CN115472367B - LTCC resistor preparation method based on ultrasonic sample mixing - Google Patents
LTCC resistor preparation method based on ultrasonic sample mixing Download PDFInfo
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- CN115472367B CN115472367B CN202211237583.0A CN202211237583A CN115472367B CN 115472367 B CN115472367 B CN 115472367B CN 202211237583 A CN202211237583 A CN 202211237583A CN 115472367 B CN115472367 B CN 115472367B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/647—Resistive arrangements
Abstract
The invention provides a preparation method of an LTCC resistor based on ultrasonic sample mixing, which comprises the following steps: s1, LTCC resistor paste comprises a functional phase and an organic carrier; the functional phase consists of a conductive phase, a bonding phase and a modifier; s2, weighing a conductive phase, a bonding phase and a modifier, mixing and cooling to obtain a mixed phase for standby; s3, mixing the materials with ethanol, and magnetically stirring to obtain turbid liquid; s4, carrying out ultrasonic and magnetic stirring on the turbid liquid; s5, repeating the step S4, and performing vacuum freeze drying to obtain a functional phase; s6, weighing the functional phase and the organic carrier, mixing and rolling to the required fineness to obtain the resistor paste; s7, preparing the LTCC resistor by using the resistor paste. The slurry prepared by the ultrasonic sample mixing method has better homogeneity, adopts vacuum freeze drying to lighten the agglomeration phenomenon of functional phase particles, reduces the loss of functional phases in the ball milling transfer process, shortens the process operation time and reduces the industrial cost.
Description
Technical Field
The invention relates to the technical field of electronic materials, in particular to a preparation method of an LTCC resistor based on ultrasonic sample mixing.
Background
The low-temperature co-firing ceramic technology (Low Temperature Cofired Ceramc, LTCC) is generated in the Japanese of the eighties of the last century and is raised in the United states, the technology adopts a low-loss dielectric substrate and low-resistivity conductor wiring, the limitation of the wiring layer number of the traditional thick film integrated circuit is broken through by the substrate co-firing technology, meanwhile, passive devices such as resistors, capacitors and the like can be embedded, three-dimensional microwave interconnection is truly achieved, and the technology is a mainstream technology for realizing the packaging of the microwave components with small size, light weight, high density and high reliability at present. A Multi-Chip module (MCM) composed of a passive circuit module manufactured by LTCC technology and a monolithic IC is being widely used in the fields of military, aerospace, automobiles, energy sources, etc.
With the rapid development of LTCC technology in China, the development of matched materials is urgently needed in wide application prospect. LTCC materials are divided into three types of substrate materials, conductor slurry and passive device materials, wherein the resistor slurry is a key material for preparing resistors, is commonly used for military phased array radar transceiver components, is an important component of a power divider, an attenuator and a load, and the performance of the resistor slurry directly influences the electrical performance of the components.
For the resistor for the phased array transceiver component, the resistor embedded in the microwave multilayer circuit substrate cannot adopt laser modulation resistance, so the resistance accuracy is completely dependent on the slurry performance and the control of the resistor preparation process. In general, the precision of the embedded resistor of the LTCC is +/-30%, in order to improve the resistance precision of the embedded resistor, wu Yaguang and the like adopt imported slurry in the paper of the research on the preparation process of the embedded resistor with high precision of the LTCC, and the precision of the embedded resistor is improved to +/-18% by means of optimizing the rheological property, the printing process, the cofiring curve and the like of the slurry; gu Shaoxiong et al in LTCC resistor fine control, realize control of the resistor value accuracy within + -17% by optimizing resistor size design. The imported slurry is used as a raw material, the precision is improved by optimizing the resistor preparation process, and for domestic slurry, the raw material has uneven performance and poor repeatability, so that the design difficulty of the slurry process is increased, the test cost is further increased, and the high-resistance slurry (more than or equal to 10kΩ) is particularly outstanding in the problem.
Disclosure of Invention
The invention aims at overcoming the defects of the domestic resistor slurry technology and provides a preparation method of an LTCC resistor based on ultrasonic sample mixing.
