CN115453825A

CN115453825A - UVLED high-power resistance welding process parallel light source system

Info

Publication number: CN115453825A
Application number: CN202210968740.9A
Authority: CN
Inventors: 陈昊
Original assignee: WUXI XUDIAN TECHNOLOGY CO LTD
Current assignee: WUXI XUDIAN TECHNOLOGY CO LTD
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2022-12-09

Abstract

The invention belongs to the technical field of solder mask process of an integrated circuit PCB (printed circuit board), and particularly provides a UVLED (ultraviolet light emitting diode) high-power solder mask process parallel light source system which comprises a PCB to-be-exposed placement working platform, a first UVLED light source, an optical reflection lens, an optical spherical lens and a second UVLED light source, wherein the first UVLED light source and the second UVLED light source are used for emitting light rays, the light rays emitted by the first UVLED light source are reflected out through the optical reflection lens, the light rays emitted by the second UVLED light source are projected out through the optical reflection lens, the reflected light rays and the projected light rays are diffused onto the optical spherical lens through the optical lens, and the diffused light rays are reflected onto the working platform through the optical spherical lens for exposure. The UVLED high-power resistance welding process parallel light source system provided by the invention has the advantages that the LED light source performance is stable, the manufacturing cost of a customer is reduced, and the production efficiency of the customer is improved.

Description

UVLED high-power resistance welding process parallel light source system

Technical Field

The invention relates to the technical field of solder mask process of an integrated circuit PCB (printed circuit board), in particular to a UVLED (ultraviolet light emitting diode) high-power solder mask process parallel light source system.

Background

Pre-baking the printing ink printed on the PCB substrate, irradiating by a UVLED high-power circuit solder-resisting parallel light source system, forming a high-molecular polymer through photopolymerization, and removing unpolymerized printing ink through development to leave a useful printing ink pattern.

The existing light source system adopts high-pressure mercury and halogen lamps driven by high pressure, namely a 7KW scattering exposure machine and a 10KW parallel light exposure machine, or a large-angle LED surface light source for exposure, and has the following defects:

(1) The high-pressure mercury and halogen lamps have high power consumption, the power is mostly several kilowatts to dozens of kilowatts, preheating is needed after starting up, and the service life of the lamp tube is about 800-1000 hours.

(2) Mercury lamps and halogen lamps have a wide wavelength range, a large heat release, and a low curing efficiency, and both require cooling equipment. Mercury lamps and halogen lamps have heavy metal pollution and burden the surrounding environment.

(3) The angle of the original scattering exposure machine and the LED surface light source is large, and a high-precision line cannot be made.

(4) The light intensity of the original 10KW parallel light exposure machine light source is low, the exposure time is long, and the operation efficiency is low.

Disclosure of Invention

The invention aims to provide a UVLED high-power solder resist process parallel light source system which is a UVLED light source with high light-emitting rate, high purity, long service life and high resolution, the UVLED light source has stable performance, the manufacturing cost of customers is reduced, the yield and the high precision of customer products are improved, and the production efficiency of the customers is improved.

The invention provides a UVLED high-power solder mask process parallel light source system, which comprises a PCB to-be-exposed working platform, a first UVLED light source, an optical reflection lens, an optical spherical lens and a second UVLED light source, wherein the first UVLED light source and the second UVLED light source are used for emitting light, the light emitted by the first UVLED light source is reflected out through the optical reflection lens, the light emitted by the second UVLED light source is projected out through the optical reflection lens, the reflected light and the projected light are diffused to the optical spherical lens through the optical lens, and the diffused light is reflected to the PCB to-be-exposed working platform through the optical spherical lens for exposure.

Further, the first UVLED light source and the second UVLED light source are all composed of 4 by 4 groups of LED lamp particles.

Further, the light emitted by the first UVLED light source and the light emitted by the second UVLED light source are scattered light of +/-60 degrees, and the scattered light of +/-60 degrees is integrated through the optical reflection lens, the optical lens and the optical spherical lens to finally irradiate a parallel light source of +/-1.5 degrees when the PCB is placed on a working platform to be exposed.

Further, the first UVLED light source and the second UVLED light source are both ultraviolet light emitting diodes.

The UVLED high-power solder resist process parallel light source system provided by the invention has the following advantages:

(1) The UVLED light source has long energy-saving service life, and the current foreign packaged LED can reach 80000 hours, and the current foreign packaged LED is a little shorter at home and can reach 30000-50000 hours;

(2) The UVLED light source has narrow wavelength and high concentration, and the emitted light wavelength basically belongs to the absorption length range of the photoinitiator in the printing ink;

(3) The irradiation of the UVLED light source is uniform;

(4) The UVLED light source can easily realize the adjustment of the radiation intensity, and the corresponding power is adjusted according to different materials;

(5) The UVLED light source has small heat productivity and is equivalent to a cold light source; moreover, the UVLED light source is more environment-friendly, and no heavy metal pollution exists;

(6) The angle and the parallel half angle of the UVLED light source system relative to the LED surface light source are smaller (plus or minus 1.5 degrees), and the resolution is higher;

(7) UVLED high-power hinders and welds processing procedure parallel light source system, the light intensity is higher, up to 158mW/cm, and the light intensity of traditional 10KW plain light exposure machine only has 126mW/cm, and the exposure efficiency is higher.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.

