CN115447217A - Lattice bonding method for realizing non-planar member formed by graphite film and skin material - Google Patents

Lattice bonding method for realizing non-planar member formed by graphite film and skin material Download PDF

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CN115447217A
CN115447217A CN202211065748.0A CN202211065748A CN115447217A CN 115447217 A CN115447217 A CN 115447217A CN 202211065748 A CN202211065748 A CN 202211065748A CN 115447217 A CN115447217 A CN 115447217A
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skin
graphite
layer
graphite layer
realizing
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吴东奇
殷永霞
穆磊磊
孟洪涛
荆树崧
田丰
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Beijing Institute of Space Research Mechanical and Electricity
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Beijing Institute of Space Research Mechanical and Electricity
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/0016—Abrading
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/002—Sandblasting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Quality & Reliability (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a lattice gluing method for realizing a non-planar member formed by a graphite film and a skin material, which comprises the following steps: preparing a graphite layer by using a graphite material; processing the graphite layer to obtain a plurality of through holes; coating structural adhesive on two side faces of the graphite layer and in each through hole; placing the edge sealing layer at the outer side of the graphite layer; respectively laying upper and lower skins on the upper and lower side surfaces of the graphite layer, and gluing the upper and lower skins with the graphite layer; forming glue columns in the through holes in the process of curing the structural glue, so that the graphite layer is anchored with the upper and lower layers of skins; and curing the structural adhesive to obtain the light high-heat-conductivity non-planar member. The invention solves the problem of forming a non-planar component by gluing and combining the high-heat-conductivity graphite film and common materials such as a carbon fiber plate and a Kevlar fiber plate through a mode of fixing the lattice-arranged glue columns, realizes that the high-heat-conductivity graphite film sandwich structure is applied to a stressed structural component product, and effectively improves the heat-conducting property of the traditional thin-wall structural component product.

Description

Lattice bonding method for realizing non-planar member formed by graphite film and skin material
Technical Field
The invention belongs to the technical field of composite material structure forming processes, and particularly relates to a dot matrix bonding method for forming a non-planar member by a graphite film and a skin material.
Background
With the increase of the heat load of the spacecraft, the requirement on the heat conducting performance of the material is correspondingly increased, and a light high-heat-conducting material is urgently needed for a non-planar radiating surface product of the spacecraft. High thermal conductivity graphite films have been used in the field of electronic devices as a carbon material that provides a continuous, efficient thermal conductivity path. But the application field of the material is expanded and limited due to poor binding force between the surface of the material and other materials and low strength of the material, and the material cannot be applied to special-shaped structural components. The resin-based fiber material has good mechanical property, low density and poor heat-conducting property.
Disclosure of Invention
The technical solution of the present invention is: overcomes the defects of the prior art, provides a dot matrix bonding method for realizing the molding of a non-planar component by a graphite film and a skin material, and aims to solve the problem of the molding of the non-planar component by bonding and combining a high-heat-conductivity graphite film and common materials such as a carbon fiber plate and a Kevlar fiber plate
In order to solve the technical problem, the invention discloses a dot matrix gluing method for realizing a non-planar member formed by a graphite film and a skin material, which comprises the following steps:
preparing a graphite layer by using a graphite material;
processing the graphite layer to obtain a plurality of through holes;
coating structural adhesive on two side surfaces of the graphite layer and in each through hole;
placing the edge sealing layer at the outer side of the graphite layer;
respectively laying an upper skin and a lower skin on the upper side and the lower side of the graphite layer, and gluing the upper skin and the lower skin with the graphite layer; forming glue columns in the through holes in the curing process of the structural glue, so that the graphite layer is anchored with the upper skin and the lower skin, and the graphite layer is prevented from being debonded from the upper skin and the lower skin due to relative displacement of the graphite layer and the upper skin and the lower skin;
and (3) after the structural adhesive is cured, completing the adhesive joint of the graphite layer and the upper-layer skin and the lower-layer skin, and obtaining the light-weight high-heat-conductivity non-planar member.
