CN115438137A

CN115438137A - Map quality inspection method, device, equipment and storage medium

Info

Publication number: CN115438137A
Application number: CN202211298819.1A
Authority: CN
Inventors: 周海洋; 李艳霞
Original assignee: Autonavi Software Co Ltd
Current assignee: Autonavi Software Co Ltd
Priority date: 2022-10-24
Filing date: 2022-10-24
Publication date: 2022-12-06

Abstract

The disclosure relates to a map quality inspection method, a map quality inspection device, a map quality inspection apparatus, and a storage medium. The method comprises the following steps: responding to a target operation instruction generated in the map making process, and determining a target module identifier; determining a target quality inspection module from the candidate quality inspection modules based on the target module identification; and calling the target quality inspection module, performing quality inspection on the target map data elements corresponding to the target operation instruction, and determining the quality inspection result of the target map data elements. Therefore, automatic quality inspection can be performed on the target map data elements in the map making process, the labor cost in the map quality inspection process is reduced, the quality inspection efficiency and the subsequent map delivery efficiency are improved, and the automatic quality inspection range and the quality inspection accuracy can be changed by changing the candidate quality inspection module.

Description

Map quality inspection method, device, equipment and storage medium

Technical Field

The present disclosure relates to the field of map data technologies, and in particular, to a method, an apparatus, a device, and a storage medium for map quality inspection.

Background

The electronic map manufacturing process mainly comprises map data acquisition, map data production and map data compiling. In order to ensure the quality of the compiled map data, quality inspection needs to be performed on the map data to evaluate the quality of the map data.

At present, the map quality inspection method is usually to perform comprehensive manual quality inspection on an obtained map data product library after the map data compiling stage is completed. However, because the map data elements contained in the map data product library are various and huge in number, and repeated modification and manual review are performed when the quality inspection result is problematic, the labor cost and time consumption of the map quality inspection scheme are high, and the efficiency of map quality inspection and map delivery is low.

Disclosure of Invention

In order to solve the technical problems of high labor cost, long time consumption and low efficiency in the map quality inspection process, the disclosure provides a map quality inspection method, a map quality inspection device, map quality inspection equipment and a storage medium.

In a first aspect, the present disclosure provides a map quality inspection method, including:

responding to a target operation instruction generated in the map making process, and determining a target module identifier;

determining a target quality inspection module from the candidate quality inspection modules based on the target module identification;

and calling the target quality inspection module, performing quality inspection on the target map data elements corresponding to the target operation instruction, and determining the quality inspection result of the target map data elements.

In a second aspect, the present disclosure also provides a map quality inspection apparatus, including:

the module identification determining unit is used for responding to a target operation instruction generated in the map making process and determining a target module identification;

the quality inspection module screening unit is used for determining a target quality inspection module from all candidate quality inspection modules based on the target module identification;

and the quality inspection unit is used for calling the target quality inspection module, performing quality inspection on the target map data elements corresponding to the target operation instruction and determining the quality inspection result of the target map data elements.

In a third aspect, the present disclosure also provides an electronic device, including:

a memory and a processor, the memory to store the processor-executable instructions;

the processor is configured to read the executable instructions from the memory and execute the executable instructions to implement the map quality inspection method provided by any embodiment of the disclosure.

In a fourth aspect, the present disclosure further provides a computer-readable storage medium, where a computer program is stored, and when the computer program is executed by a processor, the map quality inspection method provided in any embodiment of the present disclosure is implemented.

Compared with the prior art, the technical scheme of the map quality inspection provided by the embodiment of the disclosure has at least the following advantages: the method comprises the steps that a target module identification can be determined in response to a target operation instruction in the map making process, a target quality inspection module is determined from all candidate quality inspection modules based on the target module identification, the target quality inspection module is called, quality inspection is carried out on target map data elements, and quality inspection results of the target map data elements are determined; on one hand, the quality inspection module which is adapted to the target map data elements corresponding to the target operation instructions is automatically determined in the map making process so as to automatically perform quality inspection on the map data elements, and the manual participation degree in the map quality inspection process is greatly reduced, so that the labor cost in the map quality inspection process is reduced, the map quality inspection efficiency is improved, and the map delivery efficiency is further improved; on the other hand, the automatic quality inspection range can be expanded by amplifying the candidate quality inspection modules, and the expandability and the application range of the automatic quality inspection of the map are improved.

Drawings

The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numbers refer to the same or similar elements. It should be understood that the drawings are schematic and that elements and features are not necessarily drawn to scale.

FIG. 1 is a diagram illustrating a map quality inspection process in the prior art;

fig. 2 is a schematic diagram of a map quality inspection process provided in an embodiment of the present disclosure;

fig. 3 is a schematic flow chart of a map quality inspection method according to an embodiment of the present disclosure;

fig. 4 is a schematic flow chart illustrating another map quality inspection method according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a map quality inspection apparatus according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure.

Detailed Description

Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more complete and thorough understanding of the present disclosure. It should be understood that the drawings and the embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.

It should be understood that the various steps recited in method embodiments of the present disclosure may be performed in a different order, and/or performed in parallel. Moreover, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the present disclosure is not limited in this respect.

The term "include" and variations thereof as used herein are open-ended, i.e., "including but not limited to". The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions for other terms will be given in the following description.

It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.

It is noted that references to "a", "an", and "the" modifications in this disclosure are intended to be illustrative rather than limiting, and that those skilled in the art will recognize that "one or more" may be used unless the context clearly dictates otherwise.

Referring to fig. 1, the process of manufacturing the electronic map mainly includes a map data collection stage 110, a map data production stage 120, and a map data compiling stage 130. In the process of the map data production phase 120, the edited map data elements are put into a database, and then the map data master 140 is obtained after the map data production phase 120 is finished. In the process of the map data compiling stage 130, the compiled map data elements are put into a database, and then the map data product library 150 is obtained after the map data compiling stage 130 is finished.