The invention provides a preparation method of an LTCC resistor based on ultrasonic sample mixing, which comprises the following steps:
s1, preparing LTCC resistor slurry, wherein the LTCC resistor slurry comprises a functional phase and an organic carrier in a certain weight ratio; wherein the functional phase consists of a conductive phase, a bonding phase and a modifier in a certain weight ratio;
s2, weighing the conductive phase, the bonding phase and the modifier according to the weight ratio in the step S1, mixing the conductive phase, the bonding phase and the modifier, and cooling to obtain a mixed phase for standby;
s3, placing the mixed phase to be used in the step S2 into a container, adding a proper amount of ethanol, and magnetically stirring to obtain turbid liquid;
s4, placing the ultrasonic telescopic rod into the turbid liquid obtained in the step S3, and performing magnetic stirring for a period of time after ultrasonic treatment for a period of time;
s5, repeating the ultrasonic and magnetic stirring in the step S4 for a plurality of times, and taking out the solution, and performing vacuum freeze drying to obtain a functional phase with excellent homogeneity;
s6, weighing the functional phase and the organic carrier obtained in the step S5 according to the weight ratio in the step S1, mixing the functional phase and the organic carrier, and rolling until the fineness reaches the required fineness to obtain LTCC resistance slurry;
s7, preparing the LTCC resistor by using the LTCC resistor paste prepared in the step S6.
In some embodiments, the weight ratio of the functional phase to the organic carrier is: (2-4.5) and (5.5-8).
In some embodiments, the weight ratio of the conductive phase, binder phase, and modifier is 0.18:0.81:0.01.
In some embodiments, the weight ratio of the conductive phase, binder phase, and modifier is 0.2:0.79:0.01.
In some embodiments, the conductive phase, binder phase, and modifier in step S2 are mixed in a blender for 5 minutes.
In some embodiments, 200ml of ethanol is added in step S3, and the turbid liquid is prepared by magnetic stirring for 5min.
In some embodiments, the ultrasound of step S4 is preceded by a 5min ultrasound followed by a 2min magnetic stirring.
In some embodiments, the functional phase and the organic carrier are mixed for 10min in step S6.
In some embodiments, a fineness of less than 10 μm is required in step S6.
In some embodiments, in step S7, the LTCC resistor paste produced in step S6 is screen printed, laminated, and sintered onto a substrate to produce an LTCC resistor.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
1. the ultrasonic sample mixing method is adopted, the prepared LTCC resistor slurry has better homogeneity, the problem of poor resistance homogeneity of the high-resistance LTCC resistor is solved, and the precision of the LTCC resistor is improved.
2. The invention adopts vacuum freeze drying, reduces the agglomeration phenomenon of functional phase particles, and is favorable for uniformly dispersing the particles into an organic carrier.
3. According to the preparation method of the LTCC resistor, a ball milling process is abandoned when the LTCC resistor slurry is prepared, so that the loss of a functional phase in the ball milling transfer process is reduced, the process operation time is shortened, and the industrial cost is greatly reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly describe the drawings in the embodiments, it being understood that the following drawings only illustrate some embodiments of the present invention and should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for preparing an LTCC resistor based on ultrasonic sample mixing in an embodiment of the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1, this embodiment provides a method for preparing an LTCC resistor based on ultrasonic sample mixing, which includes the following steps:
s1, preparing LTCC resistor slurry, wherein the LTCC resistor slurry comprises a functional phase and an organic carrier, and the weight ratio of the functional phase to the organic carrier is 3.5:6.5; wherein the functional phase consists of a conductive phase, a binding phase and a modifier, and the weight ratio of the conductive phase to the binding phase to the modifier is 0.18:0.81:0.01;
s2, weighing the conductive phase, the bonding phase and the modifier according to the weight ratio in the step S1, putting the conductive phase, the bonding phase and the modifier into a mixer for mixing for 5min, and taking out and cooling to obtain a mixed phase for standby;
s3, placing the mixed phase to be used in the step S2 into a beaker, adding 200ml of ethanol, and magnetically stirring for 5min to prepare turbid liquid;
s4, placing the ultrasonic telescopic rod into the turbid liquid obtained in the step S3, adjusting the power to 15W, performing 5min of ultrasonic treatment, and then performing 2min of magnetic stirring, so as to avoid agglomeration of solid particles due to temperature rise caused by long-time continuous ultrasonic treatment;
s5, repeating the ultrasonic and magnetic stirring in the step S4 for 5 times, and taking out the solution, and performing vacuum freeze drying to obtain a functional phase with excellent homogeneity;
s6, weighing the functional phase and the organic carrier obtained in the step S5 according to the weight ratio in the step S1, putting the functional phase and the organic carrier into a mixer, mixing for 10min, and rolling the mixture to the fineness of less than 10 mu m through a three-roller machine to obtain LTCC resistance slurry;
and S7, taking the LTCC resistor slurry prepared in the step S6 as a substrate by taking an imported Ferro A6 system ceramic plate, and preparing the LTCC resistor by screen printing, laminating and sintering.
