CN115424573A - Display module and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a display module and electronic equipment, and belongs to the technical field of displays. This display module includes: the circuit comprises a substrate, a working voltage end VDD line, a common ground end VSS line and a metal film; the substrate comprises a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface; the substrate comprises at least one through hole penetrating from the first surface to the second surface, and the VDD line is electrically connected with the metal film through the through hole. In this application, set up the metallic film through the second surface at the base plate to pass through the through-hole with the metallic film and link to each other with VDD circuit electrical property, thereby reduce the resistance in the circuit, improve the luminous homogeneity of display module.

Description

Display module and electronic equipment

Technical Field

The application relates to the technical field of displays, in particular to a display module and electronic equipment.

Background

With the rapid development of the display technology field, display functions are implemented by displays in various computer devices. Among them, micro-light emitting diode (Micro-LED) technology is rapidly developed in the field of displays.

In Micro-LED display technology, the LED display units are driven by current continuously, so for the LED display units at different positions in the display panel, the paths through which the current flows are different, and the different paths correspond to different resistances, so that different voltage drops are formed in the display panel, thereby causing an IR-drop problem. Therefore, the voltage drop generated by the resistor can cause the circuit voltage of the LED display units at different positions in the display panel to be different, so that the brightness of the LED display units is different, and the uniformity of light emission of the Micro-LED display screen is reduced.

Disclosure of Invention

The embodiment of the application provides a display module and electronic equipment, can reduce the resistance of display circuit in the display module, improve IRdrop problem, improve the luminous homogeneity of display module.

In one aspect, an embodiment of the present application provides a display module, which includes a substrate, a working voltage terminal VDD line, a common ground terminal VSS line, and a metal film;

the substrate comprises a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface;

the substrate comprises at least one through hole penetrating from the first surface to the second surface, and the VDD line is electrically connected with the metal film through the through hole.

As an optional implementation manner of the embodiment of the present application, the display module further includes a driving circuit;

the driving circuit is used for providing a first voltage signal to the VDD line and simultaneously providing the first voltage signal to the metal film.

As an optional implementation manner of this embodiment, the VDD line is in a grid shape, and the VSS line is in a grid shape;

each grid comprises a display unit, the voltage input end of each display unit is connected with the VDD line, and the grounding end of each display unit is connected with the VSS line.

As an optional implementation manner of this embodiment of the present application, each display unit constitutes a display area, and the at least one through hole penetrating from the first surface to the second surface is uniformly distributed in the display area.

As an optional implementation manner of this embodiment, the thickness of the metal film is between 100nm and 100 um.

As an optional implementation manner of this embodiment, the material of the metal film is any one of an aluminum Al material, a copper Cu material, a silver Ag material, and a gold Au material.

As an alternative to the embodiments of the present application, the material of the substrate is a glass material or a flexible material.

As an optional implementation manner of the embodiment of the present application, a conductive metal is poured into the through hole;

the VDD line is connected in parallel with the metal film through the conductive metal in the through hole.

As an optional implementation manner of this embodiment, the diameter of the through hole is smaller than 60um.

In another aspect, an embodiment of the present application provides an electronic device, which includes at least one display module according to the above aspect.

The technical scheme provided by the embodiment of the application can at least comprise the following beneficial effects:

the application discloses display module includes: the circuit comprises a substrate, a working voltage end VDD line, a common ground end VSS line and a metal film; the substrate comprises a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface; the substrate comprises at least one through hole penetrating from the first surface to the second surface, and the VDD line is electrically connected with the metal film through the through hole. In this application, through set up the metallic film at the second surface of base plate to pass through the through-hole with the metallic film and link to each other with VDD circuit electrical property, thereby reduce the resistance in the circuit, improved the luminous homogeneity of display module.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an LED display unit according to an exemplary embodiment of the present application;

fig. 2 is a schematic structural diagram of a display module according to an exemplary embodiment of the present disclosure;

FIG. 3 is a cross-sectional view taken along line AB of FIG. 2 in accordance with an exemplary embodiment of the present application;

fig. 4 is a schematic structural diagram of a display module according to an exemplary embodiment of the present disclosure;

FIG. 5 is a top view of an exemplary embodiment of the present application, as referenced to FIG. 4;

FIG. 6 is a cross-sectional view of an exemplary embodiment of the present application, as referenced to FIG. 4;

fig. 7 is a schematic structural diagram of an electronic device according to an exemplary embodiment of the present application.