In order to ensure the delivery quality of the map data product base, a comprehensive manual quality check is often performed after the map data product base is generated. When a quality check problem is detected, the map data production 120 is returned to. After the modification, the above processes of data warehousing, map data compiling 130 and manual quality inspection in the map data production stage 120 are repeated until the quality inspection is passed. However, in this process, because of the large variety and quantity of map data elements, the workload of manual quality inspection in the whole process is large, so that the labor cost of map quality inspection is high, and the time consumption of map quality inspection and delivery is long and the efficiency is low.

Based on the above situation, the embodiments of the present disclosure provide a map quality inspection method, so as to implement that, in each stage of a map making process, in response to a target operation instruction, a quality inspection module (referred to as a target quality inspection module) adapted to at least one target map data element corresponding to the target operation instruction is determined from a plurality of preset quality inspection modules (referred to as candidate quality inspection modules), and the target quality inspection module is used to perform automatic quality inspection on the target map data element, thereby saving labor cost in the map quality inspection process, improving map quality inspection efficiency and map delivery efficiency, changing a range of map automatic quality inspection by changing (such as adding, deleting, modifying, and the like) the candidate quality inspection modules, and improving expandability and flexibility of map automatic quality inspection.

Referring to fig. 2, in the map quality inspection scheme according to the embodiment of the present disclosure, the automatic quality inspection logic of the map may be implemented as a quality inspection platform 200, and each candidate quality inspection module is stored in the quality inspection platform 200. The candidate quality inspection modules in the quality inspection platform 200 may be subjected to modification processing such as addition, deletion, and modification.

During the map production process, the quality inspection platform 200 may perform detection of a trigger instruction to the map data production stage 120 and/or the map data compilation stage 130. When a target trigger instruction generated in a certain stage is detected, an adaptive target quality inspection module can be determined for at least one map data element corresponding to the target trigger instruction, and the target quality inspection module is triggered to execute so as to perform corresponding automatic quality inspection processing on the map data element. And under the condition that the automatic quality inspection result is abnormal, manual intervention can be applied for manual reinspection. The specific automatic quality control logic can be seen in the description of the following embodiments.

The quality control platform 200 may be implemented as a stand-alone electronic device or as a local device in an electronic device that executes mapping logic.

Fig. 3 is a schematic flowchart of a map quality inspection method according to an embodiment of the present disclosure. The map quality inspection method provided by the embodiment of the disclosure can be applied to a scene of performing quality inspection on map data elements in an electronic map, for example, to a scene of performing quality inspection on edited or compiled map data elements in the process of manufacturing the electronic map. The electronic map can be a high-precision map/high-definition map with high map precision, or a common electronic map/navigation map with relatively low map precision. The map quality inspection method can be executed by a map quality inspection device, which can be implemented by software and/or hardware and can be integrated in an electronic device with computing capability. The electronic device may be a stand-alone electronic device or an electronic device that executes mapping logic. The electronic device may be, for example, a notebook computer, a desktop computer, a server, or the like.

As shown in fig. 3, the map quality inspection method provided by the embodiment of the present disclosure may include:

and S310, responding to a target operation instruction generated in the map making process, and determining a target module identifier.

The map making process refers to a process of making an electronic map, and may include at least one stage of the map making process described above. The target operation instruction is an instruction capable of triggering automatic quality inspection processing, and may be an instruction generated by triggering interactive operation executed by a user in a mapping process, or an instruction automatically generated after a certain flow is executed in the mapping process. The target module identification is the module identification corresponding to the target operation instruction. The module identifier is identification information of the quality inspection module, and may be, for example, information that uniquely identifies one quality inspection module, such as a serial number, a full name, a short name, a category of the quality inspection module, and a combination of at least one of the above information.

The quality inspection module is a computer functional module with the function of performing quality inspection on certain map data elements, abstracts the flow of manual quality inspection of the map data elements into corresponding quality inspection logics/rules, and realizes the abstracted quality inspection logics/rules into functional modules which can be called by a computer. The functional module can be realized as an operator with a certain function mapping relation, a component for packaging a certain functional function and data, a Software Development Kit (SDK), computer program codes, a packaged executable file and the like. Regardless of the implementation form of the quality inspection module, the quality inspection module can receive input data of map data elements with corresponding data structures/data models according to the quality inspection function, and output a quality inspection result whether the quality inspection corresponding to the input data passes or not after the quality inspection processing.

For example, chinese administrative division code (opcode) attribute quality inspection for a certain road corresponds to a road attribute quality inspection module. The input data of the road attribute quality inspection module is structured data composed of the coordinates, map picture and encode attributes and the like of the road. The road attribute quality inspection module can internally calculate one or more administrative divisions opcode of the road according to the administrative divisions, and if the opcode attribute of the road is not in the calculated opcode set, output the quality inspection result that the opcode attribute of the road is wrong. If the road spans a plurality of administrative division units, the length of the road in each administrative division unit to which the encode belongs is calculated, and when the length of the road contained in the administrative division unit of the encode in the input data is judged not to be the longest one, a quality detection result of error attribute of the encode of the road is output.

For another example, the road geometry quality inspection module is corresponding to the road geometry quality inspection module, wherein the road only has the road edge connection between the upstream road and the downstream road. The input data of the road geometry quality inspection module is structured data composed of a road link to be inspected and the road geometry (a left line and a right line) thereof, an upstream link and a downstream link in a straight road direction and the road geometry (the left line and the right line) thereof, and the like. The left sideline of the road and the left sideline of the upstream and downstream roads can be taken from the inside of the road geometric quality inspection module, and when the three sidelines are judged to be not connected end to end, the quality inspection result that the sidelines of the road are not connected correctly (namely the road geometric shape is disconnected) is output. The quality inspection logic of the right side line of the road is the same as that of the left side line.

