CN115445844B - Gluing device for diode processing - Google Patents
Gluing device for diode processing Download PDFInfo
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- CN115445844B CN115445844B CN202210972448.4A CN202210972448A CN115445844B CN 115445844 B CN115445844 B CN 115445844B CN 202210972448 A CN202210972448 A CN 202210972448A CN 115445844 B CN115445844 B CN 115445844B
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- Prior art keywords
- glue
- fixedly connected
- gluing
- assembly
- diode
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 66
- 230000000712 assembly Effects 0.000 claims abstract 5
- 238000000429 assembly Methods 0.000 claims abstract 5
- 239000003292 glue Substances 0.000 claims description 110
- 238000003892 spreading Methods 0.000 claims description 39
- 238000010073 coating (rubber) Methods 0.000 claims description 22
- 229920000742 Cotton Polymers 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 8
- 230000006978 adaptation Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 208000002925 dental caries Diseases 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 22
- 238000000576 coating method Methods 0.000 description 22
- 230000002349 favourable effect Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000008234 soft water Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a gluing device for diode processing, which comprises a support frame, wherein the support frame is in a shape of a Chinese character 'shan', a fixing assembly is arranged in the support frame through a screw, the fixing assembly comprises a first fixing piece and a second fixing piece which are symmetrically arranged, the inner structures of the first fixing piece and the second fixing piece are identical, the outer side of the fixing assembly is connected with a movable ring in a sliding manner, the fixing assembly is connected with the movable ring through a clamp assembly, the clamp assembly is provided with a plurality of clamp assemblies, a plurality of clamp assemblies are distributed in the fixing assembly in an annular array manner, clamping plates for clamping a diode are arranged at the end parts of the clamp assemblies and are positioned in the fixing assembly, and a gluing assembly is connected between the first fixing piece and the second fixing piece. The invention is convenient for uniformly gluing the diode, can adaptively adjust the diameter of the diode, greatly improves the gluing efficiency and can protect the diode.
Description
Technical Field
The invention relates to the technical field of diode processing, in particular to a gluing device for diode processing.
Background
The diode makes a device with two electrodes in electronic components only allow current to flow from a single direction, many uses are to apply its rectification function, its biggest characteristic is unidirectional conduction, that is, current can flow from only one direction of the diode, when the diode is installed, the connection part needs to be glued to strengthen the connection strength of the diode, and when glue is applied to the diode with leads at both ends, only the outer circumferential surface of the diode can be glued, so that the diode can not be directly placed in a glue box to be quickly dipped, and only the outer circumferential surface of the diode can be glued.
Chinese patent application publication No. CN212791607U discloses a device for gluing diodes, comprising: and the container is coated with a rubber ring, a pressing plate and a cover plate. A partition board is arranged in the container and divides the container into an inner cavity and an outer cavity, and a glue coating ring is arranged at the top of the partition board; the rubber coating ring is in a circular ring structure, is made of a material which has water absorbability, can be compressed and rebounds, and is provided with a pressing plate above; the pressing plate is arranged in the container in a sliding manner, a gap sealing structure is formed between the pressing plate and the inner wall of the container, the pressing plate is of an annular structure, and the diameter of the inner ring of the pressing plate is larger than that of the inner ring of the glue spreading ring; the top of the container is provided with a cover plate, a through hole is processed in the middle of the cover plate, and the diameter of the through hole is larger than that of the inner ring of the pressing plate. Can glue the outer wall of the diode rapidly, and is convenient for realizing mechanized mass production.
In the prior art, when the diode is glued, the adaptive adjustment is not convenient according to the diameter of the diode, the situation of uneven gluing easily occurs, and the gluing efficiency is low.
Therefore, it is necessary to invent a glue applicator for diode processing to solve the above problems.
Disclosure of Invention
The invention aims to provide a gluing device for diode processing, which solves the problems that in the prior art, when a diode is glued, the gluing device is inconvenient to adaptively adjust according to the diameter of the diode, the situation of uneven gluing is easy to occur, and the gluing efficiency is low.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a rubber coating device is used in diode processing, includes the support frame, the support frame sets up to the mountain-shaped, fixed subassembly is installed through the screw to the inside of support frame, and fixed subassembly is including symmetrical first mounting and the second mounting that sets up, first mounting and second mounting inner structure are the same, fixed subassembly's outside sliding connection has the expansion ring, connect through the anchor clamps subassembly between fixed subassembly and the expansion ring, the anchor clamps subassembly is provided with a plurality of, a plurality of anchor clamps subassembly annular array distributes in fixed subassembly's inside, the tip of anchor clamps subassembly just is located fixed subassembly's inside and is provided with the splint that carry out the centre gripping to the diode, be connected with the rubber coating subassembly between first mounting and the second mounting, the inside of rubber coating subassembly is provided with the rubberizing board that carries out the rubber coating to the diode, the rubber coating subassembly is used for driving the rubberizing board and carries out circumference activity around the diode.
