CN115424960B - Eutectic welding and tube shell sealing clamp for radio frequency power amplifier chip - Google Patents
Eutectic welding and tube shell sealing clamp for radio frequency power amplifier chip Download PDFInfo
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- CN115424960B CN115424960B CN202211192396.5A CN202211192396A CN115424960B CN 115424960 B CN115424960 B CN 115424960B CN 202211192396 A CN202211192396 A CN 202211192396A CN 115424960 B CN115424960 B CN 115424960B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a fixture for eutectic welding of a radio frequency power amplifier chip and sealing of a tube shell, which comprises a welding fixture base, a power amplifier tube positioning groove, a power amplifier tube lower shell, a chip positioning sheet, a preformed soldering lug, a radio frequency power amplifier chip, a chip pressing block and a ceramic sheet. According to the invention, the elastic pressure is used for pressing the chip, the applied pressure is regulated by regulating the compression amount of the pressing needle instead of the traditional method of weighting the pressing block, so that the best pressure value is found, the structure of the clamp is reduced, the cost is reduced, the operation is more convenient, the pressure is adjustable, and the structure of the clamp is simplified. The chip positioning and chip pressing component used in the invention adopts ceramic materials, uses a laser processing mode which has higher precision and is easy to process micro structures, and does not adopt a traditional numerical control milling mode of graphite/metal materials.
Description
Technical Field
The invention belongs to the technical field of clamp structures, and particularly relates to a clamp for eutectic welding of a radio frequency power amplifier chip and a tube shell sealing cover.
Background
Three main methods exist in the current-stage industry of eutectic welding of radio frequency power amplifier tube chips: the manual welding method has the advantages that after the welding flux is melted, the manual friction chip eliminates bubbles to control the cavitation rate to be within 5 percent, the equipment cost of the method is low, the skill requirement on operators is high, and the consistency of products is difficult to ensure. The principle of automatic welding of the full-automatic chip mounter is the same as that of manual welding, and the automatic welding is performed by changing manual work into full-automatic machine. The vacuum eutectic furnace welding, through controlling the gas atmosphere in the furnace, add activated gas (formic acid) etc. and obtain better welding effect, use vacuum furnace welding chip in the industry at present need custom graphite anchor clamps to fix a position the chip and exert pressure certain pressure, and the briquetting need consider when exerting pressure and dodge sensitive area of chip like air bridge etc. but graphite material machining degree of difficulty is big, especially for the processing of micro-size, leads to the expense of graphite anchor clamps to be expensive, even can't realize (for example below 0.2mm size) to micro-size structure. The traditional clamp can only process different balancing weights to carry out experiments when the pressure of the clamp for pressing the chip is not adjustable, so that the cost is increased.
Aiming at the problems, the invention provides a novel structure of a low-cost radio frequency chip vacuum eutectic welding fixture.
Disclosure of Invention
The invention provides a fixture for eutectic welding of a radio frequency power amplifier chip and a tube shell sealing cover, which aims to solve the problems.
The technical scheme of the invention is as follows: the fixture comprises a welding fixture base, a power amplification tube positioning groove, a power amplification tube lower shell, a chip positioning sheet, a preformed soldering lug, a radio frequency power amplification chip, a chip pressing block and a ceramic sheet;
a power amplifier tube positioning groove is formed in the welding fixture base; the lower shell of the power amplifier tube is arranged in the positioning groove of the power amplifier tube; the chip locating piece is arranged in the cavity of the lower shell of the power amplifier tube; positioning grooves are formed in two ends of the chip positioning sheet; the chip pressing block, the radio frequency power amplifier chip and the preformed soldering lug are sequentially placed in a positioning groove of the chip positioning piece from top to bottom; the ceramic plate is arranged in the cavity of the lower shell of the power amplifier tube, and the bottom surface of the ceramic plate is contacted with the upper surface of the chip pressing block.
Further, a positioning pin is arranged on the opposite angle of the welding fixture base; pressing component positioning grooves are formed in two sides of the welding fixture base.
Further, the fixture for eutectic welding of the radio frequency power amplifier chip and the sealing cover of the tube shell also comprises a pressing component; the pressing component comprises a cantilever, a pressing needle, a copper column, a hand screw, a threaded hole and a through hole;
one end of the cantilever is provided with a threaded hole, and the other end of the cantilever is provided with a through hole; the pressing needle is telescopically arranged at one end of the cantilever through the threaded hole; one end of the copper column is arranged in the positioning groove of the pressing component, and the other end of the copper column is connected with the cantilever through a through hole; the hand screw is connected with the threaded hole on the inner wall of the copper column through the through hole and is arranged at the top of the cantilever.
