CN115410960A - Packaging hardware for integrated circuit board - Google Patents
Packaging hardware for integrated circuit board Download PDFInfo
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- CN115410960A CN115410960A CN202211157548.8A CN202211157548A CN115410960A CN 115410960 A CN115410960 A CN 115410960A CN 202211157548 A CN202211157548 A CN 202211157548A CN 115410960 A CN115410960 A CN 115410960A
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- circuit board
- integrated circuit
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- device frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a packaging device for an integrated circuit board, which relates to the technical field of integrated circuit board packaging. According to the invention, the pressing and packaging mechanism and the integrated circuit board withdrawing mechanism are installed to cooperate, the integrated circuit board is arranged at the upper end of the integrated circuit board withdrawing mechanism, the corner pads are protected to fix the integrated circuit board, the pressing and packaging mechanism works to enable the pressing plate to move downwards, the soft silica gel pressing protection plate is inflated to perform a soft pressing effect on the upper surface of the integrated circuit board, the integrated circuit board is prevented from being damaged due to overlarge pressing pressure of the pressing plate on the integrated circuit board directly, after pressing is finished, mechanisms in the integrated circuit board withdrawing mechanism cooperate with each other to jack up the integrated circuit board to withdraw the pressed and packaged circuit board, and meanwhile, the next pressing and packaging treatment is facilitated.
Description
Technical Field
The invention relates to the technical field of integrated circuit board packaging, in particular to a packaging device for an integrated circuit board.
Background
The integrated circuit package is developed along with the development of the integrated circuit, and along with the continuous development of various industries such as aerospace, aviation, machinery, light industry, chemical industry and the like, the whole machine is also developed towards multifunction and miniaturization. The invention provides a packaging device for an integrated circuit board, which is characterized in that the integrated circuit board is required to be higher and higher in integration degree and more complex in function, the integrated circuit board is generally fixed by using a glue dispensing device in the packaging process of the common integrated circuit board, then the packaging device is used for directly pressing the integrated circuit board, the integrated circuit board can be permanently fixed after the glue is solidified, however, the integrated circuit board can be damaged by directly pressing the circuit board, and therefore, the invention provides the packaging device for the integrated circuit board.
In the prior art, a chinese utility model patent document with publication No. CN212324563U and publication No. 2021, 01-month and 08-day is proposed to solve the above technical problems, and the technical solution disclosed in the patent document is as follows: the utility model provides an integrated circuit is packaging hardware for board, which comprises a housin, the inside of casing is provided with circuit board components, the outside movable mounting of casing has the shell, the positive fixedly connected with filter of shell, all be provided with the heating panel around the shell, the bottom fixed mounting of casing has the supporting legs seat, the bottom fixed mounting of casing has the bottom plate, the spout has all been seted up to the top and the below of bottom plate upper surface, the top swing joint of shell has the apron, one side fixedly connected with handle of apron, one side fixedly connected with slider of shell bottom. This packaging hardware for integrated circuit board through the combined action of the expanding spring on the unable adjustment base and stripper plate, puts circuit board subassembly between the stripper plate, according to circuit board subassembly's model, adjusts the stripper plate, makes its firm fixing between the stripper plate to can reach the convenient installation to circuit board subassembly and the effect of dismantling.
In the actual use process, the following problems can occur in the technical scheme: the prior circuit board packaging device is inconvenient to integrally disassemble the packaged circuit board after pressing and packaging the circuit board, and is inconvenient to operate; the existing circuit board packaging device is lack of a protection mechanism when the circuit board is pressed, so that the circuit board is easily damaged, and the packaging quality of the circuit board is not favorably improved.
Disclosure of Invention
The present invention provides a package device for an integrated circuit board to solve the problems of the prior art.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the utility model provides an integrated circuit board packaging hardware for board, includes integrated circuit board packaging hardware main part, integrated circuit board packaging hardware main part is including the device frame, the top of device frame is provided with pressfitting packaging mechanism, the lower extreme of device frame is provided with integrated circuit board and moves back a board mechanism, pressfitting packaging mechanism is including motor, threaded rod, pressfitting board, soft silica gel pressfitting protection shield and inflator, the lower surface of motor and the bottom internal surface fixed connection of device frame, integrated circuit board moves back a board mechanism and includes flexible post, elastic buffer board and mutual exclusion magnetic pole group, the surface of device frame is provided with the movable groove with flexible post looks adaptation.
