CN115425013A - Display panel, preparation method thereof and display device - Google Patents

Display panel, preparation method thereof and display device Download PDF

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Publication number
CN115425013A
CN115425013A CN202211080574.5A CN202211080574A CN115425013A CN 115425013 A CN115425013 A CN 115425013A CN 202211080574 A CN202211080574 A CN 202211080574A CN 115425013 A CN115425013 A CN 115425013A
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China
Prior art keywords
display panel
light
display
light emitting
emitting modules
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CN202211080574.5A
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Chinese (zh)
Inventor
席克瑞
朱清三
粟平
秦锋
彭旭辉
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Shanghai Tianma Microelectronics Co Ltd
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Shanghai Tianma Microelectronics Co Ltd
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Priority to CN202211080574.5A priority Critical patent/CN115425013A/en
Publication of CN115425013A publication Critical patent/CN115425013A/en
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a display panel, a preparation method thereof and a display device, wherein the display panel comprises a plurality of spliced light-emitting modules, a driving chip of each light-emitting module is arranged on one side of the second surface of a substrate, a plurality of side wires extend along the side surface of the substrate, the side wires are respectively connected with a driving circuit layer and the driving chip, so that the driving circuit layer drives a light-emitting element to emit light, the display panel with complex and large-curvature curved surfaces formed by splicing the plurality of light-emitting modules can be obtained by reasonably setting the structure of the light-emitting modules and arranging the positions of the light-emitting modules, and the packaging layer is adopted to at least coat the side wires on the side surface of the substrate of the plurality of light-emitting modules.

Description

Display panel, preparation method thereof and display device
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
In the prior art, the complex and large-curvature display panel is high in preparation difficulty, complex in process and high in cost, and the application requirements of the complex and large-curvature display panel are difficult to meet.
Disclosure of Invention
The invention provides a display panel, a preparation method thereof and a display device, wherein the structure of light-emitting modules is reasonably arranged, the positions of the light-emitting modules are distributed, and a packaging layer is adopted to at least coat side wiring on the side surface of a substrate of a plurality of light-emitting modules, so that the effects of supporting and fixing the display panel are achieved.
In a first aspect, an embodiment of the present invention provides a display panel, where the display panel includes a plurality of light emitting modules;
the light-emitting module comprises a substrate base plate, wherein the substrate base plate comprises a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is connected with the first surface and the second surface; the light-emitting module also comprises a driving circuit layer, a plurality of side wires and a driving chip; the driving circuit layer is positioned on the first surface, and the driving chip is positioned on the second surface; the side routing wire extends along the side face, a first end of the side routing wire is connected with the driving circuit layer, and a second end of the side routing wire is connected with the driving chip;
the display panel further comprises a packaging layer deviating from the light-emitting sides of the light-emitting modules, and the packaging layer at least covers the side routing wires.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, where the method includes manufacturing a light emitting module; the light-emitting module comprises a substrate base plate, wherein the substrate base plate comprises a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is connected with the first surface and the second surface; the light-emitting module further comprises a driving circuit layer, a plurality of side wires and a driving chip; the driving circuit layer is positioned on the first surface, and the driving chip is positioned on the second surface; the side routing wire extends along the side face, a first end of the side routing wire is connected with the driving circuit layer, and a second end of the side routing wire is connected with the driving chip;
providing a profiling mold; the profiling mold comprises a plurality of grooves, and the size of each groove is matched with that of the corresponding light-emitting module;
transferring a plurality of light emitting modules into the groove; the light-emitting surface of the light-emitting module faces the groove;
preparing a packaging layer on the surface deviating from the light-emitting side of the light-emitting module; the packaging layer at least covers the side routing;
stripping the profiling mold to obtain the display panel; the appearance of the display panel is consistent with that of the profiling mold.
In a third aspect, an embodiment of the present invention further provides a display device, where the display device includes the display panel provided in the first aspect.
The display panel provided by the embodiment of the invention comprises a plurality of spliced light-emitting modules, wherein a driving chip of each light-emitting module is arranged on one side of the second surface of a substrate, a plurality of side wires extend along the side surface of the substrate, and the side wires are respectively connected with a driving circuit layer and the driving chip to realize that the driving circuit layer drives a light-emitting element to emit light.
