CN115464739A - Preparation process of formaldehyde-purified impregnated bond paper laminated wood floor - Google Patents

Preparation process of formaldehyde-purified impregnated bond paper laminated wood floor Download PDF

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CN115464739A
CN115464739A CN202211107938.4A CN202211107938A CN115464739A CN 115464739 A CN115464739 A CN 115464739A CN 202211107938 A CN202211107938 A CN 202211107938A CN 115464739 A CN115464739 A CN 115464739A
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formaldehyde
impregnated
paper
urea
purifying
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CN115464739B (en
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刘元强
盛芷宁
叶交友
沈娟霞
李小科
陆鸣亮
田雪
谢晓榕
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Dehua TB New Decoration MaterialsCo Ltd
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Dehua TB New Decoration MaterialsCo Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27MWORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M3/00Manufacture or reconditioning of specific semi-finished or finished articles
    • B27M3/04Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27DWORKING VENEER OR PLYWOOD
    • B27D1/00Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G12/00Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08G12/02Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes
    • C08G12/26Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08G12/34Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds and acyclic or carbocyclic compounds
    • C08G12/36Ureas; Thioureas
    • C08G12/38Ureas; Thioureas and melamines
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H17/00Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
    • D21H17/20Macromolecular organic compounds
    • D21H17/33Synthetic macromolecular compounds
    • D21H17/46Synthetic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H17/47Condensation polymers of aldehydes or ketones
    • D21H17/49Condensation polymers of aldehydes or ketones with compounds containing hydrogen bound to nitrogen
    • D21H17/51Triazines, e.g. melamine
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H17/00Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
    • D21H17/20Macromolecular organic compounds
    • D21H17/33Synthetic macromolecular compounds
    • D21H17/46Synthetic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H17/54Synthetic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen
    • D21H17/57Polyureas; Polyurethanes
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H17/00Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
    • D21H17/71Mixtures of material ; Pulp or paper comprising several different materials not incorporated by special processes
    • D21H17/72Mixtures of material ; Pulp or paper comprising several different materials not incorporated by special processes of organic material
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/18Paper- or board-based structures for surface covering
    • D21H27/22Structures being applied on the surface by special manufacturing processes, e.g. in presses
    • D21H27/26Structures being applied on the surface by special manufacturing processes, e.g. in presses characterised by the overlay sheet or the top layers of the structures
    • D21H27/28Structures being applied on the surface by special manufacturing processes, e.g. in presses characterised by the overlay sheet or the top layers of the structures treated to obtain specific resistance properties, e.g. against wear or weather
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A50/00TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
    • Y02A50/20Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)

Abstract

The invention relates to a preparation process of a formaldehyde-purifying impregnated bond paper laminated wood floor. It includes: mixing formaldehyde and sodium hydroxide, adjusting the pH value, adding formic acid after a period of time, adjusting the pH value again, adding alkali to a certain value, and adding melamine and urea at the moment to obtain a melamine modified urea-formaldehyde resin solution; mixing formaldehyde and potassium hydroxide, adding formic acid to reduce the pH value to a certain value, adding chitin and a nano silicon wafer, adding urea, and obtaining a urea-formaldehyde resin solution (UF) after the reaction is stopped; mixing the raw paper with raw paper, respectively carrying out primary gumming and secondary gumming, adding a curing agent at the moment, and curing the obtained impregnated paper in an oven for a period of time to obtain impregnated paper; and (3) placing the impregnated paper in the center of the base material in order, pasting the two sides of the base material, putting the finished assembly into a hot press, controlling a certain temperature and pressure, unloading the laminated board from the hot press, and cooling to obtain the impregnated bond paper laminated wood floor. The invention has good functions of sterilizing and purifying formaldehyde.

Description

Preparation process of formaldehyde-purified impregnated bond paper laminated wood floor
Technical Field
The invention relates to the technical field of impregnation process wood floor preparation, in particular to a preparation process of a formaldehyde purification impregnation adhesive film paper laminated wood floor.
