CN115403922B - Polyamide composite material and preparation method and application thereof - Google Patents
Polyamide composite material and preparation method and application thereof Download PDFInfo
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- CN115403922B CN115403922B CN202210960445.9A CN202210960445A CN115403922B CN 115403922 B CN115403922 B CN 115403922B CN 202210960445 A CN202210960445 A CN 202210960445A CN 115403922 B CN115403922 B CN 115403922B
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- 239000004952 Polyamide Substances 0.000 title claims abstract description 39
- 229920002647 polyamide Polymers 0.000 title claims abstract description 39
- 239000002131 composite material Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title description 6
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 claims abstract description 50
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000003365 glass fiber Substances 0.000 claims abstract description 22
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 17
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000006185 dispersion Substances 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 6
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 6
- 239000000725 suspension Substances 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 5
- 230000004580 weight loss Effects 0.000 claims description 5
- 229920002292 Nylon 6 Polymers 0.000 claims description 4
- 239000012752 auxiliary agent Substances 0.000 claims description 4
- 239000000314 lubricant Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 31
- 150000008064 anhydrides Chemical group 0.000 abstract description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 12
- 239000000243 solution Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- -1 poly (arylene ether nitrile Chemical class 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000005979 thermal decomposition reaction Methods 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 2
- 244000208060 Lawsonia inermis Species 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical class O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a polyamide composite material, which comprises the following components in parts by weight: 50-100 parts of polyamide resin; 5-20 parts of maleic anhydride grafted POE; 1-5 parts of copper phthalocyanine; 30-60 parts of glass fiber. According to the polyamide composite material, a certain amount of copper phthalocyanine and maleic anhydride grafted POE are added, the carboxyl on the surface of copper phthalocyanine is combined with the amino at the molecular chain end of polyamide resin during melt blending, and meanwhile, polyamide reacts with the anhydride group on the surface of maleic anhydride grafted POE to form a stable structure, so that the heat resistance and dielectric property of the material can be remarkably improved, the polyamide composite material with high heat stability and high dielectric strength can be obtained, and the use requirement of the 5G technical field or the new energy field on the material is met.
Description
Technical Field
The invention relates to the technical field of high polymer materials, in particular to a polyamide composite material and a preparation method and application thereof.
Background
Polyamide (PA) is widely used as engineering plastic in various fields. With the development of modern high technology, especially the coming of 5G and new energy age, higher requirements are put on materials, and the materials need to meet the characteristics of high strength, thermal stability, high dielectric strength and the like. The polyamide is used as a representative high-strength material, and has the defects of easy water absorption, reduced thermal stability and dielectric strength of the material after water absorption, and limited application in the fields of 5G technology and new energy. Therefore, the modification of the thermal stability and dielectric constant of polyamide materials has become a hot point of research.
In the prior art, chinese patent application CN104629353A discloses that copper salt is adopted as a heat stabilizing additive to improve the heat stability of materials in nylon 6 and nylon 66, and the materials are applied to automobile parts, but bromine-containing components are required to be added, so that the dielectric properties of the materials are affected and the environmental pollution is caused; chinese patent application CN101717569a discloses a poly (arylene ether nitrile)/hyperbranched copper phthalocyanine dielectric film, which is mainly prepared by uniformly dispersing hyperbranched copper phthalocyanine in a poly (arylene ether nitrile) matrix by in-situ blending and casting, so as to improve dielectric properties and mechanical properties, but the poly (arylene ether nitrile)/hyperbranched copper phthalocyanine dielectric film is used as a film material, and cannot meet the requirements of injection molding products and other thicker parts; chinese patent application CN111748203a discloses that caprolactam in-situ modified boehmite synergistic flame-retardant high-temperature nylon is adopted to improve the mechanical strength and dielectric strength of the material, but the introduction of brominated flame retardant in the system can reduce the thermal stability of the material, and the comprehensive performance of the material is poor. At present, the preparation of the polyamide material with high heat stability and high dielectric strength still has certain difficulty.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a polyamide material with high heat stability and high dielectric strength.
