CN115458470A - High-speed thimble structure - Google Patents
High-speed thimble structure Download PDFInfo
- Publication number
- CN115458470A CN115458470A CN202210861811.5A CN202210861811A CN115458470A CN 115458470 A CN115458470 A CN 115458470A CN 202210861811 A CN202210861811 A CN 202210861811A CN 115458470 A CN115458470 A CN 115458470A
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- China
- Prior art keywords
- locked
- voice coil
- coil motor
- attached
- seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009950 felting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Bearings For Parts Moving Linearly (AREA)
Abstract
The invention discloses a high-speed thimble structure which comprises an XY precision sliding table, a voice coil motor fixing bottom plate, an L-shaped fixing frame, a voice coil motor, a tension spring seat and a reading head, wherein the XY precision sliding table is fixed on the voice coil motor fixing bottom plate; the XY precise sliding table and a voice coil motor fixing bottom plate are locked and attached to form a base, the voice coil motor, a tension spring seat and an L-shaped fixing frame are locked and attached to a voice coil motor fixing plate to form a fixing part, an upper locking plate of the voice coil motor is locked and attached to the upper side of the voice coil motor, and a linear guide rail is locked and attached to the back of the upper locking plate of the voice coil motor; the right side of the upper locking plate of the voice coil motor is locked with the reading head, the left side is locked with the tension spring, and the upper locking plate and the fixed part form a kinematic pair which is assigned to move up and down in the Z direction; the lower part of the sliding seat is locked with a voice coil motor, the back part of the sliding seat is locked with a linear guide rail, the right side of the sliding seat is locked with a reading head, and the left side of the sliding seat is locked with a tension spring and forms a kinematic pair which is assigned to move up and down in the Z direction with the lower fixing part. The invention has the function of rapid and high-precision up-and-down reciprocating motion.
Description
Technical Field
The invention relates to a thimble structure, in particular to a high-speed thimble structure.
Background
In the prior art, in the manufacturing process, a cylinder is adopted to perform telescopic reciprocating motion in a conventional method, a cam structure and a motor are adopted in an electrical initial stage to perform vertical reciprocating motion, a high-order linear motor driving unit with quick response can be adopted to perform high-speed and high-precision vertical reciprocating motion in a modern stage by adopting a voice coil motor as a driving unit; in the semiconductor industry, the number of chips is large and small, and the traditional mechanical and electrical combination scheme has low efficiency and uncontrollable precision
Disclosure of Invention
The invention aims to provide a high-speed thimble structure, which aims to solve the problems of low efficiency and low precision in the mass transfer process and has the function of rapid and high-precision up-and-down reciprocating motion.
The high-speed thimble structure is realized by the following technical scheme: the device comprises an XY precision sliding table, a voice coil motor fixing bottom plate, an L-shaped fixing frame, a voice coil motor, a tension spring seat and a reading head;
the XY precise sliding table and a voice coil motor fixing bottom plate are locked and attached to form a base, the voice coil motor, a tension spring seat and an L-shaped fixing frame are locked and attached to a voice coil motor fixing plate to form a fixing part, an upper locking plate of the voice coil motor is locked and attached to the upper side of the voice coil motor, and a linear guide rail is locked and attached to the back of the upper locking plate of the voice coil motor; the right side of the upper locking plate of the voice coil motor is locked with the reading head, the left side is locked with the tension spring, and the upper locking plate and the fixed part form a kinematic pair which is assigned to move up and down in the Z direction; the lower part of the sliding seat is locked with a voice coil motor, the back part of the sliding seat is locked with a linear guide rail, the right side of the sliding seat is locked with a reading head, the left side of the sliding seat is locked with a tension spring, and the sliding seat and the lower fixing part form a kinematic pair which is assigned to move up and down in the Z direction.
As the preferred technical scheme, a guide seat is locked on the L-shaped fixing frame, and the lower end of the guide seat is embedded into a shaft sleeve fixing ring to form a pricking pin part guide and vacuum adsorption part; the roller bearing is embedded into the shaft sleeve fixing ring and the lower sealing plate and is locked at the lower part of the shaft sleeve fixing ring through the sealing ring.
As the preferred technical scheme, an upper sealing ring is embedded in the guide seat and locked and attached to the L-shaped fixed frame together with the top cap to form an upper sealing cavity.