Further, one end of the pressing needle is provided with a threaded stud, and the other end of the pressing needle is provided with a telescopic probe head; the pressing needle is arranged at one end of the cantilever through the threaded connection of the threaded hole and the stud.
Further, a clamp cover plate is arranged on the welding clamp base; a positioning hole in clearance fit with the positioning pin is formed in the opposite angle of the clamp cover plate; a cover plate positioning groove is formed in the clamp cover plate; copper column avoiding grooves are formed in two sides of the clamp cover plate.
Further, the radio frequency power amplifier chip eutectic welding and tube shell sealing clamp also comprises a power amplifier cover plate; the power amplifier cover plate is arranged in the cover plate positioning groove.
Further, the fixture for eutectic welding of the radio frequency power amplifier chip and the sealing cover of the tube shell also comprises a balancing weight; one end of the balancing weight is arranged in the cover plate positioning groove.
The beneficial effects of the invention are as follows:
(1) According to the invention, the elastic pressure is used for pressing the chip, the applied pressure is regulated by regulating the compression amount of the pressing needle instead of the traditional method of weighting the pressing block, so that the optimal pressure value is found, the structure of the clamp is reduced, the cost is reduced, the operation is more convenient, the pressure is adjustable, and the structure of the clamp is simplified;
(2) The invention can realize the sealing function by only adding one cover plate, and a sealing mould is not needed to be made, and the pipe cover is directly placed into the positioning groove of the clamp cover plate and is placed with the seed matching block for pressing, so that the pipe cover can be placed into the oven for baking and sealing.
(3) The chip locating plate and the chip pressing block are made of ceramic materials and adopt a laser processing technology, so that the chip locating groove and the chip pressing block with micro-size structures which are high in precision and difficult to realize in traditional machining can be obtained, and the cost of laser processing is greatly reduced compared with that of a milling machine processing technology.
Drawings
FIG. 1 is a diagram of a structure of a radio frequency power amplifier chip eutectic welding and a tube shell sealing clamp;
FIG. 2 is a block diagram of a chip spacer;
FIG. 3 is a block diagram of a chip press;
FIG. 4 is a schematic diagram of chip briquetting processing;
FIG. 5 is a block diagram of a welding fixture base;
FIG. 6 is a block diagram of a hold down assembly;
FIG. 7 is a block diagram of a hold down assembly and a welding fixture base;
FIG. 8 is a block diagram of a cantilever;
FIG. 9 is a block diagram of a press pin;
FIG. 10 is a cross-sectional view of the hold down assembly;
FIG. 11 is a block diagram of a clamp cover, a power amplifier cover, and a welding clamp base;
fig. 12 is a final assembly view of the cartridge capping jig;
FIG. 13 is a top view of the clamp cover;
fig. 14 is a schematic view of the final assembly position of the cartridge capping jig;
in the figure, 1, welding a fixture base; 1-1, locating pins; 1-2, pressing down the assembly positioning groove; 2. a power amplifier tube positioning groove; 3. a power amplifier tube lower shell; 4. a chip positioning sheet; 4-1, positioning grooves; 5. preforming the soldering lug; 6. a radio frequency power amplifier chip; 7. pressing a chip into a block; 8. a ceramic sheet; 9. pressing down the assembly; 9-1, cantilever; 9-2, needle pressing; 9-3, copper columns; 9-4, screwing the screw by hand; 9-5, threaded holes; 9-7, studs; 9-8, a telescopic probe head; 9-6, through holes; 10. a clamp cover plate; 10-1, positioning holes; 10-2, a cover plate positioning groove; 10-3, a copper column avoiding groove; 11. a power amplifier cover plate; 12. and (5) balancing weights.
Detailed Description
Embodiments of the present invention are further described below with reference to the accompanying drawings.
As shown in fig. 1, the invention provides a fixture for eutectic welding of a radio frequency power amplifier chip and sealing of a tube shell, which comprises a welding fixture base 1, a power amplifier tube positioning groove 2, a power amplifier tube lower shell 3, a chip positioning sheet 4, a preformed soldering lug 5, a radio frequency power amplifier chip 6, a chip pressing block 7 and a ceramic sheet 8; a power amplifier tube positioning groove 2 is formed in the welding fixture base 1; the power amplifier tube lower shell 3 is arranged in the power amplifier tube positioning groove 2; the chip locating piece 4 is arranged in the cavity of the lower shell 3 of the power amplifier tube;
as shown in fig. 2, positioning grooves 4-1 are formed at two ends of the chip positioning sheet 4; the chip pressing block 7, the radio frequency power amplifier chip 6 and the preformed soldering lug 5 are sequentially arranged in the positioning groove 4-1 of the chip positioning lug 4 from top to bottom; as shown in fig. 1, the ceramic sheet 8 is disposed in the cavity of the lower power amplifier tube housing 3, and the bottom surface thereof contacts with the upper surface of the chip pressing block 7.
