CN115441179A - Sensor, antenna assembly and wireless earphone - Google Patents

Sensor, antenna assembly and wireless earphone Download PDF

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Publication number
CN115441179A
CN115441179A CN202110624747.4A CN202110624747A CN115441179A CN 115441179 A CN115441179 A CN 115441179A CN 202110624747 A CN202110624747 A CN 202110624747A CN 115441179 A CN115441179 A CN 115441179A
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CN
China
Prior art keywords
antenna
sensor
circuit
circuit layer
touch
Prior art date
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Pending
Application number
CN202110624747.4A
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Chinese (zh)
Inventor
彭远
石宪庆
黄健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wanmo Acoustics Co ltd
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Wanmo Acoustics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wanmo Acoustics Co ltd filed Critical Wanmo Acoustics Co ltd
Priority to CN202110624747.4A priority Critical patent/CN115441179A/en
Publication of CN115441179A publication Critical patent/CN115441179A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/005—Measuring force or stress, in general by electrical means and not provided for in G01L1/06 - G01L1/22
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/273—Adaptation for carrying or wearing by persons or animals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups

Abstract

The application provides a wireless headset and sensor and antenna module thereof, sensor and antenna module include antenna and sensor, still include: the multiplexing mainboard comprises a first circuit layer and a second circuit layer which are arranged at intervals along the thickness direction of the multiplexing mainboard, the first circuit layer is provided with an antenna radiation body of an antenna and a radio frequency circuit, the antenna radiation body is used for sending and receiving electromagnetic waves, and the radio frequency circuit is used for transmitting and processing radio frequency signals; the second circuit layer is provided with an induction element of the sensor, the induction element is used for induction operation, and a corresponding induction signal is obtained according to the operation; the antenna radiation body and the sensing element are at least partially overlapped along the thickness direction of the multiplexing main plate, and the antenna radiation body serves as a stratum of the sensor. Therefore, the antenna and the sensor can multiplex the space of the area where the antenna radiation body is located, and the occupied space of the sensor and the antenna assembly is saved.