For another example, the road topology relation quality inspection module is corresponding to a road topology quality inspection module for inspecting whether topology is missing/whether prohibition information is missing. The input data of the road topology quality inspection module is structured data which is composed of a road link to be inspected, a head node of the road link, all roads related to the head node and the tail node of the road link, all upstream and downstream topologies in road communication relation data, link prohibition information related to road prohibition information and the like. The inside of the road topology quality inspection module can judge whether the road link is physically connected with a certain link according to a node relation (same node), and relevant forbidden information does not exist in the forbidden information, and when the link pair does not exist in the road connection relation table, a quality inspection result of whether the road link and the certain link have topology loss is output.

Specifically, in the embodiment of the present disclosure, an operation instruction that can trigger automatic quality inspection may be preset. In the map making process, the electronic equipment can detect the operation instructions generated in the map making process. When a certain operation instruction is detected, the operation instruction can be matched with a preset operation instruction. If the matching fails, the detected operation instruction cannot trigger the automatic quality inspection. If the matching is successful, the detected operation instruction can trigger automatic quality inspection, and then the operation instruction can be used as a target operation instruction of the automatic quality inspection.

Then, the electronic device may determine the target module identifier adapted thereto according to the target operation instruction, so as to determine the quality inspection module (i.e., the target quality inspection module) adapted to this automatic quality inspection according to the target module identifier with a smaller data size in a subsequent process. For example, a correspondence between relevant information of the operation instruction (such as an instruction identifier of the operation instruction, a map data element corresponding to the operation instruction, and the like) and the module identifier is preset, and the electronic device may determine the target module identifier by querying the correspondence. For another example, one or more quality inspection module categories are divided in advance according to the functions of the quality inspection modules, and each module identifier is associated with the corresponding quality inspection module category, so that the electronic device can determine the quality inspection module category corresponding to the target operation instruction through the quality inspection function required by the map data element corresponding to the target operation instruction, and then determine the target module identifier from each module identifier included in the determined quality inspection module category.

In some embodiments, S310 comprises: and responding to the target operation instruction, inquiring the mapping relation of preset element identifiers based on the target map data elements, and determining the target module identifier from all candidate module identifiers.

The preset element identifier mapping relation is used for recording the corresponding relation between the map data element and at least one candidate module identifier. The candidate module identification is identifying information of the candidate quality inspection module.

Specifically, in the process of constructing a candidate quality inspection module, the candidate module identification of the candidate quality inspection module and the applicable quality inspection object may be determined. In the embodiment of the present disclosure, the quality inspection object may be a map data element. Therefore, the corresponding relation among the candidate quality inspection module, the candidate module identifier and the map data element, namely the mapping relation of the preset element identifier can be established in the process of constructing the candidate quality inspection module. For example, the preset element identification mapping relationship may be implemented as a preset element identification mapping table as shown in table 1.

Table 1 preset element identifier mapping table

In the map making process, after the electronic device determines a target operation instruction, the electronic device can be positioned to a corresponding map data element (called a target map data element) through the target operation instruction. Then, by using the target map data element as an index, the preset element identifier mapping relationship is inquired, so that one or more target module identifiers matched with the target map data element can be obtained by screening from a plurality of candidate module identifiers. For example, the target operation command is located to the target map data element "element 2", and the target module identifier "module identifier 3" can be obtained by querying the preset element identifier mapping table.

In this embodiment, the target module identifier can be obtained more quickly and conveniently by the configured mapping relationship of the preset element identifier, and the change of the candidate quality inspection module can be adapted quickly by modifying the mapping relationship of the preset element identifier, so that the implementation logic of automatic quality inspection is simplified to a certain extent, and the speed and the change flexibility of the automatic quality inspection are further improved.

In other embodiments, S310 comprises: and responding to the target operation instruction, determining a quality inspection module type based on the target map data elements, and determining a target module identifier from candidate module identifiers corresponding to the quality inspection module type.

Specifically, in the process of constructing each candidate quality inspection module, each candidate quality inspection module may be divided into different categories according to the quality inspection function, so that one or more quality inspection module categories may be obtained, where each quality inspection module category includes at least one candidate quality inspection module. For example, referring to fig. 2, a quality inspection module library may be established in the quality inspection platform 200, and the quality inspection module library may include a road attribute quality inspection module category, a road topology relation quality inspection module category, and the like. Accordingly, each quality inspection module category comprises at least one candidate module identification. The correspondence between the quality control module class and the candidate module identifier in the quality control module library can be exemplified as table 2.

TABLE 2 correspondence between quality inspection module categories and candidate module identifications

In the map making process, after the electronic equipment determines the target operation instruction, the electronic equipment can determine the target map data element subjected to the operation according to the target operation instruction and can judge the quality inspection function required by the target map data element. And then, determining the corresponding quality inspection module type according to the judged quality inspection function. Then, the electronic device may screen one or more candidate module identifications corresponding to the quality inspection module category as target module identifications. For example, if the electronic device determines that the quality inspection module category corresponding to the target operation instruction is the "road attribute quality inspection module category", it may screen one or more of "module identifier 1", "module identifier 2", and the like as the target module identifier.

In one example, the quality testing function bodies of the candidate quality testing modules in the quality testing module category are similar, so the electronic device can randomly select one or more candidate module identifications as the target module identifications.

In another example, the electronic device may filter one or more candidate module identifiers corresponding to the quality inspection module category according to information (which may be referred to as module performance characterization information) indicating performance of the candidate quality inspection module, such as module consumption resource amount, module precision, and module speed associated with each candidate module identifier, and by combining performance parameters of the electronic device itself and business requirements corresponding to the target map data elements, and the like, as the target module identifier.

The embodiment at least matches the target module identification through the quality inspection module category, so that the flexibility and recall success rate of module identification matching can be improved to a certain extent, and the candidate quality inspection module can still be matched with a relatively accurate module identification when being changed.

In still other embodiments, if the requirement of the service on the accuracy of the automatic quality inspection is high, the electronic device may determine the target module identifier corresponding to the target map data element according to the preset element identifier mapping relationship and the quality inspection module type at the same time.