Background
At present, the forest resources which can be harvested worldwide are increasingly reduced, and meanwhile, due to the social and economic development, the demands on wood and products thereof are continuously increased, so that the artificial board products developed by resources such as artificial fast-growing commercial forests, forest cultivation, felling residues and the like are very common and wide in application.
Most of wood and main products thereof, such as density fiberboard, shaving board, laminated wood board, laminate wood floor and the like, adopt UF glue as an adhesive, so that the formaldehyde release phenomenon generally exists. With the higher living standard and quality of people, society and consumers generally pay attention to the environmental protection performance of artificial boards, wherein formaldehyde gas emitted by the artificial boards has direct influence on human health and indoor environment. Free formaldehyde is an important index for measuring the use of furniture and building materials and is also an important index for necessarily measuring all artificial boards. By free formaldehyde is meant the formaldehyde gas released during the manufacture and use of the manufactured board. Formaldehyde is gaseous at normal temperature, is colorless but has strong pungent smell, and can damage human health after being inhaled for a long time and directly contacted with skin, so that chronic poisoning is caused. Currently, the national mandatory standard GB18580-2001 regulates formaldehyde release. Therefore, under the background that the yield of the current artificial boards is gradually increased year by year and is widely used, and meanwhile, the environmental awareness of people is continuously enhanced, the application of formaldehyde purification impregnated bond paper laminated wood floors becomes an option for people.
Disclosure of Invention
The invention aims to provide a preparation process of a formaldehyde purification impregnated bond paper laminated wood floor and solve the problem of formaldehyde release seriously threatening the living room environment and the board-type furniture of human health. The formaldehyde purification impregnated bond paper laminated wood floor can meet the requirements of people on furniture and effectively reduce the release amount of formaldehyde.
The technical purpose of the invention is realized by the following technical scheme: a formaldehyde-purifying impregnated bond paper laminated wood flooring comprising: the resin content in the surface impregnated paper is 110.8% -152.3%, the volatile matter content is 5.6% -8.5%, the resin content in the decorative impregnated paper is 70.6% -92.5%, and the volatile matter content is 8.5% -9.6%. The requirement of each base material is 105g to 110g.
The invention develops a preparation process of the formaldehyde purification impregnated bond paper laminated wood floor aiming at the laminated wood floor, and finally the laminated wood floor with obvious formaldehyde purification effect can be obtained, thereby reducing the influence of harmful gas inhalation on body health for a long time.
Preferably, the formaldehyde-purifying impregnated bond paper laminated wood floor comprises a flat and attractive medium-density wood board, the water content of the medium-density wood board is 9%, the thickness of the medium-density wood board is 7-18mm, the wood board is poplar, the diameter of wood fiber of the medium-density wood board is 10-50 micrometers, and the wall thickness of the medium-density wood board is 1-11 micrometers.
Wherein, if the moisture content of the wooden board is not easy to be too high, the gluing capability is poor due to high moisture content during gluing, and the phenomena of glue penetration and board sticking are easy to occur; the moisture content is not easy to be too low, so that the phenomena of cracking, warping and the like can be caused, and waste products are generated.
The specification of the preferable surface impregnated paper is 45mm multiplied by 45mm, the resin content in the surface impregnated paper is 110.8% -152.3%, and the volatile matter content in the surface impregnated paper is 5.6% -8.5%; the decorative impregnated paper contains 70.6-92.5% of resin and 8.5-9.6% of volatile matter;
wherein, the resin content refers to the content of solid resin in the adhesive film paper and is expressed by mass percent. Volatile matter content in the adhesive film paper accounts for the content of the volatile matter in the whole adhesive film paper, and the volatile matter content is expressed by mass percentage; the volatiles were mainly water vapor and air within the impregnated paper.
Wherein, other additives such as curing agent, release agent, penetrating agent and the like are added into the resin for burning and curing, so that the proper adding amount of the curing agent in the resin is ensured.
Preferably, the curing agent is fatty amine, the release agent is dimethyl silicone oil, and the penetrating agent is sodium sulfamate.