Another object of the present invention is to provide a method for producing the above polyamide composite material.
The invention is realized by the following technical scheme:
the polyamide composite material comprises the following components in parts by weight:
50-100 parts of polyamide resin;
5-20 parts of maleic anhydride grafted POE;
1-5 parts of copper phthalocyanine;
30-60 parts of glass fiber.
According to the invention, a certain amount of copper phthalocyanine and maleic anhydride grafted POE are added into the polyamide material, the carboxyl on the surface of copper phthalocyanine is combined with the amino at the chain end of the polyamide resin molecule during melt blending, and meanwhile, the polyamide reacts with the anhydride group on the surface of the maleic anhydride grafted POE to form a stable structure, so that the thermal stability and dielectric strength of the material can be obviously improved.
Preferably, 8-15 parts of maleic anhydride grafted POE.
Preferably, the maleic anhydride grafting rate of the maleic anhydride grafted POE is 0.7-0.9%. The maleic anhydride grafting ratio can be determined by infrared spectroscopy: and testing a sample with a fixed thickness by adopting a Fourier infrared spectrometer to obtain an infrared spectrum characteristic absorption peak, and calculating the grafting rate of the maleic anhydride by comparing the ratio of carbonyl to methylene absorption intensity.
Preferably, the copper phthalocyanine is 2-4 parts.
Preferably, the average particle diameter of the copper phthalocyanine is 30-100nm.
Preferably, the polyamide resin is selected from any one or more of PA6, PA66 or PA 66/6; more preferably, the polyamide resin has a relative viscosity of 2.6 to 2.8. The relative viscosity is determined according to polyamide viscosity test standard ISO 307-2019.
Preferably, the glass fiber is selected from any one or more of alkali-free glass fibers. More preferably, the glass fibers have a weight loss ratio of less than 0.2% after being boiled in water at 80 ℃ for 48 hours.
According to the material performance requirement, the polyamide composite material also comprises 0.2-1 part of auxiliary agent according to the parts by weight.
The auxiliary agent is selected from any one or more of antioxidants and lubricants.
Suitable antioxidants are selected from any one or more of antioxidant 1098, antioxidant 1010, antioxidant 1076 or antioxidant 168.
Suitable lubricants are selected from any one or more of E wax, fatty acid ester or hyperbranched amide.
The invention also provides a preparation method of the polyamide composite material, which comprises the following steps:
s1, dissolving copper phthalocyanine and concentrated sulfuric acid in the mass ratio of 1:50-1:80 in the concentrated sulfuric acid to obtain a concentrated sulfuric acid solution of copper phthalocyanine; then dropwise adding the concentrated sulfuric acid solution of copper phthalocyanine into water, and stirring until the mixture is uniformly mixed to obtain a suspension; filtering the suspension to obtain copper phthalocyanine particles, and flushing the copper phthalocyanine particles with water until the pH value is 6-6.8; then washing the copper phthalocyanine particles by using acetone, and adding the washed copper phthalocyanine particles into a chloroform solution for ultrasonic dispersion to obtain a copper phthalocyanine nanoparticle dispersion system;
s2, weighing the components according to the proportion, premixing a copper phthalocyanine nanoparticle dispersion system and polyamide resin, adding other components except glass fibers, putting into a double-screw extruder for melt mixing, feeding the glass fibers at the side, extruding and granulating to prepare a polyamide composite material; the length-diameter ratio of the screw of the double-screw extruder is 40-48:1, the temperature of the screw cylinder is 250-300 ℃, and the rotating speed of the screw is 200-550 rpm.
The invention also provides application of the polyamide composite material in the 5G technical field or the new energy field, and is particularly suitable for preparing photovoltaic switches, 5G antenna accessories and the like.
