CN115435947A - Film type sensor for underground stress test and mounting method thereof - Google Patents
Film type sensor for underground stress test and mounting method thereof Download PDFInfo
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- CN115435947A CN115435947A CN202210908454.3A CN202210908454A CN115435947A CN 115435947 A CN115435947 A CN 115435947A CN 202210908454 A CN202210908454 A CN 202210908454A CN 115435947 A CN115435947 A CN 115435947A
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- 238000012360 testing method Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 claims abstract description 114
- 239000010408 film Substances 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000010409 thin film Substances 0.000 claims abstract description 36
- 238000009434 installation Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 32
- 230000008054 signal transmission Effects 0.000 claims description 22
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000009662 stress testing Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000002474 experimental method Methods 0.000 abstract description 7
- 238000004880 explosion Methods 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
Abstract
The invention relates to a sensor for underground explosion experiment tests, in particular to a film type sensor for underground stress tests and an installation method thereof. The technical problem that the thin film type sensor is difficult to adapt to the measuring requirement of an external field experiment environment due to the fact that the protection of a wiring position and the impedance matching problem of a packaging structure are not considered in the packaging of the existing thin film type sensor is solved. The invention relates to a film sensor for an underground stress test, which comprises a film sensor and a packaging unit, wherein the film sensor is arranged on the film sensor; the packaging unit comprises a substrate, a cover plate and a packaging box, wherein the cover plate and the packaging box are fixedly connected to the substrate, and the connecting position of the cover plate and the packaging box is partially overlapped; the packaging box is a box body with an opening at the bottom, and a wiring outlet is arranged at the joint output end of the box body; the film sensor is arranged between the cover plate and the base plate, and the joint of the film sensor is positioned in the packaging box and led out from the wiring outlet of the packaging box; the base plate and the cover plate are both made of materials with wave impedance close to a local medium to be tested.
Description
Technical Field
The invention relates to a sensor for underground explosion experiment testing, in particular to a film type sensor for underground stress testing and an installation method thereof.
Background
One of the contents of the explosion mechanics research is the propagation and evolution rule of the explosion stress wave in the rock-soil medium. When explosion happens, stress waves are excited in surrounding media and propagate outwards, and the media on a propagation path move regularly. By measuring the characteristics of the mechanical parameters at different positions, the attenuation rule of the path medium on the stress waveform can be obtained.
Since the stress wave propagates inside the medium, the relevant sensor needs to be installed inside the medium, but the installation of the sensor itself affects the medium, so that the sensor is required to be as small as possible and to be impedance-matched with the surrounding medium. The thin film sensor can better meet the use requirement due to the characteristics of thin structure, small volume and high sensitivity, and has wide application in the field of explosion mechanics experiments. During experiment, the device is placed in a solidified impedance matching material, surrounding media are compressed when shock waves are transmitted, so that the sensor is stressed, and experimental data are obtained through a test circuit. In this process, because the sensor can't the direct mount on the support, and the sensor can receive mud striking and soaking in the in-process of pouring, there is the possibility of structural deformation, circuit short circuit and sensor damage. Therefore, for such experiments, it is necessary to provide a packaging method capable of ensuring positioning, water resistance, impact resistance and impedance matching. Although the prior art provides a packaging process and a device of a thin film sensor, which can ensure the installation protection and positioning of the thin film sensor to a certain degree, the problems of protection of a wiring position and impedance matching of the device are not considered in the design of related structures, short circuit risks exist, measurement errors are easily introduced, and the requirements of installation and measurement of free field movement in an external field experimental environment are difficult to adapt.
Disclosure of Invention
The invention aims to solve the technical problem that the thin film sensor is difficult to adapt to the measuring requirement of an external field experimental environment due to the fact that the protection of a wiring position and the impedance matching of a packaging structure are not considered in the packaging of the conventional thin film sensor, and provides a thin film sensor for an underground stress test and an installation method thereof.