In the dot matrix gluing method for realizing the molding of the non-planar component by the graphite film and the skin material, the diameter of the through hole is 4mm.
In the dot matrix gluing method for realizing the molding of the non-planar component by the graphite film and the skin material, the distance between the through holes is 15mm.
In the dot matrix bonding method for realizing the molding of the non-planar member by the graphite film and the skin material, the through holes are densely distributed on the graphite layer in a regular triangle shape.
In the dot matrix bonding method for realizing the molding of the non-planar member by the graphite film and the skin material, the thickness of the edge sealing layer is consistent with that of the graphite layer.
In the dot matrix bonding method for realizing the molding of the non-planar component by the graphite film and the skin material, the shapes and the sizes of the upper skin and the lower skin are the same.
In the dot matrix bonding method for realizing the molding of the non-planar component by the graphite film and the skin material, the edge sealing layer is of a rectangular frame structure which is the same as the skin material, and the outer frame of the rectangular frame has the same overall dimension as the upper skin and the lower skin; the inner frame of the rectangular frame is consistent with the graphite layer in overall dimension.
In the dot matrix gluing method for realizing the molding of the non-planar component by the graphite film and the skin material, the width of the rectangular frame is 5mm.
In the above dot matrix bonding method for realizing the molding of the non-planar member by the graphite film and the skin material, the method further comprises: and carrying out surface treatment on the surfaces to be bonded of the graphite layer, the edge sealing layer, the upper skin and the lower skin.
In the above dot matrix bonding method for realizing the molding of the non-planar member by the graphite film and the skin material, the method further comprises: and respectively laying the upper skin and the lower skin on the upper side and the lower side of the graphite layer, packaging by using a vacuum bag, vacuumizing and exhausting gas in the sandwich structure, wherein the vacuum degree is more than or equal to 0.006MPa.
The invention has the following advantages:
(1) The invention discloses a dot matrix gluing method for realizing the molding of a non-planar component by a graphite film and a skin material, which solves the problem of the molding of the non-planar component by gluing and combining a high-heat-conductivity graphite film and common materials such as a carbon fiber plate and a Kevlar fiber plate in a mode of fixing glue columns arranged in a dot matrix, realizes the application of a high-heat-conductivity graphite film sandwich structure to a stressed structural member product, and effectively improves the heat conductivity of the traditional thin-wall structural member product.
(2) The invention discloses a dot matrix gluing method for realizing a non-planar member formed by a graphite film and a skin material, which realizes the application of a high-heat-conductivity graphite film on a stressed structural member for the first time and improves the heat-conducting property of a thin-wall structural member in the surface by 80-100 times.
(3) The invention discloses a lattice bonding method for realizing a non-planar member formed by a graphite film and a skin material, which improves the structural peel strength of a product prepared by the lattice bonding method for realizing the non-planar member formed by the graphite film and the skin material by more than 40 percent compared with a product prepared by a traditional forming method.
Drawings
FIG. 1 is a schematic diagram illustrating an implementation of a method for performing dot matrix bonding between a graphite film and a skin material to form a non-planar member according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a graphite layer in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In this embodiment, as shown in fig. 1, the method for implementing dot matrix bonding of a graphite film and a skin material molding non-planar member includes: preparing a graphite layer 2 by using a graphite material; processing the graphite layer 2 to obtain a plurality of through holes 201; structural adhesive is fully coated on two side surfaces of the graphite layer 2 and in each through hole 201; placing the edge sealing layer 3 outside the graphite layer 2; respectively laying an upper skin 4 and a lower skin 1 on the upper side and the lower side of the graphite layer 2, and gluing the upper skin and the lower skin with the graphite layer 2; forming glue columns in the through holes 201 in the structural glue curing process, so that the graphite layer 2 is anchored with the upper skin 4 and the lower skin 1, and the graphite layer 2 is prevented from being debonded from the upper skin 4 and the lower skin 1 due to relative displacement; and (3) after the structural adhesive is cured, completing the adhesive joint of the graphite layer 2, the upper skin 4 and the lower skin 1, and obtaining the light high-heat-conductivity non-planar member. The graphite layer 2 and the skin are both flexible structural members before being glued, the flexible structural members are laid by using corresponding dies, and the light high-heat-conductivity non-planar member can be obtained after the graphite layer 2 and the upper and lower skins are glued and molded.