Specifically, the electronic device may determine the target module identifier according to the preset element identifier mapping relationship and the quality inspection module type, and integrate the target module identifier obtained in the two manners as the final target module identifier, by referring to the processes of the above embodiments. For example, overlapping target module identifications may be selected when both of the two ways obtain a target module identification; in either of the two ways, the obtained target module identifier may be selected if the target module identifier is not obtained. Therefore, the accuracy of the target module identification can be further improved, and the accuracy of subsequent automatic quality inspection is improved.

And S320, determining a target quality inspection module from the candidate quality inspection modules based on the target module identification.

Specifically, the module id is used to specifically locate the quality inspection module, and it can be seen from the above description that the quality inspection module is used to specifically execute the automatic quality inspection logic. Therefore, the electronic equipment can screen out the corresponding target quality inspection module from the candidate quality inspection modules according to the determined target module identification.

And S330, calling a target quality inspection module, performing quality inspection on the target map data elements corresponding to the target operation instruction, and determining the quality inspection result of the target map data elements.

The quality inspection result is information for representing whether quality inspection of the map data element is qualified, for example, whether an attribute editing result of the road element is correct, whether a road topological relation is missing, and the like.

Specifically, the electronic device invokes the target quality inspection module, which triggers execution of the target quality inspection module. In the execution process of the target quality inspection module, quality inspection of corresponding functions is carried out on the target map data elements, and quality inspection results of the target map data elements are output after execution is finished so as to judge whether the data quality of the target map data elements is qualified.

The embodiment of the disclosure provides a map quality inspection method, which comprises the following steps: responding to a target operation instruction generated in the map making process, and determining a target module identifier; determining a target quality inspection module from the candidate quality inspection modules based on the target module identification; and calling a target quality inspection module, performing quality inspection on the target map data elements corresponding to the target operation instruction, and determining the quality inspection result of the target map data elements. Therefore, automatic quality inspection can be performed on the target map data elements, the labor cost in the map quality inspection process is reduced, the quality inspection efficiency and the subsequent map delivery efficiency are improved, the automatic quality inspection range and the quality inspection accuracy can be changed by changing the candidate quality inspection module, and the quality inspection efficiency and the subsequent map delivery efficiency are further improved.

In some embodiments, the mapping process includes a map data production phase and/or a map data compilation phase.

The map data production stage is a stage of processing the collected map data and storing the processing result into the database to generate a map data mother base, and the map data compiling stage is a stage of compiling map data elements in the map data mother base to generate a map data product base.

Specifically, the map quality inspection in the related art is performed manually after the map database is generated in the map compiling stage, and such a hysteresis quality inspection results in a problem of high labor cost, and also results in a problem of repeated modification and rechecking during quality inspection because errors in the early stage of map production are continuously accumulated to the last stage, thereby further increasing the workload of manual quality inspection and further reducing the quality inspection efficiency and the map delivery efficiency.

In this embodiment, since the candidate quality inspection module that can be independently called is used for automatic quality inspection, an operation instruction for triggering quality inspection can be set for a map data production stage and/or a map data compilation stage in a map making process. Therefore, the electronic equipment can trigger and execute automatic quality inspection at any stage in the map making process, and is not limited to the map data compiling stage, so that the problem of quality inspection hysteresis can be solved to a certain extent on the basis of reducing the labor cost, the error accumulation in the map making process is reduced, the error rate of map data elements is reduced, the repeated operation process of modification and quality inspection is avoided to a certain extent, and the quality inspection efficiency is further improved.

In an example, when the map making process is a map data production stage, the target operation instruction may include an instruction generated after editing of a feature (such as a road, an intersection, a POI, a traffic light, a portal frame, a tunnel, a toll station, and the like) in the map is completed, an instruction generated after editing of an attribute of the feature is completed, an instruction completed when the map database is put in storage, and the like. In this example, the target map data element corresponding to the target operation instruction may be at least one element related to the instruction.

Therefore, the electronic equipment can trigger automatic quality inspection in the process of editing the related information of the map data elements by an operator and/or after the map data master library is generated, the map quality inspection link is advanced to the map data production stage, and the errors in the map data element production process are reduced, so that the possibility of backward accumulation of the errors in the process is reduced, the error rate and the rechecking times in the subsequent stage are reduced, and the quality inspection efficiency of the subsequent stage is further improved.

It should be noted that, when the map data elements in the map database are subjected to automatic quality inspection, if automatic quality inspection is performed in the map data production stage, the target map data elements in the map data production stage may be map data elements including quality inspection performed in the map data production stage, so as to perform comprehensive quality inspection on the database storage process, and further improve the accuracy of map quality inspection; if the logic accuracy of the warehousing of the master library is high and the accuracy of the quality inspection result in the map data production stage is high, the target map data element can also be a map data element which does not contain the quality inspection executed in the map data production stage, so that the quality inspection efficiency is further improved to a certain extent.

In another example, when the mapping process is a map data compiling stage, the target operation instruction may be an instruction for completion of warehousing of a map data product. In this example, the target map data elements corresponding to the target operation instruction may be each map data element included in the product library. Similarly, if the map data production stage executes automatic quality inspection, the target map data element of the stage can be the map data element including the quality inspection executed in the previous stage, so as to perform comprehensive quality inspection on the map data compiling and product library warehousing processes, and further improve the accuracy of map quality inspection; if the logic accuracy of the map data compiling and product library warehousing is high, and the accuracy of the quality inspection result of the previous stage is high, the target map data element can also be a map data element which does not contain the map data element subjected to quality inspection in the previous stage, so that the quality inspection efficiency is further improved to a certain extent.