Preferably, the preparation method of the formaldehyde purification impregnated bond paper comprises the following steps: mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.2-8.9, adding formic acid after 75min, adjusting the pH value to 4.2-4.5, reacting to the temperature of 10-15 ℃, adding alkali to the pH value of 9-9.3, adding melamine and urea, reacting for a period of time, cooling to 72-78 ℃, adding urea, reacting for 15-25min, and stopping the reaction to obtain a melamine modified urea-formaldehyde resin solution (MUF).
The melamine modified urea resin is easier to form a three-dimensional network structure, and can effectively seal water-absorbing groups; the melamine is alkaline and can neutralize acid in the adhesive layer, so that the hydrolysis rate of the resin is reduced to a certain extent, and the water resistance is improved.
Preferably, the melamine is reacted with formic acid, the result of which is advantageous for reducing the amount of free formic acid released.
The melamine can react with formaldehyde to generate methyl melamine, so that the release amount of free formaldehyde is reduced, the binding force of the melamine and the formaldehyde is large, the release of formaldehyde molecules can be well bound, and the release amount of the free formaldehyde is reduced; one mole of melamine molecules can absorb six moles of formaldehyde molecules, so melamine can absorb more formaldehyde molecules.
Preferably, formaldehyde and potassium hydroxide are mixed, the temperature is increased to 78-85 ℃, formic acid is added to reduce the pH to 4.5-5.0 when the temperature is stable, an aldehyde removing agent is added at the moment, urea is added when certain viscosity exists in the reaction, and the urea-formaldehyde resin solution (UF) is obtained when the reaction is stopped.
Wherein the aldehyde removing agent is chitin and a nano silicon chip.
Preferably, one mole of urea molecules absorbs four moles of formaldehyde molecules, and urea reacts with free formaldehyde to absorb free formaldehyde.
Preferably, the melamine modified urea-formaldehyde resin solution obtained by the reaction is mixed with decorative base paper, the mixture is subjected to primary gum dipping, curing agent aliphatic amine is added at the time, and the obtained impregnated paper is cured for 45 to 70min at 85 to 105 ℃ in an oven to obtain the decorative impregnated paper.
Preferably, the formaldehyde-purifying impregnated film paper is subjected to secondary gum dipping, the urea resin solution obtained by the reaction is mixed with impregnated paper for gum dipping, curing agent aliphatic amine is added, and the obtained impregnated paper is cured in an oven at 85 to 105 ℃ for 45 to 70min to obtain surface impregnated paper.
Preferably, the base material poplar is sawed into a size of 45cm × 45cm after being sanded, the impregnated paper is cut into a size of 45cm × 45cm and is placed in the center of the poplar in order, the pasted assembly is placed into a hot press to be hot-pressed under the conditions that the temperature is 160-180 ℃, the pressure is 2.5-3.2MPa and the time is 45-60S, and the impregnated bond paper laminated wood floor is obtained after being cooled.
In conclusion, the invention has the following beneficial effects:
1. the technology is operated in the material for manufacturing furniture, and the formaldehyde release amount and the smell of the household material are reduced, so that the product is environment-friendly and simultaneously achieves the odor purification effect;
2. the surface of the wooden floor manufactured in the market at the present stage is rough, smooth, poor in water resistance, stain resistance, hardness and the like, and not attractive, and simultaneously releases a large amount of free formaldehyde, compared with products produced in the existing market, the decoration has the advantages of excellent surface performance, attractive surface pattern, low price, high temperature resistance, acid-base corrosion resistance and the like, can seal the formaldehyde release of the base material, can completely cure the resin, uses an environment-friendly additive, and well seals and releases the formaldehyde in the wooden floor;
3. the added formaldehyde removing agent chitin and the nano silicon wafer can effectively adsorb gas molecules such as formaldehyde and decompose the substances into water, thereby playing the roles of sterilization and odor removal;
4. the resin is impregnated once, so that the production cost is reduced, and meanwhile, the resin has better permeability.