Example 2
As shown in fig. 1, this embodiment provides a method for preparing an LTCC resistor based on ultrasonic sample mixing, which includes the following steps:
s1, preparing LTCC resistor slurry, wherein the LTCC resistor slurry comprises a functional phase and an organic carrier, and the weight ratio of the functional phase to the organic carrier is 3.5:6.5; wherein the functional phase consists of a conductive phase, a binding phase and a modifier, and the weight ratio of the conductive phase to the binding phase to the modifier is 0.2:0.79:0.01;
s2, weighing the conductive phase, the bonding phase and the modifier according to the weight ratio in the step S1, putting the conductive phase, the bonding phase and the modifier into a mixer for mixing for 5min, and taking out and cooling to obtain a mixed phase for standby;
s3, placing the mixed phase to be used in the step S2 into a beaker, adding 200ml of ethanol, and magnetically stirring for 5min to prepare turbid liquid;
s4, placing the ultrasonic telescopic rod into the turbid liquid obtained in the step S3, adjusting the power to 15W, performing 5min of ultrasonic treatment, and then performing 2min of magnetic stirring, so as to avoid agglomeration of solid particles due to temperature rise caused by long-time continuous ultrasonic treatment;
s5, repeating the ultrasonic and magnetic stirring in the step S4 for 6 times, and taking out the solution, and performing vacuum freeze drying to obtain a functional phase with excellent homogeneity;
s6, weighing the functional phase and the organic carrier obtained in the step S5 according to the weight ratio in the step S1, putting the functional phase and the organic carrier into a mixer, mixing for 10min, and rolling the mixture to the fineness of less than 10 mu m through a three-roller machine to obtain LTCC resistance slurry;
and S7, taking the LTCC resistor slurry prepared in the step S6 as a substrate by taking an imported Ferro A6 system ceramic plate, and preparing the LTCC resistor by screen printing, laminating and sintering.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The preparation method of the LTCC resistor based on ultrasonic sample mixing is characterized by comprising the following steps of:
s1, preparing LTCC resistor slurry, wherein the LTCC resistor slurry comprises a functional phase and an organic carrier in a certain weight ratio; wherein the functional phase consists of a conductive phase, a bonding phase and a modifier in a certain weight ratio;
s2, weighing the conductive phase, the bonding phase and the modifier according to the weight ratio in the step S1, mixing the conductive phase, the bonding phase and the modifier, and cooling to obtain a mixed phase for standby;
s3, placing the mixed phase to be used in the step S2 into a container, adding a proper amount of ethanol, and magnetically stirring to obtain turbid liquid;
s4, placing the ultrasonic telescopic rod into the turbid liquid obtained in the step S3, and performing magnetic stirring for a period of time after ultrasonic treatment for a period of time;
s5, repeating the ultrasonic and magnetic stirring in the step S4 for a plurality of times, and taking out the solution, and performing vacuum freeze drying to obtain a functional phase with excellent homogeneity;
s6, weighing the functional phase and the organic carrier obtained in the step S5 according to the weight ratio in the step S1, mixing the functional phase and the organic carrier, and rolling until the fineness reaches the required fineness to obtain LTCC resistance slurry;
s7, preparing the LTCC resistor by using the LTCC resistor paste prepared in the step S6.
