CN115460896A - Device for electromagnetically shielding electronic components of a motor vehicle - Google Patents

Device for electromagnetically shielding electronic components of a motor vehicle Download PDF

Info

Publication number
CN115460896A
CN115460896A CN202210632995.8A CN202210632995A CN115460896A CN 115460896 A CN115460896 A CN 115460896A CN 202210632995 A CN202210632995 A CN 202210632995A CN 115460896 A CN115460896 A CN 115460896A
Authority
CN
China
Prior art keywords
printed circuit
circuit board
electromagnetic
housing
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210632995.8A
Other languages
Chinese (zh)
Inventor
B·邦潘
F·贝格
R·莫德尔
R·希滕赫尔姆
R·赫尔维格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN115460896A publication Critical patent/CN115460896A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309Evaporators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037Housings with compartments containing a PCB, e.g. partitioning walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention relates to a device for electromagnetically shielding electronic components of a motor vehicle, comprising at least one housing (35) which at least partially encloses at least one printed circuit board (34); the device further comprises at least one shielding structure (32) for shielding at least one electromagnetic protection region (17) of the printed circuit board (34) with respect to an electromagnetic region (15), wherein in the electromagnetic protection region (17) at least one electromagnetically critical electronic component (64) is arranged on the printed circuit board (34), and wherein in the non-electromagnetic protection region (15) at least one plug (30) and/or plug contact (29) is in contact with the printed circuit board (34), wherein at least one electromagnetic seal (13) is arranged between the shielding structure (32) and the printed circuit board (34).