The technical scheme of the invention is further improved as follows: the output shaft of motor and the lower extreme fixed connection of threaded rod, the lower extreme surface of threaded rod is connected with the inner wall rotation of device frame, the upper end of threaded rod is connected with the internal surface top rotation of device frame, move back the board mechanism through installation pressfitting packaging mechanism and integrated circuit board and carry out the mating reaction, place integrated circuit board in and move back board mechanism upper end in the integrated circuit board, the protection corner pad is fixed it, pressfitting packaging mechanism work makes the pressfitting board move down, soft pressfitting effect is carried out to the upper surface of integrated circuit board to soft silica gel pressfitting protection shield inflation, avoid the pressfitting board directly to the too big integrated circuit board pressfitting pressure of integrated circuit board to cause the integrated circuit board to damage, after the pressfitting is finished simultaneously, integrated circuit board moves back the inside mechanism of board mechanism and mutually supports up the integrated circuit board and moves back the board, be convenient for take up the circuit board that the pressfitting encapsulation was accomplished, be convenient for simultaneously carry out next round of pressfitting encapsulation processing.
The technical scheme of the invention is further improved as follows: one side of threaded rod is provided with the gag lever post, the upper and lower both ends of gag lever post are connected with the internal surface fixed mounting of device frame respectively, the surface threaded connection of one side inner wall and the threaded rod of compressed particleboard, the opposite side inner wall of compressed particleboard and the surface sliding connection of gag lever post, motor work drive threaded rod rotate, and the gag lever post plays spacing effect, and the compressed particleboard reciprocates along the gag lever post under the effect of threaded rod and gag lever post mutually supporting.
The technical scheme of the invention is further improved as follows: the utility model discloses a processing method of integrated circuit board, including the processing of soft silica gel pressfitting protection shield, the surface of soft silica gel pressfitting protection shield and the internal surface joint of pressfitting board, the top inner wall fixed mounting of soft silica gel pressfitting protection shield has the trachea installing port, the lower surface inner wall fixed mounting of soft silica gel pressfitting protection shield has the inflatable packer, and the pressfitting board plays the effect of bearing soft silica gel pressfitting protection shield simultaneously, carries out the processing of pressfitting encapsulation to integrated circuit board.
The technical scheme of the invention is further improved as follows: one side inner wall fixed mounting of soft silica gel pressfitting protection shield has the pressure snuffle valve, the pressure snuffle valve runs through a side surface of trachea installing port respectively with the pipeline of trachea installing port, the lower surface of inflator and the top fixed surface of device frame are connected, the inner wall of pressfitting board is provided with the mounting hole with trachea installing port, pressure snuffle valve looks adaptation, and inflator work carries out fixed connection through soft bellows and trachea installing port and carries out the air inflation processing to inflatable packer, makes inflatable packer evenly tile at integrated circuit board's upper surface, evenly makes its atress by the pressfitting.
The technical scheme of the invention is further improved as follows: the gas tube of inflator and the top inner wall fixed connection of device frame, the gas tube lower extreme fixed mounting of inflator has soft bellows, the lower extreme of soft bellows and the internal surface swing joint of trachea installing port, soft silica gel pressfitting protection shield play and carry out the effect of buffering to the compressed particleboard, and the inside pressure variation of pressure air release valve monitoring inflatable packer, the inside too big integrated circuit board that represents of inflatable packer inside pressure has the risk of being damaged by the excessive pressure, and the pressure air release valve releases some gas, can not damaged by the excessive pressure when guaranteeing integrated circuit board even pressurized.
The technical scheme of the invention is further improved as follows: the outer surface of flexible post and the inner wall sliding connection of device frame, the upper end of flexible post is provided with the protection corner pad, the lower surface of protection corner pad be provided with flexible post looks adaptation the joint hole, the lower surface of protection corner pad and the top joint of protection corner pad, the protection corner pad is convenient for change through carrying out the joint with flexible post, the protection corner pad plays the effect of installation location and protection to integrated circuit board's corner.
The technical scheme of the invention is further improved as follows: the upper surface of the device frame is provided with shrinkage holes matched with the protection corner pads, the upper surfaces of the protection corner pads are clamped with the periphery of the integrated circuit board, the protection corner pads move downwards to shrink under pressure to extrude the elastic buffer plate, the elastic connection folded plate is folded and compressed, and after the integrated circuit board is pressed and packaged, the pressing plate moves upwards to eliminate the pressure.