As the preferred technical scheme, a guide shaft is inserted into the sliding seat and is tightly held and locked by screws; a conical cap is embedded in the guide shaft, a puncture needle is inserted into the conical cap, and the conical cap and a pressing cap screw thread are screwed tightly to play a role in holding the puncture needle tightly; the guide shaft and the roller bearing form an up-and-down movement guide function to drive the pricking pin to move up and down; the upper sealing ring, the lower sealing ring and the top cap form a vacuum cavity.
The invention has the beneficial effects that: the invention realizes the function of rapid and high-precision up-and-down reciprocating motion in the process of mass transfer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic cross-sectional structure of the present invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
As shown in fig. 1-2, the high-speed thimble structure of the present invention includes an XY precision sliding table 1, a voice coil motor fixing bottom plate 2, an L-shaped fixing frame 3, a voice coil motor 36, a tension spring seat 12 and a reading head 27;
the XY precision sliding table 1 and the voice coil motor fixing bottom plate 2 are locked and attached to form a base, the voice coil motor 36, the tension spring seat 12 and the L-shaped fixing frame 3 are locked and attached to the voice coil motor fixing plate 3 to form a fixing part, the upper part of the voice coil motor 36 is locked and attached with a voice coil motor upper locking plate 6, and the back of the voice coil motor upper locking plate 6 is locked and attached with a linear guide rail 20; a reading head 27 is locked on the right side of the upper locking plate 6 of the voice coil motor, a tension spring 25 is locked on the left side, and a kinematic pair which is assigned to move up and down in the Z direction is formed by the upper locking plate and the fixed part; a voice coil motor 36 is locked on the lower part of the sliding seat 6, a linear guide rail 20 is locked on the back part of the sliding seat 6, a reading head 27 is locked on the right side of the sliding seat 6, a tension spring 25 is locked on the left side of the sliding seat 6, and a kinematic pair which appoints the Z-direction up-and-down movement is formed by the lower fixing part; the voice coil motor is responsible for up-and-down movement, the guide effect of the linear guide rail, the tension spring effectively and quickly returns the whole kinematic pair to the reference, and the reading head is combined with the grating ruler to monitor the up-and-down movement distance of the whole kinematic pair.
In this embodiment, the L-shaped fixing frame 3 is locked with a guide seat 9, and the lower end of the guide seat 9 is embedded into the shaft sleeve fixing ring 4 to form a pricking pin part guide and vacuum adsorption part; the roller bearing 18 is embedded in the sleeve fixing ring 4 and the lower closing plate 11 and is locked at the lower part of the sleeve fixing ring 4 by a sealing ring 24.
In this embodiment, the upper seal ring 23 is embedded in the guide seat 9, and is locked to the L-shaped fixing frame 3 together with the top cap 10 to form an upper seal cavity.
In the embodiment, the guide shaft 5 is inserted into the sliding seat 6 and tightly locked by screws; a conical cap 7 is embedded in the guide shaft 5, a puncture needle 22 is inserted into the conical cap 7, and the conical cap and the pressing cap 8 are screwed tightly to play a role in holding the puncture needle 22 tightly; the guide shaft 5 and the roller bearing 18 form the guide function of up-and-down movement to drive the puncture needle 22 to move up and down; the upper sealing ring 23, the lower sealing ring 24 and the top cap 10 form a vacuum cavity.
In this embodiment, the guide cone cap 7 is designed to have a cross-shaped opening, and the head is tapered and has external teeth.
In this embodiment, the taper of the pressing cap 8 is the same as the angle of the head of the conical cap, and there are internal teeth.
In this embodiment, the top cap 10 has 10 holes on its upper surface for adsorbing objects.