2. The method for preparing an ultrasonic sample mixing-based LTCC resistor according to claim 1, wherein the weight ratio of the functional phase to the organic carrier is: (2-4.5) and (5.5-8).
3. The method for preparing an LTCC resistor based on ultrasonic sample mixing according to claim 1, wherein the weight ratio of the conductive phase, the binder phase and the modifier is 0.18:0.81:0.01.
4. The method for preparing an LTCC resistor based on ultrasonic sample mixing according to claim 1, wherein the weight ratio of the conductive phase, the binder phase and the modifier is 0.2:0.79:0.01.
5. The method for preparing an LTCC resistor based on ultrasonic sample mixing according to claim 1, wherein the conductive phase, the binder phase and the modifier are mixed in a mixer for 5min in step S2.
6. The method for preparing the LTCC resistor based on ultrasonic sample mixing according to claim 1, wherein 200ml of ethanol is added in the step S3, and the turbid liquid is prepared through magnetic stirring for 5min.
7. The method for preparing an LTCC resistor based on ultrasonic sample mixing according to claim 1, wherein in the step S4, the magnetic stirring is performed for 2min after the ultrasonic processing for 5min is performed.
8. The method for preparing an LTCC resistor based on ultrasonic sampling as claimed in claim 1, wherein the functional phase and the organic carrier are mixed for 10min in step S6.
9. The method for preparing an LTCC resistor based on ultrasonic sampling as claimed in claim 1, wherein the fineness is less than 10 μm in step S6.
10. The method for preparing the LTCC resistor based on ultrasonic sample mixing according to claim 1, wherein in the step S7, the LTCC resistor paste prepared in the step S6 is prepared into the LTCC resistor by screen printing, lamination and sintering on a substrate.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104575887A (en) * | 2014-12-29 | 2015-04-29 | 广西新未来信息产业股份有限公司 | Low-temperature diffusion paste for patch type piezoresistor and preparation method thereof |
| KR20160032409A (en) * | 2014-09-16 | 2016-03-24 | 영진기술 주식회사 | High conductive Paste composition and producing Method thereof using high temperature heat treatment |
| CN106205875A (en) * | 2016-08-31 | 2016-12-07 | 安徽斯迈尔电子科技有限公司 | A kind of preparation method of thick-film resistor resistance slurry |
| CN110085346A (en) * | 2019-04-30 | 2019-08-02 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of heating resistor slurry and its preparation method and application of adaptation nitridation silicon substrate |
| CN113707360A (en) * | 2021-10-22 | 2021-11-26 | 西安宏星电子浆料科技股份有限公司 | Thick film resistor paste suitable for different types of stainless steel substrates |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP1901314B1 (en) * | 1997-10-02 | 2009-08-12 | Panasonic Corporation | Resistor and its manufacturing method |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160032409A (en) * | 2014-09-16 | 2016-03-24 | 영진기술 주식회사 | High conductive Paste composition and producing Method thereof using high temperature heat treatment |
| CN104575887A (en) * | 2014-12-29 | 2015-04-29 | 广西新未来信息产业股份有限公司 | Low-temperature diffusion paste for patch type piezoresistor and preparation method thereof |
| CN106205875A (en) * | 2016-08-31 | 2016-12-07 | 安徽斯迈尔电子科技有限公司 | A kind of preparation method of thick-film resistor resistance slurry |
| CN110085346A (en) * | 2019-04-30 | 2019-08-02 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of heating resistor slurry and its preparation method and application of adaptation nitridation silicon substrate |
| CN113707360A (en) * | 2021-10-22 | 2021-11-26 | 西安宏星电子浆料科技股份有限公司 | Thick film resistor paste suitable for different types of stainless steel substrates |
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