The inside of support frame is provided with first extension board and second extension board, first mounting is installed in the second extension board inside, the second mounting is installed in first extension board inside, the expansion ring includes with first mounting matched with first push ring and with second mounting matched with second push ring and carries out the hydraulic assembly that promotes first push ring and second push ring, just a plurality of cavitys have been seted up to the inside of first mounting, a plurality of annular array distributed's run-through groove has been seted up to the inside of first push ring, cavity and run-through groove all with anchor clamps subassembly looks adaptation, the inside of rubber coating subassembly is provided with the rubber coating spare of multiunit annular array setting, multiunit rubber coating spare all includes the fixed connection pole, the inside sliding connection of fixed connection pole has the connecting block of end fixedly connected with of sliding connection pole, the tip and the rubber coating board fixed connection of connecting block, the equal fixedly connected with spacing lug in upper and lower both ends of rubber coating board, the one end that the splint is close to the rubber coating board all sets up with spacing spout with the cooperation lug.
As a preferable scheme of the invention, the top outer side of the first fixing piece is fixedly connected with a top mounting plate, the first fixing piece is detachably mounted in the second support plate through a plurality of screws, the outer side of the second fixing piece is fixedly connected with a bottom mounting plate, the bottom mounting plate is detachably mounted in the first support plate through a plurality of screws, and the side of the support frame is fixedly connected with a protection plate through screws.
As a preferable scheme of the invention, the bottom of the top mounting plate outside the first fixing piece is fixedly connected with a plurality of annular array distributed limiting vertical rods, a plurality of limiting through holes matched with the limiting vertical rods are formed in the first push ring, the output end of the hydraulic assembly is hinged with two rotating rods, the two rotating rods are hinged, the end parts of the two rotating rods are hinged with pushing blocks, the two pushing blocks are symmetrically arranged, the side sides of the first push ring and the side of the second push ring are fixedly connected with fixing blocks, the end parts of the fixing blocks are fixedly connected with sliding cylinders in a shrinkage arrangement, the end parts of the pushing blocks are fixedly connected with sliding blocks in sliding connection with the sliding cylinders, and buffering elastic pieces are fixedly connected between the sliding blocks and the sliding cylinders.
As a preferable scheme of the invention, the clamp assembly comprises a movable adjusting block fixedly connected in the through groove and a fixed adjusting block fixedly connected in the cavity, wherein a supporting rod is hinged at the end part of the movable adjusting block, a pushing rod is hinged at the end part of the fixed adjusting block, the end part of the supporting rod is hinged with the middle part of the pushing rod, a rotating shaft is fixedly connected at the end part of the pushing rod, and the end part of the rotating shaft is hinged with the clamping plate.
As a preferable scheme of the invention, the bottom of the first fixing piece and the top of the second fixing piece are fixedly connected with bottom plates, one sides of the two bottom plates, which are close to the gluing component, are fixedly connected with limiting rings, and limiting grooves matched with the limiting rings are formed in the upper side and the lower side of the gluing component.
As a preferable scheme of the invention, the outer side of the gluing component is fixedly connected with a tooth block, a motor for driving the gluing component is arranged in the supporting frame, the output end of the motor is fixedly connected with a gear, and the gear is in meshed connection with the tooth block.
As a preferable scheme of the invention, the fixed connecting rod is fixedly connected inside the gluing component, the fixed connecting rod is arranged in an inward opening, the opening of the fixed connecting rod is in a necking arrangement, pushing pieces are fixedly connected to the head end and the tail end of the sliding connecting rod, a reset elastic piece is arranged inside the fixed connecting rod and is positioned at the outer side of the sliding connecting rod, the diameter of the reset elastic piece is larger than that of the sliding connecting rod and smaller than that of the pushing pieces, and the sliding connecting rod extends to the outer side of the fixed connecting rod.
As a preferable scheme of the invention, the two sides of the connecting block are fixedly connected with the limiting inserting rods, limiting inserting holes matched with the limiting inserting rods are formed in the gluing component, the number of the glue coating plates is the same as that of the clamping plates, the width of the glue coating plates in an initial state is larger than the gap between two adjacent clamping plates, glue coating cotton is fixedly connected to the inner sides of the glue coating plates, and the glue coating cotton is made of soft water absorbing cotton.
