or independent of a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.

In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of:

acquiring operation information of a current site and analyzing the operation information to obtain task data;

analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

In one embodiment, the computer program when executed by the processor further performs the steps of:

detecting that the polishing equipment is separated from a corresponding polishing working state, and acquiring the type of a corresponding operation object and corresponding polishing data;

comparing the corresponding polishing data with preset standard data according to the type of the corresponding operation object; the preset standard data is obtained according to the type of the operation object;

and determining the grinding quality according to the comparison result.

In one embodiment, the step of comparing the corresponding polishing data with the preset standard data according to the type of the corresponding operation object further implements the following steps when executed by the processor:

if the type of the operation object is a detonation point, comparing the polishing depth with a preset depth;

if the type of the operation object is any one of the following positions: and (4) matching the polishing times with the preset times by the seam splicing and the step.

In one embodiment, the computer program when executed by the processor further performs the steps of:

and under the condition that the polishing quality of the current station is qualified, the polishing equipment is instructed to perform polishing operation of the next station until the polishing operation of all stations is completed.

In one embodiment, the computer program when executed by the processor further performs the steps of:

acquiring wall data and a construction area map;

planning the sites according to the wall data and the construction area map to obtain each site and the construction sequence of each site;

and instructing the grinding equipment to move to a station at the first position in the construction sequence.

In one embodiment, the computer program when executed by the processor further performs the steps of:

and under the condition that the motor receiving the polishing equipment sends out the early warning signal, adjusting the polishing position of the polishing equipment until the number of times of receiving the early warning signal is greater than a preset value.

In one embodiment, the step of adjusting the sharpening position of the sharpening device when executed by the processor further comprises the steps of:

instructing a feeding electric cylinder of the polishing equipment to perform contraction action so as to enable a polishing mechanism of the polishing equipment to be far away from a corresponding operation object;

and under the condition that the grinding mechanism is detected to be separated from the corresponding operation object, the grinding equipment is indicated to move for a preset distance along the grinding path.

In one embodiment, the computer program when executed by the processor further performs the steps of:

outputting safety parameters to polishing equipment; the safety parameters comprise a first safety distance between a polishing mechanism of the polishing equipment and the internal corner of the wall surface, a second safety distance between the polishing mechanism of the polishing equipment and an adjacent vertical surface, a third safety distance between the polishing mechanism of the polishing equipment and the floor, and a fourth safety distance beyond the edge of the wall body.

It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include non-volatile and/or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchlink DRAM (SLDRAM), rambus DRAM (RDRAM), and interface DRAM (DRDRAM).

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present patent should be subject to the appended claims.

Claims (13)

1. A method of sanding, comprising the steps of:

acquiring operation information of a current site and analyzing the operation information to obtain task data;

analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; and the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

2. The sanding method as defined in claim 1, further comprising the steps of:

detecting that the grinding equipment is separated from the corresponding grinding working state, and acquiring the type of the corresponding operation object and the corresponding grinding data;

comparing the corresponding polishing data with preset standard data according to the type of the corresponding operation object; the preset standard data is obtained according to the type of the operation object;

and determining the grinding quality according to the comparison result.

3. The lapping method of claim 2, wherein the corresponding lapping data comprises a lapping depth and a lapping number; the preset standard data comprises preset depth and preset times;

the step of comparing the corresponding polishing data with preset standard data according to the type of the corresponding operation object comprises the following steps:

if the type of the operation object is a detonation point, comparing the polishing depth with the preset depth;

if the type of the operation object is any one of the following positions: and matching the grinding times with the preset times by splicing the seams and the steps.

4. The sanding method as defined in claim 2, further comprising the steps of:

and under the condition that the polishing quality of the current station is qualified, the polishing equipment is instructed to perform polishing operation of the next station until polishing operation of all stations is completed.

5. The polishing method as claimed in claim 1, wherein the step of obtaining the operation information of the current station is preceded by the steps of:

acquiring wall data and a construction area map;

planning the sites according to the wall data and the construction area map to obtain each site and the construction sequence of each site;

and instructing the grinding equipment to move to a station at the first position in the construction sequence.

6. The sanding method as defined in claim 1, further comprising the steps of:

and under the condition that the motor of the polishing equipment sends out an early warning signal, adjusting the polishing position of the polishing equipment until the frequency of receiving the early warning signal is greater than a preset value.

7. The polishing method as recited in claim 6, wherein the warning signal is issued when any of the following conditions is met: and detecting that the motor torque is greater than the set torque and the motor current value is greater than the set current value.

8. The grinding method as claimed in claim 6, wherein the step of adjusting the grinding position of the grinding apparatus includes:

instructing a feeding electric cylinder of the grinding equipment to perform contraction action so as to enable a grinding mechanism of the grinding equipment to be far away from a corresponding operation object;

and under the condition that the grinding mechanism is detected to be separated from the corresponding operation object, indicating the grinding equipment to move for a preset distance along the grinding path.

9. The sanding method of claim 1, wherein the work locations include wall surfaces, bay windows, door openings, and beams; the operation objects comprise abutted seams, explosion points, steps and barriers;

the polishing strategy comprises a abutted seam polishing strategy, an explosion point polishing strategy, a step polishing strategy, an obstacle avoidance polishing strategy, a wall surface polishing strategy, a bay window polishing strategy, a door opening polishing strategy and a beam polishing strategy.

10. The sanding method as defined in claim 1, further comprising the steps of:

outputting safety parameters to the polishing equipment; the safety parameters comprise a first safety distance between a grinding mechanism of the grinding equipment and the internal corner of the wall surface, a second safety distance between the grinding mechanism of the grinding equipment and an adjacent vertical surface, a third safety distance between the grinding mechanism of the grinding equipment and the floor and a fourth safety distance beyond the edge of the wall body.

11. An abrading apparatus, comprising:

a chassis;

a polishing mechanism;

a feed mechanism; the feeding mechanism is used for controlling the distance between the polishing mechanism and the wall surface and the polishing pressure applied by the polishing mechanism;

a pitch adjustment mechanism; the pitching adjusting mechanism is used for adjusting the verticality of the polishing mechanism and the ground;

a lifting mechanism; the lifting mechanism is used for adjusting the height position of the polishing mechanism;

a traversing mechanism; the transverse moving mechanism is used for adjusting the horizontal position of the grinding mechanism

A master control device; the master control equipment is respectively connected with the chassis, the polishing mechanism, the feeding mechanism, the pitching adjusting mechanism, the lifting mechanism and the traversing mechanism; the general control device implements the steps of the method of any of claims 1 to 10.

12. An abrading device, comprising:

the task data acquisition module is used for acquiring the operation information of the current site and analyzing the operation information to obtain task data;

the analysis module is used for analyzing the task data to obtain a corresponding analysis result; the analysis result comprises a work object and/or a work position;

the output module is used for acquiring and outputting a matched polishing strategy based on the operation object and/or the operation position; the grinding strategy is used for indicating the grinding equipment to enter a corresponding grinding working state.

13. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 10.

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