The technical solution of the invention is as follows:
a film sensor for underground stress test is characterized in that: the sensor comprises a thin film sensor and a packaging unit;
the packaging unit comprises a substrate, a cover plate and a packaging box, wherein the cover plate and the packaging box are fixedly connected to the upper surface of the substrate in sequence along the leading-out direction of the signal transmission line;
the packaging box is a box body with an opening at the bottom, a wiring outlet end of a thin film sensor signal transmission line is arranged on the side wall of the box body, and a connector output end is arranged far away from the cover plate;
the thin film sensor is arranged between the cover plate and the base plate, a joint of one end of the thin film sensor, which is provided with a signal transmission line, is positioned in the packaging box, and the signal transmission line is led out from a wiring outlet of the joint output end;
the substrate and the cover plate are both made of materials with wave impedance close to a local medium to be tested.
Furthermore, the connection part of the cover plate and the packaging box is respectively provided with a stepped structure which is matched with each other, and the cover plate and the packaging box are in lap joint through the stepped structures.
Furthermore, the joint output end of the packaging box is a detachable joint packaging box plugging block; and a wiring outlet of a signal transmission line is arranged in the middle of the plug block of the joint packaging box.
Further, the bottom ends of the two sides of the packaging box are provided with outer edges extending outwards; the outer edge of the packaging box is connected with the substrate through bolts and nuts.
Furthermore, the outer edge of the packaging box and the cover plate are connected with the base plate through the same bolt and nut at the overlapping part.
Furthermore, a boss matched with the box body of the packaging box is arranged on the inner side of the joint packaging box plugging block, the boss extends into the box body, and the edge parts of the boss are respectively contacted with the inner wall of the packaging box; mounting holes are respectively formed in four corners of the substrate; the packaging box is made of castable epoxy resin.
The mounting method of the film type sensor for the underground stress test is used for mounting the film type sensor for the underground stress test, and is characterized by comprising the following steps of:
step S1), cleaning each part before use;
step S2) fixing the film sensor
Drawing a sticking indication line of the film sensor at a preset position of the substrate; coating glue in the indicating line, pasting the film sensor in the indicating line on the substrate, ensuring that the sensitive area of the film sensor is positioned in the middle of the cover plate, scraping the film sensor, extruding bubbles, removing redundant glue, waiting for the curing of the film sensor;
step S3) packaging the sensitive part of the sensor
Coating glue on the surfaces of the film sensor and the substrate, fixing the cover plate on the substrate, removing the redundant glue, and waiting for curing;
step S4) packaging a sensor cable part;
putting a connector of the film sensor and a signal transmission line into a packaging box, fixing the packaging box on a substrate, leading out the signal transmission line of the film sensor from a wiring outlet on the packaging box, and pouring glue water to the bottom of the packaging box to completely seal the bottom;
step S5), installation;
and fixing the substrate packaged with the film sensor to a required test position to complete the installation of the film sensor.
Further, in the step S2), the glue coated in the indication line is quick-drying glue with good flowing performance;
in the step S3) and the step S4), the glue is the glue with higher later-stage bonding strength.
Furthermore, the glue needs to generate low heat in unit time, and the temperature of the installation position of the film sensor (3) does not exceed the allowable upper temperature limit in the curing process.
The invention has the beneficial technical effects that:
1. according to the film type sensor for the underground stress test, the film sensor is packaged between the cover plate and the base plate, the joint part is led out from the packaging box, the cover plate and the packaging box are provided with the overlapped part, the joint position of the film sensor is completely packaged, the sealing performance is good, the joint is well protected, the whole packaging structure can prevent the film sensor from deforming and being waterproof in the backfilling process, and the testing accuracy is further guaranteed; in addition, the base and the cover plate are made of materials with the same impedance as the local medium to be tested, so that the impedance matching problem of the packaging structure and the sensor is well solved, and the accuracy and the reliability of test data of the experiment are ensured.
2. According to the film sensor for the underground stress test, the cover plate and the packaging box are provided with the overlapped parts and are in lap joint by adopting the stepped structure, so that the tight joint of the joint is ensured, the fixation is reliable, and the sealing performance of the package is further ensured.
3. The invention relates to a film sensor for underground stress test.A packaging box is designed to be an opening at the bottom, and a connector output end is of a detachable block structure, so that a cavity is formed to protect a connector connection part of the film sensor.
4. The film type sensor for the underground stress test has the advantages of simple packaging structure, convenience in packaging, time and labor saving and low cost.
5. The invention relates to a film sensor for underground stress test, wherein the packaging box and the joint packaging box plugging block are processed by cast plastics such as epoxy resin, and the manufacturing cost is low.