Description

Device for electromagnetically shielding electronic components of a motor vehicle
Technical Field
The invention relates to a device for electromagnetically shielding an electronic component of a motor vehicle, of the type according to the independent claim.
Background
A control device for a motor vehicle is known from DE 19709243 C1. The metal housing has a central part with side walls which enclose a main space, in which two metal housing covers and a printed circuit board with electronic circuits are arranged.
Disclosure of Invention
The aim of the invention is to further reduce the interfering radiation and susceptibility of the device to interference. This object is achieved by the features of the independent claims.
In particular, by providing an electromagnetic seal between the shielding layer and the printed circuit board and/or between the two housing halves, a particularly reliable and safe electromagnetic shielding is ensured, or shielding against critical areas (electronic component and/or printed circuit board areas) from the EMV (electromagnetic compatibility) point of view is ensured. Thus, possible gaps through which the electromagnetic field can pass can be safely avoided.
In an advantageous development, it is provided that the electromagnetic seal is designed as a seal, in particular as a preallocated or allocated seal or as an insert seal, and/or that the electromagnetic seal comprises at least an electromagnetic shielding element. Therefore, not only mechanical sealing but also electromagnetic sealing can be reliably achieved.
In an advantageous further development, it is provided that the printed circuit board has at least one shielding layer, in particular a shielding layer of planar design, in order to delimit the electromagnetically protected region from the non-electromagnetically protected region. This ensures that a reliable shielding can be achieved in a particularly simple manner by integrating the shielding layer into the printed circuit board. In this case, it is particularly advantageously provided that the printed circuit board has a contact region for contacting the electromagnetic seal and/or that the printed circuit board has at least one metallized through-hole (durchkongtakarteung) in order to connect the contact region and the shielding layer in an electrically conductive manner. This makes it possible to form a pot-shaped, closed body (or a cage) which surrounds the plug region outwards and in this way reliably shields electromagnetically critical regions of the printed circuit board. The quality of the shielding can then be further improved and improved.
In an advantageous development, it is provided that the shielding structure and/or the electromagnetic seal and/or the contact structure and/or the metallization via(s) enclose the non-electromagnetic-protection region in a closed (or cage-like), in particular annular or jacket-like, structure. This enables complete shielding against electromagnetically critical regions.
In an advantageous development, it is provided that a plurality of non-electromagnetic-shielding regions are provided, which are each surrounded by the shielding structure and/or the electromagnetic seal. In this way, a plurality of plug regions can be provided, which can be designed in a customized manner as required. Around these islands (Inseln), the electronic components can be positioned arbitrarily on the printed circuit board in the electromagnetically protected region. Thereby improving the degree of freedom in layout design of the printed circuit board.
In an advantageous development, it is provided that the contact regions are arranged on the upper and lower side of the printed circuit board and/or that the metallized through-hole(s) connect the shielding layer to the associated contact region from both sides of the printed circuit board. In this way, it is possible to electrically screen plug regions particularly easily, which are positioned in corners or recesses (Nische) of the control housing.
In an advantageous development, it is provided that the plug and/or plug contacts penetrate the shielding layer and/or the plug and/or plug contacts are guided through between the metallization vias, in particular between two metallization vias, and/or that the respective through openings of the shielding layer and/or the metallization vias for the plug and/or plug contacts have dimensions such that shielding is achieved, for example in the case of a through opening configured as a waveguide (Hohlleiter). In addition, a corresponding shielding of the electromagnetic region can thereby be achieved to a sufficient extent.
In an advantageous development, it is provided that the printed circuit board is arranged transversely to the at least two interchangeably arranged electronic components and/or that at least one plug connection is provided on the printed circuit board, in particular in the electromagnetic protection region, which plug connection can be brought into contact with the plug and the at least one electronic component. In particular in the case of replaceable electronic components, customized plug embodiments can be provided on a separate printed circuit board, while the electronic components themselves can be provided in a standardized manner independently of the customer. Only a special shielding of the printed circuit board with the plug arrangement has to be provided.
In an advantageous development, provision is made for a housing to be provided for at least partially enclosing the replaceable electronic component; and at least one front side which is detachably connected to the housing and via which replaceable electronic components arranged in the interior of the housing are accessible; and a rear side housing cover is provided. By means of a housing which at least partially encloses the electronic assembly, a corresponding shielding can be provided for these components. Furthermore, the replaceability of electronic components can be quickly and reliably implemented for changing hardware requirements.
