CN115442590A - Performance analysis method and device, electronic equipment and computer readable storage medium - Google Patents

Performance analysis method and device, electronic equipment and computer readable storage medium Download PDF

Info

Publication number
CN115442590A
CN115442590A CN202210929890.9A CN202210929890A CN115442590A CN 115442590 A CN115442590 A CN 115442590A CN 202210929890 A CN202210929890 A CN 202210929890A CN 115442590 A CN115442590 A CN 115442590A
Authority
CN
China
Prior art keywords
light
protective cover
stray light
receiving camera
performance analysis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210929890.9A
Other languages
Chinese (zh)
Other versions
CN115442590B (en
Inventor
陈展耀
钱哲弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Xinming Intelligent Technology Co ltd
Original Assignee
Yinniu Microelectronics Wuxi Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yinniu Microelectronics Wuxi Co ltd filed Critical Yinniu Microelectronics Wuxi Co ltd
Priority to CN202210929890.9A priority Critical patent/CN115442590B/en
Publication of CN115442590A publication Critical patent/CN115442590A/en
Application granted granted Critical
Publication of CN115442590B publication Critical patent/CN115442590B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00Diagnosis, testing or measuring for television systems or their details
    • H04N17/002Diagnosis, testing or measuring for television systems or their details for television cameras
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00Scenes; Scene-specific elements
    • G06V20/90Identifying an image sensor based on its output data

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Measurement Of Optical Distance (AREA)

Abstract

The invention discloses a performance analysis method, a performance analysis device, electronic equipment and a computer-readable storage medium. The performance analysis method comprises the following steps: acquiring the optical signal power S of reflected light received by a light receiving camera, wherein the reflected light is light which is emitted to an object to be detected by a dot matrix projector and reflected to the light receiving camera by the object to be detected; light intensity I based on stray light at G point position G Calculating the power N of the stray light at the position of the light receiving camera, wherein the stray light at the position of the G point is the light which is emitted to the protective cover by the dot matrix projector and is totally reflected by the protective cover; calculating the signal-to-noise ratio (SNR) of the depth imaging device according to the optical signal power S and the stray light power N; the performance of the depth imaging device is analyzed based on the signal-to-noise ratio, SNR. By analyzing the performance of the structural model of the depth imaging device by using the performance analysis method, the most suitable design parameters are found, and the elimination or reduction of the design parameters is realizedVeiling glare.

Description

性能分析方法、装置、电子设备及计算机可读存储介质Performance analysis method, device, electronic device, and computer-readable storage medium

技术领域technical field

本公开属于深度成像技术领域,具体涉及一种性能分析方法、装置、电子设备及计算机可读存储介质。The disclosure belongs to the technical field of depth imaging, and in particular relates to a performance analysis method, device, electronic equipment, and computer-readable storage medium.

背景技术Background technique

随着人们生活水平的提高,基于智能导航方案的室内机器人逐步进入人们的生活中,而3D感知系统是其最为核心的部分,用于实现SLAM(同步定位与地图绘制)、避障等功能。这里的3D感知系统多采用主动式、大广角结构光方案,实现对空间三维的重建。With the improvement of people's living standards, indoor robots based on intelligent navigation solutions gradually enter people's lives, and the 3D perception system is the core part of it, which is used to realize SLAM (synchronous positioning and mapping), obstacle avoidance and other functions. The 3D perception system here mostly adopts active, wide-angle structured light scheme to realize three-dimensional reconstruction of space.

其中,具有大广角结构光的深度成像装置包括大广角的点阵投射器、光接收相机和保护盖。但由于点阵投射器的散斑投射视场角大,在产品实际使用中,光接收相机所采集的图像常出现漏光,眩光等杂光问题,影响三维深度重建质量,这些因素将极大的限制大广角的深度成像装置在机器人上应用。Among them, the depth imaging device with large wide-angle structured light includes a large wide-angle dot matrix projector, a light-receiving camera and a protective cover. However, due to the speckle projection field angle of the dot matrix projector is large, in the actual use of the product, the images collected by the light receiving camera often have light leakage, glare and other stray light problems, which affect the quality of 3D depth reconstruction. These factors will greatly affect the Limiting the application of large wide-angle depth imaging devices on robots.

发明内容Contents of the invention

本公开的目的在于提供一种性能分析方法、装置、电子设备及计算机可读存储介质,在设计深度成像装置时,可利用此性能分析方法对深度成像装置的性能进行分析,以便找到最合适的设计参数,从而可提高深度成像装置的产品良率,改善光接收相机所采集的图像常出现漏光,眩光等杂光问题。The purpose of the present disclosure is to provide a performance analysis method, device, electronic equipment and computer-readable storage medium. When designing a depth imaging device, the performance analysis method can be used to analyze the performance of the depth imaging device in order to find the most suitable Design parameters, so as to improve the product yield of the depth imaging device, and improve the problems of light leakage, glare and other stray light that often occur in images collected by the light-receiving camera.

本公开第一方面提供了一种用于深度成像装置的性能分析方法,所述深度成像装置包括基板、功能元件及保护盖,所述功能元件设置在所述基板上,所述保护盖支撑在所述基板上,且位于所述功能元件远离所述基板的一侧,所述功能元件包括间隔排布的点阵投射器和光接收相机;其中,所述性能分析方法包括:The first aspect of the present disclosure provides a performance analysis method for a depth imaging device, the depth imaging device includes a substrate, a functional element and a protective cover, the functional element is arranged on the substrate, and the protective cover is supported on On the substrate, and located on the side of the functional element away from the substrate, the functional element includes dot matrix projectors and light-receiving cameras arranged at intervals; wherein the performance analysis method includes:

获取光接收相机所接收的反射光线的光信号功率S,所述反射光线为点阵投射器发射至待测对象、并经所述待测对象反射至所述光接收相机的光线;Obtaining the optical signal power S of the reflected light received by the light-receiving camera, the reflected light is the light emitted by the dot matrix projector to the object to be measured and reflected to the light-receiving camera by the object to be measured;

基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N,所述G点位置处杂光为点阵投射器发射至保护盖、并经所述保护盖全反射出的光线;Based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera at the G point position, calculate the stray light power N at the light receiving camera, the G The stray light at the dot position is the light emitted by the dot matrix projector to the protective cover and totally reflected by the protective cover;

根据所述光信号功率S和所述杂光功率N,计算所述深度成像装置的信噪比SNR;calculating the signal-to-noise ratio SNR of the depth imaging device according to the optical signal power S and the stray light power N;

基于所述信噪比SNR,分析所述深度成像装置的性能。Based on the signal-to-noise ratio SNR, the performance of the depth imaging device is analyzed.

在本公开的一种示例性实施例中,所述光信号功率S、所述杂光功率N、所述深度成像装置的信噪比SNR之间满足下述公式(1)的关系,其中:In an exemplary embodiment of the present disclosure, the optical signal power S, the stray light power N, and the signal-to-noise ratio SNR of the depth imaging device satisfy the relationship of the following formula (1), wherein:

Figure BDA0003778667830000021
Figure BDA0003778667830000021

所述G点位置处杂光的光强度IG、所述G点位置处杂光在所述光接收相机处所成图像的直径δ、所述光接收相机处的杂光功率N之间满足下述公式(1)的关系,其中:The light intensity I G of the stray light at the G point position, the diameter δ of the image formed by the stray light at the G point position at the light receiving camera, and the stray light power N at the light receiving camera satisfy the following The relation of formula (1), wherein:

Figure BDA0003778667830000022
Figure BDA0003778667830000022

在本公开的一种示例性实施例中,所述获取光接收相机所接收的反射光线的光信号功率S,具体包括:In an exemplary embodiment of the present disclosure, the acquiring the optical signal power S of the reflected light received by the light-receiving camera specifically includes:

获取所述光接收相机的焦距f、所述点阵投射器的光线发散角α和单点光功率Is、所述待测对象的反射率Rs、以及所述反射光线的路径D,并基于下述公式(3)计算出所述光信号功率S,其中:Obtain the focal length f of the light-receiving camera, the light divergence angle α of the dot matrix projector and the single-point light power Is, the reflectivity Rs of the object to be measured, and the path D of the reflected light, and based on the following Described formula (3) calculates described optical signal power S, wherein:

Figure BDA0003778667830000023
Figure BDA0003778667830000023

在本公开的一种示例性实施例中,在基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N之前,所述性能分析方法还包括:In an exemplary embodiment of the present disclosure, based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera at the G point position, the Before receiving the stray light power N at the camera, the performance analysis method also includes:

获取保护盖与光接收相机的光学中心之间的垂直距离d1;Obtain the vertical distance d1 between the protective cover and the optical center of the light-receiving camera;

在确定保护盖与光接收相机的光学中心之间的垂直距离d1小于预设距离值时,基于光接收相机的镜头光圈F、对焦距离FL、焦距f以及所述垂直距离d1,计算出G点位置处杂光在所述光接收相机处所成图像的直径δ,其中:When it is determined that the vertical distance d1 between the protective cover and the optical center of the light-receiving camera is less than a preset distance value, the point G is calculated based on the lens aperture F, focus distance FL, focal length f, and the vertical distance d1 of the light-receiving camera The diameter δ of the image formed by stray light at the light receiving camera at the position, where:

Figure BDA0003778667830000031
Figure BDA0003778667830000031

在本公开的一种示例性实施例中,所述预设距离值为10mm。In an exemplary embodiment of the present disclosure, the preset distance is 10 mm.

在本公开的一种示例性实施例中,在基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N之前,所述性能分析方法还包括:In an exemplary embodiment of the present disclosure, based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera at the G point position, the Before receiving the stray light power N at the camera, the performance analysis method also includes:

获取点阵投射器所发射光线中杂光的入射光强Ii、以及保护盖的衰减系数u;Obtain the incident light intensity I i of stray light in the light emitted by the dot matrix projector, and the attenuation coefficient u of the protective cover;

确定保护盖的反射率R、及保护盖内杂光反射到G点位置时的内反射次数M和单次内反射路径L,并基于下述公式(5)计算出G点位置处杂光的光强度IG,其中:Determine the reflectivity R of the protective cover, the number of internal reflections M and the single internal reflection path L when the stray light in the protective cover is reflected to the G point position, and calculate the stray light at the G point position based on the following formula (5). Light intensity I G , where:

IG=Ii*RM*exp(-uML) 公式(5)。I G =I i *R M *exp(-uML) Formula (5).

在本公开的一种示例性实施例中,所述确定保护盖的反射率R、及保护盖内杂光反射到G点位置时的内反射次数M和单次内反射路径L,具体包括:In an exemplary embodiment of the present disclosure, the determination of the reflectivity R of the protective cover, and the number of internal reflections M and the single internal reflection path L when the stray light in the protective cover is reflected to the G point position specifically includes:

基于所述点阵投射器所发射光线中杂光的入射角θi、所述功能元件与所述保护盖之间介质的折射率n1、所述保护盖的折射率n2,确定所述杂光进入所述保护盖的折射角θt以及所述保护盖的反射率R;Based on the incident angle θi of the stray light in the light emitted by the dot matrix projector, the refractive index n1 of the medium between the functional element and the protective cover, and the refractive index n2 of the protective cover, it is determined that the stray light enters The refraction angle θt of the protective cover and the reflectivity R of the protective cover;

基于所述保护盖的厚度d2以及所述保护盖的折射角θt,确定单次内反射路径L;determining a single internal reflection path L based on the thickness d2 of the protective cover and the refraction angle θt of the protective cover;

基于所述杂光的入射角θi、所述保护盖的折射角θt和厚度d2、所述点阵投射器的光学中心与所述G点位置的水平距离HG、及所述保护盖与所述光接收相机的光学中心之间的垂直距离d1,确定所述保护盖内杂光反射到G点位置时的内反射次数M,其中,所述点阵投射器的光学中心与所述光接收相机的光学中心位于同一水平线上。Based on the incident angle θi of the stray light, the refraction angle θt and the thickness d2 of the protective cover, the horizontal distance HG between the optical center of the dot matrix projector and the position of the G point, and the distance between the protective cover and the The vertical distance d1 between the optical centers of the light-receiving cameras determines the number of internal reflections M when the stray light in the protective cover is reflected to the G point position, wherein the optical center of the dot matrix projector and the light-receiving camera The optical centers of are located on the same horizontal line.