Detailed Description

In order that the above objects, features and advantages of the present application may be more clearly understood, the scheme of the present application will be further described below. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced other than as described herein; it is to be understood that the embodiments described in this specification are only some embodiments of the present application and not all embodiments.

The terms "first" and "second," and the like, in the description and in the claims of the present application are used for distinguishing between different objects and not for describing a particular order of the objects. For example, the first camera and the second camera are for distinguishing different cameras, and not for describing a particular order of the cameras.

In the embodiments of the present application, the words "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "such as" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of the words "exemplary" or "such as" are intended to present concepts in a concrete fashion, and in the description of embodiments of the present application, the meaning of "a plurality" means two or more unless otherwise specified.

In the application scenario where temperature acquisition exists in computer equipment used in daily life, some terms and application architectures related to the embodiments of the present application are first briefly introduced below for easy understanding.

With the continuous progress of science and technology, computer equipment is used more and more frequently in daily life, and people can use the computer equipment to study, entertain, work and the like in daily life. Among them, displays have become one of indispensable hardware components in computer devices.

Currently, the variety of displays is increasing, such as Light Emitting Diode (LED) displays, active Matrix Liquid Crystal displays (AM-LCDs), active Matrix Organic Light-Emitting Diode (AM-OLED) displays, and the like. Active matrix liquid crystal display (AM-LCD) products are widely used in the flat panel display market. However, AM-LCD products suffer from the major drawbacks of slow response time, poor conversion efficiency, low color saturation, etc. Therefore, active matrix organic light emitting diodes (AM-OLEDs) capable of overcoming these disadvantages are receiving attention. Compared with the AM-LCD, the AM-OLED has the advantages of self-luminous type, high contrast ratio, quick response, wide viewing angle and the like. The organic electroluminescent diode has a serious aging problem when it has a large current to achieve high brightness. Among the driving methods of the display, there are mainly the following two driving methods: passive addressing drive (PM, also called Passive addressing, passive driving, etc.) and Active addressing drive (AM, also called Active addressing, active driving, etc.).

The LED display units at different positions on the display panel are different in position, so that the longer the current flowing path is, the larger the resistance is, different voltage drops are formed, and the IR-drop problem exists.

Please refer to fig. 1, which illustrates a schematic structural diagram of an LED display unit according to an exemplary embodiment of the present application. As shown in fig. 1, a first LED unit 101 and a second LED unit 102 are included. In fig. 1, other LED units, which are not shown here, may be included between the first LED unit 101 and the second LED unit 102. After a voltage signal is input to each LED unit through a VDD input line on the glass substrate, each LED unit can start to work.

In fig. 1, for the circuit on the glass substrate, the Al process sheet resistance generally made of aluminum Al material is 0.08 Ω (thickness 0.2-0.5 um), the Cu process sheet resistance generally made of copper Cu material is 0.01-0.05 Ω (thickness 0.3-1 um), and in the display panel composed of each LED display unit, assuming that the line width of the VDD circuit is 10um, the length of the diagonal line is 152.4mm for a 6-inch display screen, and the resistance corresponding to the length reaches 152.4 Ω -1 k Ω. The current received by the LED unit closer to the VDD input line (such as the first LED unit 101 in fig. 1) can reach mA level, even a level a, but with the size of the display panel, the other LED units farther from the VDD input line (such as the second LED unit 102 in fig. 1) receive far end, typically <1mA, and the voltage drop can reach 0.1-5V level.

In order to improve the IR-drop problem existing in the display panel, the current transmission path can be reduced by increasing the input terminals, or a new compensation circuit is adopted, or an auxiliary electrode design is adopted to improve the problem. For the mode of adopting the auxiliary electrode design, the auxiliary electrode is formed by additionally introducing a layer of metal circuit in the circuit of the display panel and connecting the metal circuit to the electrode (VDD) of each LED display unit in the bottom layer circuit, and at the moment, the display panel is equivalently connected with a layer of metal circuit in parallel, so that the aim of reducing the resistance is fulfilled. Because the space of the bottom layer circuit is limited, and the auxiliary electrode can only be made into a fixed grid shape due to the limitation of the LED display unit in the design process, the IR-drop problem still exists due to the limitation of the manufacturing process and the display panel, so that the brightness of the LED display unit is different, and the uniformity of the light emission of the Micro-LED display screen is not high.