In an advantageous further development, it is provided that the housing cover is at least a component of a housing which at least partially shields the printed circuit board, and/or that the housing cover comprises at least one passage for at least one plug and/or at least the shielding structure and/or comprises at least one receptacle for the printed circuit board parallel to the housing cover for contacting the replaceable electronic component. In the case of modular electronic designs, corresponding shielding for the plug region is provided only in the rear housing cover. This further simplifies the design.
In an advantageous development, it is provided that the housing at least partially enclosing the replaceable electronic components comprises at least one receptacle, in particular a rail or a profile, in the interior in order to accommodate the at least one replaceable electronic component, and/or that at least one cooler is arranged on the housing. The replacement of the electronic components can thereby be further simplified. Furthermore, the central cooler may allow for high heating of the different electronic components.
Further advantageous developments emerge from the further dependent claims and from the description.
Drawings
The figures show:
fig. 1 is a schematic cross-sectional view of a device having a 180 plug outlet;
fig. 2 is a schematic cross-sectional view of an alternative device having a 90 plug outlet;
fig. 3 is a schematic cross-sectional view of another alternative device having a 90 plug outlet;
FIG. 4 is a perspective cutaway view of a printed circuit board with an electromagnetic seal and shielding structure;
FIG. 5 is a cross-sectional view of an alternative embodiment having two printed circuit boards that are each contacted by their own pin;
FIG. 6 is an enlarged view of the section taken in FIG. 5; and
fig. 7 shows a complete perspective view of a further device in exploded view, with a plurality of replaceable electronic components.
Detailed Description
The invention is illustrated schematically by means of a number of embodiments and will be described in detail hereinafter with reference to the accompanying drawings.
Fig. 1 shows a schematic sectional illustration of a device 10, in particular a control unit of a motor vehicle. The device 10 includes a housing 35. The housing 35 is composed, for example, of two housing halves 36, 37. The electromagnetic seal 13 is arranged between the two housing halves 36, 37. The electromagnetic seal 13 serves on the one hand to mechanically seal a possible gap between the two housing halves 36, 37. On the other hand, the material of the electromagnetic seal portion 13 is selected to achieve electromagnetic shielding.
A housing 35 surrounds the at least one printed circuit board 34. The printed circuit board 34 has at least one non-electromagnetic-protection region 15 and at least one electromagnetic-protection region 17. The non-electromagnetic protection region 15 is separated from the electromagnetic protection region 17 by at least one shielding structure 32. An electromagnetic seal 13 is again provided between the shielding structure 32 and the printed circuit board 34. The electromagnetic seal 13 serves on the one hand to mechanically seal possible gaps between the shielding structure 32 and the printed circuit board 34. On the other hand, the material of the electromagnetic seal portion 13 is selected to generate electromagnetic shielding. By means of the shielding structure 32 and the electromagnetic seal 13 provided for the printed circuit board 34, the printed circuit board 34 is divided into one or more non-electromagnetic protection regions 15 and one or more electromagnetic protection regions 17. In the electromagnetic protection region 17, electronic components 64 that are critical electromagnetically or from the viewpoint of EMV can be arranged.
In the embodiment shown in fig. 1, the plug 30 or the plug contacts 29 are oriented transversely to the surface of the printed circuit board 34, i.e. the plug also has a 180 ° plug outlet. The shielding structure 32 and the electromagnetic seal 13 as well as the underlying contact region 21 and the metallization via(s) 25 have a closed (or cage-like) structure which surrounds at least one or more external plugs 30.
In order to further electromagnetically shield the electromagnetic protection region 17, the printed circuit board 34 has a contact region 21. The contact area 21 forms an electrically conductive connection with the electromagnetic seal 13. Here, it is, for example, a copper or gold surface of the printed circuit board 34, as is customary for electrical contacting of the printed circuit board 34. The contact region 21 has a closed, for example annular or rectangular, structure on the surface of the printed circuit board 34. The closed structure of the contact region 21 separates the electromagnetic protection region 17 from the non-electromagnetic protection region 15. Furthermore, at least one shielding layer 27 is provided for further electromagnetic shielding within the printed circuit board 34. The shielding layer 27 is made of an electrically conductive material, such as copper or the like, and is an integral part of the printed circuit board 34. The shielding layer 27 is formed in a planar manner. The shield layer 27 is electrically connected to contact areas 21 on the surface of the printed circuit board 34 by one or more metallized through holes 25. For shielding purposes, the metallized through-hole or holes 25 are also constructed as closed structure (s)/cage(s), for example in the form of a sheath or the like. As exemplarily shown in fig. 4, the smaller the distance between adjacent metallized vias 25, the more effective the shielding effect.
The trough-shaped (or cage-shaped) structure formed by the contact region 21, the metallization via(s) 25 and the shield layer 27 is shown in more detail in fig. 4. In a perspective view, the different layers of the printed circuit board 34 are shown in section. The printed circuit board 34 comprises a circumferential contact region 21 on the surface, and a circumferential (multiple) metallized through-hole 25 arranged underneath, which is formed in a sheath shape. One or more metallized through holes 25 establish an electrically conductive connection between the contact region 21 and the planar shielding layer 27 of the printed circuit board 34. An electromagnetic seal 13 is arranged between the shielding structure 32 and the contact region 21, the shielding structure 32 being an integral part of the housing 35. The electromagnetic seal 13 is likewise designed as a circumferential and/or closed structure corresponding to the contact region 21. As shown alternatively in fig. 4, a plurality of adjacently arranged metallized through holes 25 may also be provided. A cage-like structure with a corresponding electromagnetic shielding effect can thereby be realized. For example, the metallized through holes 25 can be configured in a cylindrical or similar shape and at a distance from one another.