在本公开的一种示例性实施例中,所述杂光的入射角θi、所述折射率n1、所述折射率n2、所述保护盖的折射角θt、所述反射率R、所述厚度d2、所述水平距离HG、所述垂直距离d1、所述内反射次数M之间,对应满足下述公式(6)至公式(10),其中:In an exemplary embodiment of the present disclosure, the incident angle θi of the stray light, the refractive index n1, the refractive index n2, the refraction angle θt of the protective cover, the reflectivity R, the Between the thickness d2, the horizontal distance HG, the vertical distance d1, and the number of internal reflections M, the following formulas (6) to (10) are correspondingly satisfied, wherein:

n1 sinθi=n2 sinθt 公式(6);n1 sinθ i =n2 sinθ t formula (6);

R(R0,θt)=R0+(1-R0)(1-cosθt)5 公式(7);R(R 0 , θ t )=R 0 +(1-R 0 )(1-cosθ t ) 5 formula (7);

Figure BDA0003778667830000041
Figure BDA0003778667830000041

Figure BDA0003778667830000042
Figure BDA0003778667830000042

HG=d1*tanθi+M*d2*tanθt 公式(10)。HG=d1* tanθi +M*d2* tanθt Formula (10).

在本公开的一种示例性实施例中,所述获取保护盖的衰减系数u,具体包括:In an exemplary embodiment of the present disclosure, the obtaining the attenuation coefficient u of the protective cover specifically includes:

获取所述保护盖的厚度d2及其透过率T,并基于下述公式(11)计算出所述保护盖的衰减系数u,其中:Obtain the thickness d2 of the protective cover and its transmittance T, and calculate the attenuation coefficient u of the protective cover based on the following formula (11), where:

Figure BDA0003778667830000043
Figure BDA0003778667830000043

在本公开的一种示例性实施例中,所述基于所述信噪比SNR分析所述深度成像装置的性能,具体包括:In an exemplary embodiment of the present disclosure, the analyzing the performance of the depth imaging device based on the signal-to-noise ratio (SNR) specifically includes:

比较所述信噪比SNR与预设比值之间的大小关系;Comparing the size relationship between the signal-to-noise ratio SNR and the preset ratio;

在所述信噪比SNR小于所述预设比值时,确定所述深度成像装置的性能处于不良状态;When the signal-to-noise ratio SNR is less than the preset ratio, it is determined that the performance of the depth imaging device is in a bad state;

在所述深度成像装置的性能处于不良状态时,调出计算所述光信号功率S和/或所述杂光功率N时用到的至少部分参数信息,以用于指示对所述至少部分参数信息进行调整。When the performance of the depth imaging device is in a bad state, at least part of the parameter information used for calculating the optical signal power S and/or the stray light power N is called out to indicate the at least part of the parameter information The information is adjusted.

在本公开的一种示例性实施例中,所述预设比值为10dB。In an exemplary embodiment of the present disclosure, the preset ratio is 10dB.

本公开第二方面提供了一种性能分析装置,用于对深度成像装置的性能进行分析,所述深度成像装置包括基板、功能元件及保护盖,所述功能元件设置在所述基板上,所述保护盖支撑在所述基板上,且位于所述功能元件远离所述基板的一侧,所述功能元件包括间隔排布的点阵投射器和光接收相机;其中,所述性能分析装置包括:The second aspect of the present disclosure provides a performance analysis device for analyzing the performance of a depth imaging device, the depth imaging device includes a substrate, a functional element and a protective cover, the functional element is arranged on the substrate, the The protective cover is supported on the substrate and is located on the side of the functional element away from the substrate, and the functional element includes dot matrix projectors and light-receiving cameras arranged at intervals; wherein the performance analysis device includes:

获取模块,用于获取光接收相机所接收的反射光线的光信号功率S,所述反射光线为点阵投射器发射至待测对象、并经所述待测对象反射至所述光接收相机的光线;An acquisition module, configured to acquire the optical signal power S of the reflected light received by the light-receiving camera, the reflected light is emitted by the dot matrix projector to the object to be measured and reflected to the light-receiving camera by the object to be measured light;

第一计算模块,用于基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N,所述G点位置处杂光为点阵投射器发射至保护盖、并经所述保护盖全反射出的光线;The first calculation module is used to calculate the stray light at the light receiving camera based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera at the G point position. Optical power N, the stray light at the G point is the light emitted by the dot matrix projector to the protective cover and totally reflected by the protective cover;

第二计算模块,用于根据所述光信号功率S和所述杂光功率N,计算所述深度成像装置的信噪比SNR;The second calculation module is used to calculate the signal-to-noise ratio SNR of the depth imaging device according to the optical signal power S and the stray light power N;

性能分析模块,用于基于所述信噪比SNR,分析所述深度成像装置的性能。A performance analysis module, configured to analyze the performance of the depth imaging device based on the signal-to-noise ratio (SNR).

本公开第三方面提供了一种电子设备,其包括:A third aspect of the present disclosure provides an electronic device, which includes:

存储器,存储有计算机可读指令;a memory storing computer readable instructions;

处理器,读取存储器存储的计算机可读指令,以执行上述中的任一个所述的性能分析方法。The processor reads the computer-readable instructions stored in the memory to execute any one of the performance analysis methods described above.

本公开第四方面提供了一种计算机可读存储介质,其中,其上存储有计算机可读指令,当所述计算机可读指令被计算机的处理器执行时,使计算机执行上述中的任一个所述的性能分析方法。A fourth aspect of the present disclosure provides a computer-readable storage medium, wherein computer-readable instructions are stored thereon, and when the computer-readable instructions are executed by a processor of a computer, the computer is made to perform any one of the above-mentioned The performance analysis method described above.

本公开方案具有以下有益效果:The disclosed scheme has the following beneficial effects:

深度成像装置的性能采用信噪比SNR来评定,此信噪比SNR的计算与光接收相机所接收到的光信号功率S和杂光功率N相关,此光信号功率S为光接收相机所接收的正常信号,杂光功率N指的是保护盖全反射出进入到光接收相机中的光线功率,此杂光功率N为光接收相机所接收的噪音,在设计深度成像装置时,可先利用此性能分析方法对深度成像装置的结构模型的性能进行分析,基于分析结果,以便找到最合适的设计参数,避免或改善保护盖全反射出的杂光对光接收相机的影响,从而可改善光接收相机所采集的图像常出现漏光,眩光等杂光问题,继而可提高深度成像装置的良率。The performance of the depth imaging device is evaluated by the signal-to-noise ratio SNR. The calculation of the signal-to-noise ratio SNR is related to the optical signal power S and the stray light power N received by the optical receiving camera. The optical signal power S is the signal received by the optical receiving camera. The normal signal of the stray light power N refers to the light power totally reflected by the protective cover into the light-receiving camera. This stray light power N is the noise received by the light-receiving camera. When designing the depth imaging device, it can be used first This performance analysis method analyzes the performance of the structural model of the depth imaging device, based on the analysis results, in order to find the most suitable design parameters, avoid or improve the influence of the stray light totally reflected by the protective cover on the light receiving camera, so as to improve the light The images collected by the receiving camera often have light leakage, glare and other stray light problems, which can then improve the yield of the depth imaging device.

本公开的其他特性和优点将通过下面的详细描述变得显然,或部分地通过本公开的实践而习得。Other features and advantages of the present disclosure will become apparent from the following detailed description, or in part, be learned by practice of the present disclosure.

应当理解的是,以上的一般描述和后文的细节描述仅是示例性和解释性的,并不能限制本公开。It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

附图说明Description of drawings

此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本公开的实施例,并与说明书一起用于解释本公开的原理。显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure. Apparently, the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can obtain other drawings according to these drawings without creative efforts.

图1示出了本公开一实施例所述的深度成像装置的结构示意图;FIG. 1 shows a schematic structural diagram of a depth imaging device according to an embodiment of the present disclosure;

图2示出了图1所示的深度成像装置简化后的各结构之间的几何关系示意图;Fig. 2 shows a schematic diagram of the geometric relationship between the simplified structures of the depth imaging device shown in Fig. 1;

图3示出了本公开一实施例所述的性能分析方法的流程示意图;Fig. 3 shows a schematic flow chart of the performance analysis method described in an embodiment of the present disclosure;

图4示出了在保护盖的内反射次数M为4时,信噪比SNR与反射光线的路径D之间的关系示意图;4 shows a schematic diagram of the relationship between the signal-to-noise ratio SNR and the path D of reflected light when the number of internal reflections M of the protective cover is 4;

图5示出了在保护盖的内反射次数M为6时,信噪比SNR与反射光线的路径D之间的关系示意图;5 shows a schematic diagram of the relationship between the signal-to-noise ratio SNR and the path D of reflected light when the number of internal reflections M of the protective cover is 6;

图6示出本公开一实施例所述的性能分析装置的结构框图;Fig. 6 shows a structural block diagram of a performance analysis device according to an embodiment of the present disclosure;

图7示出本公开一实施例所述的电子设备的结构框图。Fig. 7 shows a structural block diagram of an electronic device according to an embodiment of the present disclosure.

具体实施方式detailed description

现在将参考附图更全面地描述示例实施方式。然而,示例实施方式能够以多种形式实施,且不应被理解为限于在此阐述的范例;相反,提供这些示例实施方式使得本公开的描述将更加全面和完整,并将示例实施方式的构思全面地传达给本领域的技术人员。附图仅为本公开的示意性图解,并非一定是按比例绘制。图中相同的附图标记表示相同或类似的部分,因而将省略对它们的重复描述。Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; Fully conveyed to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted.

此外,所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多示例实施方式中。在下面的描述中,提供许多具体细节从而给出对本公开的示例实施方式的充分理解。然而,本领域技术人员将意识到,可以实践本公开的技术方案而省略所述特定细节中的一个或更多,或者可以采用其它的方法、组元、步骤等。在其它情况下,不详细示出或描述公知结构、方法、实现或者操作以避免喧宾夺主而使得本公开的各方面变得模糊。Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of example embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, components, steps, etc. may be adopted. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the present disclosure.

附图中所示的一些方框图是功能实体,不一定必须与物理或逻辑上独立的实体相对应。可以采用软件形式来实现这些功能实体,或在一个或多个硬件模块或集成电路中实现这些功能实体,或在不同网络和/或处理器装置和/或微控制器装置中实现这些功能实体。Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software, or in one or more hardware modules or integrated circuits, or in different network and/or processor means and/or microcontroller means.

本公开实施例提供了深度成像装置,其可用于实现深度感知,其主要采用的实现模式为基于点阵投射的视觉模式。其中,本实施例的深度成像装置可为主动单目结构光或主动双目结构光,如图1所示,其核心结构均包括:包含大广角的点阵投射器101、光接收相机102和保护盖104。Embodiments of the present disclosure provide a depth imaging device, which can be used to realize depth perception, and its main implementation mode is a visual mode based on dot matrix projection. Among them, the depth imaging device of this embodiment can be active monocular structured light or active binocular structured light, as shown in Figure 1, its core structure includes: a dot matrix projector 101 including a large wide angle, a light receiving camera 102 and Protective cover 104 .

应当理解的是,在深度成像装置为主动双目结构光时,相比于其为主动单目结构光的方案,其可包括两个光接收相机102,并等间距位于点阵投射器101的相对两侧。It should be understood that, when the depth imaging device is an active binocular structured light, compared with an active monocular structured light solution, it may include two light-receiving cameras 102, which are equally spaced between the dot matrix projector 101 opposite sides.