6. According to the film sensor for the underground stress test, the boss is designed on the inner side face of the plug block of the connector packaging box and can be embedded into the packaging box, and the connector outlet is formed in the middle of the plug block, so that a signal transmission line can be fixed conveniently, and the connection part is protected.
7. The invention relates to a mounting method of a film type sensor for an underground stress test, which realizes the waterproof, moistureproof and extrusion prevention of the film type pressure sensor through a glue sealing process;
8. according to the mounting method of the film sensor for the underground stress test, the quick-drying glue with good flowing property is selected between the substrate and the film sensor, and the glue with high later-stage bonding strength is adopted for curing the other parts, so that the mounting time is saved and the mounting reliability is ensured.
9. According to the mounting method of the film sensor for the underground stress test, the used glue requires low heat generation in unit time, the temperature at the position of the film sensor does not exceed the allowable upper temperature limit in the curing process, and the usability of the film sensor is ensured.
Drawings
FIG. 1 is a schematic structural diagram of a thin film sensor for an underground stress test according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a substrate in an embodiment of a thin film sensor for an underground stress test according to the present invention;
FIG. 3 is a schematic structural diagram of a cover plate in an embodiment of a thin film sensor for an underground stress test according to the present invention;
FIG. 4 is a side view in the width direction of the enclosure box of the embodiment of FIG. 1;
FIG. 5 is a top view of the enclosure of the embodiment of FIG. 1;
FIG. 6 is a side view in the length direction of the enclosure of the embodiment of FIG. 1;
fig. 7 is a schematic view of the construction of the splice enclosure block of the embodiment of fig. 1;
fig. 8 is a left side view of fig. 7.
Reference numerals:
1-base plate, 2-cover plate, 3-film sensor, 4-bolt, 5-nut, 6-packaging box and 7-joint packaging box block.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1, the thin film sensor for an underground stress test according to the present invention includes a thin film sensor 3 and a package unit.
The packaging unit comprises a substrate 1, a cover plate 2 and a packaging box 6, wherein the cover plate 2 and the packaging box are fixedly connected to the upper surface of the substrate 1 in sequence along the leading-out direction of the signal transmission line. As shown in fig. 2, the substrate 1 is a square thin plate, and the four corners of the substrate are respectively provided with mounting holes for mounting the whole thin film sensor 3 to a region to be tested for testing after being packaged, and the middle part of the substrate is provided with the thin film sensor 3 and a packaging box 6. As shown in fig. 3, the cover plate 2 is a square thin plate having an area smaller than that of the base plate 1, and the cover plate 2 is fixedly connected to the upper surface of the base plate 1 by bolts 4 and nuts 5. Wherein, the connection position of the cover plate 2 and the packaging box 6 is partially overlapped, and the packaging box 6 of the overlapped part is fixedly connected on the upper surface of the cover plate 2. The connection parts of the overlapping positions of the cover plate 2 and the packaging box 6 are respectively provided with a ladder structure which is matched with each other, the two are in lap joint through the ladder structures, the tight joint of the joint parts is ensured, the fixation is reliable, and the sealing performance of the packaging is further ensured. The cover plate 2 is located in a left area in the middle of the base plate 1, the cover plate and the base plate both adopt materials with wave impedance close to a local medium to be tested, the impedance matching problem of the packaging structure and the sensor is well solved, and the accuracy and the reliability of test data are further guaranteed. The film sensor 3 is arranged between the cover plate 2 and the base plate 1, the sensitive area of the film sensor 3 is arranged between the base plate 1 and the cover plate 2, and the joint of the film sensor 3 is positioned in the packaging box 6 and is output from the wiring outlet of the packaging box 6.