Drawings
FIG. 1 is a schematic structural diagram of a curved display panel provided in the related art;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of the display panel of FIG. 2 along direction AA';
FIG. 4 is a schematic cross-sectional view of a display panel of FIG. 2 along direction BB';
FIG. 5 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 6 is an enlarged schematic view of region M of FIG. 5;
FIG. 7 is an angle schematic of the region M in FIG. 6;
fig. 8 is a schematic overall view of a display panel according to an embodiment of the invention;
FIG. 9 is a schematic diagram of a back structure of the display panel provided in FIG. 8;
FIG. 10 is a schematic diagram of a rear structure of the display panel provided in FIG. 8;
FIG. 11 is a schematic diagram of a back structure of the display panel provided in FIG. 8;
FIG. 12 is a schematic diagram of providing a pre-display image of the display panel with respect to FIGS. 8-11;
fig. 13 is a flowchart for displaying data per frame of a display panel provided in fig. 8 to 11.
Fig. 14 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention;
FIG. 15 is a schematic flow chart of a process for manufacturing the light emitting module shown in FIG. 14;
FIG. 16 is a schematic flow chart of a process for fabricating the display panel of FIG. 14;
fig. 17 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural view of a curved display panel provided in the related art. As shown in fig. 1, a display panel 100 in the related art is a curved display panel, and the substrate of a conventional LCD and OLED display screen is glass, so that in order to realize a curved screen, the glass needs to be thinned or changed into a flexible substrate, such as a flexible substrate PI or PET, on one hand, the glass substrate cannot be a complex curved surface with large curvature; on the other hand, the flexible substrate curved screen is complex in manufacturing process and high in cost, and the application requirements of a complex and large-curvature display surface are difficult to meet.
Based on the above technical problems, the inventors further developed a technical solution of the embodiment of the present invention. Specifically, an embodiment of the present invention provides a display panel, which includes a plurality of light emitting modules; the light-emitting module comprises a substrate base plate, wherein the substrate base plate comprises a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is connected with the first surface and the second surface; the light-emitting module also comprises a driving circuit layer, a plurality of side wires and a driving chip; the driving circuit layer is positioned on the first surface, and the driving chip is positioned on the second surface; the side wire extends along the side face, the first end of the side wire is connected with the driving circuit layer, and the second end of the side wire is connected with the driving chip; the display panel further comprises a packaging layer deviating from the light-emitting sides of the light-emitting modules, and the packaging layer at least covers the side wiring. By adopting the splicing technical scheme, the packaging layer is adopted to at least coat the side wiring on the substrate side face of the substrate of the plurality of light-emitting modules, the functions of supporting and fixing the light-emitting modules are achieved, the display panel with the complex and large-curvature curved surface formed by splicing the plurality of light-emitting modules can be obtained, the appearance of the display panel can be adjusted, the manufacturing process is simple, the cost is low, and the picture display of the complex and large-curvature display panel can be realized.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention. All other embodiments, which can be obtained by a person skilled in the art based on the embodiments of the present invention without any creative work, belong to the protection scope of the present invention.
Fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention; FIG. 3 is a schematic cross-sectional view of the display panel of FIG. 2 along direction AA'; FIG. 4 is a schematic cross-sectional view of a display panel of FIG. 2 taken along direction BB'; FIG. 5 is a schematic diagram of another display panel according to an embodiment of the present invention; fig. 6 is an enlarged schematic view of the region M in fig. 5. Referring to fig. 2 to 6, in the display panel according to the embodiment of the present invention, the display panel 200 includes a plurality of light emitting modules 20; the light emitting module 20 includes a substrate base 21, and the substrate base 21 includes a first surface S1 and a second surface S2 oppositely disposed and a side surface S3 connecting the first surface S1 and the second surface S2; the light emitting module 20 further includes a driving circuit layer 22, a plurality of side traces 23 and a driving chip 24; the driving circuit layer 22 is located on the first surface S1, and the driving chip 24 is located on the second surface S2; the side trace 23 extends along the side surface S3, a first end of the side trace 23 is connected with the driving circuit layer 22, and a second end of the side trace 23 is connected with the driving chip 24; the display panel 200 further includes a package layer 30 away from the light-emitting sides of the light-emitting modules 20, and the package layer 30 at least covers the side traces 23.
Specifically, the Display panel 200 includes a Liquid Crystal Display panel (LCD), an Organic Light Emitting Display panel (OLED), a Light Emitting Diode Display panel (LED), a submillimeter LED Display panel (Mini LED), a Micro LED Display panel (Micro LED), and the like, and the embodiment of the present invention does not specifically limit the type of the Display panel 200. The display panel may be a flat display panel or a curved display panel, and fig. 2 shows a display panel with a hyperboloid structure, and as shown in fig. 3, a cross section of the display panel 200 along an AA' direction in the drawing forms a curved surface with a radius R1 and an O1 as a center; as shown in FIG. 4, a curved surface with a radius R2 around O2 is formed on the cross section along the direction BB'. Through the structure of reasonable setting light emitting module and each light emitting module position of arranging, adopt the encapsulated layer to carry out the cladding to a plurality of light emitting module and fix, the encapsulated layer is as display panel's supporting layer, can obtain the display panel of complicacy and big curvature.