The invention has the following beneficial effects:
according to the polyamide composite material, a certain amount of copper phthalocyanine and maleic anhydride grafted POE is added, so that the heat resistance and dielectric property of the material can be obviously improved, the polyamide composite material with high heat stability and high dielectric strength can be obtained, and the use requirement of the 5G technical field or the new energy field on the material is met.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
The raw materials used in the examples and comparative examples of the present invention are described below, but are not limited to these materials:
polyamide resin 1: PA66 50FWFS, technical grade, relative viscosity 2.6-2.8, ascend company;
polyamide resin 2: PA6 2800A, industrial grade, relative viscosity 2.6-2.8, marine chemical company;
maleic anhydride grafted POE 1: KT-916, shenyang Kong general company, maleic anhydride grafting ratio of 0.8%;
maleic anhydride grafted POE 2: KT-915B, shenyang Kong Co., ltd., maleic anhydride grafting ratio of 0.3%.
Copper phthalocyanine 1: cuPc, 50nm average particle size, henna chemical industry limited;
copper phthalocyanine 2: cuPc, average particle size 900nm, henna chemical industry limited;
glass fiber 1: alkali-free glass fiber, ECS10-3.0-T435N, taishan group, wherein the weight loss ratio is 0.18% after being boiled in water at 80 ℃ for 48 hours;
glass fiber 2: alkali-free glass fiber, ECS11-4.5-560A, boulder group, weight loss ratio is 0.39% after water boiling in 80 ℃ water for 48 hours;
auxiliary 1: antioxidant 1098, commercially available;
auxiliary 2: lubricants, fatty acid esters, commercially available.
Preparation methods of examples and comparative examples:
s1, weighing the components according to the mixture ratio of the table 1 to the table 2, and dissolving copper phthalocyanine and concentrated sulfuric acid in the concentrated sulfuric acid according to the mass ratio of 1:50-1:80 to obtain a concentrated sulfuric acid solution of copper phthalocyanine; then dropwise adding the concentrated sulfuric acid solution of copper phthalocyanine into water, and stirring until the mixture is uniformly mixed to obtain a suspension; filtering the suspension to obtain copper phthalocyanine particles, and flushing the copper phthalocyanine particles with water until the pH value is 6-6.8; then washing the copper phthalocyanine particles by using acetone, and adding the washed copper phthalocyanine particles into a chloroform solution for ultrasonic dispersion for 20min to obtain a copper phthalocyanine nanoparticle dispersion system;
s2, premixing a copper phthalocyanine dispersion system and polyamide resin, adding other components except glass fibers, putting into a double-screw extruder for melt mixing, feeding the glass fibers at the side, and extruding and granulating to prepare a polyamide composite material; wherein the length-diameter ratio of the screw of the double screw extruder is 48:1, the temperature of a first area of the double screw extruder is 250-270 ℃, the temperature of a second area of the double screw extruder is 260-280 ℃, the temperature of a third area of the double screw extruder is 260-280 ℃, the temperature of a fourth area of the double screw extruder is 260-280 ℃, the temperature of a fifth area of the double screw extruder is 270-290 ℃, the temperature of a sixth area of the double screw extruder is 280-300 ℃, the temperature of a seventh area of the double screw extruder is 270-290 ℃, the temperature of an eighth area of the double screw extruder is 260-280 ℃, and the temperature of a ninth area of the double screw extruder is 240-260 ℃; the screw speed was 350rpm.
The related performance testing method comprises the following steps:
the polyamide composite material is subjected to thermal stability test and dielectric property test in an injection molding machine at 275 ℃ for 10min under the conditions that the rated speed of the 280T injection molding machine is 50 percent and the pressure is 60 bar:
(1) Thermal decomposition temperature: the sample was dried at 150 ℃ for 4 hours and taken out under oxygen: TGA test is carried out under the atmosphere of nitrogen=5:5, the temperature is raised from 35 ℃ to 850 ℃, the heating rate is 10 ℃/min, and the temperature of 4.5% of the weight loss of the material is recorded; the higher the thermal decomposition temperature, the higher the thermal stability of the material.