In order to further reduce the resistance of a display circuit in the display module, improve the IR-drop problem and improve the uniformity of light emission of the display module, the application provides a solution, and the resistance is reduced by arranging a whole metal film on the back of a substrate and connecting the metal film in parallel with a VDD (voltage-drain) circuit.

Please refer to fig. 2, which illustrates a schematic structural diagram of a display module according to an exemplary embodiment of the present disclosure. As shown in fig. 2, the display module includes: a substrate 201, an operating voltage terminal VDD line 202, a common ground terminal VSS line 203 and a metal film 204.

The substrate 201 includes a first surface 201a and a second surface 201b, the vdd line 202 and the VSS line 203 are disposed on the first surface 201a, and the metal film 204 is disposed on the second surface 201b. Alternatively, the working voltage terminal VDD line 202 and the common ground terminal VSS line 203 may be integrated on the first surface 201a by an engraving process.

The substrate 201 includes at least one through hole 201c penetrating from the first surface to the second surface, and the vdd line 202 is electrically connected to the metal film 204 through the through hole 201 c. Alternatively, the through hole 201c may be in the form of a cylinder, and a substrate manufacturer may customize the through hole on the substrate in advance during production and integrally form the through hole.

Referring to fig. 3, a cross-sectional view taken along line AB of fig. 2 is shown in accordance with an exemplary embodiment of the present application. As shown in fig. 3, a substrate 301, a vdd wiring 302, a vss wiring 303, and a metal film 304 are included. In fig. 3, the first surface is an upper surface of a substrate 301, the second surface is a lower surface of the substrate 301, a through hole 305 is disposed through the substrate 301, and a VDD line 302 on the upper surface is electrically connected to a metal film 304 on the lower surface through the through hole 305.

Optionally, with reference to the contents of fig. 2 and fig. 3, the VDD line 202 disposed on the first surface 201a of the display screen module is electrically connected to the metal film 204 through each through hole 201c on the substrate, and when the VDD line 202 supplies power to each LED unit on the display panel during the use of the display module, the metal film 204 on the back can reduce the voltage drop between each LED unit at different positions on the first surface 201a, so as to reduce the resistance of the display circuit in the display module, and improve the IR-drop problem.

To sum up, the display module of this application includes: the circuit comprises a substrate, a working voltage end VDD line, a common ground end VSS line and a metal film; the substrate comprises a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface; the substrate comprises at least one through hole penetrating from the first surface to the second surface, and the VDD line is electrically connected with the metal film through the through hole. In this application, set up the metallic film through the second surface at the base plate to pass through the through-hole with the metallic film and link to each other with VDD circuit electrical property, thereby reduce the resistance in the circuit, improved the luminous homogeneity of display module.

In a possible implementation manner, the display module further includes a driving circuit, where the driving circuit is electrically connected to the VDD line, the VSS line, and the metal film in the display module, and inputs electrical signals to the VDD line, the VSS line, and the metal film, so that each display unit in the display panel manufactured based on the display module works.

Please refer to fig. 4, which illustrates a schematic structural diagram of a display module according to an exemplary embodiment of the present disclosure. As shown in fig. 4, the display module includes: a substrate 401, an operating voltage terminal VDD line 402, a common ground terminal VSS line 403, and a metal film 404.

The substrate 401 includes a first surface 401a and a second surface 401b, a vdd line 402 and a VSS line 403 are disposed on the first surface 401a, and a metal film 404 is disposed on the second surface 401b. Alternatively, the working voltage terminal VDD line 402 and the common ground terminal VSS line 403 may be integrated on the first surface 401a by an engraving process.

The substrate 401 includes at least one via 401c penetrating from the first surface to the second surface, and the vdd line 402 is electrically connected to the metal film 404 through the via 401 c. Alternatively, the through hole 401c may be in the form of a cylinder, and a substrate manufacturer may customize the through hole on the substrate in advance during production and form the through hole integrally.