Specifically, as shown in fig. 5 and fig. 6, the display panel 200 includes a plurality of light emitting modules 20 combined in a splicing manner, each light emitting module 20 is one of small-sized LCD, OLED, LED or Mini LED and Micro LED display modules, and each light emitting module 20 can independently display a picture. The light emitting module 20 comprises a substrate 21, and a driving circuit layer 22 and a light emitting element 25 which are sequentially arranged on one side of the first surface S1 of the substrate 21, wherein the driving circuit layer 22 is electrically connected with the light emitting element 25 and is used for driving the light emitting element 25 to emit light, the substrate 21 can be a rigid substrate or a flexible substrate, and the substrate material of a display panel does not need to be considered, so that the light emitting module has the advantages of simple preparation process and low cost; the light emitting color and the number of the light emitting elements 25 can be flexibly adjusted according to the size of the light emitting module 20, and are not limited herein. The driving chip 24 of the light emitting module 20 is disposed on one side of the second surface S2 of the substrate base 21, the plurality of side traces 23 extend along the side surface S3 of the substrate base 21, the first end of the side trace 23 is connected to the driving circuit layer 22, and the second end of the side trace 23 is connected to the driving chip 24, so that the driving chip 24 provides a driving signal to the driving circuit layer 22, and the driving circuit layer 22 drives the light emitting element 25 to emit light. The plurality of side wires 23 include power voltage lines, data lines, scan lines, and the like, and are used for transmitting a plurality of driving signals such as voltage signals, data signals, scan signals, and the like. The light-emitting modules 20 with the structural design are adopted to splice the complex and large-curvature display panel, and further, the transparent and non-conductive packaging layer is adopted to at least cover the side wires 23 of the light-emitting modules 20, for example, only the side wires 23 of the light-emitting modules 20 are covered, or the side wires 23 of the light-emitting modules 20 completely cover the second surface S2 of the light-emitting modules 20 and the driving chip 24. The packaging structure can fix the appearance of the light-emitting module to form display panels with various dimensions and curvature radiuses; on the other hand, the side wiring can be protected, and the damage of the side wiring between two adjacent light-emitting modules is avoided when the light-emitting modules are spliced, so that the transmission of the driving signals of the light-emitting modules is ensured, and the normal display of the display panel is ensured.
It should be noted that the display panel also includes other structures, such as a package cover plate, etc., and a plurality of structures work together to implement image display of the display panel, which is not listed here.
To sum up, the display panel provided by the embodiment of the present invention includes a plurality of light emitting modules, a driving chip of the light emitting module is disposed on one side of the second surface of the substrate, a plurality of side wires extend along the side surface of the substrate, and the side wires are respectively connected to the driving circuit layer and the driving chip, so as to realize that the driving circuit layer drives the light emitting element to emit light.
In one possible implementation, with continued reference to fig. 5, the display panel 200 is a curved display panel; the bending radius of the display panel is R, the arc length corresponding to a single light-emitting module is L1 (not shown in the figure), the bending angle of the display panel is beta, the bending angle corresponding to a single light-emitting module is theta, and the number of the light-emitting modules is n; wherein L1 is not more than β π R/(180 °/n); theta is less than or equal to beta/n.
Specifically, as shown in fig. 5, n light emitting modules may be spliced to form a curved display panel with a bending radius of R, a bending angle of β, and a bending arc length of β × 2 pi × R/(360 °), where n is a positive integer. The n light emitting modules can be spliced in a two-to-two contact manner as shown in fig. 5, at this time, the arc length L1 corresponding to a single light emitting module is β × pi × R/(180 ° × n), and the bending angle θ corresponding to a single light emitting module is β/n; if the n light-emitting modules are spliced in a non-contact manner, the arc length L1 corresponding to a single light-emitting module is less than beta pi R/(180 DEG n), and the bending angle theta corresponding to the single light-emitting module is less than beta/n. Through the reasonable arrangement structure of the light-emitting modules, the display panel with various complexities and large curvature can be obtained.
Fig. 7 is an angle diagram of the region M in fig. 6. Based on the above embodiment, with continued reference to fig. 5 to fig. 7, an acute included angle between the first surfaces S1 of two adjacent light emitting modules 20 of the display panel 200 is b, and b = θ.