The technical scheme of the invention is further improved as follows: the lower surface of the elastic buffer plate is fixedly connected with the inner surface of the bottom of the device frame, elastic connection folded plates are fixedly mounted on two sides of the elastic buffer plate, the mutually exclusive magnetic pole groups are arranged on the inner side of the elastic buffer plate, the outer surfaces of the mutually exclusive magnetic pole groups are respectively fixedly connected with the inner surface of the elastic buffer plate, and the mutually exclusive magnetic pole groups generate repulsive force by utilizing the principle of mutual exclusion of opposite magnetic poles to enable the elastic buffer plate to jack up the telescopic column to withdraw from the integrated circuit board, so that workers can take down and mount the next integrated circuit board conveniently.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the technical progress that:
1. the invention provides an integrated circuit board packaging device, which is used for erecting a pressing packaging mechanism and an integrated circuit board withdrawing mechanism, wherein the pressing packaging mechanism and the integrated circuit board withdrawing mechanism are installed for cooperation, an integrated circuit board is arranged at the upper end of the integrated circuit board withdrawing mechanism, a protection corner pad is used for fixing the integrated circuit board, the pressing packaging mechanism works to move a pressing plate downwards, a soft silica gel pressing protection plate is inflated to perform soft pressing action on the upper surface of the integrated circuit board, the integrated circuit board is prevented from being damaged due to the fact that the pressing plate directly pushes the integrated circuit board too high in pressing pressure, the problem that the packaged circuit board is difficult to be improved due to the fact that the conventional circuit board packaging device lacks a protection mechanism when the circuit board is pressed is solved, the circuit board is easy to be damaged, and the packaging quality of the circuit board is not convenient to be improved.
2. The invention provides a packaging device for an integrated circuit board, wherein a pressing packaging mechanism is installed, a motor works to drive a threaded rod to rotate, a limiting rod plays a limiting role, a pressing plate moves up and down along the limiting rod under the mutual matching effect of the threaded rod and the limiting rod, the pressing plate simultaneously plays a role in bearing a soft silica gel pressing protection plate, and the integrated circuit board is subjected to pressing packaging treatment.
3. The invention provides a packaging device for an integrated circuit board, wherein after a pressing plate moves to a fixed height, an inflator works to fixedly connect an air pipe mounting port through a soft corrugated pipe to inflate an inflatable cushion, so that the inflatable cushion is uniformly paved on the upper surface of the integrated circuit board and is uniformly stressed and pressed, a soft silica gel pressing protection plate plays a role in buffering the pressing plate, a pressure release valve monitors the pressure change in the inflatable cushion, the excessive pressure in the inflatable cushion represents the risk that the integrated circuit board is damaged by overpressure, and the pressure release valve releases partial gas, so that the integrated circuit board is ensured to be uniformly pressed and cannot be damaged by overpressure.
4. The invention provides a packaging device for an integrated circuit board, which is characterized in that a board withdrawing mechanism of the integrated circuit board is installed, a protection corner pad is clamped with a telescopic column for convenient replacement, the protection corner pad plays the roles of installation, positioning and protection on the corner of the integrated circuit board, the protection corner pad moves down and contracts under pressure to extrude an elastic buffer board, an elastic connection folded plate is folded and compressed, after the integrated circuit board is pressed and packaged, a pressing plate moves up to eliminate the pressure, a mutual-exclusion magnetic pole group generates repulsion force by utilizing the principle of mutual exclusion of opposite magnetic poles to enable the elastic buffer board to jack up the telescopic column to withdraw from the integrated circuit board, and workers can take down and install the next integrated circuit board conveniently.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic view of the structure pressing and fixing operation of the present invention;
FIG. 3 is a schematic diagram of the structure of the present invention after pressing and withdrawing the board;
FIG. 4 is a schematic diagram of a board withdrawing mechanism of the structural integrated circuit board of the present invention;
FIG. 5 is a schematic view of a structural laminate panel of the present invention;
fig. 6 is a schematic view of the structural soft silica gel press-fit protection plate of the present invention.
In the figure: 1. an integrated circuit board packaging device body; 11. a device frame; 2. pressing and packaging the mechanism; 21. a motor; 22. a threaded rod; 221. a limiting rod; 23. pressing the plywood; 24. pressing the soft silica gel to the protection plate; 241. an air pipe mounting port; 242. an inflatable cushion; 25. an inflator; 251. a flexible bellows; 26. a pressure release valve; 3. the integrated circuit board retreating mechanism; 31. a telescopic column; 32. protecting the corner pad; 33. an elastic buffer plate; 331. elastically connecting the folded plate; 34. a set of mutually exclusive magnetic poles.