Optionally, the display module of the present application further includes a driving circuit 405, and the driving circuit 405 is configured to provide the first voltage signal to the metal film 404 while providing the first voltage signal to the VDD line 402.

The driving circuit 405 is used as a main power source for the display module, a VDD output terminal of the driving circuit 405 is electrically connected to the VDD line 402, and a VSS output terminal of the driving circuit 405 is electrically connected to the VSS line 403. In this application, the driving circuit 405 is further electrically connected to the metal film 404 on the second surface, and when the first voltage signal is input into VDD, the first voltage signal is also input into the metal film 404. For example, when the driving circuit 405 inputs a 12V voltage signal into the VDD line through the VDD output terminal, the driving circuit 405 also inputs a 12V voltage signal into the metal film 404, so that the voltage drop between the two is lower, and the difference between the voltage signals received by the display units at different positions through the VDD line is reduced, thereby reducing the resistance of the display module.

Optionally, the driving circuit 405 may be directly electrically connected to the metal film 404 through a VDD output terminal, or may be separately provided with an output terminal electrically connected to the metal film 404, so as to provide the first voltage signal to the VDD line 402 and provide the first voltage signal to the metal film 404 at the same time.

Optionally, in this application, the VDD line 402 is in a grid shape, and the VSS line 403 is also in a grid shape; and each grid comprises a display unit, the voltage input end of the display unit is connected with a VDD line, and the grounding end of the display unit is connected with a VSS line. That is, in the present application, each grid may correspond to one LED display unit, the VDD input terminal and the VSS input terminal of the LED display unit are electrically connected to the VDD line 402 and the VSS line 403 on the substrate, respectively, and the LED display unit operates when the driving circuit 405 inputs a voltage signal to the VDD line 402 and the VSS line 403.

Optionally, each display unit forms a display area, and at least one through hole penetrating from the first surface to the second surface is uniformly distributed in the display area. In this application, every display element constitutes the display area of display module group finally, and every through-hole can be according to the mode evenly distributed of array in the display area. For example, please refer to fig. 5, which illustrates a top view of an exemplary embodiment of the present application in relation to fig. 4. As shown in fig. 5, a display area 501, each via 502, is included. As shown in fig. 5, the through holes 502 are uniformly distributed in the display area in a square manner. The arrangement may be set directly by the substrate manufacturer when manufacturing the substrate. Optionally, the distribution mode of the square is also exemplified, and in practical application, the square may also be in other regular patterns such as triangle, circle, rectangle, and the like.

Optionally, in this application, each display unit may also be regarded as each pixel point in the display panel, and the number of the through holes may be the same as the number of the pixel points corresponding to each pixel point. That is, the number of the through holes may be the same as that of each display unit at most, so that a transmission path of a current is reduced when a voltage signal is input to VDD of each display unit, a voltage drop difference between the display units is reduced, and uniformity of display is improved.

Optionally, the thickness of the metal film 404 is between 100nm and 100 um. In the present application, the thickness of the metal film 404 on the second surface can be made as thick as possible without affecting the warpage of the substrate, thereby improving the resistance reduction effect of the present solution. Alternatively, in the present application, the substrate manufacturer may calculate the required thickness of the metal film 404 in advance by combining the IR-drop simulation result and the actual product requirement, and increase the resistance reduction effect of this embodiment by appropriately increasing the thickness. The thickness of the metal film 404 is also exemplary from 100nm to 100um, and may be adjusted to other thicknesses according to the actual product requirements, which is not limited in the present application.

Optionally, the metal film 404 is made of any one of an aluminum Al material, a copper Cu material, a silver Ag material, and a gold Au material. I.e. using pure metal material. In this application, in order to improve the light-emitting rate of display module, can adopt the metal material who has higher reflectivity to light, like Al, ag etc. can increase the reflection of light, increase light-emitting efficiency. In addition, the metal layer also has the function of shielding the electric field existing towards the second surface direction, and the reliability of the display module can be improved. Alternatively, the material of the metal film 404 in the present application may also be other mixed materials, for example, a nano indium tin oxide ITO material, etc.