Specifically, taking any two adjacent light emitting modules in the n light emitting modules in fig. 5 as an example, if the n light emitting modules are spliced to form an arc-shaped display panel with a bending radius R, an acute included angle b between the first surfaces S1 of the two adjacent light emitting modules 20 needs to be set to be equal to a bending angle θ corresponding to a single light emitting module. As shown in particular in fig. 7. In the X direction in fig. 6 and 7, the length of a single light emitting module is a, the bending angle corresponding to the single light emitting module is θ, and since the single light emitting module forms an isosceles triangle within the bending angle range, the base is a, according to the formula: b +2c =180 °, θ +2c =180 °, so b = θ needs to be set.
Alternatively, as shown with continued reference to fig. 5 and 6, the first surface S1 covers the second surface S2 in the thickness direction of the display panel (as shown in the Z direction in the figure). When a plurality of display panels are spliced to form a curved display panel, the substrate 21 between two adjacent light-emitting modules 20 interfere with each other. The second surface S2 of the substrate base 21 of the light emitting module 20 may be reduced, and the base material of the side surface S3 of the substrate base 21 may be removed, so that the side surface S3 of the substrate base 21 is inwardly contracted from the end connected to the first surface S1 to the end connected to the second surface S2. Optionally, the side S3 of the substrate base plate comprises a flat surface and/or a curved surface. According to the bending radius R of the curved display panel, the side surface S3 of the substrate base plate 21 can be polished to form a smooth plane and/or a smooth arc surface, so that when the curved display panel is spliced by a plurality of display panels, the mutual interference between the substrate base plates 21 between two adjacent light-emitting modules 20 is reduced, and the curved display panel with a complex and large diameter is formed; meanwhile, the side wiring of two adjacent light emitting modules 20 can be prevented from being extruded and damaged, and the transmission of driving signals of the display panel and normal display can be ensured.
In one possible embodiment, the encapsulation layer comprises Polyimide (PI) or epoxy (MEC). Polyimide (PI) or epoxy resin (MEC) are chooseed for use to the encapsulation layer, or other transparent non-conductive material, both can play the effect of fixed stay light-emitting module, can avoid again walking line, drive chip's interference to side in the light-emitting module, guarantee display panel's normal demonstration.
Fig. 8 is a schematic overall view of a display panel according to an embodiment of the present invention. Fig. 9 is a schematic diagram of a back structure of the display panel provided in fig. 8. Based on the above embodiments, as shown in fig. 8 and 9, optionally, the plurality of light emitting modules includes n light emitting modules, n > 1, and n is a positive integer; the display panel further comprises a control main board 50 departing from the light-emitting side of the display panel, the control main board 50 comprises a first display control signal output end 51, and the first display control signal output end 51 is electrically connected with the driving chips of the n light-emitting modules respectively; the control mainboard is used for transmitting display control signals to the driving chips of the n light-emitting modules in a time-sharing manner.
Specifically, the display panel is composed of n light emitting modules, n is a positive number, for example, as shown in fig. 8 and 9, the same light emitting modules are used to splice into a display panel with s rows × g columns, and n = s × g, and the light emitting modules are sequentially recorded as M11, M12, \8230 \, 8230;, M1g, M21, M22, \8230; \, 8230;, M2g, ms1, ms2, \8230; \, 8230;, msg. It should be noted that fig. 8 only shows that s × g identical light emitting modules are spliced to form an oversized display panel, and the appearance of the display panel is not limited to a rectangle, but also can be a circle or any other shape, which is not limited herein; the size and thickness of the light emitting module are not limited.
The display panel further comprises a control mainboard 50 departing from the light emitting side of the display panel, the control mainboard 50 is a device set consisting of a Central Processing Unit (CPU), a Digital Signal Processor (DSP), a memory and the like, and the CPU can be used for receiving external image signals or controlling a control instruction displayed by the light emitting module; the DSP receives the data and the instruction of the CPU to carry out corresponding data operation; the memory is used for storing a start program, initial parameters, temporary data and the like, and the control main board 50 can decode and reconstruct the image signals received by the display module and generate display signals capable of communicating with the display module through reasonable program setting.
One possible implementation manner, as shown in fig. 9, the control motherboard 50 includes a first display control signal output end 51, the first display control signal output end 51 is a control bus, the control bus is connected to s × g identical light emitting modules respectively, a specific ID is stored in the driving chip circuit 24 of each light emitting module by means of program burning and is stored in the non-volatile memory in the driving chip circuit 24, the arrangement positions and IDs of the display modules in the display panel have a one-to-one mapping relationship, for example, as shown in fig. 9, the display modules are recorded as IDs: m11, ID: m12 \8230;, ID: msg. The control main board 50 stores the mapping relationship between the arrangement position and the ID of each display module in the memory, respectively.