Description

Sensor, antenna assembly and wireless earphone
Technical Field
The application relates to the technical field of electronic circuits, in particular to a sensor, an antenna assembly and a wireless headset.
Background
With the progress of science and technology, the development of wireless bluetooth headsets is in a big outbreak state, and the market demand is increased rapidly. In order to meet the continuously-improved user experience demand of users, the wireless bluetooth headset gradually tends to be miniaturized and multifunctional, such as pressure sensing, active noise reduction, environmental noise reduction, bone voiceprint recognition, voice recognition and the like.
At present, in a main wireless bluetooth headset product, because the sensing element of the bluetooth headset conflicts with the structural position of an antenna easily, that is, the antenna position of the bluetooth headset needs to be placed on the surface position of an ear, and the sensing element also needs to be placed on the surface position of the ear. When the size of the handle is forcibly reduced to miniaturize the bluetooth headset, the size space occupied by the antenna is only sacrificed, and the performance of the antenna is also reduced, so that the user may frequently jam and disconnect the bluetooth headset, the separation distance of the mobile phone headset is short, and signals are unstable. The main solution to this problem at this stage is to increase the length of the ear handle until the sensing element and the antenna can be placed at the same time, but this will result in a larger size of the earphone and a poor user experience.
Disclosure of Invention
For the technical problem who solves the existence, this application provides a can effectively ensure to reduce wireless earphone and sensor and antenna module of earphone overall dimension on the basis of the original performance of earphone.
In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:
a sensor and antenna assembly, includes antenna and sensor, still includes:
the multiplexing mainboard comprises a first circuit layer and a second circuit layer which are arranged at intervals along the thickness direction of the multiplexing mainboard, the first circuit layer is provided with an antenna radiation body of the antenna and a radio frequency circuit, the antenna radiation body is used for sending and receiving electromagnetic waves, and the radio frequency circuit is used for transmitting and processing radio frequency signals; the second circuit layer is provided with an induction element of the sensor, the induction element is used for induction operation, and a corresponding induction signal is obtained according to the operation; the thickness direction of the multiplexing main plate is the thickness direction of the multiplexing main plate;
the antenna radiation body and the induction element are at least partially overlapped along the thickness direction of the multiplexing main plate, and the antenna radiation body serves as a stratum of the sensor.
Further, the sensor and the antenna assembly further comprise a main circuit board which is parallel to the multiplexing main board and is arranged at an interval, and the antenna further comprises an antenna chip arranged on the main circuit board and an antenna elastic pin connected between a feed point on the antenna radiation body and the touch chip.
Further, the radio frequency signal is a high frequency signal, the antenna transmits and receives electromagnetic waves through the antenna radiation body, and the radio frequency circuit transmits and processes the radio frequency signal, including: the radio frequency circuit converts the electromagnetic waves into radio frequency signals and transmits the radio frequency signals to the antenna chip through the antenna elastic pins, and the antenna chip processes the radio frequency signals; the sensing signal is a low-frequency signal, and the sensor further comprises a sensing chip arranged on the second circuit layer; the induction element sends the induction signal to an induction chip; and after the induction chip acquires the induction signal, determining a corresponding operation instruction according to the induction signal.
Further, the sensor is a touch sensor, the sensing element comprises two or more touch pads arranged on the second circuit layer at intervals along a direction parallel to the multiplexing main board, and an included angle is formed between the direction parallel to the multiplexing main board and the thickness direction of the multiplexing main board.
Furthermore, the first circuit layer is arranged on one side close to the main circuit board, and the first circuit layer is arranged on one side far away from the main circuit board.
Furthermore, the sensor also comprises a touch chip arranged on the second circuit layer, and the touch pad is electrically connected with the touch chip; or the main circuit board is parallel to the multiplexing main board and arranged at intervals, a touch chip is arranged on the main circuit board, and the touch gasket is electrically connected with the touch chip.
Furthermore, the sensor and the antenna assembly further comprise a touch isolation circuit connected with the touch pad, and the touch isolation circuit comprises isolation inductors connected with the touch pad in a one-to-one correspondence manner.
Furthermore, the antenna is a planar inverted-F antenna, and the planar inverted-F antenna further includes an antenna feed point disposed on the first circuit layer and close to the antenna radiation body.
Further, the sensor is a pressure sensor, and the pressure sensor comprises a pressure detection unit arranged on the second circuit layer.
Further, the sensor and antenna assembly further includes a high frequency filter circuit connected to the radio frequency circuit and/or a low frequency filter circuit connected to the inductive element.
Further, the sensor and antenna assembly further comprises a first isolation circuit connected to the radio frequency circuit, the first isolation circuit comprising a first capacitor and a second capacitor connected in series, and a common mode inductor connected between a junction between the first capacitor and the second capacitor and ground; and/or the presence of a gas in the gas,
the inductor further comprises a second isolation circuit connected with the induction element, wherein the second isolation circuit comprises a first inductor and a second inductor which are connected in series, and a filter capacitor connected between a junction between the first inductor and the second inductor and the ground.
Furthermore, the radio frequency circuit comprises an antenna matching circuit and a filter circuit, wherein the antenna matching circuit comprises a third inductor, and a third capacitor and a fourth capacitor which are respectively connected between two opposite ends of the third inductor and the ground; the filter circuit comprises a fourth inductor connected with the third inductor in series and a fifth capacitor connected between one end of the fourth inductor and the ground.
Further, the sensor and the antenna assembly further comprise a system ground circuit, and the system ground circuit comprises an isolation capacitor connected between the antenna radiation body and the ground.
Furthermore, the multiplexing main board is a flexible circuit board, and the first circuit layer and the second circuit layer are respectively flexible circuit layers; or the multiplexing mainboard is a printed circuit board, and the first circuit layer and the second circuit layer are respectively arranged on two opposite sides of the printed circuit board along the thickness direction of the multiplexing mainboard.