Drawings
FIG. 1 is a process for preparing formaldehyde-purified impregnated bond paper;
fig. 2 is a process flow of formaldehyde-purified impregnated bond paper laminated wood flooring.
Detailed Description
Example 1
Mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.2, adding formic acid after 75min, adjusting the pH value again, reacting until the water temperature is 10 ℃, adding alkali to 9.0 to terminate the acid process reaction, and adding melamine and urea at the moment to obtain a melamine modified urea-formaldehyde resin solution; mixing formaldehyde and potassium hydroxide, raising the temperature to 78 ℃, adding formic acid to reduce the pH to 4.5 when the temperature is stable, adding chitin and a nano silicon wafer, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain a urea-formaldehyde resin solution (UF); and mixing the resin solution obtained by the reaction with the base paper, respectively performing primary gum dipping and secondary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained impregnated paper in an oven at 85 ℃ for 45min to obtain the impregnated paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of a base material poplar, pasting the two sides of the base material poplar, putting the finished assembly into a hot press, controlling the temperature to be 160 ℃ and the pressure to be 2.5MPa, removing the laminated board from the hot press after 45S, and cooling to obtain the impregnated bond paper laminated wood floor.
Wherein the raw material formula 1:
formaldehyde 3 parts
3 portions of sodium hydroxide
Formic acid 4 parts
2 parts of melamine
4 portions of urea
Chitin 1 part
1 part of nano silicon wafer
Example 2
Mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.3, adding formic acid after 75min, adjusting the pH value again, reacting until the water temperature is 11 ℃, adding alkali to 9.1 to terminate the acid process reaction, and adding melamine and urea at the moment to obtain a melamine modified urea-formaldehyde resin solution; mixing formaldehyde and potassium hydroxide, raising the temperature to 81 ℃, adding formic acid to reduce the pH to 4.7 when the temperature is stable, adding chitin and a nano silicon wafer, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain a urea-formaldehyde resin solution (UF); and mixing the resin solution obtained by the reaction with the base paper, respectively carrying out primary gum dipping and secondary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained impregnated paper for 46min at 89 ℃ in an oven to obtain the impregnated paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of a base material poplar, pasting the two sides of the base material poplar, putting the finished assembly into a hot press, controlling the temperature to be 165 ℃ and the pressure to be 2.6MPa, unloading the laminated board from the hot press after 50S, and cooling to obtain the impregnated bond paper laminated wood floor.
Wherein the raw material formula 2:
4 parts of formaldehyde
3 portions of sodium hydroxide
Formic acid 2 parts
2 parts of melamine
3 portions of urea
Chitin 4 parts
3 parts of nano silicon wafer
Example 3
Mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.4, adding formic acid after 75min, adjusting the pH value again, reacting until the water temperature is 12 ℃, adding alkali to 9.0 to terminate the acid process reaction, and adding melamine and urea at the moment to obtain a melamine modified urea-formaldehyde resin solution; mixing formaldehyde and potassium hydroxide, raising the temperature to 84 ℃, adding formic acid to reduce the pH to 4.5 when the temperature is stable, adding chitin and a nano silicon wafer at the moment, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain a urea-formaldehyde resin solution (UF); and mixing the resin solution obtained by the reaction with the base paper, respectively performing primary gum dipping and secondary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained impregnated paper at 90 ℃ in an oven for 55min to obtain the impregnated paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of the base material poplar, pasting the two sides, putting the finished assembly into a hot press, controlling the temperature to be 170 ℃ and the pressure to be 2.6MPa, unloading the laminated board from the hot press after 47S, and cooling to obtain the impregnated bond paper laminated wood floor.