When the display panel is driven to display, the control main board 50 receives an external image signal or a control instruction for controlling the light-emitting modules to display, transmits a display control signal to the driving chips 24 of the sxg light-emitting modules in a time-sharing manner according to the stored mapping relationship between the arrangement position and the ID of each display module, and controls each display module to emit light to display an image in a time-sharing manner, so that each display module can display different display pictures or the same display picture, and full-screen display of the display panel is finally realized.
Fig. 10 is a schematic diagram of a back structure of the display panel provided in fig. 8. As shown in fig. 8 and 10, optionally, the plurality of light emitting modules includes n light emitting modules, the display panel with n > 1 and n being a positive integer further includes a control main board departing from the light emitting side of the display panel, the control main board includes n second display control signal output ends 52, the n second display control signal output ends 52 are in one-to-one correspondence with and electrically connected to the driving chips of the n light emitting modules; the mainboard is used for transmitting the display control signal to the driving chips of the n light-emitting modules simultaneously.
One possible implementation manner is that the control motherboard 50 at least includes the second display control signal output ends 52 with the same number as the number of the light emitting modules, as shown in fig. 8 and 10, the control motherboard 50 includes s × g second display control signal output ends 52, s × g second display control signal output ends 52 are respectively connected with the driving chips 24 of s × g identical light emitting modules in a one-to-one correspondence manner, that is, each light emitting module is respectively connected with a control bus, a specific ID is stored inside the driving chip 24 of each light emitting module in a program burning manner and stored in a nonvolatile memory inside the driving chip 24, the arrangement positions and IDs of the display modules in the display panel have a one-to-one mapping relationship, for example, fig. 10, and each display module is recorded as an ID: m11, ID: m12, 8230; \ 8230;, ID: msg. The control main board 50 stores the mapping relationship between the arrangement position and the ID of each display module in the memory, respectively.
When the display panel is driven to display, the control main board 50 receives an external image signal or a control instruction for controlling the light-emitting modules to display, and simultaneously transmits a display control signal to the driving chips 24 of the sxg light-emitting modules according to the stored mapping relationship between the arrangement position and the ID of each display module, and simultaneously controls each display module to emit light to display an image, so that each display module displays different display pictures or the same display image, and finally, the full-screen display image of the display panel is realized. The control mainboard 50 drives the display module 20 to display at the same time, which is beneficial to improving the image refreshing frequency of the display panel; when a display module 20 has a display fault, the display module is beneficial to fault detection, maintenance and the like.
Fig. 11 is a schematic diagram of a back structure of the display panel provided in fig. 8. As shown in fig. 8 and 11, optionally, the plurality of light emitting modules includes n light emitting modules, the n light emitting modules are arranged in an array, n > 1, and n is a positive integer; the display panel also comprises a control main board departing from the light-emitting side of the display panel, wherein the control main board comprises m third display control signal output ends 53, 1-m-n, and m is a positive integer; at least one third display control signal output end 53 is electrically connected with the driving chips of the light emitting modules in the same row or column; the control main board is used for controlling a third display control signal output end 53 electrically connected with the driving chips of the light-emitting modules in the same row or the same column, and transmitting display control signals to the driving chips of the light-emitting modules in the same row or the same column in a time-sharing manner.
A feasible embodiment is that, in combination with the display panel shown in fig. 8 and 10, the same light emitting modules are spliced into s rows × g columns, the control motherboard 50 includes g third display control signal output ends 53, the light emitting modules arranged along the Y direction in fig. 11 are connected to the same third display control signal output end 53, that is, the light emitting modules in each row or each column are respectively connected to a control bus, for example, M11, M21, \ 8230 \ 8230;, the MS1 light emitting module and the same third display control signal output end 53, a specific ID is stored inside the driving chip 24 of each light emitting module by means of program burning and stored in a nonvolatile memory inside the driving chip 24, the arrangement positions and IDs of the display modules in the display panel have a one-to-one mapping relationship, for example, fig. 11, and each display module is recorded as ID: m11, ID: m12, 8230; \ 8230;, ID: msg. The control main board 50 stores the mapping relationship between the arrangement position and the ID of each display module in the memory, respectively.