举例而言,此点阵投射器101可为红外散斑投射器,可由红外vcsel(垂直腔面)激光器、准直透镜和衍射光学元件组成,其功能是向空间投射特定方式排列的图案,以增加待测对象的特征性和唯一性,在产品视场角设计上,其采用大广角设计,例如120°×100°,以保证机器人在近距离可实现避障功能。光接收相机102可为红外接收相机,由感光芯片CMOS,成像镜头和红外窄带滤光片所组成,其分辨率可为百万像素,如1280×1080,用于采集待测空间的红外散斑图。For example, the dot matrix projector 101 can be an infrared speckle projector, which can be composed of an infrared vcsel (vertical cavity surface) laser, a collimating lens, and a diffractive optical element. To increase the characteristics and uniqueness of the object to be tested, in the design of the product field of view, it adopts a large and wide-angle design, such as 120°×100°, to ensure that the robot can realize the obstacle avoidance function at a short distance. The light-receiving camera 102 can be an infrared receiving camera, which is composed of a photosensitive chip CMOS, an imaging lens and an infrared narrow-band filter, and its resolution can be megapixels, such as 1280×1080, for collecting infrared speckle in the space to be measured picture.

本实施例的深度成像装置通过光接收相机102采集到的待测空间的红外散斑图,计算出同名点的视差偏移,最后进行深度计算和深度补偿,便可生成高分辨率,高精度的图像深度信息。The depth imaging device of this embodiment calculates the parallax offset of the point with the same name through the infrared speckle image of the space to be measured collected by the light-receiving camera 102, and finally performs depth calculation and depth compensation to generate high-resolution, high-precision image depth information.

其中,点阵投射器101与光接收相机102整体可看作功能元件,其安装在同一基板103的同一侧上,点阵投射器101与光接收相机102的安装方式可以是螺丝固定,也可以是点胶固定方式。点阵投射器101与光接收相机102之间的中心距离称为基线距离,其大小的选择由应用场景所决定,如近距离使用时,通常采用短基线,远距离应用时,通常采用长基线。Wherein, the dot matrix projector 101 and the light receiving camera 102 as a whole can be regarded as functional elements, which are installed on the same side of the same substrate 103, and the installation mode of the dot matrix projector 101 and the light receiving camera 102 can be fixed by screws or It is a glue fixing method. The center distance between the dot matrix projector 101 and the light-receiving camera 102 is called the baseline distance, and the choice of its size is determined by the application scenario. For example, when it is used at a short distance, a short baseline is usually used, and when it is used at a long distance, a long baseline is usually used. .

保护盖104可支撑在基板103上,且位于功能元件远离基板103的一侧,即:位于点阵投射器101与光接收相机102远离基板103的一侧,应当理解的是,此保护盖104可通过环绕功能元件的支撑壳体支撑在基板103上,保护盖104位于功能元件与待测对象之间。The protective cover 104 can be supported on the substrate 103 and is located on the side of the functional element away from the substrate 103, that is, on the side of the dot matrix projector 101 and the light receiving camera 102 away from the substrate 103. It should be understood that the protective cover 104 It can be supported on the substrate 103 by a supporting shell surrounding the functional element, and the protective cover 104 is located between the functional element and the object to be measured.

在本实施例中,保护盖104主要起到防尘、防水等功能,以保证深度成像装置测量环境的稳定性。进一步地,保护盖104的表面可镀有AR增透膜,保证大部分光线可以无损的投射过去,以便于后续生成高分辨率,高精度的图像深度信息。In this embodiment, the protective cover 104 mainly functions as dustproof and waterproof, so as to ensure the stability of the measurement environment of the depth imaging device. Further, the surface of the protective cover 104 can be coated with an AR coating to ensure that most of the light can be projected there without damage, so as to facilitate subsequent generation of high-resolution and high-precision image depth information.

举例而言,本实施例的保护盖104可为玻璃结构,但不限于此,可视具体情况而定。For example, the protective cover 104 of this embodiment can be a glass structure, but it is not limited thereto, and it depends on specific conditions.

在本实施例中,点阵投射器101的光学中心与光接收相机102的光学中心可位于同一水平线上,此水平线可与基板103相互平行。其中,由于保护盖104的存在,在产品的实际使用中,点阵投射器101中视场角大的光线容易在保护盖104中进行全反射,从而产生影响光接收相机102的杂光,此杂光会影响光接收相机102所采集的图像质量,即:光接收相机102所采集的图像常出现漏光,眩光等杂光问题,继而严重影响三维深度重建质量。这些因素将严重限制深度成像装置在机器人避障领域的应用。因此,对大广角的深度成像装置的杂光问题进行模型的建立显得尤为重要,以便在产品设计时找到最合适的设计参数。In this embodiment, the optical center of the dot matrix projector 101 and the optical center of the light-receiving camera 102 may be located on the same horizontal line, and the horizontal line may be parallel to the substrate 103 . Wherein, due to the existence of the protective cover 104, in the actual use of the product, the light with a large field of view in the dot matrix projector 101 is likely to be totally reflected in the protective cover 104, thereby generating stray light affecting the light receiving camera 102. Light will affect the quality of images captured by the light-receiving camera 102, that is, the images captured by the light-receiving camera 102 often have light leakage, glare and other stray light problems, which seriously affect the quality of 3D depth reconstruction. These factors will severely limit the application of depth imaging devices in the field of robot obstacle avoidance. Therefore, it is particularly important to establish a model for the stray light problem of a large wide-angle depth imaging device, so as to find the most suitable design parameters during product design.

基于上述问题,本实施例提供了一种性能分析方法,其可用于对图1所示的深度成像装置进行性能分析,需要说明的是,深度成像装置的结构特征可参考前述内容,在此不再重复赘述。Based on the above problems, this embodiment provides a performance analysis method, which can be used to perform performance analysis on the depth imaging device shown in FIG. Repeat it again.

其中,图2示出了图1所示的深度成像装置简化后的各结构之间的几何关系示意图,图2中O1为点阵投射器101的光学中心,O2为光接收相机102的光学中心,n2为保护盖104的折射率,d2为保护盖104的厚度,d1为光学中心O1、O2与保护盖104之间的垂直距离、n1为保护盖104两侧介质(例如:空气)的折射率,在这里n1<n2;O1和O2之间的水平距离为基线,图2中模拟了一束杂光从点阵投射器101的光学中心O1出发经n1介质入射到n2介质上,杂光入射角为θi,折射角为θt,其中,图2中A、B、C、D、E、F、G点位置为杂光在保护盖104处经过的位置,图2中H点和K点位置分别为光学中心O1、O2正投影在保护盖104的位置。Wherein, Fig. 2 shows a schematic diagram of the geometric relationship between the simplified structures of the depth imaging device shown in Fig. 1, O1 is the optical center of the dot matrix projector 101 in Fig. , n2 is the refractive index of the protective cover 104, d2 is the thickness of the protective cover 104, d1 is the vertical distance between the optical center O1, O2 and the protective cover 104, n1 is the refraction of the medium (for example: air) on both sides of the protective cover 104 rate, here n1<n2; the horizontal distance between O1 and O2 is the baseline, and a bunch of stray light is simulated in Fig. 2 from the optical center O1 of the dot matrix projector 101 and incident on the n2 medium through the n1 medium, the stray light The angle of incidence is θi, and the angle of refraction is θt, where the positions of points A, B, C, D, E, F, and G in Fig. 2 are the positions where stray light passes through the protective cover 104, points H and K in Fig. 2 The positions are respectively the positions where the optical centers O1 and O2 are orthographically projected on the protective cover 104 .

具体地,结合图1和图2的内容,本实施例的性能分析方法具体可如图3所示,其包括步骤S200、步骤S202、步骤S204以及步骤S206,其中:Specifically, in combination with the contents of FIG. 1 and FIG. 2, the performance analysis method of this embodiment can be specifically shown in FIG. 3, which includes step S200, step S202, step S204, and step S206, wherein:

在步骤S200中,获取光接收相机102所接收的反射光线的光信号功率S,此处提到的反射光线为点阵投射器101发射至待测对象、并经待测对象反射至光接收相机102的光线;In step S200, the optical signal power S of the reflected light received by the light-receiving camera 102 is obtained. The reflected light mentioned here is emitted by the dot matrix projector 101 to the object to be measured and reflected to the light-receiving camera by the object to be measured. 102 rays;

在步骤S202中,基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机102处所成图像的直径δ,计算所述光接收相机102处的杂光功率N,所述G点位置处杂光为点阵投射器101发射至保护盖104、并经所述保护盖104全反射出的光线;In step S202, based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera 102 at the G point position, the stray light at the light receiving camera 102 is calculated. Optical power N, the stray light at the G point is the light emitted by the dot matrix projector 101 to the protective cover 104 and totally reflected by the protective cover 104;

在步骤S204中,根据所述光信号功率S和所述杂光功率N,计算所述深度成像装置的信噪比SNR;In step S204, according to the optical signal power S and the stray light power N, calculate the signal-to-noise ratio SNR of the depth imaging device;

在步骤S206中,基于所述信噪比SNR,分析所述深度成像装置的性能。In step S206, the performance of the depth imaging device is analyzed based on the SNR.

本实施例中,深度成像装置的性能采用信噪比SNR来评定,此信噪比SNR的计算与光接收相机102所接收到的光信号功率S和杂光功率N相关,此光信号功率S为光接收相机102所接收的正常信号,杂光功率N指的是保护盖104全反射出进入到光接收相机102中的光线功率,此杂光功率N为光接收相机102所接收的噪音,在设计深度成像装置时,可先利用此性能分析方法对深度成像装置的结构模型的性能进行分析,基于分析结果,以便找到最合适的设计参数,避免或改善保护盖104全反射出的杂光对光接收相机102的影响,从而可改善光接收相机102所采集的图像常出现漏光,眩光等杂光问题,继而可提高深度成像装置的良率。In this embodiment, the performance of the depth imaging device is evaluated by the signal-to-noise ratio SNR. The calculation of the signal-to-noise ratio SNR is related to the optical signal power S and the stray light power N received by the light-receiving camera 102. The optical signal power S It is the normal signal received by the light-receiving camera 102. The stray light power N refers to the light power that is totally reflected by the protective cover 104 and enters the light-receiving camera 102. This stray light power N is the noise received by the light-receiving camera 102, When designing a depth imaging device, this performance analysis method can be used to analyze the performance of the structural model of the depth imaging device, based on the analysis results, in order to find the most suitable design parameters to avoid or improve the stray light totally reflected by the protective cover 104 The impact on the light-receiving camera 102 can improve the problems of light leakage, glare and other stray light in images collected by the light-receiving camera 102, and then improve the yield rate of the depth imaging device.

在步骤S206中,基于所述信噪比SNR分析所述深度成像装置的性能,具体可包括:In step S206, analyzing the performance of the depth imaging device based on the signal-to-noise ratio SNR may specifically include:

步骤S2061、比较所述信噪比SNR与预设比值之间的大小关系;Step S2061, comparing the magnitude relationship between the signal-to-noise ratio SNR and a preset ratio;

步骤S2062、在所述信噪比SNR小于所述预设比值时,确定所述深度成像装置的性能处于不良状态;Step S2062, when the signal-to-noise ratio SNR is less than the preset ratio, determine that the performance of the depth imaging device is in a bad state;

步骤S2063、在所述深度成像装置的性能处于不良状态时,调出计算所述光信号功率S和/或所述杂光功率N时用到的至少部分参数信息,以用于指示对所述至少部分参数信息进行调整。Step S2063. When the performance of the depth imaging device is in a bad state, call out at least part of the parameter information used for calculating the optical signal power S and/or the stray light power N, so as to indicate the At least some parameter information is adjusted.