Embodiments of the present application further provide a wireless headset including an earbud portion and an ear stem portion, the wireless headset including a sensor and an antenna assembly as described in any of the above embodiments, the sensor and the antenna assembly being disposed in the ear stem portion.
Furthermore, the sensor is a touch sensor, the second circuit layer is arranged on one side of the handle part close to the outside, and the first circuit layer is arranged on one side facing the inside of the handle part; or, the sensor is a pressure sensor, one of the first circuit layer and the second circuit layer is arranged on one side of the handle part close to the outside, and the other one is arranged on one side facing the inside of the handle part.
The embodiment of the application provides a wireless headset and sensor and antenna module thereof, through setting up the multiplexing mainboard of constituteing by double-deck circuit layer, be relative respectively on first circuit layer and the second circuit layer of multiplexing mainboard about being with the antenna radiation body of antenna and the response element of sensor, the antenna radiation body can act as the stratum of sensor, so, antenna and sensor can multiplex the space in antenna radiation body place region, have practiced thrift the whole occupation space of sensor and antenna, can optimize the space layout in the wireless headset who contains this sensor and antenna module to can reduce the whole size of headset effectively on the basis of guaranteeing the original performance of wireless headset.
Drawings
FIG. 1 is a schematic view of a sensor and antenna assembly according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the relative positions of sensing elements and the radiating body of the antenna in the sensor and antenna assembly according to an embodiment of the present invention;
FIG. 3 is a schematic circuit diagram of a sensor and antenna assembly according to an embodiment of the present application;
FIG. 4 is a schematic diagram of the relative position of the sensing element and the radiating body of the antenna in another embodiment of the present application;
FIG. 5 is a schematic circuit diagram of a sensor and antenna assembly according to another embodiment of the present application;
FIG. 6 is a schematic circuit diagram of an RF circuit according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a wireless headset according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of a wireless headset according to another embodiment of the present application;
FIG. 9 is a schematic view of a sensor and antenna assembly according to an embodiment of the present application.
Detailed Description
The technical solution of the present application is further described in detail with reference to the drawings and specific embodiments of the specification.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of implementations of the present application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified.
In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1, a schematic diagram of a sensor and an antenna assembly provided in an embodiment of the present application is shown, where the sensor and the antenna assembly include an antenna and a sensor, and further include: the multiplexing main board 13 comprises a first circuit layer 131 and a second circuit layer 132 which are arranged at intervals along the thickness direction of the multiplexing main board, the first circuit layer 13 is provided with an antenna radiation body 111 and a radio frequency circuit 112 of an antenna, the antenna radiation body 111 is used for sending and receiving electromagnetic waves, and the radio frequency circuit 112 is used for transmitting and processing radio frequency signals; the second circuit layer 132 is provided with a sensing element 14 of a sensor, and the sensing element 14 is used for sensing operation and obtaining a corresponding sensing signal according to the operation; the antenna radiating body 111 and the sensing element 14 at least partially overlap in the thickness direction of the multiplexing master, and the antenna radiating body 111 serves as a ground layer of the sensor. Here, the antenna radiation body 111 and the sensing element 14 at least partially overlap in the thickness direction of the multiplexing main board may be: the area occupied by the sensing element 14 on the circuit layer 132 and the area occupied by the antenna radiation body 111 on the first circuit layer 131 are arranged to overlap at least a part of the area in the thickness direction of the multiplexing circuit board.
The sensor and the antenna assembly provided by the embodiment have the advantages that the multiplexing main board formed by the double circuit layers is arranged, the antenna radiation body of the antenna and the sensing element of the sensor are at least partially overlapped on the first circuit layer and the second circuit layer of the multiplexing main board along the thickness direction of the multiplexing main board, and the antenna radiation body can serve as the stratum of the sensor, so that the antenna and the sensor can multiplex the space of the area where the antenna radiation body is located, the overall occupied space of the sensor and the antenna is saved, the spatial layout in a wireless earphone comprising the sensor and the antenna assembly can be optimized, and the overall size of the earphone can be effectively reduced on the basis of ensuring the original performance of the wireless earphone.
The sensor and the antenna assembly can be applied to various electronic devices such as computers, mobile phones, earphones and the like which need to be provided with the sensor and the antenna at the same time. The antenna can be a Bluetooth antenna and comprises a transmitting end and a receiving end which are used for transmitting and receiving electromagnetic wave signals respectively. The sensor is a detection device, can detect the information to be measured, and can convert the detected information into an electric signal or other information in a required form according to a certain rule for output, so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like. In this embodiment of the application, the sensor may be various sensors for sensing user operations and correspondingly converting designated user operations into setting control instructions for the electronic device, and different sensors may be used for sensing different external input signals, such as pressure, touch, and the like, and may include a sensing element for acquiring the external input signals and a sensing chip for converting the external input signals acquired by the sensing element into corresponding electrical signals. The multiplexing main board is composed of two circuit layers, in some embodiments, the multiplexing main board is a flexible circuit board, and the first circuit layer and the second circuit layer are respectively flexible circuit layers; in some embodiments, the multiplexing motherboard is a printed circuit board, and the first circuit layer and the second circuit layer are respectively disposed on two opposite sides of the printed circuit board. The multiplexing mainboard is as antenna radiation body and the common carrier of induction element in the sensor in the antenna, and antenna radiation body can act as the stratum of sensor, can reduce the whole occupation space of sensor and antenna effectively.