As a preferable scheme of the invention, a feeding channel is arranged in the sliding connecting rod in a penetrating way, a feeding pipe is fixedly connected in the fixing connecting rod, one end of the feeding pipe is fixedly connected with the tail part of the fixing connecting rod, the other end of the feeding pipe extends to the inside of the feeding channel, a through hole communicated with the feeding channel is formed in the connecting block, a plurality of evenly-distributed glue outlets are formed in the glue coating plate and are communicated with the through hole, a glue injecting through groove communicated with the feeding pipe is formed in the glue coating assembly, a plurality of feeding pipes are communicated with the glue injecting through groove, a glue injecting hole communicated with the glue injecting through groove is formed in one side of the glue coating assembly, and a one-way valve is arranged in the glue injecting hole.
As a preferable scheme of the invention, the electric heating wires are arranged inside the rubberized plates.
In the technical scheme, compared with the prior art, the invention has the technical effects and advantages that:
1. by starting the hydraulic assembly, the hydraulic assembly pushes the two rotating rods at the end part to rotate in different directions, so as to drive the first push ring and the second push ring to move up and down respectively, when the first push ring ascends, the movable adjusting block inside the first push ring is driven to ascend, and the push rod is pushed to rotate through the supporting rod, the push rod rotates around the end part of the first fixing piece to the inside of the first fixing piece, so that the push rod contacts with the diode, and the moving track of the push rod moves circularly, so that the diode is prevented from being damaged due to the inclination of the angle, the movable clamping plate is hinged between the rotating shaft and the push rod, the clamping plate can be automatically adjusted according to the shape of the diode, the inner side of the clamping plate is concavely arranged, the clamping plate is favorable for clamping in cooperation with the radian of the diode, the clamping safety is enhanced, when the clamping plate in the inside contacts with a material, the clamping plate is not moved, so that the first push ring and the second push ring are fixed, the sliding block pulls the buffer elastic piece to stretch and deform, and slides in the sliding barrel, the buffer elastic piece is favorable for protecting the diode from damaging the diode, and the clamping plate is favorable for clamping the material under the pulling of the buffer elastic piece;
2. through the adaptation of the sliding groove in the clamping plate and the limit lug at the end part of the gluing plate, when the clamping plate is connected with the gluing plate, the clamping plate can drive the gluing plate to synchronously slide inwards by moving inwards, so that the gluing plate can be conveniently and adaptively adjusted according to the diameter of the diode, and in order to keep the gluing plate stable, the limit inserting rod at the outer side of the connecting block slides in the limit inserting hole, thereby limiting the gluing plate;
3. the motor is started to drive the gear to rotate the gluing component through the tooth block, the limiting rings at the sides of the first fixing piece and the second fixing piece rotate in the limiting grooves formed in the upper side and the lower side of the gluing component, limiting of the gluing component is facilitated, in order to reduce resistance among parts of the device, a user can set rotating beads in the limiting grooves, friction among the parts is reduced, in the rotating process of the gluing component, the gluing component drives the gluing plate to rotate, so that the outer surface of the diode can be evenly glued, and as the large width of the gluing plate is larger than the gap between two adjacent clamping plates, the gluing plate can be prevented from being separated from the clamping plates, and the gluing cotton protrudes out of the clamping plates, so that the diode can be thoroughly and evenly glued, and soft absorbent cotton is convenient for absorbing and storing glue;
4. glue is injected into the inside of the glue injecting through groove through the glue injecting port, the glue enters the inside of the feeding channel through the feeding pipe, and enters the inside of the connecting block through the through hole, and finally the glue coating plate is discharged through the glue outlet, so that glue coating cotton is soaked, the glue outlet is provided with a plurality of glue coating cotton, glue coating cotton is uniformly soaked, automatic gluing of the device is finished, automatic efficiency of the device is greatly improved, heating wires are arranged in the glue coating assembly and the glue coating plates, glue solidification can be prevented, and adaptability of the device is enhanced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic view of the internal structure of a support frame according to the present invention;
FIG. 2 is a schematic diagram of the overall structure of the present invention;
FIG. 3 is a schematic view of a first perspective of the connection of a stationary component to a movable ring according to the present invention;
FIG. 4 is a schematic view of a second perspective of the connection of the stationary assembly to the movable ring according to the present invention;
FIG. 5 is a schematic view of a third perspective of the connection of a stationary component to a movable ring according to the present invention;
FIG. 6 is a schematic diagram of an exploded construction of a pusher block according to the present invention;
FIG. 7 is a schematic cross-sectional view of a first fastener of the present invention;
FIG. 8 is a schematic perspective view of a clamp assembly of the present invention;
FIG. 9 is a schematic perspective view of a glue application assembly according to the present invention;
FIG. 10 is a schematic view of the connection structure of the clamping plate and the glue spreading plate according to the present invention;
FIG. 11 is a schematic cross-sectional view of a glue application assembly according to the present invention;
FIG. 12 is a schematic view of the internal structure of the glue application assembly of the present invention;
FIG. 13 is a first view structural schematic diagram of a first fastener of the present invention;
FIG. 14 is a second view of the first fastener of the present invention;
FIG. 15 is a schematic perspective view of a first push ring according to the present invention;
fig. 16 is a schematic view illustrating an internal structure of a fixing link according to a second embodiment of the present invention.