The embodiment according to fig. 2 differs from the embodiment according to fig. 1 in that the plug 30 has a 90 plug termination. The plug 30 is then arranged substantially on the end of the printed circuit board 34 coaxially with the extension of the printed circuit board. The plug 30 and the plug contacts 29 are in turn arranged in the non-electromagnetic-protection region 15. The housing half 36 has a shielding structure 32 which projects transversely to the surface of the printed circuit board 34 and is in turn electromagnetically connected to the contact region 21 of the printed circuit board 34 on the surface via the electromagnetic seal 13. The lower housing half 37 is also connected to the underside of the printed circuit board 34 via the electromagnetic seal 13. The underside of the printed circuit board 34 also has contact areas 21 for electromagnetic shielding structures. Furthermore, at least one metallized through-hole 25 is provided, which is in electrically conductive contact with the two contact regions 21 (on the upper side and the lower side of the printed circuit board 34) in order to electromagnetically shield them. The smaller the distance between adjacent metallized vias 25, the more effective the shielding effect. The electromagnetic shielding of the non-electromagnetic-protection region 15 from the electromagnetic-protection region 17 is achieved by the shielding structure 32, the electromagnetic seal 13, the contact region 21 on the upper side of the printed circuit board 34, the metallized through hole(s) 25 and the contact region 21 on the lower side of the printed circuit board 34. In the electromagnetic protection region 17, exemplary parts of the printed circuit board 34 are provided, as well as possibly further printed circuit boards not illustrated in detail, on which the electronic components 64, which are critical from the viewpoint of the EMV, are arranged in each case. The two housing halves 36, 37 forming the housing 35 are connected to one another in a sealed and electromagnetically shielded manner by the electromagnetic seal 13 on the side facing away from the plug.
The electromagnetic seal 13 is made of a material which shields electromagnetic radiation and at the same time ensures mechanical sealing between the housing halves 36, 37 or between the shielding structure 32 and the printed circuit board 34. Here, it may be a pre-assigned electromagnetic seal 13 or a seal assigned during assembly of the device. Alternatively, an embedded seal may be used. For the electromagnetic seal 13, for example, a filled silicone resin with some particles, such as metal particles, carbon, and the like, is used. Alternatively, a spring or a spring element, for example made of copper or a similar material, can also be used as the electromagnetic seal 13. The electromagnetic seal 13 can be electrically conductive, in particular in the exemplary embodiment in which it is connected to the contact region 21 of the printed circuit board 34. Alternatively, however, the electromagnetic seal 13 may also be made of a poorly conductive or non-conductive material.
In fig. 1, the shield 27 is penetrated only by the plug contact 29. In SMD (surface mount device) plugs, the plug contacts 29 are replaced by metallized through holes. This allows signals to pass from the non-electromagnetically protected region 15 to the electromagnetically protected region 17 and vice versa. The through-openings are dimensioned to ensure the desired shielding effect, for example as waveguides or the like. The signals fed into the electromagnetic protection region 17 can also be provided with appropriate filters on the printed circuit board 34, if necessary.
In the embodiment shown in fig. 2, the transmission of the signal of the plug contact 29 from the non-electromagnetic-protection region 15 to the electromagnetic-protection region 17 and vice versa takes place via the inner layers of the printed circuit board 34. In this case, signal conductor paths pass between the metallized through holes 25. The through-opening is dimensioned to ensure the desired shielding effect, for example as a waveguide or the like. The smaller the distance between adjacent metallized vias 25, the more effective the shielding effect. The signals fed into the electromagnetic protection region 17 can also be provided with appropriate filters, if necessary.
The embodiment according to fig. 3 differs from the embodiment according to fig. 2 in that the shielding structure is displaced at the underside of the printed circuit board 34 to the edge of the printed circuit board. As in the embodiment shown in fig. 1, additional shielding layer(s) 27 are also required. The penetration of the plug contact 29 is effected as already described in connection with fig. 1.