When the display panel is driven to display, the control main board 50 receives an external image signal or a control instruction for controlling the light emitting modules to display, and transmits a display control signal to the driving chips 24 of g rows of light emitting modules through g third display control signal output ends 53 according to the stored mapping relationship between the arrangement position and the ID of each display module; and for the light emitting modules in the same row, each third display control signal output end 53 transmits a display control signal to the driving chips 24 of the s light emitting modules in the same row in a time-sharing manner, that is, the light emitting modules in the same row emit light sequentially at the same time for displaying, by adopting the connection manner, the number of the connection ends of the control main board 50 and the light emitting modules 20 can be reduced, so that the light emitting modules 20 in the same row or the same row emit light simultaneously to display images, which is beneficial to improving the display rate of the display panel, so that each display module can display different display pictures or the same display picture, and finally, the full screen display of the display panel is realized.
It should be noted that the light emitting modules in the same row may also be connected to the same third display control signal output terminal 53, and the light emitting control of the light emitting modules in each row by the control motherboard is the same as the connection of the light emitting modules in the same column and the same third display control signal output terminal 53 provided in the above embodiment, which will not be described in detail herein.
FIG. 12 is a schematic diagram of providing a pre-display image of the display panel with respect to FIGS. 8-11; fig. 13 is a flow chart of displaying data per frame of a display panel provided in fig. 8-11. In addition to the above embodiments, as shown in fig. 8 to 13, fig. 12 is a pre-display image of the display panel, the pre-display image and the display image are divided into s rows × g columns of partition images, and the light emitting modules P11, P12, 8230, P1g, P21, P22, 8230, P2g, ps1, ps2, ps 8230, psg, and s × g partition images are sequentially recorded, and have a one-to-one matching relationship with the position IDs of the s × g light emitting modules in fig. 8. It should be noted that, in fig. 8-13, only the pre-display image and the position ID of the light emitting module of the display panel have a one-to-one matching relationship, for some anisotropic display panels, when there is no display module with a certain ID of Msg, the main control motherboard directly ignores the partition image with the serial number of Psg when matching the pre-display image and the position ID of the light emitting module, and does not transmit the corresponding picture data; the transmission sequence of the partition pictures is not fixed, and can be set to any transmission sequence according to requirements. As shown in fig. 8-13, the operation principle of the image display of the tiled display panel is as follows:
s201, the control main board receives a complete frame of original image, divides the original image into S × g subarea images, and correspondingly matches the S × g subarea images with the position IDs of the S × g light-emitting modules of the display panel. Wherein the original image refers to a pre-display image.
S202, controlling the main board to send a first data receiving request, wherein the first data receiving request comprises an ID (identity) of the display module, M11 and a control instruction for sending display data.
S203, all the display modules receive the data request, but only the display module with the ID of M11 starts the data receiving mode after receiving the data request.
S204, the main board is controlled to transmit the display data matched with the display module with the ID of M11 to the display module of M11.
S205, the display module which starts the data receiving mode receives the display data and updates the display data to the display screen of the display module, and the rest display modules do not have updating actions.
S206, controlling the main board to send a first transmission completion instruction, wherein the first transmission completion instruction comprises the ID M11 of the display module and the completion of the transmission of the display data.
And S207, repeatedly executing the step 205 to the step 206, and controlling the main board to sequentially transmit different IDs and different display data matched with the IDs so as to control the display modules needing to be updated all over once, so that the display panel displays the original image finally.
When there are multiple control buses in the control motherboard, as shown in fig. 10, the control motherboard 50 includes s × g second display control signal output terminals 52; or as shown in fig. 11, the control main board 50 includes g third display control signal output ends 53, and after step 201 is executed, each group of control buses respectively execute step 202 to step 207 until the display panel displays the flow transmission data of the original image, thereby completing the display of one original image.
Based on the same inventive concept, the embodiment of the invention also provides a preparation method of the display panel, which is used for preparing the display panel provided by the embodiment. FIG. 14 is a schematic flow chart illustrating a method for fabricating a display panel according to an embodiment of the present invention; FIG. 15 is a schematic flow chart of a process for fabricating the light emitting module shown in FIG. 14; fig. 16 is a schematic flow chart of a manufacturing process of the display panel provided in fig. 14. As shown in fig. 14 to 16, the preparation method includes:
s101, preparing a light-emitting module.
As shown in fig. 5, the light emitting module 20 includes a substrate 21, where the substrate 21 includes a first surface S1 and a second surface S2 disposed opposite to each other, and a side surface S3 connecting the first surface S1 and the second surface S2; the light emitting module 20 further includes a driving circuit layer 22, a plurality of side traces 23 and a driving chip 24; the driving circuit layer 22 is located on the first surface S1, and the driving chip 24 is located on the second surface S2; the side trace 23 extends along the side surface S3, a first end of the side trace 23 is connected to the driving circuit layer 22, and a second end of the side trace 23 is connected to the driving chip 24.