As shown in fig. 4 to 6, the packaging box 6 is a box body with an opening at the bottom, one end of the side wall of the box body, which is provided with a wiring outlet of the signal transmission line of the film sensor 3, is a connector output end, and the connector output end is far away from the cover plate 2. The joint output end of the packaging box 6 is a detachable joint packaging box block 7, the middle part of the joint packaging box block 7 is provided with a wiring outlet of a signal transmission line, the connection part of the film sensor 3 output from the cover plate 2 is ensured to be completely positioned in the box body, the signal transmission line is output from the wiring outlet, the sealing performance of the joint part of the film sensor 3 is ensured in an all-dimensional manner, the film sensor 3 is enabled to be waterproof, the anti-collision and the like, the measurement signal is enabled not to be influenced by foreign objects, and the measurement accuracy and reliability are ensured. In order to facilitate installation and ensure sealing performance, the bottom ends of two sides of the packaging box 6 are provided with outer edges extending outwards; the outer edge of the packaging box 6 is connected with the substrate 1 through the bolt 4 and the nut 5, and at the overlapping position, the packaging box 6 is overlapped with the mounting hole of the cover plate 2, and the same bolt 4 and the same nut 5 are used for connecting with the substrate 1. As shown in fig. 7 to 8, a boss adapted to the box body of the packaging box 6 is disposed on the inner side of the joint packaging box block 7, the joint packaging box block 7 blocks the joint output end of the packaging box 6, and the boss extends into the box body and the edge portion of the boss is in sealing contact with the inner wall of the packaging box 6. The packaging box 6 and the joint packaging box plugging block are both made of castable plastics such as epoxy resin and the like, and the manufacturing cost is low.
Meanwhile, the invention also provides an installation method of the film sensor for the underground stress test, which comprises the following steps:
step S1), cleaning and inspecting each part before use;
firstly, checking whether the components are in good condition, cleaning the components such as the outer surface of the substrate 1, the lower plane of the cover plate 2, the packaging box 6, the joint packaging box plugging block 7 and the like by using alcohol, and ensuring that the surfaces are free of pollution.
Step S2), fixing the thin film sensor;
according to a preset position, drawing a sticking indicating line which accords with the size of the film sensor 3 on the substrate 1, and ensuring that the indicating line is vertical and is positioned in a cavity side line of the packaging box 6; glue is smeared in the indicating line, the thin film sensor 3 is pasted to the indicating line on the substrate 1, the sensitive area of the thin film sensor 3 is ensured to be positioned in the middle of the matching position of the cover plate 2 and the substrate 1, the thin film sensor 3 is scraped to be smooth by a scraping plate, bubbles and redundant glue between the thin film sensor 3 and the substrate 1 are extruded, the redundant glue is wiped, and the thin film sensor is waited for and solidified.
Step S3) packaging a sensitive part of the sensor;
after the film sensor 3 is fixed to the substrate 1, more glue is smeared on the surfaces of the film sensor 3 and the substrate 1, the cover plate 2 is fixed to the substrate 1 through the bolts 4 and the nuts 5, and the extruded excessive glue is wiped to wait for solidification.
Step S4) packaging a sensor cable part;
after the cover plate 2 is solidified to the substrate 1, a bolt 4 and a nut 5 below the cover plate 2 are disassembled, redundant parts of the film sensor 3 are folded, a joint of a signal transmission line is connected with the film sensor 3, the folded parts and the joint of the signal transmission line are placed into the packaging box 6 together, the packaging box 6 and the cover plate 2 are connected onto the substrate 1 through the bolt 4 and the nut 5, glue is filled into the packaging box 6 until the inside of the packaging box is flush with the bottom of an internal ladder, the signal transmission line of the film sensor 3 penetrates through a wiring outlet of a joint packaging box plugging block 7, the joint packaging box plugging block 7 is arranged into the packaging box 6, the matching of a boss and a cavity of the packaging box 6 is guaranteed, the glue is solidified, and the sensor is packaged.
Step S5) installation
And fixing the substrate 1 packaged with the thin film sensor 3 to a required test position, and finishing the installation of the thin film sensor.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications and equivalent variations of the above embodiments according to the technical spirit of the present invention are included in the scope of the present invention.
Claims (9)
1. A film type sensor for underground stress test is characterized in that: comprises a film sensor (3) and a packaging unit;
the packaging unit comprises a substrate (1), a cover plate (2) and a packaging box (6) which are sequentially and fixedly connected to the upper surface of the substrate (1) along the leading-out direction of the signal transmission line, the connecting position of the cover plate (2) and the packaging box (6) is partially overlapped, and the packaging box (6) of the overlapped part is fixedly connected to the upper surface of the cover plate (2);
the packaging box (6) is a box body with an opening at the bottom, one end of the side wall of the box body, which is provided with a wiring outlet of a signal transmission line of the film sensor (3), is a connector output end, and the connector output end is far away from the cover plate (2);
the thin film sensor (3) is arranged between the cover plate (2) and the base plate (1), a joint of one end, provided with a signal transmission line, of the thin film sensor (3) is positioned in the packaging box (6), and the signal transmission line is led out from a wiring outlet of the joint output end;
the substrate (1) and the cover plate (2) are both made of materials with wave impedance close to a local medium to be tested.