也就是说,在信噪比SNR小于预设比值时,则说明光接收相机102所采集的图像信息中杂光功率N占比较大,光信号功率S占比较小,光接收相机102所采集的图像信息出现了较明显的漏光,眩光等杂光问题,即:确定所述深度成像装置的性能处于不良状态,因此,需要对深度成像装置的结构模型进行调整,其中,此性能分析方法中,在确定深度成像装置的性能处于不良状态时,即:调出计算光信号功率S和/或杂光功率N时用到的至少部分参数信息,以用于指示对调出的这部分参数信息进行调整,快速构建最合适的深度成像装置的结构模型,提高深度成像装置的设计效率。That is to say, when the signal-to-noise ratio SNR is less than the preset ratio, it means that in the image information collected by the light-receiving camera 102, the stray light power N accounts for a large proportion, and the optical signal power S accounts for a small proportion. The image information has obvious light leakage, glare and other stray light problems, that is, it is determined that the performance of the depth imaging device is in a bad state. Therefore, it is necessary to adjust the structural model of the depth imaging device. In this performance analysis method, When it is determined that the performance of the depth imaging device is in a bad state, at least part of the parameter information used to calculate the optical signal power S and/or stray light power N is called out, so as to indicate that the called out part of the parameter information is performed. Adjust, quickly build the most suitable structural model of the depth imaging device, and improve the design efficiency of the depth imaging device.

其中,调出计算光信号功率S和/或杂光功率N时用到的至少部分参数信息的表现形式可为:在终端上将这些参数显示出来,操作人员可手动操作修改这些参数值,然后再去进行性能分析;或者,调出计算光信号功率S和/或杂光功率N时用到的至少部分参数信息然后基于设定程序自动调整修改这部分参数信息值,然后再去进行性能分析,直至性能分析结果满足要求,即:信噪比SNR大于或等于预设比值。Wherein, at least part of the parameter information used to calculate the optical signal power S and/or stray light power N can be called out in the form of displaying these parameters on the terminal, and the operator can manually modify these parameter values, and then Then perform performance analysis; or, call out at least part of the parameter information used to calculate the optical signal power S and/or stray light power N, then automatically adjust and modify the value of this part of parameter information based on the setting program, and then perform performance analysis , until the performance analysis result meets the requirements, that is, the signal-to-noise ratio SNR is greater than or equal to the preset ratio.

举例而言,本实施例提到的预设比值可为10dB,但不限于此,可根据实际需求调整预设比值的大小。For example, the preset ratio mentioned in this embodiment may be 10dB, but it is not limited thereto, and the preset ratio may be adjusted according to actual needs.

在步骤S206中,基于所述信噪比SNR分析所述深度成像装置的性能,具体还可包括:In step S206, analyzing the performance of the depth imaging device based on the signal-to-noise ratio SNR may specifically include:

步骤S2063、在信噪比SNR大于或等于所述预设比值时,确定所述深度成像装置的性能处于优良状态,在确定处于优良状态后,操作人员可将此时深度成像装置对应的参数信息作为最终设计参数。Step S2063. When the signal-to-noise ratio SNR is greater than or equal to the preset ratio, it is determined that the performance of the depth imaging device is in an excellent state. After determining that the performance of the depth imaging device is in an excellent state, the operator can send the parameter information corresponding to the depth imaging device at this time to as the final design parameter.

其中,为了方便操作人员获取这些最终设计参数,在步骤S206中,基于所述信噪比SNR分析所述深度成像装置的性能,具体还可包括:Wherein, in order to facilitate the operator to obtain these final design parameters, in step S206, analyzing the performance of the depth imaging device based on the signal-to-noise ratio SNR may specifically include:

步骤S2064、在确定所述深度成像装置的性能处于优良状态时,显示出计算所述光信号功率S和/或所述杂光功率N时用到的所有参数信息,操作人员可根据此参数信息设计符合要求的深度成像装置。Step S2064, when it is determined that the performance of the depth imaging device is in an excellent state, display all the parameter information used for calculating the optical signal power S and/or the stray light power N, and the operator can use this parameter information Design a depth imaging device that meets the requirements.

下面对计算所述光信号功率S、所述杂光功率N时用到的参数信息结合公式进行详细说明。The parameter information combination formula used for calculating the optical signal power S and the stray light power N will be described in detail below.

在本实施例中,所述光信号功率S、所述杂光功率N、所述深度成像装置的信噪比SNR之间满足下述公式(1)的关系,其中:In this embodiment, the optical signal power S, the stray light power N, and the signal-to-noise ratio SNR of the depth imaging device satisfy the relationship of the following formula (1), wherein:

Figure BDA0003778667830000101
Figure BDA0003778667830000101

且所述G点位置处杂光的光强度IG、所述G点位置处杂光在所述光接收相机102处所成图像的直径δ、所述光接收相机102处的杂光功率N之间满足下述公式(1)的关系,其中:And the light intensity I G of the stray light at the position of the G point, the diameter δ of the image formed by the stray light at the light receiving camera 102 at the position of the G point, and the stray light power N at the light receiving camera 102 satisfy the relationship of the following formula (1), where:

Figure BDA0003778667830000102
Figure BDA0003778667830000102

其中,在步骤S200中,获取光接收相机102所接收的反射光线的光信号功率S,具体可包括:Wherein, in step S200, acquiring the optical signal power S of the reflected light received by the light-receiving camera 102 may specifically include:

获取所述光接收相机102的焦距f、所述点阵投射器101的光线发散角α和单点光功率Is、所述待测对象的反射率Rs、以及所述反射光线的路径D,并基于下述公式(3)计算出所述光信号功率S,其中:Obtain the focal length f of the light-receiving camera 102, the light divergence angle α of the dot matrix projector 101 and the single-point light power Is, the reflectivity Rs of the object to be measured, and the path D of the reflected light, and The optical signal power S is calculated based on the following formula (3), wherein:

Figure BDA0003778667830000103
Figure BDA0003778667830000103

在本实施例中,通过采用光接收相机102的焦距f、点阵投射器101的光线发散角α和单点光功率Is、待测对象的反射率Rs、以及反射光线的路径D这些参数信息来计算出光接收相机102所获得的光信号功率S,这样相比于直接对处于使用状态的深度成像装置的光信号进行采集的方案,使得光信号功率S的值更加准确,从而使得后续分析结果更加准确,另外,这样在信噪比SNR不满足要求时,还可方便将光接收相机102的焦距f、点阵投射器101的光线发散角α和单点光功率Is、待测对象的反射率Rs、以及反射光线的路径D这些参数信息调取出来,以方便后续对这些参数信息进行调整,使得最终设计的深度成像装置可避免或改善保护盖104全反射出的杂光对光接收相机102的影响,从而可改善光接收相机102所采集的图像常出现漏光,眩光等杂光问题,继而可提高深度成像装置的良率。In this embodiment, by using the focal length f of the light-receiving camera 102, the light divergence angle α of the dot matrix projector 101 and the single-point light power Is, the reflectivity Rs of the object to be measured, and the path D of the reflected light To calculate the optical signal power S obtained by the light-receiving camera 102, compared with the scheme of directly collecting the optical signal of the depth imaging device in use, the value of the optical signal power S is more accurate, so that the subsequent analysis results In addition, when the signal-to-noise ratio SNR does not meet the requirements, it is also convenient to use the focal length f of the light-receiving camera 102, the light divergence angle α of the dot matrix projector 101, the single-point optical power Is, and the reflection of the object to be measured Ratio Rs, and the path D of the reflected light are retrieved to facilitate the subsequent adjustment of these parameter information, so that the final designed depth imaging device can avoid or improve the stray light totally reflected by the protective cover 104 on the light receiving camera 102, so that the image captured by the light-receiving camera 102 often has light leakage, glare and other stray light problems, and then the yield rate of the depth imaging device can be improved.

在步骤S202中,在基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机102处所成图像的直径δ,计算所述光接收相机102处的杂光功率N之前,所述性能分析方法还包括:In step S202, based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera 102 at the G point position, calculate the light intensity at the light receiving camera 102 Before the stray light power N, the performance analysis method also includes:

步骤S2011、获取保护盖104与光接收相机102的光学中心之间的垂直距离d1;Step S2011, obtaining the vertical distance d1 between the protective cover 104 and the optical center of the light-receiving camera 102;

步骤S2012、在确定保护盖104与光接收相机102的光学中心之间的垂直距离d1小于预设距离值时,基于光接收相机102的镜头光圈F、对焦距离FL、焦距f以及所述垂直距离d1,计算出G点位置处杂光在所述光接收相机102处所成图像的直径δ,其中:Step S2012, when it is determined that the vertical distance d1 between the protective cover 104 and the optical center of the light-receiving camera 102 is less than the preset distance value, based on the lens aperture F of the light-receiving camera 102, the focus distance FL, the focal length f and the vertical distance d1, calculate the diameter δ of the image formed by stray light at the light receiving camera 102 at the position of G point, wherein:

Figure BDA0003778667830000111
Figure BDA0003778667830000111

本实施例中,在确定保护盖104与光接收相机102的光学中心之间的垂直距离d1小于预设距离值时,G点所在位置对于光接收相机102来说属于微距,其在光接收相机102所成的图像可近似为一个弥散圆,此弥散圆的直径δ的计算公式可参考上述公式(4),也就是说,在确定保护盖104与光接收相机102的光学中心之间的垂直距离d1小于预设距离值时,弥散圆的直径δ与垂直距离d1、镜头光圈F、对焦距离FL、焦距f这些参数相关,为了调整弥散圆的直径δ大小以减小杂光功率N,避免或改善保护盖104全反射出的杂光对光接收相机102的影响,可通过调整这些参数来实现。In this embodiment, when it is determined that the vertical distance d1 between the protective cover 104 and the optical center of the light-receiving camera 102 is less than the preset distance value, the position of the G point belongs to the macro distance for the light-receiving camera 102, which is in the light-receiving camera 102. The image formed by the camera 102 can be approximated as a circle of confusion, and the calculation formula of the diameter δ of the circle of confusion can refer to the above-mentioned formula (4), that is to say, the distance between the optical center of the protective cover 104 and the light-receiving camera 102 is determined. When the vertical distance d1 is less than the preset distance value, the diameter δ of the circle of confusion is related to parameters such as the vertical distance d1, the lens aperture F, the focus distance FL, and the focal length f. In order to adjust the diameter δ of the circle of confusion to reduce the stray light power N, Avoiding or improving the impact of stray light totally reflected by the protective cover 104 on the light-receiving camera 102 can be achieved by adjusting these parameters.

举例而言,前述提到的预设距离可为10mm,但不限于此,也可根据实际情况进行调整。For example, the aforementioned preset distance may be 10 mm, but it is not limited thereto, and may also be adjusted according to actual conditions.

在步骤S202中,在基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机102处所成图像的直径δ,计算所述光接收相机102处的杂光功率N之前,所述性能分析方法还可包括:In step S202, based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera 102 at the G point position, calculate the light intensity at the light receiving camera 102 Before the stray light power N, the performance analysis method can also include:

步骤S2013、获取点阵投射器101所发射光线中杂光的入射光强Ij、以及保护盖104的衰减系数u;Step S2013, obtaining the incident light intensity I j of the stray light in the light emitted by the dot matrix projector 101 and the attenuation coefficient u of the protective cover 104;

步骤S2014、确定保护盖104的反射率R、及保护盖104内杂光反射到G点位置时的内反射次数M和单次内反射路径L,并基于下述公式(5)计算出G点位置处杂光的光强度IG,其中:Step S2014, determine the reflectivity R of the protective cover 104, and the number of internal reflections M and the single internal reflection path L when the stray light in the protective cover 104 is reflected to the G point position, and calculate the G point based on the following formula (5) The light intensity I G of the stray light at the position, where:

IG=Ii*RM*exp(-uML) 公式(5)。I G =I i *R M *exp(-uML) Formula (5).

基于上述可知,G点位置处杂光的光强度IG与入射光强Ii、衰减系数u、反射率R、内反射次数M和单次内反射路径L这些参数相关,为了调整G点位置处杂光的光强度IG大小以减小杂光功率N,避免或改善保护盖104全反射出的杂光对光接收相机102的影响,可通过调整这些参数来实现。Based on the above, it can be known that the light intensity I G of stray light at point G is related to the parameters of incident light intensity I i , attenuation coefficient u, reflectivity R, number of internal reflections M and single internal reflection path L, in order to adjust the position of G Adjusting the light intensity I G of the stray light to reduce the stray light power N, avoiding or improving the impact of the stray light totally reflected by the protective cover 104 on the light receiving camera 102 can be achieved by adjusting these parameters.