Wherein the raw material formula 3:
formaldehyde 3 parts
Sodium hydroxide 4 parts
Formic acid 4 parts
2 parts of melamine
4 portions of urea
Chitin 2 parts
2 parts of nano silicon wafer
Example 4
Mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.9, adding formic acid after 75min, adjusting the pH value again, reacting until the water temperature is 13 ℃, adding alkali to 9.2 to terminate the acid process reaction, and adding melamine and urea at the moment to obtain a melamine modified urea-formaldehyde resin solution; mixing formaldehyde and potassium hydroxide, raising the temperature to 85 ℃, adding formic acid to reduce the pH to 4.6 when the temperature is stable, adding chitin and a nano silicon wafer, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain a urea-formaldehyde resin solution (UF); and mixing the resin solution obtained by the reaction with the base paper, respectively performing primary gum dipping and secondary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained impregnated paper in an oven at 100 ℃ for 60min to obtain the impregnated paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of a base material poplar, pasting the two sides of the base material poplar, putting the finished assembly into a hot press, controlling the temperature to be 172 ℃ and the pressure to be 2.8MPa, and after 66S, unloading the laminated board from the hot press, and cooling to obtain the impregnated bond paper laminated wood floor.
Wherein the raw material formula 4:
2 portions of formaldehyde
3 portions of sodium hydroxide
Formic acid 3 parts
Melamine 4 parts
4 portions of urea
Chitin 4 parts
1 part of nano silicon wafer
Example 5
Mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.6, adding formic acid after 75min, adjusting the pH value again, reacting until the water temperature is 15 ℃, adding alkali to 9.3 to terminate the acid process reaction, and adding melamine and urea at the moment to obtain a melamine modified urea-formaldehyde resin solution; mixing formaldehyde and potassium hydroxide, raising the temperature to 85 ℃, adding formic acid to reduce the pH to 4.8 when the temperature is stable, adding chitin and a nano silicon wafer, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain a urea-formaldehyde resin solution (UF); and mixing the resin solution obtained by the reaction with the base paper, respectively performing primary gum dipping and secondary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained impregnated paper in an oven at the temperature of 98 ℃ for 64min to obtain the impregnated paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of the poplar substrate, pasting the two sides of the poplar substrate, putting the finished assembly into a hot press, controlling the temperature to be 160 ℃ and the pressure to be 3.0MPa, discharging the laminated board from the hot press after 58S, and cooling to obtain the impregnated bond paper laminated wood floor.
Wherein the raw material formula is 5:
formaldehyde 1 part
3 portions of sodium hydroxide
Formic acid 2 parts
3 parts of melamine
4 portions of urea
Chitin 6 parts
6 parts of nano silicon wafer
Example 6
Mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.7, adding formic acid after 75min, adjusting the pH value again, reacting until the water temperature is 14 ℃, adding alkali to 9.3 to terminate the acid process reaction, and adding melamine and urea at the moment to obtain a melamine modified urea-formaldehyde resin solution; mixing formaldehyde and potassium hydroxide, raising the temperature to 76 ℃, adding formic acid to reduce the pH to 4.9 when the temperature is stable, adding chitin and a nano silicon wafer, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain a urea-formaldehyde resin solution (UF); and mixing the resin solution obtained by the reaction with the base paper, respectively performing primary gum dipping and secondary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained impregnated paper for 48min at the temperature of 90 ℃ in an oven to obtain the impregnated paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of a base material poplar, pasting the two sides of the base material poplar, putting the finished assembly into a hot press, controlling the temperature to be 171 ℃ and the pressure to be 2.8MPa, unloading the laminated board from the hot press after 60S, and cooling to obtain the impregnated bond paper laminated wood floor.
Wherein the raw material formula 6:
2 portions of formaldehyde
3 portions of sodium hydroxide
Formic acid 5 parts
2 parts of melamine
5 portions of urea
Chitin 3 parts
3 parts of nano silicon wafer
Comparative example 1
Mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.7, adding formic acid after 75min, adjusting the pH value again, reacting until the water temperature is 15 ℃, adding alkali to 9.2 to terminate the acid process reaction, mixing the melamine modified urea-formaldehyde resin solution obtained by the reaction with base paper, performing primary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained dipped paper in an oven at 94 ℃ for 50min to obtain the dipped paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of the poplar substrate, pasting the two sides of the poplar substrate, putting the finished assembly into a hot press, controlling the temperature to be 170 ℃ and the pressure to be 3.0MPa, removing the laminated board from the hot press after 59S, and cooling to obtain the impregnated bond paper laminated wood floor.