2. The film sensor for underground stress test according to claim 1, wherein:
the connection parts of the cover plate (2) and the packaging box (6) are respectively provided with mutually matched step structures, and the cover plate and the packaging box are in lap joint through the step structures.
3. The film sensor for underground stress test according to claim 2, wherein: the joint output end of the packaging box (6) is a detachable joint packaging box plugging block (7);
and a wiring outlet of a signal transmission line is arranged in the middle of the joint packaging box plugging block (7).
4. The film sensor for underground stress test according to claim 3, wherein: the bottom ends of the two sides of the packaging box (6) are provided with outer edges extending outwards;
the outer edge of the packaging box (6) is connected with the substrate (1) through a bolt (4) and a nut (5).
5. The film sensor for underground stress testing according to claim 4, wherein: the outer edge of the packaging box (6) and the cover plate (2) are connected with the substrate (1) through the same bolt (4) and the same nut (5) at the overlapping part.
6. The film sensor for underground stress testing according to claim 5, wherein: the inner side of the joint packaging box plugging block (7) is provided with a boss matched with the box body of the packaging box (6), the boss extends into the box body, and the edge parts of the boss are respectively contacted with the inner wall of the packaging box (6);
four corners of the substrate (1) are respectively provided with a mounting hole;
the packaging box (6) is made of castable plastic epoxy resin.
7. A method for mounting a thin film sensor for an underground stress test according to any one of claims 1 to 6, comprising the steps of:
step S1), cleaning each part before use;
step S2) fixing the film sensor
Drawing a pasting indication line of the film sensor (3) at a preset position of the substrate (1); glue is smeared in the indication line, the thin film sensor (3) is pasted in the indication line on the substrate (1), the sensitive area of the thin film sensor (3) is ensured to be positioned in the middle of the cover plate (2), the thin film sensor (3) is strickled off, air bubbles are extruded out, redundant glue is removed, and the thin film sensor waits for the solidification of the redundant glue;
step S3) packaging the sensitive part of the sensor
Coating glue on the surfaces of the film sensor (3) and the substrate (1), fixing the cover plate (2) on the substrate (1), removing the redundant glue, and waiting for curing;
step S4) packaging a sensor cable part;
putting a joint of the thin film sensor (3) and a signal transmission line into a packaging box (6), fixing the packaging box (6) on a substrate (1), leading out the signal transmission line of the thin film sensor (3) from a wiring outlet on the packaging box (6), and pouring glue into the bottom of the packaging box (6) to completely seal the bottom;
step S5), installation;
and fixing the substrate (1) with the packaged film sensor (3) to a required test position to complete the installation of the film sensor.
8. The method for mounting the film sensor for the subsurface stress test according to claim 7, wherein:
in the step S2), quick-drying glue with good flowing performance is selected as glue coated in the indication line;
in the step S3) and the step S4), the glue is the glue with higher later-stage bonding strength.
9. The method for mounting a film sensor for an underground stress test according to claim 8, wherein: the glue needs to generate low heat in unit time, and the temperature at the installation position of the film sensor (3) does not exceed the allowable upper temperature limit in the curing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210908454.3A CN115435947A (en) | 2022-07-29 | 2022-07-29 | Film type sensor for underground stress test and mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210908454.3A CN115435947A (en) | 2022-07-29 | 2022-07-29 | Film type sensor for underground stress test and mounting method thereof |
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| Publication Number | Publication Date |
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| CN115435947A true CN115435947A (en) | 2022-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210908454.3A Pending CN115435947A (en) | 2022-07-29 | 2022-07-29 | Film type sensor for underground stress test and mounting method thereof |
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-
2022
- 2022-07-29 CN CN202210908454.3A patent/CN115435947A/en active Pending
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