FIG. 1 is a schematic structural diagram of a UVLED high-power solder resist process parallel light source system provided by the invention.

In the figure: 1-placing a working platform on a PCB to be exposed; 2-a first UVLED light source; 3-an optical mirror plate; 4-an optical lens; 5-optical spherical lens; 6-second UVLED light source.

Detailed Description

To further illustrate the technical means and effects of the present invention for achieving the predetermined objects, the following detailed description of the embodiments, structures, features and effects of the UVLED high power solder mask process parallel light source system according to the present invention will be made with reference to the accompanying drawings and preferred embodiments. It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged as appropriate in order to facilitate the embodiments of the invention described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In the explanation of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be interpreted broadly unless otherwise specified. For example, the connection may be a fixed connection, a connection through a special interface, or an indirect connection via an intermediate medium. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

In this embodiment, a UVLED high-power solder mask process parallel light source system is provided, as shown in fig. 1, the UVLED high-power solder mask process parallel light source system includes a PCB to-be-exposed placement platform 1, a first UVLED light source 2, an optical reflection lens 3, an optical lens 4, an optical spherical lens 5, and a second UVLED light source 6, where the first UVLED light source 2 and the second UVLED light source 6 are both configured to emit light, the light emitted by the first UVLED light source 2 is reflected by the optical reflection lens 3, the light emitted by the second UVLED light source 6 is projected by the optical reflection lens 3, and both the reflected light and the projected light are diffused to the optical spherical lens 5 through the optical lens 4, and then the diffused light is reflected to the PCB to-be-exposed placement platform 1 by the optical spherical lens 5 for exposure.

Preferably, the first uv LED light source 2 and the second uv LED light source 6 are each composed of 4 by 4 groups of LED lamp particles.

Preferably, the light emitted by the first uv led light source 2 and the second uv led light source 6 are both scattered light of ± 60 °, and the scattered light of ± 60 ° is integrated by the optical reflection lens 3, the optical lens 4 and the optical spherical lens 5, and finally irradiates a collimated light source of ± 1.5 ° when the PCB is placed on the working platform 1 to be exposed. The light emitting path is in the direction of the arrow in fig. 1.

Preferably, the first uv led light source 2 and the second uv led light source 6 are both ultraviolet light emitting diodes.

Specifically, the optical reflection lens 3 is a compound eye, is made of fused quartz, has a coated surface, and is composed of a plurality of lens arrays, and the optical reflection lens 3 is well known to those skilled in the art and will not be described herein again.

Specifically, the optical lens 4 is a cold mirror made of heat-resistant glass, the surface of the optical lens is coated with a film, and the optical lens reflects UVLED light with a wavelength of 330-450nm, and the optical lens 4 is well known to those skilled in the art and will not be described herein again.

Specifically, the optical spherical lens 5 is a curved mirror made of optical material, the concave surface is plated with an ultraviolet reflective aluminum film 330-450nm, and the optical spherical lens 5 is well known to those skilled in the art and will not be described herein.

The working principle of the UVLED high-power solder mask process parallel light source system provided by the present invention refers to the foregoing description, and is not described herein again.

It should be understood that the curing solder resist ink on the PCB substrate is irradiated by UV ultraviolet light to form a high molecular polymer through photopolymerization, then sodium carbonate solution in the unpolymerized ink is removed through development, and the ink is completely hardened after baking, so that the whole exposure process manufacturing of the solder resist of the integrated circuit PCB is completed.

Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The UVLED high-power solder mask process parallel light source system is characterized by comprising a PCB to-be-exposed placement working platform (1), a first UVLED light source (2), an optical reflection lens (3), an optical lens (4), an optical spherical lens (5) and a second UVLED light source (6), wherein the first UVLED light source (2) and the second UVLED light source (6) are used for emitting light rays, the light rays emitted by the first UVLED light source (2) are reflected out through the optical reflection lens (3), the light rays emitted by the second UVLED light source (6) are projected out through the optical reflection lens (3), the reflected light rays and the projected light rays are diffused to the optical spherical lens (5) through the optical lens (4), and the diffused light rays are reflected to the PCB to-be-exposed placement working platform (1) through the optical spherical lens (5) to be exposed.

2. A UVLED high power solder mask process collimated light source system according to claim 1, wherein said first UVLED light source (2) and said second UVLED light source (6) are each composed of 4-4 groups of LED light particles.

3. The UVLED high power solder mask process parallel light source system according to claim 1, wherein the light emitted by the first UVLED light source (2) and the light emitted by the second UVLED light source (6) are scattered light of +/-60 degrees, and the scattered light of +/-60 degrees is integrated through the optical reflection lens (3), the optical lens (4) and the optical spherical lens (5) and finally irradiates a parallel light source of +/-1.5 degrees when the PCB is placed on the working platform (1) to be exposed.

4. A UVLED high power solder mask process parallel light source system according to claim 1, wherein said first UVLED light source (2) and said second UVLED light source (6) are both UV LEDs.