(2) Dielectric strength: with reference to the standard ASTM D149-1997a Method A test, TYPE2 electrode was selected, the surrounding medium was vacuum silicone grease, the boost rate was set to 2.0kV/s, and the template size was 75.75.75.0.75 mm.
Table 1: examples 1-9 the proportions of the components (in parts by weight) and the results of the performance tests
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | Example 8 | Example 9 | |
| Polyamide resin 1 | 70 | 70 | 70 | 70 | 70 | 70 | 70 | 70 | 70 |
| Maleic anhydride grafted POE 1 | 10 | 5 | 20 | 10 | 10 | 10 | 10 | 10 | |
| Maleic anhydride grafted POE 2 | 10 | ||||||||
| Copper phthalocyanine 1 | 3 | 3 | 3 | 3 | 1 | 5 | 3 | 3 | |
| Copper phthalocyanine 2 | 3 | ||||||||
| Glass fiber 1 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 30 | 60 |
| Thermal decomposition temperature/. Degree.C | 480 | 471 | 465 | 460 | 465 | 476 | 462 | 468 | 476 |
| Dielectric strength/kV/mm | 65 | 64 | 60 | 61 | 55 | 58 | 61 | 55 | 59 |
Table 2: examples 10 to 13 and comparative examples 1 to 4 were prepared in terms of the proportions (in parts by weight) of the respective components and the results of the respective performance tests
| Example 10 | Example 11 | Example 12 | Example 13 | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | |
| Polyamide resin 1 | 70 | 50 | 70 | 70 | 70 | 70 | 70 | |
| Polyamide resin 2 | 100 | |||||||
| Maleic anhydride grafted POE 1 | 10 | 8 | 10 | 10 | 10 | 30 | / | |
| Maleic anhydride grafted POE 2 | 15 | |||||||
| Copper phthalocyanine 1 | 3 | 2 | 3 | 3 | / | 8 | 3 | 3 |
| Glass fiber 1 | 40 | 50 | 50 | 50 | 50 | 50 | 50 | |
| Glass fiber 2 | 50 | |||||||
| Auxiliary 1 | 0.1 | |||||||
| Auxiliary 2 | 0.3 | |||||||
| Thermal decomposition temperature/. Degree.C | 459 | 447 | 462 | 480 | 355 | 370 | 367 | 380 |
| Dielectric strength/kV/mm | 58 | 55 | 61 | 64 | 32 | 30 | 36 | 42 |
From the above examples and comparative examples, the heat resistance and dielectric properties of the materials can be significantly improved by adding a certain amount of copper phthalocyanine and maleic anhydride grafted POE to the polyamide material, and the two materials act synergistically.
Comparative example 1 compared with examples 1/5/6, the material was inferior in thermal stability and dielectric strength without adding copper phthalocyanine.
The copper phthalocyanine of comparative example 2 is excessively added, and aggregation and difficulty in dispersion occur, so that the overall performance of the material is unstable, and the thermal stability and the dielectric property are deteriorated.
Comparative example 3, too much maleic anhydride grafted POE was added, but it adversely affected the thermal stability and dielectric properties of the material.
Comparative example 4 compared with example 1/2/3/4, the thermal stability and dielectric properties of the material were poor without the addition of maleic anhydride grafted POE.
Claims (11)
1. The polyamide composite material is characterized by comprising the following components in parts by weight:
50-100 parts of polyamide resin;
5-20 parts of maleic anhydride grafted POE;
1-5 parts of copper phthalocyanine;
30-60 parts of glass fiber.
2. The polyamide composite material according to claim 1, characterized in that said maleic anhydride grafts POE 8-15 parts.
3. The polyamide composite material according to claim 1, characterized in that the maleic anhydride grafting ratio of the maleic anhydride grafted POE is 0.7-0.9%.