In the present embodiment, as shown in fig. 2:
the diameter of the through-hole may be 4mm. The effective area of the graphite layer can be reduced due to the overlarge diameter of the through hole, and the heat-conducting property of the molded product is influenced; the undersize diameter of the through hole is not favorable for the stable molding quality of the product, the bubble defect can remain in the glue solution in the gluing process, and the influence of the bubble defect on the gluing performance of the product can be obviously enhanced due to the diameter of the through hole. Therefore, the diameter of the through hole is preferably 4mm, the requirement of the heat conducting performance of the formed product can be met, and the stable forming quality of the product is guaranteed.
The pitch of the through holes may be 15mm. The number of the through holes is increased due to the fact that the distance between the through holes is too small, the effective area of a graphite layer is reduced, and the heat-conducting performance of a formed product is influenced; and if the distance between the through holes is too large, the risk that the internal stress of the material between the through holes of the product is larger than the adhesive bonding binding force exists, so that the product is debonded and damaged. Therefore, the distance between the through holes is preferably 15mm, the requirement of the heat conducting performance of the formed product can be met, and the risk that the internal stress of the material between the through holes of the product is larger than the binding force of the adhesive joint is avoided.
The through holes are densely distributed on the graphite layer 2 in a regular triangle shape (namely 6 through holes are uniformly distributed around each through hole at equal distances, 1 through hole is arranged in each 60-degree direction, and the total number of the 6 through holes is 360 degrees in the circumferential direction). A large number of test verifications are carried out before the layout form is determined, and the optimal layout form is obtained by comprehensively considering the test results of thermal, mechanical and process implementability of various layout modes.
The edge of the graphite layer 2 is 5mm from the edge of the skin (upper skin/lower skin). The effective area of the graphite layer can be reduced due to the fact that the distance between the edge of the graphite layer 2 and the edge of the skin is too large, and the heat-conducting performance of a formed product is affected; the graphite layer 2 edge then can't guarantee again that edge sealing layer and covering are effectively glued joint apart from the marginal apart from the distance undersize of covering, and the graphite layer internal conduction graphite has the risk of revealing. Therefore, the distance between the edge of the preferable graphite layer 2 and the edge of the skin is 5mm, the requirement of the thermal conductivity of the formed product can be met, and the leakage risk of the conductive graphite in the graphite layer is avoided.
In the present embodiment, the outer dimensions of the upper skin 4 and the lower skin 1 are the same. The thickness of the edge sealing layer 3 is consistent with that of the graphite layer 2. The edge sealing layer 3 is of a rectangular frame structure which is the same as the skin material, and the outer frame of the rectangular frame is consistent with the outer dimensions of the upper skin 4 and the lower skin 1; the inner frame of the rectangular frame is consistent with the graphite layer 2 in overall dimension. The width of the rectangular frame, i.e. the distance of the edge of the graphite layer 2 from the edge of the skin (upper skin/lower skin), is 5mm.
In the embodiment, before the bonding, the surfaces to be bonded of the graphite layer 2, the edge sealing layer 3, the upper skin 4 and the lower skin 1 should be subjected to surface treatment. For example, the surfaces to be bonded of the edge banding layer 3, the upper skin 4 and the lower skin 1, which are made of metal materials, are subjected to surface treatment such as anodization or sand blasting; the graphite layer 2 prepared from the metal material is subjected to surface treatment such as polishing by using 80-100-mesh sand paper.