Optionally, the sensor and antenna assembly further includes a main circuit board 15 parallel to the multiplexing main board 13 and disposed at an interval, and the antenna further includes an antenna chip 114 disposed on the main circuit board 15 and an antenna elastic pin 115 connected between a feeding point on the antenna radiation body 111 and the antenna chip 114. The Antenna may be a monopole Antenna or a PIFA (Planar Inverted-F Antenna), and taking the Antenna as the PIFA as an example, the feeding point of the Antenna is disposed at a side close to the Antenna radiation body 111, so that the multiplexing motherboard may form a support by using the original Antenna spring foot in the Antenna, thereby eliminating an additional support structure provided for the Antenna or the sensor circuit layer, which can meet the performance requirements of the Antenna and the sensor, simplify the overall structure integrating the Antenna and the sensor, facilitate the multiplexing of the Antenna in space, and reduce the occupied area of the Antenna in the length direction.
Optionally, the radio frequency signal is a high frequency signal, the antenna sends and receives electromagnetic waves through the antenna radiation body, and the radio frequency circuit transmits and processes the radio frequency signal, including: the radio frequency circuit converts the electromagnetic waves into the radio frequency signals and transmits the radio frequency signals to the antenna chip through the antenna elastic pins, and the antenna chip processes the radio frequency signals; the induction signal is a low-frequency signal, and the sensor further comprises an induction chip arranged on the second circuit layer; the induction element sends the induction signal to an induction chip; and after the induction chip acquires the induction signal, determining a corresponding operation instruction according to the induction signal. Therefore, the specific implementation process of the antenna for receiving and transmitting the electromagnetic wave signals and the induction operation of the induction element is completed.
Optionally, the sensor is a touch sensor, and the sensing element 14 includes two or more touch pads arranged on the second circuit layer at intervals along a direction parallel to the multiplexing motherboard. Referring to fig. 2, in an alternative embodiment, the touch pads include a first touch pad a, a second touch pad b, and a third touch pad c arranged at equal intervals along a direction parallel to the multiplexing main board.
Optionally, the first circuit layer 131 is disposed on a side close to the main circuit board 15, and the second circuit layer 132 is disposed on a side far from the main circuit board 15. When the sensor is a touch sensor, the second circuit layer 132 of the sensing element provided with the touch sensor is disposed on a side away from the main circuit board 15, so that the touch sensor can sense external input signals through a plurality of touch pads, and the sensing precision is improved.
Optionally, the sensor further includes a touch chip disposed on the second circuit layer, and the touch pad is electrically connected to the touch chip. Taking the sensor as a touch sensor as an example, the touch chip (touch IC) is directly disposed on the second circuit layer, so as to facilitate the electrical connection between the touch pad and the touch chip, and the touch pad collects a touch operation signal generated by a user corresponding to a touch operation of the sensing area and sends the touch operation signal to the touch chip, so as to correspondingly determine different designated operation types. Here, the touch chip includes a plurality of touch output ends, the touch pads are respectively connected to the touch output ends of the corresponding chips, the touch pads are used for sensing a touch input operation type of a user, the plurality of touch pads are arranged at intervals, and different designated operation types, such as an upward sliding operation, a downward sliding operation, a single-point key operation, and the like, can be correspondingly determined according to touch operation information sensed by each touch pad. Optionally, the touch chip of the sensor may also be disposed on the main circuit board 15, and the touch pad is electrically connected to the touch chip. Still taking the sensor as an example of a touch sensor, the touch chip is disposed on the main circuit board, the touch pads are disposed on the second circuit layer 132 of the multiplexing motherboard 13 at intervals along a direction parallel to the multiplexing motherboard, the touch pads are electrically connected to corresponding touch output ends on the touch chip through lines, and the touch pads transmit collected touch operation information of the user on the sensing area to the touch chip, so as to correspondingly determine different specified operation types.
Optionally, the sensor and the antenna assembly further include a touch isolation circuit connected to the touch pad, where the touch isolation circuit includes isolation inductors connected to the touch pads in a one-to-one correspondence. The touch isolation circuit comprises a plurality of inductors which are respectively in one-to-one correspondence with the touch pads and are connected in parallel, and interference of the antenna to the sensor can be filtered or reduced. In an alternative embodiment, referring to fig. 3, the number of the touch pads is three, and the touch isolation circuit includes inductors L5, L6, and L7 respectively connected to the three touch pads a, b, and c in a one-to-one correspondence.
Optionally, the antenna is a planar inverted F antenna, and the planar inverted F antenna further includes an antenna feed point disposed on the first circuit layer and close to the antenna radiation body. The antenna adopts the planar inverted-F antenna, so that the transceiving performance of the antenna is enhanced, and the user experience effect is improved.
In an alternative embodiment, the sensor is a pressure sensor, and a pressure detection unit of the pressure sensor as a sensing element may be directly provided on the second circuit layer. The pressure is through gathering pressure sensor's deformation, and when its atress produced elastic deformation or tensile deformation, its bulk resistance can take place to show the change, and pressure detection unit (sensor) locates the second circuit layer, can directly gather the pressure signal that the user corresponds the production to the touch operation in sensing area to corresponding different appointed operation types of confirming, if long press the operation, short press the operation, double click operation etc. can promote sensor detection accuracy. In the case of a pressure sensor, the stacking order of the first circuit layer 131 and the second circuit layer 132 of the multiplexing motherboard 13 can be interchanged arbitrarily, for example, the second circuit layer provided with the pressure detection unit can be disposed on the upper side of the multiplexing motherboard 13 far from the main circuit board 15, and the first circuit layer provided with the antenna radiation body can be disposed on the lower side of the multiplexing motherboard 13 near the main circuit board 15; alternatively, the second circuit layer with the pressure detection unit may be disposed on the lower side of the multiplexing main board 13 close to the main circuit board 15, and the first circuit layer with the antenna radiation body may be disposed on the upper side of the multiplexing main board 13 far from the main circuit board 15.
