CN115424896A - High-voltage breakdown-preventing and shielding device for relay board and pulse equipment - Google Patents
High-voltage breakdown-preventing and shielding device for relay board and pulse equipment Download PDFInfo
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- CN115424896A CN115424896A CN202210947206.XA CN202210947206A CN115424896A CN 115424896 A CN115424896 A CN 115424896A CN 202210947206 A CN202210947206 A CN 202210947206A CN 115424896 A CN115424896 A CN 115424896A
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- 230000015556 catabolic process Effects 0.000 claims abstract description 18
- 230000002265 prevention Effects 0.000 claims abstract description 10
- 238000004382 potting Methods 0.000 claims abstract description 9
- 230000000903 blocking effect Effects 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 22
- 238000007599 discharging Methods 0.000 claims description 7
- 230000005693 optoelectronics Effects 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 57
- 239000012790 adhesive layer Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 9
- 230000005684 electric field Effects 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- 238000002679 ablation Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007831 electrophysiology Effects 0.000 description 1
- 238000002001 electrophysiology Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H45/00—Details of relays
- H01H45/10—Electromagnetic or electrostatic shielding
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
- A61B18/12—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
- A61B18/1206—Generators therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H45/00—Details of relays
- H01H45/02—Bases; Casings; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H45/00—Details of relays
- H01H45/14—Terminal arrangements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
- A61B2018/00345—Vascular system
- A61B2018/00351—Heart
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00571—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for achieving a particular surgical effect
- A61B2018/00577—Ablation
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Surgery (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- Otolaryngology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Plasma & Fusion (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a high-voltage breakdown-preventing and shielding device for a relay board and pulse equipment, and belongs to the technical field of medical instruments. The device includes relay board, high-voltage section, low-voltage section and board ground wire. The relay board includes a ground point; the high-voltage section, the low-voltage section and the plate ground wire are arranged on the same side of the high-voltage section, the plate ground wire is fixed on the relay plate and surrounds the periphery of the high-voltage section for a circle, and one end of the plate ground wire is connected with the grounding point; the high-voltage section comprises a first potting adhesive layer used for wrapping the high-voltage section, a first shielding layer connected with a grounding point is arranged on the outer side of the first potting adhesive layer, and the first shielding layer and the grounding wire are used for blocking mutual inductance of elements on the outer sides of the high-voltage section and the first shielding layer. The high-voltage breakdown prevention and shielding device for the relay board can enable the high-voltage section not to influence the work of the low-voltage section, and prevent the breakdown phenomenon of the high-voltage section on the relay board to the low-voltage section.
Description
Technical Field
The invention relates to the technical field of medical instruments, in particular to a high-voltage breakdown-preventing and shielding device for a relay board and pulse equipment.
Background
In the field of electrophysiology, it is common practice to deliver energy and perform tissue ablation using ablation catheters. After the head end (far end) of the ablation catheter is inserted into the heart and reaches a corresponding treatment target point, an energy platform connected with the tail end (near end) of the ablation catheter sends energy media (such as energy of radio frequency, ultrasound, pulse and the like) to an energy delivery electrode on the head end of the ablation catheter, and the electrode is attached to the tissue and transfers the energy to the tissue to ablate the tissue.
So pulse equipment's high-voltage pulse discharge's control just seems especially important, pulse equipment generally discharges and adopts and all be the low pressure control high pressure, but because the voltage level of high-voltage section 2 is higher than low-voltage section 3 far away, so high-voltage section 2 often influences low-voltage section 3, can take place high-voltage section 2 and low-voltage section 3's breakdown phenomenon when high-voltage section 2 and low-voltage section 3 integrate even on a circuit board, make low-voltage section 3 unable normal work, so need a relay board high pressure now and prevent puncturing and shielding structure, prevent that high-voltage section 2 from influencing low-voltage section 3.
Disclosure of Invention
The invention aims to provide a high-voltage breakdown prevention and shielding device for a relay board, which can prevent a high-voltage section from influencing the work of a low-voltage section and prevent the breakdown phenomenon of the high-voltage section on the low-voltage section on the relay board.