The embodiment shown in fig. 5 differs from the previously shown embodiments in that two printed circuit boards 34 are arranged in the housing 35, which are each in contact with the plug 30. The two printed circuit boards 34 may each be a single controller or a component of a controller function. For example, two plugs 30 having 90 ° plug terminals are provided. Likewise, an electromagnetic isolation is achieved between the electromagnetic protection region 17 inside the housing 35 and the non-electromagnetic protection region 15 in which the plug 30 is arranged. The complete electromagnetic shielding structure is formed by providing an upper housing half 36 which is formed by the shielding structure 32 as part of the housing 35, the electromagnetic seal 13, the contact area 21, the metalized through hole 25, the shielding layer 27 extending parallel to the surface of the printed circuit board 34 towards the plug 30, the further metalized through hole 25 opening onto the lower side of the upper printed circuit board 34, the contact area 21 arranged on the lower side of the printed circuit board 34, the electromagnetic seal 13 through connection with the contact area 21, the further shielding structure 32 connected with the electromagnetic seal 13 and extending transversely to the printed circuit board 34, the further electromagnetic seal 13 possibly being part of the housing 35 connected with the contact area 21 on the upper side of the further printed circuit board 34, the further metalized through hole 25 on the further printed circuit board 34 being conductively connected with the further shielding layer 27 of the further printed circuit board 34. The other shielding layer 27 of the other printed circuit board 34, which is embodied in a planar fashion, is remote from the plug side. At the end of the further shielding layer 27 facing away from the plug, a further metallized through-hole 25 is provided, which connects the underside of the further shielding layer 27 to a further contact region 21 on the underside of a further printed circuit board 34 in an electrically conductive manner. The shielding structure 32 of the other housing half 37 is connected in a sealed and electromagnetically shielded manner by means of the electromagnetic seal 13 to the other contact region 21 on the underside of the other printed circuit board 34. The lower housing half 37 is connected at the end facing away from the plug to the other housing half 36 via the electromagnetic seal 13. Thereby forming an electromagnetic protection region 17 inside the housing 35.
Fig. 6 shows an exemplary enlarged section of the upper left side of fig. 5. It can thus be seen how the shielding structure 32, which is a component of the housing 36, is connected via the electromagnetic seal 13 to the contact region 21 at the upper side of the printed circuit board 34. The metallized through holes 25 form a contact between the contact area 21 and the shielding layer 27 of the printed circuit board 34. As previously mentioned, a plurality of metallized through holes 25 may be provided, arranged adjacent to each other, as exemplarily shown in fig. 4. The smaller the distance between adjacent metallized vias 25, the more effective the shielding effect. On the other side of the shielding layer 27 facing the plug 30, the metallized through-hole 25 (or a plurality of metallized through-holes 25) establishes an electrical contact with the shielding layer 27 and the contact structure 21 on the lower side of the printed circuit board 34, which in turn forms an electromagnetic shielding connection with the shielding structure 32 of the housing 36 via the electromagnetic seal 13.
The shield 27 is penetrated only by the plug contact 29. In SMD plugs, the plug contacts 29 are replaced by metallized through holes. This allows signals to pass from the non-electromagnetically protected region 15 to the electromagnetically protected region 17 and vice versa. The through-openings are dimensioned to ensure the desired shielding effect, for example as waveguides or the like. The signals fed into the electromagnetic protection region 17 can also be provided with appropriate filters on the printed circuit board 34, if necessary.
In fig. 7, as another embodiment, the apparatus 10 includes a housing 11 at least partially enclosing at least two electronic components 50. The housing 11 is closed on the rear side by a rear housing cover 22 or housing half 36, in particular by mechanical fastening 24, for example screws. For example, the rear side case cover 22 may be die cast, and particularly preferably aluminum die cast. The rear housing cover 22 supports the printed circuit board 34, which is oriented perpendicular to the replaceable electronic component 50. Depending on the use, a plurality of plugs 30 project through the rear housing cover 22. A seal is preferably provided between the rear side housing cover 22 and the housing 11.
At least one cooler 40 is arranged on at least one side of the housing 11. The cooling medium can be supplied or removed via the interface. For example, water or a fluid such as air may be used as the cooling medium. The cooler 40 is thermally conductively connected to the housing 11 and serves to dissipate heat generated in the electronic component 50. The housing 11 is provided with a plurality of fastening portions 12. In the embodiment, the fastening portion 12 is configured as a guide rail and is used to accommodate a bracket disposed in a vehicle. The fastening portion 12 preferably extends between the rear housing cover 22 and the front side 20 of the device 10 at a corner of the device 10. The fastening portion 12 is a one-piece member of the housing 11. The front side 20 makes accessible replaceable electronic components 50 arranged inside the device 10. The front side 20 can be opened and closed by a mechanical fastening 24.
A plurality of receiving portions are provided inside the side surfaces 14 of the housing 11, respectively. These receptacles are essentially rail-shaped receptacles for receiving, inserting and/or holding replaceable electronic components 50. Preferably, the housing is an integral component of the housing 11. Furthermore, a recess 28 is provided on at least one, preferably both, end faces of the housing 11 for receiving the seal 26. The recess 28 is intended to receive a radial sealing profile on the housing 11. In this way, a certain level of IP (ingress protection) protection and EMV protection can be achieved. The recess 28 can be adapted by advantageously milling the housing 11 so that the seal 26 can be accommodated. Preferably, the housing 11 is configured as an extruded profile. It is particularly preferred that the housing 11 is made of a continuously extruded aluminium profile.