In this embodiment, the antenna radiation body 11 is provided with an antenna feed point, and the antenna feed point is disposed on a side of the antenna radiation body relatively far away from the pressure-sensitive differential output end on the pressure detection unit. Referring to fig. 4, the sensor is a pressure sensor, and the pressure detection unit includes a pressure-sensing power supply pin, a pressure-sensing differential output positive electrode, a pressure-sensing differential output negative electrode, and a pressure-sensing ground electrode; the first circuit layer provided with the antenna radiation body 11 is opposite to the second circuit layer provided with the pressure detection unit from top to bottom, and the antenna feed point is arranged on one side, away from the pressure-sensitive differential output end on the pressure detection unit, of the antenna radiation body 11, so that the interference of the pressure sensor on the receiving and transmitting electromagnetic waves of the antenna can be reduced.
Optionally, the sensor and antenna assembly further includes a high frequency filter circuit connected to the radio frequency circuit, and/or a low frequency filter circuit connected to the inductive element. The sensor takes the antenna radiation body as a reference ground, the antenna and the sensor multiplex the area where the antenna radiation body is located, the antenna works in a high-frequency band, and the sensor works in a low-frequency band, so that the antenna and the sensor can work in different frequency bands respectively. The antenna is provided with a high-frequency filter circuit connected with the radio-frequency circuit, and the sensor is provided with a low-frequency filter circuit connected with the induction element, so that the interference of low-frequency signals on the antenna and the interference of high-frequency signals on the sensor can be eliminated or reduced respectively, and the performances of the antenna and the sensor are further ensured. Referring to fig. 5, the high frequency filter circuit may be a high frequency filter patch HPF connected to the radio frequency circuit, and the low frequency filter circuit may be a low frequency filter patch LPF connected to the inductive element.
Optionally, the sensor and antenna assembly further includes a first isolation circuit connected to the radio frequency circuit, the first isolation circuit including a first capacitor and a second capacitor connected in series, and a common mode inductor connected between a junction between the first capacitor and the second capacitor and ground; and/or the sensor and antenna assembly further comprises a second isolation circuit connected to the inductive element, the second isolation circuit comprising a first inductor and a second inductor connected in series, and a filter capacitor connected between a junction between the first inductor and the second inductor and ground. Referring to fig. 5 again, taking the sensor as a pressure sensor and the sensing chip in the pressure sensor as a pressure-sensitive signal processing chip as an example, the first isolation circuit includes a first capacitor C1 and a second capacitor C2 connected in series, and a common-mode inductor L8 connected between a node between the first capacitor C1 and the second capacitor C2 and ground, the first isolation circuit is arranged between the bluetooth antenna and the bluetooth chip radio-frequency signal under the condition of adopting series capacitors and parallel inductors, the capacitance values of the first capacitor C1 and the second capacitor C2 may be respectively 10PF, the first isolation circuit is arranged on the radio-frequency signal wiring in series to connect a high-frequency low-impedance capacitor and then in parallel to connect a low-frequency to ground inductor, so as to provide a conducting path for the radio-frequency signal and suppress the pressure-sensitive signal. The second isolation circuit comprises a first inductor L1 and a second inductor L2 which are connected in series, and a filter capacitor C7 which is connected between a node between the first inductor L1 and the second inductor L2 and the ground, the series inductors are connected in parallel with the capacitors to be arranged between the pressure detection unit and the pressure sensing signal processing chip, the isolation circuit is connected in series with the inductors with low frequency resistance and high frequency resistance on the pressure sensing signal wiring, and is connected in parallel with the capacitors with high frequency to the ground, a conduction path is provided for the pressure sensing signal, and the radio frequency signal is inhibited. Thus, the interference between the antenna and the sensor pair can be eliminated or reduced, and the performances of the antenna and the sensor can be ensured to be extremely exerted.
Optionally, referring to fig. 6, the radio frequency circuit includes an antenna matching circuit and a filter circuit, and the antenna matching circuit includes a third inductor L3, and a third capacitor C3 and a fourth capacitor C4 respectively connected between two opposite ends of the third inductor L3 and ground. The antenna is a bluetooth antenna, the antenna matching circuit includes a third inductor L3, and a third capacitor C3 and a fourth capacitor C4 respectively connected between two opposite ends of the third inductor L3 and the ground, and the third inductor L3, the third capacitor C3, and the fourth capacitor C4 form an n-type circuit for adjusting the impedance matching condition between the antenna and the circuit on the motherboard. Optionally, the filter circuit includes a fourth inductor L4 connected in series with the third inductor L3, and a fifth capacitor C5 connected between one end of the fourth inductor L4 and ground. Still take bluetooth antenna as an example for the antenna, the filter circuit includes the fourth inductance L4 with third inductance L3 series connection and connect in fifth electric capacity C5 between the one end of fourth inductance L4 and ground, third inductance L3, fourth inductance L4 and fifth electric capacity C5 form the L type circuit for noise wave or other higher harmonics outside the BT frequency channel that comes out from the main control touch chip of filtering. Therefore, the radio frequency circuit can ensure that the antenna radiation body accurately receives and transmits radio frequency signals.
Optionally, as shown in fig. 3 and fig. 6, the sensor and antenna assembly further includes a system ground circuit, and the system ground circuit includes an isolation capacitor C6 connected between the antenna radiation body 61 and the ground. The system ground return circuit comprises an isolation capacitor connected between the antenna radiation body and the ground, the radiation body of the antenna can be used as a ground layer of the induction element to be connected with the ground on the main circuit board as a whole, and a corresponding series potential component is added on the connected circuit, so that the aim of reducing the influence and the interference of the sensor on the antenna can be further fulfilled.