4. The polyamide composite material according to claim 1, characterized in that said copper phthalocyanine is 2-4 parts.
5. The polyamide composite material according to claim 1, characterized in that the average particle diameter of the copper phthalocyanine is 30-100nm.
6. The polyamide composite material according to claim 1, wherein the polyamide resin is selected from any one or more of PA6, PA66 or PA 66/6.
7. The polyamide composite material according to claim 1, wherein the polyamide resin has a relative viscosity of 2.6 to 2.8.
8. The polyamide composite material according to claim 1, wherein the glass fiber is selected from any one or more of alkali-free glass fibers; the weight loss ratio of the glass fiber after being boiled in water at 80 ℃ for 48 hours is less than 0.2%.
9. The polyamide composite material according to claim 1, further comprising 0.2 to 1 part by weight of an auxiliary agent; the auxiliary agent is selected from any one or more of antioxidants and lubricants.
10. The method of producing a polyamide composite material according to any one of claims 1 to 9, comprising the steps of:
s1, dissolving copper phthalocyanine and concentrated sulfuric acid in the mass ratio of 1:50-1:80 in the concentrated sulfuric acid to obtain a concentrated sulfuric acid solution of copper phthalocyanine; then dropwise adding the concentrated sulfuric acid solution of copper phthalocyanine into water, and stirring until the mixture is uniformly mixed to obtain a suspension; filtering the suspension to obtain copper phthalocyanine particles, and flushing the copper phthalocyanine particles with water until the pH value is 6-6.8; then washing the copper phthalocyanine particles by using acetone, and adding the washed copper phthalocyanine particles into a chloroform solution for ultrasonic dispersion to obtain a copper phthalocyanine nanoparticle dispersion system;
s2, weighing the components according to the proportion, premixing a copper phthalocyanine nanoparticle dispersion system and polyamide resin, adding other components except glass fibers, putting into a double-screw extruder for melt mixing, feeding the glass fibers at the side, extruding and granulating to prepare a polyamide composite material; the length-diameter ratio of the screw of the double-screw extruder is 40-48:1, the temperature of the screw cylinder is 250-300 ℃, and the rotating speed of the screw is 200-550 rpm.
11. Use of the polyamide composite material according to any one of claims 1 to 9 in the 5G technical field or in the new energy field.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210960445.9A CN115403922B (en) | 2022-08-11 | 2022-08-11 | Polyamide composite material and preparation method and application thereof |
Applications Claiming Priority (1)
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| CN114181523A (en) * | 2021-11-30 | 2022-03-15 | 金发科技股份有限公司 | Polyamide composite material and preparation method and application thereof |
| WO2022068143A1 (en) * | 2020-09-29 | 2022-04-07 | 金发科技股份有限公司 | Polyamide composition having high wear resistance and weathering resistance, preparation method therefor and use thereof. |
| WO2022068138A1 (en) * | 2020-09-29 | 2022-04-07 | 金发科技股份有限公司 | Halogen-free flame-retardant polyamide composite material and preparation method therefor |
| WO2022100025A1 (en) * | 2020-11-11 | 2022-05-19 | 金发科技股份有限公司 | Polyamide composition having high wear resistance and low temperature rise, preparation method therefor and application thereof |
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| WO2022068143A1 (en) * | 2020-09-29 | 2022-04-07 | 金发科技股份有限公司 | Polyamide composition having high wear resistance and weathering resistance, preparation method therefor and use thereof. |
| WO2022068138A1 (en) * | 2020-09-29 | 2022-04-07 | 金发科技股份有限公司 | Halogen-free flame-retardant polyamide composite material and preparation method therefor |
| WO2022100025A1 (en) * | 2020-11-11 | 2022-05-19 | 金发科技股份有限公司 | Polyamide composition having high wear resistance and low temperature rise, preparation method therefor and application thereof |
| CN114181523A (en) * | 2021-11-30 | 2022-03-15 | 金发科技股份有限公司 | Polyamide composite material and preparation method and application thereof |
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