In the embodiment of the invention, the depth of the power amplifier tube positioning groove 2 is larger than or equal to the height of the power amplifier tube lower shell 3. The base material of the welding fixture base 1 adopts high heat conduction materials such as aluminum alloy/copper and the like and carries out surface treatment. The chip locating plate 4, the chip pressing block 7 and the like are made of aluminum nitride/aluminum oxide ceramic materials, the ceramic materials have close thermal expansion coefficients to those of the tube shell, and the heat conductivity coefficients are high. The ceramic material can be processed into positioning sheets and pressing blocks with any shape, extremely small characteristic size and extremely high precision by utilizing a laser processing technology, and is particularly suitable for welding positioning and pressing of chips with small sizes. The thickness of the selected ceramic sheet 8 is 2 times of that of the radio frequency power amplifier chip 6, and the thickness of the preformed soldering lug 5 is one fourth of that of the chip. Because the thickness of the chip locating piece 4 is 2 times of that of the radio frequency power amplifier chip 6, the chip locating groove can simultaneously meet the locating requirements of the preformed soldering lug 5, the radio frequency power amplifier chip 6 and the chip pressing block 7. As shown in fig. 3, the thickness of the chip pressing block 7 is the same as that of the chip positioning sheet 4, when the preformed soldering lug 5 and the radio frequency power amplifier chip 6 are placed, the chip pressing block 7 is higher than the surface of the chip positioning sheet 4, the height of the chip pressing block 7 is higher than that of the preformed soldering lug 5 and the chip positioning sheet 4, and the ceramic sheet 8 is placed in the cavity of the power amplifier tube lower shell 3 to be in contact with the chip pressing block 7 higher than the chip positioning sheet 4. As shown in fig. 3, the chip pressing block 7 is concave, the convex surface of the chip pressing block 7 is the contact surface of the chip pressing block 7 and the preformed soldering lug 5, and the concave surface of the chip pressing block is a sensitive area avoiding groove of the radio frequency power amplifier chip 6 and is not in contact with the surface of the radio frequency power amplifier chip 6.
The drawing to be processed is led into laser processing equipment to carry out 1:1 cutting processing on the ceramic sheet 8 to be processed, so that the chip positioning sheet 4 shown in fig. 2 can be obtained, a sensitive area avoidance groove of a shadow part shown in fig. 4 is processed, and the minimum size of the edge is 0.1mm. If graphite materials and CNC processing methods are adopted, the chip pressing block cannot be processed.
In the embodiment of the invention, as shown in fig. 5, a positioning pin 1-1 is arranged on the opposite angle of a welding fixture base 1; the two sides of the welding fixture base 1 are provided with the pressing component positioning grooves 1-2, and the relative positions of the copper columns 9-3 in the grooves along the direction of the pressing component positioning grooves are adjustable.
In the embodiment of the invention, as shown in fig. 6 and 7, the rf power amplifier chip eutectic welding and tube shell capping clamp further comprises a pressing component 9; the pressing component 9 comprises a cantilever 9-1, a pressing needle 9-2, a copper column 9-3, a hand screw 9-4, a threaded hole 9-5 and a through hole 9-6;
as shown in fig. 8, one end of the cantilever 9-1 is provided with a threaded hole 9-5, and the other end is provided with a through hole 9-6; as shown in fig. 6 and 7, the presser finger 9-2 is telescopically disposed at one end of the cantilever 9-1 through the screw hole 9-5; one end of the copper column 9-3 is arranged in the pressing component positioning groove 1-2, and the other end of the copper column is connected with the cantilever 9-1 through the through hole 9-6; the hand screw 9-4 is connected with a threaded hole on the inner wall of the copper column 9-3 through the through hole 9-6 and is arranged on the top of the cantilever 9-1.
In the embodiment of the invention, as shown in fig. 9, one end of a pressing needle 9-2 is provided with a threaded stud 9-7, and the other end is provided with a telescopic probe head 9-8; as shown in fig. 10, which is a sectional view of the push-down assembly 9, the push pin 9-2 is disposed at one end of the cantilever 9-1 through the threaded connection of the threaded hole 9-5 and the stud 9-7. The depth of the screw bolt 9-7 screwed into the threaded hole 9-5 is adjustable.