In some embodiments, S330 includes at least one of: if the map manufacturing process is a map data production stage and the calling mode of the target quality inspection module belongs to a real-time calling mode, calling the target quality inspection module on line, performing quality inspection on the target map data elements, and determining a quality inspection result; if the map manufacturing process is a map data production stage and the calling mode of the target quality inspection module is determined not to belong to a real-time calling mode, calling the target quality inspection module offline, performing quality inspection on the target map data elements, and determining a quality inspection result; and if the map making process is the map data production stage end and/or the map data compiling stage, calling a target quality inspection module offline, performing quality inspection on the target map data elements, and determining a quality inspection result.

In particular, considering that the number of target map data elements may be more than one, and the logical complexity of the target quality inspection module may be different, the time consumption and the resource consumption amount of the automatic quality inspection may be different. Therefore, in order to balance the performance and efficiency between quality inspection and map making, in this embodiment, the operation mode of some quality inspection modules with low time consumption and/or low resource consumption is set as real-time online call in the map making process, and the operation mode of some quality inspection modules with high time consumption or high resource consumption is set as asynchronous offline call.

In specific implementation, the electronic device may determine whether the target quality inspection module performs calling online in real time according to a preset calling mode corresponding to the map making stage and/or the target quality inspection module.

In an example, after the electronic device recognizes that the map making process is a map data production stage, the electronic device may further determine a calling mode corresponding to the target quality inspection module. If the determined calling mode is a real-time calling mode, the electronic equipment can immediately call the target quality inspection module on line so as to trigger the execution of the target quality inspection module in real time to carry out quality inspection on the target map data elements.

In another example, if the electronic device identifies that the mapping process is a map data production phase and the determined calling manner of the target quality inspection module is not a real-time calling manner, the electronic device may asynchronously call the target quality inspection module offline to preferentially ensure normal operation of the mapping process. For example, the electronic device may call the target quality inspection module offline after the map data production stage is completed to perform automatic quality inspection on the target map data elements.

In another example, because the map database generated after the map data production phase is finished and the map data product library generated after the map data compilation phase is finished both include a large number of map data elements, and the time consumption and the resource consumption of the batch quality inspection of the map data elements are both large, when the electronic device recognizes that the map manufacturing process is the map data production phase is finished and/or the map data compilation phase is finished, it can be directly determined that the calling mode of the target quality inspection module is not the real-time calling mode. Then, the electronic device may call the target quality inspection module offline after the warehousing of the mother library or the warehousing of the product library is completed, and perform automatic quality inspection on the target map data elements contained in the mother library or the product library. Therefore, the performance of the map making process and the real-time performance of map data quality inspection can be balanced.

In some embodiments, the determining whether the calling mode of the target quality inspection module belongs to a real-time calling mode includes: and inquiring the preset module calling mapping relation based on the target module identification, and determining the target calling identification corresponding to the target quality inspection module.

The preset module calling mapping relation is used for recording the corresponding relation between the candidate module identification and the calling identification. The calling identifier is identification information for representing a calling mode of the quality inspection module. Then, the target calling identifier is used for representing whether the calling mode of the target quality inspection module belongs to a real-time calling mode.

Specifically, in the process of constructing the candidate quality inspection module, whether the candidate quality inspection module is suitable for online real-time calling or not can be determined according to indexes such as a quality inspection function of the candidate quality inspection module, module time consumption/speed and the like, and a corresponding calling identifier is set for the candidate quality inspection module. In this way, the preset module call mapping relationship between the candidate quality inspection module and the call identifier can be configured in advance.

After the target module identification is determined, the electronic device queries a preset module calling mapping relation by taking the target module identification as an index, and obtains a calling identification (called target calling identification) corresponding to the target quality inspection module. If the target calling identification is a calling identification corresponding to the real-time calling mode, the electronic equipment can determine that the calling mode of the target quality inspection module is the real-time calling mode; otherwise, the electronic device may determine that the calling mode of the target quality inspection module is not a real-time calling mode. Therefore, the calling mode of the target quality inspection module can be determined more quickly.

In other embodiments, the determining whether the calling mode of the target quality inspection module belongs to a real-time calling mode includes: and determining whether the calling mode of the target quality inspection module belongs to a real-time calling mode or not based on the relation between the quantity of the target quality inspection modules and the quantity threshold and/or the relation between the execution duration of the target quality inspection modules and the duration threshold.

Specifically, the number of modules of the quality inspection module and/or the critical value of the execution time of the quality inspection module, which affect the performance and efficiency of the map making process, may be determined in advance through experiments and the like, that is, the corresponding number threshold and the corresponding time threshold are determined.

After the electronic device determines the target quality inspection modules, the number of target quality inspection modules may be compared to a number threshold. If the number of the target quality inspection modules does not exceed the number threshold, which indicates that the execution of the automatic quality inspection does not affect the mapping process, it may be determined that the calling mode of the target quality inspection modules may be a real-time calling mode. If the number of the target quality inspection modules exceeds the number threshold, which indicates that the execution of automatic quality inspection can affect the map making process, the calling mode of the target quality inspection modules can be determined not to be a real-time calling mode.

The electronic equipment determines the target quality inspection module, and can compare the execution time length with the time length threshold value under the condition that the execution time length of the target quality inspection module can be inquired. If the execution time length is less than or equal to the time length threshold value, the execution of the automatic quality inspection does not influence the map making process, and then the calling mode of the target quality inspection module can be determined to be a real-time calling mode. If the execution time length is longer than the time length threshold value, the execution of the automatic quality inspection can affect the map making process, and then the calling mode of the target quality inspection module can be determined not to be a real-time calling mode.

In some embodiments, as shown in fig. 4, on the basis of the map quality inspection method shown in fig. 3, the relevant steps of the operation response processing after automatic quality inspection can be further added to realize a closed loop process of quality inspection and modification. Referring to fig. 4, the map quality inspection method includes:

and S410, responding to a target operation instruction generated in the map making process, and determining a target module identifier.

And S420, determining a target quality inspection module from the candidate quality inspection modules based on the target module identification.