In order to realize the purpose of the invention, the invention adopts the following technical scheme:
according to one aspect of the invention, a high-voltage breakdown prevention and shielding device for a relay board comprises the relay board, a high-voltage section, a low-voltage section and a board ground wire. The relay board includes a ground point; the high-voltage section is arranged on one side of the relay board; the low-pressure section is arranged at the same side of the high-pressure section; the plate ground wire is arranged on the relay plate, arranged on the same side of the high-voltage section, surrounds the periphery of the high-voltage section by a circle, and one end of the plate ground wire is connected with the grounding point; one end of the plate ground wire is connected with the grounding point; the high-voltage section comprises a first potting adhesive layer used for wrapping the high-voltage section, a first shielding layer connected with a grounding point is arranged on the outer side of the first potting adhesive layer, and the first shielding layer and the plate ground wire are used for blocking mutual inductance of elements on the outer sides of the high-voltage section and the first shielding layer. It will be appreciated by those skilled in the art that the first potting layer may be formed by potting after the electrical components are mounted in the high voltage section.
According to an embodiment of the present invention, a second shielding layer is disposed at a position corresponding to the high-voltage section on a side of the relay board facing away from the high-voltage section, and the second shielding layer is connected to a grounding point to prevent a potential difference from being generated between the board ground line and the second shielding layer.
According to an embodiment of the present invention, a projection of the first shielding layer on the relay board is located inside the board ground.
According to an embodiment of the present invention, a distance between a portion of the first shielding layer projected on the relay board and outside the board ground is less than 5mm.
According to an embodiment of the present invention, a groove is disposed between the high voltage section and the low voltage section, and the groove is filled with glue to prevent the high voltage section from discharging to the low voltage section by using the relay board as a medium.
According to an embodiment of the present invention, the grooves are discontinuous to increase the strength of the relay board.
According to an embodiment of the present invention, a photocoupler is provided on the groove, and the high voltage section and the low voltage section transmit signals therebetween to prevent direct communication of electrical signals therebetween.
According to an embodiment of the present invention, the relay board is integrally glue-filled to form a second glue-filled layer, so as to prevent the high-voltage section from performing breakdown discharge to the outside.
According to an embodiment of the present invention, the first glue filling layer and the second glue filling layer are both made of a polymer insulating material.
According to another aspect of the present invention, a pulsing device is provided. The pulse equipment comprises the high-voltage breakdown-preventing and shielding device for the relay board.
One embodiment of the present invention has the following advantages or benefits:
the invention provides a high-voltage breakdown-preventing and shielding device for a relay board, which is mainly used for controlling the discharge of a plurality of electrodes of an external conduit. This relay board high pressure is prevented puncturing and shield assembly handles through the whole encapsulating to the independent encapsulating of high-pressure section and relay board, and the effectual high-pressure section that has prevented punctures the phenomenon of discharging to the external world, and the relay board sets up the slot and carries out the encapsulating and handle between high-pressure section and low pressure section in addition, has also prevented that the high-pressure section from regard the relay board as the medium to discharge and influence its normal operating to low pressure section or other components. Through the design of shielding layer and board ground wire, prevented that the high-voltage section from producing electric field/magnetic interference to the outside, influenced the normal operating of low pressure section and other components, and the board ground wire that sets up has prevented especially that the high-voltage section from producing electric field/magnetic interference to the relay board beyond the high-voltage section for the medium through the relay board, the effectual stability that improves this structure. The high-voltage section and the low-voltage section transmit signals through the photoelectric coupler/photoelectric isolator, direct communication between the two parts through electric signals is prevented, signal transmission is performed through electric-optical-electric conversion of the photoelectric coupler/photoelectric isolator, the anti-interference capability is high, electric isolation is achieved, the influence of the high-voltage section on the low-voltage section is effectively reduced, and the stability of the structure is improved.
Drawings
The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
Fig. 1 is a schematic diagram of a relay board shown according to an exemplary embodiment.
Fig. 2 is a schematic diagram illustrating a relay board with a photocoupler mounted thereon according to an exemplary embodiment.