Reference numerals illustrate:
1. a support frame; 2. a fixing assembly; 21. a first fixing member; 22. a second fixing member; 3. a movable ring; 31. a first push ring; 32. a second push ring; 33. a hydraulic assembly; 4. a clamp assembly; 5. a gluing component; 6. a clamping plate; 7. coating a glue plate;
101. a first support plate; 102. a second support plate; 103. a protection plate;
211. a top mounting plate; 212. limiting upright posts; 213. a cavity; 214. a bottom plate; 215. a limiting ring; 221. a bottom mounting plate;
311. a through groove; 312. limiting through holes; 313. a fixed block; 314. a sliding cylinder; 331. a rotating lever; 332. a pushing block; 333. a sliding block; 334. a buffer elastic member;
401. a movable adjusting block; 402. a support rod; 403. fixing the adjusting block; 404. a push rod; 405. a rotating shaft;
501. tooth blocks; 502. a gear; 503. fixing the connecting rod; 504. a sliding connecting rod; 505. a return elastic member; 506. a connecting block; 507. a limit inserted link; 508. limiting jack; 509. a limit groove; 510. a feed pipe; 511. a feed channel;
601. a chute;
701. a limit bump; 702. and (5) coating collodion cotton.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
The invention provides a gluing device for diode processing, which is shown in figures 1-15, and comprises a support frame 1, wherein the support frame 1 is arranged in a Chinese character 'shan' -shaped, a fixing component 2 is arranged in the support frame 1 through screws, the fixing component 2 comprises a first fixing component 21 and a second fixing component 22 which are symmetrically arranged, the inner structures of the first fixing component 21 and the second fixing component 22 are the same, a movable ring 3 is slidingly connected to the outer side of the fixing component 2, the fixing component 2 is connected with the movable ring 3 through a clamp component 4, the clamp component 4 is provided with a plurality of clamp components 4 which are distributed in the fixing component 2 in an annular array manner, a clamping plate 6 for clamping a diode is arranged at the end part of the clamp component 4 and positioned in the fixing component 2, a gluing component 5 is connected between the first fixing component 21 and the second fixing component 22, a gluing plate 7 for gluing the diode is arranged in the gluing component 5, and the gluing component 5 is used for driving the gluing plate 7 to perform circumferential movement around the diode;
the inside of the support frame 1 is provided with a first support plate 101 and a second support plate 102, a first fixing piece 21 is arranged inside the second support plate 102, a second fixing piece 22 is arranged inside the first support plate 101, the movable ring 3 comprises a first push ring 31 matched with the first fixing piece 21, a second push ring 32 matched with the second fixing piece 22 and a hydraulic component 33 for pushing the first push ring 31 and the second push ring 32, a plurality of cavities 213 are formed inside the first fixing piece 21, a plurality of penetrating grooves 311 distributed in an annular array are formed inside the first push ring 31, the cavities 213 and the penetrating grooves 311 are matched with the clamp component 4, a plurality of groups of glue spreading pieces arranged in an annular array are arranged inside the glue spreading component 5, each group of glue spreading pieces comprises a fixed connecting rod 503, a sliding connecting rod 504 is connected inside the fixed connecting rod 503 in a sliding mode, the end portion of the sliding connecting rod 504 is fixedly connected with a connecting block 506, the end portion of the connecting block 506 is fixedly connected with a glue spreading plate 7, limit lugs 701 are fixedly connected to the upper end and lower end of the glue spreading plate 7, one end of the clamping plate 6, and one end of the clamping plate 7 close to the glue spreading plate 7 are provided with limit lugs 601;
specifically, in the initial state, the chute 601 inside the clamping plate 6 is matched with the limit bump 701 at the end of the glue spreading plate 7, when the clamping plate 6 is connected with the glue spreading plate 7, the clamping plate 6 moves inwards to drive the glue spreading plate 7 to slide inwards synchronously, so that the glue spreading plate 7 can be adjusted adaptively according to the diameter of the diode.