Optionally, in the sensor and the antenna assembly provided in the embodiment of the present application, the multiplexing main board 13 may be a flexible circuit board. When the multiplexing mainboard is a flexible circuit board, the first circuit layer and the second circuit layer are respectively flexible circuit layers. The flexible main circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, so that the high reliability of the multiplexing main board in the process of multiplexing the antenna and the sensor in a limited space can be ensured.
Optionally, in the sensor and the antenna assembly provided in the embodiment of the present application, the multiplexing main board 13 may also be a main circuit board. When the multiplexing motherboard 13 is a printed circuit board, the first circuit layer and the second circuit layer are respectively disposed on two opposite sides of the printed circuit board.
In another aspect of the present embodiment, referring to fig. 7, the wireless headset 70 includes an earplug portion 701 and a handle portion 702, and the sensor and antenna assembly is disposed in the handle portion 702. It should be noted that the sensor and the antenna assembly may be the sensor and the antenna assembly described in any of the foregoing embodiments of the present application, and are not described herein again.
In order to make a more comprehensive understanding of the wireless headset employing the sensor and the antenna assembly in the embodiment of the present application, the following description will take the antenna in the sensor and the antenna assembly as a planar inverted F-shaped antenna, the sensor as a touch sensor, the multiplexing main board 13 as a dual-layer flexible circuit board, and the sensing element 14 as a touch pad 141.
As shown in fig. 7, the planar inverted F antenna is configured to transceive radio frequency signals; a touch sensor configured to receive a sensing signal; the double-layer flexible circuit board comprises a first circuit layer 131 and a second circuit layer 132 which are arranged at intervals along the thickness direction of the double-layer flexible circuit board, the second circuit layer 132 is arranged on one side of the handle part 702 close to the outside, and the first circuit layer 131 is arranged on one side facing the inside of the handle part 702; the first circuit layer 131 is provided with an antenna radiation body of the planar inverted F antenna and a radio frequency circuit, and the radio frequency circuit is used for controlling the radiation body of the planar inverted F antenna to receive and transmit radio frequency signals; the second circuit layer 132 is provided with a plurality of touch pads 141, and in the embodiment of the present application, the touch pads 141 are three touch pads as an example. Referring to fig. 2 again, the three touch pads are a first touch pad a, a second touch pad b, and a third touch pad c, respectively, and the three touch pads are used for sensing an operation instruction of a user for a touch area on the handle portion 702 directly above the first touch pad a, the second touch pad b, and the third touch pad c, and obtaining a matched sensing signal according to the operation instruction. For example, the first touch pad a, the second touch pad b, and the third touch pad c may respectively correspond to a volume control key, and when a user makes continuous touches along the length direction of the ear handle portion 202 and directly above the first touch pad a, the second touch pad b, and the third touch pad c, the volume may be increased or decreased. Here, the planar inverted F antenna radiating body and the first, second, and third touch pads a, b, and c are disposed opposite to each other in the vertical direction, and the planar inverted F antenna radiating body serves as a ground layer of the touch sensor.
It should be noted that the antenna in the embodiment of the present application may also be a monopole antenna. However, when the antenna is a planar inverted F antenna, referring to fig. 2 again, the planar inverted F antenna needs to be provided with a feeding point F at the same time at the position of the antenna feeding point e, and the feeding point F is used to be connected to the ground lead out from the main circuit board. Generally, when the antenna is designed as a planar inverted F antenna, the feeding point e of the planar inverted F antenna is designed at a position closer to the antenna radiation body, so that the performance of the planar inverted F antenna for receiving and transmitting radio frequency signals is the best. That is, the monopole antenna has only one feeding point, and the planar inverted F antenna includes two feeding points, a feeding point e and a feeding point F. Here, regardless of the planar inverted F antenna or the monopole antenna, structural multiplexing between the antenna and the sensor can be achieved, and independent use of the sliding touch sensor and the planar inverted F antenna can be satisfied.
Optionally, main circuit board 15 with double-deck flexible main circuit board is parallel and the interval sets up, the planar inverted-F antenna still include the planar inverted-F antenna chip and connect in feed point e on the antenna radiation body 111 of the planar inverted-F antenna with antenna between the planar inverted-F antenna chip plays foot 115, the antenna chip 114 and the antenna of the planar inverted-F antenna play foot 115 all locate on main circuit board 15, still be equipped with touch chip on main circuit board 15, touch pad 141 with the touch chip electricity is connected.
Please refer to fig. 3 again, which is a schematic circuit diagram of a sensor and an antenna assembly, wherein three touch pads a, b, and c are respectively connected to the touch chip by three L5, L6, and L7 inductive elements for isolating high frequency signals and ensuring accurate transmission of the detection signals of the touch sensor. Here, the radio frequency circuit 112 of the planar inverted F antenna includes an antenna matching circuit and a filter circuit, where the antenna matching circuit employs an n-type isolation circuit, the filter circuit employs an L-type isolation circuit, and the n-type isolation circuit includes a third inductor L3, and a third capacitor C3 and a fourth capacitor C4 respectively connected between two opposite ends of the third inductor L3 and the ground, and is configured to adjust impedance matching between the planar inverted F antenna and a circuit on the multiplexing motherboard 13; the L-shaped isolation circuit comprises a fourth inductor L4 connected with the third inductor L3 in series and a fifth capacitor C5 connected between one end of the fourth inductor L4 and the ground, and is used for filtering noise waves or other higher harmonics which come out of the antenna chip and are outside an exclusive frequency band. The inductance values of the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, and the seventh inductor L7 may be 1nH, and the capacitance values of C3 and C4 may be 10pF. Here, the planar inverted F antenna and touch sensor composite structure further includes a system ground return circuit, the system ground return circuit includes an isolation capacitor C6 connected between the antenna radiation body and the ground, and a capacitance value interval of the isolation capacitor C6 is 5pF-22pF.