In the embodiment, after the upper skin 4 and the lower skin 1 are respectively laid on the upper side and the lower side of the graphite layer 2, the whole structural member can be packaged by a vacuum bag, and the air in the sandwich structure is evacuated, wherein the vacuum degree is not less than 0.006MPa.
On the basis of the above embodiments, a specific example is described below.
Based on the dot matrix bonding method for realizing the molding of the non-planar member by the graphite film and the skin material, the general process for molding the high-thermal-conductivity graphite film sandwich structure comprises the following steps:
a) And (3) forming a plurality of through holes with the diameter of 4mm on the graphite film blank in a mode of mechanically punching by using an automatic blanking machine or matching a blanking sample plate with manual punching. The through holes are arranged in a regular triangle, namely 6 through holes are uniformly distributed at equal distances around each through hole, every 60 degrees of the through holes are arranged in the direction, 360 degrees of the through holes are arranged in the circumferential direction, the total number of the through holes is 6, and the distance between any two through holes is 15mm.
b) According to the overall dimension of a product to be processed, amm is multiplied by bmmm, a wallpaper knife is used for cutting a graphite film blank with a hole, the overall dimension (a-10) mm is multiplied by (b-10) mm is guaranteed, and a graphite layer is obtained.
c) And (3) selecting edge sealing blanks which are the same as skin materials and have the same thickness as the graphite layer, and cutting the edge sealing blanks by using a wallpaper cutter to obtain two edge sealing strips of (a-10) mm multiplied by 5mm and two edge sealing strips of bmmm multiplied by 5mm respectively as edge sealing layers.
d) And performing surface treatment on the adhesive joint surface before adhesive bonding. The surface treatment of metallic materials is usually performed by anodizing or sand blasting, and the surface treatment of non-metallic materials is usually performed by 80-100 mesh sandpaper.
e) And (3) adhering adhesive films or coating structural adhesive on the adhesive surfaces of the skins at the two sides, wherein the adhesive amount is required to consider that graphite layers with different thicknesses are filled in the through holes and the weight of adhesive liquid required by the adhesive connection with the skin materials at the two sides is ensured.
f) The lower skin, the graphite layer, the edge sealing layer and the upper skin are sequentially placed, the vacuum bag is used for packaging the whole structure, the vacuum bag is used for vacuumizing and exhausting gas in the sandwich structure, and the vacuum degree is more than or equal to 0.006MPa.
g) And curing the high-thermal-conductivity graphite film sandwich structure according to the curing requirement of the used structural adhesive, removing auxiliary materials such as a vacuum bag and the like after curing is finished, and finishing the excessive adhesive around the sandwich structure to obtain the high-thermal-conductivity graphite film sandwich structure.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Those skilled in the art will appreciate that the invention may be practiced without these specific details.

Claims (10)

1. A dot matrix bonding method for realizing a non-planar member formed by a graphite film and a skin material is characterized by comprising the following steps:
preparing a graphite layer (2) by using a graphite material;
processing the graphite layer (2) to obtain a plurality of through holes (201);
structural adhesive is fully coated on two side surfaces of the graphite layer (2) and in each through hole (201);
the edge sealing layer (3) is arranged on the outer side of the graphite layer (2);
respectively laying an upper skin (4) and a lower skin (1) on the upper side and the lower side of the graphite layer (2) and bonding the upper skin and the lower skin with the graphite layer (2); forming glue columns in the through holes (201) in the structural glue curing process, so that the graphite layer (2) is anchored with the upper-layer skin (4) and the lower-layer skin (1), and the graphite layer (2) is prevented from being debonded from the upper-layer skin (4) and the lower-layer skin (1) due to relative displacement;
and (3) after the structural adhesive is cured, completing the adhesive joint of the graphite layer (2) and the upper skin (4) and the lower skin (1), and obtaining the light high-heat-conductivity non-planar member.
2. The method for realizing the dot matrix gluing of the graphite film and the skin material molding non-planar member according to the claim 1, characterized in that the diameter of the through hole (201) is 4mm.