Fig. 3 is a schematic diagram illustrating a first glue-pouring layer for pouring glue into a high-pressure section of a relay board according to an exemplary embodiment.
Fig. 4 is a schematic diagram illustrating installation of a first shield layer to a high voltage section of a relay board according to an exemplary embodiment.
Fig. 5 is a schematic diagram illustrating an integral glue-pouring second glue-pouring layer of a relay board according to an exemplary embodiment.
Fig. 6 isbase:Sub>A cross-sectional view of fig. 5 taken along sectionbase:Sub>A-base:Sub>A.
Fig. 7 is an enlarged view of a portion B of fig. 6.
Wherein the reference numerals are as follows:
1. a relay board; 11. a housing back plate;
2. a high pressure section; 21. a first glue filling layer; 22. a first shielding layer; 23. a second glue filling layer;
3. a low-pressure section; 31. a main control CPU; 32. a driving chip;
4. a ground plate; 41. a left rotating part;
5. a trench;
6. a photoelectric coupler; 61. isolating the power supply.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
The terms "a", "an", "the", "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.
As shown in fig. 1 to 4, fig. 1 shows a schematic diagram of a relay board 1 provided by the present invention.
Fig. 2 is a schematic diagram illustrating a relay board 1 provided by the present invention after a photocoupler 6 is mounted thereon.
Fig. 3 shows a schematic diagram of a first glue-pouring layer 21 for pouring glue into the high-voltage section 2 of the relay board 1 provided by the invention. Fig. 4 shows a schematic view of the high-voltage section 2 of the relay board 1 provided by the invention provided with the first shielding layer 22.
The high-voltage breakdown prevention and shielding device for the relay board comprises a relay board 1, a high-voltage section 2, a low-voltage section 3 and a board ground wire 4. The relay board 1 includes a ground point; the high-voltage section 2 is arranged on one side of the relay board 1; the low-voltage section 3 is arranged on the same side of the relay board 1 and is separated from the high-voltage section (2) by a groove 5; the plate ground wire 4 is arranged on the same side of the high-voltage section 2, is fixed on the relay plate 1, surrounds the periphery of the high-voltage section 2 by a circle, and one end of the plate ground wire 4 is connected with a grounding point; wherein, the encapsulating forms first encapsulating layer 21 in order to wrap up high-voltage section 2 behind the high-voltage section 2 installation electric elements, and the outside of first encapsulating layer 21 is provided with the first shielding layer 22 of connecting the ground point, and first shielding layer 22 is used for blocking the mutual inductance of the component in high-voltage section 2 and the first shielding layer 22 outside with the board ground wire 4 together.
Wherein, be provided with high-pressure section 2 and low-voltage section 3 on the relay board 1. The high-voltage section 2 and the low-voltage section 3 are spaced from each other by a distance, and a ground wire 4 is arranged around the high-voltage section 2. One end of the board ground line 4 is connected to a ground point. The first shield layer 22 is grounded and shares a ground point with the board ground line 4 for ground connection. The voltage level of the high-voltage section 2 is far higher than that of the low-voltage section 3, so if the high-voltage section 2 generates an electric field or magnetic influence on the low-voltage section 3, the low-voltage section 3 cannot normally operate, and the influence of the high-voltage section 2 on the outside is shielded.
The low-voltage section 3 is provided with a main control CPU31 and a driving chip 32, and the main control CPU31 controls the action coordination of all parts in the device. The driving chip 32 amplifies the inputted weak electric signal into a strong electric signal for an external device such as an external lead electrode.