Detailed Description
The present invention is further illustrated in detail below with reference to examples:
example 1
As shown in FIGS. 1-6, the present invention provides a packaging device for an integrated circuit board, comprising a packaging device body 1 of the integrated circuit board, the packaging device body 1 of the integrated circuit board comprises a device frame 11, a press-fit packaging mechanism 2 is arranged above the device frame 11, a board withdrawing mechanism 3 of the integrated circuit board is arranged at the lower end of the device frame 11, the press-fit packaging mechanism 2 comprises a motor 21, a threaded rod 22, a press-fit board 23, a soft silica gel press-fit protection board 24 and an inflator 25, the lower surface of the motor 21 is fixedly connected with the inner surface of the bottom of the device frame 11, the board withdrawing mechanism 3 of the integrated circuit board comprises a telescopic column 31, an elastic buffer board 33 and a mutual exclusion magnetic pole group 34, the surface of the device frame 11 is provided with a movable groove matched with the telescopic column 31, the output shaft of the motor 21 is fixedly connected with the lower end of the threaded rod 22, the outer surface of the lower end of the threaded rod 22 is rotatably connected with the inner wall of the device frame 11, the upper end of the threaded rod 22 is rotatably connected with the top of the inner surface of the device frame 11, one side of the threaded rod 22 is provided with a limit rod 221, the upper end of the limit rod is respectively fixedly connected with the inner surface of the press-fit board withdrawing mechanism, the press-fit board, the press-fit mechanism 2 of the press-fit board 23, the soft silica gel press-fit board withdrawing mechanism is mounted on the inner surface of the soft silica gel press-fit board, the press-fit packaging device frame 11, the flexible protection board, the press-fit packaging mechanism 2, the press-fit board withdrawing mechanism is mounted mechanism 2, the flexible silica gel press-fit board 23, the flexible silica gel press-fit board withdrawing mechanism is mounted mechanism 2, avoid pressfitting board 23 directly to too big integrated circuit board pressfitting pressure cause the integrated circuit board to damage, after the pressfitting was ended simultaneously, integrated circuit board moves back that the mechanism of 3 inside mutually supports moves back the board with integrated circuit board jack-up, is convenient for take up the circuit board that the pressfitting encapsulation was accomplished, is convenient for carry out next round pressfitting encapsulation simultaneously and handles.
Example 2
As shown in fig. 1 to 6, on the basis of embodiment 1, the present invention provides a technical solution: the outer surface of the soft silica gel press-fit protection plate 24 is clamped with the inner surface of the press-fit plate 23, an air pipe installation opening 241 is fixedly installed on the inner wall of the top of the soft silica gel press-fit protection plate 24, an inflatable cushion 242 is fixedly installed on the inner wall of the lower surface of the soft silica gel press-fit protection plate 24, a pressure release valve 26 is fixedly installed on the inner wall of one side of the soft silica gel press-fit protection plate 24, a pipeline of the pressure release valve 26 and a pipeline of the air pipe installation opening 241 respectively penetrate through the surface of one side of the air pipe installation opening 241, the lower surface of the inflator 25 is fixedly connected with the surface of the top of the device frame 11, an installation through hole matched with the air pipe installation opening 241 and the pressure release valve 26 is formed in the inner wall of the press-fit plate 23, the motor 21 works to drive the threaded rod 22 to rotate, the limiting rod 221 plays a limiting role, the press-fit plate 23 moves up and down along the limiting rod 221 under the effect that the threaded rod 22 and the limiting rod 221 are mutually matched, the press-fit protection plate 23 simultaneously plays a role in bearing the silica gel press-fit package of the integrated circuit board.
Example 3
As shown in fig. 1-6, on the basis of the embodiment 1-2, the present invention provides a technical solution: the inflation tube of the inflator 25 is fixedly connected with the inner wall of the top of the device frame 11, the lower end of the inflation tube of the inflator 25 is fixedly provided with a soft corrugated tube 251, the lower end of the soft corrugated tube 251 is movably connected with the inner surface of the air tube mounting opening 241, the outer surface of the telescopic column 31 is slidably connected with the inner wall of the device frame 11, the upper end of the telescopic column 31 is provided with a protection corner pad 32, the lower surface of the protection corner pad 32 is provided with a clamping hole matched with the telescopic column 31, the lower surface of the protection corner pad 32 is clamped with the top of the protection corner pad 32, the inflator 25 works to fixedly connect the soft corrugated tube 251 and the air tube mounting opening 241 to inflate the inflation pad 242, so that the inflation pad 242 is uniformly and flatly laid on the upper surface of the integrated circuit board, the inflation pad 242 is uniformly stressed and pressed, the soft silica gel pressing 24 plays a role in buffering the pressing against the pressing plate 23, the pressure release valve 26 monitors the pressure change inside the inflation pad 242, the excessive pressure inside the inflation pad 242 represents that the integrated circuit board is damaged by the protection plate, the integrated circuit board, the pressure release valve 26 releases partial gas, and ensures that the integrated circuit board is uniformly pressed and cannot be damaged by overpressure.