其中,以单次内反射路径L为例,对光强度的变化进行说明,例如,当保护盖104内的反射光线从图2中的B点位置到C点位置时,经过的路径为单次内反射路径L,此时C点位置的光学强度Ic与B点位置的光学强度可表示为:Ic=IB exp(-uL)。Wherein, a single internal reflection path L is taken as an example to illustrate the change of light intensity. For example, when the reflected light in the protective cover 104 is from point B to point C in FIG. In the internal reflection path L, the optical intensity I c at point C and the optical intensity at point B can be expressed as: I c = IB exp(-uL).

因此,在从A点位置(即:杂光入射位置)至G点位置(即:杂光出射位置)时,光线在保护盖104内经过了M次内反射,此时,A点位置的光强度(即:入射光强Ii)与G点位置处的光强度IG之间的关系式可参考前述公式(5)。Therefore, when going from point A (that is, the incident position of stray light) to point G (that is, the exit position of stray light), the light has been internally reflected M times in the protective cover 104. At this time, the light at point A For the relationship between the intensity (namely: the incident light intensity I i ) and the light intensity I G at the point G, reference can be made to the aforementioned formula (5).

在步骤S2014中,确定保护盖104的反射率R、及保护盖104内杂光反射到G点位置时的内反射次数M和单次内反射路径L,具体可包括:In step S2014, determine the reflectivity R of the protective cover 104, and the number of internal reflections M and the single internal reflection path L when the stray light in the protective cover 104 is reflected to the G point position, which may specifically include:

步骤S20141、基于所述点阵投射器101所发射光线中杂光的入射角θi、所述功能元件与所述保护盖104之间介质的折射率n1、所述保护盖104的折射率n2,确定所述杂光进入所述保护盖104的折射角θt以及所述保护盖104的反射率R;Step S20141, based on the incident angle θi of stray light in the light emitted by the dot matrix projector 101, the refractive index n1 of the medium between the functional element and the protective cover 104, and the refractive index n2 of the protective cover 104, Determine the refraction angle θt of the stray light entering the protective cover 104 and the reflectivity R of the protective cover 104;

步骤S20142、基于所述保护盖104的厚度d2以及所述保护盖104的折射角θt,确定单次内反射路径L;Step S20142, based on the thickness d2 of the protective cover 104 and the refraction angle θt of the protective cover 104, determine a single internal reflection path L;

步骤S20143、基于所述杂光的入射角θi、所述保护盖104的折射角θt和厚度d2、所述点阵投射器101的光学中心与所述G点位置的水平距离HG、及所述保护盖104与所述光接收相机102的光学中心之间的垂直距离d1,确定所述保护盖104内杂光反射到G点位置时的内反射次数M。Step S20143, based on the incident angle θi of the stray light, the refraction angle θt and the thickness d2 of the protective cover 104, the horizontal distance HG between the optical center of the dot matrix projector 101 and the position of the G point, and the The vertical distance d1 between the protective cover 104 and the optical center of the light-receiving camera 102 determines the number of internal reflections M when the stray light in the protective cover 104 is reflected to the G point.

在本实施例中,可通过杂光的入射角θi、折射率n1、保护盖104的折射率n2、保护盖104的厚度d2、水平距离HG及垂直距离d1这些参数可对保护盖104的反射率R、单次内反射路径L及内反射次数M进行调整,从而可实现对G点位置处杂光的光强度IG进行调整,以减小杂光功率N,避免或改善保护盖104全反射出的杂光对光接收相机102的影响。In this embodiment, the incident angle θi of stray light, the refractive index n1, the refractive index n2 of the protective cover 104, the thickness d2 of the protective cover 104, the horizontal distance HG and the vertical distance d1 can reflect the reflection of the protective cover 104. The ratio R, the single internal reflection path L and the number of internal reflections M are adjusted, so that the light intensity I G of the stray light at the G point can be adjusted to reduce the stray light power N, and avoid or improve the protective cover 104. The reflected stray light affects the light-receiving camera 102 .

具体地,所述杂光的入射角θi、所述折射率n1、所述折射率n2、所述保护盖104的折射角θt、所述反射率R、所述厚度d2、所述水平距离HG、所述垂直距离d1、所述内反射次数M之间,对应满足下述公式(6)至公式(10),其中:Specifically, the incident angle θi of the stray light, the refractive index n1, the refractive index n2, the refraction angle θt of the protective cover 104, the reflectivity R, the thickness d2, the horizontal distance HG , the vertical distance d1, and the number of internal reflections M, correspondingly satisfy the following formula (6) to formula (10), wherein:

n1 sinθi=n2 sinθt 公式(6);n1 sinθ i =n2 sinθ t formula (6);

R(R0,θt)=R0+(1-R0)(1-cosθt)5 公式(7);R(R 0 , θ t )=R 0 +(1-R 0 )(1-cosθ t ) 5 formula (7);

Figure BDA0003778667830000131
Figure BDA0003778667830000131

Figure BDA0003778667830000132
Figure BDA0003778667830000132

HG=d1*tanθi+M*d2*tanθt 公式(10)。HG=d1* tanθi +M*d2* tanθt Formula (10).

举例而言,功能元件与保护盖104之间的介质可为空气,空气的折射率n1等于1。For example, the medium between the functional element and the protective cover 104 can be air, and the refractive index n1 of the air is equal to 1.

示例地,在步骤S2013中、获取保护盖104的衰减系数u,具体可包括:For example, in step S2013, obtaining the attenuation coefficient u of the protective cover 104 may specifically include:

获取所述保护盖104的厚度d2及保护盖104的透过率T,并基于下述公式(11)计算出所述保护盖104的衰减系数u,其中:Obtain the thickness d2 of the protective cover 104 and the transmittance T of the protective cover 104, and calculate the attenuation coefficient u of the protective cover 104 based on the following formula (11), wherein:

Figure BDA0003778667830000133
Figure BDA0003778667830000133

也就是说,通过调整透过率T和保护盖104的厚度d2可对保护盖104的衰减系数u进行调整,从而可实现对G点位置处杂光的光强度IG进行调整,以减小杂光功率N,避免或改善保护盖104全反射出的杂光对光接收相机102的影响。That is to say, the attenuation coefficient u of the protective cover 104 can be adjusted by adjusting the transmittance T and the thickness d2 of the protective cover 104, so that the light intensity IG of the stray light at the G point can be adjusted to reduce The stray light power N is used to avoid or improve the influence of the stray light totally reflected by the protective cover 104 on the light-receiving camera 102 .

应当理解的是,基于公式(10)的内容,以及公式(6)对应的折射定理等,可推导出点阵投射器101的光学中心O1与光接收相机102的光学中心O2之间的水平距离HK,其中,It should be understood that, based on the content of formula (10) and the corresponding refraction theorem of formula (6), the horizontal distance between the optical center O1 of the dot matrix projector 101 and the optical center O2 of the light receiving camera 102 can be deduced HK, where

HK=2*d1*tanθi+M*d2*tanθt 公式(12)。HK=2*d1* tanθi +M*d2* tanθt Formula (12).

基于上述的内容可知,信噪比SNR计算所涉及到的参数可包括前述提到的镜头光圈F、对焦距离FL、焦距f、折射率n1、折射率n2、透过率T、垂直距离d1、厚度d2、反射率Rs、光线发散角α、单点光功率Is,反射光线的路径D、入射光强Ij、入射角度θi、水平距离HK,也就是说,为了使得信噪比SNR满足设计要求,可通过对这些参数进行调整设计,以避免或改善保护盖104全反射出的杂光对光接收相机102的影响。Based on the above content, it can be seen that the parameters involved in the calculation of the signal-to-noise ratio SNR may include the aforementioned lens aperture F, focusing distance FL, focal length f, refractive index n1, refractive index n2, transmittance T, vertical distance d1, Thickness d2, reflectivity Rs, light divergence angle α, single-point optical power Is, path D of reflected light, incident light intensity I j , incident angle θi, horizontal distance HK, that is, in order to make the signal-to-noise ratio SNR satisfy the design According to requirements, these parameters can be adjusted and designed to avoid or improve the impact of stray light totally reflected by the protective cover 104 on the light-receiving camera 102 .

以上为利用性能分析方法完成深度成像装置的方式。如下就如何在设计中进行杂光消除和减少进行举例。The above is the manner of completing the depth imaging device by using the performance analysis method. The following is an example of how to eliminate and reduce stray light in the design.

实际上,在深度成像装置产品设计时:镜头光圈F、对焦距离FL、焦距f、折射率n1、折射率n2、透过率T、垂直距离d1、厚度d2、光线发散角α、单点光功率Is都是已知值,此外,在深度成像装置产品的应用环境确定时,即:待测对象的反射率Rs也是已知值。根据前述公式(1)到(12),在给定一些给定的参数条件下,如f=1.65mm,FL=600mm,F=2,n1=1,n2=1.5,T=0.9,d1=7mm,d2=1.5mm,Rs=0.6,α=1°,Is=100uW,杂光入射光强Ii=50mW,入射角度θi=50°,可以得到SNR随反射光线的路径D的变化,具体如下:In fact, in the design of depth imaging devices: lens aperture F, focusing distance FL, focal length f, refractive index n1, refractive index n2, transmittance T, vertical distance d1, thickness d2, light divergence angle α, single point light The power Is is a known value. In addition, when the application environment of the depth imaging device product is determined, that is, the reflectivity Rs of the object to be measured is also a known value. According to the aforementioned formulas (1) to (12), given some given parameters, such as f=1.65mm, FL=600mm, F=2, n1=1, n2=1.5, T=0.9, d1= 7mm, d2=1.5mm, Rs=0.6, α=1°, Is=100uW, stray light incident light intensity Ii=50mW, incident angle θi=50°, the change of SNR with the path D of reflected light can be obtained, as follows :

如图4所示,而对于光接收相机102所采集的图像质量,当SNR≥10dB时,三维重建的性能更具有保证,因此从全反射次数M=4来看,并不能满足在使用范围内信噪比SNR规格都大于10dB,特别是远距离时,即:反射光线的路径D特别大时。显然点阵投射器101的光学中心O1和光接收相机102的光学中心O2之间的水平距离HK=20mm的长度是不够的。As shown in Figure 4, for the image quality collected by the light-receiving camera 102, when SNR≥10dB, the performance of three-dimensional reconstruction is more guaranteed, so from the perspective of the number of total reflections M=4, it cannot meet the requirements within the scope of use. The signal-to-noise ratio (SNR) specification is greater than 10dB, especially at a long distance, that is, when the path D of the reflected light is particularly large. Obviously, the horizontal distance HK=20 mm between the optical center O1 of the dot matrix projector 101 and the optical center O2 of the light-receiving camera 102 is not enough.

如图5所示,当全反射次数M=6时,可以看到反射光线的路径D在4m时,SNR仍然远大于10dB,此时点阵投射器101的光学中心O1和光接收相机102的光学中心O2之间的水平距离HK=22mm,也就是说,当点阵投射器101的光学中心O1和光接收相机102的光学中心O2之间的水平距离HK=22mm,基本上不会出现杂光问题。As shown in Figure 5, when the number of total reflections M=6, it can be seen that when the path D of the reflected light is at 4m, the SNR is still far greater than 10dB. The horizontal distance HK=22mm between the centers O2, that is to say, when the horizontal distance HK=22mm between the optical center O1 of the dot matrix projector 101 and the optical center O2 of the light-receiving camera 102, basically there will be no stray light problem .