Taking the light emitting module 20 as an example of a Micro LED display module, taking the preparation of a Micro LED display module as an example, and combining fig. 15, a driving circuit layer 22 is prepared on a substrate 21, the driving circuit layer 22 includes a plurality of thin film transistor TFT switches, that is, corresponding electrodes (not shown in the figure), a plurality of Micro LEDs 25 with different colors are transferred to the driving circuit layer 22 in batch, and positive and negative electrodes of the Micro LEDs are electrically connected to the electrodes of the driving circuit layer 22, so as to ensure that the driving circuit layer 22 normally drives and displays the Micro LEDs; rounding the edge of the side edge of the substrate base plate 21 to make the side edge S3 of the substrate base plate 21 be a plane, an arc surface or a combination of the two, so that two adjacent light-emitting modules 20 are spliced and provided with side wiring 23; a driving chip 24 is prepared on the second surface of the substrate base plate 21, and the driving circuit layer 22 and the driving chip 24 are electrically connected by using the side trace 23.
And S102, providing a profiling mold.
Wherein the profiling mold 40 comprises a plurality of grooves (not shown), the size of the grooves is matched with the size of the light emitting module.
Specifically, as shown in fig. 16 (a), according to the shape of the pre-prepared curved display panel, a profiling mold 40 consistent with the shape and the bending radius of the curved display panel is prepared in a reverse molding manner, a plurality of grooves with the size matched with the size of the light emitting module are arranged in the profiling mold 40, and optionally, an opening is formed between every two adjacent grooves, so that the assembly, positioning and detection are facilitated.
S103, transferring the light-emitting module into the groove of the profiling mold.
Referring to fig. 16 (a), the light emitting surface of the light emitting module is directed to the groove, and the plurality of light emitting modules are sequentially transferred into the groove of the profiling mold.
And S104, preparing a packaging layer on the surface of the light-emitting side departing from the light-emitting module.
As shown in fig. 16 (b), a transparent PI or transparent EMC material is injected into the mold, and the material is cooled to form a package layer, the package layer is at least arranged to cover the side traces, and the package layer serves as a support layer of the display module to package and support the plurality of light emitting modules.
And S105, stripping the copying mold to obtain the display panel.
Referring to fig. 16 (c), after the encapsulation layer is solidified, the profiling curved surface mold is peeled off to obtain a display panel with the same shape and bending radius as those of the profiling mold
The display panel prepared by the preparation method does not need to consider the substrate material of the display panel, so the preparation method has the advantages of simple preparation process and low cost, the profiling mold can be prepared in advance according to the required curved surface appearance, the light-emitting module is limited by the groove in the mold, and the light-emitting module is supported and fixedly spliced by the packaging layer, so that the display panel with a complicated and large-curvature curved surface is obtained. By adopting the preparation method, the appearance of the display panel can be adjusted, and the application requirements of the complex and large-curvature display panel are met.
Based on the same inventive concept, the embodiment of the invention also provides a display device. Fig. 17 is a schematic structural diagram of a display device according to an embodiment of the present invention, and as shown in fig. 17, the display device includes any one of the display modules provided in the foregoing embodiments. Illustratively, as shown in fig. 17, the display device 300 includes a display panel 200. Therefore, the display device also has the advantages of the display module in the above embodiments, and the same points can be understood by referring to the explanation of the display module above, which is not repeated herein.
The display device 300 provided in the embodiment of the present invention may be a mobile phone shown in fig. 17, and may also be any electronic product with a display function, including but not limited to the following categories: the display device includes a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, industrial control equipment, a medical display screen, a touch interaction terminal and the like, and the embodiment of the invention is not limited to this.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements and substitutions will now be apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (11)

1. A display panel is characterized by comprising a plurality of light-emitting modules;
the light-emitting module comprises a substrate base plate, wherein the substrate base plate comprises a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is connected with the first surface and the second surface; the light-emitting module also comprises a driving circuit layer, a plurality of side wires and a driving chip; the driving circuit layer is positioned on the first surface, and the driving chip is positioned on the second surface; the side routing wire extends along the side face, a first end of the side routing wire is connected with the driving circuit layer, and a second end of the side routing wire is connected with the driving chip;
the display panel further comprises a packaging layer deviating from the light emitting sides of the light emitting modules, and the packaging layer at least covers the side wiring.