According to the relay board high-voltage anti-breakdown and shielding device, the high-voltage section 2 is the charged body, when the voltage of the high-voltage section 2 changes, for example, when a pulse voltage signal is sent out, the arranged first shielding layer 22 and the high-voltage section 2 generate mutual inductance, namely the first shielding layer 22 and the high-voltage section 2 are equivalent to two polar plates of a capacitor at the moment, the first glue filling layer 21 is a medium of the capacitor, and further an apparent stray capacitor is formed mutually, and the high-voltage section ensures reliable insulation through the first glue filling layer 21. But one electrode of the stray capacitance is grounded, i.e. the first shield layer 22 is grounded, which will conduct the induced current to ground. Because the existence of first shielding layer 22, blocked high-voltage section 2 and the mutual inductance of component production beyond first shielding layer 22, and then prevented that high-voltage section 2 and low-voltage section 3 from forming effectual stray capacitance, finally avoided high-voltage section 2 to the influence of low-voltage section 3 circuit normal operating. The first shielding layer 22 is connected to the ground line 4 to isolate the radiation and conduction path of the pulse signal. Similarly, the plate ground 4 provided on the relay plate 1 is to prevent the high-voltage segment 2 from forming an apparent stray capacitance between the relay plate 1 as a medium and other elements, and the principle is similar to that of the first shield layer 22.
Fig. 5 shows a schematic diagram of the second glue-pouring layer 23 for integrally pouring glue into the relay board 1 provided by the invention. Fig. 6 showsbase:Sub>A cross-sectional view of fig. 5 along sectionbase:Sub>A-base:Sub>A. Fig. 7 shows an enlarged view of a portion B of fig. 6.
In a preferred embodiment of the invention, the side of the relay board 1 facing away from the high voltage section 2 is provided with a second shielding layer in a position corresponding to the high voltage section 2, which second shielding layer is connected to a grounding point to prevent a potential difference from being generated between the board ground line 4 and the second shielding layer.
As shown in fig. 5 to 7, the grounding point of the second shielding layer and the board ground line 4 is the same grounding point. The plate ground wire 4 is prevented from generating a potential difference with the second shielding layer, and an electric field is formed to influence the operation of other elements.
In a preferred embodiment of the invention, the projection of the first shield layer 22 on the relay board 1 is located inside the board ground 4. Here, "outer side" refers to a portion near an edge of the relay board, and "inner side" is a portion opposite to the "outer side". It is preferable that the projection of the first shielding layer 22 is located inside the ground line 4, so that the first shielding layer 22 can meet the use requirement and be minimized as much as possible.
In a preferred embodiment of the invention, the part of the first shielding layer 22 that projects onto the relay board 1 outside the board ground 4 is at a distance of less than 5mm from the board ground 4.
The projection of the first shielding layer 22 is located within a distance of less than 5mm outside the board ground line 4, which is a preferred solution that ensures the best possible effect of the first shielding layer 22 and minimizes it as much as possible.
In a preferred embodiment of the present invention, a groove 5 is formed between the high-voltage section 2 and the low-voltage section 3, and the groove 5 is filled with glue to prevent the high-voltage section 2 from discharging to the low-voltage section 3 by using the relay board 1 as a medium. The grooves 5 are discontinuous to ensure the strength of the relay board 1.
As shown in fig. 1 to 4, the grooves 5 are arranged approximately parallel to the high pressure section 2 and the low pressure section 3. The groove 5 penetrates through the thickness direction of the relay board 1. The grooves 5 are divided into a plurality of segments, preventing the strength of the relay board 1 itself from being weakened by excessively long grooves. The grooves 5 can be filled with glue by themselves or through the second glue-filling layer 23.
In a preferred embodiment of the present invention, the groove 5 is provided with a photo coupler 6, and a signal is transmitted between the high voltage section 2 and the low voltage section 3 through the photo coupler 6 to prevent direct communication of an electric signal between the high voltage section 2 and the low voltage section 3.
As shown in fig. 2 to 4, the photocoupler is also called a photo isolator. The photocoupler 6 spans the groove 5. The low voltage section 3 controls the high voltage section 2 through a photoelectric coupler 6. High-pressure section 2 and low-pressure section 3 carry out the transmission of signal through optoelectronic coupler 6, have prevented directly to exchange through the signal of telecommunication between the two parts, but carry out signal transmission through optoelectronic coupler 6's electricity-photoelectricity-electric conversion, and the interference killing feature is strong, has realized electrical isolation, has effectually reduced high-pressure section 2 to low-pressure section 3's influence, has improved the stability of this structure.