And S430, calling a target quality inspection module, performing quality inspection on the target map data elements corresponding to the target operation instruction, and determining the quality inspection result of the target map data elements.

And S440, determining the quality inspection confidence of the quality inspection result.

And the quality inspection confidence coefficient is used for representing the reliability of the quality inspection result of the quality inspection module. The higher the confidence of quality inspection, the higher the reliability of the quality inspection result.

Specifically, in order to determine the validity of the quality inspection result and thus ensure the accuracy of the quality inspection result, when constructing the candidate quality inspection module, a function of evaluating the reliability of the quality inspection result output by the candidate quality inspection module may be added, that is, a function of calculating and outputting the quality inspection confidence for the candidate quality inspection module may be added. Therefore, the electronic equipment can output the quality inspection confidence of the quality inspection result while calling the target quality inspection module to output the quality inspection result. Subsequently, the validity of the quality inspection result can be judged according to the combination of the quality inspection result and the quality inspection confidence.

And S450, performing target processing operation on the target map data elements based on the quality inspection result and the quality inspection confidence.

The target processing operation is a processing operation after automatic quality inspection performed on the target map data elements, and may be, for example, return modification, quality inspection passing, transfer to a manual quality inspection platform, and the like.

Specifically, a combined threshold of the quality inspection result and the quality inspection confidence may be set in advance. Then, after obtaining the quality inspection result and the quality inspection confidence of the target map data element, the electronic device may compare them with corresponding thresholds in the combined thresholds, respectively, to analyze the data quality of the target map data element, and perform corresponding automatic processing according to the analysis result.

For example, when the data quality is judged not to meet the standard, the error information or the data modification task of the target map data element can be automatically returned to the operator to prompt the operator to modify the data element, and the automatic quality inspection process is executed in the modification process. If the data quality of the target map data elements after the operator processes and confirms still does not reach the standard, the operator can prompt that problems possibly exist in the process of warehousing the master library, compiling the map data or warehousing the product library so as to facilitate the checking of corresponding personnel.

For another example, the quality of the target map data elements may be checked when the data quality meets the standard.

If the data quality can not be judged to reach the standard, manual intervention quality inspection can be applied to further judge the data quality of the target map data element.

In some embodiments, S440 includes: and if the quality inspection result is determined to be wrong and the quality inspection confidence coefficient is higher than the first confidence coefficient threshold value, sending error information corresponding to the target map data element to a corresponding map data production stage.

The first confidence coefficient threshold is a preset critical value which represents the confidence coefficient with higher reliability of the quality inspection result. The error information is related information for indicating that there is an error in the data quality of the target map data element. In this embodiment, the error information may include the target map data element and the error reason of the data failure. The error reason is used for prompting the specific problems of unqualified quality inspection, such as the road attribute is not accordant with the actual condition, the road edge is discontinuous, the road center line is missing/wrong, and the like.

Specifically, if the quality inspection result of the target quality inspection module is erroneous information indicating that the target map data element does not conform to the actual situation, the electronic device may further compare the quality inspection confidence with the first confidence threshold. If the quality inspection confidence is larger than the first confidence threshold, the reliability of the quality inspection result is higher. At this time, it may be determined that the target map data element is processing-erroneous. Then, based on the consideration that the error rate of the automation process of the mother database warehousing, the map data compiling and the product library warehousing is low, and the manual error rate of the map data production stage is relatively high, the electronic equipment can return the data modification task of the target map data element to the corresponding map data production stage. The task can be returned by sending error-free information corresponding to the target map data element to the corresponding map data production stage. Therefore, the operator corresponding to the returned map data production stage can edit or modify the target map data element again according to the error information, and can execute the processing according to the processes of S410-S440 in the processing process to form a closed loop process of modification and automatic quality inspection, so that the manual participation degree is further reduced, the labor cost is saved, and the quality inspection efficiency is further improved.

In the map data production stage, the quality inspection result is wrong, but the quality inspection confidence is less than or equal to the first confidence threshold, the validity of the quality inspection result cannot be determined because the reliability of the quality inspection result is relatively low, and the data quality of the target map data element can be temporarily considered to be over-critical in order not to influence the map making progress. The target map data elements will continue to participate in automatic quality inspection in subsequent processes.

In other embodiments, S440 includes: and if the target operation instruction is generated by the end of the map data production stage or the end of the map data compiling stage and the quality inspection confidence coefficient is determined to be lower than a second confidence coefficient threshold value, handing over the quality inspection task corresponding to the target map data element to the manual quality inspection platform.

The second confidence threshold is a preset critical value representing the confidence with lower reliability of the quality inspection result.

Specifically, in the process of batch automatic quality inspection for the mother library or the product library, no matter the quality inspection result is correct or wrong, as long as the reliability degree is low, that is, the quality inspection confidence is smaller than the second confidence threshold, the quality inspection result of the automatic quality inspection is considered to be unreliable, and further confirmation is still needed. At this time, in order to ensure the quality inspection effect, the electronic device may forward the quality inspection task of the target map data element to the human working medium inspection platform. As shown in fig. 2, the quality inspection platform 200 may send a quality inspection task of the target map data elements to the stage of manual quality inspection 160 of the map data to apply for manual intervention for manual quality inspection.

And if the target map data element is correct as a result of the manual quality inspection, passing the quality inspection of the target map data element.

If the target map data element is wrong as a result of the manual quality inspection, a rollback process for the data modification task of the target map data element may be performed by a quality inspector to return the data modification task of the target map data element to a corresponding map data production stage. Or, if the quality testing personnel sends the information that the quality testing result is wrong to the electronic equipment, the electronic equipment receives the information that the manual quality testing result is wrong. At this time, the electronic device may return the data modification task of the target map data element to the corresponding map data production stage, so that the operator may perform the processes such as editing/modifying the target map data element again, and in the process, the processes may be executed according to the processes of S410 to S440, thereby forming a closed loop process of modifying and automatic quality inspection.