2. The display panel according to claim 1, wherein the display panel is a curved display panel;
the bending radius of the display panel is R, the arc length corresponding to a single light-emitting module is L1, the bending angle of the display panel is beta, the bending angle corresponding to a single light-emitting module is theta, and the number of the light-emitting modules is n;
wherein L1 is not more than β π R/(180 °/n); theta is less than or equal to beta/n.
3. The display panel according to claim 2, wherein an acute included angle between the first surfaces of two adjacent light emitting modules is b, b = θ.
4. The display panel according to claim 1, wherein the plurality of light emitting modules comprises n light emitting modules, n > 1, n is a positive integer;
the display panel further comprises a control main board deviating from the light emitting side of the display panel, the control main board comprises a first display control signal output end, and the first display control signal output end is electrically connected with the driving chips of the n light emitting modules respectively; the control main board is used for transmitting display control signals to the driving chips of the n light-emitting modules in a time-sharing mode.
5. The display panel according to claim 1, wherein the plurality of light emitting modules comprises n light emitting modules, n > 1, n is a positive integer;
the display panel further comprises a control main board deviating from the light emitting side of the display panel, the control main board comprises n second display control signal output ends, and the n second display control signal output ends are in one-to-one correspondence with and electrically connected with the n driving chips of the light emitting modules; the control main board is used for transmitting display control signals to the n driving chips of the light-emitting modules at the same time.
6. The display panel according to claim 1, wherein the plurality of light emitting modules comprises n light emitting modules, the n light emitting modules are arranged in an array, n > 1, and n is a positive integer;
the display panel further comprises a control main board deviated from the light emitting side of the display panel, the control main board comprises m third display control signal output ends, 1-m-n, and m is a positive integer; at least one third display control signal output end is electrically connected with the driving chips of the light-emitting modules in the same row or the same column; the control main board is used for controlling the third display control signal output end electrically connected with the driving chips of the light-emitting modules in the same row or the same row, and transmitting display control signals to the driving chips of the light-emitting modules in the same row or the same row in a time-sharing manner.
7. The display panel according to claim 1, wherein the first surface covers the second surface in a thickness direction of the display panel.
8. The display panel according to claim 1, wherein the side of the substrate base plate comprises a flat surface and/or a curved surface.
9. The display panel according to claim 1, wherein the encapsulation layer comprises polyimide or epoxy.
10. A method for manufacturing a display panel, comprising:
preparing a light-emitting module; the light-emitting module comprises a substrate base plate, wherein the substrate base plate comprises a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is connected with the first surface and the second surface; the light-emitting module also comprises a driving circuit layer, a plurality of side wires and a driving chip; the driving circuit layer is positioned on the first surface, and the driving chip is positioned on the second surface; the side routing wire extends along the side face, a first end of the side routing wire is connected with the driving circuit layer, and a second end of the side routing wire is connected with the driving chip;
providing a profiling mold; the profiling mold comprises a plurality of grooves, and the size of each groove is matched with that of the corresponding light-emitting module;
transferring the light emitting module into the groove of the profiling mold; the light-emitting surface of the light-emitting module faces the groove;
preparing a packaging layer on the surface deviating from the light-emitting side of the light-emitting module; the packaging layer at least covers the side routing;
stripping the profiling mold to obtain the display panel; the appearance of the display panel is consistent with that of the profiling mold.
11. A display device comprising the display panel according to any one of claims 1 to 9.
CN202211080574.5A 2022-09-05 2022-09-05 Display panel, preparation method thereof and display device Pending CN115425013A (en)

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US20120206499A1 (en) * 2011-02-10 2012-08-16 Cok Ronald S Chiplet display device with serial control
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CN113270457A (en) * 2021-05-13 2021-08-17 京东方晶芯科技有限公司 Display panel, preparation method thereof, display device and splicing display device
CN114783302A (en) * 2022-04-11 2022-07-22 上海天马微电子有限公司 Panel assembly and display device
CN114999338A (en) * 2022-05-31 2022-09-02 Tcl华星光电技术有限公司 Display panel, manufacturing method and splicing display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120206499A1 (en) * 2011-02-10 2012-08-16 Cok Ronald S Chiplet display device with serial control
CN109461386A (en) * 2019-01-04 2019-03-12 京东方科技集团股份有限公司 Display device
CN113270457A (en) * 2021-05-13 2021-08-17 京东方晶芯科技有限公司 Display panel, preparation method thereof, display device and splicing display device
CN114783302A (en) * 2022-04-11 2022-07-22 上海天马微电子有限公司 Panel assembly and display device
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