Wherein, the top outer side of the first fixing piece 21 is fixedly connected with a top mounting plate 211, the first fixing piece 21 is detachably mounted in the second support plate 102 through a plurality of screws, the outer side of the second fixing piece 22 is fixedly connected with a bottom mounting plate 221, the bottom mounting plate 221 is detachably mounted in the first support plate 101 through a plurality of screws, and the side of the support frame 1 is fixedly connected with a protection plate 103 through screws;
specifically, when installing, the user can place the second mounting 22 in first extension board 101 at first, then carry out fixed mounting to it through the screw, then place the rubber coating subassembly 5 in the top of second mounting 22, make it be connected with second mounting 22 block, then place first mounting 21 in second extension board 102 is inside, in the same way, carry out fixed mounting to it, then pass through the screw with slide cartridge 314 fixed mounting in the avris of dwang 331, thereby accomplish the installation to the device, finally install guard plate 103 in the both sides of support frame 1 through the screw, be favorable to protecting the device.
The outer side of the first fixing piece 21 is fixedly connected with a plurality of limit vertical rods 212 distributed in a ring array at the bottom of the top mounting plate 211, a plurality of limit through holes 312 matched with the limit vertical rods 212 are formed in the first push ring 31, two rotating rods 331 are hinged to the output end of the hydraulic assembly 33, the two rotating rods 331 are hinged, pushing blocks 332 are hinged to the end parts of the two rotating rods 331, the two pushing blocks 332 are symmetrically arranged, the side sides of the first push ring 31 and the second push ring 32 are fixedly connected with fixing blocks 313, the end parts of the fixing blocks 313 are fixedly connected with sliding cylinders 314 in shrinkage arrangement, the end parts of the pushing blocks 332 are fixedly connected with sliding blocks 333 in sliding connection with the sliding cylinders 314, and buffer elastic pieces 334 are fixedly connected between the sliding blocks 333 and the sliding cylinders 314;
when the diode is placed inside the device, by starting the hydraulic component 33, the hydraulic component 33 pushes the two rotating rods 331 at the end part to rotate in different directions, the two rotating rods 331 push the pushing blocks 332 at the end part to move, the pushing blocks 332 drive the sliding blocks 333 to move, the sliding blocks 333 pull the sliding cylinder 314 and the fixing blocks 313 to move through the buffer elastic pieces 334, and further drive the first push ring 31 and the second push ring 32 to move up and down respectively, when the clamping plate 6 in the device contacts with a material, the clamping plate 6 does not move, and further the first push ring 31 and the second push ring 32 are fixed, the sliding blocks 333 pull the buffer elastic pieces 334 to stretch and deform and slide in the sliding cylinder 314, so that the diode is protected, damage to the diode by the clamping plate 6 is prevented, and the fixed clamping of the material is facilitated under the pulling of the buffer elastic pieces 334.
The fixture assembly 4 comprises a movable adjusting block 401 fixedly connected inside the through groove 311 and a fixed adjusting block 403 fixedly connected inside the cavity 213, wherein a supporting rod 402 is hinged at the end part of the movable adjusting block 401, a push rod 404 is hinged at the end part of the fixed adjusting block 403, the end part of the supporting rod 402 is hinged with the middle part of the push rod 404, a rotating shaft 405 is fixedly connected at the end part of the push rod 404, and the end part of the rotating shaft 405 is hinged with the clamping plate 6;
specifically, when the first push ring 31 rises, the movable adjusting block 401 inside the first push ring is driven to rise, the movable adjusting block 401 pushes the supporting rod 402 at the end part of the movable adjusting block to rotate, and the supporting rod 404 is pushed to rotate through the supporting rod 402, because the fixed adjusting block 403 is fixed in the first fixing piece 21, the push rod 404 rotates around the end part of the first fixing piece 21 to the inside of the first fixing piece 21, and further the clamping plate 6 at the end part of the first push ring is pushed to move inwards to make the first push ring contact with the diode, and because the moving track of the push rod 404 moves circularly, in order to prevent the clamping plate 6 from damaging the diode due to the inclination of the angle, the movable clamping plate 6 is hinged between the rotating shaft 405 and the push rod 404, the clamping plate 6 can be automatically adjusted according to the shape of the diode, and similarly, the second push ring 32 descends, the clamping plate 6 inside the second push ring is driven to contact with the material, and the inner side of the clamping plate 6 is concavely arranged, so that the clamping plate 6 is favorable for clamping in cooperation with the radian of the diode, and the safety of clamping is enhanced.
As a further optimization of the invention, the bottom of the first fixing piece 21 and the top of the second fixing piece 22 are fixedly connected with bottom plates 214, one sides of the two bottom plates 214 close to the gluing component 5 are fixedly connected with limiting rings 215, and the upper side and the lower side of the gluing component 5 are provided with limiting grooves 509 matched with the limiting rings 215;
the outer side of the gluing component 5 is fixedly connected with a tooth block 501, a motor for driving the gluing component 5 is arranged in the support frame 1, the output end of the motor is fixedly connected with a gear 502, and the gear 502 is meshed with the tooth block 501;
specifically, after the diode is clamped more stably, a user can drive the gear 502 to rotate mainly by starting the motor, the gear 502 drives the gluing component 5 to rotate through the tooth block 501, the limiting rings 215 on the sides of the first fixing piece 21 and the second fixing piece 22 rotate in the limiting grooves 509 arranged on the upper side and the lower side of the gluing component 5, limiting of the gluing component 5 is facilitated, and in order to reduce resistance between parts of the device, the user can set rotating beads in the limiting grooves 509, so that friction between the parts is reduced.