Optionally, the material of the substrate 401 is a glass material or a flexible material. That is, in the present application, a customized through-hole glass may be used as a substrate, or a flexible circuit board may be used, and a corresponding through-hole is made in the flexible circuit board.

Optionally, conductive metal is poured into the through hole; the VDD line 402 is connected in parallel with the metal film 404 through the conductive metal in the via. The conductive metal may be the same as or different from the metal film 404. For example, the through holes are filled with conductive metals such as Fe, cu, al, and Au to achieve conductivity. Optionally, the conductive metal filled in the through hole may or may not fill the inner space of the entire through hole, and the VDD line 402 and the metal film 404 are electrically connected. Optionally, the diameter of the through hole is smaller than 60um.

Referring to fig. 6, a cross-sectional view of an exemplary embodiment of the present application is shown in relation to fig. 4. As shown in fig. 6, the VDD line 601, the substrate 602, the metal film 603, the via 604, and the conductive metal 605 are included. As shown in fig. 6, the conductive metal 605 filled in the through hole 604 fills the inner space of the through hole, the diameter of the through hole is 60um, and the thickness of the substrate is 300um. Alternatively, for the display shown in FIG. 6In the device module, a manufacturer can first customize a glass substrate 602 having a through hole 604 and fill a conductive metal 605 into the glass substrate to realize the fabrication of the substrate, then fabricate a VDD line and a VSS line on a first surface (upper surface) of the substrate in fig. 6, complete a set of processes, perform LED display unit transfer, package and other steps, then plate a metal film 603 on a second surface (lower surface) of the substrate by distillation, and finally continue to plate a protective film (such as polyvinyl chloride PV, silicon dioxide SiO) on the metal film 603 by evaporation ₂ Silicon nitride SiNx, etc.), and improves the oxidation resistance of the metal film. Optionally, in the above manufacturing process, the metal film on the second surface may be manufactured first, and then the VDD line and the VSS line on the first surface may be manufactured, so as to improve the static electricity problem.

Alternatively, the shape of the through hole may be a cylinder as shown in the above figures, and may also be a circular truncated cone, a rectangular parallelepiped, a square, a triangular prism, and the like, which is not limited in the present application.

In the present application, the resistance is reduced by connecting the VDD line and the metal film in parallel, and the same is applied to the VSS line. For example, the VSS line is connected in parallel to the metal film through the via hole, and the VSS output terminal of the driving circuit inputs the second voltage signal to the VSS line and also inputs the second voltage signal to the metal film at the same time, so that the effect of reducing the resistance can be achieved, which is not described herein again.

Alternatively, the present application may combine several ways to further reduce the resistance. For example, thicker metal may be used to reduce the resistance, or metal lines may be added to reduce the resistance, or a metal material with lower resistivity, such as Cu metal, may be selected to reduce the resistance instead of Al.

To sum up, the display module of this application includes: the circuit comprises a substrate, a working voltage end VDD circuit, a common grounding end VSS circuit and a metal film; the substrate comprises a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface; the substrate comprises at least one through hole penetrating from the first surface to the second surface, and the VDD line is electrically connected with the metal film through the through hole. In this application, set up the metallic film through the second surface at the base plate to pass through the through-hole with the metallic film and link to each other with VDD circuit electrical property, thereby reduce the resistance in the circuit, improved the luminous homogeneity of display module.

In addition, the metal film is arranged on the other surface of the substrate opposite to the VDD line, the influence of the width and the thickness of the VDD line or the VSS line is avoided, and the improvement effect is better.

Fig. 7 is a schematic structural diagram of an electronic device according to an exemplary embodiment of the present application. As shown in fig. 7, the electronic device 700 includes a Central Processing Unit (CPU) 701, a system Memory 704 including a Random Access Memory (RAM) 702 and a Read Only Memory (ROM) 703, and a system bus 705 connecting the system Memory 704 and the CPU 701. The electronic device 700 also includes a basic transmission/Output System (I/O System) 706 that facilitates information transfer between various devices within the computer, and a mass storage device 707 configured to store an operating System 712, application programs 713, and other program modules 714.