Comparative example 2
Mixing formaldehyde and potassium hydroxide, raising the temperature to 79 ℃, adding formic acid to reduce the pH to 4.9 when the temperature is stable, adding chitin and a nano silicon wafer at the moment, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain a urea-formaldehyde resin solution (UF); and (3) mixing the resin solution obtained by the reaction with the base paper, performing primary gum dipping, adding curing agent fatty amine at the moment, and curing the obtained impregnated paper for 70min in an oven at 88 ℃ to obtain the impregnated paper. Cutting the impregnated paper into 45cm multiplied by 45cm, neatly placing the impregnated paper in the center of a base material poplar, pasting the two sides of the base material poplar, putting the finished assembly into a hot press, controlling the temperature to be 171 ℃ and the pressure to be 2.9MPa, discharging the laminated board from the hot press after 48S, and cooling to obtain the impregnated bond paper laminated wood floor.
The impregnated bond paper laminated wood flooring obtained in examples 1 to 6 and comparative examples 1 and 2 were subjected to performance tests, specifically as follows:
water cut test
Sampling according to the regulation of GB/T34722-2017 'impregnated bond paper veneer plywood and laminated wood board', numbering the samples, weighing as soon as possible, and filling the results into a record table. Putting the samples with the water content obtained in the same batch of tests into an oven, drying at the temperature of 103 DEG C2 for 8h, selecting 2-3 samples from the samples, carrying out one-time test weighing, and weighing the selected samples once every 2 h.
Surface bond Strength test
Sampling according to the regulation of GB/T34722-2017 impregnated bond paper veneer plywood and core-board, grinding the surface of a sample by using fine sand paper, adhering the bottom surface of a metal special chuck to the center of the sample by using hot melt adhesive, uniformly loading in the direction vertical to the gluing surface, damaging the sample within 30 to 90 seconds from the loading, and recording the maximum load when the bond line of the sample is stripped or damaged to be accurate to 10N.
Surface contamination resistance test
Sampling according to the regulation of GB/T34722-2017 'impregnated bond paper veneer plywood and laminated wood board', dripping 2 drops or coating a little (the area is about 300 mm) 2 ) Detecting the object, covering with a watch glass, standing at room temperature for 24h, scrubbing the surface with clear water or ethanol or acetone solvent, and drying with absorbent cotton. Under natural light, the surface condition of the test piece is observed from various angles at a position which is about 40mm away from the surface of the test piece.
Formaldehyde emission (dryer method) test
According to the regulation of GB/T17657-2013 physicochemical property test method for artificial boards and facing artificial boards. Total surface area tailored 0.125m 2 The sample was heated in an oven at 170 ℃ for 10 min, and then placed in a 2.5L jar, and the jar was placed in an oven and heated at (65. + -. 2) ° C for (2. + -. 0.1) h to room temperature, and then the evaluation was started.
Formaldehyde emission (climatic chamber method) test
According to the regulation of GB 18580-2017 Formaldehyde emission limit in artificial boards and products thereof for interior decoration and finishing materials. The sample having a total cut surface area of 0.5m was placed in a 40L dryer, and after standing at normal temperature for 24 hours, evaluation was started.
Formaldehyde purification Performance test
Formaldehyde purification performance test, namely formaldehyde purification efficiency and formaldehyde purification effect durability: reference is made to the regulation in section 6 of JC/T1074-2008. Preparing a formaldehyde purification ecological plate sample, opening a formaldehyde tester, and observing the indoor formaldehyde concentration at a qualified value of 0.1 mg/m 3 And (4) placing the sample into a formaldehyde test box, and keeping the concentration of formaldehyde not to change greatly. 0.5mL of formaldehyde solution is extracted by a medical pipettor, and is injected into 0.02-0.03 mL to the prepared medical cotton swab, and the medical cotton swab is inserted into a formaldehyde test box. The fan was turned on to mix the air in the box for about 2 min. Observing the reduction speed of the concentration of the formaldehyde in the box and the formaldehyde removal effect.