In the above structure, the fixed connecting rod 503 is fixedly connected inside the glue spreading component 5, the fixed connecting rod 503 is opened inwards, the opening of the fixed connecting rod 503 is in a necking shape, the pushing pieces are fixedly connected to the front end and the rear end of the sliding connecting rod 504, the reset elastic piece 505 is arranged inside the fixed connecting rod 503, the reset elastic piece 505 is positioned at the outer side of the sliding connecting rod 504, the diameter of the reset elastic piece 505 is larger than that of the sliding connecting rod 504 and smaller than that of the pushing pieces, and the sliding connecting rod 504 extends to the outer side of the fixed connecting rod 503;
specifically, when the clamping plate 6 clamps the diode inwards, the glue coating plate 7 is driven to synchronously move inwards, so that the connecting block 506 at the outer side of the glue coating plate 7 drives the sliding connecting rod 504 to extend outwards, and further the pushing piece at the end part of the sliding connecting rod 504 slides outwards to extrude the reset elastic piece 505 inside, and after the glue coating plate 7 resets, the reset elastic piece 505 can drive the glue coating plate 7 to reset, so that the glue coating plate 7 is in a contracted position in an initial state, and is convenient to adapt to the clamping plate 6.
As a further optimization of the invention, both sides of the connecting block 506 are fixedly connected with the limiting inserting rods 507, limiting inserting holes 508 which are matched with the limiting inserting rods 507 are formed in the gluing component 5, the number of the gluing plates 7 is the same as that of the clamping plates 6, the width of the gluing plates 7 is larger than the gap between two adjacent clamping plates 6 in an initial state, gluing cotton 702 is fixedly connected to the inner side of the gluing plates 7, and the material of the gluing cotton 702 is soft absorbent cotton;
specifically, in order to make glue spreading plate 7 keep stable, the spacing inserted bar 507 in the connecting block 506 outside is at the inside slip of spacing jack 508, thereby carry out spacingly to glue spreading plate 7, at glue spreading assembly 5 pivoted in-process, glue spreading assembly 5 drives glue spreading plate 7 and rotates, thereby can carry out even rubber coating to the surface of diode, because glue spreading plate 7 is big width is greater than the clearance between two adjacent splint 6, can prevent to spread glue spreading plate 7 and break away from splint 6, and glue spreading cotton 702 protrusion sets up in splint 6, be convenient for carry out thorough evenly rubber coating to the diode, soft absorbent cotton is convenient for absorb and store glue, glue spreading plate 7 surface indent sets up, be favorable to adapting to the radian of diode, can protect the diode, and be convenient for carry out even rubber coating.
Embodiment two:
as shown in fig. 16, in order to automatically glue the device, a feeding channel 511 is arranged inside the sliding connecting rod 504 in a penetrating manner, a feeding pipe 510 is fixedly connected inside the fixed connecting rod 503, one end of the feeding pipe 510 is fixedly connected with the tail of the fixed connecting rod 503, the other end of the feeding pipe extends to the inside of the feeding channel 511, a through hole communicated with the feeding channel 511 is formed inside the connecting block 506, a plurality of glue outlets which are uniformly distributed are formed inside the glue spreading plate 7 and are communicated with the through holes, a glue injecting through groove communicated with the feeding pipe 510 is formed inside the glue spreading component 5, a plurality of feeding pipes 510 are communicated with the glue injecting through groove, a glue injecting hole communicated with the glue injecting through groove is formed in one side of the glue spreading component 5, and a one-way valve is arranged in the glue injecting hole;
specifically, when the user needs to glue the device, the user can pour into glue through the injecting glue mouth and lead to the inslot portion, glue is through injecting glue through leading to the inslot portion into inlet pipe 510, and enter into inside feed channel 511 through inlet pipe 510, enter into inside connecting block 506 through feed channel 511 and opening, and through the glue outlet discharge scribble the offset plate 7 outside, thereby it scribbles offset cotton 702 to infiltrate, owing to the glue outlet is provided with a plurality ofly, be convenient for evenly soakage to offset cotton 702, thereby accomplish the automatic rubberizing to the device, the automation efficiency of device has been improved greatly, and glue subassembly 5 and a plurality of inside of scribbling offset plate 7 all set up the heating wire, can prevent that glue from solidifying, be favorable to strengthening the adaptability of device.