Example 4
As shown in fig. 1 to 6, on the basis of the embodiments 1 to 3, the present invention provides a technical solution: the upper surface of the device frame 11 is provided with a contraction hole matched with the protection corner pad 32, the upper surface of the protection corner pad 32 is clamped with the periphery of the integrated circuit board, the lower surface of the elastic buffer plate 33 is fixedly connected with the inner surface of the bottom of the device frame 11, two sides of the elastic buffer plate 33 are fixedly provided with elastic connection folded plates 331, the mutually exclusive magnetic pole groups 34 are arranged on the inner sides of the elastic buffer plate 33, the outer surfaces of the mutually exclusive magnetic pole groups 34 are respectively and fixedly connected with the inner surface of the elastic buffer plate 33, the protection corner pad 32 is clamped with the telescopic column 31 to be convenient to replace, the protection corner pad 32 plays a role in mounting, positioning and protecting the corners of the integrated circuit board, the protection corner pad 32 is downwards contracted under pressure to extrude the elastic buffer plate 33, the elastic connection folded and compressed folded plate 331, after the integrated circuit board is pressed and packaged, the pressing plate 23 upwards moves to eliminate the pressure, the mutually exclusive magnetic pole groups 34 generate repulsive force to enable the elastic buffer plate 33 to jack the telescopic column 31 up the telescopic column 31 to withdraw from the integrated circuit board by using the principle of opposite magnetic poles, and facilitate a worker to take down and mount the next integrated circuit board.
The operation of the package device for an ic board will be described in detail below.
As shown in fig. 1-6, firstly, the integrated circuit board is placed on the upper end of the integrated circuit board withdrawing mechanism 3, the protection corner pad 32 fixes the integrated circuit board, the motor 21 works to drive the threaded rod 22 to rotate, the pressing plate 23 moves up and down along the limiting rod 221 under the action of the mutual matching of the threaded rod 22 and the limiting rod 221, the pressing plate 23 simultaneously plays a role of bearing the soft silica gel pressing protection plate 24, then, the inflator 25 works to fixedly connect with the air pipe mounting port 241 through the soft bellows 251 to inflate the inflatable cushion 242, so that the inflatable cushion 242 is uniformly laid on the upper surface of the integrated circuit board, so that the integrated circuit board is uniformly stressed and pressed, the soft silica gel pressing protection plate 24 plays a role of buffering the pressing plate 23, the pressure valve 26 monitors the pressure change inside the inflatable cushion 242, the excessive pressure inside the inflatable cushion 242 represents the risk of damage of the integrated circuit board due to overpressure, the pressure valve 26 releases partial air, so as to ensure that the integrated circuit board is uniformly and cannot be damaged due to overpressure, finally, the protection corner pad 32 moves down to compress the elastic buffer plate 33 to extrude the elastic buffer plate 33, the integrated circuit board is folded and then folded and the integrated circuit board is packaged, and the integrated circuit board withdrawing mechanism can be conveniently used for removing the repulsive force generated by the integrated circuit board after the integrated circuit board withdrawing mechanism 34.
The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, it is possible to modify or improve the optical characteristics of the optical fiber without departing from the spirit of the present invention.
Claims (9)
1. The utility model provides an integrated circuit board packaging hardware for board, includes integrated circuit board packaging hardware main part (1), integrated circuit board packaging hardware main part (1) is including device frame (11), its characterized in that: the integrated circuit packaging structure is characterized in that a pressing packaging mechanism (2) is arranged above the device frame (11), an integrated circuit board withdrawing mechanism (3) is arranged at the lower end of the device frame (11), the pressing packaging mechanism (2) comprises a motor (21), a threaded rod (22), a pressing plate (23), a soft silica gel pressing protection plate (24) and an inflator (25), the lower surface of the motor (21) is fixedly connected with the inner surface of the bottom of the device frame (11), the integrated circuit board withdrawing mechanism (3) comprises a telescopic column (31), an elastic buffer plate (33) and a mutually exclusive magnetic pole group (34), and a movable groove matched with the telescopic column (31) is formed in the surface of the device frame (11).