The basic transmission/output system 706 includes a display 706 configured to display information and a transmission device 709, such as a mouse, keyboard, etc., configured to transmit information to a user. Wherein the display 706 and the transmission device 709 are connected to the central processing unit 701 through a transmission output controller 710 connected to the system bus 705. The basic transmission/output system 706 may also include a transmission output controller 710 configured to receive and process transmissions from a number of other devices, such as a keyboard, mouse, or electronic stylus. Similarly, transport output controller 710 may also provide output to a display screen, a printer, or other type of output device.

The mass storage device 707 is connected to the central processing unit 701 through a mass storage controller (not shown) connected to the system bus 705. The mass storage device 707 and its associated computer-readable media provide non-volatile storage for the electronic device 700. That is, the mass storage device 707 may include a computer readable medium (not shown) such as a hard disk or CD-ROM (Compact disk Read-Only Memory) drive.

The computer readable media may include computer storage media and communication media. Computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes RAM, ROM, EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), flash Memory or other solid state Memory technology, CD-ROM, DVD (Digital Video Disc) or other optical, magnetic, tape, magnetic disk storage or other magnetic storage devices. Of course, those skilled in the art will appreciate that the computer storage media is not limited to the foregoing. The system memory 704 and mass storage device 707 described above may collectively be referred to as memory.

The electronic device 700 may be connected to the internet or other network devices through the network interface unit 711 connected to the system bus 705. The memory also includes one or more programs, which are stored in the memory.

Optionally, the electronic device provided in the present application may include at least one display module as shown in the embodiment of fig. 1 or fig. 2. Optionally, the electronic device may be a mobile phone, a television, a tablet computer, a notebook computer, smart glasses, a smart watch, an MP3 player (Moving Picture Experts Group Audio Layer III, mpeg compression standard Audio Layer 3), an MP4 player (Moving Picture Experts Group Audio Layer IV, mpeg compression standard Audio Layer 4), a laptop portable computer, a smart wearable device, and other devices having a display.

Optionally, in this application, the driving Circuit in the display module may be disposed on a Flexible Printed Circuit (FPC) or a glass substrate, and is combined with a rigid Circuit Board (PCB), and each pixel Circuit is in a Micro LED lamp panel, and the display process may refer to the working principle in fig. 2 or fig. 3, which is not described herein again. In addition, the more the number of the through holes is, the cost of the through holes is correspondingly increased, the size of the through holes occupies the area on the first surface, and when the screen pixel density (pixel Per Inch, PPI) of the display panel of the electronic device is higher, the density of the through holes on the first surface can be properly reduced, and the design number of the through holes is reduced.

The display module and the electronic device disclosed in the embodiments of the present application are described above by way of example, and the principles and embodiments of the present application are described herein by way of example, and the description of the embodiments is only configured to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A display module is characterized by comprising a substrate, a working voltage end VDD line, a common ground end VSS line and a metal film;

the substrate comprises a first surface and a second surface, the VDD line and the VSS line are arranged on the first surface, and the metal film is arranged on the second surface;

the substrate comprises at least one through hole penetrating from the first surface to the second surface, and the VDD line is electrically connected with the metal film through the through hole.

2. The display module of claim 1, further comprising a driving circuit;

the driving circuit is used for providing a first voltage signal to the VDD line and simultaneously providing the first voltage signal to the metal film.

3. The display module of claim 1, wherein the VDD line is in a grid pattern and the VSS line is in a grid pattern;

each grid comprises a display unit, the voltage input end of each display unit is connected with the VDD line, and the grounding end of each display unit is connected with the VSS line.

4. The display module of claim 3, wherein each display unit forms a display area, and the at least one through hole penetrating from the first surface to the second surface is uniformly distributed in the display area.

5. The display module of any one of claims 1-4, wherein the thickness of the metal film is between 100nm and 100 um.

6. The display module according to any one of claims 1 to 4, wherein the material of the metal film is any one of an aluminum Al material, a copper Cu material, a silver Ag material and a gold Au material.

7. The display module according to any one of claims 1 to 4, wherein the substrate is made of a glass material or a flexible material.

8. The display module of any one of claims 1 to 4, wherein the through holes are filled with a conductive metal;

the VDD line is connected in parallel with the metal film through the conductive metal in the through hole.

9. The display module of any one of claims 1-4, wherein the diameter of the through hole is less than 60um.

10. An electronic device, comprising at least one display module of any one of claims 1-9.

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