According to the map quality inspection method provided by the embodiment of the disclosure, after the quality inspection result and the quality inspection confidence coefficient are obtained, the target processing operations such as quality inspection passing, error rollback or manual quality inspection are performed on the target map data elements based on the quality inspection result and the quality inspection confidence coefficient, so that a closed-loop processing flow of automatic quality inspection and automatic quality inspection post-processing is realized, the manual participation degree in the quality inspection process is further reduced, the labor cost is further reduced, the automation degree of quality inspection is further improved, and the quality inspection efficiency is further improved.

Fig. 5 is a schematic structural diagram of a map quality inspection apparatus provided in an embodiment of the present disclosure, where the apparatus may be implemented by software and/or hardware, and may be integrated in any electronic device with certain computing capability.

As shown in fig. 5, a map quality inspection apparatus 500 provided in an embodiment of the present disclosure may include:

a module identifier determining unit 510, configured to determine an object module identifier in response to an object operation instruction generated in a mapping process;

a quality inspection module screening unit 520, configured to determine a target quality inspection module from the candidate quality inspection modules based on the target module identifier;

and the quality inspection unit 530 is used for calling the target quality inspection module, performing quality inspection on the target map data elements corresponding to the target operation instruction, and determining the quality inspection result of the target map data elements.

In some embodiments, the module identifier determining unit 510 is specifically configured to:

responding to a target operation instruction, inquiring a preset element identifier mapping relation based on a target map data element, and determining a target module identifier from all candidate module identifiers; the preset element identifier mapping relation is used for recording the corresponding relation between the map data element and at least one candidate module identifier;

and/or in response to the target operation instruction, determining a quality inspection module type based on the target map data elements, and determining a target module identifier from candidate module identifiers corresponding to the quality inspection module type.

In some embodiments, the map quality inspection apparatus 500 further comprises a post-quality inspection processing unit for:

after a target quality inspection module is called, quality inspection is carried out on the target map data elements, and quality inspection results of the target map data elements are determined, the quality inspection confidence of the quality inspection results is determined;

and performing target processing operation on the target map data elements based on the quality inspection result and the quality inspection confidence.

Further, the post-quality inspection processing unit is also used for:

if the quality inspection result is determined to be wrong and the quality inspection confidence coefficient is higher than the first confidence coefficient threshold value, sending error information corresponding to the target map data element to a corresponding map data production stage; the error information comprises target map data elements and error reasons;

and/or if the target operation instruction is generated by the end of the map data production stage or the end of the map data compiling stage and the quality inspection confidence is determined to be lower than a second confidence threshold, handing over the quality inspection task corresponding to the target map data element to the manual quality inspection platform.

In some embodiments, the quality inspection unit 530 is specifically configured to implement a function of invoking a target quality inspection module, performing quality inspection on a target map data element corresponding to a target operation instruction, and determining a quality inspection result of the target map data element by at least one of the following manners:

if the map manufacturing process is a map data production stage and the calling mode of the target quality inspection module is determined to belong to a real-time calling mode, calling the target quality inspection module on line, performing quality inspection on the target map data elements, and determining a quality inspection result;

if the map manufacturing process is a map data production stage and the calling mode of the target quality inspection module is determined not to belong to a real-time calling mode, calling the target quality inspection module offline, performing quality inspection on the target map data elements, and determining a quality inspection result;

and if the map making process is the map data production stage end and/or the map data compiling stage, calling a target quality inspection module offline, performing quality inspection on the target map data elements, and determining a quality inspection result.

Further, the quality inspection unit 530 is further configured to implement a function of determining whether the calling mode of the target quality inspection module belongs to a real-time calling mode by:

inquiring a preset module calling mapping relation based on the target module identifier, and determining a target calling identifier corresponding to the target quality inspection module; the preset module calling mapping relation is used for recording the corresponding relation between the candidate module identification and the calling identification; the target calling identifier is used for representing whether the calling mode of the target quality inspection module belongs to a real-time calling mode or not;

or determining whether the calling mode of the target quality inspection module belongs to the real-time calling mode or not based on the relation between the number of the target quality inspection modules and the number threshold and/or the relation between the execution duration of the target quality inspection modules and the duration threshold.

The map quality inspection device provided by the embodiment of the disclosure can execute any map quality inspection method provided by the embodiment of the disclosure, and has corresponding functional modules and beneficial effects of the execution method. Reference may be made to the description of any method embodiment of the disclosure that may not be described in detail in the embodiments of the apparatus of the disclosure.

Fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure, which is used for exemplarily explaining an electronic device implementing a map quality inspection method in any embodiment of the present disclosure, and should not be construed as specifically limiting the embodiment of the present disclosure.

As shown in FIG. 6, electronic device 600 may include a processor (e.g., central processing unit, graphics processor, etc. 601, which may perform various appropriate actions and processes in accordance with programs stored in a Read Only Memory (ROM) 602 or loaded from a storage device 608 into a Random Access Memory (RAM) 603. In RAM 603, various programs and data necessary for operation of electronic device 600 are also stored. Processor 601, ROM 602, and RAM 603 are connected to each other via a bus 604. An input/output (I/O) interface 605 is also connected to bus 604.

Generally, the following devices may be connected to the I/O interface 605: input devices 606 including, for example, a touch screen, touch pad, keyboard, mouse, camera, microphone, accelerometer, gyroscope, etc.; output devices 607 including, for example, a Liquid Crystal Display (LCD), a speaker, a vibrator, and the like; storage 608 including, for example, tape, hard disk, etc.; and a communication device 609. The communication means 609 may allow the electronic device 600 to communicate with other devices wirelessly or by wire to exchange data. While the electronic device 600 is illustrated with various means, it is not required that all illustrated means be implemented or provided. More or fewer devices may alternatively be implemented or provided.