In a preferred embodiment of the present invention, the relay board 1 is integrally glue-filled to form the second glue-filled layer 23, so as to prevent the high-voltage section 2 from discharging to the outside. The first adhesive filling layer 21 and the second adhesive filling layer 23 are both made of polymer insulating materials.
As shown in fig. 5 to 7, the second potting layer 23 in the trench 5 is filled to increase the insulation performance between the high-voltage section 2 and the low-voltage section 3, so that the induced current of the high-voltage section 2 can be prevented from passing through the ground board 4 and discharging to the low-voltage section 3 through the relay board 1, and further affecting the operation of the low-voltage section 3.
In a preferred embodiment of the present invention, the relay board 1 is further provided with an isolation power supply 61, the isolation power supply 61 is located at two sides of the trench 5, and the isolation power supply 61 isolates the input loop from the output loop, thereby further improving the safety of the device.
The high-voltage breakdown prevention and shielding device of the relay board effectively prevents the high-voltage section 2 from performing breakdown discharge on the outside through the independent glue filling treatment on the high-voltage section 2 and the integral glue filling treatment on the relay board 1, and the relay board 1 is provided with the groove 5 between the high-voltage section 2 and the low-voltage section 3 and is subjected to the glue filling treatment, so that the relay board 1 is prevented from discharging on the low-voltage section 3 or other elements by taking the high-voltage section 2 as a medium to influence the normal operation of the relay board 1. Through the design of first shielding layer 21 and board ground wire 4, prevented that high-voltage section 2 from producing electric field/magnetism to the outside and disturbing, influence the normal operating of low-voltage section 3 and other components, and the board ground wire 4 that sets up has prevented especially that high-voltage section 2 from producing electric field/magnetism for relay board 1 outside high-voltage section 2 for the medium through relay board 1 and disturbing, the effectual stability that improves this structure. The high-voltage section 2 and the low-voltage section 3 transmit signals through the photoelectric coupler 6, direct communication between the two parts through electric signals is prevented, the signals are transmitted through the electricity-light-electricity conversion of the photoelectric coupler, the anti-interference capability is high, electrical isolation is achieved, the influence of the high-voltage section 2 on the low-voltage section 3 is effectively reduced, and the stability of the structure is improved.
The pulse equipment provided by the embodiment of the invention comprises the relay board high-voltage breakdown prevention and shielding device. By which excellent functions can be realized.
In embodiments of the present invention, the term "plurality" means two or more unless explicitly defined otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.
In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or units must have a specific direction, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the embodiments of the present invention.
In the description herein, the appearances of the phrase "one embodiment," "a preferred embodiment," or the like, are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made to the present embodiment by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the embodiments of the present invention should be included in the protection scope of the embodiments of the present invention.
Claims (10)
1. The utility model provides a breakdown and shield assembly are prevented to relay board high pressure which characterized in that includes:
a relay board (1) including a ground point;
the high-voltage section (2) is arranged on one side of the relay board (1);
the low-pressure section (3) is arranged on the same side of the high-pressure section (2) and is separated from the high-pressure section (2); and
the plate ground wire (4) is arranged on the relay plate (1), arranged on the same side of the high-voltage section (2), and surrounds the periphery of the high-voltage section (2) by one circle, and one end of the plate ground wire (4) is connected with a grounding point;
the high-voltage section (2) comprises a first encapsulating layer (21) used for wrapping the high-voltage section (2), a first shielding layer (22) connected with a grounding point is arranged on the outer side of the first encapsulating layer (21), and the first shielding layer (22) and the plate ground wire (4) are used for blocking mutual inductance of elements on the outer sides of the high-voltage section (2) and the first shielding layer (22).
2. The relay board high-voltage breakdown-preventing and shielding device according to claim 1, wherein a second shielding layer is disposed at a position corresponding to the high-voltage section (2) on a side of the relay board (1) facing away from the high-voltage section (2), and the second shielding layer is connected to a grounding point to prevent a potential difference from being generated between the board ground wire (4) and the second shielding layer.