The rear-side housing cover 22 has a corresponding shielding structure 32 on the side facing the interior of the housing 11. These shielding structures 32 project slightly inwardly in the direction of the printed circuit board 34. The shielding structure 32 comprises an electromagnetic seal 13 at its end facing the printed circuit board 34. In the assembled state, the electromagnetic seal 13 is in contact with the contact region 21 on the outer side of the printed circuit board 34, as described in connection with fig. 1. In the connection with the metallized through-hole 25 and the shielding layer 27, an electromagnetic separation of the non-electromagnetic protection region 15, shown by the dashed lines, is achieved, which surrounds the (external) plug 30. Two non-electromagnetic protection regions 15 are provided for two external sockets, which extend from the shielding layer 27 inside the printed circuit board 34 outwards around the plug 30. On the contrary, however, the plug connection 31 located on the inside is arranged outside the non-electromagnetic-protection region 15, i.e. in the electromagnetic-protection region 17 of the printed circuit board 34. The rear case cover 22 has accommodating portions 23 at the corners, respectively, and is used to fasten the printed circuit board 34. The shield 27 is penetrated only by the plug contacts 29 (not explicitly shown in this figure) of the plug 30. In SMD plugs, the plug contacts 29 are replaced by metallized through holes. This allows signals to pass from the non-electromagnetically protected region 15 to the electromagnetically protected region 17 and vice versa. The through-opening, for example as a waveguide or the like, is dimensioned here to ensure the desired shielding effect. The signals fed into the electromagnetic protection region 17 can also be provided with appropriate filters on the printed circuit board 34, if necessary.
The printed circuit board 34 is arranged parallel to the rear housing cover 22 and transversely to the replaceable electronic component 50. On the side facing away from the interior 16 of the housing 11, the plug 30 is contacted on a printed circuit board 34, which extends through the rear housing cover 22 in order to make contact in the vehicle. On the other side of the printed circuit board 34, corresponding plug connections 31 are arranged, via which the replaceable electronic component 50 can be brought into contact with the plug 30 in the plugged-in state. The plug connection 31 may be, for example, a so-called Edge-Card-header (Edge-Card-header) or the like.
Several replaceable electronic components 50 have been inserted into the interior of the housing 11. The configuration of the replaceable electronic component 50 is shown in the preceding region by way of example. The replaceable electronic component 50 includes a housing 52. The housing 52 is illustratively formed from two housing halves 54. The housing halves 54 enclose at least one electronics unit 62, 66 or a printed circuit board with electronic components 64, 66 arranged thereon. The housing 52 may be comprised of two screwed sheet metal halves 54.
In the present exemplary embodiment, an electronics unit 62 is provided, which extends over almost the entire width of the housing 11 and has several electronic components 64. The electronic unit 62 may be, for example, a printed circuit board or a so-called backplane or motherboard. Further electronic units 66 are provided below the electronic unit 62, which are provided with further electronic components 64, in particular with electronic components 64 generating heat losses. The electronic components 64 are preferably arranged on the respective electronic unit 62, 66 in such a way that their upper sides face the adjacent housing halves 54, respectively. The electronic units 62, 66 with the associated electronic components 64 comprise in particular a high-performance computer core, which performs particularly intensive computing functions in a motor vehicle. Here, for example, it CAN be an autonomous or semi-autonomous driving function, infotainment, a communication interface or gateway function between different bus systems (ethernet, CAN, LIN, etc.), certain security applications for granting authorization, for example for the purpose of entering the motor vehicle from the outside, or other operations in the motor vehicle which are associated with a particularly high computing power. The electronic component 64 is particularly preferably a high-performance processor, a multicore processor or a highly integrated circuit (SoC, system on a chip) which is characterized by high power dissipation.
Accordingly, the connecting means 58 for fastening and/or thermally contacting the replaceable electronic component 50 to the housing 11 in the respective receptacle are shown in each case from the side. The connecting means 58 serve in particular to clamp the housing 52 to the housing 11. Good thermal and/or electrical contact of the electronic assembly 50 with respect to the housing 11 is achieved by this clamping. For example, so-called Wedge Locks (Wedge-Locks) are used as the connecting mechanism 58. Such a connecting mechanism 58 preferably effects a removable wedging or clamping of the housing edge of the housing 52 with the receptacle 18.
At least one heat dissipating structure 60 is provided on the underside of the housing 52. A member having particularly good thermal conductivity may be used as the heat dissipation structure 60, such as a so-called vapor chamber (vapor chamber), a heat pipe (heatpipe), or a pulsating heatpipe (pulsating heatpipe). Alternatively, a copper plate, a thermally conductive foil or in particular a thermally conductive layer may be used. The heat dissipation structure 60 functions to conduct heat loss from the electronic component 64, which generates a particularly large amount of heat, to the clamped edges of the electronic assembly 50 or to a heat sink.
The device 10 is particularly used for the critical structural elements of EMV in the automotive field. Replaceable electronic components 50, in particular with high EMV requirements, can be used in particular for implementing computationally intensive functions in the automotive field, such as semi-automatic or automatic driving, communication modules, gateway functions, infotainment, security applications, etc. These functions may be implemented separately in the replaceable electronic module 50. This interchangeability also allows for later modification of current hardware, as electronic components 50 can be easily replaced.