本实施例提出了一种大广角的深度成像装置的系统建模与杂光消除方法,通过建立杂光模型,即:利用性能分析方法,用公式将应用场景的要求,和深度成像装置各模块的设计参数建立关系。设计人员可通过调整不同部件的设计参数,达到消除大广角深度成像装置的保护盖104所带来的杂光问题。在机器人导航,避障等领域可广泛应用。This embodiment proposes a system modeling and stray light elimination method for a large wide-angle depth imaging device. By establishing a stray light model, that is, using a performance analysis method, using a formula to combine the requirements of the application scene and the modules of the depth imaging device relationship with the design parameters. Designers can eliminate the stray light problem caused by the protective cover 104 of the large wide-angle depth imaging device by adjusting the design parameters of different components. It can be widely used in robot navigation, obstacle avoidance and other fields.

其中,在调整参数时,可优先对点阵投射器101的光学中心O1和光接收相机102的光学中心O2之间的水平距离HK进行调整,以调整内反射次数M,在水平距离HK的调整也不能是SNR满足设计要求,可继续调整杂光入射角度θi、保护盖104的厚度d2、透过率T等等。Wherein, when adjusting parameters, the horizontal distance HK between the optical center O1 of the dot matrix projector 101 and the optical center O2 of the light-receiving camera 102 can be adjusted preferentially to adjust the number of internal reflections M, and the adjustment of the horizontal distance HK is also It cannot be that the SNR meets the design requirements, and the incident angle θi of stray light, the thickness d2 of the protective cover 104 , the transmittance T, etc. can be continuously adjusted.

本公开实施例还提供给了一种性能分析装置,用于对前述提到的深度成像装置的性能进行分析,在此不再对深度成像装置的具体结构进行详细赘述。The embodiment of the present disclosure also provides a performance analysis device for analyzing the performance of the aforementioned depth imaging device, and the specific structure of the depth imaging device will not be described in detail here.

其中,如图6所示,性能分析装置包括:获取模块400、第一计算模块410、第二计算模块420及性能分析模块430。Wherein, as shown in FIG. 6 , the performance analysis device includes: an acquisition module 400 , a first calculation module 410 , a second calculation module 420 and a performance analysis module 430 .

结合图1、图2及图6的内容,获取模块400用于获取光接收相机102所接收的反射光线的光信号功率S,所述反射光线为点阵投射器101发射至待测对象、并经所述待测对象反射至所述光接收相机102的光线;1, FIG. 2 and FIG. 6, the acquisition module 400 is used to acquire the optical signal power S of the reflected light received by the light receiving camera 102, the reflected light is emitted to the object to be measured by the dot matrix projector 101, and light reflected by the object to be measured to the light-receiving camera 102;

第一计算模块410用于基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机102处所成图像的直径δ,计算所述光接收相机102处的杂光功率N,所述G点位置处杂光为点阵投射器101发射至保护盖104、并经所述保护盖104全反射出的光线;The first calculation module 410 is used to calculate the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera 102 at the G point position, and calculate the The stray light power N at the position of the G point is the light emitted by the dot matrix projector 101 to the protective cover 104 and totally reflected by the protective cover 104;

第二计算模块420用于根据所述光信号功率S和所述杂光功率N,计算所述深度成像装置的信噪比SNR;The second calculation module 420 is used to calculate the signal-to-noise ratio SNR of the depth imaging device according to the optical signal power S and the stray light power N;

性能分析模块430用于基于所述信噪比SNR,分析所述深度成像装置的性能。具体地,获取模块400用于获取所述光接收相机102的焦距f、所述点阵投射器101的光线发散角α和单点光功率Is、所述待测对象的反射率Rs、以及所述反射光线的路径D,并基于前述提到的公式(3)计算出所述光信号功率S。The performance analysis module 430 is used for analyzing the performance of the depth imaging device based on the SNR. Specifically, the acquiring module 400 is used to acquire the focal length f of the light-receiving camera 102, the light divergence angle α and the single-point optical power Is of the dot matrix projector 101, the reflectivity Rs of the object to be measured, and the The path D of the reflected light is calculated, and the optical signal power S is calculated based on the aforementioned formula (3).

示例地,在第一计算模块410用于基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机102处所成图像的直径δ,以计算所述光接收相机102处的杂光功率N之前,获取模块400还用于:获取保护盖104与光接收相机102的光学中心之间的垂直距离d1;在确定保护盖104与光接收相机102的光学中心之间的垂直距离d1小于预设距离值时,基于光接收相机102的镜头光圈F、对焦距离FL、焦距f以及所述垂直距离d1,计算出G点位置处杂光在所述光接收相机102处所成图像的直径δ,具体参考前述公式(4)。Exemplarily, the first calculation module 410 is used to calculate the diameter δ of the image formed by the stray light at the light-receiving camera 102 based on the light intensity I G of the stray light at the G point position and the stray light at the G point position. Before the stray light power N at the light receiving camera 102, the acquiring module 400 is also used to: acquire the vertical distance d1 between the protective cover 104 and the optical center of the light receiving camera 102; When the vertical distance d1 between the centers is less than the preset distance value, based on the lens aperture F of the light-receiving camera 102, the focus distance FL, the focal length f and the vertical distance d1, the stray light at the G point position is calculated in the light-receiving For the diameter δ of the image formed by the camera 102 , refer to the foregoing formula (4) for details.

此外,获取模块400还用于获取点阵投射器101所发射光线中杂光的入射光强Ii、以及保护盖104的衰减系数u;确定保护盖104的反射率R、及保护盖104内杂光反射到G点位置时的内反射次数M和单次内反射路径L,并基于前述公式(5)计算出G点位置处杂光的光强度IGIn addition, the obtaining module 400 is also used to obtain the incident light intensity I i of the stray light in the light emitted by the dot matrix projector 101 and the attenuation coefficient u of the protective cover 104; The number of internal reflections M and the single internal reflection path L when the stray light is reflected to the G point position, and the light intensity I G of the stray light at the G point position is calculated based on the aforementioned formula (5).

应当理解的是,此性能分析装置与前述提到的性能分析方法相对应,在此不进行一一详细赘述。It should be understood that the performance analysis device corresponds to the performance analysis method mentioned above, and will not be described in detail here.

下面参考图7来描述根据本公开实施例的电子设备50。图7显示的电子设备50仅仅是一个示例,不应对本公开实施例的功能和使用范围带来任何限制。An electronic device 50 according to an embodiment of the present disclosure is described below with reference to FIG. 7 . The electronic device 50 shown in FIG. 7 is only an example, and should not limit the functions and scope of use of the embodiments of the present disclosure.

如图7所示,电子设备50以通用计算设备的形式表现。电子设备50的组件可以包括但不限于:上述至少一个处理单元510、上述至少一个存储单元520、连接不同系统组件(包括存储单元520和处理单元510)的总线530。As shown in FIG. 7, electronic device 50 takes the form of a general-purpose computing device. Components of the electronic device 50 may include but not limited to: at least one processing unit 510 , at least one storage unit 520 , and a bus 530 connecting different system components (including the storage unit 520 and the processing unit 510 ).

其中,所述存储单元存储有程序代码,所述程序代码可以被所述处理单元510执行,使得所述处理单元510执行本说明书上述示例性方法的描述部分中描述的根据本发明各种示例性实施方式的步骤。例如,所述处理单元510可以执行前述性能分析方法中的各个步骤。Wherein, the storage unit stores program codes, and the program codes can be executed by the processing unit 510, so that the processing unit 510 executes various exemplary methods according to the present invention described in the description part of the above-mentioned exemplary methods in this specification. Implementation steps. For example, the processing unit 510 may execute various steps in the foregoing performance analysis method.

存储单元520可以包括易失性存储单元形式的可读介质,例如随机存取存储单元(RAM)5201和/或高速缓存存储单元5202,还可以进一步包括只读存储单元(ROM)5203。The storage unit 520 may include a readable medium in the form of a volatile storage unit, such as a random access storage unit (RAM) 5201 and/or a cache storage unit 5202 , and may further include a read-only storage unit (ROM) 5203 .

存储单元520还可以包括具有一组(至少一个)程序模块5205的程序/实用工具5204,这样的程序模块5205包括但不限于:操作系统、一个或者多个应用程序、其它程序模块以及程序数据,这些示例中的每一个或某种组合中可能包括网络环境的实现。Storage unit 520 may also include a program/utility 5204 having a set (at least one) of program modules 5205, such program modules 5205 including but not limited to: an operating system, one or more application programs, other program modules, and program data, Implementations of networked environments may be included in each or some combination of these examples.

总线530可以为表示几类总线结构中的一种或多种,包括存储单元总线或者存储单元控制器、外围总线、图形加速端口、处理单元或者使用多种总线结构中的任意总线结构的局域总线。Bus 530 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local area using any of a variety of bus structures. bus.

电子设备50也可以与一个或多个外部设备600(例如键盘、指向设备、蓝牙设备等)通信,还可与一个或者多个使得用户能与该电子设备50交互的设备通信,和/或与使得该电子设备50能与一个或多个其它计算设备进行通信的任何设备(例如路由器、调制解调器等等)通信。这种通信可以通过输入/输出(I/O)接口550进行。输入/输出(I/O)接口550与显示单元540相连。并且,电子设备50还可以通过网络适配器560与一个或者多个网络(例如局域网(LAN),广域网(WAN)和/或公共网络,例如因特网)通信。如图所示,网络适配器560通过总线530与电子设备50的其它模块通信。应当明白,尽管图中未示出,可以结合电子设备50使用其它硬件和/或软件模块,包括但不限于:微代码、设备驱动器、冗余处理单元、外部磁盘驱动阵列、RAID系统、磁带驱动器以及数据备份存储系统等。The electronic device 50 can also communicate with one or more external devices 600 (such as keyboards, pointing devices, Bluetooth devices, etc.), and can also communicate with one or more devices that enable the user to interact with the electronic device 50, and/or communicate with Any device (eg, router, modem, etc.) that enables the electronic device 50 to communicate with one or more other computing devices. Such communication may occur through input/output (I/O) interface 550 . An input/output (I/O) interface 550 is connected to the display unit 540 . Moreover, the electronic device 50 can also communicate with one or more networks (such as a local area network (LAN), a wide area network (WAN) and/or a public network such as the Internet) through the network adapter 560 . As shown, network adapter 560 communicates with other modules of electronic device 50 via bus 530 . It should be appreciated that although not shown, other hardware and/or software modules may be used in conjunction with electronic device 50, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives And data backup storage system, etc.

通过以上的实施方式的描述,本领域的技术人员易于理解,这里描述的示例实施方式可以通过软件实现,也可以通过软件结合必要的硬件的方式来实现。因此,根据本公开实施方式的技术方案可以以软件产品的形式体现出来,该软件产品可以存储在一个非易失性存储介质(可以是CD-ROM,U盘,移动硬盘等)中或网络上,包括若干指令以使得一台计算设备(可以是个人计算机、服务器、终端装置、或者网络设备等)执行根据本公开实施方式的方法。Through the description of the above implementations, those skilled in the art can easily understand that the example implementations described here can be implemented by software, or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of the present disclosure can be embodied in the form of software products, and the software products can be stored in a non-volatile storage medium (which can be CD-ROM, U disk, mobile hard disk, etc.) or on the network , including several instructions to make a computing device (which may be a personal computer, a server, a terminal device, or a network device, etc.) execute the method according to the embodiments of the present disclosure.

在本公开的示例性实施例中,还提供了一种计算机可读存储介质,其上存储有计算机可读指令,当所述计算机可读指令被计算机的处理器执行时,使计算机执行上述方法实施例部分描述的方法。In an exemplary embodiment of the present disclosure, there is also provided a computer-readable storage medium, on which computer-readable instructions are stored, and when the computer-readable instructions are executed by a processor of a computer, the computer is made to perform the above method Methods described in the Examples section.