In particular, the processes described above with reference to the flow diagrams may be implemented as computer software programs, according to embodiments of the present disclosure. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a non-transitory computer readable medium, the computer program containing program code for performing a map quality inspection method provided by any of the above-described embodiments of the present disclosure. In such an embodiment, the computer program may be downloaded and installed from a network via the communication means 609, or installed from the storage means 608, or installed from the ROM 602. When executed by the processor 601, the computer program may perform the functions defined in the map quality inspection method provided by any embodiment of the present disclosure.

It should be noted that the computer readable medium in the present disclosure can be a computer readable signal medium or a computer readable storage medium or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present disclosure, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In contrast, in the disclosed embodiments, a computer readable signal medium may comprise a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: electrical wires, optical cables, RF (radio frequency), etc., or any suitable combination of the foregoing.

In some embodiments, the clients, servers may communicate using any currently known or future developed network Protocol, such as HTTP (HyperText Transfer Protocol), and may interconnect any form or medium of digital data communication (e.g., a communications network). Examples of communication networks include a local area network ("LAN"), a wide area network ("WAN"), the Internet (e.g., the Internet), and peer-to-peer networks (e.g., ad hoc peer-to-peer networks), as well as any currently known or future developed network.

The computer readable medium may be embodied in the electronic device; or may be separate and not incorporated into the electronic device.

The computer readable medium carries one or more programs, and when the one or more programs are executed by the electronic device, the electronic device is enabled to execute the map quality inspection method provided by any embodiment of the disclosure.

In embodiments of the present disclosure, computer program code for carrying out operations of the present disclosure may be written in any combination of one or more programming languages, including but not limited to an object oriented programming language such as Java, smalltalk, C + +, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the computer, partly on the computer, as a stand-alone software package, partly on the computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

The units described in the embodiments of the present disclosure may be implemented by software or hardware. Where the name of an element does not in some cases constitute a limitation on the element itself.

The functions described herein above may be performed, at least in part, by one or more hardware logic components. For example, without limitation, exemplary types of hardware logic components that may be used include: field Programmable Gate Arrays (FPGAs), application Specific Integrated Circuits (ASICs), application Specific Standard Products (ASSPs), system on a chip (SOCs), complex Programmable Logic Devices (CPLDs), and the like.

In the context of this disclosure, a computer-readable medium may be a tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of a computer-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

The foregoing description is only exemplary of the preferred embodiments of the disclosure and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the disclosure herein is not limited to the particular combination of features described above, but also encompasses other embodiments in which any combination of the features described above or their equivalents does not depart from the spirit of the disclosure. For example, the above features and the technical features disclosed in the present disclosure (but not limited to) having similar functions are replaced with each other to form the technical solution.

Further, while operations are depicted in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order. Under certain circumstances, multitasking and parallel processing may be advantageous. Likewise, while several specific implementation details are included in the above discussion, these should not be construed as limitations on the scope of the disclosure. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

Claims

1. A map quality inspection method, comprising:

2. The method of claim 1, wherein the mapping process comprises a map data production phase and/or a map data compilation phase.

3. The method of claim 1, wherein the determining a target module identification in response to a target operation instruction generated in a mapping process comprises:

responding to the target operation instruction, inquiring a preset element identifier mapping relation based on the target map data element, and determining the target module identifier from all candidate module identifiers; the preset element identifier mapping relation is used for recording the corresponding relation between the map data element and at least one candidate module identifier;

and/or in response to the target operation instruction, determining a quality inspection module category based on the target map data element, and determining the target module identifier from each candidate module identifier corresponding to the quality inspection module category.

4. The method of claim 1, wherein after said invoking said target quality inspection module, performing a quality inspection on said target map data element, and determining a quality inspection result of said target map data element, said method further comprises:

determining the quality testing confidence of the quality testing result;

and performing target processing operation on the target map data element based on the quality inspection result and the quality inspection confidence.

5. The method of claim 4, wherein the performing a target processing operation on the target map data element based on the quality inspection result and the quality inspection confidence comprises:

if the quality inspection result is determined to be wrong and the quality inspection confidence coefficient is higher than a first confidence coefficient threshold value, sending error information corresponding to the target map data element to a corresponding map data production stage; wherein the error information comprises the target map data elements and an error cause;

and/or if the target operation instruction is generated after the map data production stage is finished or the map data compiling stage is finished, and the quality inspection confidence coefficient is determined to be lower than a second confidence coefficient threshold value, the quality inspection task corresponding to the target map data element is transferred to the manual quality inspection platform.

6. The method of claim 2, wherein the invoking of the target quality inspection module performs quality inspection on the target map data element corresponding to the target operation instruction, and the determination of the quality inspection result of the target map data element comprises at least one of:

if the map manufacturing process is the map data production stage and the calling mode of the target quality inspection module is determined to belong to a real-time calling mode, calling the target quality inspection module on line, performing quality inspection on the target map data elements, and determining the quality inspection result;

if the map manufacturing process is the map data production stage and the calling mode of the target quality inspection module is determined not to belong to the real-time calling mode, calling the target quality inspection module offline, performing quality inspection on the target map data elements, and determining the quality inspection result;

and if the map making process is the end of the map data production stage and/or the map data compiling stage, calling the target quality inspection module offline, performing quality inspection on the target map data elements, and determining the quality inspection result.

7. The method of claim 6, wherein determining whether the calling mode of the target quality inspection module belongs to the real-time calling mode comprises:

inquiring a preset module calling mapping relation based on the target module identification, and determining a target calling identification corresponding to the target quality inspection module; the preset module calling mapping relation is used for recording the corresponding relation between the candidate module identification and the calling identification; the target calling identification is used for representing whether the calling mode of the target quality inspection module belongs to the real-time calling mode or not;

8. A map quality inspection apparatus, comprising:

9. An electronic device, comprising:

a memory and a processor, the memory for storing the processor-executable instructions;

the processor is used for reading the executable instructions from the memory and executing the executable instructions to realize the map quality inspection method according to any one of claims 1 to 7.

10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the map quality inspection method according to any one of claims 1 to 7.