Claims (15)

1. A device for electromagnetically shielding electronic components of a motor vehicle, comprising at least one housing (35) at least partially enclosing at least one printed circuit board (34); the device further comprises at least one shielding structure (32) for shielding at least one electromagnetic protection region (17) of the printed circuit board (34) with respect to a non-electromagnetic protection region (15), wherein in the electromagnetic protection region (17) at least one electronic component (64) to be electromagnetically shielded is arranged on the printed circuit board (34), and wherein in the non-electromagnetic protection region (15) at least one plug (30) and/or plug contact (29) is in contact with the printed circuit board (34), characterized in that at least one electromagnetic seal (13) is arranged between the shielding structure (32) and the printed circuit board (34).
2. The device according to claim 1, characterized in that the electromagnetic seal (13) is configured as a seal, in particular as a pre-assigned or assigned seal or as an embedded seal or as a contact spring(s), and/or that the electromagnetic seal (13) comprises at least an electromagnetic shielding member.
3. The arrangement according to one of the preceding claims, characterized in that the printed circuit board (34) has at least one shielding layer (27), in particular a planar shielding layer, for delimiting the electromagnetically protected region (17) with respect to the non-electromagnetically protected region (15).
4. The device according to one of the preceding claims, characterized in that the printed circuit board (34) has a contact structure or contact area (21) for contacting the electromagnetic seal (13).
5. Device according to any one of the preceding claims, characterized in that the printed circuit board (34) has at least one or more metallized through-holes (25) in order to connect the contact area (21) and the shielding layer (27) electrically conductively.
6. Device according to any one of the preceding claims, characterized in that the shielding structure (32) and/or the electromagnetic seal (13) and/or the contact region (21) and/or the metallized through hole(s) (25) enclose the non-electromagnetic protection region (15) in a closed or cage-like structure, in particular in the form of a ring or sheath.
7. Device according to any one of the preceding claims, characterized in that a plurality of non-electromagnetic protection regions (15) are provided, which are each surrounded by a shielding structure (32) and/or an electromagnetic seal (13).
8. Device according to one of the preceding claims, characterized in that the contact areas (21) are placed on the upper and lower side of the printed circuit board (34) and/or the metallized through hole(s) (25) connect the shielding layer (27) with the associated contact area (21) from both sides of the printed circuit board (34).
9. Device according to one of the preceding claims, characterized in that the plug (30) and/or the plug contact (29) penetrates the shielding layer (27); and/or the plug (30) and/or the plug contact (29) is guided through between the metalized vias (25), in particular between two metalized vias (25); and/or the shielding layer (27) and/or the corresponding through-openings of the metallization vias (25) for the plugs (30) and/or plug contacts (29) have a size that enables shielding, for example in the case of a waveguide configuration.
10. The device according to any one of the preceding claims, characterized in that the printed circuit board (34) is arranged (50) transversely with respect to at least two exchangeably arranged electronic components; and/or at least one plug connection (31) is arranged on the printed circuit board (34), in particular in the electromagnetic protection region (15), said plug connection being able to be brought into contact with the plug (30) and/or at least one electronic component (50).
11. The device according to any one of the preceding claims, wherein a housing (11) is provided for at least partially enclosing the replaceable electronic component (50); and is provided with at least one front side (20) which is detachably connected to the housing (11) and by means of which replaceable electronic components (50) arranged in the interior of the housing (11) are accessible; and a rear side housing cover (22) is provided.
12. The device according to one of the preceding claims, characterized in that the housing cover (22) is at least an integral part of a housing (35) at least partially shielding the printed circuit board (34); and/or the housing cover (22) comprises at least one passage for at least one plug (30) and/or at least the shielding structure (32) and/or comprises at least one receptacle (23) for the printed circuit board (34) parallel to the housing cover (22) for contacting the replaceable electronic component (50).
13. Device according to one of the preceding claims, characterized in that the housing (11) at least partially enclosing the replaceable electronic component (50) comprises at least one accommodation (18), in particular a rail or a profile, internally for accommodating at least one replaceable electronic component (50) and/or at least one cooler (40) is arranged on the housing (11).
14. Device according to one of the preceding claims, characterized in that the plug contacts (29) are oriented transversely to the surface of the printed circuit board (34).
15. Device according to any one of the preceding claims, characterized in that the shielding structure (32) is in particular part of a metallic housing (35).
CN202210632995.8A 2021-06-08 2022-06-06 Device for electromagnetically shielding electronic components of a motor vehicle Pending CN115460896A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021205744.6 2021-06-08
DE102021205744.6A DE102021205744A1 (en) 2021-06-08 2021-06-08 Device for electromagnetic shielding of an electronic component of a motor vehicle