The specific test results are shown in tables 1-6
TABLE 1 moisture content detection
Figure DEST_PATH_IMAGE001
For the moisture content, its waterproof performance of impregnated paper laminate improves to a certain extent, and impregnated paper is two-sided (including top layer and decorative layer), and the moisture content all has obvious reduction, no matter top layer impregnated paper or decorative layer impregnated paper resin curing after the hot pressing laminating have good waterproof effect, but receives the effect of high temperature, probably can make partly solidified resin appear ageing, finally leads to the bonding strength to be influential for the goods moisture content is different. From the whole, the water content is the highest in example 4, so the hot pressing temperature and pressure are large, whereas the water content is the lowest in comparative example 1.
TABLE 2 surface bond Strength testing
Figure DEST_PATH_IMAGE002
Figure DEST_PATH_IMAGE003
The tests relate to finished articles with respect to the indication of surface bond strength
The surface bonding strength of the adhesive is reduced compared with that of the base material, mainly because the hot pressing process adopted by the veneering has certain damage to the glued glue layer in the base material, the damage is caused not only by further pressing, but also by high temperature, a part of cured resin can be aged, and finally the internal bonding strength is lower than that of the base material, wherein the bonding strength of the embodiment 4 is the lowest, and the bonding strength of the embodiment 5 is higher because the hot pressing temperature and the pressure are higher.
TABLE 3 surface resistance to fouling and Corrosion
Figure DEST_PATH_IMAGE004
Different oven temperatures result in different degrees of precuring, wherein the temperature is in direct proportion to the degree of precuring, and the pollution and corrosion resistance of the examples 3 and 4 is higher, because the temperature of the examples 3 and 4 is increased, so that the degree of precuring is increased, the resin is better melted in the pressing process, the surface of the laminated board is smoother, and the pollution resistance of the surface of the final laminated board is improved.
TABLE 4 Formaldehyde emission (dryer method)
Figure DEST_PATH_IMAGE005
During the preparation of the resin, the urea added for the second time degrades and rearranges macromolecular parts in molecules, so that the content of ether bonds in the resin is reduced, and the formaldehyde emission is mainly due to light methyl and secondary methyl ether bonds in the molecules. So that the formaldehyde emission of the impregnated paper per se is remarkably reduced as the molar ratio is reduced.
Compared with the formaldehyde emission of the part, which is not sealed, of the base material of the prepared laminated board with different raw material amounts, along with the increase of the dosage of the formaldehyde removing agent, the impregnated paper with high raw material amount releases more formaldehyde, and can better seal the formaldehyde from the board, but along with the high dosage, the sealing effect is not obviously improved. The formaldehyde purifying ecological plate has the function of purifying formaldehyde in air, and also has the characteristic of releasing formaldehyde. A part of formaldehyde released from the glue layer of the ecological plate is mixed into air, and a part of formaldehyde is adsorbed and decomposed by the effective components of the formaldehyde removing agent on the surface.
TABLE 5 Formaldehyde emission (climatic box method)
Figure DEST_PATH_IMAGE006
During the preparation of the resin, the urea added for the second time degrades and rearranges macromolecular parts in molecules, so that the content of ether bonds in the resin is reduced, and the formaldehyde emission is mainly due to light methyl and secondary methyl ether bonds in the molecules.
The climate box method has no condition that formaldehyde in the box body is dissolved in distilled water, the formaldehyde is fully mixed with air and fully contacts with the surface of the test piece, the reaction of formaldehyde-removing effective components and the formaldehyde is accelerated, the formaldehyde concentration detected by the climate box method is lower, and the lowest formaldehyde content in the embodiment 5 shows that the formaldehyde-removing components are more and more remarkable.