3. The relay board high voltage breakdown prevention and shielding device according to claim 1, wherein the projection of the first shielding layer (22) on the relay board (1) is located inside the board ground (4).
4. The relay board high voltage breakdown prevention and shielding device according to claim 1, wherein a portion of the projection of the first shielding layer (22) on the relay board (1) located outside the board ground line (4) is less than 5mm from the board ground line (4).
5. The relay board high-voltage breakdown-prevention and shielding device according to claim 1, wherein a groove (5) is formed between the high-voltage section (2) and the low-voltage section (3), and the groove (5) is filled with glue to prevent the high-voltage section (2) from discharging to the low-voltage section (3) by taking the relay board (1) as a medium.
6. The relay board high voltage breakdown prevention and shielding device according to claim 5, wherein the grooves (5) are in discontinuous communication to increase the strength of the relay board (1).
7. The relay board high-voltage breakdown-preventing and shielding device as claimed in claim 6, wherein an optoelectronic coupler (6) is arranged on the groove (5), and the high-voltage section (2) and the low-voltage section (3) are in signal transmission through the optoelectronic coupler (6) so as to prevent direct electrical signal communication between the high-voltage section (2) and the low-voltage section (3).
8. The relay board high-voltage breakdown prevention and shielding device according to claim 1, wherein the relay board (1) is integrally glue-filled to form a second glue-filled layer (23) so as to prevent the high-voltage section (2) from performing breakdown discharge to the outside.
9. The relay board high-voltage breakdown-preventing and shielding device according to claim 8, wherein the first potting layer (21) and the second potting layer (23) are both made of polymer insulating materials.
10. An impulse device, comprising: the relay board high voltage breakdown preventing and shielding device of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210947206.XA CN115424896B (en) | 2022-08-09 | 2022-08-09 | High-voltage breakdown-preventing and shielding device for relay board and pulse equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210947206.XA CN115424896B (en) | 2022-08-09 | 2022-08-09 | High-voltage breakdown-preventing and shielding device for relay board and pulse equipment |
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| Publication Number | Publication Date |
|---|---|
| CN115424896A true CN115424896A (en) | 2022-12-02 |
| CN115424896B CN115424896B (en) | 2023-12-22 |
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| CN202210947206.XA Active CN115424896B (en) | 2022-08-09 | 2022-08-09 | High-voltage breakdown-preventing and shielding device for relay board and pulse equipment |
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| DE102005059082A1 (en) * | 2005-12-10 | 2007-06-14 | Danfoss A/S | Method for potting electrical components and housing arrangement |
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| CN106300069A (en) * | 2016-10-18 | 2017-01-04 | 中国原子能科学研究院 | A kind of high-tension shielding structure of the power-supply system for electromagnetic separator |
| CN108123617A (en) * | 2016-11-29 | 2018-06-05 | 台达电子企业管理（上海）有限公司 | Device, high-low pressure converting system and power supply for installation height voltage conversion circuit |
| CN112889353A (en) * | 2018-10-17 | 2021-06-01 | 3M创新有限公司 | Packaged printed circuit board assembly |
-
2022
- 2022-08-09 CN CN202210947206.XA patent/CN115424896B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005059082A1 (en) * | 2005-12-10 | 2007-06-14 | Danfoss A/S | Method for potting electrical components and housing arrangement |
| CN205391469U (en) * | 2015-12-31 | 2016-07-27 | 天津市鹰泰利安康医疗科技有限责任公司 | High low -voltage isolating device of oncotherapy equipment |
| CN106300069A (en) * | 2016-10-18 | 2017-01-04 | 中国原子能科学研究院 | A kind of high-tension shielding structure of the power-supply system for electromagnetic separator |
| CN108123617A (en) * | 2016-11-29 | 2018-06-05 | 台达电子企业管理（上海）有限公司 | Device, high-low pressure converting system and power supply for installation height voltage conversion circuit |
| CN112889353A (en) * | 2018-10-17 | 2021-06-01 | 3M创新有限公司 | Packaged printed circuit board assembly |
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| CN115424896B (en) | 2023-12-22 |
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