In the embodiment of the application, the antenna radiation body 111 of the planar inverted F antenna and the touch pads 141 are integrated on two sides of the same double-layer flexible main circuit board, and the antenna radiation body can be used as a stratum of the sensor, so that the antenna and the sensor can multiplex the space of the area where the antenna radiation body is located, and the overall occupied space of the sensor and the antenna is saved; moreover, by arranging the isolation circuit and the filter circuit between the antenna radiation body 111 of the planar inverted-F antenna and the antenna chip 114 of the planar inverted-F antenna and arranging the isolation inductor between the touch chip and the touch pad 141, the performance of the antenna can be effectively ensured, and the performance requirements of the corresponding functions of the sliding touch wireless earphone can be met.
In order to provide a more general understanding of the wireless headset employing the sensor and antenna assembly of the present application, please refer to fig. 8, which is a schematic diagram of another embodiment of a wireless headset 70 including an earbud portion 701 and an ear stem portion 702, the sensor and antenna assembly being disposed in the ear stem portion 702. In this embodiment, the antenna in the sensor and the antenna assembly is a bluetooth antenna, the sensor is a pressure sensor for example, the multiplexing motherboard 13 is a double-layer flexible circuit board, the sensing element 14 is a pressure sensing detection unit 142, and the touch chip is a sensor and an antenna assembly formed by a pressure sensing signal processing chip.
Referring to fig. 8, in the embodiment of the present application, the bluetooth antenna of the sensor and the antenna assembly in the wireless headset is configured to receive and transmit radio frequency signals; a pressure sensor configured to receive a sensing signal; the double-layer flexible circuit board comprises a first circuit layer 131 and a second circuit layer 132 which are arranged at intervals in the thickness direction of the circuit board, wherein the first circuit layer 131 is arranged on one side, close to the outside, of the handle part 702, and the second circuit layer 132 is arranged on one side facing the inside of the handle part 702; the first circuit layer 131 is provided with an antenna radiation body 111 and a radio frequency circuit 112 of the bluetooth antenna, and the radio frequency circuit 112 is configured to control the antenna radiation body 111 of the bluetooth antenna to receive and transmit radio frequency signals; the second circuit layer 132 is provided with a pressure detection unit 142. The pressure detection unit 142 is configured to detect an operation instruction corresponding to the position of the wireless headset 70, and obtain a matched sensing signal according to the operation instruction; here, the antenna radiation body 111 of the bluetooth antenna and the pressure detection unit 142 are disposed opposite to each other in the vertical direction, and the antenna radiation body 111 of the bluetooth antenna is a ground layer of the pressure sensor. Similarly, the sensor and the antenna module in the wireless headset in the embodiment of the present application further include a main circuit board 15 parallel to the double-layer flexible main circuit board and arranged at an interval, the main circuit board 15 is provided with an antenna chip 111 of the bluetooth antenna and an antenna elastic pin 115 connected to a feed point on the radiation body 111 of the bluetooth antenna and between the bluetooth antenna chips, the main circuit board 15 is further provided with a pressure-sensitive signal processing chip, and the pressure detection unit 142 is electrically connected to the pressure-sensitive signal processing chip.
Referring to fig. 9, the antenna radiation body 111 of the bluetooth antenna is connected to the antenna chip 114 of the bluetooth antenna, and the pressure detection unit 142 is electrically connected to the pressure-sensitive signal processing chip.
Referring to fig. 5 again, a specific structure diagram of the antenna radiation body 111 of the bluetooth antenna is connected to the antenna chip 114 of the bluetooth antenna, and the pressure detection unit 142 is electrically connected to the pressure-sensitive signal processing chip. Here, the antenna radiation body 111 of the bluetooth antenna is connected to the antenna chip 114 of the bluetooth antenna through the radio frequency circuit 112 and the first isolation circuit; referring to fig. 6, the radio frequency circuit 112 of the bluetooth antenna includes an antenna matching circuit and a filter circuit, where the antenna matching circuit is an n-type isolation circuit, the filter circuit is an L-type isolation circuit, and the n-type isolation circuit includes a third inductor L3, and a third capacitor C3 and a fourth capacitor C4 that are respectively connected between two opposite ends of the third inductor L3 and the ground; the L-shaped isolation circuit comprises a fourth inductor L4 connected with the third inductor L3 in series and a fifth capacitor C5 connected between one end of the fourth inductor L4 and the ground. The inductance values of the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, and the seventh inductor L7 may be 1nH, and the capacitance values of the third capacitor C3 and the fourth capacitor C4 may be 10pF. The first isolation circuit comprises a first capacitor C1 and a second capacitor C2 which are connected in series, and a common-mode inductor L8 which is connected between a node between the first capacitor C1 and the second capacitor C2 and the ground; the selectable range of the capacitance values of the first capacitor C1 and the second capacitor C2 is 5pF-22pF, and the selectable range of the common-mode inductance value is 8.2nH-72nH; preferably, the value of the first capacitor C1 can be selected to be 10pF, the value of the second capacitor C2 is 18pF, and the value of the common-mode inductor L8 is 22nH. Here, the pressure detection unit 142 is electrically connected to the pressure-sensitive signal processing chip through a second isolation circuit; the second isolation circuit comprises a first inductor L1 and a second inductor L2 which are connected in series, and a filter capacitor C7 which is connected between a node between the first inductor L1 and the second inductor L2 and the ground. The inductance value selectable range of the first inductor L1 and the second inductor L2 is 8.2nH-72nH, and the capacitance value selectable range of the filter capacitor C7 is 5pF-22pF. Preferably, the value of the first inductor L1 is 72nH, the value of the second inductor L2 is 72nH, and the value of the filter capacitor C7 is 5pF.
Here, referring to fig. 6 again, the composite structure of the antenna and the pressure sensor further includes a system ground return circuit, the system ground return circuit includes an isolation capacitor C6 connected between the antenna radiation body 111 of the bluetooth antenna and the ground, and a capacitance value of the isolation capacitor C6 is in a range of 5pF to 22pF.
In the embodiment of the application, the antenna radiation body 111 of the bluetooth antenna and the pressure sensing chip of the pressure sensor are integrated on two opposite sides of the same double-layer flexible circuit board, and the antenna radiation body 111 of the bluetooth antenna can serve as a stratum of the sensor, so that the antenna and the sensor can multiplex the space of the area where the antenna radiation body 111 of the bluetooth antenna is located, and the overall occupied space of the sensor and the antenna is saved; in addition, by arranging the isolation circuit and the filter circuit, the normal transceiving performance of the antenna can be effectively ensured, and the overall size of the earphone can be effectively reduced.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (16)