根据本公开的一个实施例,还提供了一种用于实现上述方法实施例中的方法的程序产品,其可以采用便携式紧凑盘只读存储器(CD-ROM)并包括程序代码,并可以在终端设备,例如个人电脑上运行。然而,本发明的程序产品不限于此,在本文件中,可读存储介质可以是任何包含或存储程序的有形介质,该程序可以被指令执行系统、装置或者器件使用或者与其结合使用。According to an embodiment of the present disclosure, there is also provided a program product for implementing the method in the above method embodiment, which may adopt a portable compact disk read-only memory (CD-ROM) and include program codes, and may be used in a terminal devices, such as personal computers. However, the program product of the present invention is not limited thereto. In this document, a readable storage medium may be any tangible medium containing or storing a program, and the program may be used by or in combination with an instruction execution system, apparatus or device.

所述程序产品可以采用一个或多个可读介质的任意组合。可读介质可以是可读信号介质或者可读存储介质。可读存储介质例如可以为但不限于电、磁、光、电磁、红外线、或半导体的系统、装置或器件,或者任意以上的组合。可读存储介质的更具体的例子(非穷举的列表)包括:具有一个或多个导线的电连接、便携式盘、硬盘、随机存取存储器(RAM)、只读存储器(ROM)、可擦式可编程只读存储器(EPROM或闪存)、光纤、便携式紧凑盘只读存储器(CD-ROM)、光存储器件、磁存储器件、或者上述的任意合适的组合。The program product may reside on any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or any combination thereof. More specific examples (non-exhaustive list) of readable storage media include: electrical connection with one or more conductors, portable disk, hard disk, random access memory (RAM), read only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

计算机可读信号介质可以包括在基带中或者作为载波一部分传播的数据信号,其中承载了可读程序代码。这种传播的数据信号可以采用多种形式,包括但不限于电磁信号、光信号或上述的任意合适的组合。可读信号介质还可以是可读存储介质以外的任何可读介质,该可读介质可以发送、传播或者传输用于由指令执行系统、装置或者器件使用或者与其结合使用的程序。A computer readable signal medium may include a data signal carrying readable program code in baseband or as part of a carrier wave. Such propagated data signals may take many forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the foregoing. A readable signal medium may also be any readable medium other than a readable storage medium that can transmit, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device.

可读介质上包含的程序代码可以用任何适当的介质传输,包括但不限于无线、有线、光缆、RF等等,或者上述的任意合适的组合。Program code embodied on a readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

可以以一种或多种程序设计语言的任意组合来编写用于执行本发明操作的程序代码,所述程序设计语言包括面向对象的程序设计语言—诸如JAVA、C++等,还包括常规的过程式程序设计语言—诸如“C”语言或类似的程序设计语言。程序代码可以完全地在用户计算设备上执行、部分地在用户设备上执行、作为一个独立的软件包执行、部分在用户计算设备上部分在远程计算设备上执行、或者完全在远程计算设备或服务器上执行。在涉及远程计算设备的情形中,远程计算设备可以通过任意种类的网络,包括局域网(LAN)或广域网(WAN),连接到用户计算设备,或者,可以连接到外部计算设备(例如利用因特网服务提供商来通过因特网连接)。Program code for performing the operations of the present invention may be written in any combination of one or more programming languages, including object-oriented programming languages—such as JAVA, C++, etc., as well as conventional procedural programming languages. Programming language - such as "C" or a similar programming language. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server to execute. In cases involving a remote computing device, the remote computing device may be connected to the user computing device through any kind of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computing device (e.g., using an Internet service provider). business to connect via the Internet).

应当注意,尽管在上文详细描述中提及了用于动作执行的设备的若干模块或者单元,但是这种划分并非强制性的。实际上,根据本公开的实施方式,上文描述的两个或更多模块或者单元的特征和功能可以在一个模块或者单元中具体化。反之,上文描述的一个模块或者单元的特征和功能可以进一步划分为由多个模块或者单元来具体化。It should be noted that although several modules or units of the device for action execution are mentioned in the above detailed description, this division is not mandatory. Actually, according to the embodiment of the present disclosure, the features and functions of two or more modules or units described above may be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided to be embodied by a plurality of modules or units.

此外,尽管在附图中以特定顺序描述了本公开中方法的各个步骤,但是,这并非要求或者暗示必须按照该特定顺序来执行这些步骤,或是必须执行全部所示的步骤才能实现期望的结果。附加的或备选的,可以省略某些步骤,将多个步骤合并为一个步骤执行,以及/或者将一个步骤分解为多个步骤执行等。In addition, although steps of the methods of the present disclosure are depicted in the drawings in a particular order, there is no requirement or implication that the steps must be performed in that particular order, or that all illustrated steps must be performed to achieve the desired result. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step for execution, and/or one step may be decomposed into multiple steps for execution, etc.

通过以上的实施方式的描述,本领域的技术人员易于理解,这里描述的示例实施方式可以通过软件实现,也可以通过软件结合必要的硬件的方式来实现。因此,根据本公开实施方式的技术方案可以以软件产品的形式体现出来,该软件产品可以存储在一个非易失性存储介质(可以是CD-ROM,U盘,移动硬盘等)中或网络上,包括若干指令以使得一台计算设备(可以是个人计算机、服务器、移动终端、或者网络设备等)执行根据本公开实施方式的方法。Through the description of the above implementations, those skilled in the art can easily understand that the example implementations described here can be implemented by software, or can be implemented by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of the present disclosure can be embodied in the form of software products, and the software products can be stored in a non-volatile storage medium (which can be CD-ROM, U disk, mobile hard disk, etc.) or on the network , including several instructions to make a computing device (which may be a personal computer, a server, a mobile terminal, or a network device, etc.) execute the method according to the embodiments of the present disclosure.

本领域技术人员在考虑说明书及实践这里公开的发明后,将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本公开的真正范围和精神由所附的权利要求指出。Other embodiments of the present disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with the true scope and spirit of the disclosure indicated by the appended claims.

Claims (14)