In the embodiment of the present invention, as shown in fig. 11, a jig cover plate 10 is provided on a welding jig base 1; a positioning hole 10-1 which is in clearance fit with the positioning pin 1-1 is formed in the opposite angle of the clamp cover plate 10; the fixture cover plate 10 is provided with a cover plate positioning groove 10-2; copper column avoiding grooves 10-3 are formed in two sides of the clamp cover plate 10.
In the embodiment of the invention, as shown in fig. 11, the rf power amplifier chip eutectic welding and tube shell capping fixture further comprises a power amplifier cover plate 11; the power amplifier cover plate 11 is arranged in the cover plate positioning groove 10-2.
In the embodiment of the invention, as shown in fig. 12, the rf power amplifier chip eutectic welding and tube shell capping fixture further comprises a balancing weight 12; one end of the balancing weight 12 is arranged in the cover plate positioning groove 10-2.
As shown in fig. 13, a top view of the clamp cover is shown. Firstly, placing a power amplification tube to be capped in a power amplification tube positioning groove 2. The jig cover plate 10 is then placed on the welding jig base 1, and the relative positions of the jig cover plate 10 and the welding jig base 1 are positioned with the positioning pins 1-1. And finally, placing a power amplifier cover plate 11 and a balancing weight 12, wherein the relative positions of the power amplifier cover plate 11 and the power amplifier tube lower shell 3 are positioned by a clamp cover plate 10.
In an embodiment of the present invention, as shown in fig. 14, a top view of the assembled position is shown. In the position A (the pressing needle 9-2 is positioned at the center of the ceramic plate 8), the hand screw 9-4 is screwed down to enable the pressing needle 9-2 to be compressed by a certain amount (the length of the elastic pressing needle 9-2 below the cantilever 9-1 can be adjusted to adjust the compression amount of the pressing needle 9-2), the ceramic plate 8 is pressed (the shape and the size of the ceramic plate 8 can ensure that all chip pressing blocks can be pressed at the same time, and pressure can be applied to the chip pressing blocks at the same time). When the hand screw 9-4 is loosened, the cantilever 9-1 can be lifted and rotated out of the tube shell area (such as the position B), and the placement of the tube shell, the chip and the like is not affected. The assembled and positioned clamp shown in fig. 14 is placed into a vacuum furnace for welding, the pressure applied by the pressing needle 9-2 can avoid the chip floating on the surface of the melted solder during welding, and the pressure can extrude and discharge the air in the melted solder to obtain the welding effect of almost zero cavity. The placement of the clamp cover plate 10 can not be affected by disassembling the hand screw 9-4 and the cantilever 9-1 of the push-down assembly 9 when the pipe shell is covered.
In the embodiment of the invention, the eutectic soldering step of the chip is as follows: s1, placing a lower power amplifier tube shell 3 on a welding fixture base 1; s2, placing the chip positioning sheet 4 into a cavity of the lower shell 3 of the power amplification tube; s3, placing the preformed soldering lug 5 into the positioning groove 4-1 of the chip positioning lug 4; s4, placing the radio frequency power amplifier chip 6 into the positioning groove 4-1 of the chip positioning sheet 4; s5, placing the chip pressing block 7 into the positioning groove 4-1 of the chip positioning sheet 4; s6, placing a ceramic sheet 8; s7, placing the pressing needle 9-2 in the center of the ceramic plate 8, and screwing the hand screw 9-4; s8, placing the clamp into a vacuum eutectic furnace for welding; s9, taking out the clamp, loosening the hand screw 9-4, and taking out the chip locating plate 4, the chip pressing block 7 and the ceramic plate 8.
In the embodiment of the invention, the power amplifier tube sealing step comprises the following steps: s1, placing a lower power amplifier tube shell 3 on a welding fixture base 1; s2, covering the clamp cover plate 10 on the welding clamp base 1; s3, placing the power amplifier cover plate 11 in the cover plate positioning groove 10-2; s4, placing the balancing weight 12 into the cover plate positioning groove 10-2 to press the power amplifier cover plate 11; s5, placing the clamp into an oven for heating to enable the precoated glue of the power amplifier cover plate 11 to be melted; s6, curing the glue to finish the sealing.