2. A packaging apparatus for an integrated circuit board according to claim 1, wherein: the output shaft of the motor (21) is fixedly connected with the lower end of the threaded rod (22), the outer surface of the lower end of the threaded rod (22) is rotatably connected with the inner wall of the device frame (11), and the upper end of the threaded rod (22) is rotatably connected with the top of the inner surface of the device frame (11).
3. A packaging apparatus for an integrated circuit board according to claim 1, wherein: one side of threaded rod (22) is provided with gag lever post (221), the upper and lower both ends of gag lever post (221) are connected with the internal surface fixed of device frame (11) respectively, the surface threaded connection of one side inner wall and threaded rod (22) of pressfitting board (23), the surface sliding connection of the opposite side inner wall and gag lever post (221) of pressfitting board (23).
4. A packaging apparatus for an integrated circuit board according to claim 1, wherein: the surface of soft silica gel pressfitting protection shield (24) and the internal surface joint of pressfitting board (23), the top inner wall fixed mounting of soft silica gel pressfitting protection shield (24) has trachea installing port (241), the lower surface inner wall fixed mounting of soft silica gel pressfitting protection shield (24) has inflatable packer (242).
5. A packaging apparatus for an integrated circuit board according to claim 1, wherein: one side inner wall fixed mounting of soft silica gel pressfitting protection shield (24) has the disappointing valve of pressure (26), the disappointing valve of pressure (26) runs through the one side surface of trachea installing port (241) respectively with the pipeline of trachea installing port (241), the lower surface of inflator (25) is connected with the top fixed surface of mounting frame (11), the inner wall of pressfitting board (23) is provided with the mounting hole who loses heart valve of pressure (26) looks adaptation with trachea installing port (241).
6. A packaging apparatus for an integrated circuit board according to claim 1, wherein: an inflation tube of the inflator (25) is fixedly connected with the inner wall of the top of the device frame (11), a soft corrugated tube (251) is fixedly installed at the lower end of the inflation tube of the inflator (25), and the lower end of the soft corrugated tube (251) is movably connected with the inner surface of the air tube installation opening (241).
7. A packaging apparatus for an integrated circuit board according to claim 1, wherein: the outer surface of flexible post (31) and the inner wall sliding connection of device frame (11), the upper end of flexible post (31) is provided with protection angle pad (32), the lower surface of protection angle pad (32) be provided with the joint hole of flexible post (31) looks adaptation, the lower surface of protection angle pad (32) and the top joint of protection angle pad (32).
8. A packaging apparatus for an integrated circuit board according to claim 1, wherein: the upper surface of the device frame (11) is provided with shrinkage holes matched with the protection corner pads (32), and the upper surfaces of the protection corner pads (32) are clamped with the periphery of the integrated circuit board.
9. A packaging apparatus for an integrated circuit board according to claim 1, wherein: the lower surface of the elastic buffer plate (33) is fixedly connected with the inner surface of the bottom of the device frame (11), elastic connection folded plates (331) are fixedly installed on two sides of the elastic buffer plate (33), the mutually exclusive magnetic pole group (34) is arranged on the inner side of the elastic buffer plate (33), and the outer surface of the mutually exclusive magnetic pole group (34) is fixedly connected with the inner surface of the elastic buffer plate (33) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211157548.8A CN115410960A (en) | 2022-09-22 | 2022-09-22 | Packaging hardware for integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211157548.8A CN115410960A (en) | 2022-09-22 | 2022-09-22 | Packaging hardware for integrated circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN115410960A true CN115410960A (en) | 2022-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211157548.8A Pending CN115410960A (en) | 2022-09-22 | 2022-09-22 | Packaging hardware for integrated circuit board |
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| CN (1) | CN115410960A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116072576A (en) * | 2023-03-24 | 2023-05-05 | 广州雅量商业智能技术有限公司 | Integrated circuit board packaging device and packaging method thereof |
-
2022
- 2022-09-22 CN CN202211157548.8A patent/CN115410960A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116072576A (en) * | 2023-03-24 | 2023-05-05 | 广州雅量商业智能技术有限公司 | Integrated circuit board packaging device and packaging method thereof |
| CN116072576B (en) * | 2023-03-24 | 2023-08-08 | 广州雅量商业智能技术有限公司 | Integrated circuit board packaging device and packaging method thereof |
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