1.一种用于深度成像装置的性能分析方法,所述深度成像装置包括基板、功能元件及保护盖,所述功能元件设置在所述基板上,所述保护盖支撑在所述基板上,且位于所述功能元件远离所述基板的一侧,所述功能元件包括间隔排布的点阵投射器和光接收相机;其特征在于,所述性能分析方法包括:1. A performance analysis method for a depth imaging device, the depth imaging device comprising a substrate, a functional element and a protective cover, the functional element is arranged on the substrate, and the protective cover is supported on the substrate, And located on the side of the functional element away from the substrate, the functional element includes dot matrix projectors and light-receiving cameras arranged at intervals; it is characterized in that the performance analysis method includes: 获取光接收相机所接收的反射光线的光信号功率S,所述反射光线为点阵投射器发射至待测对象、并经所述待测对象反射至所述光接收相机的光线;Obtaining the optical signal power S of the reflected light received by the light-receiving camera, the reflected light is the light emitted by the dot matrix projector to the object to be measured and reflected to the light-receiving camera by the object to be measured; 基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N,所述G点位置处杂光为点阵投射器发射至保护盖、并经所述保护盖全反射出的光线;Based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera at the G point position, calculate the stray light power N at the light receiving camera, the G The stray light at the dot position is the light emitted by the dot matrix projector to the protective cover and totally reflected by the protective cover; 根据所述光信号功率S和所述杂光功率N,计算所述深度成像装置的信噪比SNR;calculating the signal-to-noise ratio SNR of the depth imaging device according to the optical signal power S and the stray light power N; 基于所述信噪比SNR,分析所述深度成像装置的性能。Based on the signal-to-noise ratio SNR, the performance of the depth imaging device is analyzed. 2.根据权利要求1所述的性能分析方法,其特征在于,2. performance analysis method according to claim 1, is characterized in that, 所述光信号功率S、所述杂光功率N、所述深度成像装置的信噪比SNR之间满足下述公式(1)的关系,其中:The relationship between the optical signal power S, the stray light power N, and the signal-to-noise ratio SNR of the depth imaging device satisfies the following formula (1), wherein:
Figure FDA0003778667820000011
Figure FDA0003778667820000011
所述G点位置处杂光的光强度IG、所述G点位置处杂光在所述光接收相机处所成图像的直径δ、所述光接收相机处的杂光功率N之间满足下述公式(1)的关系,其中:The light intensity I G of the stray light at the G point position, the diameter δ of the image formed by the stray light at the G point position at the light receiving camera, and the stray light power N at the light receiving camera satisfy the following The relation of formula (1), wherein:
Figure FDA0003778667820000012
Figure FDA0003778667820000012
3.根据权利要求1所述的性能分析方法,其特征在于,所述获取光接收相机所接收的反射光线的光信号功率S,具体包括:3. The performance analysis method according to claim 1, wherein said obtaining the optical signal power S of the reflected light received by the light-receiving camera specifically comprises: 获取所述光接收相机的焦距f、所述点阵投射器的光线发散角α和单点光功率Is、所述待测对象的反射率Rs、以及所述反射光线的路径D,并基于下述公式(3)计算出所述光信号功率S,其中:Obtain the focal length f of the light-receiving camera, the light divergence angle α of the dot matrix projector and the single-point light power Is, the reflectivity Rs of the object to be measured, and the path D of the reflected light, and based on the following Described formula (3) calculates described optical signal power S, wherein:
Figure FDA0003778667820000021
Figure FDA0003778667820000021
4.根据权利要求1所述的性能分析方法,其特征在于,在基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N之前,所述性能分析方法还包括:4. performance analysis method according to claim 1, is characterized in that, based on the light intensity I G of stray light at the G point position and the diameter of the image formed by stray light at the light receiving camera at the G point position δ, before calculating the stray light power N at the light receiving camera, the performance analysis method also includes: 获取保护盖与光接收相机的光学中心之间的垂直距离d1;Obtain the vertical distance d1 between the protective cover and the optical center of the light-receiving camera; 在确定保护盖与光接收相机的光学中心之间的垂直距离d1小于预设距离值时,基于光接收相机的镜头光圈F、对焦距离FL、焦距f以及所述垂直距离d1,计算出G点位置处杂光在所述光接收相机处所成图像的直径δ,其中:When it is determined that the vertical distance d1 between the protective cover and the optical center of the light-receiving camera is less than a preset distance value, the point G is calculated based on the lens aperture F, focus distance FL, focal length f, and the vertical distance d1 of the light-receiving camera The diameter δ of the image formed by stray light at the light receiving camera at the position, where:
Figure FDA0003778667820000022
Figure FDA0003778667820000022
5.根据权利要求4所述的性能分析方法,其特征在于,所述预设距离值为10mm。5. The performance analysis method according to claim 4, wherein the preset distance value is 10mm. 6.根据权利要求1所述的性能分析方法,其特征在于,在基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N之前,所述性能分析方法还包括:6. performance analysis method according to claim 1, is characterized in that, based on the light intensity I of stray light at G point position and the diameter of the image formed by stray light at said light receiving camera at said G point position δ, before calculating the stray light power N at the light receiving camera, the performance analysis method also includes: 获取点阵投射器所发射光线中杂光的入射光强Ii、以及保护盖的衰减系数u;Obtain the incident light intensity I i of stray light in the light emitted by the dot matrix projector, and the attenuation coefficient u of the protective cover; 确定保护盖的反射率R、及保护盖内杂光反射到G点位置时的内反射次数M和单次内反射路径L,并基于下述公式(5)计算出G点位置处杂光的光强度IG,其中:Determine the reflectivity R of the protective cover, the number of internal reflections M and the single internal reflection path L when the stray light in the protective cover is reflected to the G point position, and calculate the stray light at the G point position based on the following formula (5). Light intensity I G , where: IG=Ii*RM*exp(-uML)公式(5)。I G =I i *R M *exp(-uML) formula (5). 7.根据权利要求6所述的性能分析方法,其特征在于,所述确定保护盖的反射率R、及保护盖内杂光反射到G点位置时的内反射次数M和单次内反射路径L,具体包括:7. The performance analysis method according to claim 6, characterized in that, the determination of the reflectivity R of the protective cover, and the number of internal reflections M and the single internal reflection path when the stray light in the protective cover is reflected to the G point position L, specifically including: 基于所述点阵投射器所发射光线中杂光的入射角θi、所述功能元件与所述保护盖之间介质的折射率n1、所述保护盖的折射率n2,确定所述杂光进入所述保护盖的折射角θt以及所述保护盖的反射率R;Based on the incident angle θi of the stray light in the light emitted by the dot matrix projector, the refractive index n1 of the medium between the functional element and the protective cover, and the refractive index n2 of the protective cover, it is determined that the stray light enters The refraction angle θt of the protective cover and the reflectivity R of the protective cover; 基于所述保护盖的厚度d2以及所述保护盖的折射角θt,确定单次内反射路径L;determining a single internal reflection path L based on the thickness d2 of the protective cover and the refraction angle θt of the protective cover; 基于所述杂光的入射角θi、所述保护盖的折射角θt和厚度d2、所述点阵投射器的光学中心与所述G点位置的水平距离HG、及所述保护盖与所述光接收相机的光学中心之间的垂直距离d1,确定所述保护盖内杂光反射到G点位置时的内反射次数M,其中,所述点阵投射器的光学中心与所述光接收相机的光学中心位于同一水平线上。Based on the incident angle θi of the stray light, the refraction angle θt and the thickness d2 of the protective cover, the horizontal distance HG between the optical center of the dot matrix projector and the position of the G point, and the distance between the protective cover and the The vertical distance d1 between the optical centers of the light-receiving cameras determines the number of internal reflections M when the stray light in the protective cover is reflected to the G point position, wherein the optical center of the dot matrix projector and the light-receiving camera The optical centers of are located on the same horizontal line. 8.根据权利要求7所述的性能分析方法,其特征在于,8. The performance analysis method according to claim 7, characterized in that, 所述杂光的入射角θi、所述折射率n1、所述折射率n2、所述保护盖的折射角θt、所述反射率R、所述厚度d2、所述水平距离HG、所述垂直距离d1、所述内反射次数M之间,对应满足下述公式(6)至公式(10),其中:The incident angle θi of the stray light, the refractive index n1, the refractive index n2, the refraction angle θt of the protective cover, the reflectivity R, the thickness d2, the horizontal distance HG, the vertical Between the distance d1 and the number of internal reflections M, the following formulas (6) to (10) are correspondingly satisfied, wherein: n1sinθi=n2sinθt公式(6); n1sinθi = n2sinθt formula (6); R(R0t)=R0+(1-R0)(1-cosθt)5公式(7);R(R 0t )=R 0 +(1-R 0 )(1-cosθ t ) 5 formula (7);
Figure FDA0003778667820000031
Figure FDA0003778667820000031
Figure FDA0003778667820000032
Figure FDA0003778667820000032
HG=d1*tanθi+M*d2*tanθt公式(10)。HG=d1* tanθi +M*d2* tanθt Formula (10).
9.根据权利要求7所述的性能分析方法,其特征在于,所述获取保护盖的衰减系数u,具体包括:9. The performance analysis method according to claim 7, wherein said obtaining the attenuation coefficient u of the protective cover specifically comprises: 获取所述保护盖的厚度d2及其透过率T,并基于下述公式(11)计算出所述保护盖的衰减系数u,其中:Obtain the thickness d2 of the protective cover and its transmittance T, and calculate the attenuation coefficient u of the protective cover based on the following formula (11), where:
Figure FDA0003778667820000033
Figure FDA0003778667820000033
10.根据权利要求1至9中任一项所述的性能分析方法,其特征在于,所述基于所述信噪比SNR分析所述深度成像装置的性能,具体包括:10. The performance analysis method according to any one of claims 1 to 9, wherein the analyzing the performance of the depth imaging device based on the signal-to-noise ratio (SNR) specifically comprises: 比较所述信噪比SNR与预设比值之间的大小关系;Comparing the size relationship between the signal-to-noise ratio SNR and the preset ratio; 在所述信噪比SNR小于所述预设比值时,确定所述深度成像装置的性能处于不良状态;When the signal-to-noise ratio SNR is less than the preset ratio, it is determined that the performance of the depth imaging device is in a bad state; 在所述深度成像装置的性能处于不良状态时,调出计算所述光信号功率S和/或所述杂光功率N时用到的至少部分参数信息,以用于指示对所述至少部分参数信息进行调整。When the performance of the depth imaging device is in a bad state, at least part of the parameter information used for calculating the optical signal power S and/or the stray light power N is called out to indicate the at least part of the parameter information The information is adjusted. 11.根据权利要求10所述的性能分析方法,其特征在于,所述预设比值为10dB。11. The performance analysis method according to claim 10, wherein the preset ratio is 10dB. 12.一种性能分析装置,用于对深度成像装置的性能进行分析,所述深度成像装置包括基板、功能元件及保护盖,所述功能元件设置在所述基板上,所述保护盖支撑在所述基板上,且位于所述功能元件远离所述基板的一侧,所述功能元件包括间隔排布的点阵投射器和光接收相机;其特征在于,所述性能分析装置包括:12. A performance analysis device for analyzing the performance of a depth imaging device, the depth imaging device comprising a substrate, a functional element and a protective cover, the functional element is arranged on the substrate, and the protective cover is supported on On the substrate, and located on the side of the functional element away from the substrate, the functional element includes dot matrix projectors and light-receiving cameras arranged at intervals; it is characterized in that the performance analysis device includes: 获取模块,用于获取光接收相机所接收的反射光线的光信号功率S,所述反射光线为点阵投射器发射至待测对象、并经所述待测对象反射至所述光接收相机的光线;An acquisition module, configured to acquire the optical signal power S of the reflected light received by the light-receiving camera, the reflected light is emitted by the dot matrix projector to the object to be measured and reflected to the light-receiving camera by the object to be measured light; 第一计算模块,用于基于G点位置处杂光的光强度IG以及所述G点位置处杂光在所述光接收相机处所成图像的直径δ,计算所述光接收相机处的杂光功率N,所述G点位置处杂光为点阵投射器发射至保护盖、并经所述保护盖全反射出的光线;The first calculation module is used to calculate the stray light at the light receiving camera based on the light intensity I G of the stray light at the G point position and the diameter δ of the image formed by the stray light at the light receiving camera at the G point position. Optical power N, the stray light at the G point is the light emitted by the dot matrix projector to the protective cover and totally reflected by the protective cover; 第二计算模块,用于根据所述光信号功率S和所述杂光功率N,计算所述深度成像装置的信噪比SNR;The second calculation module is used to calculate the signal-to-noise ratio SNR of the depth imaging device according to the optical signal power S and the stray light power N; 性能分析模块,用于基于所述信噪比SNR,分析所述深度成像装置的性能。A performance analysis module, configured to analyze the performance of the depth imaging device based on the signal-to-noise ratio (SNR). 13.一种电子设备,其特征在于,包括:13. An electronic device, characterized in that it comprises: 存储器,存储有计算机可读指令;a memory storing computer readable instructions; 处理器,读取存储器存储的计算机可读指令,以执行权利要求1-11中的任一个所述的性能分析方法。The processor reads the computer-readable instructions stored in the memory to execute the performance analysis method described in any one of claims 1-11. 14.一种计算机可读存储介质,其特征在于,其上存储有计算机可读指令,当所述计算机可读指令被计算机的处理器执行时,使计算机执行权利要求1-11中的任一个所述的性能分析方法。14. A computer-readable storage medium, characterized in that computer-readable instructions are stored thereon, and when the computer-readable instructions are executed by a processor of a computer, the computer is made to perform any one of claims 1-11 The performance analysis method described.
CN202210929890.9A 2022-08-02 2022-08-02 Performance analysis method, device, electronic device and computer readable storage medium Active CN115442590B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210929890.9A CN115442590B (en) 2022-08-02 2022-08-02 Performance analysis method, device, electronic device and computer readable storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210929890.9A CN115442590B (en) 2022-08-02 2022-08-02 Performance analysis method, device, electronic device and computer readable storage medium

Publications (2)

Publication Number Publication Date
CN115442590A true CN115442590A (en) 2022-12-06
CN115442590B CN115442590B (en) 2024-11-22

Family

ID=84242018

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210929890.9A Active CN115442590B (en) 2022-08-02 2022-08-02 Performance analysis method, device, electronic device and computer readable storage medium

Country Status (1)

Country Link
CN (1) CN115442590B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116337225A (en) * 2023-05-06 2023-06-27 武汉量子技术研究院 Method and experimental device for improving photoelectric signal detection signal-to-noise ratio based on vortex rotation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108881691A (en) * 2018-07-13 2018-11-23 Oppo广东移动通信有限公司 Control method, microprocessor, computer-readable storage medium, and computer device
WO2021218196A1 (en) * 2020-04-29 2021-11-04 奥比中光科技集团股份有限公司 Depth imaging method and apparatus, and computer readable storage medium
CN113822920A (en) * 2021-09-29 2021-12-21 北京的卢深视科技有限公司 Method for acquiring depth information by structured light camera, electronic equipment and storage medium

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108881691A (en) * 2018-07-13 2018-11-23 Oppo广东移动通信有限公司 Control method, microprocessor, computer-readable storage medium, and computer device
WO2021218196A1 (en) * 2020-04-29 2021-11-04 奥比中光科技集团股份有限公司 Depth imaging method and apparatus, and computer readable storage medium
CN113822920A (en) * 2021-09-29 2021-12-21 北京的卢深视科技有限公司 Method for acquiring depth information by structured light camera, electronic equipment and storage medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116337225A (en) * 2023-05-06 2023-06-27 武汉量子技术研究院 Method and experimental device for improving photoelectric signal detection signal-to-noise ratio based on vortex rotation
CN116337225B (en) * 2023-05-06 2023-08-15 武汉量子技术研究院 Method and experimental device for improving photoelectric signal detection signal-to-noise ratio based on vortex rotation

Also Published As

Publication number Publication date
CN115442590B (en) 2024-11-22

Similar Documents

Publication Publication Date Title
CN114252984B (en) Optical system for tele camera
US10616706B1 (en) Estimating room acoustic properties using microphone arrays
KR20180032058A (en) Optical lens assembly and electronic apparatus having the same
CN104049339A (en) Projection optical system and projector apparatus
CN103308282B (en) High-efficiency measuring system and method for transmittance of reflective telescopic system
CN103149016A (en) Stray light detection method and system for optical system to be detected
CN115442590A (en) Performance analysis method and device, electronic equipment and computer readable storage medium
WO2022089113A1 (en) Lens assembly, electronic device, depth detection method, and storage medium
CN111290100A (en) Projection lens and projection imaging system
CN103954358A (en) Imaging spectrometer
CN102289056B (en) Front objective lens with large field of view and large relative aperture for imaging spectrograph
US7119903B1 (en) Method and system for measuring differential scattering of light off of sample surfaces
TW201516458A (en) Projection lens
CN107743219B (en) Determination method and device, projector, the optical projection system of user&#39;s finger location information
JP5867577B2 (en) Image projection device
CN105717612B (en) Full reflection zooming short-throw projection optical system based on object space telecentricity
CN219736775U (en) An off-axis reflective optical monitoring device
JP5578420B2 (en) Optical system for image projection device and image projection device
CN203882076U (en) Projector and its projection lens
CN207067512U (en) Projector and projection lens thereof
CN105092031A (en) Infrared high spectral imaging system with cold shield
CN108267850A (en) A kind of reflective optical system and method for reflection
CN204808360U (en) Optical prism module
CN211528809U (en) Lens, imaging system and electronic equipment
CN113138066B (en) External distortion detection method, system and platform thereof and electronic equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 231283 Taohua Science and Technology Innovation Valley, Intersection of Mingchuan Road and Yonghe Road, Taohua Town, Feixi County, Hefei City, Anhui Province

Patentee after: Hefei Xinming Intelligent Technology Co.,Ltd.

Country or region after: China

Address before: 214400 Room 301, No. 99, Chengjiang East Road, Jiangyin City, Wuxi City, Jiangsu Province

Patentee before: Yinniu Microelectronics (Wuxi) Co.,Ltd.

Country or region before: China