3. The method for realizing the dot matrix gluing of the graphite film and the skin material molding non-planar member according to the claim 1, characterized in that the distance between the through holes (201) is 15mm.
4. The method for realizing the lattice gluing of the graphite film and the skin material molding non-planar component according to claim 1, characterized in that the through holes (201) are densely distributed on the graphite layer (2) in regular triangles.
5. The method for realizing the lattice gluing of the graphite film and the skin material molding non-planar component according to claim 1, characterized in that the thickness of the edge sealing layer (3) is consistent with that of the graphite layer (2).
6. The method for realizing the dot matrix gluing of the graphite film and the skin material molded non-planar component according to the claim 1 is characterized in that the outer dimensions of the upper skin (4) and the lower skin (1) are the same.
7. The method for realizing the lattice gluing of the graphite film and the skin material molding non-planar component according to claim 1, characterized in that the edge sealing layer (3) is of a rectangular frame structure the same as the skin material, and the outer frame of the rectangular frame is consistent with the outer dimensions of the upper skin (4) and the lower skin (1); the inner frame of the rectangular frame is consistent with the graphite layer (2) in overall dimension.
8. The method for realizing the dot matrix gluing of the graphite film and the skin material molding non-planar component according to claim 7, wherein the width of the rectangular frame is 5mm.
9. The method for realizing the dot matrix gluing of the graphite film and the skin material molding non-planar component according to claim 1, further comprising the following steps: and performing surface treatment on the surfaces to be glued of the graphite layer (2), the edge sealing layer (3), the upper skin (4) and the lower skin (1).
10. The method for realizing the dot matrix gluing of the graphite film and the skin material molding non-planar component according to claim 1, further comprising the following steps: and respectively laying the upper skin (4) and the lower skin (1) on the upper side and the lower side of the graphite layer (2), packaging by using a vacuum bag, vacuumizing and exhausting gas in the sandwich structure, wherein the vacuum degree is more than or equal to 0.006MPa.
CN202211065748.0A 2022-08-31 2022-08-31 Lattice bonding method for realizing non-planar member formed by graphite film and skin material Pending CN115447217A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203185771U (en) * 2013-04-24 2013-09-11 常州碳元科技发展有限公司 Edge covering type high-heat-conductivity graphite diaphragm
CN205439399U (en) * 2015-12-24 2016-08-10 深圳市三科斯电子材料有限公司 High heat conduction radiation heat dissipation graphite membrane
CN111465260A (en) * 2020-03-19 2020-07-28 北京空间机电研究所 Large-area radiation heat dissipation device for spacecraft for reducing mass
CN113290983A (en) * 2021-04-08 2021-08-24 山东非金属材料研究所 Ultra-light composite material electric heating floor and preparation method thereof
CN215203792U (en) * 2021-03-12 2021-12-17 惠州昌钲新材料有限公司 Ultrahigh heat-conducting gasket special for storage products
CN216183535U (en) * 2021-10-31 2022-04-05 苏州梭洋新材料科技有限公司 Edge-covered non-metal honeycomb filled foam composite board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203185771U (en) * 2013-04-24 2013-09-11 常州碳元科技发展有限公司 Edge covering type high-heat-conductivity graphite diaphragm
CN205439399U (en) * 2015-12-24 2016-08-10 深圳市三科斯电子材料有限公司 High heat conduction radiation heat dissipation graphite membrane
CN111465260A (en) * 2020-03-19 2020-07-28 北京空间机电研究所 Large-area radiation heat dissipation device for spacecraft for reducing mass
CN215203792U (en) * 2021-03-12 2021-12-17 惠州昌钲新材料有限公司 Ultrahigh heat-conducting gasket special for storage products
CN113290983A (en) * 2021-04-08 2021-08-24 山东非金属材料研究所 Ultra-light composite material electric heating floor and preparation method thereof
CN216183535U (en) * 2021-10-31 2022-04-05 苏州梭洋新材料科技有限公司 Edge-covered non-metal honeycomb filled foam composite board

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