The working principle is as follows: the voice coil motor drives the voice coil motor to lock the attachment plate, the guide shaft and the felting needle to form an integral up-down moving pair, and the up-down moving position degree is accurately judged by combining the reading head.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (4)
1. A high-speed thimble structure which characterized in that: the device comprises an XY precision sliding table (1), a voice coil motor fixing bottom plate (2), an L-shaped fixing frame (3), a voice coil motor (36), a tension spring seat (12) and a reading head (27);
the XY precision sliding table (1) and a voice coil motor fixing bottom plate (2) are locked and attached to form a base, a voice coil motor (36), a tension spring seat (12) and an L-shaped fixing frame (3) are locked and attached to a voice coil motor fixing plate (3) to form a fixing part, an upper voice coil motor locking attachment plate (6) is locked and attached above the voice coil motor (36), and a linear guide rail (20) is locked and attached to the back of the upper voice coil motor locking attachment plate (6); a reading head (27) is locked on the right side of a locking plate (6) on the voice coil motor, a tension spring (25) is locked on the left side, and a kinematic pair which is assigned to move up and down in the Z direction is formed by the left locking plate and the fixed part; a voice coil motor (36) is locked and attached to the lower portion of the sliding seat (6), a linear guide rail (20) is locked and attached to the back of the sliding seat (6), a reading head (27) is locked and attached to the right side of the sliding seat (6), a tension spring (25) is locked and attached to the left side of the sliding seat (6), and a kinematic pair which is assigned to the upward and downward movement of the Z direction is formed by the sliding seat and the lower fixing portion.
2. The high-speed thimble structure according to claim 1, characterized in that: a guide seat (9) is locked on the L-shaped fixing frame (3), and the lower end of the guide seat (9) is embedded into a shaft sleeve fixing ring (4) to form a pricking needle part guide and vacuum adsorption part; the roller bearing (18) is embedded into the shaft sleeve fixing ring (4) and the lower sealing plate (11) and is locked at the lower part of the shaft sleeve fixing ring (4) through a sealing ring (24).
3. The high-speed ejector pin structure of claim 2, wherein: an upper sealing ring (23) is embedded into the guide seat (9) and is locked on the L-shaped fixing frame (3) together with the top cap (10) to form an upper sealing cavity.
4. The high-speed thimble structure according to claim 1, characterized in that: the guide shaft (5) is inserted into the sliding seat (6) and is tightly held and locked by screws; a conical cap (7) is embedded in the guide shaft (5), a puncture needle (22) is inserted into the conical cap (7), and the conical cap is screwed with the thread of the pressing cap (8) to play a role in holding the puncture needle (22); the guide shaft (5) and the roller bearing (18) form an up-and-down movement guide function to drive the puncture needle (22) to move up and down; the upper sealing ring (23), the lower sealing ring (24) and the top cap (10) form a vacuum cavity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210861811.5A CN115458470A (en) | 2022-07-22 | 2022-07-22 | High-speed thimble structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210861811.5A CN115458470A (en) | 2022-07-22 | 2022-07-22 | High-speed thimble structure |
Publications (1)
Publication Number | Publication Date |
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CN115458470A true CN115458470A (en) | 2022-12-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202210861811.5A Pending CN115458470A (en) | 2022-07-22 | 2022-07-22 | High-speed thimble structure |
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CN (1) | CN115458470A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367208A (en) * | 2013-07-02 | 2013-10-23 | 华中科技大学 | Back bonding platform for superchip |
CN103633006A (en) * | 2013-12-11 | 2014-03-12 | 中国电子科技集团公司第二研究所 | Wafer chip jacking mechanism |
CN109244018A (en) * | 2018-10-27 | 2019-01-18 | 中山市良泽精密模具有限公司 | Portable lossless blue membrane DNA chip mechanism for stripping |
CN210092057U (en) * | 2019-09-02 | 2020-02-18 | 深圳新益昌科技股份有限公司 | Voice coil thimble mechanism of LED die bonder |
-
2022
- 2022-07-22 CN CN202210861811.5A patent/CN115458470A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367208A (en) * | 2013-07-02 | 2013-10-23 | 华中科技大学 | Back bonding platform for superchip |
CN103633006A (en) * | 2013-12-11 | 2014-03-12 | 中国电子科技集团公司第二研究所 | Wafer chip jacking mechanism |
CN109244018A (en) * | 2018-10-27 | 2019-01-18 | 中山市良泽精密模具有限公司 | Portable lossless blue membrane DNA chip mechanism for stripping |
CN210092057U (en) * | 2019-09-02 | 2020-02-18 | 深圳新益昌科技股份有限公司 | Voice coil thimble mechanism of LED die bonder |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20221209 |
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RJ01 | Rejection of invention patent application after publication |