Claims (1)
1. The fixture is characterized by comprising a welding fixture base (1), a power amplification tube positioning groove (2), a power amplification tube lower shell (3), a chip positioning sheet (4), a preformed soldering lug (5), a radio frequency power amplification chip (6), a chip pressing block (7) and a ceramic sheet (8);
a power amplifier tube positioning groove (2) is formed in the welding fixture base (1); the power amplification tube lower shell (3) is arranged in the power amplification tube positioning groove (2); the chip locating piece (4) is arranged in the cavity of the lower shell (3) of the power amplifier tube; positioning grooves (4-1) are formed in two ends of the chip positioning sheet (4); the chip pressing block (7), the radio frequency power amplification chip (6) and the preformed soldering lug (5) are sequentially arranged in the positioning groove (4-1) of the chip positioning piece (4) from top to bottom; the ceramic sheet (8) is arranged in the cavity of the lower shell (3) of the power amplification tube, and the bottom surface of the ceramic sheet is contacted with the upper surface of the chip pressing block (7); a positioning pin (1-1) is arranged at the opposite angle of the welding fixture base (1); both sides of the welding fixture base (1) are provided with pressing component positioning grooves (1-2);
the fixture for eutectic welding of the radio frequency power amplifier chip and the sealing cover of the tube shell also comprises a pressing component (9); the pressing component (9) comprises a cantilever (9-1), a pressing needle (9-2), a copper column (9-3), a hand screw (9-4), a threaded hole (9-5) and a through hole (9-6);
one end of the cantilever (9-1) is provided with a threaded hole (9-5), and the other end of the cantilever is provided with a through hole (9-6); the pressing needle (9-2) is telescopically arranged at one end of the cantilever (9-1) through the threaded hole (9-5); one end of the copper column (9-3) is arranged in the positioning groove (1-2) of the pressing component, and the other end of the copper column is connected with the cantilever (9-1) through the through hole (9-6); the hand-screwed screw (9-4) is connected with a threaded hole on the inner wall of the copper column (9-3) through a through hole (9-6) and is arranged at the top of the cantilever (9-1);
one end of the pressing needle (9-2) is provided with a threaded stud (9-7), and the other end of the pressing needle is provided with a telescopic probe head (9-8); the pressing needle (9-2) is connected with the stud (9-7) through a thread hole (9-5) at one end of the cantilever (9-1);
a clamp cover plate (10) is arranged on the welding clamp base (1); a positioning hole (10-1) which is in clearance fit with the positioning pin (1-1) is formed in the opposite angle of the clamp cover plate (10); a cover plate positioning groove (10-2) is formed in the clamp cover plate (10); copper column avoiding grooves (10-3) are formed in two sides of the clamp cover plate (10);
the radio frequency power amplifier chip eutectic welding and tube shell sealing clamp also comprises a power amplifier cover plate (11); the power amplifier cover plate (11) is arranged in the cover plate positioning groove (10-2);
the fixture for eutectic welding of the radio frequency power amplifier chip and the sealing cover of the tube shell also comprises a balancing weight (12); one end of the balancing weight (12) is arranged in the cover plate positioning groove (10-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211192396.5A CN115424960B (en) | 2022-09-28 | 2022-09-28 | Eutectic welding and tube shell sealing clamp for radio frequency power amplifier chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211192396.5A CN115424960B (en) | 2022-09-28 | 2022-09-28 | Eutectic welding and tube shell sealing clamp for radio frequency power amplifier chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115424960A CN115424960A (en) | 2022-12-02 |
| CN115424960B true CN115424960B (en) | 2023-04-25 |
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| CN202211192396.5A Active CN115424960B (en) | 2022-09-28 | 2022-09-28 | Eutectic welding and tube shell sealing clamp for radio frequency power amplifier chip |
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| CN (1) | CN115424960B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11134707A (en) * | 1997-06-04 | 1999-05-21 | Mitsubishi Chemical Corp | Chip positioning device |
| CN107548277B (en) * | 2017-08-30 | 2019-10-25 | 成都雷电微力科技有限公司 | A kind of TR component ballast and installation method |
| CN109909666A (en) * | 2019-04-17 | 2019-06-21 | 中国电子科技集团公司第二十研究所 | Chip pressurization welding tooling |
| CN211982449U (en) * | 2020-06-04 | 2020-11-20 | 贵州航天电子科技有限公司 | Vacuum eutectic welding fixes frock |
| CN212823272U (en) * | 2020-08-28 | 2021-03-30 | 中国电子科技集团公司第五十八研究所 | Welding fixture of alloy sealing cap |
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- 2022-09-28 CN CN202211192396.5A patent/CN115424960B/en active Active
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