Publications (1)

Publication Number Publication Date
CN115460896A true CN115460896A (en) 2022-12-09

Family

ID=84102144

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210632995.8A Pending CN115460896A (en) 2021-06-08 2022-06-06 Device for electromagnetically shielding electronic components of a motor vehicle

Country Status (2)

Country Link
CN (1) CN115460896A (en)
DE (1) DE102021205744A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023200091A1 (en) * 2023-01-09 2024-07-11 Bucher Hydraulics Ag Modular system and modular electrical control unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414597A (en) 1994-05-04 1995-05-09 Ford Motor Company Shielded circuit module
DE19709243C1 (en) 1997-03-06 1998-06-10 Siemens Ag Control device for motor vehicle
US6269008B1 (en) 1999-11-22 2001-07-31 Lucent Technologies Inc. Multi-walled electromagnetic interference shield
DE102014115296A1 (en) 2014-10-21 2016-04-21 Connaught Electronics Ltd. Camera for a motor vehicle and motor vehicle
DE102019123754A1 (en) 2019-09-05 2021-03-11 Connaught Electronics Ltd. Electronic control unit

Also Published As

Publication number Publication date
DE102021205744A1 (en) 2022-12-08

Similar Documents

Publication Publication Date Title
JP7007239B2 (en) Pluggable module with cooling channels with heat transfer fins
US5381314A (en) Heat dissipating EMI/RFI protective function box
EP1962387B1 (en) Low profile high current power connector
CN110875555B (en) Communication system including a receptacle cage having an airflow passage
US7145773B2 (en) Pluggable electronic module
US6404628B1 (en) Integrated power electronics cooling housing
US8043112B2 (en) Jack connector assembly having circuity components integrated for providing POE-functionality
US5348482A (en) High density integrated backplane assembly
US10575442B2 (en) Heat sink assembly for an electrical connector
US7349227B2 (en) Electronic control device
US6953897B2 (en) Device and method for clamping and grounding a cable
US9565795B2 (en) Receptacle assembly and module assembly
US11374363B2 (en) Pluggable module having EMI prevention fins in airflow channel
CN113574979B (en) Switch box system with sealing insert
CN104518301A (en) Transceiver module adapter device
CN115460896A (en) Device for electromagnetically shielding electronic components of a motor vehicle
CN109841992B (en) Modular plug connector with replaceable module circuit board
WO2016200674A1 (en) Electrical connector having flexible printed circuit board termination
TW202145665A (en) Emi shielding for a receptacle cage
CN109997421B (en) I/O circuit board for immersion cooled electronic devices
US5604668A (en) Apparatus for shielding electronic circuit boards
TW202404193A (en) Receptacle connector assembly for a communication system
CN114788428A (en) Electronic controller capable of being expanded in modularization mode
US20230156901A1 (en) Vehicle, a main frame, a module pocket, an electronic module, and a printed circuit board
JP4327404B2 (en) Electronic equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination