CN115433541B - Conductive adhesive and preparation method thereof - Google Patents
Conductive adhesive and preparation method thereof Download PDFInfo
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- CN115433541B CN115433541B CN202211216385.6A CN202211216385A CN115433541B CN 115433541 B CN115433541 B CN 115433541B CN 202211216385 A CN202211216385 A CN 202211216385A CN 115433541 B CN115433541 B CN 115433541B
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 74
- 239000000853 adhesive Substances 0.000 title claims abstract description 72
- 238000002360 preparation method Methods 0.000 title abstract description 13
- -1 phenyl vinyl Chemical group 0.000 claims abstract description 98
- 229920002545 silicone oil Polymers 0.000 claims abstract description 91
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 67
- 239000001257 hydrogen Substances 0.000 claims abstract description 67
- 239000003054 catalyst Substances 0.000 claims abstract description 34
- 239000011231 conductive filler Substances 0.000 claims abstract description 29
- 239000003112 inhibitor Substances 0.000 claims abstract description 25
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 22
- 239000003085 diluting agent Substances 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 40
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 17
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- 125000003545 alkoxy group Chemical group 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 125000004423 acyloxy group Chemical group 0.000 claims description 6
- 229920001558 organosilicon polymer Polymers 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 150000002170 ethers Chemical class 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-L fumarate(2-) Chemical class [O-]C(=O)\C=C\C([O-])=O VZCYOOQTPOCHFL-OWOJBTEDSA-L 0.000 claims description 2
- 238000003860 storage Methods 0.000 abstract description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 229920005573 silicon-containing polymer Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- JBSLOWBPDRZSMB-BQYQJAHWSA-N dibutyl (e)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C\C(=O)OCCCC JBSLOWBPDRZSMB-BQYQJAHWSA-N 0.000 description 1
- 229940008099 dimethicone Drugs 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application relates to a conductive adhesive and a preparation method thereof, wherein the conductive adhesive comprises the following components in parts by weight: 100 parts of phenyl vinyl silicone oil, 3-10 parts of phenyl hydrogen silicone oil, 0.08-0.6 part of hydrosilylation catalyst, 0.08-0.5 part of inhibitor, 4-10 parts of diluent, 0.8-3 parts of tackifier and 450-750 parts of conductive filler. The preparation method of the conductive adhesive comprises (1) mixing phenyl vinyl silicone oil, a diluent and a hydrosilylation catalyst for defoaming to obtain a mixture; (2) Sequentially adding an inhibitor, a tackifier and a conductive filler into the mixture obtained in the step (1), mixing and defoaming to obtain a base adhesive; (3) Adding phenyl hydrogen-containing silicone oil into the base gum obtained in the step (2) for mixing and defoaming. The conductive adhesive disclosed by the application has the advantages of low density, excellent low temperature resistance, excellent normal-temperature storage performance, excellent conductivity, high-low temperature impact resistance and good bonding performance; the preparation is simple, and the conductive adhesive is suitable for the fields of electronics, military industry and the like.
Description
Technical Field
The application relates to the technical field of conductive adhesive, in particular to conductive adhesive and a preparation method thereof.
Background
The electronic field adopts lead soldering to realize conductive connection, and the connection mode is gradually limited due to certain toxicity of lead, so that conductive adhesive sealant can realize conductive connection and simultaneously has the function of bonding and fixing, and the conductive adhesive is adopted to replace the traditional lead soldering to become a trend.
At present, the epoxy resin silver conductive adhesive in the market is dominant in excellent adhesive property, but the epoxy resin silver conductive adhesive has larger internal stress, poor impact resistance, easy cracking of products and poor high temperature resistance, and the organic silicon conductive adhesive is far superior to the epoxy resin conductive adhesive in temperature resistance, and has almost the same conductive property. The single-component organosilicon conductive sealant is convenient to operate and has good performance in the aspects of adhesion and high and low temperature cold and hot impact resistance. The single-component organosilicon conductive adhesive on the market has two types of condensation type and addition type, the condensation type conductive adhesive is stored at room temperature but has slower curing speed, the addition type conductive adhesive is heated and cured rapidly, but needs to be stored at a lower temperature (usually below 10 ℃), the temperature needs to be returned before use, inconvenience is brought to transportation and use, the requirements on the low-temperature performance and low density of the adhesive are further required in some aviation fields, the minimum use temperature of the common silicone rubber can only reach about-55 ℃, and the common conductive filler is usually a metal material such as gold, silver-coated copper and the like. Therefore, how to develop a single-component addition type low-density low-temperature resistant conductive organic silicon sealant capable of being stored at room temperature and rapidly cured at high temperature so as to be suitable for glue application in the electronic industry is a technical problem to be solved.
Disclosure of Invention
The application aims to provide a conductive adhesive which has excellent storage performance at room temperature, is quickly cured at high temperature and has low density, and can be applied to the fields of electronics, military industry and the like with higher requirements.
In a first aspect, the application relates to a conductive adhesive, which comprises the following components in parts by weight: 100 parts of phenyl vinyl silicone oil, 3-10 parts of phenyl hydrogen silicone oil, 0.08-0.6 part of hydrosilylation catalyst, 0.08-0.5 part of inhibitor, 4-10 parts of diluent, 0.8-3 parts of tackifier and 450-750 parts of conductive filler.
Optionally, the phenyl vinyl silicone oil is selected from one or more of phenyl vinyl silicone oils with vinyl content of 0.32-0.57% and phenyl content of 5-10%.
Optionally, the phenyl hydrogen-containing silicone oil is one or more of phenyl hydrogen-containing silicone oils with silicon-hydrogen bond content of 0.3-0.8% and phenyl content of 5-10%.
Optionally, the hydrosilylation catalyst is a platinum catalyst.
Optionally, the inhibitor is selected from one or more of alkynol, ether compound, amine compound, vinyl ring compound and fumarate compound.
Alternatively, the diluent is selected from phenyl polydimethylsiloxanes having a viscosity of 50-500mpa.s and a phenyl content of 5-10%.
Optionally, the tackifier is a polysilicone polymer containing alkoxy groups, epoxy groups and silicon-hydrogen bonds of the following structure:
x is greater than or equal to 8, y is greater than or equal to 5, and z is greater than or equal to 4.
Optionally, the tackifier is a silicone polymer containing alkoxy, acyloxy, epoxy and silicon-hydrogen bonds of the structure:
x is greater than or equal to 5, y is greater than or equal to 8, and z is greater than or equal to 4.
Optionally, the conductive filler is spherical silver-coated graphite powder and/or silver-coated glass powder.
Optionally, the particle size of the conductive filler is 10-40 μm.
In a second aspect, the present application relates to a method for preparing the above-mentioned conductive paste, comprising the steps of: (1) Mixing phenyl vinyl silicone oil, a diluent and a hydrosilylation catalyst for deaeration to obtain a mixture; (2) Sequentially adding an inhibitor, a tackifier and a conductive filler into the mixture obtained in the step (1), mixing and defoaming to obtain a base adhesive; (3) Adding phenyl hydrogen-containing silicone oil into the base gum obtained in the step (2) for mixing and defoaming.
The beneficial effects are that:
the conductive adhesive disclosed by the application has the advantages of low density, excellent low temperature resistance, excellent normal-temperature storage performance, excellent conductivity, high-low temperature impact resistance and good bonding performance; the preparation is simple, and the conductive adhesive is suitable for the fields of electronics, military industry and the like.
Detailed Description
The present application will be described in further detail by way of examples. The features and advantages of the present application will become more apparent from the description.
The word "exemplary" is used herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
In addition, the technical features described below in the different embodiments of the present application may be combined with each other as long as they do not collide with each other.
In a first aspect, the application relates to a conductive adhesive, which comprises the following components in parts by weight: 100 parts of phenyl vinyl silicone oil, 3-10 parts of phenyl hydrogen silicone oil, 0.08-0.6 part of hydrosilylation catalyst, 0.08-0.5 part of inhibitor, 4-10 parts of diluent, 0.8-3 parts of tackifier and 450-750 parts of conductive filler.
The conductive adhesive is an addition type conductive adhesive, contains a curing agent, is a single-component addition type conductive adhesive, and can be conveniently and directly used. In the conductive adhesive, phenyl vinyl silicone oil is used as a basic substance, and can well perform hydrosilylation reaction with phenyl hydrogen-containing silicone oil in the presence of a hydrosilylation catalyst, and a three-dimensional net-shaped product generated by hydrosilylation of the phenyl vinyl silicone oil and the phenyl hydrogen-containing silicone oil has good performance. In particular, the conductive adhesive with the above weight proportion can further obtain better performance.
According to one embodiment of the present application, the phenylvinyl silicone oil is selected from one or more of phenylvinyl silicone oils having a vinyl content of 0.32 to 0.57% and a phenyl content of 5 to 10%.
It should be noted that phenyl vinyl silicone oil refers to a silicone oil in which a part of methyl groups in the phenyl vinyl silicone oil is substituted with phenyl groups and vinyl groups, wherein the vinyl group content and the phenyl group content are as described above. The vinyl in the phenyl vinyl silicone oil can be subjected to addition reaction with a silicon-hydrogen bond in the phenyl hydrogen-containing silicone oil under the action of a catalyst, so that the linear phenyl vinyl silicone oil is converted into the conductive adhesive with the three-dimensional network structure.
In the phenylvinyl silicone oil, the vinyl content may refer to a molar percentage of the units containing vinyl groups in the molecule to the total number of all the molecular units; the phenyl content may refer to the mole percent of the total number of phenyl-containing units in the molecule.
According to one embodiment of the application, the phenyl hydrogen-containing silicone oil is selected from one or more of phenyl hydrogen-containing silicone oils with silicon-hydrogen bond content of 0.3-0.8% and phenyl content of 5-10%.
In the phenyl hydrogen-containing silicone oil, the content of the silicon hydrogen bond can refer to the mole percentage content of the chain units containing the silicon hydrogen bond in the molecule accounting for the total number of all the molecular chain units; the phenyl content may refer to the mole percent of the total number of phenyl-containing units in the molecule.
The phenyl hydrogen-containing silicone oil functions as a curing agent or a crosslinking agent. Phenyl hydrogen-containing silicone oil refers to a silicone oil in which part of methyl groups are replaced by hydrogen and phenyl groups, and the positions replaced by hydrogen form silicon-hydrogen bonds. The silicon-hydrogen bond in the phenyl hydrogen-containing silicone oil can be subjected to addition reaction with vinyl in the phenyl vinyl silicone oil under the catalysis of the catalyst to generate conductive silica gel with larger molecules.
Even if the phenyl hydrogen-containing silicone oil and the phenyl vinyl silicone oil undergo hydrosilylation reaction to obtain the conductive adhesive, the phenyl content and the silicon hydrogen bond content in the phenyl hydrogen-containing silicone oil and the phenyl content and the vinyl content in the phenyl vinyl silicone oil have important influences on the performance of a product obtained by the reaction of the phenyl hydrogen-containing silicone oil and the phenyl vinyl silicone oil. In the conductive adhesive, the conductive adhesive with better performance can be further obtained by carrying out hydrosilylation reaction on phenyl hydrogen-containing silicone oil and phenyl vinyl silicone oil, and particularly, the comprehensive control of the phenyl content and the silicon hydrogen bond content in the phenyl hydrogen-containing silicone oil, the phenyl content and the vinyl content in the phenyl vinyl silicone oil.
According to one embodiment of the application, the hydrosilylation catalyst is a platinum catalyst.
It should be noted that the number of electron layers of platinum atoms is large, the radius is relatively large, and the electron structure is similar to the olefin double bond in the aspects of radius, energy level and the like; in particular, in the conductive adhesive, the platinum catalyst can better catalyze the addition reaction of a silicon-hydrogen bond in phenyl hydrogen-containing silicone oil and vinyl in phenyl vinyl silicone oil. Specifically, the platinum catalyst can be chloroplatinic acid or a complex catalyst of platinum and vinyl double-end socket.
According to one embodiment of the application, the inhibitor is selected from one or more of alkynols, ethers, amines, vinyl rings and fumarates.
The conductive adhesive has a certain storage period and a certain applicable period by adding the inhibitor after the phenylvinyl silicone oil, the phenylhydrogen silicone oil and the hydrosilylation catalyst are contacted to generate a hydrosilylation reaction. In the conductive adhesive, based on the phenyl vinyl silicone oil, the phenyl hydrogen silicone oil and the platinum catalyst, one or more of alkynol, ether compounds, amine compounds, vinyl ring bodies and fumarylates are used as inhibitors, so that the conductive adhesive can obtain better comprehensive performance.
According to one embodiment of the application, the diluent is selected from phenyl polydimethylsiloxanes having a viscosity of 50-500mpa.s and a phenyl content of 5-10%.
The phenyl content of phenyl dimethicone may refer to the molar percentage of the total number of phenyl-containing units in the molecule.
The thinner has good fluidity and low viscosity, the fluidity can be improved and the viscosity can be reduced by adding the thinner, and the thickness of the conductive adhesive can be controlled within a preferable numerical range by controlling the material type, the viscosity and the dosage of the thinner.
According to one embodiment of the application, the adhesion promoter is a silicone polymer containing alkoxy groups, epoxy groups, and silicon-hydrogen bonds of the structure:
x is greater than or equal to 8, y is greater than or equal to 5, and z is greater than or equal to 4.
The organic silicon polymer containing alkoxy, epoxy and silicon-hydrogen bond with the structure is used as tackifier, can be compatible with the phenyl vinyl silicone oil and the phenyl hydrogen-containing silicone oil, and the conductive adhesive obtained by compounding the components with the tackifier with the structure obtains very good physical and mechanical properties, electrical properties and the like.
According to another embodiment of the application, the adhesion promoter is a silicone polymer containing alkoxy groups, acyloxy groups, epoxy groups, and silicon hydrogen bonds of the structure:
x is greater than or equal to 5, y is greater than or equal to 8, and z is greater than or equal to 4.
The organic silicon polymer containing alkoxy, acyloxy, epoxy and silicon-hydrogen bond with the structure is used as tackifier, can be compatible with the phenyl vinyl silicone oil and the phenyl hydrogen silicone oil, and the conductive adhesive obtained by compounding the components with the tackifier with the structure obtains very good physical and mechanical properties, electrical properties and the like. Acyloxy groups, also known as acyl groups, may be represented by-COR, where O and C are linked by a double bond.
According to one embodiment of the application, the conductive filler is spherical silver-coated graphite powder and/or silver-coated glass powder.
The silver-coated graphite powder and/or the silver-coated glass powder are uniformly dispersed in the conductive adhesive, and the conductive adhesive has good conductive performance by the mutual contact and communication of the silver-coated graphite powder and/or the silver-coated glass powder particles. The conductive filler improves the conductivity on one hand and the mechanical property on the other hand.
As a preferred embodiment, the particle size of the conductive filler is 10-40 μm.
The selection of the conductive filler material and the control of the particle size play an important role in the performance parameters of the conductive adhesive, and under the condition that the various materials are selected, the conductive filler is selected and the particle size is controlled so that the performance of the conductive adhesive is better.
In the conductive adhesive, the components in the mass ratio are compounded to ensure that the conductive adhesive has good physical and mechanical properties, electrical properties and the like. More importantly, by selecting phenyl vinyl silicone oil with vinyl content of 0.32-0.57% and phenyl content of 5-10%, phenyl hydrogen-containing silicone oil with silicon-hydrogen bond content of 0.3-0.8% and phenyl content of 5-10%, platinum catalyst, and simultaneously selecting inhibitor, diluent, tackifier and conductive filler as the specific types, the conductive adhesive further obtains better physical and mechanical properties, electrical properties and the like.
In a second aspect, the present application relates to a method for preparing the above-mentioned conductive paste, comprising the steps of:
(1) Mixing phenyl vinyl silicone oil, a diluent and a hydrosilylation catalyst for deaeration to obtain a mixture; (2) Sequentially adding an inhibitor, a tackifier and a conductive filler into the mixture obtained in the step (1), mixing and defoaming to obtain a base adhesive; (3) Adding phenyl hydrogen-containing silicone oil into the base gum obtained in the step (2) for mixing and defoaming.
The mixing and deaeration in steps (1) to (3) may be performed in a rotary mixing deaerator.
In the step (2), after the inhibitor, the tackifier and the conductive filler are added to the mixture, the first mixing and defoaming are performed at a first rotation speed and a vacuum degree, then the second mixing and defoaming are performed at a second rotation speed and a vacuum degree, the second rotation speed is higher than the first rotation speed, the obtained base adhesive is further subjected to the subsequent step (3), and finally the prepared conductive adhesive can obtain better performance parameters.
In the preparation method of the present application, the diluent is used to control the consistency of the mixture formed by mixing and defoaming the phenylvinyl silicone oil, the diluent and the hydrosilylation catalyst in a certain preferred range through the step (1), and meanwhile, the hydrosilylation catalyst is uniformly dispersed in the mixture obtained in the step (1). Through the step (2), the inhibitor, the tackifier and the conductive filler are uniformly dispersed in the base adhesive, and the viscosity of the base adhesive is controlled within a certain preferred range by adding the tackifier. Enabling phenyl hydrogen-containing silicone oil to enter the base adhesive obtained in the step (2) through the step (3), and enabling the phenyl hydrogen-containing silicone oil to contact phenyl vinyl silicone oil in the presence of a hydrosilylation catalyst, wherein the phenyl hydrogen-containing silicone oil and the phenyl vinyl silicone oil can undergo a hydrosilylation reaction; the existence of the inhibitor can slow down the reaction between the phenyl hydrogen-containing silicone oil and the phenyl vinyl silicone oil, so that the conductive adhesive can maintain good performance in a certain storage period and a certain applicable period.
The application is illustrated in further detail by the following examples.
The reagents used in the examples below are all commercially available except for the adhesion promoters.
Example 1
100 parts of phenyl vinyl silicone oil;
4 parts of curing agent phenyl hydrogen silicone oil;
0.08 parts of catalyst;
0.1 parts of inhibitor;
8 parts of a diluent;
0.8 parts of tackifier;
450 parts of conductive filler;
the phenyl vinyl silicone oil used in this example has a vinyl content of 0.32%, a phenyl content of 5%, a silicone bond content of the phenyl hydrogen silicone oil as a curing agent of 0.8%, a phenyl content of 5%, chloroplatinic acid as a catalyst, propargyl alcohol as an inhibitor, phenyl polydimethylsiloxane having a viscosity of 350mpa.s and a phenyl content of 5%, and a tackifier of an organosilicon polymer containing alkoxy groups, epoxy groups and a silicone bond, wherein the structural formula is:
x is more than or equal to 8, y is more than or equal to 5, and z is more than or equal to 4; the preparation method of the tackifier comprises the following steps:
putting 24g of D4H, 16.3g of vinyl trimethoxy silane and 13.7g of allyl glycidyl ether into a 250mL three-neck flask, adding 30mL of toluene as a solvent, and reacting at 80 ℃ under the protection of nitrogen for 4 hours; and distilling the product after the reaction is finished, and removing low-boiling-point substances to obtain the transparent tackifier.
The conductive filler is a mixture of 200 parts of 10um silver-coated graphite powder and 250 parts of 40um silver-coated glass powder.
The preparation method of the single-component addition type organosilicon conductive adhesive comprises the following steps:
a) Weighing phenyl vinyl silicone oil, a catalyst and a diluent according to parts by weight, adding the phenyl vinyl silicone oil, the catalyst and the diluent into a stirrer, mixing and defoaming for 10min, and obtaining a mixture at a rotating speed of 50 r/min;
b) Weighing inhibitor, tackifier and conductive filler according to parts by weight, adding the inhibitor, tackifier and conductive filler into the mixture, mixing in a stirrer, mixing and defoaming for 10min at a rotating speed of 20r/min and a vacuum degree of-0.1 MPa, and mixing and defoaming for 20min at a rotating speed of 50r/min and a vacuum degree of-0.1 MPa to obtain base rubber;
c) Weighing phenyl hydrogen-containing silicone oil as a curing agent according to parts by weight, adding the phenyl hydrogen-containing silicone oil into the base adhesive, and mixing and defoaming the base adhesive for 10 minutes in a stirrer at a rotating speed of 40r/min and a vacuum degree of-0.1 MPa to obtain the single-component addition type organosilicon conductive adhesive.
Example 2
100 parts of phenyl vinyl silicone oil;
7 parts of curing agent phenyl hydrogen silicone oil;
0.4 parts of catalyst;
0.5 parts of inhibitor;
10 parts of diluent;
3 parts of tackifier;
750 parts of conductive filler;
the phenyl vinyl silicone oil vinyl content used in this example was 0.5% phenyl content 7%, the curing agent phenyl hydrogen silicone oil silicon hydrogen bond content 0.3%, the phenyl content 7%, the inhibitor dibutyl fumarate, the diluent phenyl polydimethylsiloxane having a viscosity of 50mpa.s and a phenyl content of 7%, the catalyst and tackifier were the same as in example 1, and the conductive filler was a mixture of 400 parts of 10um silver-coated graphite and 350 parts of 10um silver-coated glass.
The preparation method of the single-component addition type organosilicon conductive adhesive is the same as that of example 1.
Example 3
100 parts of phenyl vinyl silicone oil;
10 parts of curing agent phenyl hydrogen silicone oil;
0.2 parts of catalyst;
0.25 parts of inhibitor;
8 parts of a diluent;
2 parts of tackifier;
500 parts of conductive filler;
the phenyl vinyl silicone oil used in this example had a vinyl content of 0.57%, a phenyl content of 10%, a curing agent was phenyl hydrogen silicone oil having a silicon-hydrogen bond content of 0.3%, a phenyl content of 10%, an inhibitor was 1-ethynyl cyclohexanol, a diluent was phenyl polydimethylsiloxane having a viscosity of 200mpa.s and a phenyl content of 10%, a catalyst and a tackifier were the same as in example 1, and a conductive filler was 40um silver-coated graphite.
The preparation method of the single-component addition type organosilicon conductive adhesive is the same as that of example 1.
Example 4
A conductive paste was prepared in the same manner as in example 1 except that:
the tackifier is an organosilicon polymer containing alkoxy, acyloxy, epoxy and silicon-hydrogen bond with the following structure:
x is greater than or equal to 5, y is greater than or equal to 8, and z is greater than or equal to 4.
The preparation method of the tackifier comprises the following steps:
24g of D4H, 25.7g of 3- (acryloyloxy) propyl trimethoxysilane and 13.7g of allyl glycidyl ether are placed in a 250mL three-neck flask, 30mL of toluene is added as a solvent, and the reaction is carried out under the protection of nitrogen, wherein the reaction temperature is 80 ℃ and the reaction time is 4 hours; and distilling the product after the reaction is finished, and removing low-boiling-point substances to obtain the transparent tackifier.
Example 5
A conductive paste was prepared in the same manner as in example 2, except that the tackifier was replaced with the tackifier prepared in example 4.
Example 6
A conductive paste was prepared in the same manner as in example 3, except that the tackifier was replaced with the tackifier prepared in example 4.
Test example 1
In order to examine the mechanical properties and the conductive adhesion conditions of the organosilicon conductive adhesive prepared in examples 1 to 6, the applicant cures the single-component addition type organosilicon conductive adhesive in the above examples in an oven at 150 ℃ for 1 hour to prepare a test piece with the thickness of 2mm, tests the tensile properties, tests the adhesion according to the shearing standard, tests the curing conditions as above, and tests the shearing strength at high and low temperatures; the volume resistivity, hardness, normal temperature storage time, density, low temperature hardening temperature and other parameters of the organosilicon conductive adhesive prepared in examples 1-3 were tested, the relevant test results are shown in Table 1 below, and the test results of examples 4-6 are shown in Table 2. The volume resistivity is detected by adopting a standard GJB150-2009, the hardness is detected by adopting a standard GB/T531.1-2008, and the tensile strength and the elongation at break are detected by adopting a standard GB/T528-2009. The normal temperature storage time is to package the conductive adhesive with a 30cc Japanese syringe to reach the time when the conductive adhesive cannot be extruded normally to judge the storage period. Shear strength/aluminum-aluminum was tested using standard GB/T7124-2008, density was measured by standard GB/T13477.2-2002, and low temperature hardening temperature was measured by DSC (differential scanning calorimeter). The shear strength/aluminum-aluminum (Mpa) (after high and low temperature impact) was measured using standard GB/T7124-2008, with high and low temperature impact at 150 ℃ and low temperature at-40 ℃ for 100 cycles.
Table 1, examples 1-3 store and physical property test results:
table 2, examples 4-6 store and physical property test results:
as can be seen from the above example data in tables 1 and 2, the conductive paste prepared in the examples of the present application has small volume resistivity and excellent conductivity; the hardness is high, the tensile strength is high, the elongation at break is high, the shearing strength is high, and the adhesive property and the toughness are good; the normal temperature storage time is long, which indicates that the storage performance is excellent; the density is small; the low temperature hardening temperature is low, which indicates that the low temperature resistance is excellent. The shearing strength value after high and low temperature impact shows that the conductive adhesive prepared by the embodiment of the application has good high and low temperature impact resistance. Curing can be completed in one hour at 150 ℃, which indicates that the conductive adhesive prepared by the embodiment of the application is cured rapidly at high temperature.
The application has been described above in connection with preferred embodiments, which are, however, exemplary only and for illustrative purposes. On this basis, the application can be subjected to various substitutions and improvements, and all fall within the protection scope of the application.
Claims (7)
1. The conductive adhesive is characterized by comprising the following components in parts by weight: 100 parts of phenyl vinyl silicone oil, 3-10 parts of phenyl hydrogen silicone oil, 0.08-0.6 part of hydrosilylation catalyst, 0.08-0.5 part of inhibitor, 4-10 parts of diluent, 0.8-3 parts of tackifier and 450-750 parts of conductive filler;
the tackifier is an organosilicon polymer containing alkoxy, epoxy and silicon-hydrogen bonds and having the following structure:
，
x is more than or equal to 8, y is more than or equal to 5, and z is more than or equal to 4; and/or the number of the groups of groups,
the tackifier is an organosilicon polymer containing alkoxy, acyloxy, epoxy and silicon-hydrogen bond with the following structure:
，
x is more than or equal to 5, y is more than or equal to 8, and z is more than or equal to 4;
the phenyl vinyl silicone oil is one or more selected from phenyl vinyl silicone oils with vinyl content of 0.32-0.57% and phenyl content of 5-10%; the phenyl hydrogen-containing silicone oil is one or more of phenyl hydrogen-containing silicone oils with silicon-hydrogen bond content of 0.3-0.8% and phenyl content of 5-10%.
2. The conductive paste as claimed in claim 1, wherein the hydrosilylation catalyst is a platinum catalyst.
3. The conductive adhesive according to claim 2, wherein the inhibitor is selected from one or more of alkynols, ethers, amines, vinyl rings and fumarates.
4. A conductive paste according to claim 3, wherein the diluent is selected from phenyl polydimethyl siloxanes having a viscosity of 50-500mpa.s and a phenyl content of 5-10%.
5. The conductive paste according to claim 1, wherein the conductive filler is spherical silver-coated graphite powder and/or silver-coated glass powder.
6. The conductive paste according to claim 1, wherein the particle size of the conductive filler is 10 to 40 μm.
7. A method for preparing the conductive paste according to any one of claims 1 to 6, comprising the steps of:
(1) Mixing phenyl vinyl silicone oil, a diluent and a hydrosilylation catalyst for deaeration to obtain a mixture;
(2) Sequentially adding an inhibitor, a tackifier and a conductive filler into the mixture obtained in the step (1), mixing and defoaming to obtain a base adhesive;
(3) Adding phenyl hydrogen-containing silicone oil into the base gum obtained in the step (2) for mixing and defoaming.
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