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The utility model provides a rubber coating device is used in diode processing, includes support frame (1), its characterized in that: the support frame (1) is arranged in a mountain shape, a fixing assembly (2) is arranged in the support frame (1) through screws, the fixing assembly (2) comprises a first fixing piece (21) and a second fixing piece (22) which are symmetrically arranged, the inner structures of the first fixing piece (21) and the second fixing piece (22) are identical, a movable ring (3) is slidably connected to the outer side of the fixing assembly (2), the fixing assembly (2) is connected with the movable ring (3) through a clamp assembly (4), the clamp assembly (4) is provided with a plurality of clamp assemblies (4) in an annular array, clamping plates (6) for clamping the diodes are arranged at the end parts of the clamp assemblies (4) and in the fixing assembly (2), a gluing assembly (5) is connected between the first fixing piece (21) and the second fixing piece (22), and a gluing plate (7) for gluing the diodes is arranged in the inner side of the gluing assembly (5), and the gluing assembly (5) is used for driving the gluing plate (7) to move around the circumference of the diodes;
the inside of support frame (1) is provided with first extension board (101) and second extension board (102), first mounting (21) are installed inside second extension board (102), second mounting (22) are installed inside first extension board (101), loose ring (3) include with first mounting (21) matched with first push ring (31) and with second mounting (22) matched with second push ring (32) and carry out hydraulic pressure subassembly (33) that promote first push ring (31) and second push ring (32), just a plurality of cavitys (213) have been seted up to the inside of first mounting (21), a plurality of annular array distributed's through groove (311) have been seted up to the inside of first push ring (31), cavity (213) and through groove (311) all with anchor clamps subassembly (4) looks adaptation, the inside of gluing subassembly (5) is provided with the rubber coating piece that multiunit annular array set up, and the rubber coating piece all includes fixed connection pole (503), fixed connection pole (506) are connected with fixed connection pole (506) and fixed connection pole (7) are connected with the connecting rod (701) of connecting rod (506) end, fixed connection pole (7), and one end of the clamping plate (6) close to the rubberizing plate (7) is provided with a chute (601) matched with the limit lug (701).
2. The glue applicator for diode processing of claim 1, wherein: the top outside fixedly connected with top mounting panel (211) of first mounting (21), first mounting (21) are through a plurality of screws demountable installation in the inside of second extension board (102), the outside fixedly connected with bottom mounting panel (221) of second mounting (22), bottom mounting panel (221) are through a plurality of screws demountable installation in the inside of first extension board (101), the avris of support frame (1) is through screw fixedly connected with guard plate (103).
3. The glue spreading device for diode processing according to claim 2, wherein: the utility model discloses a hydraulic assembly, including top mounting panel (211), first mounting panel (21), first push ring (31), second push ring (32), first mounting panel (211) and second mounting panel, the bottom fixedly connected with of top mounting panel (211) distributes spacing pole setting (212), the inside of first push ring (31) is provided with a plurality of and spacing pole setting (212) matched with spacing through-hole (312), the output of hydraulic assembly (33) articulates there are two dwang (331), two dwang (331) articulated setting, two the tip of dwang (331) all articulates has pushing block (332), two pushing block (332) symmetry sets up, the avris of first push ring (31) and second push ring (32) all fixedly connected with fixed block (313), the tip fixedly connected with of fixed block (313) has slide (333) that the throat set up, fixedly connected with buffer elastic component (334) between slide (333) and slide (314).
4. The glue applicator for diode processing of claim 1, wherein: the fixture assembly (4) comprises a movable adjusting block (401) fixedly connected in the through groove (311) and a fixed adjusting block (403) fixedly connected in the cavity (213), wherein a supporting rod (402) is hinged to the end portion of the movable adjusting block (401), a pushing rod (404) is hinged to the end portion of the fixed adjusting block (403), the end portion of the supporting rod (402) is hinged to the middle portion of the pushing rod (404), a rotating shaft (405) is fixedly connected to the end portion of the pushing rod (404), and the end portion of the rotating shaft (405) is hinged to the clamping plate (6).
5. The glue applicator for diode processing of claim 1, wherein: the bottom of first mounting (21) and the top of second mounting (22) are all fixedly connected with bottom plate (214), two the bottom plate (214) are close to one side of rubber coating subassembly (5) and are all fixedly connected with spacing ring (215), spacing groove (509) with spacing ring (215) matched with is all seted up to the upper and lower both sides of rubber coating subassembly (5).
6. The glue applicator for diode processing of claim 1, wherein: the outer side of the gluing component (5) is fixedly connected with a tooth block (501), a motor for driving the gluing component (5) is arranged in the support frame (1), the output end of the motor is fixedly connected with a gear (502), and the gear (502) is meshed with the tooth block (501).