1. A sensor and antenna module, includes antenna and sensor, its characterized in that still includes:
the multiplexing mainboard comprises a first circuit layer and a second circuit layer which are arranged at intervals along the thickness direction of the multiplexing mainboard, the first circuit layer is provided with an antenna radiation body of the antenna and a radio frequency circuit, the antenna radiation body is used for sending and receiving electromagnetic waves, and the radio frequency circuit is used for transmitting and processing radio frequency signals; the second circuit layer is provided with an induction element of the sensor, the induction element is used for induction operation, and a corresponding induction signal is obtained according to the operation;
the antenna radiation body and the induction element are at least partially overlapped along the thickness direction of the multiplexing main plate, and the antenna radiation body serves as a stratum of the sensor.
2. The sensor and antenna assembly of claim 1, further comprising a main circuit board spaced apart from and parallel to the multiplexing board, the antenna further comprising an antenna chip mounted on the main circuit board and an antenna spring connected between a feed point on the radiating body of the antenna and the antenna chip.
3. The sensor and antenna assembly of claim 2, wherein the rf signal is a high frequency signal, the antenna transmits and receives electromagnetic waves through the antenna radiating body, and the rf circuit transmits and processes the rf signal, comprising: the radio frequency circuit converts the electromagnetic waves into radio frequency signals and transmits the radio frequency signals to the antenna chip through the antenna elastic pins, and the antenna chip processes the radio frequency signals; the sensing signal is a low-frequency signal, and the sensor further comprises a sensing chip arranged on the second circuit layer; the induction element sends the induction signal to an induction chip; and after the induction chip acquires the induction signal, determining a corresponding operation instruction according to the induction signal.
4. The sensor and antenna assembly of claim 1, wherein the sensor is a touch sensor and the sensing element comprises two or more touch pads spaced apart on the second circuit layer in a direction parallel to the multiplexing motherboard.
5. The sensor and antenna assembly of claim 2, wherein the first circuit layer is disposed on a side proximate to the main circuit board and the second circuit layer is disposed on a side distal from the main circuit board.
6. The sensor and antenna assembly of claim 5, wherein the sensor further comprises a touch chip disposed on the second circuit layer, the touch pad being electrically connected to the touch chip; or the like, or, alternatively,
the multiplexing mainboard is parallel to the main circuit board, and the main circuit board is arranged at intervals, a touch chip is arranged on the main circuit board, and the touch gasket is electrically connected with the touch chip.
7. The sensor and antenna assembly of claim 6, further comprising a touch isolation circuit connected to the touch pad, the touch isolation circuit including isolation inductors connected in one-to-one correspondence with the touch pad.
8. The sensor and antenna assembly of claim 1, wherein the antenna is a planar inverted-F antenna, the planar inverted-F antenna further comprising an antenna feed point disposed on the first circuit layer proximate the antenna radiating body.
9. The sensor and antenna assembly of claim 1, wherein the sensor is a pressure sensor comprising a pressure sensing unit disposed on the second circuit layer.
10. The sensor and antenna assembly of claim 9, further comprising a high frequency filter circuit connected to the radio frequency circuit and/or a low frequency filter circuit connected to the inductive element.
11. The sensor and antenna assembly of claim 9, further comprising a first isolation circuit connected to the radio frequency circuit, the first isolation circuit including a first capacitor and a second capacitor connected in series, and a common mode inductance connected between a junction between the first capacitor and the second capacitor and ground; and/or the presence of a gas in the gas,
the inductor further comprises a second isolation circuit connected with the inductive element, wherein the second isolation circuit comprises a first inductor and a second inductor which are connected in series, and a filter capacitor connected between a node between the first coupling capacitor and the second coupling capacitor and the ground.
12. The sensor and antenna assembly of any one of claims 1-11, wherein the radio frequency circuitry includes antenna matching circuitry and filtering circuitry, the antenna matching circuitry including a third inductance and third and fourth capacitors respectively connected between opposite ends of the third inductance and ground; the filter circuit comprises a fourth inductor connected with the third inductor in series and a fifth capacitor connected between one end of the fourth inductor and the ground.
13. The sensor and antenna assembly of any one of claims 1-11, further comprising a system ground return circuit including an isolation capacitor connected between the antenna radiating body and ground.
14. The sensor and antenna assembly of any one of claims 1-11, wherein the multiplexing motherboard is a flexible circuit board, and the first circuit layer and the second circuit layer are each a flexible circuit layer; or the multiplexing mainboard is a printed circuit board, and the first circuit layer and the second circuit layer are respectively arranged on two opposite sides of the printed circuit board along the thickness direction of the multiplexing mainboard.
15. A wireless headset comprising an eartip portion and a stem portion, further comprising a sensor and antenna assembly according to any one of claims 1 to 14, the sensor and antenna assembly being disposed within the stem portion.
16. The wireless headset of claim 15, wherein the sensor is a touch sensor, the second circuit layer is disposed on a side of the handle portion adjacent to the exterior, and the first circuit layer is disposed on a side facing the interior of the handle portion; or the like, or, alternatively,
the sensor is a pressure sensor, one of the first circuit layer and the second circuit layer is arranged on one side of the handle part close to the outside, and the other one of the first circuit layer and the second circuit layer is arranged on one side facing the inside of the handle part.
CN202110624747.4A 2021-06-04 2021-06-04 Sensor, antenna assembly and wireless earphone Pending CN115441179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110624747.4A CN115441179A (en) 2021-06-04 2021-06-04 Sensor, antenna assembly and wireless earphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110624747.4A CN115441179A (en) 2021-06-04 2021-06-04 Sensor, antenna assembly and wireless earphone

Publications (1)

Publication Number Publication Date
CN115441179A true CN115441179A (en) 2022-12-06

Family

ID=84240229

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110624747.4A Pending CN115441179A (en) 2021-06-04 2021-06-04 Sensor, antenna assembly and wireless earphone

Country Status (1)

Country Link
CN (1) CN115441179A (en)

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