TABLE 6 Formaldehyde purification Performance
Figure DEST_PATH_IMAGE007
From the whole, the formaldehyde removal effect of the formaldehyde purification impregnated bond paper laminated board is improved along with the improvement of the concentration of the effective components in the addition amount of the formaldehyde removal agent, the higher the addition amount of the formaldehyde removal agent in the test is, the more remarkable the effect is, particularly when the formaldehyde removal agent in the example 5 is higher, the formaldehyde purification performance reaches 95%, and the durability of the purification effect reaches 87%.

Claims (7)

1. A preparation process of a formaldehyde purification impregnated bond paper laminated wood floor is characterized in that: the formaldehyde-purifying impregnated bond paper laminated wood floor comprises a medium-density wood board, surface impregnated paper and decorative impregnated paper; the thickness of the medium-density wood board is 7-18mm, the wood board is poplar, the diameter of wood fiber of the wood board is 10-50 micrometers, the wall thickness is 1-11 micrometers, the resin content in the surface layer impregnated paper is 110.8-152.3 wt%, the volatile matter content is 5.6-8.5 wt%, the resin content in the decorative impregnated paper is 70.6-92.5 wt%, and the volatile matter content is 8.5-9.6 wt%.
2. The formaldehyde-purifying impregnated bond paper laminate wood flooring of claim 1, wherein: the preparation method of the decorative impregnated bond paper comprises the following steps: mixing formaldehyde and sodium hydroxide, adjusting the pH value to 8.2-8.9, adding formic acid after 75min, adjusting the pH value to 4.2-4.5, reacting to the temperature of 10-15 ℃, adding alkali to the pH value of 9-9.3, adding melamine and urea, reacting for a period of time, cooling to 72-78 ℃, adding urea, reacting for 15-25min, and stopping the reaction to obtain a melamine modified urea-formaldehyde resin solution (MUF).
3. The formaldehyde-purifying impregnated bond paper laminate wood flooring of claim 2, wherein: the preparation method of the surface layer impregnated bond paper comprises the following steps: mixing formaldehyde and potassium hydroxide, heating to 78-85 ℃, adding formic acid to reduce the pH to 4.5-5.0 when the temperature is stable, adding chitin and a nano silicon wafer at the moment, adding urea when the reaction has certain viscosity, and stopping the reaction to obtain the urea-formaldehyde resin solution (UF).
4. The formaldehyde-purifying impregnated bond paper laminate wood flooring of claim 2, wherein: primary gum dipping: and (3) mixing the melamine modified urea resin solution obtained by the reaction with decorative base paper, gumming, adding curing agent aliphatic amine, and curing the obtained impregnated paper in an oven at 85-105 ℃ for 45-70min to obtain the decorative impregnated paper.
5. The formaldehyde-purifying impregnated bond paper laminate wood flooring of claim 3, wherein: secondary gum dipping: and mixing the urea resin solution obtained by the reaction with impregnated paper, dipping the impregnated paper, adding curing agent aliphatic amine, and curing the impregnated paper in an oven at 85-105 ℃ for 45-70min to obtain the surface impregnated paper.
6. The formaldehyde-purifying impregnated paper laminated wood flooring according to any one of claims 1 to 5, wherein: the formaldehyde-purifying impregnated bond paper laminated wood floor also comprises a smell cleaning agent, an aldehyde removing agent, a curing agent and a glue agent.
7. The formaldehyde-purifying impregnated bond paper laminate wood flooring of claim 6, wherein: sanding a base material poplar, sawing the base material poplar into a size of 45cm multiplied by 45cm, cutting the impregnated paper into a size of 45cm multiplied by 45cm, neatly placing the cut impregnated paper in the center of the poplar, placing the pasted assembly in a hot press, hot-pressing the assembly at the temperature of 160 to 180 ℃ and under the pressure of 2.5 to 3.2MPa for 45 to 60S, and cooling to obtain the impregnated bond paper laminated wood floor.
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