7. The glue applicator for diode processing of claim 1, wherein: fixed connecting rod (503) fixed connection is inside rubber coating subassembly (5), the inside opening setting of fixed connecting rod (503), and the opening part of fixed connecting rod (503) is the throat setting, the equal fixedly connected with pushing piece in head and tail both ends of sliding connection pole (504), the inside of fixed connecting rod (503) is provided with resets elastic component (505), reset elastic component (505) are located the outside of sliding connection pole (504), the diameter of reset elastic component (505) is greater than the diameter of sliding connection pole (504) and is less than the diameter of pushing piece, the outside that sliding connection pole (504) extends to fixed connecting rod (503).
8. The glue applicator for diode processing of claim 1, wherein: the utility model discloses a glue spreading device, including connecting block (506), glue spreading component (5), glue spreading board (7), connecting block (506) both sides equal fixedly connected with spacing inserted bar (507), glue spreading component (5)'s inside offered with spacing jack (508) of spacing inserted bar (507) looks adaptation, glue spreading board (7) quantity is the same with the quantity of splint (6), and glue spreading board (7) width is greater than the clearance between two adjacent splint (6) under initial condition, glue spreading board (7) inboard fixedly connected with glue spreading cotton (702), glue spreading cotton (702)'s material sets up to soft cotton that absorbs water.
9. The glue applicator for diode processing of claim 1, wherein: the inside of sliding connection pole (504) is run through and is provided with feed channel (511), the inside fixedly connected with inlet pipe (510) of fixed connection pole (503), inlet pipe (510) one end and fixed connection pole (503) afterbody fixed connection, the other end extend to the inside of feed channel (511), the inside of connecting block (506) is provided with the opening that is linked together with feed channel (511), the inside of spreading plate (7) is provided with a plurality of evenly distributed's play glue mouth, and a plurality of play glue mouthful all are linked together with the opening, the inside of spreading subassembly (5) is provided with the injecting glue logical groove that is linked together with inlet pipe (510), a plurality of inlet pipe (510) all are linked together with injecting glue logical groove, and the injecting glue mouth that is linked together with injecting glue logical groove is seted up to one side of spreading subassembly (5), be provided with the check valve in the injecting glue mouth.
10. The glue applicator for diode processing of claim 1, wherein: and heating wires are arranged in the glue spreading plates (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210972448.4A CN115445844B (en) | 2022-08-15 | 2022-08-15 | Gluing device for diode processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210972448.4A CN115445844B (en) | 2022-08-15 | 2022-08-15 | Gluing device for diode processing |
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| Publication Number | Publication Date |
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| CN115445844A CN115445844A (en) | 2022-12-09 |
| CN115445844B true CN115445844B (en) | 2024-04-12 |
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| CN202210972448.4A Active CN115445844B (en) | 2022-08-15 | 2022-08-15 | Gluing device for diode processing |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20120130629A (en) * | 2011-05-23 | 2012-12-03 | 주식회사 두오텍 | A resin dispensing apparatus |
| CN209886065U (en) * | 2019-04-17 | 2020-01-03 | 安徽巨合电子科技有限公司 | Light-emitting diode support rubber coating device |
| JP6883166B1 (en) * | 2019-12-02 | 2021-06-09 | 永康市飛升智能科技有限公司 | A device that applies adhesive to bamboo materials |
| CN215695384U (en) * | 2021-08-16 | 2022-02-01 | 利辛悟芯信息科技有限公司 | Automatic chip dispensing equipment for electronic products |
| CN114582739A (en) * | 2022-02-21 | 2022-06-03 | 合肥鑫丰科技有限公司 | Integrated circuit semiconductor chip packaging equipment and packaging method thereof |
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2022
- 2022-08-15 CN CN202210972448.4A patent/CN115445844B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120130629A (en) * | 2011-05-23 | 2012-12-03 | 주식회사 두오텍 | A resin dispensing apparatus |
| CN209886065U (en) * | 2019-04-17 | 2020-01-03 | 安徽巨合电子科技有限公司 | Light-emitting diode support rubber coating device |
| JP6883166B1 (en) * | 2019-12-02 | 2021-06-09 | 永康市飛升智能科技有限公司 | A device that applies adhesive to bamboo materials |
| CN215695384U (en) * | 2021-08-16 | 2022-02-01 | 利辛悟芯信息科技有限公司 | Automatic chip dispensing equipment for electronic products |
| CN114582739A (en) * | 2022-02-21 | 2022-06-03 | 合肥鑫丰科技有限公司 | Integrated circuit semiconductor chip packaging equipment and packaging method thereof |
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| Publication number | Publication date |
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| CN115445844A (en) | 2022-12-09 |
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